A monitoring fixture for laser cladding of a semiconductor component

Abstract

The application discloses a kind of monitoring fixing device when melting spraying to general semiconductor spare, it is related to part melting spraying technical field, including monitoring mechanism and fixed mechanism, monitoring mechanism further includes mechanical arm, the top inside of mechanical arm is provided with melting spraying metal wire, the front end of mechanical arm is fixedly connected with spraying end structure, the top of mechanical arm is fixedly connected with infrared structure, melting spraying metal wire, infrared structure and spraying end structure are used to melt spray and detect roughness and thickness and other parameters of coating of part surface.The application is by mechanical arm, melting spraying metal wire, infrared structure and spraying end structure, reach the effect of on-line real-time monitoring and detecting roughness and thickness and other parameters of coating of melting spraying, and according to detection result, real-time feedback is given to the control system of melting spraying machine, make corresponding adjustment, to meet the need of melting spraying parameter.Real-time monitoring and detection can ensure that roughness and thickness and other parameters of coating always remain in predetermined range.

Description

Technical Field

[0001] This invention relates to the field of component sputtering technology, and in particular to a monitoring and fixing device for sputtering semiconductor components. Background Technology

[0002] The surface of components within a semiconductor cavity undergoes thermal spraying primarily to enhance their corrosion resistance, wear resistance, and hardness, enabling them to withstand the extreme environments of semiconductor manufacturing, such as high temperatures and strong corrosion, thereby improving their lifespan and performance. Thermal spraying, also known as thermal spraying, is a process that involves heating materials to a molten or semi-molten state and then spraying them onto a substrate surface using a high-speed gas stream to form a coating.

[0003] In existing lamination equipment, monitoring technology cannot accurately reflect the true condition of the coating surface in real time, and may also be affected by environmental factors, leading to errors. This can result in uneven coating surfaces, affecting the aesthetics and overall quality of the coating. Furthermore, if the surface roughness or thickness of the lamination coating does not meet requirements, additional processing steps are needed to correct these problems.

[0004] To address the problem that existing monitoring technologies cannot accurately reflect the true condition of the coating surface in real time, an infrared device is installed on the lamination equipment. This allows for online real-time monitoring and detection of parameters such as the roughness and thickness of the lamination coating. The detection results are then fed back to the lamination machine's control system in real time, enabling adjustments to be made to meet the required lamination parameters.

[0005] However, during the spraying process of semiconductor components, the components are often placed in one location for spraying, and are mostly not fixed in place. During the spraying process, the components may move or rotate due to the force generated by the spraying, resulting in the coating material not being deposited evenly and stably on the component surface. Moreover, if the components move violently or fall off during the spraying process, it may also damage the spraying equipment. Summary of the Invention

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a monitoring and fixing device for the melting and spraying of semiconductor components. The main problem it solves is that existing monitoring technologies cannot accurately reflect the true condition of the coating surface in real time.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A monitoring and fixing device for the lamination of semiconductor components includes a monitoring mechanism and a fixing mechanism. The monitoring mechanism further includes a robotic arm. A lamination wire is disposed inside the tip of the robotic arm. A spraying end structure is fixedly connected to the front end of the robotic arm. An infrared structure is fixedly connected to the tip of the robotic arm. The lamination wire, infrared structure, and spraying end structure are used to lamination the surface of the component and detect parameters such as the roughness and thickness of the lamination coating. Thus, appropriately increasing the roughness of the coating can effectively improve the adhesion between the coating and the substrate, while the coating thickness directly affects its resistance to the external environment.

[0009] As a further improvement of the present invention, a transmission line is fixedly connected to the side of the robotic arm away from the spraying end structure, and a power control system is fixedly connected to the end of the transmission line away from the robotic arm. A transmission system is rotatably mounted at the top center of the power control system. Two transmission systems are provided, with the other transmission system rotatably connected to the top of the robotic arm. The molten metal wire is wound around the outer surface of the two transmission systems, and a base is fixedly connected to the bottom end of the robotic arm. This achieves the effect of melting and spraying metal materials.

[0010] As a further improvement of the present invention, the fixing mechanism includes a fixing body, a base two fixedly connected to the bottom end of the fixing body, a connecting column fixedly connected to the outer surface of the fixing body near the robotic arm, and a horizontal clamping plate fixedly connected to the bottom end of the connecting column. Two horizontal clamping plates are provided, and two vertical clamping plates are symmetrically arranged in the middle of the two horizontal clamping plates. Thus, the parts can be fixed by the horizontal and vertical clamping plates.

[0011] As a further improvement of the present invention, a plurality of telescopic rods are uniformly and fixedly connected to the bottom end of the lower horizontal clamping plate. The bottom end of each telescopic rod is fixedly connected to the top end of the base. A spring is provided on the outside of each telescopic rod, and the two ends of the spring are respectively fixedly connected to the bottom end of the lower horizontal clamping plate and the top end of the base. Two connecting rods are symmetrically fixedly connected to the side of the fixing body near the robotic arm. This allows for automatic closing and fixing after the parts are placed.

[0012] As a further improvement of the present invention, a wiping cotton is fixedly connected to the middle of the connecting rod one, and two baffles are symmetrically fixedly connected to both sides of the lower horizontal clamping plate. A spring two and a telescopic rod two are fixedly connected to the side of each baffle that is close to each other. The ends of the spring two and the telescopic rod two away from the baffles are respectively fixedly connected to the sides of the two vertical clamping plates. Thus, the wiping cotton can effectively wipe the surface of the part.

[0013] As a further improvement of the present invention, two transverse grooves are symmetrically formed on the side of the horizontal clamping plates that are close to each other, and two longitudinal grooves are symmetrically formed on the side of the vertical clamping plates that are close to each other. Two sliding blocks are symmetrically fixedly connected to the bottom end of each vertical clamping plate, and four sliding grooves are symmetrically formed at the bottom end of the lower horizontal clamping plate. The four sliding blocks are slidably connected inside the four sliding grooves respectively. This allows the parts to be secured around their perimeter.

[0014] As a further improvement of the present invention, two connecting rods are symmetrically fixedly connected to the side of the horizontal clamping plate away from the robotic arm. A handle is fixedly connected to the middle of the connecting rod, and a round block is fixedly connected to the bottom end of the handle. This allows the user to easily pull the horizontal clamping plate downwards.

[0015] As a further improvement of the present invention, a locking block is rotatably connected to the center of the circular block, and two symmetrically arranged moving slots are formed through the center of the fixed body. The two connecting rods are respectively disposed inside the two moving slots, and a locking slot is formed on the side of the fixed body away from the robotic arm. This ensures that the horizontal clamping plate can be locked when pulled to the bottom.

[0016] Compared with the prior art, the beneficial effects of this invention are as follows:

[0017] 1. The system utilizes a robotic arm, a metal spraying wire, an infrared structure, and a spraying end structure. The robotic arm controls the spraying end structure to align with the part surface. The infrared structure then precisely adjusts the position of the spraying end structure, allowing the metal spraying wire to accurately spray onto the part surface. This enables real-time online monitoring and detection of parameters such as the roughness and thickness of the sprayed coating. The detection results are fed back to the control system of the spraying machine in real time, allowing for adjustments to meet the required spraying parameters. Real-time monitoring and detection ensure that parameters such as coating roughness and thickness remain within predetermined ranges, thus preventing coating quality instability. Furthermore, the real-time monitoring system can quickly feed back detection results to the control system, which can immediately make adjustments based on the feedback information, thereby shortening the production cycle and improving production efficiency. Precise control of coating thickness and roughness also avoids material waste caused by coatings that are too thick or too thin.

[0018] 2. Through the horizontal and vertical clamping plates, springs one and two, and the elastic action of telescopic rod one and spring two, the horizontal and vertical clamping plates can be brought closer together. When the part is located in the middle of the horizontal and vertical clamping plates, it will be clamped by springs one and two. The clamping parts prevent movement or deformation due to external forces during the spraying process, thus ensuring that the coating is deposited evenly and stably on the part surface. This helps avoid problems such as uneven coating thickness and excessive surface roughness, improving the overall quality of the coating. Furthermore, the clamping parts ensure stability during the spraying process, reducing the adjustment time required due to part movement or deformation. This helps improve production efficiency and shorten the production cycle. The clamping parts also prevent parts from flying out uncontrollably or causing other accidents during the spraying process. This helps ensure the safety of the production site and protect the lives and property of operators.

[0019] 3. After the part is fixed in place by the horizontal and vertical clamps using the horizontal clamps, wiping cotton, and spring one, the spring one springs back, causing the surface of the part to be welded to come into contact with the wiping cotton. At this point, the wiping cotton will clean the side of the part to be welded. Cleaning the part surface facilitates the fusion of metal powder with the part surface during the welding process, forming a stronger metallurgical bond. This helps improve the overall quality of the coating. Furthermore, a clean surface helps the metal powder to distribute evenly during welding, forming a coating of uniform thickness and a smooth surface, thus contributing to improved overall coating quality and performance. Welding on a clean surface allows for more precise control of welding process parameters, such as spray distance, spray speed, and welding temperature, which helps achieve a more stable welding process, improving production efficiency and product quality. Attached Figure Description

[0020] Fig. 1 This is a schematic diagram of the structure of the present invention.

[0021] Fig. 2 This is a structural schematic diagram of the present invention from another angle.

[0022] Fig. 3 This is a schematic diagram of the monitoring mechanism in this invention.

[0023] Fig. 4 This is a schematic diagram of the fixing mechanism in this invention.

[0024] Fig. 5 This is a schematic diagram of the structure of the horizontal clamping plate, vertical clamping plate, and baffle in this invention.

[0025] Fig. 6 This is a schematic diagram of the structure of the vertical clamping plate, longitudinal groove, and sliding block in this invention.

[0026] Fig. 7This is a schematic diagram of the structure of the horizontal clamping plate, connecting rod 2, and locking block in this invention.

[0027] In the diagram: 100, Monitoring mechanism; 101, Transmission system; 102, Power control system; 103, Transmission line; 104, Robotic arm; 105, Metal spraying wire; 106, Infrared structure; 107, Spraying end structure; 108, Base one; 200, Fixing mechanism; 201, Fixing body; 202, Base two; 203, Connecting column; 204, Horizontal clamp; 205, Vertical clamp; 206, Wiping cotton; 207, Connecting rod one; 208, Telescopic rod one; 209, Spring one; 210, Baffle; 211, Spring two; 212, Telescopic rod two; 213, Horizontal groove; 214, Longitudinal groove; 215, Sliding block; 216, Sliding groove; 217, Connecting rod two; 218, Handle; 219, Round block; 220, Locking block; 221, Moving groove; 222, Locking groove. Detailed Implementation

[0028] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0030] like Figs. 1-3As shown, the present invention provides a monitoring and fixing device for the sputtering of semiconductor components, including a monitoring mechanism 100 and a fixing mechanism 200. The monitoring mechanism 100 also includes a robotic arm 104. A sputtering metal wire 105 is disposed inside the top end of the robotic arm 104. A spraying end structure 107 is fixedly connected to the front end of the robotic arm 104. An infrared structure 106 is fixedly connected to the top end of the robotic arm 104. The sputtering metal wire 105, the infrared structure 106 and the spraying end structure 107 are used to sputter the surface of the component and detect parameters such as the roughness and thickness of the sputtered coating. A transmission line 103 is fixedly connected to the side of the robotic arm 104 away from the spraying end structure 107. A power control system 102 is fixedly connected to the end of the transmission line 103 away from the robotic arm 104. A transmission system 101 is rotatably connected to the top center of the power control system 102. Two transmission systems 101 are provided, with the other transmission system 101 rotatably connected to the top of the robotic arm 104. The molten metal wire 105 is wound around the outer surface of the two transmission systems 101. A base 108 is fixedly connected to the bottom end of the robotic arm 104. This allows for online real-time monitoring and detection of parameters such as the roughness and thickness of the molten coating, and provides real-time feedback to the control system of the molten coating machine based on the detection results, making corresponding adjustments to meet the required molten coating parameters.

[0031] like Figs. 4-5 As shown, the fixing mechanism 200 includes a fixing body 201. A base 202 is fixedly connected to the bottom end of the fixing body 201. A connecting column 203 is fixedly connected to the outer surface of the fixing body 201 near the robotic arm 104. A horizontal clamping plate 204 is fixedly connected to the bottom end of the connecting column 203. Two horizontal clamping plates 204 are provided, and two vertical clamping plates 205 are symmetrically arranged in the middle of the two horizontal clamping plates 204. Several telescopic rods 208 are uniformly fixedly connected to the bottom end of the lower horizontal clamping plate 204. The bottom ends of all telescopic rods 208 are fixedly connected to the top end of the base 202. A spring 209 is provided on the outside of each telescopic rod 208. The two ends of the spring 209 are respectively fixedly connected to the bottom end of the lower horizontal clamping plate 204 and the top end of the base 202. Two connecting rods 207 are symmetrically fixedly connected to the side of the fixing body 201 near the robotic arm 104. A wiping cotton 206 is fixedly connected to the middle of the connecting rod 207. Two baffles 210 are symmetrically fixedly connected to both sides of the lower horizontal clamping plate 204. A spring 211 and a telescopic rod 212 are fixedly connected to the side of each baffle 210 that is close to each other. The ends of the springs 211 and the telescopic rods 212 that are away from the baffles 210 are fixedly connected to the sides of the two vertical clamping plates 205. Thus, the parts are clamped by the elastic effect of the springs 209 and 211, while the surface of the parts that needs to be welded can be cleaned.

[0032] like Figs. 2-7As shown, two transverse grooves 213 are symmetrically opened on the side of the horizontal clamping plate 204 that are close to each other, and two longitudinal grooves 214 are symmetrically opened on the side of the vertical clamping plate 205 that are close to each other. Two sliding blocks 215 are symmetrically fixedly connected to the bottom end of each vertical clamping plate 205. Four sliding grooves 216 are symmetrically opened at the bottom end of the lower horizontal clamping plate 204. The four sliding blocks 215 are slidably connected to the inside of the four sliding grooves 216 respectively. Two connecting rods 217 are symmetrically fixedly connected to the side of the lower horizontal clamping plate 204 away from the robotic arm 104. A handle 218 is fixedly connected to the middle of the connecting rod 217. A round block 219 is fixedly connected to the bottom end of the handle 218. A locking block 220 is rotatably connected to the middle of the round block 219. Two moving grooves 221 are symmetrically opened through the middle of the fixed body 201. The two connecting rods 217 are respectively set inside the two moving grooves 221. A locking groove 222 is opened on the side of the fixed body 201 away from the robotic arm 104. This prevents the horizontal clamp 204 from springing upwards when parts need to be placed.

[0033] The effect achieved by the entire device is as follows: First, the operator pulls the handle 218 downwards. Since the connecting rod 217 fixedly connected to both ends of the handle 218 is fixedly connected to the lower horizontal clamping plate 204, and since the connecting rod 217 is located inside the spring 211, the downward pulling of the handle 218 will cause the lower horizontal clamping plate 204 to move downwards along the moving groove 221. Since the bottom end of the lower horizontal clamping plate 204 is fixedly connected to the telescopic rod 208 and the spring 209, the telescopic rod 208 will extend and retract, and the spring 209 will undergo elastic deformation. When the horizontal clamping plate 204 moves to the bottom, the locking block 220, which is rotated and connected to the round block 219 fixedly connected to the bottom end of the handle 218, will rotate, so that the locking block 220 rotates to the position where it is locked with the locking groove 222. At this time, the horizontal clamping plate 204 will not rebound under the locking effect. When the spring 209 does not rebound during the clamping process, it means that the parts can be fixed more stably. This helps reduce vibration or displacement caused by the rebound of spring 209, thereby improving the accuracy and stability of clamping.

[0034] Then, because the sliding blocks 215 fixedly connected to the bottom of the vertical clamping plate 205 are slidably connected to the sliding grooves 216 opened at the top of the horizontal clamping plate 204, the operator can slide the vertical clamping plate 205 away from each other along the surface of the horizontal clamping plate 204. The movement of the vertical clamping plate 205 will cause the telescopic rod 212 to extend and retract, and the spring 211 to undergo elastic deformation. At this time, the parts are placed in the slotted horizontal groove 213 at the top of the horizontal clamping plate 204, and then the vertical clamping plate 205 is released. At this time, the vertical clamping plate 205 will move towards the center under the rebound effect of the spring 211, so that the parts are placed in the vertical groove 216 opened on the side of the vertical clamping plate 205 that is close to each other. The component is fixed in slot 214. After the component is fixed, the locking block 220 is rotated away from the locking slot 222. At this time, the horizontal clamping plate 204 will move upward under the effect of the spring 209. Since the component is set to exit the surface of the horizontal clamping plate 204, when the horizontal clamping plate 204 moves the component upward, the surface of the component that needs to be sprayed will come into contact with the wiping cotton 206 fixedly connected to the middle of the connecting rod 207. Thus, when the component surface comes into contact with the wiping cotton 206, the component is wiped. Cleaning the surface of the component is beneficial to the fusion of metal powder with the surface of the component during the spraying process, forming a stronger metallurgical bond. This helps to improve the overall quality of the coating. Moreover, a clean surface also helps the metal powder to be evenly distributed during the spraying process, forming a coating with uniform thickness and a smooth surface, thereby helping to improve the overall quality and performance of the coating.

[0035] When the component, driven by the rebound of the horizontal clamping plate 204, comes into contact with the slotted transverse groove 213 of the top horizontal clamping plate 204, the component is fixed and clamped around its perimeter to prevent it from moving or deforming due to external forces during the spraying process, thus ensuring that the coating can be deposited evenly and stably on the surface of the component. Finally, after the component is completely clamped, the power control system 102 is activated to transmit a signal to the robotic arm 104 through the transmission line 103, causing the robotic arm 104 to move to a suitable spraying position. Then, the spraying end structure 107 heats and melts the spraying wire 105 and sprays it out. The transmission system 101 is constantly activated to push the spraying wire 105 forward. Then, the infrared structure 106 continuously detects the surface of the component, thereby achieving online real-time monitoring and detection of parameters such as the roughness and thickness of the sprayed coating. The detection results are fed back to the control system of the spraying machine in real time, and corresponding adjustments are made to meet the required spraying parameters. Real-time monitoring and testing can ensure that parameters such as coating roughness and thickness remain within a predetermined range, thereby avoiding instability in coating quality.

[0036] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A monitoring and fixing device for the melting and sputtering of semiconductor components, comprising a monitoring mechanism (100) and a fixing mechanism (200), characterized in that, The monitoring mechanism (100) includes a robotic arm (104), with a metal spraying wire (105) inside the top of the robotic arm (104). A spraying end structure (107) is fixedly connected to the front end of the robotic arm (104), and an infrared structure (106) is fixedly connected to the top of the robotic arm (104). The infrared structure (106) is used to detect the roughness and thickness parameters of the sprayed coating. The spraying end structure (107) is used to spray the surface of the part. The fixing mechanism (200) includes a fixing body (201), with a base (202) fixedly connected to the bottom end of the fixing body (201). A connecting column is fixedly connected to the outer surface of the fixing body (201) near the robotic arm (104). 203), a horizontal clamping plate (204) is fixedly connected to the bottom end of the connecting column (203). There are two horizontal clamping plates (204), and another horizontal clamping plate (204) is located below the first horizontal clamping plate (204). Two vertical clamping plates (205) are symmetrically arranged between the two horizontal clamping plates (204). Several telescopic rods (208) are evenly fixedly connected to the bottom end of the lower horizontal clamping plate (204). The bottom end of each telescopic rod (208) is fixedly connected to the top end of the base (202). A spring (209) is provided on the outside of each telescopic rod (208). The two ends of the spring (209) are fixedly connected to the bottom end of the lower horizontal clamping plate (204) and the base (202) respectively. At the top, two connecting rods (207) are symmetrically fixedly connected to the side of the fixed body (201) near the robotic arm (104). A wiping cotton (206) is fixedly connected to the middle of the connecting rod (207). At the bottom, two connecting rods (217) are symmetrically fixedly connected to one end of the horizontal clamp (204) away from the robotic arm (104). A handle (218) is fixedly connected between the other ends of the connecting rods (217). A round block (219) is fixedly connected to the bottom of the handle (218). A locking block (220) is rotatably connected to the middle of the round block (219). Two moving slots (221) are symmetrically opened through the middle of the fixed body (201). The two connecting rods (217) are respectively provided with The fixed body (201) is located inside the two moving slots (221). A locking slot (222) is provided on the side of the fixed body (201) away from the robotic arm (104). When the handle (218) is pulled downward, the lower horizontal clamping plate (204) will move downward along the moving slot (221). After the horizontal clamping plate (204) moves to the bottom, it controls the locking block (220) that is rotatably connected to the round block (219) fixedly connected to the bottom of the handle (218) to rotate. The rotation of the locking block (220) is used to lock with the locking slot (222). After the parts are fixed, the locking block (220) is rotated away from the locking slot (222). The horizontal clamping plate (204) will move upward under the effect of the spring (209).When the horizontal clamp (204) moves the component upward, the surface of the component that needs to be sprayed will come into contact with the wiping cotton (206) fixedly connected to the middle of the connecting rod (207). When the surface of the component comes into contact with the wiping cotton (206), the component will be wiped.

2. The monitoring and fixing device for the melting and sputtering of semiconductor components according to claim 1, characterized in that, A transmission line (103) is fixedly connected to the side of the robotic arm (104) away from the spraying end structure (107). A power control system (102) is fixedly connected to the end of the transmission line (103) away from the robotic arm (104). A transmission system (101) is rotatably connected to the top center of the power control system (102). There are two transmission systems (101). The other transmission system (101) is rotatably connected to the top of the robotic arm (104). The molten metal wire (105) is wound around the outer surface of the two transmission systems (101). A base (108) is fixedly connected to the bottom end of the robotic arm (104).

3. The monitoring and fixing device for the melting and fixing of semiconductor components according to claim 1, characterized in that, Two baffles (210) are symmetrically fixedly connected to both sides of the horizontal clamping plate (204) below. A spring (211) and a telescopic rod (212) are fixedly connected to the side of the two baffles (210) that are close to each other. The ends of the springs (211) and the telescopic rods (212) on both sides that are away from the baffles (210) are respectively fixedly connected to the sides of the two vertical clamping plates (205).

4. The monitoring and fixing device for the melting and sputtering of semiconductor components according to claim 3, characterized in that, Two transverse grooves (213) are symmetrically opened on the side of the two horizontal clamping plates (204) that are close to each other, and two longitudinal grooves (214) are symmetrically opened on the side of the two vertical clamping plates (205) that are close to each other. Two sliding blocks (215) are symmetrically fixedly connected to the bottom end of each vertical clamping plate (205). Four sliding grooves (216) are symmetrically opened at the bottom end of the lower horizontal clamping plate (204). The four sliding blocks (215) of the two vertical clamping plates (205) are slidably connected to the inside of the four sliding grooves (216).

Images