A signal PIN processing method, mold, product and control system

Abstract

The present application relates to a signal PIN processing method and mold, the obtained product and electronic equipment using the product, and a processing control system, and relates to the fields of electronic manufacturing and mold technology. The method improves the processing quality and efficiency of the signal PIN while reducing costs by improving the traditional stamping die technology. The product obtained by this method has high surface quality, excellent electrical performance and structural stability, and meets the high-precision and high-demand AI module production needs.

Description

Technical Field

[0001] The present application relates to the technical field of electronic manufacturing and mechanical processing, and in particular to a processing method and mold, product and control system of a signal PIN. Background Art

[0002] With the rapid advancement of intelligent technology, AI modules, signal sheets on PCB, examples, data and other key components are becoming increasingly important and widely used in cutting-edge fields such as intelligent driving, Internet of Things, and big data processing. These precision components place extremely high demands on manufacturing processes. They not only need to have high precision and high reliability to ensure stable operation of the system, but also need to respond quickly to market changes to meet the needs of continuously iterating products.

[0003] However, the current mainstream manufacturing process, especially the processing method based on traditional mold stamping technology, has shown obvious limitations when facing these high-precision and high-demand products. First, traditional mold manufacturing involves a complex copper water injection process to form the mold cavity. This process is not only costly but also time-consuming, which seriously restricts the improvement of production efficiency. Secondly, the fixed nature of mold design makes it difficult to flexibly respond to the diverse needs of product shapes and sizes, especially for parts with complex surfaces or high precision requirements. Traditional processing methods seem to be unable to cope with it.

[0004] During the processing, product surface quality becomes another major challenge. Defects such as tearing, burrs, and burrs not only affect the appearance of the product, but may also pose a potential threat to its electrical connection performance, signal transmission efficiency, and structural stability. Especially in the application scenarios of multi-layer board stacking or precision patching, any slight deviation may lead to a significant decline in overall performance.

[0005] In addition, traditional processing methods lack flexibility when processing products of different thicknesses. Due to the changes in the physical properties of copper sheets during the stamping process (such as volume compression and density increase), the processing of products of different thicknesses requires frequent mold changes or adjustment of process parameters, which not only increases production costs, but also reduces the flexibility and efficiency of the production line.

[0006] More importantly, the traditional single-strip processing mode cannot fully meet the AI ​​module and the pursuit of complex structures and precise dimensions of components such as signal sheets on PCBs due to its inherent limitations. During the continuous die stamping process, the material properties of the copper sheet further increase the difficulty of processing and limit the innovation and diversity of product design.

[0007] In summary, traditional die stamping technology can no longer meet the urgent needs of industry development when processing high-precision and high-demand components such as AI modules and PCBs. Therefore, it is necessary to explore and develop a new, efficient, low-cost processing technology and its supporting die to overcome the above technical bottlenecks and improve product quality and production efficiency. Summary of the invention

[0008] The purpose of this application is to overcome the above technical problems and provide a signal PIN processing method and mold, a product made by the method and a corresponding processing control system.

[0009] In a first aspect, the present application provides a method for processing a signal PIN, comprising the following steps:

[0010] Step 1: The material strip is transferred from the end of the mold to the inside of the mold. At the same time, according to the processing requirements, the copper wire or other conductive materials are transferred from the side of the mold to the inside of the mold synchronously;

[0011] Step 2: During the conveying process of the material strip, the die is used to punch precise positioning holes on the material strip and perform necessary trimming to eliminate burrs and burrs;

[0012] Step 3: Use the die cutting mechanism to cut the material strip, and fix the cut material strip part inside the positioning hole formed by the previous punching to ensure the stability of subsequent processing;

[0013] Step 4: Use the mold to finely cut the fixed material strip multiple times. The number of cutting times varies from 2 to 8 times according to product design requirements to meet the processing requirements of different shapes and sizes;

[0014] Step 5: Use the flattening mechanism of the mold to flatten the cut material strip to eliminate deformation and unevenness caused during the processing;

[0015] Step 6: Subsequently, the flattened strip is cooled by the cooling mechanism of the mold to stabilize its shape and size and reduce internal stress;

[0016] Step 7: Repeat the flattening and cooling process of steps 5 and 6 as needed to achieve the best processing effect;

[0017] Step 8: After completing all processing steps, the finished product is taken out of the mold through the blanking mechanism;

[0018] Step 9: Use the waste removal mechanism to remove and collect the waste generated during the processing.

[0019] By adopting the above technical solution, the processing method not only facilitates the processing of signal sheets of various shapes by synchronously conveying the material belt and the conductive material, and adopting multiple cutting and flattening cooling steps, but also significantly improves the processing accuracy and surface quality of AI modules, module signal sheets and other products, and eliminates problems such as torn surfaces, burrs and burrs. At the same time, the method improves production efficiency, reduces scrap rate and saves costs.

[0020] Optionally, the conductive material is combined with the material tape during processing to enhance the structural strength of the product or achieve an electrical connection function.

[0021] By adopting the above technical solutions, the combination of conductive materials (such as copper wire) and material strips not only enhances the structural strength of the product, but also realizes the electrical connection function and improves the electrical performance and reliability of the product. This is especially important for AI modules and modules that require high conductivity and stability.

[0022] In a second aspect, the present application provides a mold for implementing the above-mentioned processing method, comprising:

[0023] The material belt conveying mechanism is used to convey the material belt into the mold;

[0024] A conductive material supply mechanism, used for feeding copper wire or other conductive materials into the mold;

[0025] A stamping positioning mechanism is used to stamp out positioning holes on the material strip and perform edge trimming;

[0026] A cutting and fixing mechanism, used for cutting the material strip and fixing it in the positioning hole;

[0027] Multiple cutting mechanisms are used to perform multiple fine cuts on the fixed material strips;

[0028] A flattening mechanism is used to flatten the cut material strips;

[0029] A cooling mechanism is used to cool the flattened material strip;

[0030] Dropping mechanism, used to take out the finished product;

[0031] The waste cutting mechanism is used to cut off and collect the waste.

[0032] By adopting the above technical solutions, the integrated mold simplifies the processing flow and improves the consistency and stability of the processing. The collaborative work between the various mechanisms makes the entire processing process more efficient and automated, reducing the dependence on manual operation and the possibility of human error.

[0033] Optionally, the stamping positioning mechanism, the cutting and fixing mechanism, the multiple cutting mechanisms, the flattening mechanism and the cooling mechanism are all integrated in the same mold cavity to achieve a continuous and efficient processing flow.

[0034] By adopting the above technical solutions, the continuous and efficient processing process reduces the waiting time and conversion time during the processing, improves production efficiency and output. At the same time, the integrated design also facilitates the maintenance and maintenance of the equipment.

[0035] Optionally, it also includes an automatic adjustment mechanism for automatically adjusting the processing parameters of each mechanism according to processing requirements, such as punching force, cutting depth, flattening force and cooling time.

[0036] By adopting the above technical solution, the automatic adjustment mechanism can automatically adjust the processing parameters according to the processing requirements to ensure the stability and consistency of the processing process. This not only improves product quality, but also reduces the skill requirements for operators, making the processing process more flexible and controllable.

[0037] Optionally, the cutting mechanism is designed as a replaceable mold component to meet the processing requirements of products of different shapes and sizes.

[0038] By adopting the above technical solution, the replaceable cutting mechanism enables the mold to adapt to the processing requirements of products of different shapes and sizes, improving the versatility and flexibility of the equipment. This reduces the cost and risk of enterprises needing to replace the entire set of molds due to product upgrades.

[0039] On the third aspect, the present application provides a signal sheet on an AI module manufactured by the above-mentioned processing method. The surface of the signal sheet is smooth, without burrs or tearing surfaces, and has high processing accuracy and structural stability.

[0040] By adopting the above technical solution, the product made by this method has a high-quality surface and precise dimensions, ensuring the stability and reliability of the product. This is crucial for AI modules and modules that require high precision and stability.

[0041] In a fourth aspect, the present application provides a control system for monitoring and optimizing the above-mentioned processing method, including a processor, a sensor and a memory, wherein a control program is stored in the memory. When the control program is executed by the processor, it can monitor various parameters in the processing process in real time, such as temperature, pressure, speed, etc., and automatically adjust the processing parameters according to the monitoring results to optimize the processing effect and efficiency.

[0042] By adopting the above technical solutions, the control system can monitor and adjust various parameters in the processing process in real time to ensure the stability and consistency of the processing process. By optimizing the processing parameters, product quality and production efficiency can be further improved, and the scrap rate and cost can be reduced. At the same time, the system also provides strong support for the company's intelligent manufacturing and digital transformation.

[0043] Optionally, monitored process parameters include temperature, pressure and speed.

[0044] By adopting the above technical solutions, temperature is a critical parameter in many processing processes, which directly affects the performance of materials, reaction rate and the final quality of products; in processing involving physical or chemical changes, pressure control is crucial to ensure sufficient reaction and product uniformity; in machining, cutting, forming and other processes, speed control directly affects processing efficiency and product surface quality; by monitoring these key parameters, the system can have a more comprehensive understanding of the status of the processing process, so as to make more accurate adjustments and optimization decisions.

[0045] Optionally, the punching force, cutting depth, flattening force and cooling time during the processing can be automatically adjusted according to the monitoring results.

[0046] By adopting the above technical solutions, through real-time monitoring and adjustment of processing parameters, it is possible to ensure that each processing step is maintained in the optimal state, thereby improving the processing accuracy of the signal sheet; this is crucial for high-precision components such as AI modules, because any slight deviation may affect its performance; the automatic adjustment mechanism helps to reduce errors and defective rates during the processing. When abnormal parameters are detected, the system can respond quickly and adjust to the appropriate processing conditions to avoid the production of defective or waste products; automated adjustments reduce the need for manual intervention, making the processing process smoother and more efficient. At the same time, by optimizing processing parameters, the processing cycle can be shortened and overall production efficiency can be improved.

[0047] In summary, the present application includes at least one of the following beneficial technical effects:

[0048] 1. Since the present invention adopts synchronous conveying of material belts and conductive materials, combined with multiple cutting and flattening cooling steps, the processing accuracy and surface quality of the signal PIN are significantly improved, and the problems of torn surface, burrs, etc. are eliminated, thereby improving the electrical performance and reliability of the product;

[0049] 2. The present invention simplifies the processing flow and improves the consistency and stability of processing through integrated mold design. The collaborative work between various mechanisms and the application of automatic adjustment mechanisms make the processing more efficient, automated, flexible and controllable, reduce the dependence on manual operation and the possibility of human error, and further improve production efficiency and product quality;

[0050] 3. The monitoring system provided by the present invention can monitor and adjust key parameters in the processing process in real time to ensure the stability and consistency of the processing process. This not only helps to optimize processing parameters, further improve product quality and production efficiency, but also helps to reduce scrap rate and cost, and also provides strong support for the intelligent manufacturing and digital transformation of enterprises. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a flow chart of the signal PIN processing method in the embodiment of the present application.

[0052] Figure 2 It is a structural schematic diagram of the mold in the embodiment of the present application.

[0053] Description of reference numerals:

[0054] 1. Material belt conveying mechanism; 2. Conductive material supplying mechanism; 3. Punching and positioning mechanism; 4. Cutting and fixing mechanism; 5. Multiple cutting mechanisms; 6. Flattening mechanism; 7. Cooling mechanism; 8. Blanking mechanism; 9. Waste cutting mechanism. DETAILED DESCRIPTION

[0055] The following is combined with Figure 1 This application is described in further detail.

[0056] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be the common meanings understood by those skilled in the art to which this application belongs. The "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components.

[0057] Example 1

[0058] This embodiment discloses a method for processing a signal PIN in detail, referring to Figure 1 This method significantly improves the processing accuracy and surface quality of the signal PIN through a series of precise processing steps. The following is a detailed description of each step of the method:

[0059] Step 1: Initialize the processing process, and feed the strip from the end of the mold into the mold steadily and continuously. At the same time, in order to ensure the enhancement of the product structure strength and the realization of specific electrical connection functions, conductive materials such as copper wires are synchronously transmitted from the side of the mold. The key to this step is to accurately control the transmission speed and position of the strip and conductive material to ensure their accurate combination inside the mold.

[0060] Step 2: After the material strip is delivered to the right place, the precision-designed stamping and positioning mechanism 3 in the mold is used to accurately punch positioning holes on the material strip. This step is intended to provide an accurate positioning reference for subsequent cutting and fixing. At the same time, necessary trimming is performed to completely eliminate burrs and burrs to ensure processing accuracy and product quality.

[0061] Step 3: Next, the cutting and fixing mechanism 4 of the mold comes into play to accurately cut the strip. After the cutting is completed, the cut strip part is firmly fixed inside the mold using the positioning holes formed by the previous punching. The stability of this step is directly related to the smooth progress of the subsequent processing steps, so it is very important.

[0062] Step 4: According to the specific product design requirements, the fixed material strip is finely cut 2 to 8 times using the multiple cutting mechanisms 5 in the mold. This step can adapt to the requirements of products of different shapes and sizes, greatly improving the flexibility and applicability of the processing method. Each cutting is strictly carried out in accordance with the design specifications to ensure the accuracy and consistency of the final product.

[0063] Step 5: After cutting, in order to avoid possible processing deformation or unevenness, the flattening mechanism 6 equipped with the mold is used to perform a comprehensive flattening process on the cut material strip. This step is to ensure the flatness and appearance quality of the product.

[0064] Step 6: After flattening, the strip is immediately cooled quickly and evenly by the cooling mechanism 7 designed in the mold. This step can effectively stabilize the shape and size of the product, while greatly reducing internal stress, enhancing the structural stability of the product and extending its service life.

[0065] Step 7: According to the actual situation during the processing and product requirements, you can flexibly choose whether to repeat the flattening and cooling steps. This design can ensure that the product achieves the best processing effect and fully meet the personalized needs of customers.

[0066] Step 8: After all processing steps are successfully completed, the finished product is automatically and accurately taken out through the mold's efficient blanking mechanism 8. This step greatly improves production efficiency and avoids errors and damage that may be introduced by human operation.

[0067] Step 9: Finally, all waste generated during the processing is automatically cut off and collected by a special waste cutting mechanism 9. This environmentally friendly and efficient design not only realizes the effective recycling and utilization of waste, but also creates additional economic value for the production enterprise.

[0068] The implementation principle of Example 1 is: This method ensures that the signal PIN can achieve unparalleled high-precision positioning and cutting during the processing process through precise mold design and close coordination between each processing step. At the same time, through scientific and effective flattening and cooling treatment, the surface quality and structural stability of the product are significantly improved. In addition, the automated design of the entire processing flow greatly reduces the dependence and risk of manual operation, thereby achieving a leap in production efficiency and a steady improvement in product quality. In short, this method is driven by technological innovation and guided by customer needs, bringing a profound change to the production field of signal PINs.

[0069] In order to further optimize the processing effect, this method can also be combined with advanced control systems for real-time monitoring and adjustment. For example, by introducing sensors and intelligent algorithms in key processing steps, various parameters in the processing process (such as temperature, pressure, speed, etc.) can be monitored in real time, and the processing parameters can be automatically adjusted according to the monitoring results to optimize the processing effect and efficiency. This intelligent improvement not only further improves product quality and production efficiency, but also provides strong support for the company's intelligent manufacturing and digital transformation. At the same time, by comprehensively collecting and analyzing the data generated during the processing process, the most direct and valuable feedback and guidance information can be provided for subsequent product development and production.

[0070] Example 2

[0071] This embodiment discloses a mold for processing a signal PIN, referring to Figure 2 Through highly integrated and intelligent design, it achieves efficient and stable processing of high-precision products, significantly improves processing quality and production efficiency, and reduces costs and scrap rates.

[0072] The mold is composed of multiple mechanisms working together to form a complete processing system. Specifically, it includes a material belt conveying mechanism 1, a conductive material supplying mechanism 2, a stamping positioning mechanism 3, a cutting and fixing mechanism 4, multiple cutting mechanisms 5, a flattening mechanism 6, a cooling mechanism 7, a blanking mechanism 8 and a waste material cutting mechanism 9. These mechanisms perform their respective functions during the processing and are interrelated to ensure the continuity and stability of the processing.

[0073] The material belt conveying mechanism 1 and the conductive material supply mechanism 2 are the starting parts of the processing process, responsible for feeding the raw materials into the mold stably and accurately. The stamping and positioning mechanism 3 is responsible for the preliminary stamping and trimming of the material belt to form accurate positioning holes and ensure the accuracy of subsequent processing. The cutting and fixing mechanism 4 follows closely, cutting the material belt and fixing it in the positioning hole, laying the foundation for subsequent fine processing.

[0074] The multiple cutting mechanisms 5 are one of the core components of the device, which are exquisitely designed and powerful. According to the requirements of product design, the mechanism can perform 2 to 8 fine cuts on the fixed material strip to meet the processing requirements of different shapes and sizes. This multiple cutting design not only significantly improves the processing accuracy and flexibility, but also effectively reduces the generation of waste and further reduces costs.

[0075] The flattening mechanism 6 and the cooling mechanism 7 are responsible for the subsequent processing of the cut strips. The flattening mechanism 6 applies appropriate pressure to eliminate the deformation and unevenness generated during the processing, ensuring the flatness and consistency of the product. The cooling mechanism 7 reduces the temperature of the strip, stabilizes its shape and size, and reduces internal stress, thereby improving the stability and reliability of the product.

[0076] Finally, the blanking mechanism 8 and the waste removal mechanism 9 are responsible for taking the finished product out of the mold and removing and collecting the waste generated during the processing. The design of these two mechanisms fully considers the automation and intelligent requirements of the processing process, and can automatically complete the blanking and waste processing tasks, reducing the burden on operators and improving overall production efficiency.

[0077] It is worth mentioning that this mold also includes an automatic adjustment mechanism, which can automatically adjust the processing parameters of each mechanism according to the processing requirements. Key parameters such as punching force, cutting depth, flattening force and cooling time can be adjusted and optimized in real time through the automatic adjustment mechanism. This intelligent design not only simplifies the operation process, but also ensures that each processing can achieve the best effect.

[0078] In general, the mold of this embodiment realizes efficient and stable processing of signal PIN through highly integrated and intelligent design. The collaborative work between various mechanisms and the intelligent adjustment function of the automatic adjustment mechanism jointly ensure the improvement of processing quality and production efficiency. At the same time, the device also has the advantages of strong adaptability, high flexibility, and easy maintenance, which injects new vitality into the development of the electronic manufacturing field.

[0079] The implementation principle of Example 2 is as follows: the mold forms a continuous and automated processing process from raw material supply to finished product removal through the collaborative work between various mechanisms. During the processing, each mechanism operates according to the preset program and processing parameters to ensure the accuracy and stability of each step. At the same time, the introduction of the automatic adjustment mechanism enables the entire processing process to be adjusted and optimized in real time according to actual needs, thereby achieving higher processing accuracy and efficiency. This intelligent processing method not only improves product quality and production efficiency, but also reduces costs and scrap rates, providing strong support for the large-scale production of signal PINs.

[0080] Example 3

[0081] This embodiment discloses a control system for monitoring and optimizing a processing method. The system monitors key parameters such as temperature, pressure, speed, etc. during the processing in real time, and automatically adjusts various settings during the processing according to these parameters to ensure the stability and consistency of the processing effect. This intelligent control system not only improves the reliability and stability of the processing quality, but also provides strong data support for the optimization of the processing process.

[0082] It can automatically adjust the punching force, cutting depth, flattening force and cooling time during the processing according to the monitoring results. It can ensure that each processing step is kept in the optimal state, thereby improving the processing accuracy of the signal sheet; this is crucial for high-precision components such as AI modules, because any slight deviation may affect its performance; the automatic adjustment mechanism helps to reduce errors and defective rates during the processing. When abnormal parameters are detected, the system can respond quickly and adjust to the appropriate processing conditions to avoid the production of defective or waste products; automated adjustments reduce the need for manual intervention, making the processing process smoother and more efficient. At the same time, by optimizing processing parameters, the processing cycle can be shortened and overall production efficiency can be improved.

[0083] Example 4

[0084] This embodiment discloses a signal PIN made by the above processing method. The product has a flat surface, no burrs, no tearing surface, and has high processing accuracy and structural stability. Such high-quality signal PIN products are crucial to ensure the stable operation of high-precision electronic equipment in modern society, especially AI modules, intelligent driving systems, etc.

[0085] The implementation principle of Example 4 is: the surface quality and processing accuracy of the signal PIN are directly related to its reliability and durability in practical applications. Through specific processing methods and mold design, high-quality signal PIN products can be obtained, thereby meeting the stringent requirements of high-end electronic equipment for precision connection components and improving the performance and life of the overall system.

[0086] Example 5

[0087] This embodiment discloses how to use multiple cutting mechanisms 5 to perform different times of cutting during the processing process to meet the needs of different product designs. In actual operation, the selection of the number of cutting times is determined according to the shape, size and precision requirements of the product. By flexibly adjusting the number of cutting times, more sophisticated and complex product processing can be achieved, thereby improving the quality and diversity of the products.

[0088] In the specific cutting process, you first need to determine the shape and size of the cutting according to the product design drawings, and set the appropriate number of cutting times. During the first cutting, the mold will roughly cut the material strip to form the general outline of the product. In the subsequent cutting process, the mold will gradually and finely adjust the shape and size of the product until it meets the design requirements.

[0089] It is worth mentioning that multiple cutting is not just a simple repetitive cutting process. After each cutting, the product needs to be inspected and adjusted for quality. By real-time monitoring of key indicators such as product size, shape and surface quality, deviations and problems in the processing process can be discovered and corrected in a timely manner. This quality control method can ensure that each cutting meets the expected design requirements, thereby improving the overall quality and precision of the product.

[0090] In addition, during multiple cutting processes, attention should also be paid to the control of cutting depth and cutting speed. Too shallow a cutting depth may result in inaccurate product shape, while too deep a cutting depth may damage the product or increase the scrap rate. Similarly, too fast a cutting speed may result in unstable processing or reduced product quality, while too slow a cutting speed may affect production efficiency. Therefore, in actual operation, it is necessary to reasonably set these parameters according to the specific requirements and processing conditions of the product. By flexibly using multiple cutting mechanisms 5 to perform different numbers of cuttings, this embodiment can realize the processing of signal PINs with various complex shapes and high-precision requirements. This processing method not only improves the quality and precision of the product, but also enhances the diversity and market competitiveness of the product. At the same time, combined with intelligent control systems and quality detection methods, the stability and reliability of the processing process can be further improved, providing a strong guarantee for the large-scale production of signal PINs.

[0091] The implementation principle of Example 5 is: by flexibly adjusting the key parameters such as the number of cutting times, depth and speed of the multiple cutting mechanisms 5, accurate adaptation to different product design requirements can be achieved. Combined with real-time quality control and quality inspection methods, it can be ensured that each cutting meets the expected design requirements, thereby improving the overall quality and precision of the product. This processing method fully utilizes the flexibility and intelligent characteristics of the mold, and provides strong support for the efficient and stable processing of signal PINs.

[0092] Example 6

[0093] The embodiment of the present application provides a mathematical model of cold heading processing in the signal PIN processing process and its application. In the cold heading process, we pay special attention to the following important parameters and their relationship: V0 represents the volume of the product material before cold heading; V1 represents the volume of the final product; K is the cold heading density coefficient, which connects the relationship between V0 and V1.

[0094] Regardless of the material used, the relationship between V0 and V1 follows the formula V0 = K * V1. The cold heading density coefficient K is determined by the material density before and after cold heading, specifically expressed as K = p1 / p0, where p0 is the material density before cold heading and p1 is the material density after cold heading. The density difference of different materials will lead to different K values, but they all have one common feature, that is, K is always greater than 1, which means that the cold heading process causes the material to be compressed, the volume to decrease and the density to increase.

[0095] By accurately mastering and controlling these parameters, the production process of signal PIN can be more effectively managed and optimized, material waste can be reduced, and the stability of product quality can be improved. At the same time, the application of this mathematical model also helps to achieve precise control of production costs and provide data support for enterprise management.

[0096] The K value of a specific material can be determined experimentally or calculated based on the known density of the material. For example, for iron material, its density p0 before cold heading is 7.86g / cm³, and its density p1 after cold heading is 7.92g / cm³, then the K value can be calculated as 7.92 / 7.86. Similarly, the K value of materials such as copper, aluminum and stainless steel can also be obtained by similar methods.

[0097] The implementation principle of Example 4 is: cold heading is one of the key steps in the signal PIN manufacturing process. By mathematically modeling the relationship between the volume and density of the material during the cold heading process, we can manage the production process more scientifically and accurately, and improve the stability and production efficiency of the product. This quantitative management method not only helps to improve product quality, but also provides a powerful tool for cost control and decision analysis of enterprises.

[0098] In general, the specific implementation methods of the present application achieve efficient, stable processing and quality optimization of signal PINs by providing highly integrated and intelligent molds, control systems and refined processing procedures. These innovations and improvements not only improve product quality and production efficiency, but also reduce costs and scrap rates, injecting new vitality into the development of the electronics manufacturing field. At the same time, the present application also provides flexible and changeable processing methods to meet the needs of different product designs, further enhancing its practicality and market competitiveness.

[0099] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for processing a signal PIN, characterized in that: The following steps are involved: Step 1: The material strip is transferred from the end of the mold to the inside of the mold. At the same time, according to the processing requirements, the copper wire is transferred from the side of the mold to the inside of the mold synchronously; Step 2: During the conveying process of the material strip, the die is used to punch precise positioning holes on the material strip and perform trimming to eliminate burrs and burrs; Step 3: Use the cutting and fixing mechanism (4) of the mold to cut the material strip, and fix the cut material strip part inside the positioning hole formed by the previous punching to ensure the stability of subsequent processing; Step 4: The fixed material strip is finely cut multiple times by using multiple cutting mechanisms (5) of the mold. The number of cutting times is 2 to 8 times according to the product design requirements to meet the processing requirements of different shapes and sizes; Step 5: Use the flattening mechanism (6) of the mold to flatten the cut material strip to eliminate deformation and unevenness generated during the processing; Step 6: Subsequently, the flattened strip is cooled by the cooling mechanism (7) of the mold to stabilize its shape and size and reduce internal stress; Step 7: Repeat the flattening and cooling process of steps 5 and 6 as needed to achieve the best processing effect; Step 8: After all processing steps are completed, the finished product is taken out of the mold through the mold blanking mechanism (8); Step nine: using the waste removal mechanism (9) of the mold to remove and collect the waste generated during the processing, wherein the copper wire is combined with the material strip during the processing to enhance the structural strength of the product and realize the electrical connection function.

2. A mold for implementing the processing method according to claim 1, characterized in that: include: A material strip conveying mechanism (1), used for conveying the material strip into the mold; A copper wire supply mechanism (2), used for feeding the copper wire into the mold; A punching and positioning mechanism (3) is used to punch and form positioning holes on the material strip and to perform edge trimming; A cutting and fixing mechanism (4) is used to cut the material strip and fix it in the positioning hole; A plurality of cutting mechanisms (5) for performing multiple fine cutting on the fixed material strips; A flattening mechanism (6) is used to flatten the cut material strip; A cooling mechanism (7) is used to cool the flattened material strip; A material removal mechanism (8) for removing the finished product; The waste cutting mechanism (9) is used for cutting and collecting waste.

3. The mold according to claim 2, characterized in that: The punching positioning mechanism (3), the cutting and fixing mechanism (4), the plurality of cutting mechanisms (5), the flattening mechanism (6) and the cooling mechanism (7) are all integrated in the same mold cavity to achieve a continuous and efficient processing flow.

4. The mold according to claim 2, characterized in that: It also includes an automatic adjustment mechanism for automatically adjusting the processing parameters of each mechanism according to processing requirements, including punching force, cutting depth, flattening force and cooling time.

5. The mold according to any one of claims 2 to 4, characterized in that: The cutting mechanism is designed as a replaceable mold component to meet the processing requirements of products of different shapes and sizes.

6. A signal sheet on an AI module manufactured by the processing method of claim 1, characterized in that: The surface of the signal sheet is flat, without burrs or tearing, and has high processing accuracy and structural stability.

7. A control system for monitoring and optimizing the processing method according to claim 1, characterized in that: It also includes a processor, a sensor and a memory, wherein the memory stores a control program. When the control program is executed by the processor, it can monitor various parameters in the processing process in real time, including temperature, pressure, and speed, and automatically adjust the processing parameters according to the monitoring results to optimize the processing effect and efficiency.

8. The control system of the processing method according to claim 7, characterized in that: It can automatically adjust the punching force, cutting depth, flattening force and cooling time during the processing according to the monitoring results.

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