Multi-station dispensing machine for chip packaging

Abstract

The invention relates to the technical field of dispensing machines, in particular to a multi-station dispensing machine for chip packaging, a chip fixing assembly is arranged at the top of a workbench, the chip fixing assembly comprises a dispensing frame, and the dispensing frame is movably connected to the top of the workbench. When the multi-station dispensing machine for chip packaging is used, firstly, a chip needing to be subjected to dispensing packaging is fixed through a chip fixing assembly, the chip needing to be subjected to dispensing packaging is vertically inserted into a sliding groove, the chip is subjected to limiting treatment through two limiting frames, and meanwhile in the process of inserting the chip into the sliding groove, the chip is fixed through the chip fixing assembly; the bottom of a chip can be fixed through a fixing spring and a clamping plate, meanwhile, the chip is secondarily fixed through a limiting L-shaped frame and a hinged gear rod and is divided into an upper half area and a lower half area for dispensing treatment, and the situation that in the gluing process, the chip deviates, so that glue cannot be accurately applied to a preset position, and the glue dispensing efficiency is improved is more accurately and effectively avoided. And the dispensing precision and quality are influenced.

Description

Technical Field

[0001] The invention relates to the technical field of glue dispensers, in particular to a multi-station glue dispenser for chip packaging. Background Art

[0002] Glue dispensing machine is an automated equipment widely used in industrial production. The main function of the glue dispensing machine is to accurately apply fluid materials such as glue, paint, lubricant, etc. on the surface of the workpiece or a specific position according to a predetermined trajectory and dosage.

[0003] In the process of dispensing glue on the chip, it is particularly important to fix the chip. There are many parts and circuits inside the chip. During dispensing, they may be offset, resulting in the glue being unable to be accurately applied to the predetermined position, affecting the accuracy and quality of dispensing. At the same time, in high-precision chip packaging, slight position deviations may lead to poor circuit connection. For this reason, we propose a multi-station dispensing machine for chip packaging. Summary of the invention

[0004] The purpose of the present invention is to provide a multi-station glue dispenser for chip packaging to solve the problem raised in the above background technology that in the process of glue dispensing on the chip, the fixation of the chip is particularly important. There are many parts and circuits inside the chip, and they may be offset during glue dispensing, resulting in the glue being unable to be accurately applied to the predetermined position, affecting the accuracy and quality of glue dispensing. At the same time, in high-precision chip packaging, slight position deviations may lead to poor circuit connection problems. To achieve the above-mentioned purpose, the present invention provides the following technical scheme: a multi-station glue dispenser for chip packaging, comprising a workbench, a chip fixing component is arranged on the top of the workbench, the chip fixing component comprises a glue dispenser, the glue dispenser is movably connected to the top of the workbench, the glue dispenser is fixedly connected to the inside of the glue dispenser with two placement plates, the two placement plates are symmetrically distributed inside the glue dispenser, each of the placement plates is respectively provided with a slide groove, and two opposite sides of the two slide grooves are movably connected to two limit frames together, the two sides of the glue dispenser are respectively movably connected with articulated levers through hinges, the bottom of the articulated lever is movably connected to a limited L-shaped frame, the other two sides of the glue dispenser are respectively provided with fixed grooves, one side of the horizontal side of the limited L-shaped frame is movably connected to the inside of the fixed groove, the bottom inner wall of the fixed groove is fixedly connected to two telescopic rods, the two telescopic rods are distributed in a linear array on the bottom inner wall of the fixed groove, and the top of the two telescopic rods The part is connected to the bottom of the horizontal side of the limiting L-shaped frame, and the top of each placing plate is fixedly connected to a fixing block, and one side of the fixing block is fixedly connected to a plurality of fixing springs, and the fixing springs are distributed in a linear array on one side of the fixing block, and the other end of the fixing spring is fixedly connected to a clamping plate. When using the multi-station glue dispenser for chip packaging, the chip to be glued and packaged is first fixed by the chip fixing component, and the chip to be packaged is vertically inserted into the slide groove, and the chip is limited by the two limiting frames. At the same time, during the insertion process of the slide groove, the fixing spring and the clamping plate can fix the bottom of the chip, and the chip is fixed for the second time by the limiting L-shaped frame and the articulated gear lever, and divided into the upper half area and the lower half area for glue dispensing, which is more accurate and effectively avoids the chip from running off during the gluing process, thereby causing the glue to be unable to be accurately applied to the predetermined position, affecting the accuracy and quality of glue dispensing.

[0005] Further preferably, two sliding grooves are opened on the top of the workbench and the two sliding grooves are symmetrically distributed, and a glue dispensing assembly is arranged on the top of the workbench, and the glue dispensing assembly includes two sliding legs, and the two sliding legs are movably connected to the inside of the two sliding grooves respectively and the two sliding legs are symmetrically distributed.

[0006] Further preferably, the outer wall of each of the sliding legs is respectively sleeved with a limiting ring, the tops of the two sliding legs are commonly fixedly connected to a curved frame, the interior of the curved frame is provided with two air avoidance grooves, and the two air avoidance grooves are symmetrically distributed, the interior of each of the air avoidance grooves is movably connected to a glue coating frame, and the opposite sides of the two glue coating frames are respectively fixedly connected with a plurality of glue coating tubes, and the glue coating tubes are distributed in a linear array, the interior of each of the air avoidance grooves is respectively fixedly connected with a tension spring, and the two tension springs are symmetrically distributed, and a transmission assembly is provided on one side of the curved frame.

[0007] The top of each movable rack is connected with a sector gear through meshing movement, and one side of each movable rack is connected with a fanciful gear. The bottom of each movable rack is connected with a fanciful gear through meshing movement, and one side of each movable rack is connected with a fanciful gear through meshing movement.

[0008] Further preferably, one end of the transmission roller is fixedly connected to a back plate, the bottom of the back plate is fixedly connected to a connecting support plate, the other end of one of the transmission rollers is fixedly connected to bevel gear 1, the side surface of bevel gear 1 is connected to bevel gear 2 through meshing movement, the interior of bevel gear 2 is fixedly connected to a rotating shaft, the side surface of the rotating shaft is fixedly connected to a socket frame, and the other end of the socket frame is fixedly connected to the back side of the curved frame.

[0009] Further preferably, the bottom of the rotating shaft is fixedly connected with a bevel gear three, the top of the workbench is fixedly connected with a moving component, the moving component includes a rail frame, and the rail frame is fixedly connected to the top of the workbench.

[0010] Further preferably, the rail frame is fixedly connected to a track body inside, the top of the track body is movably connected to a bevel gear four through meshing, and the inside of the bevel gear four is movably connected to a gear bracket through a hinge.

[0011] Further preferably, the other side of the gear bracket is connected to the curved frame, and four supporting legs are fixedly connected to the bottom of the workbench, and the four supporting legs are symmetrically distributed on the bottom of the workbench. At the same time, the device is also provided with a glue dispensing assembly, a transmission assembly and a moving assembly. Gluing is performed through the glue dispensing assembly, and the fan-shaped gear drives the movable rack to move inward, thereby pushing the glue coating frame to move inward, and then the chip is glued through the glue coating tube. Since the fan-shaped gear is engaged with the movable rack, when it is not engaged with the movable rack for a period of time, it is restored by the action of the tension spring, so that the device has higher stability and practicality.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] In the present invention, when using the multi-station glue dispenser for chip packaging, the chip to be glued and packaged is first fixed by the chip fixing assembly, the chip to be packaged is vertically inserted into the slide slot, and the chip is limited by two limiting frames. At the same time, during the insertion into the slide slot, the fixing spring and the clamping plate can fix the bottom of the chip, and the chip is fixed for a second time by the limiting L-shaped frame and the articulated gear lever, and divided into the upper half area and the lower half area for glue dispensing, which is more accurate and effectively avoids the chip from running off the track during the gluing process, resulting in the glue being unable to be accurately applied to the predetermined position, affecting the accuracy and quality of glue dispensing.

[0014] In the present invention, the device is also provided with a dispensing assembly, a transmission assembly and a moving assembly. Glue is dispensed through the dispensing assembly, and the fan-shaped gear drives the movable rack to move inward, thereby pushing the glue coating frame to move inward, and then the chip is coated with glue through the glue coating tube. Since the fan-shaped gear is engaged with the movable rack, when it is not engaged with the movable rack for a period of time, it is restored by the action of the tension spring, thereby making the device have higher stability and practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional main structure of the present invention;

[0016] Figure 2 For the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0017] Figure 3 It is a schematic diagram of the front view of the three-dimensional structure of the present invention;

[0018] Figure 4 For the present invention Figure 3 The enlarged structural diagram at B in the middle;

[0019] Figure 5 It is a schematic diagram of the side-view stereoscopic structure of the present invention;

[0020] Figure 6 It is a schematic diagram of the three-dimensional structure of the present invention from top view.

[0021] In the figure: 1, workbench; 2, sliding groove; 3, glue dispensing assembly; 4, transmission assembly; 5, moving assembly; 6, chip fixing assembly; 7, supporting leg; 301, sliding leg; 302, limiting ring; 303, curved frame; 304, air avoidance groove; 305, glue coating frame; 306, glue coating tube; 307, tension spring; 401, circular push frame; 402, movable rack; 403, fan-shaped gear; 404, placement frame; 405, connecting shaft; 406, flat gear; 407, two-way toothed belt; 408, gear belt; 409, transmission roller ; 410, back plate; 411, bevel gear one; 412, bevel gear two; 413, rotating shaft; 414, connecting support plate; 415, sleeve frame; 416, bevel gear three; 501, track frame; 502, track body; 503, bevel gear four; 504, gear bracket; 601, dispensing frame; 602, placement plate; 603, slide groove; 604, limiting frame; 605, articulated gear lever; 606, limit L-shaped frame; 607, fixing groove; 608, telescopic rod; 609, fixing block; 610, fixing spring; 611, clamping plate. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-Figure 6The present invention provides a technical solution: a multi-station glue dispenser for chip packaging, comprising a workbench 1, a chip fixing assembly 6 is arranged on the top of the workbench 1, the chip fixing assembly 6 comprises a glue dispenser 601, the glue dispenser 601 is movably connected to the top of the workbench 1, the glue dispenser 601 is internally fixedly connected to two placement plates 602, the two placement plates 602 are symmetrically distributed inside the glue dispenser 601, each placement plate 602 is respectively provided with a slide groove 603 inside, the opposite sides of the two slide grooves 603 are movably connected to two limiting frames 604, the two sides of the glue dispenser 601 are respectively movably connected to an articulated lever 605 through a hinge, and the bottom of the articulated lever 605 is movably connected to a limited L-shaped frame 60 6. The other two sides of the dispensing frame 601 are respectively provided with fixed grooves 607, one side of the horizontal side of the limiting L-shaped frame 606 is movably connected to the inside of the fixed groove 607, and the bottom inner wall of the fixed groove 607 is fixedly connected with two telescopic rods 608, and the two telescopic rods 608 are distributed in a linear array on the bottom inner wall of the fixed groove 607, and the tops of the two telescopic rods 608 are connected to the bottom of the horizontal side of the limiting L-shaped frame 606, and the top of each placement plate 602 is respectively fixedly connected with a fixed block 609, and one side of the fixed block 609 is fixedly connected with a plurality of fixed springs 610, and the fixed springs 610 are distributed in a linear array on one side of the fixed block 609, and the other end of the fixed spring 610 is fixedly connected with a clamping plate 611.

[0024] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, two sliding grooves 2 are provided on the top of the workbench 1 and the two sliding grooves 2 are symmetrically distributed, a glue dispensing component 3 is arranged on the top of the workbench 1, and the glue dispensing component 3 includes two sliding legs 301, the two sliding legs 301 are respectively movably connected to the inside of the two sliding grooves 2 and the two sliding legs 301 are symmetrically distributed, the outer wall of each sliding leg 301 is respectively sleeved with a limiting ring 302, the tops of the two sliding legs 301 are commonly fixedly connected with a curved frame 303, the inside of the curved frame 303 is provided with two air avoidance grooves 304 and the two air avoidance grooves 304 are symmetrically distributed, the inside of each air avoidance groove 304 is respectively movably connected with a glue coating frame 305, the opposite sides of the two glue coating frames 305 are respectively fixedly connected with a plurality of glue coating tubes 306 and the glue coating tubes 306 are distributed in a linear array, and the inside of each air avoidance groove 304 is respectively fixedly connected with a tension spring 307 and the two tension springs 307 are symmetrically distributed, and a transmission component 4 is arranged on one side of the curved frame 303. When using the multi-station glue dispenser for chip packaging, the chip to be glued and packaged is first fixed by the chip fixing component 6, and the chip to be packaged is vertically inserted into the slide groove 603, and the chip is limited by the two limiting frames 604. At the same time, during the insertion into the slide groove 603, the fixing spring 610 and the clamping plate 611 can fix the bottom of the chip, and the chip is fixed for the second time by the limiting L-shaped frame 606 and the articulated gear lever 605, and divided into the upper half area and the lower half area for glue dispensing, which is more accurate and effectively avoids the chip from running off during the gluing process, thereby causing the glue to be unable to be accurately applied to the predetermined position, affecting the accuracy and quality of glue dispensing.

[0025] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the transmission assembly 4 includes two circular push frames 401, which are respectively movably connected to one side of the curved frame 303 and are symmetrically distributed. The push end of one end of the circular push frame 401 is connected to the glue coating frame 305, and the other end of the circular push frame 401 is fixedly connected to a movable rack 402. The top of each movable rack 402 is movably connected to a sector gear 403 through meshing. One side of the sector gear 403 is fixedly connected to a placement frame 404. The bottom of the placement frame 404 is fixedly connected to the top of the curved frame 303. The other side of the rack 404 is fixedly connected to a flat gear 406, and the interior of the flat gear 406 is fixedly connected to a connecting shaft 405, which passes through the flat gear 406, the placement rack 404 and the fan gear 403 in sequence. The side surfaces of the two flat gears 406 are connected to a two-way toothed belt 407 through meshing movement, one of the flat gears 406 is located inside the two-way toothed belt 407, and the other flat gear 406 is located on the outer wall of the two-way toothed belt 407. The top of the two-way toothed belt 407 is connected to a gear belt 408 through meshing movement, and the interior of the gear belt 408 is fixedly connected to Two transmission rollers 409, one end of the transmission roller 409 is fixedly connected to a back plate 410, the bottom of the back plate 410 is fixedly connected to a connecting support plate 414, the other end of one of the transmission rollers 409 is fixedly connected to a bevel gear 1 411, the side surface of the bevel gear 1 411 is connected to a bevel gear 2 412 through meshing, the inside of the bevel gear 2 412 is fixedly connected to a rotating shaft 413, the side surface of the rotating shaft 413 is fixedly connected to a sleeve frame 415, the other end of the sleeve frame 415 is fixedly connected to the back of the curved frame 303, the bottom of the rotating shaft 413 is fixedly connected to a bevel gear 3 416. The top of the workbench 1 is fixedly connected with a moving assembly 5, and the moving assembly 5 includes a rail frame 501, and the rail frame 501 is fixedly connected to the top of the workbench 1. The inside of the rail frame 501 is fixedly connected with a track body 502, and the top of the track body 502 is connected with a bevel gear 4 503 through meshing movement, and the inside of the bevel gear 4 503 is connected with a gear bracket 504 through a hinge movement, and the other side of the gear bracket 504 is connected to the curved frame 303. The bottom of the workbench 1 is fixedly connected with four supporting legs 7, and the four supporting legs 7 are symmetrically distributed at the bottom of the workbench 1.

[0026] The use method and advantages of the present invention: When the multi-station glue dispenser for chip packaging is used, the working process is as follows:

[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, when using the multi-station glue dispenser for chip packaging, first fix the chip to be glued and packaged by the chip fixing component 6, vertically insert the chip to be packaged into the slide groove 603, and limit the chip by two limiting frames 604. At the same time, during the insertion into the slide groove 603, the fixing spring 610 and the clamping plate 611 can fix the bottom of the chip, and at the same time, the chip is fixed for a second time by the limiting L-shaped frame 606 and the hinged lever 605, and divided into the upper half area and the lower half area for glue dispensing. The processing is more accurate and effectively avoids the chip deviation during the gluing process, so that the glue cannot be accurately applied to the predetermined position, affecting the accuracy and quality of the gluing. At the same time, the device is also provided with a gluing component 3, a transmission component 4 and a moving component 5. The specific working process is that the device is first moved by the transmission component 4, and the sector gear 403 is connected to the external motor to rotate the sector gear 403, and then the connecting shaft 405 and the flat gear 406 are driven by the rotation of the sector gear 403. As a result, the flat gear 406 rotates, and then the flat gear 406, the two-way toothed belt 407 and the gear belt 408 are driven to rotate. At the same time, during the rotation of the gear belt 408, the transmission roller 409 is driven to rotate, and the transmission roller 409 drives the bevel gear 1 411 to rotate. Finally, when the bevel gear 1 411 rotates, the transmission structure composed of the bevel gear 1 411, the bevel gear 2 412, the rotating shaft 413, the bevel gear 3 416 and the bevel gear 4 503 rotates accordingly, so that the bevel gear 4 503 is on the track. The main body 502 moves, thereby driving the entire structure to move. When it moves to the appropriate position, glue is dispensed through the glue dispensing component 3, and the fan-shaped gear 403 drives the movable rack 402 to move inward, thereby pushing the glue coating frame 305 to move inward, and then the chip is glued through the glue coating tube 306. Since the fan-shaped gear 403 is engaged with the movable rack 402, when it is not engaged with the movable rack 402 for a period of time, it is restored by the force of the tension spring 307, so that the device has higher stability and practicality.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Technical personnel in this industry should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A multi-station glue dispenser for chip packaging, comprising a workbench (1), characterized in that: A chip fixing assembly (6) is arranged on the top of the workbench (1), and the chip fixing assembly (6) comprises a glue dispensing frame (601), and the glue dispensing frame (601) is movably connected to the top of the workbench (1), and two placement plates (602) are fixedly connected inside the glue dispensing frame (601), and the two placement plates (602) are symmetrically distributed inside the glue dispensing frame (601), and each of the placement plates (602) is provided with a slide groove (603) inside, and two limiting frames (604) are movably connected to the opposite sides of the two slide grooves (603), and the two sides of the glue dispensing frame (601) are respectively movably connected to an articulated lever (605) through a hinge, and the bottom of the articulated lever (605) is movably connected to a limited L-shaped frame (606), and the other two sides of the glue dispensing frame (601) are respectively A fixing groove (607) is separately provided, one side of the horizontal side of the limiting L-shaped frame (606) is movably connected to the inside of the fixing groove (607), two telescopic rods (608) are fixedly connected to the bottom inner wall of the fixing groove (607), the two telescopic rods (608) are distributed in a linear array on the bottom inner wall of the fixing groove (607), the tops of the two telescopic rods (608) are connected to the bottom of the horizontal side of the limiting L-shaped frame (606), the top of each placement plate (602) is fixedly connected to a fixing block (609), one side of the fixing block (609) is fixedly connected to a plurality of fixing springs (610), the fixing springs (610) are distributed in a linear array on one side of the fixing block (609), and the other end of the fixing spring (610) is fixedly connected to a clamping plate (611).

2. The multi-station glue dispenser for chip packaging according to claim 1, characterized in that: The top of the workbench (1) is provided with two sliding grooves (2) and the two sliding grooves (2) are symmetrically distributed. The top of the workbench (1) is provided with a glue dispensing component (3), and the glue dispensing component (3) includes two sliding legs (301). The two sliding legs (301) are respectively movably connected inside the two sliding grooves (2) and the two sliding legs (301) are symmetrically distributed.

3. The multi-station glue dispenser for chip packaging according to claim 2, characterized in that: The outer wall of each sliding leg (301) is respectively sleeved with a limiting ring (302), the tops of the two sliding legs (301) are commonly fixedly connected to a curved frame (303), the interior of the curved frame (303) is provided with two air avoidance grooves (304), and the two air avoidance grooves (304) are symmetrically distributed, the interior of each air avoidance groove (304) is movably connected to a glue coating frame (305), the opposite sides of the two glue coating frames (305) are respectively fixedly connected to a plurality of glue coating tubes (306), and the glue coating tubes (306) are distributed in a linear array, the interior of each air avoidance groove (304) is respectively fixedly connected to a tension spring (307), and the two tension springs (307) are symmetrically distributed, and a transmission component (4) is provided on one side of the curved frame (303).

4. The multi-station glue dispenser for chip packaging according to claim 3, characterized in that: The transmission assembly (4) comprises two circular push frames (401), the two circular push frames (401) are respectively movably connected to one side of the curved frame (303) and the two circular push frames (401) are symmetrically distributed, the push end of one end of the circular push frame (401) is connected to the glue coating frame (305), the other end of the circular push frame (401) is fixedly connected to a movable rack (402), the top of each movable rack (402) is movably connected to a sector gear (403) through meshing, one side of the sector gear (403) is fixedly connected to a placement frame (404), the bottom of the placement frame (404) is fixedly connected to the top of the curved frame (303), and the other end of the placement frame (404) is fixedly connected to the top of the curved frame (303). A flat gear (406) is fixedly connected to one side, and a connecting shaft (405) is fixedly connected inside the flat gear (406). The connecting shaft (405) passes through the flat gear (406), the placement frame (404) and the fan gear (403) in sequence. The side surfaces of the two flat gears (406) are connected to a bidirectional toothed belt (407) through meshing movement. One of the flat gears (406) is located inside the bidirectional toothed belt (407), and the other flat gear (406) is located on the outer wall of the bidirectional toothed belt (407). The top of the bidirectional toothed belt (407) is connected to a gear belt (408) through meshing movement. Two transmission rollers (409) are fixedly connected inside the gear belt (408).

5. The multi-station glue dispenser for chip packaging according to claim 4, characterized in that: One end of the transmission roller (409) is fixedly connected to a back plate (410), and the bottom of the back plate (410) is fixedly connected to a connecting support plate (414); the other end of one of the transmission rollers (409) is fixedly connected to a bevel gear 1 (411); the side surface of the bevel gear 1 (411) is connected to a bevel gear 2 (412) through meshing; the interior of the bevel gear 2 (412) is fixedly connected to a rotating shaft (413); the side surface of the rotating shaft (413) is fixedly connected to a sleeve frame (415); the other end of the sleeve frame (415) is fixedly connected to the back side of the curved frame (303).

6. The multi-station glue dispenser for chip packaging according to claim 5, characterized in that: The bottom of the rotating shaft (413) is fixedly connected to a bevel gear three (416), and the top of the workbench (1) is fixedly connected to a moving assembly (5), wherein the moving assembly (5) comprises a rail frame (501), and the rail frame (501) is fixedly connected to the top of the workbench (1).

7. The multi-station glue dispenser for chip packaging according to claim 6, characterized in that: The rail frame (501) is fixedly connected to a track body (502) inside, the top of the track body (502) is movably connected to a bevel gear four (503) through meshing, and the inside of the bevel gear four (503) is movably connected to a gear bracket (504) through a hinge.

8. The multi-station glue dispenser for chip packaging according to claim 7, characterized in that: The other side of the gear bracket (504) is connected to the curved frame (303), and four supporting legs (7) are fixedly connected to the bottom of the workbench (1), and the four supporting legs (7) are symmetrically distributed at the bottom of the workbench (1).

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