High-speed wire polishing device for diamond wire-drawing die machining
By introducing positioning, recycling and protection devices into the high-speed line polishing device, the problems of raw material position offset and debris treatment are solved, the stability and safety of polishing are improved, and the effective recycling and secondary utilization of debris are realized. .
Patent Information
- Application Number
- CN202411535288.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2024-12-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In diamond wire drawing mold processing, existing high-speed line polishing devices need to be positioned and fixed before polishing the original. If they are not fixed or position offset, they will lead to failure of polishing or damage to raw materials, increasing production costs.
A high-speed linear polishing device including positioning, recycling and protection devices is designed to accurately position and fix the raw materials through components such as electric push rods, clamps, return springs and limit blocks, prevent position deviation, and collect them through the recycling device. Polish debris, guards prevent debris from being thrown out.
It ensures the positional stability of the raw materials during the polishing process, improves the polishing pass rate, prevents damage to the device and damage to the operator, and at the same time realizes effective recycling and secondary utilization of debris.
Smart Images

Figure CN119098887A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of high-speed wire polishing, in particular to a high-speed wire polishing device for processing diamond wire drawing dies. Background Art
[0002] The high-speed wire polishing device in the processing of diamond wire drawing dies is a device specially used to improve the surface finish and processing accuracy of the die. The patent with patent announcement number CN210756820U relates to a high-speed wire polishing device for diamond wire drawing die processing, including a workbench, a wire drawing die fixed rotating device, a polishing wire fixed rotating device, a polishing wire and a CNC controller. The top wall of the workbench is fixedly screwed with a wire drawing die fixed rotating device, the top wall of the workbench is fixedly screwed with a polishing wire fixed rotating device, the polishing wire fixed rotating device is fixed to both ends of the polishing wire, the top wall of the workbench is screwed with a support frame, the top of the support frame is screwed with the bottom wall of the cover plate, the right side wall of the cover plate is screwed with a cantilever, and the other end of the cantilever is fixedly connected to the CNC controller. This patent arranges a wire drawing die fixed rotating device and a polishing wire fixed rotating device so that the wire drawing die rotates at high speed while the polishing wire rotates in the opposite direction of its rotation direction, thereby improving the efficiency of wire drawing die polishing.
[0003] In the above patent, by setting a wire drawing die fixed rotating device and a polishing wire fixed rotating device, the wire drawing die is rotated at high speed while the polishing wire rotates in the opposite direction of its rotation direction, thereby improving the polishing efficiency of the wire drawing die. However, before polishing the original part, the raw material needs to be positioned and fixed. Raw materials that are not fixed will cause the position of the raw material to shift during polishing, resulting in polishing failure or even damage to the raw material, increasing production costs. Summary of the invention
[0004] In view of the deficiencies in the prior art, the present invention provides a high-speed wire polishing device for diamond wire drawing die processing, which solves the problems raised in the above-mentioned background technology.
[0005] To achieve the above purpose, the present invention is implemented through the following technical solutions: a high-speed wire polishing device for diamond wire drawing die processing, comprising a base, a shell is fixedly installed on the top of the base, a console is fixedly installed on the surface of the base, a grinding device is arranged on the inner wall of the shell, a sliding groove is opened on the top of the base, a polishing machine is slidably installed inside the sliding groove, and a positioning device, a recovery device and a protective device are arranged on the top of the base; The positioning device includes: an operating table, an electric push rod, a clamping plate 1, a reset spring, a clamping plate 2, an arc block, a fixing part, a limit block, a limit groove and a positioning plate. The operating table is fixedly mounted on the top of the base. The fixed end of the electric push rod is fixedly passed through the inner and outer walls of the operating table. The clamping plate 1 is fixedly mounted on the output end of the electric push rod. The reset spring is fixedly mounted on the side of the clamping plate 1 away from the electric push rod. The clamping plate 2 is connected to the clamping plate 1 through the reset spring. A groove is provided on the surface of the clamping plate 2. The positioning plate rotates The movable plate is movably installed on the inner wall of the groove, the arc block is fixedly installed on the side of the second splint close to the first splint, the fixing piece is fixedly installed on the side of the first splint close to the second splint, the limit block is slidably installed on the inner wall of the fixing piece, and the limit groove is opened on the inner wall of the operating table. After the limit block contacts the limit groove, the limit groove will limit the limit block. After the limit block is limited, the first splint cannot continue to move in the direction of the second splint, so that after the second splint completes the positioning of the raw material, the first splint and the second splint will not continue to move in the direction of the raw material.
[0006] According to the above technical solution, a No. 1 torsion spring is arranged between the groove and the positioning plate, the arc surface block contacts the limit block, and the positioning plate is driven to reset by the No. 1 torsion spring.
[0007] According to the above technical solution, a No. 1 spring is arranged between the limit block and the fixing member, the limit block contacts the limit groove, and the limit block is driven to reset by the No. 1 spring.
[0008] According to the above technical scheme, the recovery device includes: a recovery port, a positioning rod, a rotating rod, a reset telescopic rod, a recovery plate, a round rod, a long plate, an arc plate and a blocking plate. The recovery port is opened on a side of the operating table away from the polishing machine, the positioning rod rotates and penetrates the inner and outer walls of the operating table, the rotating rod is fixedly installed on the circumferential surface of the positioning rod, the reset telescopic rod is fixedly installed on the bottom of the first clamping plate, the recovery plate is fixedly installed on the bottom of the output end of the reset telescopic rod, the round rod is fixedly installed on both ends of the recovery plate, the long plate is fixedly installed on the inner wall of the operating table, the arc plate is rotatably installed on one end of the long plate close to the control console, and the blocking plate is fixedly installed on the bottom of the long plate. The arc plate is blocked by the blocking plate, so that the arc plate cannot rotate toward the bottom. After the arc plate cannot rotate toward the bottom, it will drive the round rod to move toward the top. After the round rod moves to the top, it drives the recovery plate to move toward the top. After the recovery plate moves to the bottom, it no longer contacts the bottom of the operating table.
[0009] According to the above technical solution, a No. 2 torsion spring is arranged between the arc plate and the long plate, the arc plate is in contact with the round rod, the bottom of the operating table is arranged as an inclined surface, and the No. 2 torsion spring is used to drive the arc plate to reset.
[0010] According to the above technical scheme, the protective device includes: a protective door, a handle, a through rod, a limit hook, a hollow block, a baffle and a push rod. The protective door is slidably installed on the top of the base, the handle is fixedly installed on the side of the protective door away from the outer shell, the through rod slides through the side of the operating table close to the protective door, the limit hook is fixedly installed on the end of the through rod close to the protective door, the push rod slides through the inner and outer walls of the protective door, the hollow block is fixedly installed on the end of the push rod close to the outer shell, and the baffle is fixedly installed on the surface. When the push rod is pushed, the movement of the push rod will drive the hollow block to move in the direction of the limit hook. After the hollow block moves, it will no longer limit the limit hook, so that the protective door can be opened when polishing is required under special circumstances.
[0011] According to the above technical solution, the hollow block is in contact with the limit hook, and a No. 3 spring is arranged between the through rod and the operating table, and the through rod is driven by the No. 3 spring to reset.
[0012] According to the above technical solution, a No. 2 spring is arranged between the baffle and the protective door, the recovery plate is in contact with the through rod, and the baffle is driven to reset by the No. 2 spring.
[0013] The present invention provides a high-speed wire polishing device for diamond wire drawing die processing. It has the following beneficial effects: (1) The invention positions irregularly shaped raw materials by rotating the positioning plate, and squeezes the raw materials and fixes the position of the raw materials by moving the second clamping plate, thereby ensuring that the raw materials or raw materials with irregular surface shapes will not be displaced during polishing, preventing the raw materials from moving during polishing, resulting in processing failure or even damage to the raw materials, and ensuring the polishing pass rate. By preventing the first clamping plate and the second clamping plate from continuing to move in the direction of the raw materials, it is prevented that the first clamping plate and the second clamping plate will continue to exert thrust on the raw materials, which may cause damage to the device, thereby improving the protection effect of the device.
[0014] (2) In the present invention, the recovery plate moves in a direction away from the raw material, and the movement of the recovery plate drives the polishing debris to move in the direction of the recovery port, so that the debris can be recovered and the debris that can be reused can be collected and utilized. When the recovery plate moves in the direction of the raw material, the recovery plate does not contact the bottom of the operating table, thereby preventing some debris from being driven to the side away from the recovery port by the recovery plate moving in the opposite direction when not recovered, resulting in the debris being unable to be effectively recovered, thereby improving the practicality of the device.
[0015] (3) In the present invention, after the hollow block moves, it will contact the limit hook and the limit hook will limit the hollow block, so that when the polishing work is in progress, the protective door cannot be opened, so as to prevent the high-speed rotating polishing machine from throwing out debris and causing harm to the operator, thereby improving the protection effect for the operator. After the hollow block moves, the limit hook is no longer limited, so when the protective door needs to be opened for polishing again under special circumstances, the device can be contacted and limited, thereby improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the housing of the present invention; Figure 3 This is a schematic diagram of the internal structure of the operating table of the present invention; Figure 4 It is a structural schematic diagram of the positioning device of the present invention; Figure 5 This is a schematic diagram of the position relationship between the positioning plate and the clamping plate of the present invention; Figure 6 This is a schematic diagram of the positional relationship between the curved plate and the long plate of the present invention; Figure 7 It is a structural schematic diagram of the positional relationship between the hollow block and the partition of the present invention.
[0017] In the figure: 1. base; 2. shell; 3. control console; 4. grinding device; 5. polishing machine; 61. operating table; 62. electric push rod; 63. splint one; 64. reset spring; 65. splint two; 66. arc block; 67. fixing piece; 68. limit block; 69. limit groove; 610. positioning plate; 71. recovery port; 72. positioning rod; 73. rotating rod; 74. reset telescopic rod; 75. recovery plate; 76. round rod; 77. long plate; 78. arc plate; 79. blocking plate; 81. protective door; 82. handle; 83. through rod; 84. limit hook; 85. hollow block; 86. baffle; 87. No. 2 spring; 88. push rod. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0019] See also Figure 1-Figure 5An embodiment of the present invention is: a high-speed wire polishing device for diamond wire drawing die processing, comprising a base 1, a shell 2 is fixedly installed on the top of the base 1, a console 3 is fixedly installed on the surface of the base 1, a grinding device 4 is arranged on the inner wall of the shell 2, a sliding groove is opened on the top of the base 1, a polishing machine 5 is slidably installed inside the sliding groove, and a positioning device is arranged on the top of the base 1, the positioning device comprises: an operating table 61, an electric push rod 62, a clamping plate 1 63, a reset spring 64, a clamping plate 2 65, an arc block 66, a fixing member 67, a limit block 68, a limit groove 69 and a positioning plate 610, the operating table 61 is fixedly installed on the top of the base 1, the fixed end of the electric push rod 62 is fixedly penetrated through the inner and outer walls of the operating table 61, the clamping plate 1 63 is fixedly installed on the output end of the electric push rod 62, and the reset spring 64 is fixed It is fixedly installed on the side of the splint 1 63 away from the electric push rod 62, and the splint 2 65 is connected to the splint 1 63 through the reset spring 64. The surface of the splint 2 65 is provided with a groove, and the positioning plate 610 is rotatably installed on the inner wall of the groove to ensure that the raw material or the raw material with irregular surface shape will not be shifted during the polishing process, to prevent the raw material from moving during polishing, resulting in processing failure or even damage to the raw material, and to ensure the qualified rate of polishing. The arc block 66 is fixedly installed on the side of the splint 2 65 close to the splint 1 63, the fixing part 67 is fixedly installed on the side of the splint 1 63 close to the splint 2 65, the limit block 68 is slidably installed on the inner wall of the fixing part 67, and the limit groove 69 is provided on the inner wall of the operating table 61 to prevent the splint 1 63 and the splint 2 65 from continuously applying thrust to the raw material, which may cause damage to the device, thereby improving the protection effect of the device.
[0020] A torsion spring No. 1 is arranged between the groove and the positioning plate 610 , and the arc block 66 contacts the limit block 68 , and the positioning plate 610 is driven to reset by the torsion spring No. 1.
[0021] A No. 1 spring is provided between the limit block 68 and the fixing member 67 . The limit block 68 contacts the limit groove 69 , and the limit block 68 is driven to reset by the No. 1 spring.
[0022] When the present embodiment is working: the raw material is placed inside the operating table 61, and then the electric push rod 62 is started, and the output end of the electric push rod 62 moves in the direction of the raw material. The movement of the output end of the electric push rod 62 will drive the clamp plate 1 63 to move in the direction of the raw material. The movement of the clamp plate 1 63 will drive the reset spring 64 to move in the direction of the raw material. The movement of the reset spring 64 will drive the clamp plate 2 65 to move in the direction of the raw material. The clamp plate 2 65 will contact the raw material when it moves. The movement of the clamp plate 2 65 will drive the positioning plate 610 to move in the direction of the raw material. The movement of the positioning plate 610 will contact the raw material. The raw material will push the positioning plate 610 to rotate. The rotation of the positioning plate 610 will position the irregularly shaped raw material. The movement of the clamp plate 2 65 will squeeze the raw material and fix the position of the raw material, ensuring that the raw material or the raw material with irregular surface shape will not be offset during the polishing process, preventing the raw material from moving during polishing, resulting in processing failure or even damage to the raw material. To ensure the qualified rate of polishing, after the second splint 65 contacts the raw material, as the first splint 63 continues to move in the direction of the second splint 65, the movement of the second splint 65 will drive the fixing member 67 to move in the direction of the second splint 65, and the movement of the fixing member 67 will drive the limit block 68 to move in the direction of the second splint 65. The movement of the limit block 68 will contact the arc block 66, and the arc block 66 will push the limit block 68 to move in the direction away from the reset spring 64. After the limit block 68 moves, it will contact the limit groove 69. After the limit block 68 contacts the limit groove 69, the limit groove 69 will limit the limit block 68. After the limit block 68 is limited, the first splint 63 cannot continue to move in the direction of the second splint 65, so that after the second splint 65 completes the positioning of the raw material, the first splint 63 and the second splint 65 will not continue to move in the direction of the raw material, so as to prevent the first splint 63 and the second splint 65 from continuously applying thrust to the raw material, which will cause damage to the device and improve the protection effect of the device.
[0023] See also Figure 1-Figure 7On the basis of the above embodiment, in another embodiment of the present invention, a recovery device and a protective device are arranged on the top of the base 1, wherein the recovery device comprises: a recovery port 71, a positioning rod 72, a rotating rod 73, a resetting telescopic rod 74, a recovery plate 75, a round rod 76, a long plate 77, an arc plate 78 and a blocking plate 79, the recovery port 71 is opened on a side of the operating table 61 away from the polishing machine 5, the positioning rod 72 rotates and penetrates the inner and outer walls of the operating table 61, the rotating rod 73 is fixedly mounted on the circumferential surface of the positioning rod 72, the resetting telescopic rod 74 is fixedly mounted on the bottom of the clamping plate 63, and the recovery plate 75 is fixedly mounted on the bottom of the output end of the resetting telescopic rod 74, and the debris can be recovered and the debris that can be reused can be collected and utilized. The round rod 76 is fixedly mounted on both ends of the recovery plate 75, the long plate 77 is fixedly mounted on the inner wall of the operating table 61, and the arc plate 78 is rotatably mounted on the end of the long plate 77 close to the console 3. The blocking plate 79 is fixedly mounted on the bottom of the long plate 77 to prevent some debris from being driven to the side away from the recovery port 71 by the recovery plate 75 moving in the opposite direction when not being recovered, resulting in the debris being unable to be effectively recovered, thereby improving the practicability of the device.
[0024] A second torsion spring is provided between the arc plate 78 and the long plate 77. The arc plate 78 contacts the round rod 76. The bottom of the operating table 61 is provided as an inclined surface. The arc plate 78 is driven to reset by the second torsion spring.
[0025] The protective device includes: a protective door 81, a handle 82, a through rod 83, a limit hook 84, a hollow block 85, a baffle 86 and a push rod 88. The protective door 81 is slidably installed on the top of the base 1, the handle 82 is fixedly installed on the side of the protective door 81 away from the shell 2, the through rod 83 slides through the side of the operating table 61 close to the protective door 81, the limit hook 84 is fixedly installed on the end of the through rod 83 close to the protective door 81, the push rod 88 slides through the inner and outer walls of the protective door 81, and the hollow block 85 is fixedly installed on the end of the push rod 88 close to the shell 2, so that the protective door 81 cannot be opened during polishing work, preventing the high-speed rotating polishing machine 5 from throwing out debris, causing injury to the operator, and improving the protection effect on the operator. The baffles 86 are fixedly installed on the surface and can be contacted and limited by the device to improve the practicality of the device.
[0026] The hollow block 85 is in contact with the limit hook 84 , and a No. 3 spring is provided between the through rod 83 and the operating table 61 , and the through rod 83 is driven by the No. 3 spring to be reset.
[0027] A No. 2 spring 87 is provided between the baffle plate 86 and the protective door 81 , and the recovery plate 75 is in contact with the through rod 83 , and the No. 2 spring 87 drives the baffle plate 86 to reset.
[0028] When the present embodiment is working, when the splint 63 moves away from the raw material, the movement of the splint 63 will drive the reset telescopic rod 74 to move away from the raw material, and the movement of the reset telescopic rod 74 will drive the recovery plate 75 to move away from the raw material. The movement of the recovery plate 75 will collect the polishing debris at the bottom of the operating table 61, and the recovery plate 75 will move away from the raw material. The movement of the recovery plate 75 will drive the polishing debris to move in the direction of the recovery port 71, so that the debris can be recovered and the debris that can be reused can be collected and utilized. When the recovery plate 75 moves in the direction of the raw material, the movement of the recovery plate 75 will drive the round rod 76 to move in the direction of the raw material, and the movement of the round rod 76 will arc The arc plate 78 contacts with the round rod 76, and after the round rod 76 contacts with the arc plate 78, the arc plate 78 is blocked by the blocking plate 79, so that the arc plate 78 cannot rotate toward the bottom. After the arc plate 78 cannot rotate toward the bottom, it will drive the round rod 76 to move toward the top. After the round rod 76 moves toward the top, it drives the recovery plate 75 to move toward the top. After the recovery plate 75 moves to the bottom, it no longer contacts the bottom of the operating table 61, so that when the recovery plate 75 moves toward the direction of the raw material, the recovery plate 75 does not contact the bottom of the operating table 61, preventing some debris from being driven to the side away from the recovery port 71 by the recovery plate 75 moving in the opposite direction when not being recovered, resulting in the debris cannot be effectively recovered, thereby improving the practicability of the device.
[0029] When the handle 82 is pulled manually, the movement of the handle 82 will drive the protective door 81 to move, and the movement of the protective door 81 will drive the push rod 88 to move in the direction of the limit hook 84, and the movement of the push rod 88 will drive the hollow block 85 to move. When the recovery plate 75 moves in the direction of the raw material, the recovery plate 75 will no longer contact the penetration rod 83 after moving. After the recovery plate 75 moves and no longer contacts the penetration rod 83, the penetration rod 83 is driven to move in the direction of the protective door 81 through the reset of the No. 3 spring, and the movement of the penetration rod 83 will drive the limit hook 84 to move in the direction of the protective door 81, and the hollow block 85 will contact the limit hook 84 after moving. After the hollow block 85 moves, it will contact the limit hook 84, and the limit hook 84 will limit the hollow block 85, so that the protective door 81 cannot be opened during polishing work, to prevent the high-speed rotating polishing machine 5 from throwing out debris and causing harm to the operator, thereby improving the protection effect on the operator, pushing the push rod 88, and the movement of the push rod 88 will drive the hollow block 85 to move in the direction of the limit hook 84. After the hollow block 85 moves, it will no longer limit the limit hook 84, so that when polishing needs to be opened under special circumstances, the protective door 81 can be contacted and limited by this device, thereby improving the practicality of the device.
[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-speed wire polishing device for diamond wire drawing die processing, comprising a base (1), Features: A shell (2) is fixedly mounted on the top of the base (1), a console (3) is fixedly mounted on the surface of the base (1), a polishing device (4) is arranged on the inner wall of the shell (2), a sliding groove is opened on the top of the base (1), a polishing machine (5) is slidably mounted inside the sliding groove, and a positioning device, a recovery device and a protective device are arranged on the top of the base (1); The positioning device comprises: an operating table (61), an electric push rod (62), a clamping plate (63), a return spring (64), a clamping plate (65), a curved surface block (66), a fixing member (67), a limit block (68), a limit groove (69) and a positioning plate (610), wherein the operating table (61) is fixedly mounted on the top of the base (1), the fixed end of the electric push rod (62) is fixedly passed through the inner and outer walls of the operating table (61), the clamping plate (63) is fixedly mounted on the output end of the electric push rod (62), and the return spring (64) is fixedly mounted on the far end of the clamping plate (63). On the side away from the electric push rod (62), the second clamping plate (65) is connected to the first clamping plate (63) through a reset spring (64), the surface of the second clamping plate (65) is provided with a groove, the positioning plate (610) is rotatably mounted on the inner wall of the groove, the arc block (66) is fixedly mounted on the side of the second clamping plate (65) close to the first clamping plate (63), the fixing member (67) is fixedly mounted on the side of the first clamping plate (63) close to the second clamping plate (65), the limit block (68) is slidably mounted on the inner wall of the fixing member (67), and the limit groove (69) is opened on the inner wall of the operating table (61).
2. A high-speed wire polishing device for diamond wire drawing die processing according to claim 1, Features: A first torsion spring is provided between the groove and the positioning plate (610), and the arc surface block (66) is in contact with the limiting block (68).
3. A high-speed wire polishing device for diamond wire drawing die processing according to claim 2, Features: A No. 1 spring is provided between the limit block (68) and the fixing member (67), and the limit block (68) is in contact with the limit groove (69).
4. A high-speed wire polishing device for diamond wire drawing die processing according to claim 3, Features: The recovery device comprises: a recovery port (71), a positioning rod (72), a rotating rod (73), a resetting telescopic rod (74), a recovery plate (75), a round rod (76), a long plate (77), a curved plate (78) and a blocking plate (79), wherein the recovery port (71) is opened on a side of the operating table (61) away from the polishing machine (5), the positioning rod (72) rotates and penetrates the inner and outer walls of the operating table (61), the rotating rod (73) is fixedly mounted on the circumferential surface of the positioning rod (72), the resetting telescopic rod (74) is fixedly mounted on the bottom of the clamping plate (63), the recovery plate (75) is fixedly mounted on the bottom of the output end of the resetting telescopic rod (74), the round rod (76) is fixedly mounted on both ends of the recovery plate (75), the long plate (77) is fixedly mounted on the inner wall of the operating table (61), the curved plate (78) is rotatably mounted on one end of the long plate (77) close to the control console (3), and the blocking plate (79) is fixedly mounted on the bottom of the long plate (77).
5. A high-speed wire polishing device for diamond wire drawing die processing according to claim 4, Features: A second torsion spring is provided between the arc-shaped plate (78) and the long plate (77), the arc-shaped plate (78) is in contact with the round rod (76), and the bottom of the operating table (61) is arranged as an inclined surface.
6. A high-speed wire polishing device for diamond wire drawing die processing according to claim 5, Features: The protective device comprises: a protective door (81), a handle (82), a penetration rod (83), a limit hook (84), a hollow block (85), a baffle (86) and a push rod (88), wherein the protective door (81) is slidably mounted on the top of the base (1), the handle (82) is fixedly mounted on a side of the protective door (81) away from the housing (2), the penetration rod (83) is slidably penetrated on a side of the operating table (61) close to the protective door (81), the limit hook (84) is fixedly mounted on one end of the penetration rod (83) close to the protective door (81), the push rod (88) is slidably penetrated on the inner and outer walls of the protective door (81), the hollow block (85) is fixedly mounted on one end of the push rod (88) close to the housing (2), and the baffle (86) is fixedly mounted on the surface.
7. A high-speed wire polishing device for diamond wire drawing die processing according to claim 6, Features: The hollow block (85) is in contact with the limit hook (84), and a No. 3 spring is provided between the through rod (83) and the operating table (61).
8. A high-speed wire polishing device for diamond wire drawing die processing according to claim 7, Features: A No. 2 spring (87) is provided between the baffle plate (86) and the protective door (81), and the recovery plate (75) is in contact with the penetration rod (83).
Citation Information
Patent Citations
High-speed wire polishing device for machining diamond wire-drawing die
CN210756820U
Wire polishing device for diamond wire-drawing die machining
CN214025123U
Die hole polishing equipment
JP2009090427A
Cited By
Numerical control lathe for machining sighting telescope precise workpiece
CN120961958A
Numerical control lathe for processing precision workpiece of sighting telescope
CN120961958B
