Processing method for semiconductor precision part production

Abstract

The invention relates to a processing method for semiconductor precision part production, and belongs to the technical field of semiconductor part processing. The base controls the conveying assembly to convey and position the mounting plate loaded with the first part in the preset direction, and the second part is mounted on the mounting plate through the feeding assembly; the positioner aligns welding spots of the first part and the second part on the mounting plate through a calibration push rod which is pushed bidirectionally, and positioning and preliminary fixing are completed; the conveying assembly is controlled through the base to convey the positioned mounting plate into a welding chamber, and the first part and the second part are welded through high-frequency laser; and finally, the mounting plate, the processed first part and the processed second part are conveyed out of the welding chamber. The invention provides a processing method for semiconductor precision part production, which is used for solving the technical problems that when a workbench is used for assembling and processing a precision part, the feeding and mounting processes are too tedious and are not convenient enough.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor parts processing, and in particular relates to a processing method for producing semiconductor precision parts. Background Art

[0002] In the semiconductor production industry, the performance and precision of semiconductor processing equipment are constantly improving, and it involves the processing and manufacturing of many complex precision parts. Such precision parts have high processing accuracy and have a great impact on the yield and performance of semiconductor processing equipment. In the processing of precision parts, many assembly connections of two parts are involved. In traditional assembly and processing, especially welding processing, there is a docking deviation caused by insufficient assembly accuracy, which can easily lead to an excessively large heat-affected area and uneven welds, thereby affecting the structural strength and reliability of the parts, and further affecting the structure of the equipment and the reliability of production and processing.

[0003] The patent with publication number CN216151529U discloses a parts welding device for precision instrument assembly and processing. It includes a workbench and a welding device, wherein the welding device is arranged at the top of the workbench, the top of the workbench is fixedly connected to a fixed seat, both sides of the welding device are provided with movers, both ends of the movers are movably connected to support plates, both sides of the workbench are provided with dust removal mechanisms, and both ends of the welding device are fixedly connected to heat dissipation mechanisms. The utility model uses the mutual cooperation between the adsorption plate, the chip drop port, the chip storage box, and the control mechanism. The adsorption plate will adsorb the iron chips splashed during welding, and the control mechanism controls the iron chips to fall off and slide into the chip storage box for collection, thereby solving the problem of the impact of splashing iron chips on welding work, saving time for cleaning iron chips, and improving the efficiency of parts welding.

[0004] The prior art represented by the above patents has at least the following problems:

[0005] The assembly and processing of precision parts using a workbench, the loading and installation process is too cumbersome and not convenient enough. Summary of the invention

[0006] The present invention provides a processing method for producing semiconductor precision parts, which is used to solve the technical problem that the loading and installation processes of the precision parts assembled and processed using a workbench are too complicated and inconvenient.

[0007] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0008] A processing method for producing semiconductor precision parts, comprising: a base, a transport component, a loading component, a mounting plate, a positioner, and a welding chamber. The transport component is mounted on the base and is used to transport a first part; the loading component is mounted on the base, the loading component has a storage area, and the loading component mounts a second part onto the first part; the mounting plates are distributed on the transport component at intervals, and move the first part with the movement of the transport component; the positioner is mounted on the transport component, and the positioner provides a bidirectional position calibration push rod to calibrate the installation positions of the first part and the second part; the welding chamber is mounted on the base, and the cover is arranged on the transport component, and a laser welding device is arranged inside;

[0009] The following steps are involved:

[0010] S10, the base controls the transport component to transport and position the mounting plate loaded with the first part along a preset direction, and installs the second part on the mounting plate through the loading component;

[0011] S20, the positioner aligns the welding points of the first part and the second part on the mounting plate through a calibration push rod pushed in both directions, thereby completing positioning and preliminary fixation;

[0012] S30, controlling the transport assembly by the base to transport the positioned mounting plate to the welding chamber, and performing welding processing on the first part and the second part by high-frequency laser;

[0013] S40. Finally, the mounting plate and the processed first part and second part are transported out of the welding chamber.

[0014] Furthermore, the welding chamber is also provided with an exhaust assembly, one end of which is installed in the welding chamber and the other end is connected to the base to collect and process the gas generated by welding;

[0015] The S30 further comprises the following steps:

[0016] S31. The air and floating dust in the welding room are collected by an exhaust assembly and stored in the base through a pipeline. The exhaust assembly cooperates with a shield of the welding room to reduce the escape of waste gas and smoke generated by welding.

[0017] Furthermore, a visual inspection element is mounted on the base, and the visual inspection element is mounted from the side of the transport assembly;

[0018] The following steps are also included:

[0019] S32, transport the finished parts to the front of the visual inspection component through the transport assembly, record and inspect the quality of the finished parts through visual comparison, and collect the data records to the base through the communication connection.

[0020] Furthermore, the loading assembly includes: a first mobile frame, a pallet, and a transport arm. The first mobile frame is mounted on the base, and has a first area and a second area in the storage area; the pallet has a plurality of receiving slots for transporting the second part; the transport arm is slidably mounted on the first mobile frame, the transport arm has a transport portion, and the transport portion is equipped with a plurality of suction cups for transporting the pallet;

[0021] The S20 further includes the following steps:

[0022] S21, after the pallet enters the first area, the suction cup is controlled to fix the pallet on the transport portion, and as the transport arm moves on the first mobile frame, the pallet is moved from the first area to the second area for material replenishment.

[0023] Furthermore, the loading assembly further comprises: a second mobile frame and a mounting arm. The second mobile frame is mounted on the base; the mounting arm is slidably mounted on the second mobile frame, and is used to grab the second part in the pallet and initially load it on the transport assembly;

[0024] The S20 further includes the following steps:

[0025] S22: The mounting arm takes out the second part from the receiving groove and loads it onto the first part by moving on the second movable frame.

[0026] Furthermore, a detachable positioning block is provided on the mounting plate for clamping the first part for positioning;

[0027] The S10 further comprises the following steps:

[0028] S11, installing the plurality of positioning blocks along the circumferential side of the mounting plate, detachably mounting the positioning blocks on the mounting plate by bolts, and the positioning blocks abutting against and fixing the circumferential outer wall of the first part.

[0029] The present invention provides a processing method for producing semiconductor precision parts, which has the following beneficial effects:

[0030] 1. The present invention controls the transport assembly and the loading assembly in the base to cooperate with each other to complete the assembly of the first part and the second part, and then uses the mounting plate as a carrier to improve the stability of transportation and assembly, and completes the welding of the assembled parts through the positioner and the welding chamber, thereby improving the stability and convenience of production and processing, and reducing the cumbersome steps of manual assembly and disassembly;

[0031] 2. The present invention collects the exhaust gas and smoke generated by welding through the welding chamber and the exhaust assembly, reduces the escape and pollution of harmful gases generated by welding in the environment, and collects the smoke and particulate matter generated by welding to a certain extent;

[0032] 3. The present invention records and detects finished parts through visual inspection elements, thereby improving the efficiency of tracking and sorting qualified products in subsequent processes.

[0033] 4. The present invention uses a pallet and a transport arm to replenish a pallet loaded with a second part to the second area, thereby improving the efficiency of replenishing the second part;

[0034] 5. The present invention improves the installation speed and efficiency of the second part through the second moving frame and the installation arm;

[0035] 6. The present invention improves the installation reliability of the first part and the positioning accuracy of the assembly process by means of the positioning block. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic diagram of a structure of a semiconductor precision parts production device provided by an embodiment of the present invention;

[0038] Figure 2 An assembly diagram of a transport component and a processing component provided for an embodiment of the present invention;

[0039] Figure 3 The embodiment of the present invention provides Figure 2 A top view of the assembly structure;

[0040] Figure 4 for Figure 1 The enlarged view of A1 in the middle;

[0041] Figure 5 for Figure 1 The enlarged view of B1 in the middle;

[0042] Figure 6 for Figure 2 Enlarged view of C1 in the middle.

[0043] In the figure:

[0044] 10-base; 20-transportation assembly; 401-mounting plate; 4011-positioning block; 402-positioner; 403-calibration push rod; 404-welding chamber; 4041-channel; 405-exhaust assembly; 406-visual inspection element; 310-first mobile frame; 311-pallet; 312-accommodating slot; 313-transportation arm; 314-suction cup; 320-second mobile frame; 321-mounting arm; 322-gripper. DETAILED DESCRIPTION

[0045] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0046] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0048] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be welding, bolt connection, or riveting; it can be fixed connection, detachable connection, or integral connection; it can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] Example:

[0050] Please refer to Figures 1 to 6As shown, this embodiment provides a processing method for the production of semiconductor precision parts, including: a base 10, a transport component 20, a loading component, a mounting plate 401, a positioner 402, and a welding chamber 404. The transport component 20 is installed on the base 10, and is used to transport the first part; the loading component is installed on the base 10, and has a storage area, and the loading component installs the second part on the first part; the mounting plates 401 are distributed on the transport component 20 at intervals, and move the first part with the movement of the transport component 20; the positioner 402 is installed on the transport component 20, and the positioner 402 provides a bidirectional position calibration push rod 403 to calibrate the installation position of the first part and the second part; the welding chamber 404 is installed on the base 10, and the cover is set on the transport component 20, and a laser welding device is arranged inside;

[0051] The following steps are involved:

[0052] S10, the base 10 controls the transport assembly 20 to transport and position the mounting plate 401 loaded with the first part along a preset direction, and installs the second part on the mounting plate 401 through the loading assembly;

[0053] S20, the locator 402 aligns the welding points of the first part and the second part on the mounting plate 401 through the calibration push rod 403 pushed in both directions, thereby completing the positioning and preliminary fixing;

[0054] S30, controlling the transport assembly 20 through the base 10 to transport the positioned mounting plate 401 to the welding chamber 404, and performing welding processing on the first part and the second part through high-frequency laser;

[0055] S40 , finally, the mounting plate 401 and the processed first part and second part are transported out of the welding chamber 404 .

[0056] In this embodiment, if Figure 1 As shown, the loading assembly is installed in an L-shape on the upper surface of the base 10. A storage area for replenishing the second part is set in the working area of ​​the loading assembly. The storage area is set in parallel with the transport assembly 20. The transport assembly 20 is specifically a conveyor belt and multiple support frames and expansion tables. The conveyor belt is provided with independent assembly areas, positioning and calibration areas, welding processing areas and inspection areas. When two or more parts need to be assembled, multiple parts are assembled by assembling multiple transport assemblies 20 and loading assemblies. Among the parts to be processed, the first part is a shell part, and the second part is a component installed inside the first part. The parts are controlled to stay in each area by controlling the intermittent motion of the transport assembly 20, thereby improving the processing efficiency. Moreover, by adding processing components to the transport assembly 20 to adapt to specific process requirements, the efficiency and accuracy of processing and inspection are improved.

[0057] Further, in some implementations of this embodiment, Figure 2 , Figure 3 as well as Figure 6 As shown, the welding chamber 404 is also provided with an exhaust assembly 405, one end of the exhaust assembly 405 is installed in the welding chamber 404, and the other end is connected to the base 10 to collect and process the gas generated by welding;

[0058] S30 further includes the following steps:

[0059] S31. The air and floating dust in the welding chamber 404 are collected by the exhaust assembly 405 and stored in the base 10 through the pipeline. The exhaust assembly 405 cooperates with the shield of the welding chamber 404 to reduce the escape of waste gas and smoke generated by welding.

[0060] In this embodiment, if Figure 3 The transport direction of the transport assembly 20 is from right to left, and from right to left are the positioner 402, the welding chamber 404, and the visual inspection element 406. Figure 6 The positioner 402 shown has two parts, which are respectively located on both sides of the transport assembly 20 to adjust the relative position of the second part on the first part. The calibration push rod 403 is driven by a cylinder to abut the side walls of the first part and the second part so that the welding points are aligned. The two ends of the calibration push rod 403 are provided with chamfers to guide the first part and the second part to align with each other in another direction and move to a predetermined position. Figure 2 The welding chamber 404 is provided with an exhaust system, and the exhaust gas and smoke are collected and sent to the base 10 through the bent pipe. Figure 6 As shown, a channel 4041 for passing the mounting block is opened on the side wall of the welding chamber 404, and specifically, movable blocks can be installed on the left and right of the channel 4041 to increase the air tightness in the welding chamber 404, thereby increasing the collection efficiency of the exhaust assembly 405 for waste gas and smoke in the welding chamber 404.

[0061] Further, in some implementations of this embodiment, Figure 2 , Figure 3 as well as Figure 6 As shown, a visual inspection element 406 is also mounted on the base 10, and the visual inspection element 406 extends from the side of the transport component 20;

[0062] S31 also includes the following steps:

[0063] S32, transport the finished parts to the front of the visual inspection element 406 through the transport component 20, record and inspect the quality of the finished parts through visual comparison, and collect the data records to the base 10 through the communication connection.

[0064] In this embodiment, if Figure 2 As shown, the visual inspection element includes a support frame and a visual sensor, which are installed on one side of the transport component 20. It is used to detect whether the assembly relationship meets the requirements and whether there is any leakage or desoldering at the welding point.

[0065] Further, in some implementations of this embodiment, Figure 1 , Figure 4 as well as Figure 5 As shown, the loading assembly includes: a first mobile frame 310, a pallet 311, and a transport arm 313. The first mobile frame 310 is mounted on the base 10, and has a first area and a second area in the storage area; the pallet 311 has a plurality of receiving slots 312 for transporting the second part; the transport arm 313 is slidably mounted on the first mobile frame 310, and the transport arm 313 has a transport portion, and a plurality of suction cups 314 are mounted on the transport portion for transporting the pallet 311;

[0066] S20 also includes the following steps:

[0067] S21, after the pallet 311 enters the first area, the suction cup 314 is controlled to fix the pallet 311 on the transport part, and as the transport arm 313 moves on the first mobile frame 310, the pallet 311 is moved from the first area to the second area for material replenishment.

[0068] In this embodiment, if Figure 1 As shown, the first mobile frame 310 is a gantry bracket, and the storage area is below the first mobile frame 310. The left side with the partition is the first area, and the right side is the second area. The pallet 311 is provided with rollers to slide into the first area, and the transport arm 313 controls the contact between the suction cup 314 and the pallet 311 by moving up and down, so as to add the pallet 311 in the first area to the second area.

[0069] Further, in some implementations of this embodiment, Figure 1 , Figure 4 as well as Figure 5 As shown, the loading assembly further includes: a second mobile frame 320 and a mounting arm 321. The second mobile frame 320 is mounted on the base 10; the mounting arm 321 is slidably mounted on the second mobile frame 320, and is used to grab the second part in the pallet 311 and initially load it on the transport assembly 20;

[0070] S21 also includes the following steps:

[0071] S22 , the mounting arm 321 takes out the second part from the receiving groove 312 by moving on the second moving frame 320 , and loads the second part onto the first part.

[0072] In this embodiment, if Figure 1As shown, since the receiving slots 312 on the pallet 311 have a variety of array patterns, the mounting arm 321, in addition to sliding back and forth along the second movable frame 320 to move between the second zone and the transport assembly 20, is also equipped with a cross arm and an upgrade arm to control the up and down and left and right movement of the clamp 322. The mounting slot reserves an expansion slot for the clamp 322 to extend into. The clamp 322 is two clamping blocks that slide toward each other, and a buffer gasket is installed on the clamp 322 that contacts the second part to prevent scratches on the surface of the second part.

[0073] Furthermore, in some implementations of this embodiment, a detachably mounted positioning block 4011 is provided on the mounting plate 401, which is used to clamp the first part for positioning;

[0074] S10 also includes the following steps:

[0075] S11, multiple positioning blocks 4011 are installed along the peripheral side of the mounting plate 401, and are detachably installed on the mounting plate 401 by bolts, and the positioning blocks 4011 are abutted and fixed to the peripheral outer wall of the first part.

[0076] In this embodiment, if Figure 6 As shown, the mounting plate 401 is a carrier. By controlling the distribution of the mounting plate 401 on the transport component 20 and cooperating with the intermittent movement of the transport component 20, the residence time of the parts in the processing area is increased. The mounting seat has two layers, the upper layer has multiple positioning plates, and the positioning plates are detachably mounted on the lower layer by bolts, thereby fixing the first part to the mounting plate 401.

[0077] In summary, when using a processing method for producing semiconductor precision parts, the first part is transported to the area to be processed in sequence through the transport component 20, and the transport component 20 moves intermittently, thereby controlling the first part to be transported intermittently on the transport component 20, so that the relative processing is performed in the predetermined area; after the pallet 311 enters the first area, the transport arm 313 moves up and down with the cantilever, and the suction cup 314 is controlled by the control of the pneumatic element to fix the pallet 311 on the handling part, and as the transport arm 313 rises and moves on the second mobile frame 320, the pallet 311 moves from the first area to the top of the second area, and then descends to the second area, stacking the fully loaded pallet 311 on the empty pallet 311 to replenish the material. When the empty pallet 311 in the second area reaches the upper limit, the empty pallet 311 will be taken out by the stacking equipment; the mounting arm 321 moves forward and backward on the second mobile frame 320, moves left and right through the cross arm, and moves up and down through the lifting arm to extend into the receiving groove 312 at the predetermined position, and clamps the second part by controlling the relative movement of the clamping claw 322, and takes the second part out of the receiving groove 312, and then loads it onto the first part. The receiving groove 312 of the support plate 311 is fixed in position, and the movement efficiency is improved by presetting the movement path of the mounting arm 321; the first part is abutted against the inner wall of the mounting plate 401 and the positioning block 4011, and the mounting position of the second part is adjusted by the positioner 402, and the assembly positions of the second part and the first part are aligned from both sides by the cylinder, and the welding point is adjusted to improve the welding accuracy; the mounting plate 401 loaded with the first part and the second part is sent to the welding chamber 404 by the transport component 20, and the first part and the second part are welded by high-frequency laser, and then Most of the waste gas and welding smoke generated in the welding chamber 404 are extracted through the exhaust component 405, and collected into the base 10 along with the exhaust component 405, and most of the waste gas is discharged, thereby reducing the impact on the processing workshop environment, and reducing the gradual accumulation of smoke on the transport component 20 to cause damage to the equipment and the impact on welding accuracy; finally, the finished parts are transported to the front of the visual inspection component 406 through the transport component 20, and the quality of the finished products is recorded and inspected through visual comparison, and the data is recorded, and the image information and sequence information of the defective products are uploaded to complete the processing.

[0078] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A processing method for producing semiconductor precision parts, It is characterized in that Used: Base (10); A transport assembly (20), mounted on the base (10), and used for transporting a first part; A loading assembly is mounted on the base (10), the loading assembly has a storage area, and the loading assembly mounts the second part onto the first part; The mounting plates (401) are spaced apart on the transport component (20) and drive the first part to move along with the movement of the transport component (20); A positioner (402) is installed on the transport assembly (20), and the positioner (402) provides a bidirectional position calibration push rod (403) to calibrate the installation positions of the first part and the second part; A welding chamber (404) is installed on the base (10) and is covered on the transport assembly (20), and is provided with a laser welding device inside; The following steps are involved: S10, the base (10) controls the transport component (20) to transport and position the mounting plate (401) loaded with the first part along a preset direction, and installs the second part on the mounting plate (401) through the loading component; S20, the positioner (402) aligns the welding points of the first part and the second part on the mounting plate (401) through a calibration push rod (403) that is pushed bidirectionally, thereby completing positioning and preliminary fixing; S30, controlling the transport assembly (20) through the base (10) to transport the positioned mounting plate (401) into the welding chamber (404), and performing welding processing on the first part and the second part through high-frequency laser; S40. Finally, the mounting plate (401) and the processed first part and second part are transported out of the welding chamber (404).

2. The processing method for producing semiconductor precision parts according to claim 1, It is characterized in that The welding chamber (404) is also provided with an exhaust assembly (405), one end of the exhaust assembly (405) is installed in the welding chamber (404), and the other end is connected to the base (10) to collect and process the gas generated by welding; The S30 further comprises the following steps: S31. The air and floating dust in the welding chamber (404) are collected through an exhaust assembly (405) and stored in the base (10) through a pipeline. The exhaust assembly (405) cooperates with a shield of the welding chamber (404) to reduce the escape of exhaust gas and smoke generated by welding.

3. The processing method for producing semiconductor precision parts according to claim 2, It is characterized in that A visual inspection element (406) is also mounted on the base (10), and the visual inspection element (406) extends from a side of the transport component (20); The step S31 further includes the following steps: S32, transporting the finished parts to the front of the visual inspection element (406) through the transport component (20), recording and inspecting the quality of the finished parts through visual comparison, and collecting the data records to the base (10) through the communication connection.

4. The processing method for producing semiconductor precision parts according to claim 3, It is characterized in that The feeding assembly comprises: A first mobile rack (310) is mounted on the base (10) and has a first area and a second area in the storage area; A pallet (311) having a plurality of receiving slots (312) for transporting a second part; A transport arm (313) is slidably mounted on the first mobile frame (310), the transport arm (313) comprising a transport portion, and a plurality of suction cups (314) are mounted on the transport portion for transporting the pallet (311); The S20 further includes the following steps: S21, after the pallet (311) enters the first zone, the pallet (311) is fixed on the transport portion by controlling the suction cup (314), and as the transport arm (313) moves on the first mobile frame (310), the pallet (311) is moved from the first zone to the second zone for material replenishment.

5. The processing method for producing semiconductor precision parts according to claim 4, It is characterized in that The feeding assembly also includes: A second mobile frame (320) is mounted on the base (10); a mounting arm (321) slidably mounted on the second mobile frame (320) and used for grabbing the second part in the pallet (311) and preliminarily loading it onto the transport assembly (20); The step S21 further includes the following steps: S22: The mounting arm (321) takes out the second part from the containing groove (312) and loads it onto the first part by moving on the second movable frame (320).

6. The processing method for producing semiconductor precision parts according to claim 5, It is characterized in that The mounting plate (401) is provided with a detachably mounted positioning block (4011) for clamping the first part for positioning; The S10 further comprises the following steps: S11, installing a plurality of the positioning blocks (4011) along the circumferential side of the mounting plate (401), detachably mounting them on the mounting plate (401) by means of bolts, and the positioning blocks (4011) abutting against and fixing the circumferential outer wall of the first part.

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