Test seat

Abstract

The invention discloses a test seat, which is suitable for being locked on a circuit board and can be used for testing an object to be tested, and the object to be tested has a warping degree to define a first surface appearance, the testing seat comprises a base, a plurality of elastic metal pieces arranged in the base and a conductive elastic piece which is arranged above the base and can conform to the first surface appearance so as to be electrically connected with the object to be tested, and the conductive elastic piece can be in contact with the elastic metal pieces under the first surface appearance. Therefore, the problem of poor contact between the to-be-detected object and the elastic metal piece can be solved.

Description

Technical Field

[0001] The present invention relates to semiconductor testing technology, and in particular to a test socket. Background Art

[0002] Semiconductor packaging testing often places an object to be tested, such as a semiconductor package or chip, into a test socket with multiple probes. After each probe contacts the electrical connection pad or solder ball of the object to be tested, the test signal is transmitted to the object to be tested through each probe to achieve the purpose of testing. However, the direct contact between the probe and the object to be tested can easily cause mutual wear between the probe and the electrical connection pad or solder ball, thereby affecting the functions of each other.

[0003] Furthermore, as the design size of the object to be tested gradually increases, for example, above 65mm*65mm, the packaged object to be tested will face an increasingly large warpage phenomenon, that is, the surface of the object to be tested is not a flat plane. In addition, the probes provided in the base may have different heights in actual use, resulting in the tip of each probe not being on the same horizontal plane. The aforementioned various conditions will cause poor contact between the probe and the object to be tested. In this regard, how to improve the problem of poor contact between the object to be tested and the probe will become a goal that people in this technical field are eager to pursue. Summary of the invention

[0004] To solve the above-mentioned problems of the prior art, the present invention discloses a test socket, which is suitable for being locked on a circuit board and used to test an object under test, wherein the object under test has a warping degree to define a first surface morphology. The test socket comprises: a base; a plurality of elastic metal parts disposed in the base; and a conductive elastic sheet located above the base and conforming to the first surface morphology to electrically connect the object under test.

[0005] In one embodiment, the conductive elastic sheet is ductile and can be deformed to contact the top of each of the elastic metal members.

[0006] In a specific embodiment, the multiple elastic metal parts include at least one first elastic metal part and at least one second elastic metal part. When the base is locked on the circuit board, the top of the at least one first elastic metal part and the top of the at least one second elastic metal part are located at different heights, thereby defining a second surface morphology, and the conductive elastic sheet conforms to the second surface morphology.

[0007] In another embodiment, the conductive elastic sheet includes a first substrate layer and a second substrate layer stacked together.

[0008] In another embodiment, the first substrate layer is made of silicon (Si) gel, and the second substrate layer is made of polymer material.

[0009] In another embodiment, the thickness ratio of the second substrate layer in the conductive elastic sheet is 25% to 75%.

[0010] In another embodiment, the first substrate layer includes a plurality of conductive elastic regions respectively corresponding to the elastic metal members and a plurality of conductive particles distributed in the conductive elastic regions.

[0011] In another embodiment, the second substrate layer is a frame-shaped structure, and each of the conductive elastic regions corresponds to a hollow area of ​​the frame-shaped structure.

[0012] In another embodiment, the test seat further includes a plurality of guide pins, the conductive elastic sheet is placed on the guide pins to have a spacing distance from the surface of the base, and the conductive elastic sheet is in a concave arc shape.

[0013] The present invention also discloses a test seat, comprising: a base; a plurality of elastic metal parts disposed in the base; and a conductive elastic sheet located above the base and contacting the top of each of the elastic metal parts, wherein the strength-ductility product of the conductive elastic sheet is greater than 550 megapascals (MPa)%.

[0014] In one embodiment, the multiple elastic metal parts include at least one first elastic metal part and at least one second elastic metal part. When the base is locked on a circuit board, the top of the at least one first elastic metal part and the top of the at least one second elastic metal part are located at different heights, thereby defining a surface morphology, and the conductive elastic sheet conforms to the surface morphology so that the conductive elastic sheet contacts the top of the at least one first elastic metal part and the top of the at least one second elastic metal part respectively.

[0015] In another embodiment, the conductive elastic sheet is suitable for conforming to an object to be tested.

[0016] In another embodiment, the conductive elastic sheet includes a first substrate layer and a second substrate layer stacked together.

[0017] In another embodiment, the first substrate layer is made of silicone, and the second substrate layer is made of polymer material.

[0018] In another embodiment, the thickness ratio of the second substrate layer in the conductive elastic sheet is 25% to 75%.

[0019] In another embodiment, the test seat further includes a plurality of guide pins, the conductive elastic sheet is placed on the guide pins to have a spacing distance from the surface of the base, and the conductive elastic sheet is in a concave arc shape.

[0020] In another embodiment, the first substrate layer includes a plurality of conductive elastic regions respectively corresponding to the elastic metal members and a plurality of conductive particles distributed in the conductive elastic regions.

[0021] In another embodiment, the second substrate layer is a frame-shaped structure, and each of the conductive elastic regions corresponds to a hollow area of ​​the frame-shaped structure.

[0022] In another embodiment, the second substrate layer forms a plurality of hollow portions corresponding to each of the conductive elastic regions.

[0023] In yet another embodiment, each of the conductive elastic regions of the first substrate layer extends into each of the corresponding hollow portions.

[0024] As can be seen from the above, the test seat of the present invention can maintain contact with each elastic metal piece according to the warping degree of the object under test or the different heights of multiple elastic metal pieces through the conductive elastic sheet, thereby achieving the purpose of providing good contact between the object under test and the elastic metal piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural exploded view of the test socket of the present invention.

[0026] Figure 2 This is a three-dimensional structural diagram of the test seat of the present invention carrying the object to be tested.

[0027] Figure 3 for Figure 2 Section view of the AA section line.

[0028] Figure 4 for Figure 3 A partial enlarged view of the middle area S.

[0029] Figure 5 It is a schematic diagram of the structure when the base in the test base of the present invention is warped.

[0030] Figure 6 It is a schematic diagram of the drooping state of the conductive elastic sheet in the test socket of the present invention.

[0031] Figure 7 FIG. 1 is a schematic structural diagram of a conductive elastic sheet according to a first embodiment of the present invention.

[0032] Figure 8 FIG. 4 is a schematic structural diagram of a conductive elastic sheet according to a second embodiment of the present invention.

[0033] Main component symbols

[0034] 1 Test socket

[0035] 11. Base

[0036] 111 First Surface

[0037] 112 Second Surface

[0038] 113 Through Hole

[0039] 12 Elastic metal parts

[0040] 120 Top

[0041] 121 First elastic metal parts

[0042] 122 Second elastic metal piece

[0043] 13, 13' Conductive elastic sheet

[0044] 131, 131' first substrate layer

[0045] 1311 Conductive elastic region

[0046] 1312 Conductive particles

[0047] 132,132' Second substrate layer

[0048] 1321 Hollow

[0049] 1322 Hollow Area

[0050] 133 Frame

[0051] 14 Guide pin

[0052] 8 Objects to be tested

[0053] 81 Conductor

[0054] 9 Circuit Board

[0055] a First thickness

[0056] b Second thickness

[0057] D Separation distance

[0058] H1 First Height

[0059] H2 Second Height

[0060] S Zone

[0061] S1 First surface morphology

[0062] S2 Second surface morphology. DETAILED DESCRIPTION

[0063] The technical content of the present invention is described below by using specific embodiments, and those skilled in the art can easily understand the advantages and effects of the present invention from the contents disclosed in this specification. However, the present invention can also be implemented or applied through other different specific embodiments.

[0064] Figure 1 This is a structural exploded view of the test socket of the present invention. Figure 2This is a three-dimensional structural diagram of the test seat of the present invention carrying the object to be tested. Figure 3 for Figure 2 Please refer to the cross-sectional view along the AA section line of the test seat 1 of the present invention. As shown in the figure, the test seat 1 of the present invention is suitable for being locked on a circuit board 9, and is used to test an object to be tested 8. The object to be tested 8 defines a first surface morphology S1 according to its warping degree, that is, the object to be tested 8 may be warped due to the packaging process, and accordingly, the non-flat surface caused by the warping (that is, the surface of the object to be tested 8 used to electrically contact the test seat 1 and formed with a conductor 81 such as a solder ball or an electrical contact pad) defines the first surface morphology S1. The present invention enables the object to be tested 8 to be placed on the test seat 1 in a conformable manner, wherein the test seat 1 of the present invention includes a base 11, a plurality of elastic metal parts 12, a conductive elastic sheet 13 and a plurality of guide pins 14. The detailed description of the test seat 1 of the present invention is as follows.

[0065] The base 11 includes a first surface 111 and a second surface 112 relative to each other and a through hole 113 connecting the first surface 111 and the second surface 112, wherein the base 11 is disposed on the circuit board 9 with the second surface 112 and can be fixed to the circuit board 9 by fixing members such as screws and bolts. In addition, other fixing methods can also be used to combine the base 11 and the circuit board 9.

[0066] Each of the elastic metal members 12 is disposed in the base 11 . Specifically, each of the elastic metal members 12 may be, for example, a spring probe, and is respectively inserted into each of the corresponding through holes 113 .

[0067] The conductive elastic sheet 13 is located above the base 11 and conforms to the first surface topography S1 to electrically connect the object to be tested 8. Specifically, the conductive elastic sheet 13 is located above the first surface 111 of the base 11, and in this embodiment, the conductive elastic sheet 13 is ductile, so that it can be deformed to form a curved shape conforming to the first surface topography S1, so as to contact the top of each of the elastic metal parts 12.

[0068] Each of the guide pins 14 is used to set the conductive elastic sheet 13 on the base 11, wherein the conductive elastic sheet 13 is adapted to move up and down relative to the base 11 along each of the guide pins 14. In detail, the guide pin 14 may have a top end and a bottom end, and the conductive elastic sheet 13 has a through hole corresponding to each of the guide pins 14, the bottom end may be used to be fixed on the first surface 111 of the base 11, and the conductive elastic sheet 13 is inserted into the corresponding guide pin 14 through each of the through holes, so as to be adapted to move up and down relative to the base 11 along each of the guide pins 14. In this embodiment, the number of the guide pins 14 may be 4, and they are symmetrically arranged at the diagonals of the conductive elastic sheet 13, so that the conductive elastic sheet 13 is stably located on the base 11 through each of the guide pins 14. In addition, in other embodiments, the guide pin 14 may not be used to fix the conductive elastic sheet 13 . For example, the conductive elastic sheet 13 may be directly attached to the base 11 . The present invention is not limited thereto.

[0069] When not being tested, the middle area of ​​the conductive elastic sheet 13 droops toward the base 11 to form a concave arc surface; during actual testing, the object under test 8 is placed on the conductive elastic sheet 13, and the object under test 8 is pressed against the conductive elastic sheet 13 toward the base 11, so that the conductive elastic sheet 13 moves along each of the guide pins 14 to the base 11 and contacts each of the elastic metal parts 12. At this time, the circuit board 9 provides a test signal, so that the test signal is input into the object under test 8 through each of the elastic metal parts 12, the conductive elastic sheet 13 and each of the conductors 81 to test whether the function of the object under test 8 is normal.

[0070] In this embodiment, if Figures 1 to 3 As shown, the object under test 8 presents a crying face warping (warping with a notch downward as shown in the figure) due to the warping phenomenon, that is, the first surface morphology S1 is a curved surface with a notch downward. When testing, the object under test 8 is placed on the test seat 1, so that the object under test 8 is pressed toward the test seat 1 (for example, by providing pressure through a crimping joint). Since the conductive elastic sheet 13 of the test seat 1 of the present invention can conform to the first surface morphology S1 of the warped object under test 8, and each of the elastic metal parts 12 has elastic force, different stroke states can be presented based on different degrees of pressing, for example Figure 3 As shown, the parts on both sides of the conductive elastic sheet 13 extend downward to a large extent in accordance with the first surface morphology S1, and the middle part of the conductive elastic sheet 13 extends upward to a large extent in accordance with the first surface morphology S1, thereby, the conductive elastic sheet 13 and each of the conductors 81 of the object under test 8 can be in close contact without generating gaps that are not in contact with each other, so that the conductive elastic sheet 13 and the object under test 8 have a good contact effect, so that during the test process, the purpose of providing the object under test 8 with good test performance can be achieved.

[0071] Figure 4 for Figure 3 A partial enlarged view of the middle area S. As shown in the figure, during the test process, the top 120 of each elastic metal piece 12 can be immersed or even inserted into the conductive elastic sheet 13 to contact the conductive particles in the conductive elastic sheet 13, thereby increasing the contact area and achieving a better electrical transmission effect; in addition, the conductor 81 of the object to be tested 8 can also enter the conductive elastic sheet 13 to obtain a better contact effect. Accordingly, by making the top 120 of the elastic metal piece 12 and the conductor 81 of the object to be tested 8 both immersed in the conductive elastic sheet 13, the contact resistance is reduced.

[0072] Figure 5 Schematic diagram of the structure of the test seat of the present invention when the base is warped. When each of the elastic metal parts 12 is arranged in the base 11, the base 11 usually pre-loads the elastic metal parts 12. Relatively, each of the elastic metal parts 12 will give the base 11 a reactive elastic force. However, as the size of the object to be tested becomes larger and larger, the size of the base 11 of the test seat 1 and the number of the elastic metal parts 12 must also increase. Therefore, the elastic force on the base 11 will eventually increase, causing the base 11 to warp, which will cause the tops of the elastic metal parts 12 arranged in the base 11 to be located at different heights. In detail, the plurality of elastic metal pieces 12 of the present invention may include at least one first elastic metal piece 121 and at least one second elastic metal piece 122. When the base 11 is locked to the circuit board 9, the base 11 is warped due to the elastic metal piece 12. Accordingly, the top of the at least one first elastic metal piece 121 and the top of the at least one second elastic metal piece 122 are located at different heights. In this embodiment, the middle portion of the warped base 11 is higher than the two side portions. Therefore, the first end of the first elastic metal piece 121 located in the middle is The height H1 is higher than the second height H2 of the second elastic metal parts 122 on both sides, and a second surface morphology S2 is defined according to the top of the first elastic metal part 121 and the top of the second elastic metal part 122 of different heights, so that the conductive elastic sheet 13 conforms to the second surface morphology S2. Since the conductive elastic sheet 13 in this case is ductile, it can conform to the second surface morphology S2 and contact with the top of the first elastic metal part 121 and the top of the second elastic metal part 122, thereby achieving the purpose of providing good contact.

[0073] Figure 6The schematic diagram of the drooping state of the conductive elastic sheet in the test socket of the present invention is shown in the figure. As shown in the figure, when the conductive elastic sheet 13 of the present invention is located above the base 11 through each guide pin 14 (for example, the aforementioned penetration method), before the test socket 1 is locked on the circuit board, the portion where the conductive elastic sheet 13 is connected to each of the guide pins 14 is separated from the first surface 111 of the base 11 by a spacing distance D. Since the conductive elastic sheet 13 has a relatively soft property, the central portion will droop toward the base 11 to present a concave arc shape, that is, the distance between the conductive elastic sheet 13 and the first surface 111 is less than the spacing distance D, and then contact with each of the elastic metal parts 12.

[0074] Figure 7 1 is a schematic diagram of the structure of the conductive elastic sheet of the present invention in the first embodiment. As shown in the figure, the conductive elastic sheet 13 of the present invention comprises a first substrate layer 131 and a second substrate layer 132 stacked together. Specifically, the first substrate layer 131 is a relatively soft silicon (Si) gel, and the second substrate layer 132 is a relatively hard polymer material, such as a polyimide substrate, so that the first substrate layer 131 can be well bonded to the second substrate layer 132.

[0075] Furthermore, the thickness ratio of the second substrate layer 132 in the conductive elastic sheet 13 is 25% to 75%, that is, as shown in the figure, the percentage of the first thickness a of the second substrate layer 132 relative to the second thickness b of the conductive elastic sheet 13 is 25% to 75%. Accordingly, the conductive elastic sheet 13 of the present invention has better ductility.

[0076] In a specific embodiment, the strength-elongation product value of the ductile conductive elastic sheet 13 is greater than 550 MPa%, wherein the strength-elongation product is defined as the product of tensile strength (Mpa) and elongation (%), and the tensile strength and elongation are measured according to the tensile test standard of the American Society for Testing and Materials (ASTM), that is, the ultimate strength refers to the maximum stress that a material can withstand before tensile fracture, and the elongation refers to the maximum deformation that a material can achieve before tensile fracture; in an embodiment of the present invention, the tensile strength is, for example, 280 MPa, and the elongation is 2%, or the tensile strength is, for example, 150 MPa, and the elongation is 15%. Accordingly, the conductive elastic sheet 13 of the present invention can be suitable for fitting the object to be tested based on its ductility.

[0077] In this embodiment, the ductility of the first substrate layer 131 is greater than that of the second substrate layer 132 . By combining the two according to the above thickness ratio, a conductive elastic sheet 13 having a strong ductility greater than 550 MPa% is obtained.

[0078] In another specific embodiment, the first substrate layer 131 includes a plurality of conductive elastic regions 1311 respectively corresponding to the elastic metal parts and a plurality of conductive particles 1312 distributed in each of the conductive elastic regions. When the object to be tested is pressed against the base, the corresponding conductor and the elastic metal part clamp the conductive elastic region 1311, so that the distance between the conductive particles 1312 in the conductive elastic region 1311 is shortened so that they can contact each other, thereby providing an electrical connection between the corresponding conductor and the elastic metal part.

[0079] In this embodiment, the second substrate layer 132 may be a grid-like structure, that is, the second substrate layer 132 has a plurality of hollow portions 1321 corresponding to the conductive elastic regions 1311, and the portion of the first substrate layer 131 at the conductive elastic region 1311 may extend into the hollow portion 1321. In another embodiment, the first substrate layer 131 may not extend into the hollow portion 1321, and the top end of the elastic metal member may enter the hollow portion 1321 and contact the first substrate layer 131.

[0080] In another specific embodiment, the conductive elastic sheet 13 may also have a frame 133 disposed between the first substrate layer 131 and the second substrate layer 132 to provide a good support effect for the conductive elastic sheet 13 and to provide a portion of the frame 133 for taking the conductive elastic sheet 13 out to facilitate the installation or removal of the conductive elastic sheet 13.

[0081] Figure 8 1 is a schematic diagram of the structure of the conductive elastic sheet of the present invention in the second embodiment. In this embodiment, the structure of the conductive elastic sheet 13' is substantially the same as that of the previous embodiment, except that the second substrate layer 132' of this embodiment is a frame-type structure, and each of the conductive elastic regions 1311 corresponds to the hollow area 1322 of the frame-type structure, that is, each of the conductive elastic regions 1311 is located within the range surrounded by the hollow area 1322, and the portion of the first substrate layer 131' corresponding to the hollow area 1322 extends into the hollow area 1322. In this embodiment, the present invention can increase the ductility of the conductive elastic sheet 13' by reducing the area ratio of the second substrate layer 132' superimposed on the first substrate layer 131'.

[0082] In summary, the test seat of the present invention can adapt to the first surface morphology of the warped test object or the second surface morphology corresponding to each elastic metal piece in the warped base through the conductive elastic sheet, thereby achieving the purpose of providing good contact between the test object and each elastic metal piece.

[0083] The above embodiments are only illustrative and are not intended to limit the present invention. Those skilled in the art may modify and change the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is defined by the claims attached to the present invention, and as long as it does not affect the effect and implementation purpose of the present invention, it should be included in this disclosed technical content.

Claims

1. A test seat, suitable for being locked on a circuit board and used to test an object to be tested, the object to be tested having a warpage degree to define a first surface morphology, the test seat comprising: Pedestal; A plurality of elastic metal parts are disposed in the base; as well as The conductive elastic sheet is located above the base and conforms to the first surface morphology to be electrically connected to the object to be tested.

2. The test socket according to claim 1, wherein: The conductive elastic sheet is ductile and can be deformed to contact the top of each elastic metal piece.

3. The test socket according to claim 1, wherein: The multiple elastic metal parts include at least one first elastic metal part and at least one second elastic metal part. When the base is locked on the circuit board, the top of the at least one first elastic metal part and the top of the at least one second elastic metal part are located at different heights, thereby defining a second surface morphology, and the conductive elastic sheet conforms to the second surface morphology.

4. The test socket according to any one of claims 1 to 3, wherein: The conductive elastic sheet comprises a first substrate layer and a second substrate layer stacked together.

5. The test socket according to claim 4, wherein: The first substrate layer is made of silica gel, and the second substrate layer is made of polymer material.

6. The test socket according to claim 4, wherein: The thickness ratio of the second substrate layer in the conductive elastic sheet is 25% to 75%.

7. The test socket according to claim 4, wherein: The first substrate layer comprises a plurality of conductive elastic regions respectively corresponding to the elastic metal parts and a plurality of conductive particles distributed in the conductive elastic regions.

8. The test socket according to claim 7, wherein: The second substrate layer is a frame-shaped structure, and each of the conductive elastic regions corresponds to a hollow area of ​​the frame-shaped structure.

9. The test socket according to claim 1, wherein: The test seat also includes a plurality of guide pins. The conductive elastic sheet is placed on the guide pins to have a spacing distance from the surface of the base, and the conductive elastic sheet is in a concave arc shape.

10. A test socket, comprising: Pedestal; A plurality of elastic metal parts are disposed in the base; as well as The conductive elastic sheet is located above the base and contacts the top of each of the elastic metal parts respectively, wherein the strength-ductility product of the conductive elastic sheet is greater than 550 million Pa%.

11. The test socket according to claim 10, wherein: The multiple elastic metal parts include at least one first elastic metal part and at least one second elastic metal part. When the base is locked on a circuit board, the top of the at least one first elastic metal part and the top of the at least one second elastic metal part are located at different heights, thereby defining a surface morphology, and the conductive elastic sheet conforms to the surface morphology so that the conductive elastic sheet contacts the top of the at least one first elastic metal part and the top of the at least one second elastic metal part respectively.

12. The test socket according to claim 10, wherein: The conductive elastic sheet is suitable for conforming to an object to be tested.

13. The test socket according to any one of claims 10 to 12, wherein: The conductive elastic sheet comprises a first substrate layer and a second substrate layer stacked together.

14. The test socket according to claim 13, wherein: The first substrate layer is made of silica gel, and the second substrate layer is made of polymer material.

15. The test socket according to claim 13, wherein: The thickness ratio of the second substrate layer in the conductive elastic sheet is 25% to 75%.

16. The test socket according to claim 10, wherein: The test seat also includes a plurality of guide pins. The conductive elastic sheet is placed on the guide pins to have a spacing distance from the surface of the base, and the conductive elastic sheet is in a concave arc shape.

17. The test socket according to claim 13, wherein: The first substrate layer comprises a plurality of conductive elastic regions respectively corresponding to the elastic metal parts and a plurality of conductive particles distributed in the conductive elastic regions.

18. The test socket according to claim 17, wherein: The second substrate layer is a frame-shaped structure, and each of the conductive elastic regions corresponds to a hollow area of ​​the frame-shaped structure.

19. The test socket according to claim 17, wherein: The second substrate layer forms a plurality of hollow portions corresponding to each of the conductive elastic regions.

20. The test socket according to claim 19, wherein: Each of the conductive elastic regions of the first substrate layer extends into each of the corresponding hollow portions.

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