Coated part and preparation method thereof

Abstract

The film-coated member comprises: a substrate; the corrosion-resistant layer is arranged on the surface of the substrate and is formed by adopting an atomic layer deposition technology; the light absorption layer is arranged on the surface, away from the substrate, of the corrosion-resistant layer, the thickness of the light absorption layer is 1-100 nm, and the light absorption layer is used for reducing interference of the substrate on the color of the coated part; the light interference layer is arranged on the surface, away from the substrate, of the light absorption layer, the light interference layer is a laminated layer of at least two sublayers made of different materials, the materials of the sublayers are selected from at least one of oxides, simple substances, carbides, nitrides and sulfides, and the thickness of the light interference layer is 100-2000 nm; and the wear-resistant layer is arranged on the surface, deviating from the substrate, of the light interference layer and is formed by adopting an atomic layer deposition technology. And the coated part is red. Through the comprehensive superposition effect of the four layers, the coated part presents a red appearance which is most difficult to produce at present, and the decorative effect of the coated part is greatly improved. The invention further provides a preparation method of the coated part.

Description

Technical Field

[0001] The present application relates to a red coated part and a preparation method thereof. Background Art

[0002] In the prior art, in order to make the substrate (such as mobile phone housing, jewelry, glasses frame, etc.) have a red decorative effect, a red film layer is usually deposited on the surface of the substrate by physical vapor deposition (PVD). However, due to the limitations of the PVD process itself, the PVD film layer is usually not dense enough and has poor shape retention (maintaining the same shape as the surface of the appearance part), and PVD is usually unable to form a film layer of uniform thickness on the surface of the three-dimensional heterogeneous structure, and the color effect of the film layer is closely related to the uniformity of the thickness, so this is disastrous for the regulation of the final color effect of the film layer. In addition, because the PVD film layer is not dense enough and has poor corrosion resistance, the PVD film layer on the surface of the substrate is easily corroded during artificial sweat and salt spray tests, resulting in film peeling. Summary of the invention

[0003] In view of this, the present application provides a coated part, comprising:

[0004] substrate;

[0005] A corrosion-resistant layer is disposed on the surface of the substrate and is formed by atomic layer deposition technology;

[0006] A light absorbing layer is arranged on the surface of the corrosion resistant layer away from the substrate, the thickness of the light absorbing layer is 1nm-100nm, and the function of the light absorbing layer is to reduce the interference of the substrate on the color of the coated part;

[0007] an optical interference layer, disposed on a surface of the light absorbing layer away from the substrate, the optical interference layer being a stack of at least two sublayers of different materials, the material of the sublayer being selected from at least one of oxides, simple substances, carbides, nitrides, and sulfides, and the thickness of the optical interference layer being 100 nm to 2000 nm; and

[0008] The wear-resistant layer is arranged on the surface of the light interference layer away from the substrate and is formed by using atomic layer deposition technology, and the coated part appears red.

[0009] The coated part of the present application forms a corrosion-resistant layer, a light-absorbing layer, a light interference layer and a wear-resistant layer on the substrate in sequence. Through the comprehensive superposition of the four layers, the coated part presents a red appearance, which is currently the most difficult to produce, and greatly improves the decorative effect of the coated part. In addition, each film layer is dense, and a corrosion-resistant layer and a wear-resistant layer are provided, so that the coated part as a whole is both corrosion-resistant and wear-resistant.

[0010] The present application also provides a method for preparing a coated part, comprising the following steps:

[0011] Providing a substrate, and forming a corrosion-resistant layer on the surface of the substrate by using an atomic layer deposition technique;

[0012] forming a light absorbing layer on the surface of the corrosion-resistant layer away from the substrate, wherein the thickness of the light absorbing layer is 1 nm-100 nm;

[0013] forming an optical interference layer on the surface of the light absorbing layer away from the substrate, wherein the optical interference layer is a stack of at least two sublayers of different materials, the material of the sublayer is selected from at least one of oxides, simple substances, carbides, nitrides, and sulfides, and the thickness of the optical interference layer is 100nm-2000nm;

[0014] Atomic layer deposition technology is used to form a wear-resistant layer on the surface of the light interference layer away from the substrate, and the coated part appears red. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic cross-sectional view of a coating component according to an embodiment of the present application.

[0016] Description of main component symbols:

[0017] Coated parts 100

[0018] Base 10

[0019] Corrosion resistant layer 20

[0020] Light absorbing layer 30

[0021] Light interference layer 40

[0022] Wear-resistant layer 50 DETAILED DESCRIPTION

[0023] See also Figure 1 The embodiment of the present application provides a coated article 100, comprising a substrate 10 and a corrosion-resistant layer 20, a light-absorbing layer 30, a light interference layer 40 and a wear-resistant layer 50 sequentially stacked on the surface of the substrate 10. The corrosion-resistant layer 20 is located at the innermost side of the substrate 10. The light-absorbing layer 30 is disposed on the surface of the corrosion-resistant layer 20 away from the substrate 10. The light interference layer 40 is disposed on the surface of the light-absorbing layer 30 away from the substrate 10. The wear-resistant layer 50 is disposed on the surface of the light interference layer 40 away from the substrate 10. The combined effect of the four layers of the corrosion-resistant layer 20, the light-absorbing layer 30, the light interference layer 40 and the wear-resistant layer 50 makes the coated article 100 present a red appearance.

[0024] When the surface of the substrate 10 on which the film is formed is flat, the corrosion-resistant layer 20 and the wear-resistant layer 50 are both formed using atomic layer deposition technology, and there are no special requirements for the formation method of the light absorption layer 30 and the light interference layer 40. For example, physical vapor deposition or atomic layer deposition can be used.

[0025] In some embodiments, the corrosion-resistant layer 20, the light-absorbing layer 30, the light-interference layer 40, and the wear-resistant layer 50 are all formed by atomic layer deposition technology. In particular, for a substrate 10 having a complex three-dimensional structure, the corrosion-resistant layer 20, the light-absorbing layer 30, the light-interference layer 40, and the wear-resistant layer 50 are all formed by atomic layer deposition technology.

[0026] Atomic layer deposition (ALD) is a method of forming a thin film by alternately passing gaseous precursors and reactants into a reaction chamber and causing surface chemical reactions on the substrate. Through self-limiting precursor alternating saturation reactions, a thin film with highly controllable thickness, composition, morphology and structure at the nanoscale is obtained. This method has no restrictions on the substrate and is particularly suitable for substrates with high aspect ratios or complex three-dimensional structures. The thin films prepared by atomic layer deposition have excellent properties such as high density (no pinholes), high conformality and large-area uniformity.

[0027] Since the corrosion-resistant layer 20 is formed by atomic layer deposition technology, it has a dense structure and uniform thickness, has fewer defects than the PVD film layer, and can effectively block the erosion of the corrosive liquid. The wear-resistant layer 50 located on the outermost side of the substrate 10 is formed by atomic layer deposition technology, and also has a dense structure and uniform thickness, so it effectively plays a role in wear resistance and effectively protects the internal film layer from being scratched.

[0028] In the present application, the substrate 10 can be made of various plastics, metals, and ceramics. The metal material can be stainless steel, aluminum alloy, titanium alloy, etc., but is not limited thereto.

[0029] The coated part 100 is a mobile phone middle frame, a computer frame, a watch case, a watch strap, jewelry, a glasses frame, a lighting fixture, or luggage hardware.

[0030] The function of the corrosion-resistant layer 20 is to prevent corrosion by the corrosive liquid. In some embodiments, the material of the corrosion-resistant layer 20 is an oxide, but not limited to this. For example, the oxide can be Al 2 O 3 、ZrO 2 , HfO 2 The thickness of the corrosion-resistant layer 20 is 1 nm-50 nm, for example, 1 nm, 3 nm, 5 nm, 7 nm, 9 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm.

[0031] The function of the light absorbing layer 30 is to reduce the interference of the substrate 10 on the color finally presented by the coating part 100. In some embodiments, the material of the light absorbing layer 30 is TiAlC, Cu, Au, Pt, MoS 2 The light absorbing layer 30 has a thickness of 1 nm to 100 nm, for example, 1 nm, 5 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, or 100 nm.

[0032] The function of the light interference layer 40 is to interfere with light, and it is also the core film layer that finally forms the red appearance. The light interference layer 40 is a stack of at least two sublayers of different materials. The material of the sublayer can be selected from at least one of oxides, simple substances, carbides, nitrides, and sulfides. The thickness of the light interference layer 40 is 100nm-2000nm, for example 100nm, 200nm, 300nm, 500nm, 700nm, 900nm, 1000nm, 1200nm, 1400nm, 1600nm, 1800nm, 2000nm.

[0033] In some embodiments, the oxide is selected from TiO 2 、SiO 2 、Al 2 O 3 、ZrO 2 , HfO 2 、 2 O 5 and Nb 2 O 5 At least one of .

[0034] In some embodiments, the element, such as the metal element, is selected from at least one of Cu, Ag, Pt and Au.

[0035] In some embodiments, the carbide is selected from TiC, ZrC, HfC, VC, NbC, TaC, Cr 3 C 2 、TiAlC、Mo 2 At least one of C and WC.

[0036] In some embodiments, the nitride is selected from TiN, ZrN, HfN, VN, NbN, TaN, CrN, AlN and Si 3 N 4 At least one of .

[0037] In some embodiments, the sulfide is selected from MoS 2 、GaS x , GeS, MoS 2 , Li 2 S, CoSx 、NiS x , MnS, FeS x VS 4 、ReS 2 , HfS 2 、ZrS 2 、AlS x , ZnS, CaS, BaS, SrS, CdS, TiS 2 、ZnS、PbS、In 2 S, Cu x S, WS, TiS, Sb 2 At least one of S and SnS, wherein 0<X≤3.

[0038] The light interference layer 40 is a stack of multiple layers. In some embodiments, the light interference layer 40 is a stack of different oxide layers, such as TiO 2 Layer and SiO 2 Layer stacking, Al 2 O 3 Layer and Nb 2 O 5 Layer stacking, Ta 2 O 5 Layer and Nb 2 O 5 There is no particular limitation on the number of sub-layers in the stacking of the layers, as long as the total thickness of the light interference layer 40 is controlled to be 100 nm to 2000 nm.

[0039] In some embodiments, the optical interference layer 40 is a stack of different single-element layers, such as a stack of a Cu layer and an Ag layer.

[0040] In some embodiments, the light interference layer 40 is a stack of different carbide layers, such as a stack of a ZrC layer and a NbC layer.

[0041] In some embodiments, the optical interference layer 40 is a stack of different nitride layers, such as a TiN layer and a Si 3 N 4 Layers of stacking.

[0042] In some embodiments, the optical interference layer 40 is a stack of different sulfide layers.

[0043] In some embodiments, the light interference layer 40 is a stack of at least two of an oxide layer, a single substance layer, a carbide layer, and a nitride layer. 2 layer and a stack of TiN layers.

[0044] The wear-resistant layer 50 is located at the outermost side and has wear-resistant properties, effectively protecting other internal film layers. In some embodiments, the material of the wear-resistant layer 50 may be an oxide or a nitride. The thickness of the wear-resistant layer 50 is 200-2000nm, for example, 200nm, 300nm, 400nm, 500nm, 700nm, 900nm, 1000nm, 1200nm, 1400nm, 1600nm, 1800nm, 2000nm. For example, the metal oxide may be selected from ZrO 2 、Al 2 O 3 At least one of the following. The nitride may be selected from TiN, ZrN, HfN, VN, NbN, TaN, CrN, AlN, Si 3 N 4 At least one of .

[0045] Table 1 lists various designs of the film structures of the corrosion-resistant layer 20, the light-absorbing layer 30, the light interference layer 40 and the wear-resistant layer 50 as examples.

[0046] Table 1

[0047]

[0048]

[0049] The present application also provides a method for preparing the above-mentioned coated part, comprising the following steps:

[0050] Providing a substrate, and forming a corrosion-resistant layer on a surface of the substrate by using an atomic layer deposition technique;

[0051] Atomic layer deposition technology is used to form a light absorbing layer on the surface of the corrosion-resistant layer away from the substrate;

[0052] Atomic layer deposition technology is used to form a light interference layer on the surface of the light absorbing layer away from the substrate. The material of the light interference layer is selected from at least one of oxides, simple substances, carbides, nitrides, and sulfides. The thickness of the light interference layer 40 is 100nm-2000nm. The light interference layer 40 is a stack of at least two different material layers.

[0053] Atomic layer deposition technology is used to form a wear-resistant layer 50 on the surface of the optical interference layer facing away from the substrate.

[0054] It is understandable that in some embodiments, at least one of the light absorbing layer 30 and the light interference layer 40 may also be formed by physical vapor deposition. The physical vapor deposition method generally includes the following steps: the first step is to place the substrate in a physical vapor deposition system and evacuate the system; the second step is to turn on the heating or DC / RF power supply to deposit the target material on the surface of the substrate by evaporation or magnetron sputtering; the third step is to deposit the film to a certain thickness and then end the deposition.

[0055] Atomic layer deposition technology includes two different methods: time-based and space-based.

[0056] Time-based atomic layer deposition technology includes the following steps:

[0057] The first step is to place the substrate in an atomic layer deposition chamber and evacuate the chamber to 0.01 torr-0.1 torr.

[0058] The second step is to introduce a metal organic compound or a metal inorganic compound precursor in a pulsed form within a temperature range of 20°C to 400°C, so that the precursor is chemically adsorbed on the surface of the substrate;

[0059] The third step is to introduce 1 sccm-10000 sccm of inert gas (such as N 2 , Ar gas) for 0.01s-200s;

[0060] The fourth step is to introduce reactants into the atomic layer deposition chamber to allow the reactants to react with the adsorbed precursors;

[0061] Step 5: introduce 1 sccm-10000 sccm of inert gas (such as N 2 , Ar gas) for 0.01s-200s;

[0062] Step 6: Repeat steps 2 to 5, and perform cyclic deposition to sequentially form an anti-corrosion layer, a light-absorbing layer, a light interference layer, and a wear-resistant layer.

[0063] In the above steps, the precursor is a metal organic compound or a metal inorganic compound, the reactant is at least one of oxygen-containing, nitrogen-containing, and carbon-containing reactants, and the inert gas is purged to remove excess gas and by-products from the reaction chamber.

[0064] The spatial atomic layer deposition technology includes the following steps:

[0065] The first step is to place the substrate in a space-type atomic layer deposition system, and after evacuation, introduce the isolation gas, precursor, and reactant into the space-type atomic layer deposition system in sequence or simultaneously within the range of 20°C-400°C;

[0066] The second step is to start the moving device to move the substrate through the deposition area of ​​the system at least once to form an anti-corrosion layer, a light absorption layer, a light interference layer, and a wear-resistant layer.

[0067] In the above steps, the precursor is a metal organic or metal inorganic compound, the reactant is at least one of oxygen-containing, nitrogen-containing, carbon-containing, and sulfur-containing reactants, and the isolation gas is an inactive gas. The introduction speed of the isolation gas is 0.1sccm-100000sccm, and the moving speed of the moving device for moving the substrate is 0.1m / min-200m / min, or the rotation speed is 0.1° / s-720° / s. For the synthesis of a single substance film layer, two precursors can be introduced for reaction, or the same precursor and reactant can react.

[0068] In the above steps, suitable precursors and reactants are selected according to the material composition of the anti-corrosion layer, light absorption layer, light interference layer and wear-resistant layer to be prepared.

[0069] The precursor is a metal organic or metal inorganic compound. Table 2 lists several precursors used in the steps of preparing the film layer. For example, if the film layer is a titanium compound, the precursor can be selected from at least one of tetrakis(dimethylamino)titanium, tetrakis(ethylmethylamino)titanium, and titanium tetrachloride. If the film layer is a silicon compound, the precursor can be selected from at least one of bis(diethylamino)silane, tetrakis(ethylmethylamino)silane, and trimethoxysilanol. If the film layer is a vanadium compound, the precursor can be selected from at least one of acetylacetonate vanadium, tetrakis(diethylamino)vanadium, and bis(cyclopentadienyl)vanadium. If the film layer is a zirconium compound, the precursor can be selected from at least one of tetrakis(dimethylamino)zirconium, bis(cyclopentadienyl)dimethyl zirconium, and dimethylbis(tert-butylcyclopentadienyl)zirconium. If the film layer is a hafnium compound, the precursor can be selected from at least one of ethoxide hafnium, di(isopropylcyclopentadienyl)hafnium dichloride, and tetrakis(dimethylamino)hafnium. If the film layer is an aluminum compound, the precursor can be selected from at least one of trimethylaluminum, triethylaluminum, and ethoxide aluminum. If the film layer is a tantalum compound, the precursor can be selected from at least one of penta(dimethylamino)tantalum, tert-butyliminotri(ethylmethylamino)tantalum, and tert-butyliminotri(diethylamino)tantalum. If the film layer is a niobium compound, the precursor can be selected from at least one of penta(dimethylamino)niobium, tert-butyliminotri(ethylmethylamino)niobium, and tert-butyliminotri(diethylamino)niobium. If the film layer is a chromium compound, the precursor can be selected from at least one of chromium chloride, acetylacetonate chromium, and bis(phenyl)chromium. If the film layer is a molybdenum compound, the precursor can be selected from at least one of bis(tert-butylimino)-bis(dimethylamino)molybdenum and molybdenum chloride. If the film layer is a tungsten compound, the precursor can be selected from bis(tert-butylimino)bis(dimethylamino)tungsten.

[0070] If the film layer is a gallium compound, the precursor may be selected from at least one of gallium chloride and gallium acetylacetonate. If the film layer is a germanium compound, the precursor may be selected from tetrakis(dimethylamino)germanium. If the film layer is a cobalt compound, the precursor may be selected from at least one of cobalt acetylacetonate and bis(cyclopentadienyl)cobalt. If the film layer is a nickel compound, the precursor may be selected from at least one of nickelocene and di(methylcyclopentadienyl)nickel. If the film layer is a manganese compound, the precursor may be selected from at least one of tris(tetramethylheptanedione)manganese and N,N'-diisopropylacetamidine manganese. If the film layer is an iron compound, the precursor may be selected from at least one of ferric acetylacetonate and tert-butylferrocene. If the film layer is a rhenium compound, the precursor may be selected from at least one of trimethylsilyl perrhenate and tricarbonylcyclopentadienyl rhenium. If the film layer is a zinc compound, the precursor may be selected from diethyl zinc. If the film layer is a compound of calcium, the precursor may be selected from calcium hexafluoroacetylacetonate dihydrate. If the film layer is a compound of barium, the precursor may be selected from bis(triisopropylcyclopentadienyl)barium. If the film layer is a compound of strontium, the precursor may be selected from bis(triisopropylcyclopentadienyl)strontium. If the film layer is a compound of cadmium, the precursor may be selected from at least one of cadmium acetylacetonate and dimethyl cadmium. If the film layer is a compound of lead, the precursor may be selected from lead hexafluoroacetylacetonate. If the film layer is a compound of indium, the precursor may be selected from cyclopentadienyl indium. If the film layer is a compound of copper, the precursor may be selected from at least one of di(dimethylamine-2-propanol)copper and bis(hexafluoroacetylacetonate). If the film layer is a compound of antimony, the precursor may be selected from at least one of antimony chloride and antimony n-butoxide. If the film layer is a compound of platinum, the precursor may be selected from trimethylmethylcyclopentadienyl platinum. If the film layer is a gold compound, the precursor can be selected from at least one of trimethyl (trimethylphosphine) gold and trimethyl (triethylphosphine) gold. If the film layer is a silver compound, the precursor can be selected from triethylphosphine (heptafluoro-2,2-dimethyl-3,5-octanedionate) silver.

[0071] Table 2

[0072]

[0073]

[0074]

[0075] Table 3 lists the reactants used in the steps of preparing the film layer. The reactants corresponding to the oxides may be reactants containing oxygen, specifically H 2 O, O 3 or oxygen plasma. The reactant corresponding to the nitride may be a nitrogen-containing reactant, specifically NH 3 or N 2 H 4The reactant corresponding to the carbide may be a reactant containing carbon, specifically trimethylaluminum or triethylaluminum. The reactant corresponding to the sulfide may be a reactant containing sulfur, specifically H 2 S. The reactant corresponding to the hydride may be a reactant of hydrogen sulfide, specifically H 2 plasma.

[0076] Table 3

[0077]

[0078] The coated article 100 of the present application forms a corrosion-resistant layer 20, a light-absorbing layer 30, a light interference layer 40 and a wear-resistant layer 50 on a substrate 10 in sequence. Through the comprehensive superposition of the four layers, the coated article 100 presents a red appearance, which is currently the most difficult to produce, and greatly improves the decorative effect of the coated article 100. In addition, each film layer is dense, and the corrosion-resistant layer 20 and the wear-resistant layer 50 are provided, so that the coated article 100 as a whole is both corrosion-resistant and wear-resistant.

[0079] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A coated part, characterized in that: include: substrate; A corrosion-resistant layer is disposed on the surface of the substrate and is formed by atomic layer deposition technology; A light absorbing layer is arranged on the surface of the corrosion resistant layer away from the substrate, the thickness of the light absorbing layer is 1nm-100nm, and the function of the light absorbing layer is to reduce the interference of the substrate on the color of the coated part; an optical interference layer, disposed on a surface of the light absorbing layer away from the substrate, the optical interference layer being a stack of at least two sublayers of different materials, the material of the sublayer being selected from at least one of oxides, simple substances, carbides, nitrides, and sulfides, and the thickness of the optical interference layer being 100 nm to 2000 nm; and The wear-resistant layer is arranged on the surface of the light interference layer away from the substrate and is formed by using atomic layer deposition technology, and the coated part appears red.

2. The coated article according to claim 1, characterized in that: The material of the corrosion-resistant layer is oxide, and the thickness is 1nm-50nm.

3. The coated article according to claim 2, characterized in that: The oxide of the corrosion-resistant layer is selected from at least one of Al2O3, ZrO2, and HfO2.

4. The coated article according to claim 1, characterized in that: The material of the light absorbing layer is selected from at least one of TiAlC, Cu, Au, Pt, and MoS2.

5. The coated article according to claim 1, characterized in that: The at least two sub-layers contain different simple substances; or, the at least two sub-layers contain different carbides; or, The at least two sub-layers contain different nitrides; or, The at least two sublayers contain different sulfides; or, The at least two sub-layers are at least two of an oxide layer, a single substance layer, a carbide layer, and a nitride layer.

6. The coated article according to claim 1, characterized in that: The oxide of the sublayer is selected from at least one of TiO2, SiO2, Al2O3, ZrO2, HfO2, Ta2O5 and Nb2O5; The single substance of the sublayer is selected from at least one of Cu, Ag, Pt and Au; The carbide of the sublayer is selected from at least one of TiC, ZrC, HfC, VC, NbC, TaC, Cr3C2, TiAlC, Mo2C and WC; The nitride of the sublayer is selected from at least one of TiN, ZrN, HfN, VN, NbN, TaN, CrN, AlN and Si3N4; The sulfide of the sublayer is selected from MoS2, GaS x 、GeS、MoS2、Li2S、CoS x 、NiS x , MnS, FeS x , VS4, ReS2, HfS2, ZrS2, AlS x , ZnS, CaS, BaS, SrS, CdS, TiS2, ZnS, PbS, In2S, Cu x At least one of S, WS, TiS, Sb2S, SnS, wherein 0<X≤3.

7. The coated article according to claim 1, characterized in that: The material of the wear-resistant layer is oxide or nitride, and the thickness of the wear-resistant layer is 200-2000nm.

8. The coated article according to claim 7, characterized in that: The oxide of the wear-resistant layer is selected from at least one of ZrO2 and Al2O3; the nitride of the wear-resistant layer is selected from at least one of TiN, ZrN, HfN, VN, NbN, TaN, CrN, AlN, and Si3N4.

9. A method for preparing a coated part, characterized in that: The steps include: Providing a substrate, and forming a corrosion-resistant layer on the surface of the substrate by using an atomic layer deposition technique; forming a light absorbing layer on the surface of the corrosion-resistant layer away from the substrate, wherein the thickness of the light absorbing layer is 1 nm-100 nm; forming an optical interference layer on the surface of the light absorbing layer away from the substrate, wherein the optical interference layer is a stack of at least two sublayers of different materials, the material of the sublayer is selected from at least one of oxides, simple substances, carbides, nitrides, and sulfides, and the thickness of the optical interference layer is 100nm-2000nm; Atomic layer deposition technology is used to form a wear-resistant layer on the surface of the light interference layer away from the substrate, and the coated part appears red.

10. The method for preparing a coated part according to claim 9, characterized in that: The material of the corrosion-resistant layer is oxide, with a thickness of 1nm-50nm, and the oxide of the corrosion-resistant layer is selected from at least one of Al2O3, ZrO2, and HfO2; The material of the light absorbing layer is selected from at least one of TiAlC, Cu, Au, Pt, and MoS2; The oxide of the sublayer is selected from at least one of TiO2, SiO2, Al2O3, ZrO2, HfO2, Ta2O5 and Nb2O5; The single substance of the sublayer is selected from at least one of Cu, Ag, Pt and Au; The carbide of the sublayer is selected from at least one of TiC, ZrC, HfC, VC, NbC, TaC, Cr3C2, TiAlC, Mo2C and WC; The nitride of the sublayer is selected from at least one of TiN, ZrN, HfN, VN, NbN, TaN, CrN, AlN and Si3N4; The sulfide of the sublayer is selected from MoS2, GaS x 、GeS、MoS2、Li2S、CoS x 、NiS x , MnS, FeS x , VS4, ReS2, HfS2, ZrS2, AlS x , ZnS, CaS, BaS, SrS, CdS, TiS2, ZnS, PbS, In2S, Cu x At least one of S, WS, TiS, Sb2S, SnS, where 0<X≤3; The material of the wear-resistant layer is oxide or nitride, the thickness of the wear-resistant layer is 200-2000nm, the oxide of the wear-resistant layer is selected from at least one of ZrO2 and Al2O3; the nitride of the wear-resistant layer is selected from at least one of TiN, ZrN, HfN, VN, NbN, TaN, CrN, AlN, and Si3N4.

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