Detachable boat page and graphite boat

Abstract

The invention relates to tubular coating equipment, and provides a detachable boat page and a graphite boat, the boat page comprises a first boat page body and a second boat page body, the first boat page body is provided with a plurality of mounting hole sites at intervals in the length direction, and the mounting hole sites penetrate through the first boat page body; the second boat page body is detachably arranged in the mounting hole position, the top surface of the second boat page body is lower than the top surface of the first boat page body, and the top surface of the second boat page body is suitable for placing a silicon wafer, so that the bottom of the silicon wafer is relatively positioned between the top surface of the second boat page body and the top surface of the first boat page body. The second boat page body is detachably mounted in the mounting hole position of the first boat page body, so that when the boat page is cleaned, the whole first boat page body does not need to be dismounted and cleaned, and only the second boat page body needs to be taken down from the first boat page body to be cleaned; the bottom surface of the silicon wafer is relatively located in the mounting hole position, thereby reducing the winding plating risk of the bottom surface of the silicon wafer, and reducing the subsequent grinding process of the bottom surface of the silicon wafer.

Description

Technical Field

[0001] The invention relates to the field of tubular coating equipment, and further to a detachable boat leaf and a graphite boat. Background Art

[0002] Tubular coating equipment is a kind of process equipment widely used in the manufacture of crystalline silicon photovoltaic cells. Graphite boat is a silicon wafer carrier used in conjunction with tubular coating equipment. At present, the horizontal wafer carrier graphite boat used in production has two structural defects:

[0003] 1. When silicon nitride is coated on the surface of silicon wafers, the graphite boat as a carrier will inevitably deposit silicon nitride film. When the film thickness accumulates to a certain extent, it will affect the coating effect of the silicon wafer. First, the residual silicon nitride will affect the electrical and thermal conductivity of the graphite boat. Poor electrical conductivity will cause problems such as uneven potential and disordered electric field distribution between the plates during the coating process of the silicon wafer, thereby affecting the uniformity and quality of the silicon nitride coating; poor thermal conductivity will cause unstable temperature control of the silicon wafer during the coating process, deviations in the kinetic energy and deposition concentration of the plasma, and thus affect the structure and performance of the silicon nitride coating. Secondly, the accumulation of silicon nitride film thickness on the surface of the graphite boat carrier will lead to changes in the electric field strength between the plates, thereby affecting the coating speed and film thickness. When the silicon nitride deposited on the surface of the graphite boat is thicker, the electric field strength between the plates is high and the coating speed is fast. In particular, the contact between the silicon wafer and the graphite boat page makes it easier for the silicon wafer to deposit thicker silicon nitride, resulting in a thicker film on the silicon wafer, and the color of the silicon wafer is white, which does not meet the quality standards. Therefore, in order to improve the coating efficiency and yield, the graphite boat must be disassembled and cleaned when it reaches the limit of use (120 times / boat). The boat is thin, long and fragile, making it inconvenient to clean. It requires frequent cleaning (equipment that runs 24 hours a day needs to be cleaned about once every 3-4 days) and the cleaning cycle is long. In addition, disassembly and assembly are time-consuming, labor-intensive and labor-intensive, resulting in low production efficiency.

[0004] 2. The existing horizontal wafer-carrying graphite boat adopts a square groove on the boat page, and the silicon wafer is placed flat in the square groove. The top surface of the silicon wafer is higher than the boat page where the whole is located. The bottom of the square groove is penetrated with fine holes to unload the airflow at the bottom of the silicon wafer. Although it solves the problem that the air pressure above the silicon wafer drops quickly to the process pressure (usually between 1700-1800mtorr) when vacuuming to a certain extent, there is still gas in the lower part of the silicon wafer without a channel to be quickly discharged, forming an upper and lower pressure difference, resulting in abnormal conditions such as silicon wafer flying, falling off, and moving, but due to some special reasons such as the graphite boat bumps are not on the same water side wall, the silicon wafer material itself has defects, the process temperature and pressure control is improper, etc., causing the silicon wafer to break in the boat, the reserved leakage hole is completely exposed between the upper and lower anode plates, and the electromagnetic field can easily affect the existing magnetic field through the through hole, resulting in abnormal glow discharge, process failure, and even serious damage to the graphite boat. Summary of the invention

[0005] In view of the above technical problems, the purpose of the present invention is to provide a detachable boat page and a graphite boat, wherein the second boat page body can be detachably installed in the installation hole of the first boat page body. When cleaning the boat page, there is no need to disassemble the entire boat page body for cleaning. Only the second boat page body needs to be taken out for cleaning, which can solve the problems of low production efficiency caused by frequent boat washing and long cycles, and time-consuming, labor-intensive and labor-intensive disassembly and assembly of the boat. The bottom surface of the silicon wafer is placed inside and between the top surface of the first boat page body and the top surface of the second boat page body to avoid silicon nitride film coating on the bottom surface of the silicon wafer, reduce the risk of bypass plating on the bottom surface of the silicon wafer, and reduce the subsequent grinding process of the bottom surface of the silicon wafer.

[0006] In order to achieve the above-mentioned object, the present invention provides a detachable boat leaf, comprising a first boat leaf body and a second boat leaf body, wherein the first boat leaf body is suitable for horizontal placement and a plurality of installation holes are provided at intervals in the length direction of the first boat leaf body, and the installation holes penetrate the first boat leaf body;

[0007] The second boat page body is detachably disposed in the mounting hole, the top surface of the second boat page body is lower than the top surface of the first boat page body, the top surface of the second boat page body is suitable for placing a silicon wafer, so that the bottom of the silicon wafer is relatively located between the top surface of the second boat page body and the top surface of the first boat page body, and the bottom surface of the second boat page body is flush with the bottom surface of the first boat page body.

[0008] In some embodiments, the mounting hole includes a first mounting slot and a second mounting slot, the slot of the first mounting slot is arranged on the top surface of the first boat page body, the slot of the second mounting slot is arranged on the bottom of the first mounting slot and the second mounting slot passes through the bottom surface of the first boat page body, and the slot of the second mounting slot is smaller than the slot of the first mounting slot;

[0009] The second boat page body includes a first mounting portion and a second mounting portion, the first mounting portion is suitable for being placed in the first mounting groove and the bottom of the first mounting portion is abutted against the bottom of the first mounting groove, the top surface of the first mounting portion is lower than the top surface of the first boat page body, and the second mounting portion is suitable for being placed in the second mounting groove and the bottom surface of the second mounting portion is flush with the bottom surface of the first boat page body.

[0010] In some embodiments, the second boat page body is further provided with a plurality of assembly holes, the assembly holes are suitable for installing bumps, the bumps are suitable for placing the silicon wafer, and the highest point of the bumps is higher than the top surface of the second boat page body and lower than the top surface of the first boat page body.

[0011] In some embodiments, the distance between the highest point of the protrusion and the top surface of the first boat page body is not less than the thickness of the silicon wafer, so that the top surface of the silicon wafer does not exceed the top surface of the first boat page body.

[0012] In some embodiments, the distance between the highest point of the protrusion and the top surface of the first boat page body is equal to the thickness of the silicon wafer, so that the top surface of the silicon wafer is flush with the top surface of the first boat page body.

[0013] In some embodiments, the distance between the top surface of the second boat page body and the top surface of the first boat page body is 0.3 mm, and the distance between the highest point of the protrusion and the top surface of the first boat page body is 0.1 mm.

[0014] In some embodiments, a plurality of unloading blind holes are further provided on the top surface of the first boat page body, and the unloading blind holes are arranged at the edges of the mounting holes. The unloading blind holes connect the top surface of the first boat page body and the top surface of the second boat page body, so that the airflow between the top surface of the second boat page body and the bottom surface of the silicon wafer is suitable for flowing out through the unloading blind holes.

[0015] In some embodiments, the unloading blind hole is located at the four corners of the mounting hole, the top of the unloading blind hole is located on the top surface of the first boat page body, the unloading blind hole does not penetrate the first boat page body and the bottom of the unloading blind hole is located at the bottom of the first mounting groove of the mounting hole.

[0016] In some embodiments, the unloading blind hole is a three-quarter arc, the four corners of the silicon wafer are relatively located at the center of the unloading blind hole, and the inner side wall of the unloading blind hole is vertically arranged.

[0017] According to another aspect of the present application, a graphite boat is further provided, comprising any one of the above preferred embodiments of the detachable boat page, a graphite connecting block and a ceramic rod, wherein a plurality of the detachable boat pages are arranged in sequence in a vertical direction;

[0018] The graphite connection blocks are arranged at both ends of the first boat leaf body of the detachable boat leaf in the horizontal direction;

[0019] The ceramic rods vertically penetrate and connect a plurality of the first boat leaf bodies, and ceramic rings are sleeved on the ceramic rods between adjacent first boat leaf bodies.

[0020] Compared with the prior art, the detachable boat leaf and graphite boat provided by the present invention have at least one of the following beneficial effects:

[0021] 1. The second boat page body can be detachably installed in the mounting hole of the first boat page body. When cleaning the boat page, there is no need to disassemble the entire first boat page body for cleaning. You only need to remove the second boat page body from the first boat page body for cleaning. This can solve the problems of low production efficiency caused by frequent boat washing and long cycles, and time-consuming, labor-intensive and labor-intensive boat disassembly and assembly. The bottom surface of the silicon wafer is relatively located inside the mounting hole and between the top surface of the first boat page body and the top surface of the second boat page body, so as to avoid silicon nitride film coating on the bottom surface of the silicon wafer, reduce the risk of bypass plating on the bottom surface of the silicon wafer, and reduce the subsequent grinding process of the bottom surface of the silicon wafer.

[0022] 2. The highest point of the bump is higher than the top surface of the second boat page body and lower than the top surface of the first boat page body. The silicon wafer is suitable for being fixed above the bump and the bottom surface of the silicon wafer is located in the first mounting groove. The bottom surface of the silicon wafer is lower than the top surface of the first boat page body, which reduces the risk of coating on the bottom surface of the silicon wafer and avoids the problem of wrap-around plating on the bottom surface of the silicon wafer.

[0023] 3. The top surface of the silicon wafer is flush with the top surface of the first boat leaf body, and the airflow can pass through the top surface of the silicon wafer more evenly, so that it can be coated on the top surface of the silicon wafer more evenly, thereby improving the stability of the coating on the top surface of the silicon wafer and ensuring the coating efficiency of the top surface of the silicon wafer; at the same time, the side walls and bottom surface of the silicon wafer are both located in the first mounting groove, avoiding the risk of circumferential coating on the side walls and bottom surface of the silicon wafer, and avoiding the airflow directly blowing on the side walls of the silicon wafer to cause the silicon wafer to shake, thereby reducing the airflow entering the bottom surface of the silicon wafer.

[0024] 4. The unloading blind hole connects the top surface of the first boat page body and the top surface of the second boat page body, so that the airflow on the bottom surface of the silicon wafer can be discharged through the unloading blind hole, avoiding the pressure difference between the top and bottom surfaces of the silicon wafer, causing the silicon wafer to shake up and down or fly up.

[0025] 5. The unloading blind holes are arranged at the four corners of the first mounting groove, and the inner side walls of the unloading blind holes are arranged vertically, so that the redundant gas can only rise vertically, avoiding the airflow on the bottom surface of the silicon wafer to gather and generate vortices at the four corners of the first mounting groove, so that the airflow on the bottom surface of the silicon wafer can flow out through the unloading blind holes faster, thereby avoiding the pressure difference between the top and bottom of the silicon wafer and causing the flying wafer problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0027] Figure 1 This is the overall picture of the graphite boat;

[0028] Figure 2 is a cross-sectional view of a detachable boat leaf;

[0029] Figure 3 It is the electric field diagram of the detachable boat leaf;

[0030] Figure 4 It is the structural diagram of the first boat page body;

[0031] Figure 5 It is the structural diagram of the installation holes;

[0032] Figure 6 It is the structural diagram of the second boat page body;

[0033] Figure 7 It is a top view of the removable boat page;

[0034] Figure 8 It is an installation cross-sectional view of the first boat page body and the second boat page body.

[0035] Description of Figure Numbers:

[0036] The first boat leaf body 1, the mounting hole 11, the first mounting groove 111, the second mounting groove 112, the unloading blind hole 12, the second boat leaf body 2, the first mounting portion 21, the second mounting portion 22, the assembly hole 23, the bump 24, the graphite connecting block 3, the ceramic rod 4, and the silicon wafer 5. DETAILED DESCRIPTION

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0038] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0039] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0040] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance. It should be noted that the above embodiments can be freely combined as needed. The above are only preferred implementations of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be regarded as the scope of protection of the present invention.

[0042] refer to Figures 1 to 4 The present invention provides a detachable boat leaf, including a first boat leaf body 1 and a second boat leaf body 2. The first boat leaf body 1 is suitable for horizontal placement and has a plurality of installation holes 11 spaced apart in the length direction of the first boat leaf body 1, and the installation holes 11 penetrate the first boat leaf body 1; the second boat leaf body 2 is detachably arranged in the installation holes 11, the top surface of the second boat leaf body 2 is lower than the top surface of the first boat leaf body 1, the top surface of the second boat leaf body 2 is suitable for placing a silicon wafer 5, so that the bottom of the silicon wafer 5 is relatively located between the top surface of the second boat leaf body 2 and the top surface of the first boat leaf body 1, and the bottom surface of the second boat leaf body 2 is flush with the bottom surface of the first boat leaf body 1.

[0043] In this embodiment, the second boat page body 2 can be removably installed in the mounting hole 11 of the first boat page body 1. When cleaning the boat page, there is no need to disassemble the entire first boat page body 1 for cleaning. Only the second boat page body 2 needs to be removed from the first boat page body 1 for cleaning. This can solve the problems of low production efficiency caused by frequent boat washing and long cycles, and time-consuming, labor-intensive and labor-intensive disassembly and assembly of the boat. The bottom surface of the silicon wafer 5 is relatively located inside the mounting hole 11 and between the top surface of the first boat page body 1 and the top surface of the second boat page body 2, so as to avoid the silicon nitride film being plated on the bottom surface of the silicon wafer 5, reduce the risk of bypass plating on the bottom surface of the silicon wafer 5, and reduce the subsequent grinding process of the bottom surface of the silicon wafer 5.

[0044] Specifically, the first boat page body 1 is provided with mounting holes 11 at intervals in the length direction, and the mounting holes 11 are in the shape of a U-shaped U.S. character. The second boat page body 2 can be removably mounted in the mounting holes 11, and the top surface of the second boat page body 2 is suitable for placing the silicon wafer 5. When cleaning, it is only necessary to remove the second boat page body 2 from the first boat page body 1 and then clean it, without removing the entire first boat page body 1. It is worth noting that the main idea of ​​the present application is to clean the second boat page body 2 in the silicon wafer 5 deposition area to ensure that the electric field and magnetic field at the location of the silicon wafer 5 are consistent, so that the deposition rate on the silicon wafer 5 is consistent. The silicon nitride coating deposited at other positions of the first boat page body 1 does not affect the electric field and magnetic field above the second boat page body 2, so it does not need to be taken into account. Reference Figures 4 to 6 The mounting hole 11 includes a first mounting groove 111 and a second mounting groove 112, both of which are square. The notch of the first mounting groove 111 is arranged on the top surface of the first boat page body 1, and the first mounting groove 111 passes through the top surface of the first boat page body 1. The notch of the second mounting groove 112 is arranged at the bottom of the first mounting groove 111 and the second mounting groove 112 passes through the bottom surface of the first boat page body 1, and the notch of the second mounting groove 112 is smaller than the notch of the first mounting groove 111; the second boat page body 2 is a boss shape, and the second boat page body 2 includes a first mounting portion 21 and a second mounting portion 22. The first mounting portion 21 is suitable for being placed in the first mounting groove 111 and the bottom of the first mounting portion 21 is abutted against the bottom of the first mounting groove 111, the top surface of the first mounting portion 21 is lower than the top surface of the first boat page body 1, and the second mounting portion 22 is suitable for being placed in the second mounting groove 112 and the bottom surface of the second mounting portion 22 is flush with the bottom surface of the first boat page body 1. The placement method of the mounting hole 11 is simple and fast, which improves the efficiency of disassembly and installation of the second boat page body 2, thereby reducing the cleaning time of the second boat page body 2. The top surface of the second boat page body 2 is suitable for placing the silicon wafer 5, and the top surface of the silicon wafer 5 and the surrounding small area form a deposition domain. After the second boat page body 2 is conveniently installed and disassembled and efficiently and quickly cleaned, the deposition rate above the second boat page body 2 is kept consistent, making the coating speed and film thickness of the silicon wafer 5 more uniform. Moreover, when the silicon wafer 5 is placed on the second boat page body 2, the bottom surface of the silicon wafer 5 is located inside the mounting hole 11 and relatively located below the top surface of the first boat page body 1, avoiding the airflow from directly reaching the bottom surface of the silicon wafer 5, reducing the probability of plating around the bottom surface of the silicon wafer 5, and the size of the first placement groove is consistent with the size of the silicon wafer 5, which also avoids the airflow from blowing away the silicon wafer 5, reducing the risk of flying silicon wafers 5.

[0045] It is worth noting that the side walls of the mounting hole 11 include a first side wall, a second side wall and a third side wall. The first side wall is perpendicular to the top surface of the first boat page body 1, the second side wall is parallel to the top surface of the first boat page body 1, the third side wall is perpendicular to the bottom surface of the first boat page body 1, and the second side wall connects the bottom of the first side wall and the top of the second side wall.

[0046] Further, refer to Figure 6 and Figure 7 The second boat page body 2 is also provided with a plurality of assembly holes 23, the assembly holes 23 are suitable for installing bumps 24, the bumps 24 are suitable for placing silicon wafers 5, and the highest point of the bumps 24 is higher than the top surface of the second boat page body 2 and lower than the top surface of the first boat page body 1.

[0047] In this embodiment, the highest point of the protrusion 24 is higher than the top surface of the second boat page body 2 and lower than the top surface of the first boat page body 1. The silicon wafer 5 is suitable for being fixed above the protrusion 24 and the bottom surface of the silicon wafer 5 is located in the first mounting groove 111. The bottom surface of the silicon wafer 5 is lower than the top surface of the first boat page body 1, thereby reducing the risk of coating on the bottom surface of the silicon wafer 5 and avoiding the problem of wrap-around plating on the bottom surface of the silicon wafer 5.

[0048] Specifically, the distance between the highest point of the convex point 24 and the top surface of the first boat page body 1 is not less than the thickness of the silicon wafer 5, so that the top surface of the silicon wafer 5 does not exceed the top surface of the first boat page body 1. The top surface of the silicon wafer 5 does not exceed the top surface of the first boat page body 1, so that the side wall of the silicon wafer 5 is also located below the top surface of the first boat page body 1, and the airflow will not blow directly on the side of the silicon wafer 5, avoiding the problem of plating around the side wall of the silicon wafer 5. At the same time, the side wall of the silicon wafer 5 is completely located in the first mounting groove 111, avoiding the airflow blowing directly on the side wall of the silicon wafer 5 to cause the silicon wafer 5 to shake, and also reducing the airflow entering the bottom surface of the silicon wafer 5. It is worth noting that the convex point 24 is a placement structure for placing the silicon wafer 5, and it can also be other placement structures such as card points, which are all commonly used technologies in the field and will not be further elaborated in this application.

[0049] Preferably, reference Figure 2 and Figure 8 The distance between the highest point of the bump 24 and the top surface of the first boat page body 1 is equal to the thickness of the silicon wafer 5 , so that the top surface of the silicon wafer 5 is flush with the top surface of the first boat page body 1 .

[0050] In the present embodiment, the top surface of the silicon wafer 5 is flush with the top surface of the first boat leaf body 1, and the airflow can pass through the top surface of the silicon wafer 5 more evenly, so that it can be coated on the top surface of the silicon wafer 5 more evenly, thereby improving the stability of the coating on the top surface of the silicon wafer 5 and ensuring the coating efficiency of the top surface of the silicon wafer 5; at the same time, the side walls and bottom surface of the silicon wafer 5 are both located in the first mounting groove 111, thereby avoiding the risk of bypass coating on the side walls and bottom surface of the silicon wafer 5, and also avoiding the airflow directly blowing on the side walls of the silicon wafer 5 causing the silicon wafer 5 to shake, thereby reducing the airflow entering the bottom surface of the silicon wafer 5.

[0051] Specifically, the top surface of the silicon wafer 5 is flush with the top surface of the first boat page body 1, and the bottom surface of the second boat page body 2 is flush with the bottom surface of the first boat page body 1, so that the distance between adjacent first boat page bodies 1 is equal to the distance between the bottom surface of the second boat page body 2 and the top surface of the silicon wafer 5, that is, the cross-section of the airflow is always equal, so that the airflow can flow through the silicon wafer 5, the airflow flow is more stable, and the deposition efficiency of the top surface of the silicon wafer 5 is more uniform. The distance between the top surface of the second boat page body 2 and the top surface of the first boat page body 1 is 0.3mm, and the distance between the highest point of the bump 24 and the top surface of the first boat page body 1 is 0.1mm. The thickness of the silicon wafer 5 in this embodiment is 0.2mm. It is worth noting that according to the different thicknesses of the silicon wafer 5, the size of the distance between the bump 24, the top surface of the second boat page body 2 and the top surface of the first boat page body 1 can also be adjusted, as long as the top surface of the silicon wafer 5 is parallel to the top surface of the first boat page body 1.

[0052] Further, refer to Figure 5 and Figure 7 The top surface of the first boat page body 1 is also provided with a plurality of unloading blind holes 12, and the unloading blind holes 12 are arranged at the edge of the mounting hole 11. The unloading blind holes 12 connect the top surface of the first boat page body 1 and the top surface of the second boat page body 2, so that the airflow between the top surface of the second boat page body 2 and the bottom surface of the silicon wafer 5 is suitable for flowing out through the unloading blind holes 12.

[0053] In this embodiment, the unloading blind hole 12 connects the top surface of the first boat page body 1 and the top surface of the second boat page body 2, so that the airflow between the bottom surface of the silicon wafer 5 and the top surface of the second boat page body 2 can be discharged through the unloading blind hole 12, avoiding the formation of a pressure difference between the top and bottom surfaces of the silicon wafer 5, causing the silicon wafer 5 to shake up and down or the silicon wafer 5 to fly up.

[0054] Specifically, the unloading blind holes 12 are located at the four corners of the mounting hole 11, the tops of the unloading blind holes 12 are located at the top surface of the first boat page body 1, the unloading blind holes 12 do not penetrate the first boat page body 1, and the bottoms of the unloading blind holes 12 are located at the bottom of the first mounting groove 111 of the mounting hole 11, so that the airflow at the bottom of the silicon wafer 5 can be discharged from the top of the first boat page body 1 through the unloading blind holes 12, thereby effectively balancing the pressure difference between the top and bottom surfaces of the silicon wafer 5 and preventing the silicon wafer 5 from shaking or flying. The unloading blind hole 12 is arranged on the side wall of the first mounting groove 111, and the depth of the unloading blind hole 12 is consistent with the depth of the first mounting groove 111. The unloading blind hole 12 does not penetrate the first boat leaf body 1, and the bottom of the unloading blind hole 12 is located at the bottom of the first mounting groove 111 of the mounting hole position 11, so that the bottom of the unloading blind hole 12 is flush with the top surface of the second boat leaf body 2, and the airflow on the top surface of the second boat leaf body 2 and the bottom surface of the silicon wafer 5 can more smoothly reach the unloading blind hole 12 and flow out through the inner side wall of the unloading blind hole 12, and the flow performance of the airflow is better. It is worth noting that in the modified embodiment, the depth of the unloading blind hole 12 can also be less than the depth of the first mounting groove 111 and the bottom of the unloading blind hole 12 is relatively located below the bottom surface of the silicon wafer 5, as long as it can connect the top surface of the first boat leaf body 1 and the bottom surface of the silicon wafer 5, so that the airflow on the bottom surface of the silicon wafer 5 flows out through the unloading blind hole 12.

[0055] At the same time, the unloading blind hole 12 does not penetrate the first boat page body 1, so even if the battery cell is broken, it will not affect the distribution of the electromagnetic field between the plates, and it also avoids the electromagnetic field penetrating through the unloading blind hole 12 to affect the existing magnetic field, thereby improving the stability of the magnetic field in the graphite boat.

[0056] Preferably, the unloading blind hole 12 is a three-quarter arc, the four corners of the silicon wafer 5 are relatively located at the center of the unloading blind hole 12, and the inner side wall of the unloading blind hole 12 is vertically arranged.

[0057] In this embodiment, the unloading blind holes 12 are arranged at the four corners of the first mounting groove 111, and the inner side walls of the unloading blind holes 12 are arranged vertically, so that the redundant gas can only rise vertically, thereby preventing the airflow on the bottom surface of the silicon wafer 5 from gathering at the four corners of the first mounting groove 111 and generating vortices, so that the airflow on the bottom surface of the silicon wafer 5 can flow out faster through the unloading blind holes 12, thereby avoiding the pressure difference between the top and bottom of the silicon wafer 5 and causing the flying wafer problem.

[0058] Specifically, the unloading blind hole 12 is a three-quarter arc, and the four corners of the silicon wafer 5 cover the other quarter of the arc of the unloading blind hole 12. The inner side wall of the unloading blind hole 12 is vertically arranged, and the airflow reaching the unloading blind hole 12 flows out directly through the inner side wall of the unloading blind hole 12, which greatly reduces the pressure at the four corners of the first mounting groove 111, and avoids the airflow from generating eddies at the four corners of the first mounting groove 111 and affecting the stability of the silicon wafer 5. It is worth noting that the inner side wall of the unloading blind hole 12 includes but is not limited to a vertical arrangement, and it can also have a certain curvature or an inclined arrangement, which plays a role in guiding and gathering, and avoids the airflow from being blocked in the unloading blind hole 12. This is easy to think of by those skilled in the art, and this application does not make further limitations here.

[0059] Further, refer to Figure 1 The present application provides a graphite boat, comprising a detachable boat page, a graphite connecting block 3 and a ceramic rod 4 in any of the above-mentioned embodiments, wherein a plurality of detachable boat pages are arranged in sequence in the vertical direction; the graphite connecting blocks 3 are arranged at both ends of the first boat page body 1 of the detachable boat page in the horizontal direction; the ceramic rod 4 vertically penetrates and connects a plurality of first boat page bodies 1, and a ceramic ring is also sleeved on the ceramic rod 4 between adjacent first boat page bodies 1.

[0060] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A detachable boat leaf, characterized in that: include: A first boat page body, wherein the first boat page body is suitable for being placed horizontally and has a plurality of installation holes spaced apart in the length direction of the first boat page body, wherein the installation holes penetrate the first boat page body; A second boat page body, wherein the second boat page body is detachably disposed in the mounting hole, the top surface of the second boat page body is lower than the top surface of the first boat page body, the top surface of the second boat page body is suitable for placing a silicon wafer, so that the bottom of the silicon wafer is relatively located between the top surface of the second boat page body and the top surface of the first boat page body, and the bottom surface of the second boat page body is flush with the bottom surface of the first boat page body.

2. A detachable boat leaf according to claim 1, characterized in that: The mounting hole comprises a first mounting groove and a second mounting groove, the notch of the first mounting groove is arranged on the top surface of the first boat page body, the notch of the second mounting groove is arranged on the bottom of the first mounting groove and the second mounting groove passes through the bottom surface of the first boat page body, and the notch of the second mounting groove is smaller than the notch of the first mounting groove; The second boat page body includes a first mounting portion and a second mounting portion, the first mounting portion is suitable for being placed in the first mounting groove and the bottom of the first mounting portion is abutted against the bottom of the first mounting groove, the top surface of the first mounting portion is lower than the top surface of the first boat page body, and the second mounting portion is suitable for being placed in the second mounting groove and the bottom surface of the second mounting portion is flush with the bottom surface of the first boat page body.

3. A detachable boat leaf according to claim 1, characterized in that: The second boat page body is also provided with a plurality of assembly holes, the assembly holes are suitable for installing bumps, the bumps are suitable for placing the silicon wafer, and the highest point of the bumps is higher than the top surface of the second boat page body and lower than the top surface of the first boat page body.

4. A detachable boat leaf according to claim 3, characterized in that: The distance between the highest point of the protrusion and the top surface of the first boat page body is not less than the thickness of the silicon wafer, so that the top surface of the silicon wafer does not exceed the top surface of the first boat page body.

5. The detachable boat leaf according to claim 3, characterized in that: The distance between the highest point of the protrusion and the top surface of the first boat page body is equal to the thickness of the silicon wafer, so that the top surface of the silicon wafer is flush with the top surface of the first boat page body.

6. A detachable boat leaf according to claim 5, characterized in that: The distance between the top surface of the second boat page body and the top surface of the first boat page body is 0.3 mm, and the distance between the highest point of the protrusion and the top surface of the first boat page body is 0.1 mm.

7. A detachable boat leaf according to any one of claims 1 to 6, characterized in that: The top surface of the first boat page body is also provided with a plurality of unloading blind holes, and the unloading blind holes are arranged at the edge of the mounting hole. The unloading blind holes connect the top surface of the first boat page body and the top surface of the second boat page body, so that the airflow between the top surface of the second boat page body and the bottom surface of the silicon wafer is suitable for flowing out through the unloading blind holes.

8. A detachable boat leaf according to claim 7, characterized in that: The unloading blind holes are located at the four corners of the mounting holes, the tops of the unloading blind holes are located on the top surface of the first boat page body, the unloading blind holes do not penetrate the first boat page body and the bottoms of the unloading blind holes are located at the bottom of the first mounting groove of the mounting hole.

9. A detachable boat leaf according to claim 8, characterized in that: The unloading blind hole is a three-quarter arc, the four corners of the silicon wafer are relatively located at the center of the unloading blind hole, and the inner side wall of the unloading blind hole is vertically arranged.

10. A graphite boat, characterized in that: include: A detachable boat leaf as claimed in any one of claims 1 to 9, wherein a plurality of detachable boat leaves are arranged in sequence and spaced apart in the vertical direction; Graphite connecting blocks, the graphite connecting blocks are arranged at both ends of the first boat leaf body of the detachable boat leaf in the horizontal direction; A ceramic rod is vertically connected to a plurality of the first boat leaf bodies, and a ceramic ring is sleeved on the ceramic rod between adjacent first boat leaf bodies.

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