Batch cleaning device for tinned components and use method of batch cleaning device

Abstract

The invention discloses a batch cleaning device for components after tinning and a using method thereof, and the batch cleaning device comprises an equipment frame in which a cleaning chamber is formed; the fixing supports are arranged on the inner walls of the two sides of the equipment frame respectively; the bearing plates are located in the equipment frame and erected between the fixing supports in a layered mode; the control panel is arranged on the outer wall of the equipment frame and provides a power supply for the batch cleaning device; the control panel comprises a control module; wherein each bearing plate is provided with a plurality of clamping and limiting devices, a plurality of clamping and limiting devices and a plurality of clamping and limiting devices, and the component clamping device is clamped between any two adjacent clamping limiting devices and is used for placing the to-be-cleaned component after tinning. According to the invention, a batch cleaning method integrating heating and plasma cleaning functions is creatively adopted, so that the cleaning efficiency and the cleaning quality can be improved, and meanwhile, components with fine pins are protected.

Description

Technical Field

[0001] The invention relates to the technical field of electronic assembly technology, in particular to a batch cleaning device after tinning of components and a use method thereof. Background Art

[0002] With the advancement of localization of components and microwave communication technology, gold-plated components packaged in metal tube shells are increasingly widely used in the field of electronic assembly, especially in fields such as aerospace that require high reliability. Due to the risk of gold brittleness in gold-plated components, tin-plating is often used to remove gold from gold-plated components using surface mount technology (SMT) patches. In the actual production process, components need to be dipped in flux to facilitate tin-plating. After tin-plating, the flux often adheres to the pins or body of the components. During the production of SMT patches, the flux will adhere the components to the nozzle of the patch machine, making it impossible to patch normally, causing quality defects such as throwing, missing patches, and may damage the patch equipment in severe cases. In the production process, the components after tin-plating are often cleaned manually with alcohol. This method is not only time-consuming and labor-intensive, but also not cleaned thoroughly. In addition, there is a risk of damaging the pins of components with fine pins. Therefore, a cleaning device and a method for use that can achieve batch cleaning after tin-plating are needed. Summary of the invention

[0003] The purpose of the present invention is to provide a batch cleaning device for components after tin-plating and a method of using the device. The device creatively adopts a batch cleaning method with heating and plasma cleaning functions in one, which can help heat and activate residual flux, while reducing the adhesion of the flux and improving the plasma cleaning intensity. It can effectively remove the residual flux and other adherent organic matter on the components after tin-plating, and has strong engineering practicality.

[0004] In order to achieve the above object, the present invention provides a batch cleaning device for components after tinning, comprising:

[0005] an apparatus frame, the interior of which forms a cleaning chamber;

[0006] Fixed brackets are respectively arranged on the inner walls of both sides of the equipment frame;

[0007] A plurality of bearing plates are located inside the equipment frame and are layered between the fixed brackets;

[0008] A control panel, arranged on the outer wall of the equipment frame, provides power to the batch cleaning device; the control panel includes a control module;

[0009] Wherein, each of the bearing plates is provided with:

[0010] A plurality of clamping and limiting devices are arranged on the bearing plate at intervals, and a clamping and limiting space is formed between two adjacent clamping and limiting devices;

[0011] The component clamping device is clamped between any two adjacent clamping limit devices and is used to place components to be cleaned after tinning.

[0012] Optionally, the body of each of the supporting plates includes:

[0013] The electric heating resistance wire is connected to the control module circuit and can be controlled by the control module to generate heat so as to heat the carrier plate;

[0014] The temperature sensor is located above the electric heating resistance wire and is connected to the control module circuit to detect and monitor the heating temperature of the carrier plate.

[0015] Optionally, the batch cleaning device further includes a temperature control indicator light, which is arranged on the outer wall of the equipment frame; the temperature control indicator light is connected to the control module circuit, and the control module can control the lighting or extinguishing of the temperature control indicator light according to the temperature signal transmitted by the temperature sensor.

[0016] Optionally, each of the carrying plates further comprises:

[0017] A plurality of plug-in interfaces are arranged between two adjacent clamping and limiting devices to realize plugging with the component clamping device placed at the position;

[0018] The plug-in interface is connected to the control module circuit. When the plug-in interface is plugged into the component clamping device, the component clamping device is powered on.

[0019] Optionally, the plug-in interface includes:

[0020] a first powered jack and a second powered jack;

[0021] The first power-on socket and the second power-on socket are arranged in sequence in a vertical direction, and the distance between the two power-on sockets can be adjusted by a sliding component.

[0022] Optionally, the component clamping device comprises:

[0023] A base, a base slot is provided on the side of the base, and the base acts as a bottom electrode to store or release energy;

[0024] A component placement plate is located above the base and is fixedly mounted on a card slot of the base to support components to be cleaned;

[0025] The upper cover plate is located above the component placement plate and acts as a top electrode to store or release energy;

[0026] The adjustable bolt is arranged between the upper cover plate and the base, and is used to install the upper cover plate onto the base; and the adjustable bolt can adjust the distance between the upper cover plate and the base according to the energy density required by the preset cleaning power.

[0027] Optionally, the component placement plate is provided with a plurality of grooves regularly arranged in a grid shape and matching the size of the components, and each groove is used to place a component to be cleaned;

[0028] The depth of each groove is less than the thickness of the component.

[0029] Optionally, the upper cover plate is provided with a plurality of through slots which are regularly arranged in a grid shape and match the size of the components and the size of the grooves.

[0030] Optionally, a first metal pin is provided on a side of the base, a second metal pin is provided on a side of the upper cover plate on the same side as the base, and the first metal pin is located vertically below the second metal pin;

[0031] The first metal pin and the second metal pin are respectively matched and plugged with the first power-on socket and the second power-on socket on the plug-in interface.

[0032] The present invention also provides a method for using a batch cleaning device, comprising the following steps:

[0033] S1, placing a plurality of components to be cleaned after tinning in grooves of one or more component placement boards;

[0034] S2, install the component placement plate on the base, install the adjustable bolts, and then install the upper cover plate. Adjust the distance between the upper cover plate and the base by rotating a certain number of circles until it is consistent with the height corresponding to the set cleaning power;

[0035] S3, adjusting the distance between the first power socket and the second power socket to make it consistent with the distance between the first metal pin and the second metal pin on the base and the upper cover;

[0036] S4, placing the assembled multiple component clamping devices on the carrier plate respectively, fixing them by two adjacent clamping limit devices, and facing the plug-in interface with the first metal pin and the second metal pin, so that the pins are plugged into the power sockets in pairs;

[0037] S5, setting the heating temperature and time of the batch cleaning device, setting the plasma cleaning power and time, performing vacuuming and introducing the medium gas, and starting cleaning;

[0038] S6, after cleaning is completed, taking out the component holding device from the batch cleaning device, and then taking out the component placement plate;

[0039] S7, remove the cleaned components from the component placement board.

[0040] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0041] 1. The traditional manual cleaning of tin-plated components using alcohol is not only time-consuming and labor-intensive, but also incomplete. For components with fine pins, there is a risk of damaging the pins of the components. The device and method provided by the present invention can improve the cleaning efficiency and cleaning quality, and has low requirements on the skill level of the operator.

[0042] 2. Currently, water cleaning equipment is used to clean components, but there is a risk of water flow impact damaging the components. The device and method provided by the present invention can achieve contactless and collision-free cleaning of components, which is particularly suitable for cleaning components with fine pins.

[0043] 3. The process device provided by the present invention has a simple structure, a simple production process, and high cleaning efficiency, and has the advantage of low-cost production. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 is a schematic diagram of a batch cleaning device of the present invention;

[0045] Figure 2 It is a structural schematic diagram of a single-layer bearing plate of the present invention;

[0046] Figure 3 It is a structural schematic diagram of the component clamping device of the present invention;

[0047] Figure 4 It is a schematic diagram of the components to be cleaned after being placed in the component clamping device of the present invention. DETAILED DESCRIPTION

[0048] The following will be combined with the attached Figures 1 to 4 , the technical content, structural features, objectives achieved and effects of the present invention are described in detail through preferred embodiments.

[0049] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0050] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0051] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] The present invention provides a batch cleaning device for components after tinning. Figure 1 As shown, the batch cleaning device includes: an equipment frame 1, which serves as a structural support for the entire batch cleaning device and forms a cleaning chamber therein; fixed brackets 4, which are respectively arranged on both sides of the interior of the equipment frame 1, tightly fitted and fixed on the inner wall of the equipment frame 1; a supporting plate 3, which is located inside the equipment frame 1 and is layered on the fixed brackets 4, that is, both ends of each of the supporting plates 3 are respectively fixedly connected to the corresponding fixed brackets 4, and the supporting plates 3 have a heating function; a control panel 2, which is arranged on the outer wall of the equipment frame 1 and includes a control module, and the control panel 2 can serve as a control center and a power supply center for the entire batch cleaning device.

[0053] Among them, Figure 2 As shown, each of the supporting plates 3 is internally provided with: an electric heating resistor 31, which is connected to the control module circuit and can be controlled by the control module to generate heat to heat the supporting plate 3; a temperature sensor 32, which is located above the electric heating resistor 31 and is connected to the control module circuit, and is used to detect the temperature of the supporting plate 3 and transmit it to the control module, so that the control module can monitor the heating of the supporting plate 3.

[0054] Specifically, when the carrier plate 3 is heated, the temperature sensor 32 can transmit its current temperature to the control module in real time. When the temperature of the carrier plate 3 reaches a set temperature threshold, the control module controls the electric heating resistor 31 to stop heating.

[0055] A temperature control indicator light 11 is provided on the outer wall of the equipment frame 1 and opposite to the control panel 2. The temperature control indicator light 11 is connected to the control module circuit, and the control module further controls the temperature control indicator light 11 to light up or go out according to the received temperature signal transmitted by the temperature sensor 32, so as to display the heating status of the carrier plate 3 in real time.

[0056] Specifically, when the carrier plate 3 is heated, the control module controls the temperature control indicator light 11 to light up, indicating that the current carrier plate 3 is in a heating state; when the temperature of the carrier plate 3 reaches the set temperature threshold, the control module controls the electric heating resistor 31 to stop heating, and the control module also controls the temperature control indicator light 11 to go out, indicating that the current carrier plate 3 is in an unheated state.

[0057] Among them, the control panel 2 is also provided with various buttons, including temperature control buttons, vacuum buttons, ventilation buttons, and cleaning buttons. These buttons are all connected to the control module circuit to set temperature parameters (including temperature threshold and heating time, etc.), vacuum, medium gas input and cleaning for the batch cleaning device.

[0058] The upper surface of each carrier plate 3 is provided with: a plurality of clamping limit devices 5, which are distributed at intervals and fixed on the carrier plate 3, and a clamping limit space is formed between two adjacent clamping limit devices 5; a component clamping device 7, which is clamped between any two adjacent clamping limit devices 5, and is used to place components to be cleaned after tinning; and a plurality of plug-in interfaces 6, which are arranged between two adjacent clamping limit devices 5 to achieve plugging with the component clamping device 7 placed at this position. The plug-in interface 6 is connected to the control module circuit, so when the plug-in interface 6 is plugged with the component clamping device 7, the component clamping device 7 is powered on.

[0059] Since the present invention provides a batch cleaning device, a plurality of the component clamping devices 7 can be provided, and at most all the clamping and limiting spaces formed by two adjacent clamping and limiting devices 5 can be filled.

[0060] The plug-in interface 6 comprises a first power-on socket and a second power-on socket. The first power-on socket and the second power-on socket are arranged in sequence in the vertical direction, and the distance between the two power-on sockets can be adjusted by a sliding component. Preferably, the first power-on socket and the second power-on socket are both double-hole power-on sockets.

[0061] Specifically, the sliding assembly includes a first slide slot, a second slide slot and a fastening screw. The first power socket is arranged in the first slide slot, and the second power socket is arranged in the second slide slot. The relative distance between the first power socket and the second power socket can be changed by moving the positions of the first power socket and the second power socket in the first slide slot and the second slide slot; when the distance between the two power sockets is adjusted to a desired value, the fastening screw is further used to lock and fix the distance.

[0062] In addition, a heat-conducting insulating layer 33 is laid on the upper surface of the carrier plate 3 and in the clamping and limiting spaces between all two adjacent clamping and limiting devices 5 to perform heat transfer and insulation on the component clamping devices 7 .

[0063] In a specific embodiment of the present invention, the thermally conductive insulating layer is an alumina ceramic plate with high thermal conductivity.

[0064] Preferably, the clamping and limiting device 5 is made of non-conductive, high-temperature resistant polytetrafluoroethylene material.

[0065] Among them, Figure 3 As shown, the component clamping device 7 is arranged in a keyboard grid shape, and the component clamping device 7 comprises: a base 75, a base slot is provided on the side of which, the base 75 serves as a bottom electrode to store / release energy on the one hand, and as a bottom support structure of the component clamping device 7 on the other hand; a component placement plate 73, located above the base 75 and fixedly clamped on the base slot, for supporting components to be cleaned; an upper cover plate 76, located above the component placement plate 73, serving as a top electrode to store / release energy on the one hand, and as an upper structure cover plate of the component clamping device 7 on the other hand; an adjustable bolt 74, arranged between the upper cover plate 76 and the base 75, for mounting the upper cover plate 76 on the base 75.

[0066] The component placement plate 73 is provided with a plurality of grooves 732 arranged regularly in a grid shape and matching the size of the components. Each groove 732 is used to place a component to be cleaned. The groove depth of the groove 732 is less than the thickness of the component. In this embodiment, the thickness of the component is 5 mm, and the groove depth of the groove 732 is 4 mm.

[0067] Preferably, the component placement plate 73 is made of an antistatic epoxy board.

[0068] The upper cover plate 76 is provided with a plurality of through slots 722 which are regularly arranged in a grid shape and match the size of the components and the size of the groove 732. The provision of the through slots 722 can make the plasma beam between the upper cover plate 76 and the base 75 denser when powered on, that is, the ion energy is more concentrated.

[0069] The side of the base 75 is provided with a first metal pin 711, and the side of the upper cover 76 on the same side as the base 75 is provided with a second metal pin 721, and the first metal pin 711 is located vertically below the second metal pin 721. The first metal pin 711 and the second metal pin 721 are respectively matched and plugged with the first power-on socket and the second power-on socket on the plug-in interface 6. Preferably, the first metal pin 711 and the second metal pin 721 are both double pins that match the double-hole power-on socket.

[0070] The adjustable bolt 74 is a height-adjustable bolt. By rotating the adjustable bolt 74, the distance between the upper cover plate 76 and the base 75 can be adjusted accordingly, so that the distance between the first metal pin 711 and the second metal pin 721 is also adjusted accordingly.

[0071] In a specific embodiment, the distance between the upper cover plate 76 and the base 75 needs to be adjusted according to the preset cleaning power to adjust the energy density during cleaning. Therefore, the distance between the first metal pin 711 and the second metal pin 721 changes with the change of the distance between the upper cover plate 76 and the base 75, and can be adjusted by adjusting the bolt 74; then the distance between the first power-on socket and the second power-on socket is adjusted by the aforementioned sliding assembly until it is consistent with the distance between the first metal pin 711 and the second metal pin 721. Then, the first metal pin 711 and the second metal pin 721 are inserted into the first power-on socket and the second power-on socket.

[0072] Preferably, the adjustable bolts 74 are arranged at four vertex positions of the component clamping device 7 .

[0073] Preferably, the adjustable bolt 74 is made of insulating material. In this embodiment, non-conductive polytetrafluoroethylene is used.

[0074] In a specific embodiment of the present invention, the distance between the upper cover plate 76 and the base 75 is 10 mm, the thickness of the components is 5 mm, and the pins of the components are placed upward and 5 mm away from the upper cover plate.

[0075] In a preferred embodiment of the present invention, the base 75 and the upper cover plate 76 are made of conductive aluminum alloy that is resistant to ionization corrosion.

[0076] The present invention also provides a method for using a batch cleaning device, comprising the following steps:

[0077] S1, placing multiple components 733 to be cleaned after tinning with their front faces facing downward and their pins facing upward in the grooves 732 of the component placement plate 73 (when there are a large number of components 733, they can be placed in the grooves of multiple component placement plates 73 according to the number of components 733);

[0078] S2, clamp the component placement plate 73 on the base clamping slot of the base 75, install the adjustable bolt 74, and then install the upper cover plate 76, and adjust the distance between the upper cover plate 76 and the base 75 by rotating a certain number of circles until it is consistent with the height corresponding to the set cleaning power;

[0079] S3, adjusting the distance between the first power socket and the second power socket to make it consistent with the distance between the first metal pin 711 and the second metal pin 721 on the base 75 and the upper cover 76;

[0080] S4, placing the assembled multiple component clamping devices 7 on the carrier board 3 respectively, fixing them by two adjacent clamping limit devices 5, and facing the plug-in interface 6 with the first metal pin 711 and the second metal pin 721, so that the pins are plugged into the power sockets in pairs;

[0081] S5, setting the use procedure of the batch cleaning device, including setting the heating temperature threshold and heating time of the carrier plate 3 through the temperature control button on the control panel 2, vacuuming through the vacuum button, then starting the ventilation button to introduce medium gas, and setting the plasma cleaning power and gas pressure and other related parameters through the cleaning button, and then starting the cleaning, and observing the heating state of the carrier plate 3 during cleaning through the control panel 2 and the temperature control indicator light 11;

[0082] In this embodiment, the heating temperature threshold is 120°C, the heating time is 150s, the gas used for cleaning is a mixture of hydrogen and argon, the gas flow rate is 350mL / min, the cleaning energy is 300W, and the cleaning time is 300s;

[0083] S6, after cleaning is completed, the component holding device 7 is taken out from the batch cleaning device, the adjustable bolts 74 between the upper cover plate 76 and the base 75 are removed, and the component placement plate 73 is taken out;

[0084] S7, removing the cleaned components from the component placement plate 73.

[0085] In summary, the present invention provides a batch cleaning device for components after tin plating and a method of use thereof, which creatively adopts a batch cleaning method with heating and plasma cleaning functions in one, which can help heat and activate residual flux, while reducing the adhesion of the flux and improving the plasma cleaning intensity. It can effectively remove residual flux and other adherent organic matter on components after tin plating, and has strong engineering practicality.

[0086] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the invention. After reading the above content, it will be obvious to those skilled in the art for various modifications and substitutions of the present invention. Therefore, the protection scope of the present invention should be limited by the attached claims.

Claims

1. A batch cleaning device for components after tin plating, characterized in that: Include: An equipment frame (1) having a cleaning chamber formed therein; Fixed brackets (4) are respectively arranged on the inner walls of both sides of the equipment frame (1); A plurality of bearing plates (3) are located inside the equipment frame (1) and are layered and erected between the fixed brackets (4); A control panel (2) is arranged on the outer wall of the equipment frame (1) and provides power to the batch cleaning device; the control panel (2) comprises a control module; Wherein, each of the bearing plates (3) is provided with: A plurality of clamping and limiting devices (5) are arranged at intervals on the carrying plate (3), and a clamping and limiting space is formed between two adjacent clamping and limiting devices (5); The component clamping device (7) is clamped between any two adjacent clamping limit devices (5) and is used for placing components to be cleaned after tinning.

2. The batch cleaning device according to claim 1, characterized in that: The plate body of each of the supporting plates (3) comprises: An electric heating resistor (31) is connected to the control module circuit and can be controlled to generate heat through the control module to heat the carrier plate (3); A temperature sensor (32) is located above the electric heating resistance wire (31) and is connected to the control module circuit, and is used to detect and monitor the heating temperature of the carrier plate (3).

3. The batch cleaning device according to claim 2, characterized in that: The batch cleaning device further comprises a temperature control indicator light (11) which is arranged on the outer wall of the equipment frame (1); the temperature control indicator light (11) is connected to a control module circuit, and the control module can control the lighting or extinguishing of the temperature control indicator light (11) according to a temperature signal transmitted by a temperature sensor (32).

4. The batch cleaning device according to claim 1, characterized in that: Each of the supporting plates (3) further comprises: A plurality of plug-in interfaces (6) are arranged between two adjacent clamping and limiting devices (5) to achieve plugging with a component clamping device (7) placed at the position; The plug-in interface (6) is connected to the control module circuit; when the plug-in interface (6) is plugged into the component clamping device (7), the component clamping device (7) is powered on.

5. The batch cleaning device according to claim 4, characterized in that: The plug-in interface (6) comprises: a first powered jack and a second powered jack; The first power-on socket and the second power-on socket are arranged in sequence in a vertical direction, and the distance between the two power-on sockets can be adjusted by a sliding component.

6. The batch cleaning device according to claim 5, characterized in that: The component clamping device (7) comprises: A base (75) having a base slot on its side, the base (75) being used as a bottom electrode to store or release energy; A component placement plate (73) is located above the base (75) and is fixedly mounted on a base slot for supporting components to be cleaned; An upper cover plate (76), located above the component placement plate (73), serves as a top electrode to store or release energy; The adjustable bolt (74) is arranged between the upper cover plate (76) and the base (75) and is used to install the upper cover plate (76) on the base (75); and the adjustable bolt (74) can adjust the distance between the upper cover plate (76) and the base (75) according to the energy density required by the preset cleaning power.

7. The batch cleaning device according to claim 6, characterized in that: The component placement plate (73) is provided with a plurality of grooves (732) which are regularly arranged in a grid shape and match the size of the components, and each groove (732) is used to place a component to be cleaned; The depth of each groove (732) is less than the thickness of the component.

8. The batch cleaning device according to claim 7, characterized in that: The upper cover plate (76) is provided with a plurality of through slots (722) which are regularly arranged in a grid shape and match the size of the components and the size of the grooves (732).

9. The batch cleaning device according to claim 6, characterized in that: A first metal plug pin (711) is provided on a side of the base (75), and a second metal plug pin (721) is provided on a side of the upper cover plate (76) on the same side as the base (75), and the first metal plug pin (711) is located vertically below the second metal plug pin (721); The first metal plug pin (711) and the second metal plug pin (721) are respectively matched and plugged with the first power-on plug socket and the second power-on plug socket on the plug-in interface (6).

10. A method for using a batch cleaning device, implemented based on the batch cleaning device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, placing a plurality of components (733) to be cleaned after tinning in grooves (732) of one or more component placement plates (73); S2, installing the component placement plate (73) on the base (75), installing the adjustable bolts (74), and then installing the upper cover plate (76), and adjusting the distance between the upper cover plate (76) and the base (75) by rotating a certain number of circles until the distance is consistent with the height corresponding to the set cleaning power; S3, adjusting the distance between the first power-on socket and the second power-on socket so that the distance is consistent with the distance between the first metal plug pin (711) and the second metal plug pin (721) on the base (75) and the upper cover (76); S4, placing the assembled plurality of component clamping devices (7) on the carrier plate (3) respectively, fixing them by two adjacent clamping limit devices (5), and aligning the side with the first metal plug pin (711) and the second metal plug pin (721) toward the plug-in interface (6), so that the plug pins are plugged into the power-on sockets in pairs; S5, setting the heating temperature and time of the batch cleaning device, setting the plasma cleaning power and time, performing vacuuming and introducing the medium gas, and starting cleaning; S6, after cleaning is completed, taking out the component holding device (7) from the batch cleaning device, and then taking out the component placement plate (73); S7, remove the cleaned components from the component placement plate (73).

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