A microchannel radiator split flow integrated cooling structure

Abstract

The present invention discloses a microchannel radiator shunt integrated cooling structure, which relates to the field of electronic device heat dissipation technology, including a heat exchange channel unit, a plurality of heat dissipation units are respectively arranged on both sides of the heat exchange channel unit, a heat insulation block is arranged between adjacent heat dissipation units, a first vacuum layer is arranged inside the heat insulation block, the heat dissipation unit includes a first shell, a first heat exchange channel, a second heat exchange channel and a first liquid return channel, a collection space is opened in the first shell above the first heat exchange channel and the second heat exchange channel, the heat exchange channel unit is connected to the collection space through the first heat exchange channel, and the heat exchange channel unit is connected to the collection space through the second heat exchange channel. The present invention separates heat dissipation units under different temperature states through the heat insulation block and the first vacuum layer, avoids mutual heat conduction between heat dissipation units under different temperature states, and facilitates giving full play to the heat dissipation effect of a single heat dissipation unit.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a microchannel radiator shunt integrated cooling structure. Background Art

[0002] Microchannel heat sinks are highly efficient thermal management devices that are widely used in electronic devices and high-performance computing systems. Their main feature is the use of tiny channel structures, through which the coolant can quickly flow through the heat sink, effectively taking away the heat, thereby greatly improving the heat dissipation efficiency. Microchannel heat sinks are designed to maximize the heat conduction area and reduce thermal resistance.

[0003] The invention with authorization announcement number CN104979307B discloses a microchannel heat sink cooling multi-chip system device. The invention integrates multiple microchannels on a substrate, allowing the coolant to flow in the diversion channel grooves in the substrate to cool the substrate, thereby dissipating heat for multiple chips at the same time.

[0004] The above device can achieve the purpose of chip heat dissipation, but the heat dissipation efficiency of the above device is low. When cooling multiple chips, the chip with high heat generation can transfer heat to the chip with low heat generation through the substrate, affecting the performance of the equipment. Moreover, it is difficult to fit a whole substrate to chips in different positions, and thus it is impossible to dissipate heat efficiently. Therefore, a unit-type device is needed that can control the heat dissipation capacity of the radiator according to the amount of heat generated by the corresponding chip. Summary of the invention

[0005] The object of the present invention is to provide a microchannel radiator split flow integrated cooling structure to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A microchannel radiator split flow integrated cooling structure comprises a heat exchange channel unit, a plurality of heat dissipation units are respectively arranged on both sides of the heat exchange channel unit, and a heat insulation block is arranged between adjacent heat dissipation units;

[0008] The heat dissipation unit comprises a first shell, a first heat exchange channel, a second heat exchange channel and a first liquid return channel, a collecting space is provided in the first shell above the first heat exchange channel and the second heat exchange channel, the heat exchange channel unit is connected to the collecting space through the first heat exchange channel, the heat exchange channel unit is connected to the collecting space through the second heat exchange channel, and the collecting space is connected to the heat exchange channel unit through the first liquid return channel;

[0009] A stepped columnar groove is provided in the first shell and passes through the second heat exchange channel, a one-way valve is provided at the outer end of the stepped columnar groove, a hot start device is slidably provided on the inner side of the stepped columnar groove, a plate storage space is formed between the hot start device and the bottom of the stepped columnar groove, a start space is formed between the one-way valve and the hot start device, the start space is filled with a low-boiling point liquid, and a first vent hole is provided at the inner end of the stepped columnar groove and the start space.

[0010] As a further solution of the present invention: a first vacuum layer is provided inside the insulation block.

[0011] As a further solution of the present invention: a heat insulation layer is provided in the middle of the inner side of the first shell.

[0012] As a further solution of the present invention: the hot start device includes a first piston rod, a first movable plate is fixedly arranged on the inner side of the first piston rod, a first liquid hole cooperating with the second heat exchange channel is opened on the first movable plate, and a first spring is arranged on the first piston rod.

[0013] As a further solution of the present invention: the heat exchange channel unit includes a connecting pipe, connecting heads are fixedly provided at both ends of the connecting pipe, and a hot liquid channel and a cold liquid channel are respectively opened on the upper and lower sides of the connecting head and the connecting pipe, the liquid outlet of the first return liquid channel is connected to the hot liquid channel in the connecting head, and the liquid inlet of the first heat exchange channel and the second heat exchange channel are connected to the cold liquid channel in the connecting head, a liquid inlet head is fixedly provided on the outside of one of the connecting heads, and a liquid outlet head is fixedly provided on the outside of the other connecting head.

[0014] As a further solution of the present invention: a second vacuum layer is arranged in the connecting pipe outside the hot liquid channel.

[0015] As a further solution of the present invention: a partition is fixedly arranged in the collecting space, and the internal space of the collecting space is divided into two spaces, cold and hot, by the partition; the liquid outlets of the first heat exchange channel and the second heat exchange channel are located in the hot space of the collecting space, and the liquid inlet of the first return liquid channel is located in the cold space of the collecting space; a plurality of fans are fixedly arranged above the heat dissipation unit and the insulation block; and a plurality of microchannel heat dissipation devices are fixedly arranged on the upper end surface of the first shell above the collecting space.

[0016] As a further solution of the present invention: a spiral heat exchange channel is opened outside the starting space, the collecting space is connected with the spiral heat exchange channel through a connecting channel, and the spiral heat exchange channel is connected with the hot liquid channel through a second liquid return channel.

[0017] As a further solution of the present invention: the height of the liquid outlet of the second liquid return channel is lower than the height of the first liquid return channel.

[0018] As a further solution of the present invention: the microchannel heat dissipation device includes a second shell, and a liquid inlet pipe and a liquid outlet pipe are respectively opened at both ends of the second shell, the inlet of the liquid inlet pipe is connected to the hot space in the collecting space, and the outlet of the liquid outlet pipe is connected to the cold space in the collecting space, a plurality of heat exchange microchannels are arranged between the liquid inlet pipe and the liquid outlet pipe, and heat exchange fins are arranged between adjacent heat exchange microchannels.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The heat-dissipating units at different temperature states are separated by the heat-insulating block and the first vacuum layer to avoid mutual heat conduction between the heat-dissipating units at different temperature states, so as to give full play to the heat-dissipating effect of a single heat-dissipating unit;

[0021] 2. The first heat exchange channel, the second heat exchange channel and the collecting space are separated by a heat insulation layer to prevent heat from being transferred to the bottom of the first shell, thereby improving the heat dissipation efficiency of the first shell;

[0022] 3. The low-temperature coolant in the heat exchange channel unit is transported to the first shell through the first heat exchange channel, so as to cool down the bottom of the first shell. The heated coolant is transported back to the heat exchange channel unit through the collection space. The low-boiling point liquid in the start-up space is converted from liquid to gas when the temperature rises, thereby driving the hot start device to move, thereby controlling the opening and closing of the second heat exchange channel, allowing the hot start device to change dynamically. When strong cooling is required, the temperature can be reduced in time, thereby controlling the heat dissipation capacity of the heat dissipation unit;

[0023] 4. The heat in the hot liquid channel is separated from the connecting pipe through the second vacuum layer to avoid the heat being transferred to the connecting pipe and the heat dissipation unit, thereby improving the heat dissipation efficiency of the device;

[0024] 5. The coolant in the hot space of the collection space is fed into the microchannel heat dissipation device, and the fan performs heat dissipation treatment on the coolant in the microchannel heat dissipation device to reduce the temperature of the coolant, and then the coolant is fed into the cold space of the collection space to cool the coolant, so that the entire device can perform self-heating. When only the above device unit is required to complete the heat dissipation of the chip, the liquid inlet head and the liquid outlet head can be connected through the connecting pipe, and a pressure pump can be installed in the connecting pipe to circulate the coolant in the device, so that the device can be miniaturized, thereby expanding the scope of use of the device and improving the practicality of the device heat dissipation;

[0025] 6. The low-boiling-point liquid in the startup space is heated by the spiral heat exchange channel to speed up the opening of the second heat exchange channel, thereby improving the heat dissipation efficiency of the heat dissipation unit. When the coolant temperature in the collection space is not higher than the boiling point temperature of the liquid in the startup space (the heat of the chip can be well suppressed by relying solely on the first heat exchange channel), the spiral heat exchange channel has no effect on the liquid in the startup space. When the coolant temperature in the collection space is higher than the boiling point temperature of the liquid in the startup space, and the temperature at the bottom of the first shell is not enough to convert the liquid in the startup space into gas, the spiral heat exchange channel heats the liquid in the startup space to speed up the efficiency of converting the liquid in the startup space into gas, and then promptly opens the second heat exchange channel to further cool the chip. When the temperature at the bottom of the first shell begins to drop to the liquid in the startup space, When the boiling point temperature is reached, the gas in the starting space is gradually transformed into liquid, while the temperature of the coolant in the collecting space is still higher than the boiling point temperature of the liquid in the starting space. The spiral heat exchange channel still heats the liquid in the starting space until the temperature of the coolant in the collecting space is no higher than the boiling point temperature of the liquid in the starting space. This can delay the shutdown of the hot start device to prevent the chip from generating a large amount of heat in the process, resulting in insufficient heat dissipation, thereby reducing the operating efficiency of the chip. In this way, the heat dissipation unit can be flexibly adjusted according to the heat generation of different chips. The heat dissipation capacity of the heat dissipation unit is strong above the chip with large heat generation, and the heat dissipation capacity of the heat dissipation unit is weak above the chip with small heat generation. The cooling capacity of the coolant is fully utilized, so that the heat dissipation capacity of the overall device is reasonably distributed, and different chips are dissipated to the greatest extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of Example 1 of the present invention.

[0027] Figure 2 It is a schematic diagram of the top structure of embodiment 1 of the present invention.

[0028] Figure 3 This is a schematic diagram of the main structure of Example 1 of the present invention.

[0029] Figure 4 Embodiment 1 of the present invention Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle.

[0030] Figure 5 Embodiment 1 of the present invention Figure 2 Schematic diagram of the cross-sectional structure at BB in the middle.

[0031] Figure 6 Embodiment 1 of the present invention Figure 2 Schematic diagram of the cross-sectional structure at CC in the middle.

[0032] Figure 7 Embodiment 1 of the present invention Figure 3Schematic diagram of the cross-sectional three-dimensional structure at DD in the middle.

[0033] Figure 8 Embodiment 1 of the present invention Figure 7 Schematic diagram of the local enlarged structure at S in the middle.

[0034] Fig. 9 Embodiment 1 of the present invention Figure 3 Schematic diagram of the cross-sectional structure at EE in the middle.

[0035] Fig.10 It is a schematic diagram of the three-dimensional structure of Example 2 of the present invention.

[0036] Fig.11 It is a schematic diagram of the top view of the structure of embodiment 2 of the present invention.

[0037] Fig.12 This is a schematic diagram of the main structure of Example 2 of the present invention.

[0038] Fig.13 Embodiment 2 of the present invention Fig.11 Schematic diagram of the cross-sectional structure at FF in the middle.

[0039] Fig.14 Embodiment 2 of the present invention Fig.12 Schematic diagram of the cross-sectional three-dimensional structure at GG in the middle.

[0040] Fig.15 Embodiment 2 of the present invention Fig.14 Schematic diagram of the three-dimensional cross-sectional structure at point H in the middle.

[0041] Notes on reference numerals: 100, heat dissipation unit; 101, first shell; 102, one-way valve; 103, hot start device; 1031, piston rod; 1032, moving plate; 1033, liquid hole; 1034, spring; 104, vent hole; 105, plate storage space; 106, start space; 107, heat insulation layer; 108, first heat exchange channel; 109, second heat exchange channel; 110, collection space; 111, first liquid return channel; 112, partition; 113, connecting channel; 114, partition; 115, connecting channel; 116, partition; 117, connecting channel; 118, connecting channel; 119, connecting channel; 120, connecting channel; 121, connecting channel; 122, connecting channel; 123, connecting channel; 124, connecting channel; 125, connecting channel; 126, connecting channel; 127, connecting channel; 128, connecting channel; 129, connecting channel; 130, connecting channel; 131, connecting channel; 132, connecting channel; 133, connecting channel; 134, connecting channel; 135, connecting channel; 136, connecting channel; 137, connecting channel; 138, connecting channel; 139, connecting channel; 140, connecting channel; 141, connecting channel; 142, connecting channel; 143, connecting channel; 144, connecting channel; 145, connecting channel; 146, connecting channel; 147, connecting channel; 148, connecting channel; 149, connecting channel; 149, connecting channel; 140, connecting channel; 141, connecting channel; 149, connecting channel; 140, connecting channel; 141, connecting channel 4. spiral heat exchange channel; 115. second liquid return channel; 200. insulation block; 201. first vacuum layer; 300. heat exchange channel unit; 301. liquid inlet head; 302. connector; 303. connecting pipe; 304. liquid outlet head; 305. hot liquid channel; 306. cold liquid channel; 307. second vacuum layer; 400. fan; 500. microchannel heat dissipation device; 501. second shell; 502. liquid inlet pipe; 503. liquid outlet pipe; 504. heat exchange microchannel; 505. heat exchange fins. DETAILED DESCRIPTION

[0042] The following embodiments will be described in detail with reference to the accompanying drawings. In the drawings or descriptions, similar or identical parts use the same reference numerals, and in actual applications, the shape, thickness or height of each component may be enlarged or reduced. The embodiments listed in the present invention are only used to illustrate the present invention and are not used to limit the scope of the present invention. Any obvious modifications or changes made to the present invention do not depart from the spirit and scope of the present invention.

[0043] Example 1

[0044] See also Figure 1-Figure 9 In an embodiment of the present invention, a microchannel radiator shunt integrated cooling structure includes a heat exchange channel unit 300, a plurality of heat dissipation units 100 are respectively arranged on both sides of the heat exchange channel unit 300, an insulation block 200 is arranged between adjacent heat dissipation units 100, and a first vacuum layer 201 is arranged inside the insulation block 200. The heat dissipation units 100 in different temperature states are separated by the insulation block 200 and the first vacuum layer 201 to avoid mutual heat conduction between the heat dissipation units 100 in different temperature states, so as to give full play to the heat dissipation effect of a single heat dissipation unit 100.

[0045] See also Figure 1 , Figure 7 , Figure 8 and Fig. 9 The heat dissipation unit 100 includes a first shell 101, a first heat exchange channel 108, a second heat exchange channel 109 and a first liquid return channel 111. A collecting space 110 is provided in the first shell 101 above the first heat exchange channel 108 and the second heat exchange channel 109. The heat exchange channel unit 300 is connected to the collecting space 110 through the first heat exchange channel 108, the heat exchange channel unit 300 is connected to the collecting space 110 through the second heat exchange channel 109, and the collecting space 110 is connected to the heat exchange channel unit 300 through the first liquid return channel 111. A heat insulation layer 107 is provided in the middle of the inner side of the first shell 101. The first heat exchange channel 108, the second heat exchange channel 109 and the collecting space 110 are separated by the heat insulation layer 107 to prevent heat from being transferred to the bottom of the first shell 101, thereby improving the heat dissipation efficiency of the first shell 101.

[0046] See also Figure 1 , Figure 2 , Figure 4 and Figure 5A stepped columnar groove is provided in the first shell 101 and passes through the second heat exchange channel 109. A one-way valve 102 is provided at the outer end of the stepped columnar groove. A hot start device 103 is slidably provided inside the stepped columnar groove. A plate storage space 105 is formed between the hot start device 103 and the bottom of the stepped columnar groove. A start-up space 106 is formed between the one-way valve 102 and the hot start device 103. The start-up space 106 is filled with a low-boiling liquid, preferably acetone, petroleum ether, or chloroform. A first ventilation is provided at the inner end of the stepped columnar groove and the start-up space 106. The hole 104 transports the low-temperature coolant in the heat exchange channel unit 300 to the first shell 101 through the first heat exchange channel 108, so as to cool down the bottom of the first shell 101, and transports the heated coolant back to the heat exchange channel unit 300 through the collecting space 110. The low-boiling point liquid in the starting space 106 is converted from liquid to gas when the temperature rises, thereby driving the hot start device 103 to move, thereby controlling the opening and closing of the second heat exchange channel 109, allowing the hot start device 103 to change dynamically, and when strong cooling is required, the temperature can be reduced in time, thereby controlling the heat dissipation capacity of the heat dissipation unit 100.

[0047] See also Figure 4 The hot start device 103 includes a first piston rod 1031, a first movable plate 1032 is fixedly arranged on the inner side of the first piston rod 1031, a first liquid hole 1033 cooperating with the second heat exchange channel 109 is opened on the first movable plate 1032, and a first spring 1034 is arranged on the first piston rod 1031.

[0048] See also Figure 1 , Figure 6 The heat exchange channel unit 300 includes a connecting pipe 303, and connectors 302 are fixedly provided at both ends of the connecting pipe 303. A hot liquid channel 305 and a cold liquid channel 306 are respectively provided on the upper and lower sides of the connecting head 302 and the connecting pipe 303. A second vacuum layer 307 is provided on the outside of the hot liquid channel 305 in the connecting pipe 303. The liquid outlet of the first return liquid channel 111 is connected to the hot liquid channel 305 in the connecting head 302, and the liquid inlet of the first heat exchange channel 108 and the second heat exchange channel 109 is connected to the cold liquid channel 306 in the connecting head 302. A liquid inlet head 301 is fixedly provided on the outside of one of the connecting heads 302, and a liquid outlet head 304 is fixedly provided on the outside of the other connecting head 302. The heat in the hot liquid channel 305 is separated from the connecting pipe 303 by the second vacuum layer 307, so as to avoid the heat being transferred to the connecting pipe 303 and the heat dissipation unit 100, thereby improving the heat dissipation efficiency of the device.

[0049] When the device is in use, the starting space 106 is filled with low-boiling-point liquid through the one-way valve 102, and the cooling liquid is transported to the cold liquid channel 306 through the liquid inlet head 301, and is fed to the collecting space 110 through the first heat exchange channel 108. During the cooling liquid transportation process, the heat generated by the chip is absorbed to achieve the purpose of initial cooling, and then the cooling liquid after heat exchange is transported to the hot liquid channel 305 through the first return liquid channel 111. When the temperature of the bottom of the first shell 101 cannot be maintained by the first heat exchange channel 108 alone, the temperature of the bottom of the first shell 101 continues to rise, so that the low-boiling-point liquid in the starting space 106 is converted from liquid to gas, which drives the first heat exchange channel 108 to cool down. A piston rod 1031 and a first movable plate 1032 move, gradually making the first liquid hole 1033 fit with the second heat exchange channel 109, slowly and completely opening the second heat exchange channel 109 to dissipate heat from the bottom of the first shell 101, and the coolant in the cold liquid channel 306 is fed to the collecting space 110 through the second heat exchange channel 109. The first heat exchange channel 108 and the second heat exchange channel 109 cool the chip together, thereby maintaining the temperature of the bottom of the first shell 101, so that the heat dissipation unit 100 is at the highest efficiency to dissipate heat from the chip. When manufacturing the device, multi-layer splicing is adopted, and the device is sealed with a sealing component.

[0050] Example 2

[0051] See also Figure 10-15On the basis of Example 1, a partition 112 is fixedly provided in the collecting space 110, and the internal space of the collecting space 110 is divided into two spaces, a hot space and a cold space, by the partition 112. The liquid outlets of the first heat exchange channel 108 and the second heat exchange channel 109 are located in the hot space of the collecting space 110, and the liquid inlet of the first liquid return channel 111 is located in the cold space of the collecting space 110. A spiral heat exchange channel 114 is opened on the outside of the starting space 106, and the collecting space 110 is connected to the spiral heat exchange channel 114 through the connecting channel 113, and the spiral heat exchange channel 114 is connected to the hot liquid channel 305 through the second liquid return channel 115. The height of the liquid outlet of the second liquid return channel 115 is lower than the height of the first liquid return channel 111. The heat dissipation unit 100 and the insulation block 200 are above A plurality of fans 400 are fixedly arranged, and a plurality of microchannel heat dissipation devices 500 are fixedly arranged on the upper end surface of the first shell 101 above the collecting space 110. The coolant in the hot space of the collecting space 110 is fed into the microchannel heat dissipation device 500. The fan 400 performs heat dissipation treatment on the coolant in the microchannel heat dissipation device 500 to reduce the temperature of the coolant, and then the coolant is fed into the cold space of the collecting space 110 to facilitate cooling of the coolant, so that the entire device can perform self-heating. When only the above-mentioned device unit is required to complete the heat dissipation of the chip, the liquid inlet head 301 and the liquid outlet head 304 can be connected through a connecting pipe, and a pressure pump can be installed in the connecting pipe to allow the coolant to circulate in the device, so that the device can be miniaturized, thereby expanding the scope of use of the device and improving the practicality of the heat dissipation of the device.

[0052] See also Fig.13 The microchannel heat dissipation device 500 includes a second shell 501, and a liquid inlet pipe 502 and a liquid outlet pipe 503 are respectively opened at both ends of the second shell 501. The inlet of the liquid inlet pipe 502 is connected to the hot space in the collecting space 110, and the outlet of the liquid outlet pipe 503 is connected to the cold space in the collecting space 110. A plurality of heat exchange microchannels 504 are arranged between the liquid inlet pipe 502 and the liquid outlet pipe 503, and heat exchange fins 505 are arranged between adjacent heat exchange microchannels 504.

[0053] When the device is in use, at room temperature, the first heat exchange channel 108 is always in an open state. When the chip is cooled, the coolant in the first heat exchange channel 108 at the bottom of the first shell 101 absorbs heat, causing the coolant temperature to rise, and then is fed to the collection space 110. A portion of the heated coolant in the collection space 110 is fed to the hot liquid channel 305 through the first liquid return channel 111, and another portion of the heated coolant is fed to the hot liquid channel 305 through the spiral heat exchange channel 114 (since there are two liquid inlets and only one liquid outlet in the collection space 110, there is a certain pressure inside the collection space 110, which causes the coolant to flow out of the collection space 110. The spiral heat exchange channel 114 flows through the spiral heat exchange channel 114, and the low boiling point liquid in the startup space 106 is heated by the spiral heat exchange channel 114, so as to accelerate the opening of the second heat exchange channel 109, thereby improving the heat dissipation efficiency of the heat dissipation unit 100. When the temperature of the coolant in the collection space 110 is not higher than the boiling point temperature of the liquid in the startup space 106 (the heat of the chip can be well suppressed by relying only on the first heat exchange channel 108), the spiral heat exchange channel 114 has no effect on the liquid in the startup space 106. The temperature of the coolant in the collection space 110 is higher than the boiling point temperature of the liquid in the startup space 106. At this time, the temperature at the bottom of the first shell 101 is not high enough to When the liquid in the startup space 106 is converted into gas, the spiral heat exchange channel 114 heats the liquid in the startup space 106, speeding up the conversion efficiency of the liquid in the startup space 106 into gas, and then timely opening the second heat exchange channel 109 to further cool the chip. When the temperature at the bottom of the first shell 101 begins to drop to the boiling point of the liquid in the startup space 106, the gas in the startup space 106 is gradually converted into liquid, while the temperature of the coolant in the collection space 110 is still higher than the boiling point of the liquid in the startup space 106, and the spiral heat exchange channel 114 still heats the liquid in the startup space 106 until the chip is cooled. The temperature of the coolant in the collection space 110 is not higher than the boiling point of the liquid in the start space 106. This can delay the shutdown of the hot start device 103 and prevent the chip from generating a large amount of heat in the process, resulting in insufficient heat dissipation and lowering the chip operation efficiency. In this way, the heat dissipation unit 100 can be flexibly adjusted according to the heat generation of different chips. The heat dissipation capacity of the heat dissipation unit 100 is strong above the chip with large heat generation, and the heat dissipation capacity of the heat dissipation unit 100 is weak above the chip with small heat generation. The cooling capacity of the coolant is fully utilized, so that the heat dissipation capacity of the overall device is reasonably distributed, and the heat dissipation of different chips is maximized.

[0054] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0055] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A microchannel radiator split flow integrated cooling structure, comprising a heat exchange channel unit (300), characterized in that: A plurality of heat dissipation units (100) are respectively arranged on both sides of the heat exchange channel unit (300), and a heat insulation block (200) is arranged between adjacent heat dissipation units (100); The heat dissipation unit (100) comprises a first shell (101), a first heat exchange channel (108), a second heat exchange channel (109) and a first liquid return channel (111); a collecting space (110) is provided in the first shell (101) above the first heat exchange channel (108) and the second heat exchange channel (109); the heat exchange channel unit (300) is connected to the collecting space (110) through the first heat exchange channel (108); the heat exchange channel unit (300) is connected to the collecting space (110) through the second heat exchange channel (109); and the collecting space (110) is connected to the heat exchange channel unit (300) through the first liquid return channel (111); A stepped columnar groove is provided in the first shell (101) and passes through the second heat exchange channel (109); a one-way valve (102) is provided at the outer end of the stepped columnar groove; a thermal start device (103) is slidably provided inside the stepped columnar groove; a plate storage space (105) is formed between the thermal start device (103) and the bottom of the stepped columnar groove; a start space (106) is formed between the one-way valve (102) and the thermal start device (103); the start space (106) is filled with a low-boiling-point liquid; and a first vent hole (104) is provided at the inner end of the stepped columnar groove and the start space (106).

2. The microchannel radiator split flow integrated cooling structure according to claim 1, characterized in that: A first vacuum layer (201) is provided inside the thermal insulation block (200).

3. The microchannel radiator split flow integrated cooling structure according to claim 1, characterized in that: A heat insulation layer (107) is provided in the middle of the inner side of the first shell (101).

4. The microchannel radiator split flow integrated cooling structure according to any one of claims 1 to 3, characterized in that: The hot start device (103) comprises a first piston rod (1031), a first movable plate (1032) is fixedly arranged on the inner side of the first piston rod (1031), a first liquid hole (1033) cooperating with the second heat exchange channel (109) is opened on the first movable plate (1032), and a first spring (1034) is arranged on the first piston rod (1031).

5. The microchannel radiator split flow integrated cooling structure according to claim 4, characterized in that: The heat exchange channel unit (300) comprises a connecting tube (303), connecting heads (302) are fixedly provided at both ends of the connecting tube (303), a hot liquid channel (305) and a cold liquid channel (306) are respectively provided on the upper and lower sides of the connecting head (302) and the connecting tube (303), the liquid outlet of the first return liquid channel (111) is connected to the hot liquid channel (305) in the connecting head (302), the liquid inlet of the first heat exchange channel (108) and the second heat exchange channel (109) are connected to the cold liquid channel (306) in the connecting head (302), a liquid inlet head (301) is fixedly provided on the outer side of one of the connecting heads (302), and a liquid outlet head (304) is fixedly provided on the outer side of the other connecting head (302).

6. The microchannel radiator split flow integrated cooling structure according to claim 5, characterized in that: A second vacuum layer (307) is provided in the connecting pipe (303) outside the hot liquid channel (305).

7. The microchannel radiator split flow integrated cooling structure according to claim 6, characterized in that: A partition (112) is fixedly arranged in the collecting space (110), and the internal space of the collecting space (110) is divided into two spaces, a hot space and a cold space, by the partition (112); the liquid outlets of the first heat exchange channel (108) and the second heat exchange channel (109) are located in the hot space of the collecting space (110); the liquid inlet of the first liquid return channel (111) is located in the cold space of the collecting space (110); a plurality of fans (400) are fixedly arranged above the heat dissipation unit (100) and the heat insulation block (200); and a plurality of microchannel heat dissipation devices (500) are fixedly arranged on the upper end surface of the first shell (101) above the collecting space (110).

8. The microchannel radiator split flow integrated cooling structure according to claim 7, characterized in that: A spiral heat exchange channel (114) is provided outside the start-up space (106), the collecting space (110) is connected to the spiral heat exchange channel (114) via a connecting channel (113), and the spiral heat exchange channel (114) is connected to the hot liquid channel (305) via a second liquid return channel (115).

9. The microchannel radiator split flow integrated cooling structure according to claim 8, characterized in that: The height of the liquid outlet of the second liquid return channel (115) is lower than that of the first liquid return channel (111).

10. The microchannel radiator split flow integrated cooling structure according to claim 9, characterized in that: The microchannel heat dissipation device (500) comprises a second shell (501), and a liquid inlet pipe (502) and a liquid outlet pipe (503) are respectively provided at two ends of the second shell (501); the inlet of the liquid inlet pipe (502) is connected to the hot space in the collecting space (110), and the outlet of the liquid outlet pipe (503) is connected to the cold space in the collecting space (110); a plurality of heat exchange microchannels (504) are arranged between the liquid inlet pipe (502) and the liquid outlet pipe (503), and heat exchange fins (505) are arranged between adjacent heat exchange microchannels (504).

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