An 800G QSFP-DD DR8 silicon photonic module

Abstract

The present invention relates to a silicon photonic chip, wherein the four sides thereof are, in a clockwise direction, a first side, a second side, a third side and a fourth side, two obliquely distributed input light waveguides are provided on the first side, eight obliquely distributed output light waveguides are provided on the second side, and four groups of RF pads are provided on the third side and the fourth side, respectively. An 800G QSFP‑DD DR8 silicon photonic module, wherein the silicon photonic chip is distributed on a PCB board at 45°, two light receiving ends are distributed side by side on both sides of the silicon photonic chip along the width direction of the PCB board, two light emitting ends are obliquely arranged on the PCB board and coupled with the two input light waveguides of the silicon photonic chip, and an eight-channel optical fiber array is coupled with the eight output light waveguide edges of the silicon photonic chip. The beneficial effects are as follows: the size of the silicon photonic chip can be greatly reduced, and the cost can be greatly reduced. In addition, the reduction in the size of the silicon photonic chip allows more space for layout in the width direction of the PCB board, and the layout is convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to an 800G QSFP-DD DR8 silicon optical module. Background Art

[0002] The structure of the traditional 800G QSFP-DD DR8 silicon photonic module is as follows: Figure 1 As shown, it includes: a shell and a PCB board in the shell, the PCB board has a silicon photonic chip, a DSP chip, an eight-channel optical fiber array, two light receiving ends and two light emitting ends, the two light receiving ends are arranged side by side on both sides of the silicon photonic chip along the width direction of the PCB board, the silicon photonic chip has two input light waveguides and eight output light waveguides on the side away from the gold finger end of the PCB board, the optical path of one of the two input light waveguides is divided into four paths and then coupled with four of the eight output light waveguides, the optical path of the other of the two input light waveguides is divided into four paths and then coupled with the remaining four of the eight output light waveguides, or it can be understood as a 1-to-4 solution, and the side of the silicon photonic chip close to the gold finger end of the PCB board has eight groups of RF pads, the two light emitting ends are fixed on the PCB board and coupled with the two input light waveguides, and the eight-channel optical fiber array is fixed on the PCB board and coupled with the eight output light waveguides;

[0003] The optical receiving end includes: an array PD, a TIA chip and a 45° four-channel optical fiber array, the 45° four-channel optical fiber array is fixed on the PCB board, the array PD is coupled with the 45° four-channel optical fiber array and fixed on the PCB board, the TIA chip is gold-wire bonded to the array PD, and the TIA chip is electrically connected to the PCB board;

[0004] The optical transmitting end includes: a laser chip, a collimating lens, an optical isolator and a converging lens coupled in sequence along the optical path direction, the laser chip is fixed on the PCB board via a ceramic heat sink, and the collimating lens, the optical isolator and the converging lens are respectively fixed on the PCB board;

[0005] The shell width is 18.35mm, the array PD channel spacing in the optical receiving end is 0.5mm (a relatively small spacing), and the PCB board width is only about 14.1mm. In order to ensure the coupling space of the laser chip and the eight-channel optical fiber array in the optical transmitting end, the silicon photonic chip is relatively long, which ultimately leads to tight layout space in the width direction of the PCB board. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide an 800G QSFP-DD DR8 silicon photonic module to overcome the deficiencies in the above-mentioned prior art.

[0007] The technical solution of the present invention to solve the above technical problems is as follows: a silicon photonic chip, which is rectangular in shape, and has four sides, which are the first side, the second side, the third side and the fourth side in a clockwise direction; the first side is provided with two inclined light input waveguides, the second side is provided with eight inclined light output waveguides, and the third side and the fourth side are respectively provided with four groups of RF pads.

[0008] The beneficial effects of the present invention are as follows: in the present invention, the input light waveguide and the output light waveguide are obliquely distributed on different sides of the silicon photonic chip, and four groups of RF pads are distributed on different sides of the silicon photonic chip, so that the length dimension of the silicon photonic chip can be greatly reduced, the cost is greatly reduced, and the length dimension of the silicon photonic chip is reduced. When the size of the PCB board remains unchanged, the width direction of the PCB board has more space for layout, making the layout convenient.

[0009] Based on the above technical solution, the present invention can also be improved as follows.

[0010] Furthermore, the incident light waveguide is inclined at an angle of 55° to 65° relative to the first side.

[0011] Furthermore, the incident light waveguide is inclined at an angle of 60° relative to the first side.

[0012] Furthermore, the light output waveguide is inclined at an angle of 55° to 65° relative to the second side.

[0013] Furthermore, the light output waveguide is inclined at an angle of 60° relative to the second side.

[0014] Based on the above technical scheme, the present invention also provides an 800G QSFP-DD DR8 silicon photonic module, including: a PCB board, two light emitting ends, an eight-channel optical fiber array, two light receiving ends and a silicon photonic chip. The silicon photonic chip and the DSP chip are fixed on the PCB board, and the silicon photonic chip is distributed at an angle of 42° to 48°. The light input waveguide and the light output waveguide of the silicon photonic chip are away from the gold finger end of the PCB board. The two light receiving ends are distributed side by side on both sides of the silicon photonic chip along the width direction of the PCB board and are electrically connected to the PCB board. The two light emitting ends are obliquely arranged on the PCB board and coupled with the two light input waveguides of the silicon photonic chip. The eight-channel optical fiber array is edge-coupled with the eight light output waveguides of the silicon photonic chip.

[0015] The further beneficial effects of adopting the above are:

[0016] In the present invention, since the length of the silicon photonic chip is greatly reduced, while the size of the PCB board remains unchanged, more space is available for layout in the width direction of the PCB board, making it more convenient to layout the two optical receiving ends. In addition, the silicon photonic chip is mounted on the PCB board at a 45° angle, and the RF pad is located close to the gold finger end of the PCB board, so the RF line can be fanned out very conveniently.

[0017] Furthermore, the optical receiving end includes: an array PD, a TIA chip and a 45° four-channel optical fiber array, the 45° four-channel optical fiber array is fixed on the PCB board, the array PD is coupled with the 45° four-channel optical fiber array and fixed on the PCB board, the TIA chip is gold-wire bonded to the array PD, and the TIA chip is electrically connected to the PCB board.

[0018] Furthermore, the optical fibers of the eight-channel optical fiber array and the optical fibers of the two light receiving ends are connected to the ferrule.

[0019] Furthermore, the light emitting end includes: a laser chip, a collimating lens, an optical isolator and a converging lens coupled in sequence along the optical path direction, the laser chip is fixed on the PCB board via a ceramic heat sink, and the collimating lens, the optical isolator and the converging lens are respectively fixed on the PCB board.

[0020] Furthermore, the silicon photonic chips are distributed at an angle of 45°. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a top view of an 800G QSFP-DD DR8 silicon photonic module in the prior art;

[0022] Figure 2 This is a structural diagram of the silicon photonic chip in the present invention;

[0023] Figure 3 This is a top view of the 800G QSFP-DD DR8 silicon photonic module of the present invention;

[0024] Figure 4 for Figure 3 A partial enlarged view of .

[0025] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0026] 1. Silicon photonic chip, 110, first side, 120, second side, 130, third side, 140, fourth side, 150, input optical waveguide, 160, output optical waveguide, 170, RF pad, 2. PCB board, 3. Optical transmitting end, 310, laser chip, 320, collimating lens, 330, optical isolator, 340, converging lens, 350, ceramic heat sink, 4. Eight-channel optical fiber array, 5. Optical receiving end, 510, array PD, 520, TIA chip, 530, 45° four-channel optical fiber array, 6. DSP chip, 7. ferrule. DETAILED DESCRIPTION

[0027] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0028] Example 1

[0029] like Figure 2 As shown, a silicon photonic chip is rectangular, and has four sides, which are, in a clockwise direction, a first side 110, a second side 120, a third side 130, and a fourth side 140. Two tilted light input waveguides 150 are provided on the first side 110, eight tilted light output waveguides 160 are provided on the second side 120, four groups of RF pads 170 are provided on the third side 130, and four groups of RF pads 170 are provided on the fourth side 140;

[0030] The optical path of one of the two input light waveguides 150 is evenly divided into four paths and then coupled with four of the eight output light waveguides 160 ; the optical path of the other of the two input light waveguides 150 is evenly divided into four paths and then coupled with the remaining four of the eight output light waveguides 160 ;

[0031] In the present invention, the input light waveguide 150 and the output light waveguide 160 are obliquely distributed on different sides of the silicon photonic chip 1, and four groups of RF pads 170 are distributed on different sides of the silicon photonic chip 1, so that the length of the silicon photonic chip 1 can be greatly reduced and the cost is greatly reduced. In addition, when the size of the PCB board 2 remains unchanged, the width direction of the PCB board 2 has more space for layout, making the layout convenient.

[0032] Example 2

[0033] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0034] The light input waveguide 150 is inclined at an angle of 55° to 65° relative to the first side 110 , and in this embodiment, the inclined angle is preferably 60°. The light output waveguide 160 is inclined at an angle of 55° to 65° relative to the second side 120 , and in this embodiment, the inclined angle is preferably 60°.

[0035] Example 3

[0036] like Figure 2 , Figure 3As shown, an 800G QSFP-DD DR8 silicon photonic module includes: a PCB board 2, two optical transmitting ends 3, an eight-channel optical fiber array 4, two optical receiving ends 5, and the silicon photonic chip 1 as described in embodiment 1 or 2, The silicon photonic chip 1 and the DSP chip 6 are fixed on the PCB board 2. The silicon photonic chip 1 is mounted on the PCB board 2 at an angle of 42° to 48°. The input light waveguide 150 of the silicon photonic chip 1 is away from the gold finger end of the PCB board 2, and the output light waveguide 160 of the silicon photonic chip 1 is also away from the gold finger end of the PCB board 2. The input light waveguide 150 and the output light waveguide 160 are both tilted, so that the two light emitting ends 3 and an eight-channel optical fiber array 4 are still in a position away from the gold finger end of the PCB board 2, then the RF pad 170 is in a position close to the gold finger end of the PCB board 2, the two light receiving ends 5 are distributed side by side on both sides of the silicon photonic chip 1 along the width direction of the PCB board 2, and the two light receiving ends 5 are electrically connected to the PCB board 2 respectively, the two light receiving ends 5 and the silicon photonic chip 1 are distributed side by side in the width direction of the PCB board 2, and the two light emitting ends 3 are tilted on the PCB board 2 and coupled with the two input light waveguides 150 of the silicon photonic chip 1, and the eight-channel optical fiber array 4 is coupled with the eight output light waveguides 160 of the silicon photonic chip 1, the emission light emitted by one of the two optical emission ends 3 is coupled into one of the two input light waveguides 150, and the emission light will be evenly divided into four paths after being coupled into the input light waveguide 150, and coupled into four of the eight output light waveguides 160, the emission light emitted by the other of the two optical emission ends 3 is coupled into the other input light waveguide 150 of the two input light waveguides 150, and the emission light will be evenly divided into four paths after being coupled into the input light waveguide 150, and coupled into the remaining four output light waveguides 160 of the eight output light waveguides 160, and the output lights of the eight output light waveguides 160 are respectively coupled into the eight optical fibers in the eight-channel optical fiber array 4.

[0037] In the present invention, since the length of the silicon photonic chip 1 is greatly reduced, while the size of the PCB board 2 remains unchanged, more space is provided for layout in the width direction of the PCB board 2, making it more convenient to layout the two optical receiving ends 5. In addition, the silicon photonic chip 1 is mounted on the PCB board 2 at an angle of 42° to 48°, and the RF pad 170 is located close to the gold finger end of the PCB board 2, so the RF line can be fanned out very conveniently.

[0038] Example 4

[0039] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of embodiment 3, and the details are as follows:

[0040] The optical receiving end 5 includes: an array PD510, a TIA chip 520 and a 45° four-channel optical fiber array 530. The 45° four-channel optical fiber array 530 is fixed on the PCB board 2. The array PD510 is coupled with the 45° four-channel optical fiber array 530 and fixed on the PCB board 2. The TIA chip 520 is gold-wire bonded with the array PD510. The TIA chip 520 is electrically connected to the PCB board 2. For received light, it is coupled into the array PD510 via the 45° four-channel optical fiber array 530. The array PD510 converts the optical signal into an electrical signal, which is then transmitted to the TIA chip 520.

[0041] In addition, the optical fibers of the eight-channel optical fiber array 4 and the optical fibers of the two optical receiving ends 5 are all connected to the ferrule 7. Since the two optical receiving ends 5 have a total of eight optical fibers and the eight-channel optical fiber array 4 also has eight optical fibers, the ferrule 7 only needs to have sixteen channels to meet the usage requirements.

[0042] Example 5

[0043] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of Embodiment 3 or 4, and the details are as follows:

[0044] The optical transmitting end 3 includes: a laser chip 310, a collimating lens 320, an optical isolator 330 and a converging lens 340 coupled in sequence along the optical path direction, wherein the laser chip 310 is fixed on the PCB board 2 via a ceramic heat sink 350, and the collimating lens 320, the optical isolator 330 and the converging lens 340 are respectively fixed on the PCB board 2. The emission light emitted by the laser chip 310 is coupled into an input optical waveguide 150 after passing through the collimating lens 320, the optical isolator 330 and the converging lens 340 in sequence, and the emission light is evenly divided into four paths after being coupled into the input optical waveguide 150, and is coupled into four output optical waveguides 160.

[0045] Example 6

[0046] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of Embodiment 3, 4 or 5, and the details are as follows:

[0047] The silicon photonic chips 1 are preferably distributed on the PCB board 2 at an angle of 45°.

[0048] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An 800G QSFP-DD DR8 silicon photonic module, characterized in that: include: A PCB board (2), two light emitting ends (3), an eight-channel optical fiber array (4), two light receiving ends (5) and a silicon photonic chip (1); the silicon photonic chip (1) is rectangular in shape and has four side edges, which are, in a clockwise direction, a first side edge (110), a second side edge (120), a third side edge (130) and a fourth side edge (140); the first side edge (110) is provided with two tilted light input waveguides (150); the tilt angle of the light input waveguides (150) relative to the first side edge (110) is 55° to 65°; the second side edge (120) is provided with eight tilted light output waveguides (160); the tilt angle of the light output waveguides (160) relative to the second side edge (120) is 55° to 65°; and the third side edge (130) and the fourth side edge (140) are respectively provided with four groups of RF pads (170); The PCB board (2) is fixed with a silicon photonic chip (1) and a DSP chip (6); the silicon photonic chip (1) is distributed at an angle of 42° to 48°; the light input waveguide (150) and the light output waveguide (160) of the silicon photonic chip (1) are away from the gold finger end of the PCB board (2); the two light receiving ends (5) are arranged side by side on both sides of the silicon photonic chip (1) along the width direction of the PCB board (2) and are electrically connected to the PCB board (2); the two light emitting ends (3) are arranged on the PCB board (2) at an angle relative to the first side edge (110) and are coupled to the two light input waveguides (150) of the silicon photonic chip (1); and the eight-channel optical fiber array (4) is arranged at an angle relative to the second side edge (120) and is coupled to the eight light output waveguides (160) of the silicon photonic chip (1).

2. The 800G QSFP-DD DR8 silicon photonic module according to claim 1, characterized in that: The light input waveguide (150) is inclined at an angle of 60° relative to the first side edge (110).

3. The 800G QSFP-DD DR8 silicon photonic module according to claim 1, characterized in that: The light output waveguide (160) is inclined at an angle of 60° relative to the second side edge (120).

4. The 800G QSFP-DD DR8 silicon photonic module according to claim 1, characterized in that: The optical receiving end (5) comprises: an array PD (510), a TIA chip (520) and a 45° four-channel optical fiber array (530); the 45° four-channel optical fiber array (530) is fixed on a PCB board (2); the array PD (510) is coupled to the 45° four-channel optical fiber array (530) and fixed on the PCB board (2); the TIA chip (520) is gold-wire bonded to the array PD (510); and the TIA chip (520) is electrically connected to the PCB board (2).

5. An 800G QSFP-DD DR8 silicon photonic module according to claim 1 or 4, characterized in that: The optical fibers of the eight-channel optical fiber array (4) and the optical fibers of the two light receiving ends (5) are connected to the ferrule (7).

6. The 800G QSFP-DD DR8 silicon photonic module according to claim 1, characterized in that: The light emitting end (3) comprises: a laser chip (310), a collimating lens (320), an optical isolator (330) and a converging lens (340) which are sequentially coupled along the light path direction; the laser chip (310) is fixed on a PCB board (2) via a ceramic heat sink (350); and the collimating lens (320), the optical isolator (330) and the converging lens (340) are respectively fixed on the PCB board (2).

7. The 800G QSFP-DD DR8 silicon photonic module according to claim 1, characterized in that: The silicon photonic chips (1) are distributed at an angle of 45°.

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