Semiconductor wafer grinding equipment

Abstract

The present invention provides a semiconductor wafer grinding device, which belongs to the field of wafer grinding technology, including a processing table, a water retaining assembly and a supporting assembly are arranged above the processing table, a lifting assembly is fixedly connected to the processing table, the lifting assembly is connected to a water tank, the water retaining assembly includes a water retaining cover, the supporting assembly includes a supporting tray, a wafer is arranged inside the supporting tray, a cylinder and an electric turntable are arranged below the supporting tray, a motor 2 and a rotating shaft are arranged above the processing table, and also include: an impact assembly, which ensures the cooling effect of the wafer during grinding by pressurizing the liquid; a grinding assembly, which improves the grinding quality of the wafer by the rotation of the motor 2. The invention has the beneficial effects of: improving the quality and performance of the wafer by reducing the mechanical stress inside the wafer through vibration, and at the same time, the grinding disc improves the cleaning effect through the dual effects of centrifugal force and water flow impact force, and ensures uniform cooling, avoids heat accumulation, and reduces damage to the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer grinding, and in particular to a semiconductor wafer grinding device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Wafer is the carrier used to produce integrated circuits. Generally speaking, wafer refers to single-crystal silicon wafers. The larger the wafer, the more ICs can be produced on the same wafer, which can reduce costs; but it has higher requirements for material technology and production technology, such as uniformity and other issues. In wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, photolithography technology has higher and higher requirements for the flatness of the wafer surface.

[0003] In the semiconductor manufacturing process, the wafer grinding process is a very critical link. The wafer needs to be cut into thin slices with the required thickness and flatness, which requires grinding by a grinder. Although the current wafer grinder can use a high-speed rotating grinding wheel to grind the wafer surface to achieve the required flatness and surface finish, the wafer is susceptible to damage caused by mechanical pressure during grinding, and the mechanical stress and thermal stress generated by the grinding wheel will produce residual stress inside the wafer, which may cause the wafer to deform or crack in subsequent processes, thereby reducing the quality and performance of the wafer. In addition, during the grinding process, a water pipe is usually used to spray polishing liquid or coolant, which is cooled by fixed-point spraying of the water pipe and then combined with the rotation of the wafer. However, this method cannot evenly cool the wafer surface, has a low degree of thermal stress elimination, and may also cause residual grinding debris, and the cleaning degree is not ideal. How to invent a semiconductor wafer grinding device to solve these problems has become an urgent problem for technicians in this field. Summary of the invention

[0004] In order to make up for the above shortcomings, the present invention provides a semiconductor wafer grinding equipment, which aims to solve the problems that residual stress may cause deformation or cracks of the wafer in subsequent processes, thereby reducing the quality of the wafer, and the cooling effect is not uniform, the degree of thermal stress elimination is low, and the degree of debris cleaning is not ideal.

[0005] The present invention is achieved in that:

[0006] The present invention provides a semiconductor wafer grinding device, comprising a processing table, a water retaining assembly and a supporting assembly are arranged above the processing table, the processing table is fixedly connected with a lifting assembly, the lifting assembly is connected with a water tank, the water retaining assembly comprises a water retaining cover, the supporting assembly comprises a supporting tray, a wafer is arranged inside the supporting tray, a cylinder and an electric turntable are arranged below the supporting tray, a motor 2 and a rotating shaft are arranged above the processing table, and further comprises:

[0007] An impact assembly, the impact assembly is located above the processing table, and the impact assembly ensures a cooling effect on the wafer during grinding by pressurizing the liquid;

[0008] A grinding assembly is located above the processing table, and the grinding assembly utilizes the rotation of motor 2 to improve the grinding quality of the wafer.

[0009] Preferably, a drainage groove is provided on the upper side wall of the processing table, and the upper end of the processing table is fixedly connected to the water retaining cover, the cylinder and the electric turntable. The cylinder is sleeved on the outside of the electric turntable, and the water retaining cover is located on the outside of the cylinder. One end of the drainage groove is located between the water retaining cover and the cylinder. A vibration rod is slidably connected to the upper side wall of the water retaining cover, and the vibration rod is arranged in a "T" shape. A telescopic spring is sleeved on the outer wall of the vibration rod, and both ends of the telescopic spring are respectively fixedly connected to the side walls of the vibration rod and the side walls of the water retaining cover. The end of the vibration rod located on the inner side of the water retaining cover is hemispherical.

[0010] Preferably, the lower end of the support tray is fixedly connected to the electric turntable, a plurality of protrusions in a circular array are fixedly connected to the upper side wall of the support tray, a chamfer is provided at a corner of one end of the protrusion, a plurality of water flow holes distributed in a circular array are provided on the side wall of the support tray, and the support tray is located on the inner side of the water shield.

[0011] Preferably, the lifting assembly includes a side panel, two of which are symmetrically distributed about the central axis of the processing table, one end of the side panel is fixedly connected to the processing table by bolts, the other end of the side panel is fixedly connected to a motor, a threaded rod is provided on one side of the side panel, one end of the threaded rod is rotatably connected to the lower end of the side panel, and the other end of the threaded rod vertically penetrates the upper side wall of the side panel and is fixedly connected to a motor.

[0012] Preferably, the side plate is slidably connected to a support plate, the support plate is threadedly connected to the threaded rod, the upper end of the support plate is fixedly connected to the water tank, the lower side wall of the support plate is fixedly connected to a one-way water pipe, and one end of the one-way water pipe is fixedly connected to the water tank.

[0013] Preferably, the impact assembly includes a fixed disk, an outer wall of the fixed disk is fixedly connected to one end of the support plate, a water storage chamber is opened inside the fixed disk, extension frames are symmetrically fixedly connected to the outer walls of the fixed disk on both sides, a reset spring and a magnetic magnet are arranged inside the extension frame, the magnetic magnet is arranged in a "T" shape, the two ends of the reset spring are respectively fixedly connected to the inner wall of the extension frame and the side wall of the magnetic magnet, the magnetic magnet is respectively slidably connected to the fixed disk and the extension frame, and a chamfer is opened at one end of the magnetic magnet located inside the water storage chamber.

[0014] Preferably, the impact assembly also includes a pull rod, an impact spring and a pressure plate, the pull rod is arranged in a "T" shape, the pressure plate is slidably connected to the inner wall of the water storage chamber, the impact spring is located inside the water storage chamber, and the two ends of the impact spring are respectively fixedly connected to the upper inner wall of the water storage chamber and the side wall of the pressure plate.

[0015] Preferably, the impact assembly also includes a buoyancy plate, which slides in a limited position with the inner wall of the water storage chamber, the lower side wall of the buoyancy plate is fixedly connected to a support rod, and both ends of the buoyancy plate are fixedly connected to magnetic blocks, and the width between the two magnetic blocks is smaller than the distance between the two magnetic magnets.

[0016] Preferably, the grinding assembly includes a grinding disk, a cavity is provided inside the grinding disk, a plurality of chip grooves distributed in a circular array are provided on the lower side wall of the grinding disk, the chip grooves are arc-shaped, and a drainage hole is provided between the cavity and the chip grooves. The side wall of the grinding disk is fixedly connected to one end of the rotating shaft, the upper end of the rotating shaft vertically penetrates the side wall of the fixed disk and is fixedly connected to motor 2, and motor 2 is fixedly connected to the upper end of the fixed disk.

[0017] Preferably, a limiting slide groove is provided on the upper side wall of the grinding disc, and the limiting slide groove is slidably connected to a rotating ring, and the rotating ring is fixedly connected to the end of the one-way water pipe away from the water tank, and a plurality of connecting pipes are fixedly connected on both sides of the rotating ring symmetrically, and the upper ends of the connecting pipes are fixedly connected to the fixed disc.

[0018] The beneficial effects of the present invention are:

[0019] During the grinding process, vibration is used to reduce the mechanical stress generated by the grinding disc on the wafer during processing, thereby reducing the probability of deformation or cracking of the wafer in subsequent processes and improving the quality and performance of the wafer. At the same time, the grinding disc can better discharge the debris generated by grinding from the chip groove under the dual effects of the centrifugal force generated by the rotation and the impact force of the water flow, thereby ensuring the cleaning effect. Not only that, the polishing liquid flowing inside the cavity can cool the grinding disc to avoid heat accumulation, thereby reducing the damage to the wafer caused by thermal stress. In addition, the arc-shaped chip groove can increase the speed of waste liquid discharge, thereby increasing the flow rate of the polishing liquid, thereby improving the cleaning effect; and when the drainage holes are blocked more, the pressure plate can increase the water pressure inside the water storage cavity and the cavity, and the debris blocked inside the drainage hole can be cleaned up by pressure to ensure the normal flow of the polishing liquid, thereby ensuring the uniformity of cooling the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the overall front side structure of a semiconductor wafer grinding device provided by an embodiment of the present invention;

[0022] Figure 2 It is a schematic diagram of the overall rear side structure of a semiconductor wafer grinding device provided by an embodiment of the present invention;

[0023] Figure 3 It is a schematic diagram of the separation structure of a water retaining component and a supporting component of a semiconductor wafer grinding equipment provided by an embodiment of the present invention;

[0024] Figure 4 It is a schematic structural diagram of a semiconductor wafer grinding equipment supporting assembly provided by an embodiment of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of a lifting assembly of a semiconductor wafer grinding equipment provided by an embodiment of the present invention;

[0026] Figure 6 It is a schematic structural diagram of a grinding component and an impact component of a semiconductor wafer grinding device provided by an embodiment of the present invention;

[0027] Figure 7 It is a schematic diagram of the bottom structure of a grinding wheel of a semiconductor wafer grinding device provided by an embodiment of the present invention;

[0028] Figure 8 It is a schematic diagram of the front half-section structure of a grinding disc and a reflux box of a semiconductor wafer grinding equipment provided by an embodiment of the present invention;

[0029] Fig. 9 It is a schematic diagram of the right half-section structure of a grinding disc and a reflux box of a semiconductor wafer grinding equipment provided by an embodiment of the present invention;

[0030] Fig.10 It is a top cross-sectional view of a reflow box of a semiconductor wafer grinding equipment provided by an embodiment of the present invention.

[0031] In the figure: 1, processing table; 101, drainage trough; 2, water retaining assembly; 21, water retaining cover; 22, vibration rod; 23, telescopic spring; 3, lifting assembly; 31, threaded rod; 32, side plate; 33, motor 1; 34, support plate; 4, water tank; 41, one-way water pipe; 5, motor 2; 6, impact assembly; 61, fixed plate; 62, connecting pipe; 63, pull rod; 64, extension frame; 641, reset spring; 642, magnetic Magnet; 65, water storage chamber; 66, magnetic block; 67, impact spring; 68, pressure plate; 69, buoyancy plate; 610, support rod; 7, grinding assembly; 71, grinding disc; 72, chip groove; 73, rotating ring; 74, drainage hole; 75, cavity; 76, limiting slide groove; 8, supporting assembly; 81, supporting tray; 82, bump; 83, water flow hole; 9, wafer; 10, cylinder; 11, electric turntable; 12, rotating shaft. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Embodiment 1, refer to Figure 1-Figure 10 A semiconductor wafer grinding device comprises a processing table 1, a water retaining assembly 2 and a supporting assembly 8 are arranged above the processing table 1, a lifting assembly 3 is fixedly connected to the processing table 1, the lifting assembly 3 is connected to a water tank 4, the water retaining assembly 2 comprises a water retaining cover 21, the supporting assembly 8 comprises a supporting tray 81, a wafer 9 is arranged inside the supporting tray 81, a cylinder 10 and an electric turntable 11 are arranged below the supporting tray 81, a motor 2 5 and a rotating shaft 12 are arranged above the processing table 1, and further comprises:

[0034] An impact assembly 6, the impact assembly 6 is located above the processing table 1, and the impact assembly 6 ensures a cooling effect on the wafer 9 during grinding by pressurizing the liquid;

[0035] The grinding assembly 7 is located above the processing table 1 , and the grinding assembly 7 utilizes the rotation of the motor 2 5 to improve the grinding quality of the wafer 9 .

[0036] Furthermore, a drainage groove 101 is provided on the upper side wall of the processing table 1, and the upper end of the processing table 1 is fixedly connected to the water shield 21, the cylinder 10 and the electric turntable 11. The cylinder 10 is sleeved on the outer side of the electric turntable 11, and the water shield 21 is located on the outer side of the cylinder 10. One end of the drainage groove 101 is located between the water shield 21 and the cylinder 10. The upper side wall of the water shield 21 is slidably connected to a vibration rod 22, and the vibration rod 22 is arranged in a "T" shape. The outer wall of the vibration rod 22 is sleeved with a telescopic spring 23, and the telescopic spring 23 is provided on the outer wall of the vibration rod 22. The two ends of the spring 23 are respectively fixedly connected to the side walls of the vibration rod 22 and the side walls of the water shield 21. The end of the vibration rod 22 located on the inner side of the water shield 21 is hemispherical. The lower end of the supporting tray 81 is fixedly connected to the electric turntable 11. The upper side wall of the supporting tray 81 is fixedly connected with a plurality of protrusions 82 in a circular array. A chamfer is provided at a corner of one end of the protrusion 82. The side wall of the supporting tray 81 is provided with a plurality of water flow holes 83 distributed in a circular array. The supporting tray 81 is located on the inner side of the water shield 21.

[0037] Stable support of the processing table 1: The processing table 1 is the main operating platform for grinding the wafer 9. The four corners of the processing table 1 are firmly connected to the legs to ensure the stability of the entire device. When grinding the wafer 9, the wafer 9 is first placed on the support tray 81 for fixing. The support tray 81 is a prior art and can well position the wafer 9 to avoid the wafer 9 from shifting during the grinding process. In addition, the inner diameter of the support tray 81 is larger than the outer diameter of the grinding disc 71, so the grinding disc 71 can be easily moved in and out.

[0038] The electric turntable 11 is the power source for driving the bearing tray 81 to rotate, so as to realize the counterclockwise rotation of the wafer 9, so as to better cooperate with the clockwise rotation of the grinding disc 71 to ensure the grinding effect of the wafer 9, and the cylinder 10 protects the electric turntable 11 to prevent the waste liquid from damaging the components of the electric turntable 11.

[0039] Protection of the water shield 21: During the rotation of the tray 81, since the height of the upper end of the tray 81 is higher than the height of the wafer 9 placement position, the waste liquid splashed during the grinding process is blocked and discharged into the water shield 21 through the water hole 83. The centrifugal force generated by the rotation of the tray 81 will accelerate the discharge of the waste liquid, preventing the waste liquid from accumulating inside the tray 81 and interfering with the grinding. At this time, the waste liquid thrown out is blocked by the water shield 21 to prevent it from splashing everywhere. At the same time, the water shield 21 can also collect the waste liquid so that it can be quickly discharged from the drainage trough 101 and used for subsequent processing.

[0040] Interaction between the protrusion 82 and the vibration rod 22: when the support tray 81 rotates, the protrusion 82 will be driven to rotate synchronously. When the chamfered side of the protrusion 82 contacts the spherical surface at the lower end of the vibration rod 22, the two can slide against each other, so that the vibration rod 22 can be squeezed quickly and smoothly, and the telescopic spring 23 is stretched during the upward movement of the vibration rod 22, so that the telescopic spring 23 generates elastic potential energy. When the protrusion 82 is separated from the vibration rod 22, the vibration rod 22 loses the squeezing effect below. In an instant, the telescopic spring 23 begins to recover and drives the vibration rod 22 downward to impact the support tray 81 through the elastic potential energy, so that the support tray 81 vibrates and transmits the vibration effect to the wafer 9, thereby reducing the mechanical stress of the grinding disc 71 on the wafer 9 during processing, thereby reducing the probability of deformation or cracking of the wafer in subsequent processes, and improving the surface quality and overall performance of the wafer.

[0041] Reference Figure 5 and Figure 6 , further; the lifting assembly 3 includes a side panel 32, two side panels 32 are provided, and the two side panels 32 are symmetrically distributed about the central axis of the processing table 1, one end of the side panel 32 is fixedly connected to the processing table 1 by bolts, and the other end of the side panel 32 is fixedly connected to a motor 33, and a threaded rod 31 is provided on one side of the side panel 32, one end of the threaded rod 31 is rotatably connected to the lower end of the side panel 32, and the other end of the threaded rod 31 vertically penetrates the upper side wall of the side panel 32 and is fixedly connected to the motor 33.

[0042] Adjustment of the height of the grinding disc 71: By starting the motor 33, the threaded rod 31 can be driven to rotate, and then the position height of the grinding disc 71 can be accurately adjusted through the threaded connection between the threaded rod 31 and the support plate 34, and due to the limited sliding between the support plate 34 and the side plate 32, the stability of the grinding disc 71 can be maintained during the movement, thereby avoiding the shaking of the grinding disc 71 during operation and improving stability.

[0043] The side plate 32 is slidably connected to a support plate 34, the support plate 34 is threadedly connected to the threaded rod 31, the upper end of the support plate 34 is fixedly connected to the water tank 4, the lower side wall of the support plate 34 is fixedly connected to a one-way water flow pipe 41, and one end of the one-way water flow pipe 41 is fixedly connected to the water tank 4.

[0044] Input of polishing liquid: The water tank 4 is connected to an external water pump, and the input amount of the water pump is fixed, so the flow of water in each drainage hole 74 is also stably output, and the purpose of setting a one-way water pipe 41 is to prevent the drainage hole 74 from causing the polishing liquid to flow back due to stamping when it is blocked.

[0045] Reference Figure 6-Figure 9, further; the grinding assembly 7 includes a grinding disc 71, a cavity 75 is opened inside the grinding disc 71, a plurality of chip grooves 72 distributed in a circumferential array are opened on the lower side wall of the grinding disc 71, the chip groove 72 is arc-shaped, and a drainage hole 74 is opened between the cavity 75 and the chip groove 72, the side wall of the grinding disc 71 is fixedly connected to one end of the rotating shaft 12, the upper end of the rotating shaft 12 vertically penetrates the side wall of the fixed disc 61 and is fixedly connected to the motor 2 5, and the motor 2 5 is fixedly connected to the upper end of the fixed disc 61.

[0046] Chip removal and cooling: When the grinding disc 71 processes the wafer 9, the motor 25 controls the rotation of the shaft 12, thereby driving the grinding disc 71 to rotate clockwise, so that most of the chips generated by grinding pass through the chip groove 72, and only a very small part remains on the surface of the grinding disc 71, but it does not affect normal grinding. While the grinding disc 71 is processing, the polishing liquid will flow from the water tank 4 into the cavity 75 through the one-way water pipe 41, and then evenly flow into the chip groove 72 through the drainage hole 74. At this time, the chips generated by grinding can be better discharged under the dual effects of the centrifugal force generated by the rotation and the impact of the water flow. Not only that, the polishing liquid flowing in the cavity 75 can cool the grinding disc 71 to avoid heat accumulation, thereby greatly reducing the damage to the wafer caused by thermal stress. At the same time, the surface of the wafer 9 can be evenly rinsed in conjunction with the rotation to ensure the cleaning effect. In addition, the arc-shaped chip groove 72 can increase the speed of waste liquid discharge, thereby increasing the flow rate of the polishing liquid, thereby improving the cleaning effect.

[0047] Furthermore, a limiting slide groove 76 is provided on the upper side wall of the grinding disc 71, and the limiting slide groove 76 is slidably connected to a rotating ring 73, the rotating ring 73 is fixedly connected to one end of the one-way water pipe 41 away from the water tank 4, and a plurality of connecting pipes 62 are fixedly connected on both sides of the rotating ring 73 symmetrically, and the upper end of the connecting pipe 62 is fixedly connected to the fixed disc 61.

[0048] Normal operation of the grinding disc 71: The normal rotation of the grinding disc 71 during operation can be ensured by the limiting sliding between the limiting slide groove 76 and the rotating ring 73. At the same time, the limiting slide groove 76 and the rotating ring 73 are sealed with each other, which can prevent water from leaking out of the cavity 75, thereby effectively ensuring the impact force of the polishing liquid when it is discharged from the drainage hole 74, improving the effect of cleaning debris, and at the same time ensuring that after the drainage hole 74 is blocked, the water will overflow into the water storage chamber 65 along the connecting pipe 62.

[0049] Example 2, refer to Figure 8-Figure 10, further; the impact component 6 includes a fixed plate 61, the outer wall of the fixed plate 61 is fixedly connected to one end of the support plate 34, a water storage chamber 65 is opened inside the fixed plate 61, and the outer wall of the fixed plate 61 is symmetrically fixedly connected to the extension frame 64 on both sides, and the extension frame 64 is provided with a reset spring 641 and a magnetic iron 642, and the magnetic iron 642 is arranged in a "T" shape. The two ends of the reset spring 641 are respectively fixedly connected to the inner wall of the extension frame 64 and the side wall of the magnetic iron 642, and the magnetic iron 642 is respectively slidably connected to the fixed plate 61 and the extension frame 64, and a chamfer is opened at one end of the magnetic iron 642 located inside the water storage chamber 65; the impact component 6 also includes a buoyancy plate 69, the buoyancy plate 69 and the inner wall of the water storage chamber 65 are limitedly slidable, the lower side wall of the buoyancy plate 69 is fixedly connected to the support rod 610, and the two ends of the buoyancy plate 69 are fixedly connected to the magnetic suction block 66, and the width between the two magnetic suction blocks 66 is less than the distance between the two magnetic suction blocks 642.

[0050] Unblocking of the impact assembly 6: When the drain hole 74 is blocked more, the continuous input of the polishing liquid through the one-way water pipe 41 will cause part of the liquid to flow into the water storage chamber 65 through the connecting pipe 62 due to the pressure. When the liquid inside the water storage chamber 65 is higher than the support rod 610, it will drive the buoyancy plate 69 to gradually move upward, and the support rod 610 and the buoyancy plate 69 are both made of plastic products with a density less than that of the polishing liquid, which can effectively ensure the size of the buoyancy, and through the limited sliding between the buoyancy plate 69 and the water storage chamber 65, the magnetic block 66 is driven to rise vertically inside the water storage chamber 65 to avoid rotation during the floating process, so as to ensure the subsequent alignment effect with the magnetic iron 642. In the process of the gradual rise of the buoyancy plate 69, the magnetic block 66 gradually approaches the magnetic iron 642, and because the end of the magnetic block 66 away from the buoyancy plate 69 is aligned with the magnetic iron 64 2 The end away from the return spring 641 has the same polarity, so when the buoyancy plate 69 rises one end distance, due to the mutual repulsion of magnetism, the magnetic iron 642 gradually shrinks into the extension frame 64 and compresses the return spring 641. When the magnetic block 66 is flush with the magnetic iron 642, the interaction force reaches the maximum value. At this time, the magnetic iron 642 is completely shrunk into the extension frame 64 and no longer limits the pressure plate 68. In the initial state, the multiple impact springs 67 are in a compressed state. Therefore, at this moment, the pressure plate 68 will generate a momentary pressure on the liquid due to the release of the elastic potential energy of the impact spring 67, thereby increasing the water pressure inside the water storage chamber 65 and the cavity 75. The debris blocked in the drainage hole 74 is cleaned by the pressure to ensure the normal flow of the polishing liquid, thereby ensuring the uniformity of cooling the wafer 9.

[0051] Furthermore, the impact assembly 6 also includes a pull rod 63, an impact spring 67 and a pressure plate 68. The pull rod 63 is arranged in a "T" shape, the pressure plate 68 is slidingly connected to the inner wall of the water storage chamber 65, and the impact spring 67 is located inside the water storage chamber 65. The two ends of the impact spring 67 are respectively fixedly connected to the upper inner wall of the water storage chamber 65 and the side wall of the pressure plate 68.

[0052] Resetting of the pressure plate 68: After the pressure plate 68 moves down to below the magnetic iron 642, during this process, the buoyancy plate 69 and the magnetic block 66 will move down synchronously, and the magnetic iron 642 will also lose the repulsive force, thereby driving the magnetic iron 642 back to its original position through the elastic reset of the reset spring 641. Before the next impact, it is necessary to manually stretch the pull rod 63 and drive the pressure plate 68 to move up, so that the impact spring 67 is compressed again. In this process, the magnetic iron 642 is contracted by the opening of the chamfer of the magnetic iron 642 and the sliding between the side walls of the pressure plate 68. When the pressure plate 68 moves to above the magnetic iron 642, the magnetic iron 642 is reset, thereby limiting the pressure plate 68 and completing the energy storage process.

[0053] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer grinding device, comprising a processing table (1), a water retaining assembly (2) and a supporting assembly (8) are arranged above the processing table (1), the processing table (1) is fixedly connected to a lifting assembly (3), the lifting assembly (3) is connected to a water tank (4), the water retaining assembly (2) comprises a water retaining cover (21), the supporting assembly (8) comprises a supporting tray (81), a wafer (9) is arranged inside the supporting tray (81), a cylinder (10) and an electric turntable (11) are arranged below the supporting tray (81), a motor 2 (5) and a rotating shaft (12) are arranged above the processing table (1), characterized in that: Also includes: An impact assembly (6), the impact assembly (6) being located above the processing table (1), and the impact assembly (6) ensuring a cooling effect on the wafer (9) during grinding by pressurizing the liquid; A grinding assembly (7), the grinding assembly (7) being located above the processing table (1), and the grinding assembly (7) utilizing the rotation of the second motor (5) to improve the grinding quality of the wafer (9); The lifting assembly (3) comprises a side plate (32), wherein two side plates (32) are provided, and the two side plates (32) are symmetrically distributed about the central axis of the processing table (1); one end of the side plate (32) is fixedly connected to the processing table (1) by means of bolts, and the other end of the side plate (32) is fixedly connected to a motor 1 (33); a threaded rod (31) is provided on one side of the side plate (32), and one end of the threaded rod (31) is rotatably connected to the lower end of the side plate (32), and the other end of the threaded rod (31) vertically penetrates the upper side wall of the side plate (32) and is fixedly connected to the motor 1 (33); The side plate (32) is slidably connected to a support plate (34), the support plate (34) is threadedly connected to the threaded rod (31), the upper end of the support plate (34) is fixedly connected to the water tank (4), the lower side wall of the support plate (34) is fixedly connected to a one-way water flow pipe (41), and one end of the one-way water flow pipe (41) is fixedly connected to the water tank (4); The impact assembly (6) comprises a fixed disk (61), the outer wall of the fixed disk (61) is fixedly connected to one end of the support plate (34), a water storage chamber (65) is provided inside the fixed disk (61), extension frames (64) are fixedly connected to the outer wall of the fixed disk (61) on both sides symmetrically, a return spring (641) and a magnetic magnet (642) are provided inside the extension frame (64), the magnetic magnet (642) is arranged in a "T" shape, the two ends of the return spring (641) are respectively fixedly connected to the inner wall of the extension frame (64) and the side wall of the magnetic magnet (642), the magnetic magnet (642) is respectively slidably connected to the fixed disk (61) and the extension frame (64), and one end of the magnetic magnet (642) located inside the water storage chamber (65) is provided with a chamfer; The impact assembly (6) further comprises a pull rod (63), an impact spring (67) and a pressure plate (68); the pull rod (63) is arranged in a "T" shape; the pressure plate (68) is slidably connected to the inner wall of the water storage chamber (65); the impact spring (67) is located inside the water storage chamber (65); and the two ends of the impact spring (67) are respectively fixedly connected to the upper inner wall of the water storage chamber (65) and the side wall of the pressure plate (68); The impact assembly (6) further comprises a buoyancy plate (69), the buoyancy plate (69) slidingly limitedly sliding with the inner wall of the water storage chamber (65), the lower side wall of the buoyancy plate (69) being fixedly connected to a support rod (610), and both ends of the buoyancy plate (69) being fixedly connected to magnetic blocks (66), and the width between the two magnetic blocks (66) being smaller than the distance between the two magnetic magnets (642).

2. A semiconductor wafer grinding device according to claim 1, characterized in that: The upper side wall of the processing table (1) is provided with a drainage groove (101). The upper end of the processing table (1) is fixedly connected to the water shield (21), the cylinder (10) and the electric turntable (11). The cylinder (10) is sleeved on the outside of the electric turntable (11). The water shield (21) is located on the outside of the cylinder (10). One end of the drainage groove (101) is located between the water shield (21) and the cylinder (10). The upper side wall of the water shield (21) is slidably connected to a vibration rod (22). The vibration rod (22) is arranged in a "T" shape. The outer wall of the vibration rod (22) is sleeved with a telescopic spring (23). The two ends of the telescopic spring (23) are respectively fixedly connected to the side wall of the vibration rod (22) and the side wall of the water shield (21). The end of the vibration rod (22) located on the inner side of the water shield (21) is arranged in a hemispherical shape.

3. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The lower end of the tray (81) is fixedly connected to the electric turntable (11); a plurality of protrusions (82) in a circumferential array are fixedly connected to the upper side wall of the tray (81); a chamfer is provided at one end of the protrusion (82); a plurality of water flow holes (83) distributed in a circumferential array are provided on the side wall of the tray (81); and the tray (81) is located on the inner side of the water shield (21).

4. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The grinding assembly (7) comprises a grinding disc (71), a cavity (75) is provided inside the grinding disc (71), a plurality of chip removal grooves (72) are provided on the lower side wall of the grinding disc (71) and are distributed in a circumferential array, the chip removal grooves (72) are arc-shaped, a drainage hole (74) is provided between the cavity (75) and the chip removal grooves (72), the side wall of the grinding disc (71) is fixedly connected to one end of the rotating shaft (12), the upper end of the rotating shaft (12) vertically penetrates the side wall of the fixed disc (61) and is fixedly connected to the second motor (5), and the second motor (5) is fixedly connected to the upper end of the fixed disc (61).

5. The semiconductor wafer grinding equipment according to claim 4, characterized in that: The upper side wall of the grinding disc (71) is provided with a limit slide groove (76), the limit slide groove (76) is slidably connected to a rotating ring (73), the rotating ring (73) is fixedly connected to one end of the one-way water flow pipe (41) away from the water tank (4), and a plurality of connecting pipes (62) are fixedly connected to the symmetrical two sides of the rotating ring (73), and the upper ends of the connecting pipes (62) are fixedly connected to the fixed disc (61).

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