Polyphenylene sulfide composite material for capacitor shell and preparation method of polyphenylene sulfide composite material

Abstract

The invention provides a polyphenylene sulfide composite material for a capacitor shell and a preparation method thereof, the polyphenylene sulfide composite material comprises the following raw materials by weight: 100 parts of polyphenylene sulfide, 10-20 parts of bisphenol A type solid epoxy resin, 5-8 parts of a flexibilizer, and 60-100 parts of a phenyl silane coupling agent modified filler, the flexibilizer is side chain type epoxy polysiloxane with an epoxy group on a side chain, the epoxy resin is prepared from methyl hydrogen silicone oil and allyl glycidyl ether through a hydrosilylation reaction, the epoxy value is 0.15-0.25, and the viscosity at 25 DEG C is 50-120 mpa.s. Side chain type epoxy polysiloxane with relatively high heat resistance is adopted as a toughening agent, so that the problems that a conventional toughening agent is poor in high-temperature durability and the strength is obviously reduced are solved; meanwhile, phenyl silane coupling agent modified filler and bisphenol A type solid epoxy resin are matched for use, so that the polyphenylene sulfide composite material for the capacitor shell, which has high-temperature durability, good bonding performance with epoxy pouring sealant and excellent toughness, is obtained.

Description

Technical Field

[0001] The invention belongs to the technical field of polyphenylene sulfide composite materials, and in particular relates to a polyphenylene sulfide composite material for a capacitor shell and a preparation method thereof. Background Art

[0002] Polyphenylene sulfide (PPS) is a polymer with a rigid main chain structure composed of benzene rings and sulfur atoms. It is crystalline and has not only excellent mechanical properties, but also excellent flame retardancy, insulation resistance, thermal stability and chemical corrosion resistance. It is widely used in environmental protection, automobiles, electronics and electrical, machinery, aerospace and other fields.

[0003] In recent years, high-reliability and high-temperature-resistant organic film capacitors have developed rapidly, requiring small size, the ability to withstand higher frequencies and ambient temperatures, and small distributed inductance. Since PPS film capacitors have many properties superior to other dielectric capacitors, such as the electrical, physical, and chemical properties of PP, PC, PET and other capacitors, they are mainly manifested in their high temperature resistance, low loss tangent value, good insulation resistance, and high breakdown field strength. In particular, the temperature and frequency characteristics of PPS film are superior to those of general dielectric film capacitors. Polyphenylene sulfide film capacitors have gradually become the preferred product in the field of high-temperature, high-stability, and high-precision organic capacitors, especially in the field of high-reliability aerospace systems.

[0004] Although PPS film capacitors have many advantages, they also have disadvantages such as poor adhesion to the epoxy insulation sealant of the capacitor. Researchers have conducted a lot of research and improvement. For example, patent CN114085526B discloses a polyphenylene sulfide composition and its preparation method and application. The polyphenylene sulfide composition includes components: 25-70 parts of polyphenylene sulfide; 20-55 parts of glass fiber; 5-40 parts of filler; 0.1-1 parts of nucleating agent; 0.5-5 parts of epoxy modifier; 2-6 parts of toughening agent; wherein the weight ratio of the glass fiber to the filler is ≥0.7. Patent CN116218217B discloses a polyphenylene sulfide composite material for capacitor packaging shell and a preparation method thereof. The PPS composite material includes the following components in weight percentage: 30%-40% polyphenylene sulfide resin, whose mass flow rate is 200-350g / 10min; 35%-45% alkali-free short glass fiber; 10%-20% calcium carbonate; 3%-6% bisphenol A type solid epoxy resin; 1%-3% ethylene-methyl acrylate-methacrylate glycidyl terpolymer toughening agent; 0%-2% masterbatch; 0-0.5% lubricant; 0.1%-0.5% coupling agent.

[0005] The above technology adopts the method of doping epoxy resin in polyphenylene sulfide composite materials, which can improve the bonding strength of polyphenylene sulfide composite materials to epoxy potting glue. Because PPS itself is not tough enough, doping with rigid epoxy resin will further reduce the toughness, and it is easy to cause film products to break due to the winding step. Therefore, it is necessary to use toughening agents such as ethylene-methyl acrylate-methacrylate glycidyl terpolymer, nitrile rubber, butadiene rubber, styrene-ethylene / butylene-styrene block copolymer, etc., especially the use of ethylene-methyl acrylate-methacrylate glycidyl terpolymer can also improve the dispersion and compatibility of epoxy resin in composite materials. However, since polyphenylene sulfide film capacitors are often used in high-temperature occasions such as automobile engine compartments, high-temperature motor drives, high-temperature sensors, power converters, and power inverters with temperatures as high as 100-125°C, the toughening agent softens and even degrades when working continuously at this high temperature, causing stress concentration, and the strength of the film is significantly reduced, and even cracking occurs.

[0006] Therefore, it is necessary to develop a polyphenylene sulfide composite material for capacitor housing with high temperature durability, good bonding performance with epoxy potting adhesive, and excellent toughness to improve the overall stability and reliability of the capacitor. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides a polyphenylene sulfide composite material for capacitor casing and a preparation method thereof, adopting a side chain epoxy polysiloxane with high heat resistance as a toughening agent to solve the problems of poor high temperature durability and significantly reduced strength of conventional toughening agents, and at the same time, using a phenyl silane coupling agent modified filler and a bisphenol A type solid epoxy resin together to obtain a polyphenylene sulfide composite material for capacitor casing that has high temperature durability, good bonding performance with epoxy potting glue, and excellent toughness.

[0008] In order to achieve the above purpose, the following technical solutions are adopted:

[0009] A polyphenylene sulfide composite material for a capacitor shell comprises the following raw materials in parts by weight: 100 parts of polyphenylene sulfide, 10-20 parts of bisphenol A solid epoxy resin, 5-8 parts of a toughening agent, and 60-100 parts of a phenyl silane coupling agent modified filler. The toughening agent is a side chain epoxy polysiloxane having an epoxy group on the side chain, which is prepared by a silylation reaction between methyl hydrogen silicone oil and allyl glycidyl ether, has an epoxy value of 0.15-0.25, and a viscosity of 50-120 mPa·s at 25°C.

[0010] The phenylsilane coupling agent modified filler is formed by mixing a phenylsilane coupling agent modified granular inorganic filler and a phenylsilane coupling agent modified rod-shaped inorganic filler at a mass ratio of 1:1-1.5. The use of phenylsilane coupling agent modified fillers with a reasonable particle size and distribution of granular and rod-shaped fillers can increase the contact area between the filler and the matrix, thereby enhancing the interface bonding force and further improving the toughness of the material.

[0011] The rod-shaped inorganic filler has an average diameter of 1-20 μm and an aspect ratio of 5-20, and is selected from one or a combination of two or more of glass fiber, insulating potassium titanate whisker, and basalt fiber, preferably glass fiber.

[0012] The granular inorganic filler has an average particle size of 0.1-10 μm and is selected from one or a combination of two or more of mica, diatomaceous earth, silica lime, talc, montmorillonite, kaolin, silicon dioxide, glass microspheres, calcium carbonate, barium sulfate, and titanium dioxide.

[0013] The phenylsilane coupling agent is selected from one or a combination of two or more of 3-phenylpropylmethyldimethoxysilane, 4-phenylbutyltrimethoxysilane, triethoxy(2-phenylpropyl)silane, trimethoxy(2-phenylethyl)silane, 3-phenylpropyldimethylmethoxysilane, and methylbis(ethoxy)(2-phenylpropyl)silane.

[0014] The present invention adopts side chain epoxy polysiloxane with high heat resistance as a toughening agent, which solves the problem of poor high temperature durability and significantly reduced strength of conventional toughening agents. However, it is found that the bonding performance between the composite material and the epoxy potting adhesive is not improved by the side chain epoxy polysiloxane. Therefore, the inventors successfully solved the bonding performance problem by modifying inorganic fillers such as glass fibers using phenyl silane coupling agents.

[0015] It is speculated that the bond energy, bond length and bond angle of the silicon-oxygen bond of the side chain epoxy polysiloxane are relatively large, and it has high flexibility. Its molecular chain is easier to bend and deform than the molecular chains of toughening agents such as ethylene-methyl acrylate-methacrylate glycidyl terpolymer, nitrile rubber, butadiene rubber, styrene-ethylene / butylene-styrene block copolymer, etc. When the composite material system contains a large amount of inorganic fillers such as glass fiber, the side chain epoxy polysiloxane is concentrated and dispersed around the inorganic fillers such as glass fiber with surface polarity, thereby affecting the dispersibility of the epoxy resin. The surface polar groups of inorganic fillers such as glass fiber modified by phenyl silane coupling agent are reduced, and their adaptability to side chain epoxy polysiloxane is improved.

[0016] There is no particular limitation on the preparation method of the phenylsilane coupling agent modified filler, and any method commonly used in the art may be used. Specifically, the method may include: preparing a treatment liquid of a phenylsilane coupling agent and water, adding an inorganic filler, heating to react, filtering after the reaction, washing, and drying to obtain the phenylsilane coupling agent modified inorganic filler.

[0017] The concentration of the phenylsilane coupling agent in the treatment liquid is 1-3wt%, the mass ratio of the inorganic filler to the treatment liquid is 1:10-12, the temperature is raised to 60-80°C, the reaction time is 1-3h, and the washing is 1-3 times of washing with ethanol.

[0018] The epoxy equivalent of the bisphenol A type solid epoxy resin is 2000-4000 g / eq.

[0019] The weight average molecular weight of the polyphenylene sulfide is 40,000-60,000.

[0020] The present invention also provides a method for preparing the polyphenylene sulfide composite material for capacitor housing, comprising the following steps:

[0021] Polyphenylene sulfide, bisphenol A type solid epoxy resin, toughening agent and phenyl silane coupling agent modified filler are uniformly mixed, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for a capacitor shell.

[0022] The extrusion granulation conditions are: zone 11 temperatures: 230-150°C, 250-260°C, 260-270°C, 270-280°C, 280-290°C, 290-300, 300-310°C, 300-310°C, 300-310°C, 300-310°C, 300-310°C, 300-310°C, die head temperature 310-320°C, screw diameter 30-65mm, aspect ratio 25-42:1, screw speed 250-350rpm.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The invention adopts side chain epoxy polysiloxane with high heat resistance as toughening agent to solve the problems of poor high temperature durability and significantly reduced strength of conventional toughening agents. At the same time, it is used together with phenyl silane coupling agent modified filler and bisphenol A type solid epoxy resin to obtain a polyphenylene sulfide composite material for capacitor shell which has high temperature durability, good bonding performance with epoxy potting glue and excellent toughness. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with specific embodiments, but is not limited to the contents of the specification. Unless otherwise specified, the "parts" described in the embodiments of the present invention are all parts by weight. The reagents used are all commercially available reagents in the art.

[0026] Linear polyphenylene sulfide was purchased from Jiangxi Juzhen Technology Development Co., Ltd. with a weight average molecular weight of 56,000.

[0027] The chopped alkali-free glass fiber was purchased from Xuanyue Technology New Materials Co., Ltd. with an average diameter of 11 μm and a length of 0.15 mm.

[0028] Ultrafine talc powder was purchased from Qingdao Shengyida Talc Powder Co., Ltd., with an average particle size of 1000 mesh.

[0029] The side chain epoxy polysiloxane was purchased from Anhui IOTA Silicone Oil Co., Ltd. IOTA105-2-0.15 has an epoxy value of 0.15 and a viscosity of 61.5 mpas; IOTA105-2-0.25 has an epoxy value of 0.25 and a viscosity of 92.1 mpas.

[0030] E-03 bisphenol A solid epoxy resin was purchased from Dow Chemical, and the epoxy equivalent weight was 3300 g / eq.

[0031] Example 1

[0032] 1) Trimethoxy (2-phenylethyl) silane and water were mixed evenly to prepare a treatment solution I with a concentration of 3 wt %. 100 g of ultrafine talc was added to 1 kg of the treatment solution I, and the temperature was raised to 80° C. to react for 3 h. After the reaction was completed, the mixture was filtered, washed with ethanol for 3 times, and dried at 100° C. to constant weight to obtain ultrafine talc modified with a phenylsilane coupling agent.

[0033] 2) Trimethoxy (2-phenylethyl) silane and water were mixed evenly to prepare a treatment solution II with a concentration of 1 wt%, 100 g of short-cut alkali-free glass fiber was added to 1.2 kg of treatment solution II, and the temperature was raised to 80 ° C for reaction for 2 h. After the reaction was completed, it was filtered, washed with ethanol for 3 times, and dried at 100 ° C to constant weight to obtain phenyl silane coupling agent modified short-cut alkali-free glass fiber.

[0034] 3) 100 g of polyphenylene sulfide, 20 g of E-03 bisphenol A type solid epoxy resin, 8 g of side chain epoxy polysiloxane IOTA105-2-0.15, 50 g of ultrafine talc modified by phenyl silane coupling agent obtained in step 1), and 50 g of chopped alkali-free glass fiber modified by phenyl silane coupling agent obtained in step 2) are mixed uniformly in a high-speed mixer, and then extruded and granulated, cooled and dried to obtain a polyphenylene sulfide composite material for a capacitor housing;

[0035] The extrusion granulation conditions are: temperatures in zones 1-11: 245°C, 255°C, 265°C, 275°C, 285°C, 295°C, 300°C, 300°C, 300°C, 300°C, 300°C, the die temperature is 310°C, the screw diameter is 65mm, the aspect ratio is 40:1, and the screw speed is 350rpm.

[0036] Example 2

[0037] The rest is the same as Example 1, except that in step 3), the amount of side chain epoxy polysiloxane IOTA105-2-0.15 used is 5 g.

[0038] Example 3

[0039] The rest is the same as Example 1, except that in step 1), an equal amount of 3-phenylpropylmethyldimethoxysilane is used to replace trimethoxy(2-phenylethyl)silane.

[0040] Example 4

[0041] 1) Prepare a treatment solution with a concentration of 1 wt% of trimethoxy (2-phenylethyl) silane and water, add 100 g of ultrafine talc, heat to 80° C. and react for 3 h. After the reaction is completed, filter, wash with ethanol 3 times, and dry at 100° C. to constant weight to obtain ultrafine talc modified with a phenylsilane coupling agent.

[0042] 2) Prepare a treatment solution with a concentration of 3 wt% of trimethoxy (2-phenylethyl) silane and water, add 100 g of chopped alkali-free glass fiber, heat to 80° C. to react for 2 h, filter after the reaction, wash with ethanol 3 times, and dry at 100° C. to constant weight to obtain phenylsilane coupling agent modified chopped alkali-free glass fiber.

[0043] 3) 100 g of polyphenylene sulfide, 20 g of E-03 bisphenol A type solid epoxy resin, 8 g of side chain epoxy polysiloxane IOTA105-2-0.25, 50 g of ultrafine talc modified by phenyl silane coupling agent obtained in step 1), and 50 g of chopped alkali-free glass fiber modified by phenyl silane coupling agent obtained in step 2) are mixed uniformly in a high-speed mixer, and then extruded and granulated, cooled and dried to obtain a polyphenylene sulfide composite material for a capacitor housing;

[0044] The extrusion granulation conditions are: temperatures in zones 1-11: 245°C, 255°C, 265°C, 275°C, 285°C, 295°C, 300°C, 300°C, 300°C, 300°C, 300°C, the die temperature is 310°C, the screw diameter is 65mm, the aspect ratio is 40:1, and the screw speed is 350rpm.

[0045] Example 5

[0046] The rest is the same as Example 1, except that, in step 3), 100 g of polyphenylene sulfide, 20 g of E-03 bisphenol A type solid epoxy resin, 8 g of side chain epoxy polysiloxane IOTA105-2-0.15, 40 g of ultrafine talc modified by phenyl silane coupling agent obtained in step 1), and 60 g of chopped alkali-free glass fiber modified by phenyl silane coupling agent obtained in step 2) are mixed uniformly in a high-speed mixer, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for capacitor housing.

[0047] Example 6

[0048] The rest is the same as Example 1, except that, in step 3), 100g of polyphenylene sulfide, 10g of E-03 bisphenol A type solid epoxy resin, 8g of side chain epoxy polysiloxane IOTA105-2-0.15, 30g of ultrafine talc modified by phenyl silane coupling agent obtained in step 1), and 30g of chopped alkali-free glass fiber modified by phenyl silane coupling agent obtained in step 2) are mixed uniformly in a high-speed mixer, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for capacitor housing.

[0049] Example 7

[0050] The rest is the same as Example 1, except that, in step 3), 100 g of polyphenylene sulfide, 20 g of E-03 bisphenol A type solid epoxy resin, 8 g of side chain epoxy polysiloxane IOTA105-2-0.15, and 100 g of phenyl silane coupling agent modified ultrafine talc obtained in step 1) are mixed uniformly in a high-speed mixer, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for a capacitor shell.

[0051] Example 8

[0052] The rest is the same as Example 1, except that, in step 3), 100 g of polyphenylene sulfide, 20 g of E-03 bisphenol A type solid epoxy resin, 8 g of side chain epoxy polysiloxane IOTA105-2-0.15, and 100 g of phenyl silane coupling agent modified chopped alkali-free glass fiber obtained in step 2) are mixed evenly in a high-speed mixer, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for capacitor housing.

[0053] Comparative Example 1

[0054] The rest is the same as Example 1, except that in step 3), the amount of side chain epoxy polysiloxane IOTA105-2-0.15 used is 3 g.

[0055] Comparative Example 2

[0056] The rest is the same as Example 1, except that in step 3), the amount of side chain epoxy polysiloxane IOTA105-2-0.15 used is 10 g.

[0057] Comparative Example 3

[0058] 100g of polyphenylene sulfide, 20g of E-03 bisphenol A type solid epoxy resin, 8g of side chain epoxy polysiloxane IOTA105-2-0.15, 50g of ultrafine talc powder, and 50g of short-cut alkali-free glass fiber are mixed uniformly in a high-speed mixer, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for a capacitor shell;

[0059] The extrusion granulation conditions are: temperatures in zones 1-11: 245°C, 255°C, 265°C, 275°C, 285°C, 295°C, 300°C, 300°C, 300°C, 300°C, 300°C, the die temperature is 310°C, the screw diameter is 65mm, the aspect ratio is 40:1, and the screw speed is 350rpm.

[0060] Comparative Example 4

[0061] The rest is the same as Example 1, except that an equal amount of 3-aminopropyltrimethoxysilane is used to replace trimethoxy(2-phenylethyl)silane.

[0062] Comparative Example 5

[0063] The rest is the same as Example 1, except that the side chain epoxy polysiloxane IOTA105-2-0.15 is replaced by an equal mass of DuPont Elvaloy PTW from the United States.

[0064] The composite materials prepared in the above examples and comparative examples were subjected to the following performance tests:

[0065] Tensile strength: The tensile strength was tested according to ISO 527 Plastics - Determination of tensile properties.

[0066] High temperature durability: refer to the standard GBT 7141-2008 to carry out heat aging in a heat aging oven. The heat aging conditions are 125°C and 1000h. Re-measure the above tensile strength and calculate the strength loss rate.

[0067] Bonding strength test with epoxy potting glue: injection molding 170mm*10mm*4mm polyphenylene sulfide composite material sheet, evenly apply Loctite epoxy resin AB glue EA E-60NC on one end of the sheet, the coating area is 30mm*10mm, thickness is 7mm, cover another sheet in the same position, cure at 25℃ in a constant temperature box for 60min, and test the tensile strength with XLW-1 intelligent electronic tensile testing machine.

[0068] Impact strength: The impact performance test is carried out according to the method in ISO 179-1 Plastics - Determination of simply supported beam impact strength (C-notch).

[0069] Table 1 Performance test results

[0070]

[0071]

[0072] It can be seen from the performance test results in Table 1 that the polyphenylene sulfide composite material prepared by the present invention has good toughness and excellent bonding performance with epoxy resin, can work continuously at high temperature, and is suitable as a capacitor shell material.

[0073] From the performance test results of Example 1 and Comparative Example 5, it can be seen that the use of side chain epoxy polysiloxane instead of conventional ethylene-methyl acrylate-glycidyl methacrylate terpolymer has a significant effect of improving the high temperature durability of the composite material.

[0074] From the changes in strength and bonding strength from Comparative Examples 3 and 4 to Example 1, it can be seen that the bonding strength and mechanical strength of the composite materials gradually increase as the filler is modified from unmodified, aminosilane coupling agent modified to phenylsilane coupling agent modified, indicating that the epoxy resin and the composite material system gradually adapt to each other with the modification.

[0075] The above detailed description is a specific description of one feasible embodiment of the present invention. The embodiment is not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not deviate from the present invention should be included in the scope of the technical solution of the present invention.

Claims

1. A polyphenylene sulfide composite material for capacitor housing, characterized in that: The invention comprises the following raw materials in parts by weight: 100 parts of polyphenylene sulfide, 10-20 parts of bisphenol A solid epoxy resin, 5-8 parts of toughening agent, and 60-100 parts of phenyl silane coupling agent modified filler. The toughening agent is a side chain epoxy polysiloxane having an epoxy group on the side chain, which is prepared by a silylation reaction between methyl hydrogen silicone oil and allyl glycidyl ether, has an epoxy value of 0.15-0.25, and a viscosity of 50-120 mpa·s at 25°C.

2. The polyphenylene sulfide composite material for capacitor housing according to claim 1, characterized in that: The phenylsilane coupling agent modified filler is prepared by mixing a phenylsilane coupling agent modified granular inorganic filler and a phenylsilane coupling agent modified rod-shaped inorganic filler in a mass ratio of 1:1-1.

5.

3. The polyphenylene sulfide composite material for capacitor housing according to claim 2, characterized in that: The rod-shaped inorganic filler has an average diameter of 1-20 μm and an aspect ratio of 5-20, and is selected from one or a combination of two or more of glass fiber, insulating potassium titanate whisker, and basalt fiber, preferably glass fiber.

4. The polyphenylene sulfide composite material for capacitor housing according to claim 2, characterized in that: The granular inorganic filler has an average particle size of 0.1-10 μm and is selected from one or a combination of two or more of mica, diatomaceous earth, silica lime, talc, montmorillonite, kaolin, silicon dioxide, glass microspheres, calcium carbonate, barium sulfate, and titanium dioxide.

5. The polyphenylene sulfide composite material for capacitor housing according to claim 2, characterized in that: The phenylsilane coupling agent is selected from one or a combination of two or more of 3-phenylpropylmethyldimethoxysilane, 4-phenylbutyltrimethoxysilane, triethoxy(2-phenylpropyl)silane, trimethoxy(2-phenylethyl)silane, 3-phenylpropyldimethylmethoxysilane, and methylbis(ethoxy)(2-phenylpropyl)silane.

6. The polyphenylene sulfide composite material for capacitor housing according to claim 2, characterized in that: The preparation method of the phenylsilane coupling agent modified filler comprises the following steps: preparing a treatment liquid of a phenylsilane coupling agent and water, adding an inorganic filler, heating to react, filtering after the reaction, washing, and drying to obtain the phenylsilane coupling agent modified inorganic filler.

7. The polyphenylene sulfide composite material for capacitor housing according to claim 6, characterized in that: The concentration of the phenylsilane coupling agent in the treatment liquid is 1-3wt%, the mass ratio of the inorganic filler to the treatment liquid is 1:10-12, the temperature is raised to 60-80°C, the reaction time is 1-3h, and the washing is 1-3 times of washing with ethanol.

8. The polyphenylene sulfide composite material for capacitor housing according to claim 1, characterized in that: The epoxy equivalent of the bisphenol A type solid epoxy resin is 2000-4000 g / eq; the weight average molecular weight of the polyphenylene sulfide is 40,000-60,000.

9. The method for preparing the polyphenylene sulfide composite material for capacitor housing according to any one of claims 1 to 8, characterized in that: The steps include: Polyphenylene sulfide, bisphenol A solid epoxy resin, toughening agent and phenyl silane coupling agent modified filler are uniformly mixed, and then extruded into granules, cooled and dried to obtain a polyphenylene sulfide composite material for a capacitor shell.

10. The method for preparing the polyphenylene sulfide composite material for capacitor housing according to claim 9, characterized in that: The extrusion granulation conditions are as follows: Zone 11 temperature: 230-150°C, 250-260°C, 260-270°C, 270-280°C, 280-290°C, 290-300, 300-310℃, 300-310℃, 300-310℃, 300-310℃, 300-310℃, 300-310℃, die temperature 310-320℃, The screw diameter is 30-65mm, the aspect ratio is 25-42:1, and the screw speed is 250-350rpm.

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