Cold plate liquid cooling server

Abstract

The present invention provides a cold plate type liquid cooling server, comprising a main frame and a server body, the server body is installed in the main frame, two groups of clamping components and cold plates are arranged above the main frame, the cold plate is detachably connected to the main frame through the two groups of clamping components; heat is transferred between the cold plate and the server body through a first heat conducting plate; a liquid storage tank and a cooling component are arranged below the main frame, the cold plate is connected to the liquid storage tank and the cooling component through a water pump, and the cooling component is connected to the liquid storage tank through a connecting pipe; a control module is arranged on the main frame, and temperature sensors are arranged in the main frame and on the liquid storage tank. The server realizes the alternation of hot and cold between the server body and the cold plate through the first heat conducting plate, and the cold plate is connected to the cooling component and the liquid storage tank to form a coolant circulation system, so that the cold plate can continuously absorb the heat generated by the server body, ensuring that the server body can still maintain a stable temperature when running for a long time and working under high load.

Description

Technical Field

[0001] The present invention belongs to the technical field of servers, and more specifically, particularly relates to a cold plate type liquid cooling server. Background Art

[0002] During the use of the server, multiple internal components will run at the same time. As the operation lasts for a long time, the power consumption of the components will increase significantly, causing the components to generate a large amount of heat. In order to prevent the server from running in a high-temperature environment for a long time, the server is often cooled to dissipate the heat generated by the server to a certain extent, thereby cooling the server and ensuring the stable operation of the server. However, traditional servers often rely on their own air-cooling structure for heat dissipation, and promote air circulation through fans to dissipate the heat generated during the operation of the server. However, when the server is under high load, performing large-scale data calculations or running uninterruptedly for a long time, due to the low thermal conductivity of the air, the air-cooling structure cannot discharge the high heat in time, resulting in heat remaining in the server. The long-term heat accumulation causes the internal temperature of the server to continue to rise, resulting in a decrease in server performance. At the same time, it may also cause damage to the server's hardware and shorten the service life of the server. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a cold plate liquid cooling server to solve the technical problems in the prior art that the traditional server air cooling structure has low heat dissipation efficiency, which will lead to residual heat and long-term accumulation when in a high-load state, easily causing server performance degradation and hardware damage, and shortening the service life.

[0004] The purpose and effect of a cold plate liquid cooling server of the present invention are achieved by the following specific technical means:

[0005] A cold plate type liquid cooling server comprises a main frame and a server body, wherein the server body is installed in the main frame, and two groups of clamping assemblies and cold plates are arranged above the main frame, the two groups of the clamping assemblies are connected to the main frame, and the cold plate is detachably connected to the main frame through the two groups of the clamping assemblies; a first heat conducting plate is arranged between the cold plate and the server body, and the first heat conducting plate is in contact with the server body and the cold plate; a liquid storage tank and a cooling assembly are arranged below the main frame, the liquid storage tank is located between the main frame and the cooling assembly, the cold plate is connected to the liquid storage tank and the cooling assembly through a water pump, and the cooling assembly is connected to the liquid storage tank through a connecting pipe; a control module is arranged on the main frame, and temperature sensors are arranged in the main frame and on the liquid storage tank.

[0006] According to a preferred embodiment, the clamping assembly includes a clamping base and a clamping piece, mounting plates are provided on both sides of the main frame, and the clamping base is detachably connected to the mounting plates by multiple sets of screws; a support frame is provided on the clamping base, the clamping piece is clamped in the support frame and is rotatably connected to the support frame through a rotating shaft, a rotating shaft and a clamping block are provided above the clamping base, and the rotating shaft is passed through the clamping base; two sets of limit plates are provided on the clamping base, the clamping block is located between the two sets of limit plates, a bearing is provided on the clamping block, one end of the rotating shaft is clamped in the bearing, a roller is rotatably provided at one end of the clamping piece, and the clamping block is in contact with the roller.

[0007] According to a preferred embodiment, the cold plate includes a bottom plate and a top plate, the bottom plate is in contact with the first heat conductive plate, a plurality of groups of support blocks are arranged on the bottom plate, fixing holes are opened on the top plate and the support blocks, fixing bolts are passed through the fixing holes, and the top plate and the bottom plate are detachably connected; a heat dissipation cold pipe is arranged between the bottom plate and the top plate, a plurality of groups of support blocks are passed through the heat dissipation cold pipe, a plurality of groups of clips are arranged on the top of the bottom plate, the heat dissipation cold pipe is clamped in the clips, and both ends of the heat dissipation cold pipe are respectively connected and communicated with the liquid storage tank and the cooling assembly; a clamping plate is arranged at both ends of the top plate, and the clamping plate is clamped between the clamping base and the clamping member.

[0008] According to a preferred embodiment, a wavy surface is provided at the bottom of the base plate and a top of the first heat conducting plate, and the base plate and the first heat conducting plate are matched through the wavy surface; a plurality of heat sinks are provided above the top plate, a plurality of connecting slots are provided on the top of the top plate, the heat sinks are clamped in the connecting slots, the heat sinks and the top plate are detachably connected, and a heat dissipation channel is formed between the heat sinks and the adjacent heat sinks; a bellows is installed on the top plate, a plurality of mounting slots are provided on one side of the bellows, a fan is clamped in the mounting slots, a plurality of air outlets are provided on the other side of the bellows, and the air outlets are located in the heat dissipation channel.

[0009] According to a preferred embodiment, the cooling assembly includes a mounting bracket and a cooling copper tube, a plurality of mounting columns are provided on both sides of the main frame, the mounting bracket is provided with mounting slots corresponding to the mounting columns, the mounting columns are clamped in the mounting slots, and the mounting bracket is detachably connected to the main frame by a plurality of mounting screws; a heat insulation plate is provided between the liquid storage tank, the server body and the mounting bracket, a cooling shell is provided at the bottom of the mounting bracket, the cooling shell is connected to the mounting bracket to form a cooling cavity, the cooling copper tube is installed in the cooling cavity, one end of the cooling copper tube is connected to the cold plate, and the other end is connected to the liquid storage tank.

[0010] According to a preferred embodiment, the cooling assembly also includes a heat sink, which is installed in the cooling cavity and in contact with the cooling copper tube. A plurality of heat sink fins are arranged on the heat sink. A heat dissipation groove is provided on one side of the cooling shell, and the cooling cavity is connected to the outside through the heat dissipation groove. An air duct is provided on the other side of the cooling shell, and the air duct is connected to the cooling cavity. A fan is provided at the bottom of the cooling shell, and the fan is detachably connected to the cooling shell, and the fan is connected to the air duct through a ventilation pipe.

[0011] According to a preferred embodiment, the cooling assembly further includes a semiconductor refrigeration plate and a second heat conducting plate, both of which are installed in the cooling cavity, and the second heat conducting plate is located between the semiconductor refrigeration plate and the cooling copper tube, and contacts the semiconductor refrigeration plate and the cooling copper tube; a heat dissipation groove is provided on one side of the cooling shell, and the cooling cavity is connected to the outside through the heat dissipation groove, and an air duct is provided on the other side of the cooling shell, and the air duct is connected to the cooling cavity; a fan is provided at the bottom of the cooling shell, and the fan is detachably connected to the cooling shell, and the fan is connected to the air duct through a ventilation duct. According to a preferred embodiment, a ventilation rack is provided between the mounting bracket and the liquid storage tank, and multiple groups of air outlet pipes are provided on one side of the ventilation rack, and multiple groups of air outlet holes are provided on both sides of the air outlet pipe, and multiple groups of placement slots are provided at the bottom of the liquid storage tank, and the air outlet pipe is located in the placement slot; multiple groups of blowing pipes are provided at the bottom of the cooling shell, and the blowing pipes are connected to the cooling cavity, and the fan is located between the multiple groups of blowing pipes.

[0012] According to a preferred embodiment, a plurality of connection ports are provided on one side of the server body, a dustproof net is provided on one side of the main frame, a wire groove is opened on the dustproof net corresponding to the connection port, a connecting wire is passed through the wire groove and connected to the connection port, and the server body is connected to an external device through the connecting wire; a sealing cover plate is provided on one side of the wire groove, the sealing cover plate is rotatably connected to the dustproof net, and a flip spring is also provided between the sealing cover plate and the dustproof net.

[0013] According to a preferred embodiment, a plurality of groups of limit members are arranged above the main frame, the limit members are connected to the main frame by a plurality of groups of mounting screws, and the cold plate is clamped between the plurality of groups of limit members; assembly plates are arranged at both ends of the liquid storage tank, the main frame is clamped between two groups of assembly plates, a plurality of groups of assembly blocks are arranged on the assembly plates, the main frame is provided with assembly grooves corresponding to the assembly blocks, the assembly blocks are clamped in the assembly grooves, and the liquid storage tank is detachably connected to the main frame by a plurality of groups of assembly screws.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The server is provided with a cold plate on the main frame. The cold plate is in contact with the server body and can effectively absorb a large amount of heat generated when the server is running. At the same time, a liquid storage tank and a cooling component are provided under the main frame. The cold plate is connected to the liquid storage tank and the cooling component through a water pump, and the cooling component is connected to the liquid storage tank, thereby realizing the circulation of the coolant, which can take away the heat absorbed by the cold plate, and cool the coolant through the cooling component, so that the cold plate can continuously absorb the heat generated by the server body, ensuring that the server can maintain a stable temperature when running for a long time and working at high load, thereby reducing the server performance degradation and hardware damage caused by overheating, and extending the service life of the server.

[0016] 2. The cold plate is composed of a bottom plate, a top plate and a heat dissipation cold pipe. Heat is transferred between the bottom plate and the server body through the first heat conducting plate. Wave surfaces are provided on the top of the first heat conducting plate and the bottom of the bottom plate, and the two sets of wave surfaces fit each other. The first heat conducting plate is in contact with the bottom plate. The wave surface can increase the contact area between the two. When the server body generates heat, the heat can be transferred to the bottom plate more quickly through the first heat conducting plate. The existence of the wave surface makes the contact points more and the heat conduction efficiency higher. A large amount of heat can be transferred from the server body to the cold plate in a shorter time, which lays a good foundation for the subsequent heat dissipation process, thereby ensuring that the server can maintain a stable temperature even under high load operation. At the same time, multiple groups of heat sinks are detachably provided on the top plate, and multiple groups of heat dissipation channels are formed through the heat sinks. A bellows is installed on the top plate, multiple groups of fans are provided on one side of the bellows, and an air outlet is provided on the other side. The air outlet is located in the heat dissipation channel. Since the bottom plate and the top plate are both made of heat-conducting materials, when the heat is conducted to the top plate, the heat sink can quickly absorb the heat, and the airflow generated by the fan of the bellows is blown into the heat dissipation channel through the air outlet, which accelerates the dissipation of heat on the heat sink, so that the heat generated by the server can be conducted and dissipated, thereby improving the heat dissipation efficiency and ensuring that the server can maintain a stable operating temperature even under long-term high-load operation.

[0017] 3. The clamping assembly ensures the contact between the cold plate and the server body. At the same time, the clamping assembly also realizes the rapid installation and disassembly of the cold plate and the main frame, which improves the convenience of maintenance and replacement. The clamping base is detachably connected to the mounting plate by screws. The clamping piece can be flexibly rotated through the support frame and the rotating shaft, and cooperates with the clamping block to apply stable pressure to the cold plate. The rotating shaft and bearing make the adjustment of the clamping block more accurate. When the clamping block continuously squeezes the roller, it can evenly apply pressure to the clamping plate of the cold plate through the clamping piece, ensuring close contact between the cold plate and the server body and ensuring good heat conduction effect. When the server body generates heat, the heat can be quickly transferred from the server body to the cold plate, avoiding the accumulation of heat inside the server, and effectively reducing the risk of performance degradation and hardware damage due to overheating of the server.

[0018] 4. A cooling assembly is provided under the main frame, through which the coolant that takes away the heat can be cooled down to ensure that the coolant can circulate continuously to dissipate heat for the server. The cooling copper tube in the cooling assembly is installed in the cooling cavity and contacts the heat sink. The multiple sets of heat dissipation fins on the heat sink increase the contact area with the air and improve the heat dissipation efficiency. The heat dissipation grooves and air ducts on one side of the cooling shell and the fan at the bottom work together to form a good air circulation channel to accelerate the dissipation of heat. The heat insulation board between the liquid storage tank and the server body and the mounting bracket can reduce the transfer of heat and improve the cooling effect. The setting of the ventilation rack and the air outlet duct can provide additional heat dissipation effect for the liquid storage tank. The airflow generated by the fan will enter the ventilation rack and blow to the liquid storage tank through the air outlet holes opened on the air outlet duct. The heat dissipation capacity of the cooling assembly ensures that the coolant can be cooled quickly during the circulation process, continuously providing low-temperature coolant for the cold plate, and ensuring the heat dissipation requirements of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Is a schematic diagram of the structure of the present invention after assembly;

[0020] Figure 2 It is a schematic diagram of the structure of the present invention after splitting;

[0021] Figure 3 It is a schematic diagram of the structure after the cold plate is split;

[0022] Figure 4 It is a schematic diagram of the structure after the clamping assembly is disassembled;

[0023] Figure 5 This is a schematic diagram of the structure of the cooling assembly after the disassembly of the embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the structure of the cooling assembly after the second embodiment of the present invention is split;

[0025] Figure 7 yes Figure 1 A partial enlarged view of area a in the middle;

[0026] Figure 8 It is a schematic diagram of the structure of the bellows;

[0027] Fig. 9 is a bottom view of the cooling housing;

[0028] Fig.10 is a back view of the cooling housing;

[0029] Fig.11 It is a schematic diagram of the structure of the liquid storage tank;

[0030] Fig.12 It is a right side view of the reservoir;

[0031] Fig.13 It is the principle block diagram of the control module.

[0032] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0033] 11. Main frame; 12. Mounting plate; 13. Mounting column; 14. Stopper; 15. Assembly slot; 21. Server body; 22. First heat conducting plate; 23. Control module; 24. Temperature sensor; 25. Dust screen; 26. Wire slot; 27. Sealing cover; 301. Liquid storage tank; 302. Bottom plate; 303. Top plate; 304. Support block; 305. Heat dissipation pipe; 306. Buckle; 307. Pressing plate; 308. Wave surface; 309. Heat dissipation plate; 310. Connection slot; 311. Bellows; 312. Mounting slot; 313. Fan; 314 , air outlet; 315, placement slot; 316, assembly plate; 317, assembly block; 41, clamping base; 42, clamping member; 43, support frame; 44, rotating shaft; 45, clamping block; 46, limit plate; 47, roller; 501, mounting bracket; 502, cooling copper tube; 503, mounting slot; 504, heat insulation board; 505, cooling shell; 506, heat dissipation member; 507, heat dissipation slot; 508, air duct; 509, fan; 510, semiconductor refrigeration plate; 511, second heat conduction plate; 512, ventilation rack; 513, air outlet duct; 514, blow pipe. DETAILED DESCRIPTION

[0034] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention. Embodiment 1:

[0035] like Figures 1 to 13As shown, the present invention provides a cold plate type liquid cooling server, the main frame 11 plays a role in supporting and connecting other components, and the main frame 11 can provide a reliable installation foundation for the server body 21 and other components. The server body 21 is installed in the main frame 11 to ensure that there will be no shaking or displacement during operation, and to ensure the stable operation of the server. At the same time, a slide groove is provided in the main frame 11, and the server body 21 is opened in the slide groove, so that a certain gap is formed between the server body 21 and the main frame 11. Two groups of clamping components and cold plates are provided above the main frame 11, and the clamping components are connected to the main frame 11 to provide locking pressure for the installation of the cold plate. The cold plate is detachably connected to the main frame 11 through these two groups of clamping components, which facilitates the operation when maintenance or replacement is required. The heat generated by the server body 21 during operation can be taken away by the cold plate. The first heat conducting plate 22 provided between it and the server body 21 can conduct the heat generated by the server body 21 during operation to the cold plate. The first heat conducting plate 22 is in contact with the server body 21 and the cold plate to ensure the smoothness of heat transfer. A liquid storage tank 301 and a cooling assembly are provided below the main frame 11. The liquid storage tank 301 is located between the main frame 11 and the cooling assembly and serves to store coolant. The cold plate is connected to the liquid storage tank 301 and the cooling assembly through a water pump to ensure that the coolant can circulate in the system. When the cold plate absorbs the heat generated by the server body 21, the coolant carrying the heat is transported to the cooling assembly through the water pump. The cooling assembly is connected to the liquid storage tank 301 through a connecting pipe, and the coolant after cooling returns to the liquid storage tank 301 to prepare for the next round of heat dissipation cycle. A control module 23 is provided on the main frame 11. The control module 23 can intelligently control the entire heat dissipation system. It can adjust the flow rate of the water pump, the working state of the cooling assembly and other parameters in real time according to the data fed back by the temperature sensor 24 to ensure that the server always runs within a suitable temperature range. It is connected to the server body 21 to achieve power-on. The control module 23 can use Mitsubishi FX5U-32MT / ES. Temperature sensors 24 are provided inside the main frame 11 and on the liquid storage tank 301. These temperature sensors 24 can monitor the temperature changes of the coolant around the server body 21 and in the liquid storage tank 301, and provide data basis for the decision of the control module 23. The temperature sensor 24 can adopt Omron E52-CA15A.

[0036] like Figure 2 , Figure 4As shown, the clamping assembly includes a clamping base 41 and a clamping member 42. A mounting plate 12 is provided on both sides of the main frame 11. The clamping base 41 is detachably connected to the mounting plate 12 through multiple sets of screws. A support frame 43 is provided on the clamping base 41. The clamping member 42 is clamped in the support frame 43 and is rotatably connected to the support frame 43 through a rotating shaft, so that the clamping member 42 can be rotated and adjusted to better adapt to different installation requirements and the angle of applying pressure. A rotating shaft 44 and a clamping block 45 are provided above the clamping base 41. The rotating shaft 44 is penetrated on the clamping base 41 and can be stably rotated. Two sets of limit plates 46 are provided on the clamping base 41, and the clamping block 45 is located between the two sets of limit plates 46. The function of the limit plate 46 is to limit the moving range of the clamping block 45 to ensure that the clamping block 45 can be accurately adjusted in the specified area. A bearing is provided on the clamping block 45, and one end of the rotating shaft 44 is clamped in the bearing. The setting of the bearing makes the rotation of the rotating shaft 44 smoother, and also reduces the friction loss between the rotating shaft 44 and the pressing block 45. A roller 47 is rotatably provided at one end of the pressing member 42, and the pressing block 45 contacts the roller 47. When it is necessary to apply pressure to the cold plate, the pressing block 45 is driven to move by the rotation of the rotating shaft 44, and the pressing block 45 squeezes the roller 47, so that the pressing member 42 generates pressure on the cold plate. The rotatability of the roller 47 reduces the sliding friction between the pressing block 45 and the pressing member 42, making the transmission of pressure more uniform and stable. Through the cooperation of the rotating shaft 44, the pressing block 45 and the pressing member 42, the contact between the cold plate and the server body 21 can be ensured, the heat conduction efficiency can be improved, and the heat generated during the operation of the server body 21 can be effectively transferred to the cold plate, providing a good foundation for the subsequent heat dissipation process. At the same time, the close cooperation and adjustability between the various components also enable the pressing assembly to adapt to servers and cold plates of different specifications, thereby improving the versatility and applicability of the entire system.

[0037] like Figure 2 , Figure 3 , Figure 8As shown, the cold plate includes a bottom plate 302 and a top plate 303. The bottom plate 302 contacts the first heat conducting plate 22, can receive the heat generated by the server body 21 during operation, and transfer it to the internal heat dissipation structure. A plurality of support blocks 304 are arranged on the bottom plate 302. These support blocks 304 not only provide stable support for the top plate 303, but also play a role in the installation and fixation of the heat dissipation cold pipe 305. The top plate 303 and the support blocks 304 are provided with fixing holes, and the fixing bolts are inserted into these fixing holes, so that the top plate 303 and the bottom plate 302 can be detachably connected. This facilitates the operation when maintenance or replacement of internal components is required, and improves the maintainability of the cold plate. A heat dissipation cold pipe 305 is arranged between the bottom plate 302 and the top plate 303, and a plurality of support blocks 304 are inserted into the heat dissipation cold pipe 305 to ensure the stable position of the heat dissipation cold pipe 305. A plurality of buckles 306 are arranged on the top of the bottom plate 302, and the heat dissipation cold pipe 305 is clamped in the buckles 306, which further strengthens the fixation of the heat dissipation cold pipe 305. The two ends of the heat dissipation cold pipe 305 are respectively connected to the liquid storage tank 301 and the cooling assembly, so that the coolant can circulate in the heat dissipation cold pipe 305. When the heat generated by the server body 21 is transferred to the cold plate, the coolant in the heat dissipation cold pipe 305 absorbs the heat, and then the coolant carrying the heat is transported to the cooling assembly for cooling treatment. The cooled coolant returns to the liquid storage tank 301 to prepare for the next round of heat dissipation cycle.

[0038] Both ends of the top plate 303 are provided with a clamping plate 307, which is clamped between the clamping base 41 and the clamping member 42, ensuring the stability of the cold plate during operation and preventing poor contact between the cold plate and the server body 21 due to vibration or other external factors. The bottom of the bottom plate 302 and the top of the first heat conducting plate 22 are both provided with a wavy surface 308, and the bottom plate 302 and the first heat conducting plate 22 are matched through the wavy surface 308. This wavy surface 308 increases the contact area between the two, and compared with the plane contact, the wavy surface 308 can provide more heat conduction paths. When the server body 21 generates heat, the heat can be transferred to the bottom plate 302 through the first heat conducting plate 22 more quickly and evenly, thereby improving the heat conduction efficiency.

[0039] A plurality of heat sinks 309 are arranged above the top plate 303, and a plurality of connection slots 310 are provided on the top of the top plate 303. The heat sinks 309 are clamped in the connection slots 310, so that the heat sinks 309 and the top plate 303 can be detachably connected, which is convenient for the installation and replacement of the heat sinks 309, and also improves the flexibility and adaptability of the cold plate; the heat sinks 309 and the adjacent heat sinks 309 form a heat dissipation channel, which provides a good path for the heat dissipation. A bellows 311 is installed on the top plate 303, and a plurality of installation slots 312 are provided on one side of the bellows 311, and a fan 313 is clamped in the installation slot 312, and when the fan 313 is running, a strong airflow can be generated. A plurality of air outlets 314 are arranged on the other side of the bellows 311, and the air outlets 314 are located in the heat dissipation channel, so that the airflow can be directly blown into the heat dissipation channel, accelerating the heat dissipation on the heat sink 309.

[0040] like Figure 1 , Figure 5 , Figure 7 , Fig. 9 , Fig.10 As shown, the cooling assembly includes a mounting bracket 501 and a cooling copper tube 502. Multiple groups of mounting columns 13 are arranged on both sides of the main frame 11. The mounting bracket 501 is provided with mounting slots 503 corresponding to the mounting columns 13. The mounting columns 13 are clamped in the mounting slots 503, which not only ensures the installation of the mounting bracket 501 on the main frame 11, but also facilitates the disassembly operation when maintenance or replacement is required. The mounting bracket 501 is further connected to the main frame 11 through multiple groups of mounting screws, making the entire structure more stable and reliable. A heat insulation board 504 is arranged between the liquid storage tank 301 and the server body 21 and the mounting bracket 501. The heat insulation board 504 effectively blocks the transfer of heat, prevents the heat generated by the server body 21 from affecting the normal operation of the cooling assembly, and also prevents the low temperature of the cooling assembly from having an adverse effect on the server body 21. A cooling shell 505 is arranged at the bottom of the mounting bracket 501, and the cooling shell 505 is tightly connected to the mounting bracket 501 to form a cooling cavity. The cooling copper tube 502 is installed in the cooling cavity, one end of the cooling copper tube 502 is connected to the cold plate, and the other end is connected to the liquid storage tank 301, forming a complete coolant circulation system. When the coolant carrying heat flows from the cold plate into the cooling copper tube 502, the cooling copper tube 502 interacts with other heat dissipation structures in the cooling cavity to dissipate the heat in the coolant, so that the coolant cools down and then flows back to the liquid storage tank 301.

[0041] The cooling assembly also includes a heat sink 506, which is installed in the cooling cavity and in close contact with the cooling copper tube 502. The heat sink 506 is provided with multiple groups of heat sink fins, which greatly increase the heat dissipation area and improve the heat dissipation efficiency. After the heat in the coolant is transferred to the cooling copper tube 502, the cooling copper tube 502 transfers the heat to the heat sink 506, and the heat sink 506 dissipates the heat to the air in the cooling cavity through the heat sink fins. A heat dissipation groove 507 is provided on one side of the cooling shell 505, and the cooling cavity is connected to the outside world through the heat dissipation groove 507, so that the hot air in the cooling cavity can be discharged in time, and the air circulation in the cooling cavity is maintained, thereby improving the heat dissipation effect. An air duct 508 is provided on the other side of the cooling shell 505, and the air duct 508 is connected to the cooling cavity. A fan 509 is provided at the bottom of the cooling shell 505, and the fan 509 is detachably connected to the cooling shell 505, which facilitates the maintenance and replacement of the fan 509. The fan 509 is connected to the air duct 508 through the ventilation duct. When the fan 509 is running, it can generate a strong airflow, accelerate the air flow in the cooling cavity, quickly discharge the hot air out of the cooling cavity, and introduce cold air from the outside to further improve the heat dissipation efficiency.

[0042] like Figure 2 , Fig.12 As shown, a ventilation rack 512 is arranged between the mounting bracket 501 and the liquid storage tank 301, and multiple groups of air outlet pipes 513 are arranged on one side of the ventilation rack 512, and multiple groups of air outlet holes are arranged on both sides of the air outlet pipes 513. Multiple groups of placement slots 315 are arranged at the bottom of the liquid storage tank 301, and the air outlet pipes 513 are located in the placement slots 315. When the fan 509 is running, a part of the air flow passes through the ventilation rack 512 and the air outlet pipe 513, blows out from the air outlet hole, and assists in cooling the liquid storage tank 301. Multiple groups of blowing pipes 514 are arranged at the bottom of the cooling shell 505, and the blowing pipes 514 are connected with the cooling cavity. The fan 509 is located between the multiple groups of blowing pipes 514, ensuring that the air flow can enter the cooling cavity evenly, thereby improving the overall heat dissipation efficiency of the cooling assembly. Not only the coolant in the cooling copper tube 502 is cooled, but also the liquid storage tank 301 is assisted in heat dissipation, further improving the performance of the entire cooling system, and ensuring that the server can maintain a stable temperature under long-term high-load operation.

[0043] like Figure 2 , Fig.11As shown, a plurality of connection ports are arranged on one side of the server body 21, which are important channels for data transmission and communication between the server body 21 and external devices. A dustproof net 25 is arranged on one side of the main frame 11, and a wire groove 26 is provided corresponding to the connection port of the dustproof net 25. The connecting wire can be inserted into the wire groove 26 and connected to the connection port, so as to realize the connection between the server body 21 and the external device through the connecting wire. The dustproof net 25 can effectively prevent dust and impurities from entering the server, and protect the electronic components of the server from pollution and damage. A sealing cover plate 27 is arranged on one side of the wire groove 26, and the sealing cover plate 27 is rotatably connected to the dustproof net 25. After the connecting wire passes through the wire groove 26, the sealing cover plate 27 can be closed to further enhance the dustproof effect. A flap spring is also arranged between the sealing cover plate 27 and the dustproof net 25, and the flap spring can provide a certain elastic force, so that the sealing cover plate 27 can automatically rebound and close after opening, which is convenient for operation and also ensures the continuity of dustproof.

[0044] A plurality of sets of limit members 14 are arranged above the main frame 11, and the limit members 14 are connected to the main frame 11 by a plurality of sets of mounting screws, which not only ensures the stability of the limit members 14, but also facilitates disassembly and adjustment when necessary. The cold plate is arranged between the plurality of sets of limit members 14, and the limit members 14 can fix and limit the cold plate, prevent the cold plate from displacement or shaking during the operation of the server, ensure the contact between the cold plate and the server body 21, and thus ensure a good heat conduction effect. Through the joint action of the plurality of sets of limit members 14, the cold plate can maintain a stable position during operation, thereby improving the heat dissipation efficiency and the reliability of the system.

[0045] The liquid storage tank 301 is used as a storage container for the coolant, and both ends thereof are provided with assembly plates 316. The main frame 11 is clamped between two sets of assembly plates 316, so that the liquid storage tank 301 can be installed on the main frame 11. Multiple sets of assembly blocks 317 are provided on the assembly plates 316, and the main frame 11 is provided with assembly grooves 15 corresponding to the assembly blocks 317. The assembly blocks 317 are clamped in the assembly grooves 15, which further strengthens the connection stability between the liquid storage tank 301 and the main frame 11. The liquid storage tank 301 is detachably connected to the main frame 11 through multiple sets of assembly screws, which facilitates the installation, maintenance and replacement of the liquid storage tank 301. When the liquid storage tank 301 needs to be cleaned, repaired or the coolant is replaced, the liquid storage tank 301 can be removed from the main frame 11, which improves the maintainability and flexibility of the entire system.

[0046] Embodiment 2:

[0047] Based on the cold plate liquid cooling server provided in the first embodiment of the present application, the second embodiment of the present application proposes a cold plate liquid cooling server. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment. The second embodiment of the present invention will be further described below.

[0048] like Figure 6 As shown, the cooling assembly also includes a semiconductor refrigeration plate 510 and a second heat conducting plate 511. The semiconductor refrigeration plate 510 utilizes the thermoelectric effect of semiconductor materials to quickly absorb heat and dissipate it to the surrounding environment. The second heat conducting plate 511 is located between the semiconductor refrigeration plate 510 and the cooling copper tube 502, and contacts the semiconductor refrigeration plate 510 and the cooling copper tube 502. The second heat conducting plate 511 can efficiently conduct the heat in the cooling copper tube 502 to the semiconductor refrigeration plate 510, thereby improving the heat dissipation efficiency. The semiconductor refrigeration plate 510 can adopt the Fuxin TEC1-12706 semiconductor refrigeration plate. A heat dissipation groove 507 is provided on one side of the cooling shell 505, and the cooling cavity is connected to the outside world through the heat dissipation groove 507, so that the heat in the cooling cavity can be dissipated to the outside world. An air duct 508 is provided on the other side of the cooling shell 505, and the air duct 508 is connected to the cooling cavity. A fan 509 is provided at the bottom of the cooling shell 505, and the fan 509 is detachably connected to the cooling shell 505, which is convenient for maintenance and replacement. The fan 509 is connected to the air duct 508 through a ventilation pipe. When the fan 509 is running, it can generate a strong airflow to accelerate the heat dissipation in the cooling cavity and achieve heat dissipation for the semiconductor refrigeration plate 510.

[0049] The difference between the second embodiment and the first embodiment is that the semiconductor refrigeration plate 510 and the second heat conducting plate 511 are used to cool the coolant. The semiconductor refrigeration plate 510 uses the thermoelectric effect of semiconductor materials to quickly absorb heat and dissipate it into the surrounding environment. The second heat conducting plate 511 conducts heat between the semiconductor refrigeration plate 510 and the cooling copper tube 502. The semiconductor refrigeration plate 510 can more quickly deal with the large amount of heat generated when the server is running at high load, ensuring that the server temperature will not rise rapidly. At the same time, the semiconductor refrigeration plate 510 can more accurately control the cooling effect by adjusting the current and other methods, and can be flexibly adjusted according to the actual heat dissipation needs of the server. For example, when the server load changes greatly, the working state of the semiconductor refrigeration plate 510 can be adjusted in time to keep the server temperature stable. The remaining conditions are consistent with the first embodiment, so this embodiment will not be repeated.

[0050] The basic principles and main features of the present invention and the advantages of the present invention are shown and described above. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments.

Claims

1. A cold plate liquid cooling server, comprising a main frame (11) and a server body (21), characterized in that: The server body (21) is installed in the main frame (11); two groups of clamping assemblies and cold plates are arranged above the main frame (11); the two groups of clamping assemblies are connected to the main frame (11); the cold plate is detachably connected to the main frame (11) through the two groups of clamping assemblies; a first heat conducting plate (22) is arranged between the cold plate and the server body (21); the first heat conducting plate (22) is in contact with the server body (21) and the cold plate; a liquid storage tank (301) and a cooling assembly are arranged below the main frame (11); the liquid storage tank (301) is located between the main frame (11) and the cooling assembly; the cold plate is connected to the liquid storage tank (301) and the cooling assembly through a water pump; the cooling assembly is connected to the liquid storage tank (301) through a connecting pipe; a control module (23) is arranged on the main frame (11); temperature sensors are arranged in the main frame (11) and on the liquid storage tank (301). (24); the clamping assembly comprises a clamping base (41) and a clamping member (42); mounting plates (12) are provided on both sides of the main frame (11); the clamping base (41) is detachably connected to the mounting plates (12) via a plurality of sets of screws; a support frame (43) is provided on the clamping base (41); the clamping member (42) is clamped in the support frame (43) and is rotatably connected to the support frame (43) via a rotating shaft; a rotating member (42) is provided above the clamping base (41). A rotating shaft (44) and a pressing block (45), wherein the rotating shaft (44) is passed through the pressing base (41); two groups of limit plates (46) are provided on the pressing base (41), and the pressing block (45) is located between the two groups of limit plates (46); a bearing is provided on the pressing block (45), one end of the rotating shaft (44) is clamped in the bearing, and a roller (47) is rotatably provided at one end of the pressing member (42), and the pressing block (45) is in contact with the roller (47).

2. A cold plate liquid cooling server according to claim 1, characterized in that: The cold plate comprises a bottom plate (302) and a top plate (303), the bottom plate (302) is in contact with the first heat conducting plate (22), a plurality of groups of support blocks (304) are arranged on the bottom plate (302), fixing holes are opened on the top plate (303) and the support blocks (304), fixing bolts are passed through the fixing holes, and the top plate (303) and the bottom plate (302) are detachably connected; a heat dissipation cooling pipe (305) is arranged between the bottom plate (302) and the top plate (303), and the plurality of groups of support blocks (304) are arranged on the bottom plate (302). The support block (304) is inserted into the heat dissipation cooling tube (305); a plurality of groups of buckles (306) are arranged on the top of the bottom plate (302); the heat dissipation cooling tube (305) is clamped in the buckles (306); and both ends of the heat dissipation cooling tube (305) are respectively connected to the liquid storage tank (301) and the cooling assembly; and clamping plates (307) are arranged at both ends of the top plate (303); and the clamping plates (307) are clamped between the clamping base (41) and the clamping member (42).

3. A cold plate liquid cooling server according to claim 2, characterized in that: The bottom of the bottom plate (302) and the top of the first heat conducting plate (22) are both provided with a wavy surface (308), and the bottom plate (302) and the first heat conducting plate (22) are matched through the wavy surface (308); a plurality of heat dissipation plates (309) are provided above the top plate (303), and a plurality of connection slots (310) are provided on the top of the top plate (303), and the heat dissipation plates (309) are clamped in the connection slots (310). The top plate (303) is detachably connected to the heat dissipation plate (309), and the heat dissipation plate (309) and adjacent heat dissipation plates (309) form a heat dissipation channel; a bellows (311) is installed on the top plate (303), and a plurality of installation slots (312) are provided on one side of the bellows (311), and fans (313) are provided in the installation slots (312); a plurality of air outlets (314) are provided on the other side of the bellows (311), and the air outlets (314) are located in the heat dissipation channel.

4. The cold plate liquid cooling server according to claim 1, characterized in that: The cooling assembly comprises a mounting bracket (501) and a cooling copper tube (502); a plurality of mounting columns (13) are arranged on both sides of the main frame (11); the mounting bracket (501) is provided with mounting slots (503) corresponding to the mounting columns (13); the mounting columns (13) are clamped in the mounting slots (503); the mounting bracket (501) is detachably connected to the main frame (11) via a plurality of mounting screws; a heat insulation plate (504) is arranged between the liquid storage tank (301), the server body (21) and the mounting bracket (501); a cooling shell (505) is arranged at the bottom of the mounting bracket (501); the cooling shell (505) is connected to the mounting bracket (501) to form a cooling cavity; the cooling copper tube (502) is installed in the cooling cavity; one end of the cooling copper tube (502) is connected to the cold plate, and the other end is connected to the liquid storage tank (301).

5. A cold plate liquid cooling server according to claim 4, characterized in that: The cooling assembly also includes a heat sink (506), the heat sink (506) is installed in the cooling cavity and contacts the cooling copper tube (502), a plurality of heat sink fins are arranged on the heat sink (506), a heat dissipation groove (507) is opened on one side of the cooling shell (505), the cooling cavity is connected to the outside through the heat dissipation groove (507), an air duct (508) is arranged on the other side of the cooling shell (505), the air duct (508) is connected to the cooling cavity; a fan (509) is arranged at the bottom of the cooling shell (505), the fan (509) is detachably connected to the cooling shell (505), and the fan (509) is connected to the air duct (508) through a ventilation pipe.

6. The cold plate liquid cooling server according to claim 4, characterized in that: The cooling assembly further comprises a semiconductor refrigeration plate (510) and a second heat conducting plate (511), wherein the semiconductor refrigeration plate (510) and the second heat conducting plate (511) are both installed in the cooling cavity, wherein the second heat conducting plate (511) is located between the semiconductor refrigeration plate (510) and the cooling copper tube (502), and is in contact with the semiconductor refrigeration plate (510) and the cooling copper tube (502); a heat dissipation groove (507) is provided on one side of the cooling shell (505), wherein the cooling cavity is connected to the outside through the heat dissipation groove (507); an air duct (508) is provided on the other side of the cooling shell (505), wherein the air duct (508) is connected to the cooling cavity; and a fan (509) is provided at the bottom of the cooling shell (505), wherein the fan (509) is detachably connected to the cooling shell (505), and wherein the fan (509) is connected to the air duct (508) through a ventilation pipe.

7. A cold plate liquid cooling server according to claim 5 or 6, characterized in that: A ventilation rack (512) is arranged between the mounting bracket (501) and the liquid storage tank (301); a plurality of groups of air outlet pipes (513) are arranged on one side of the ventilation rack (512); a plurality of groups of air outlet holes are arranged on both sides of the air outlet pipes (513); a plurality of groups of placement grooves (315) are arranged at the bottom of the liquid storage tank (301); the air outlet pipes (513) are located in the placement grooves (315); a plurality of groups of blowing pipes (514) are arranged at the bottom of the cooling shell (505); the blowing pipes (514) are connected to the cooling cavity; and the fan (509) is located between the plurality of groups of blowing pipes (514).

8. The cold plate liquid cooling server according to claim 1, characterized in that: A plurality of connection ports are arranged on one side of the server body (21); a dust screen (25) is arranged on one side of the main frame (11); a wire groove (26) is provided on the dust screen (25) corresponding to the connection port; a connecting wire is passed through the wire groove (26) and connected to the connection port; the server body (21) is connected to an external device via the connecting wire; a sealing cover plate (27) is arranged on one side of the wire groove (26); the sealing cover plate (27) is rotatably connected to the dust screen (25); and a flap spring is arranged between the sealing cover plate (27) and the dust screen (25).

9. The cold plate liquid cooling server according to claim 8, characterized in that: A plurality of groups of stoppers (14) are arranged above the main frame (11); the stoppers (14) are connected to the main frame (11) by means of a plurality of groups of mounting screws; the cold plate is clamped between the plurality of groups of stoppers (14); both ends of the liquid storage tank (301) are provided with assembly plates (316); the main frame (11) is clamped between two groups of assembly plates (316); a plurality of groups of assembly blocks (317) are arranged on the assembly plates (316); the main frame (11) is provided with assembly grooves (15) corresponding to the assembly blocks (317); the assembly blocks (317) are clamped in the assembly grooves (15); and the liquid storage tank (301) is detachably connected to the main frame (11) by means of a plurality of groups of assembly screws.

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