Silicon carbide crystal cutting line fracture detection system and method and medium
By using a line break alarm and impedance detection rod in the silicon carbide crystal cutting line break detection system, the cutting line break is detected in real time, which solves the problem of cutting line breaking difficult to detect cutting line breaking, improves production safety and efficiency, and reduces maintenance costs and product defect rate.
Patent Information
- Application Number
- CN202411422303.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2024-12-10
AI Technical Summary
During the cutting process of silicon carbide crystal, cutting line breaks are difficult to detect instantaneously, resulting in missed inspection and alarm delays, affecting production safety and efficiency, and may lead to product quality problems.
The silicon carbide crystal cut line break detection system is adopted, including a line break alarm and an impedance detection rod. By comparing the impedance value of the impedance detection rod to the target reference point and the preset threshold, the alarm indication is detected and triggered in real time to ensure the rapid state of the cutting line. response.
It improves production safety and efficiency, reduces maintenance costs and product defect rate, reduces the time spent on equipment shutdown and wire network cleaning, and enhances the optimization of silicon carbide crystal cutting process and cost reduction and efficiency improvement.
Smart Images

Figure CN119104950A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of multi-wire cutting of silicon carbide substrates, and in particular to a silicon carbide crystal cutting wire fracture detection system, method and medium. Background Art
[0002] Silicon carbide (SiC) materials, especially its single crystal form, are indispensable key materials in the power electronics industry. With its outstanding high-voltage and high-frequency resistance characteristics, SiC is widely used in many systems such as electric vehicle systems, photovoltaic inverter systems, and rail transit power control systems. It can effectively reduce the system volume, simplify the structural design, and significantly improve the power density. However, the production process of SiC substrate crystals is extremely complex, involving harsh growth conditions and long growth cycles. At the same time, due to its high hardness characteristics, the processing difficulty is relatively large. These factors together lead to the cost of SiC substrate crystals accounting for a high proportion in the entire SiC production chain. Therefore, ensuring the stable quality of the SiC processing process and avoiding the production of defective products have become the key to optimizing SiC production, reducing costs and improving efficiency.
[0003] In the relevant SiC crystal cutting process, when the cutting wire breaks, there are the following problems: When the cutting wire breaks in the cutting chamber, due to the high-speed flying, these broken cutting wires are often difficult to be detected immediately, resulting in missed detection and alarm delays, and it is impossible to respond quickly to avoid the production of defective products. In addition, once the machine triggers an alarm and stops due to wire breakage, a large amount of scattered cutting wires will be entangled on the groove wheel and may penetrate the gap of the work-in-progress, scratch the product, and seriously affect the product quality. At the same time, the process of handling these scattered steel wires and rewiring is time-consuming and labor-intensive, which not only reduces production efficiency, but also may cause product line mark defects and quality problems in subsequent processing. Summary of the invention
[0004] Based on the above problems, the present application provides a silicon carbide crystal cutting line break detection system, method and medium, which not only improves production safety and efficiency, but also reduces maintenance costs and product defective rates, providing strong support for the optimization of silicon carbide crystal cutting process and cost reduction and efficiency improvement.
[0005] The embodiments of the present application disclose the following technical solutions:
[0006] In a first aspect, the present application discloses a silicon carbide crystal cutting wire fracture detection system, the silicon carbide crystal cutting wire fracture detection system comprising: a wire break alarm and an impedance detection rod, the impedance detection rod being connected to the wire break alarm via a wire;
[0007] The disconnection alarm is used to trigger an alarm indication if it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold.
[0008] Optionally, it is characterized in that the silicon carbide crystal cutting wire fracture detection system comprises a plurality of groups of impedance detection rods, and each group of impedance detection rods is respectively arranged on one side of the guide wheel;
[0009] The disconnection alarm is specifically used to trigger an alarm indication if it is detected by any one or more groups of impedance detection rods that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold.
[0010] Optionally, it is characterized in that the disconnection alarm is also used to, after the alarm indication is triggered, if a reset pulse is received through the reset port of the disconnection alarm, cancel the alarm indication.
[0011] Optionally, it is characterized in that the disconnection alarm is specifically used for:
[0012] Acquire historical disconnection data every preset time period, wherein the historical disconnection data includes at least one of disconnection time, disconnection location, impedance change value before and after disconnection, disconnection type and disconnection environment;
[0013] adjusting the preset impedance threshold according to the historical disconnection data;
[0014] If it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than the adjusted preset impedance threshold, an alarm indication is triggered.
[0015] Optionally, the disconnection alarm is specifically used to trigger an alarm indication if the impedance value of the impedance detection rod to a target reference point calculated based on the output current and output voltage of the impedance detection rod is less than a preset impedance threshold.
[0016] In a second aspect, the present application discloses a silicon carbide crystal cutting wire fracture detection method, which is applied to a silicon carbide crystal cutting wire fracture detection system, wherein the silicon carbide crystal cutting wire fracture detection system comprises a wire break alarm and an impedance detection rod, wherein the impedance detection rod is connected to the wire break alarm via a wire; the silicon carbide crystal cutting wire fracture detection method comprises:
[0017] If it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered.
[0018] Optionally, the silicon carbide crystal cutting wire fracture detection system comprises a plurality of groups of impedance detection rods, and each group of impedance detection rods is respectively arranged on one side of the guide wheel;
[0019] If the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, triggering an alarm indication includes:
[0020] If it is detected by any one or more groups of impedance detection rods that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered.
[0021] Optionally, the silicon carbide crystal cutting line fracture detection method further includes:
[0022] After the alarm indication is triggered, if a reset pulse is received through the reset port of the disconnection alarm, the alarm indication is released.
[0023] Optionally, if the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, triggering an alarm indication includes:
[0024] Acquire historical disconnection data every preset time period, wherein the historical disconnection data includes at least one of disconnection time, disconnection location, impedance change value before and after disconnection, disconnection type and disconnection environment;
[0025] adjusting the preset impedance threshold according to the historical disconnection data;
[0026] If it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than the adjusted preset impedance threshold, an alarm indication is triggered.
[0027] Optionally, if the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, triggering an alarm indication includes:
[0028] If the impedance value of the impedance detection rod to the target reference point calculated based on the output current and output voltage of the impedance detection rod is less than a preset impedance threshold, an alarm indication is triggered.
[0029] In a third aspect, the present application discloses a computer-readable medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method for detecting fractures in a silicon carbide crystal cutting line as described in the second aspect are implemented.
[0030] Compared with the prior art, this application has the following beneficial effects:
[0031] The embodiment of the present application provides a silicon carbide crystal cutting line break detection system, method and medium, the system includes a wire break alarm and an impedance detection rod, the wire break alarm is used to trigger an alarm indication if it is detected through the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than the preset impedance threshold. The silicon carbide crystal cutting line break detection system of the present application integrates a wire break alarm and an impedance detection rod, and compares the impedance value of the impedance detection rod to the target reference point with the preset impedance threshold. When the measured impedance value is less than the preset impedance threshold, it can determine that the cutting line is broken, and quickly notify the operator through an alarm indication, realizing real-time detection and rapid response to the cutting line status, which not only improves production safety and efficiency, but also reduces maintenance costs and product defective rates, and provides strong support for the optimization of silicon carbide crystal cutting processes and cost reduction and efficiency improvement. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0033] Figure 1 A schematic diagram of a silicon carbide crystal cutting wire fracture detection system provided in an embodiment of the present application;
[0034] Figure 2 A terminal schematic diagram of a silicon carbide crystal cutting wire fracture detection system provided in an embodiment of the present application;
[0035] Figure 3 A flow chart of a method for detecting a break in a silicon carbide crystal cutting line provided in an embodiment of the present application;
[0036] Figure 4 A schematic diagram of a computer-readable medium provided for an embodiment of the present application. DETAILED DESCRIPTION
[0037] As described above, in the current SiC crystal cutting process, when the cutting wire breaks, there are the following problems: When the cutting wire breaks in the cutting chamber, due to the high-speed flying, these broken cutting wires are often difficult to be detected immediately, resulting in missed detection and alarm delays, and it is impossible to respond quickly to avoid the production of defective products. In addition, once the machine triggers an alarm and stops due to wire breakage, a large amount of scattered cutting wires will be entangled on the groove wheel and may penetrate the gap of the work-in-progress, scratching the product and seriously affecting the product quality. At the same time, the process of handling these scattered steel wires and rewiring is time-consuming and labor-intensive, which not only reduces production efficiency, but may also cause product line mark defects and quality problems in subsequent processing.
[0038] After research, the inventor has proposed a silicon carbide crystal cutting line fracture detection system, method and medium. The system includes a wire break alarm and an impedance detection rod. The wire break alarm is used to trigger an alarm indication if the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than the preset impedance threshold. The silicon carbide crystal cutting line fracture detection system of the present application integrates a wire break alarm and an impedance detection rod, and compares the impedance value of the impedance detection rod to the target reference point with the preset impedance threshold. The impedance value is monitored and judged almost instantly, effectively avoiding equipment damage, product scratches or more serious personal injuries that may be caused by the high-speed flying of the cutting line. In addition, the timely alarm signal enables the operator to respond quickly and stop the equipment operation, thereby reducing the large amount of time consumed by equipment shutdown, wire network cleaning and rewiring, and improving the overall production efficiency. Furthermore, during equipment maintenance or regular inspection, the functional inspection can be completed by simply touching the impedance detection rod and the wire network with a wire or metal tool, without the need for complex destructive inspection and recovery work, reducing the difficulty and cost of maintenance. Therefore, the silicon carbide crystal cutting wire fracture detection system of the present application not only improves production safety and efficiency, but also reduces maintenance costs and product defective rates, providing strong support for the optimization of the silicon carbide crystal cutting process and cost reduction and efficiency improvement.
[0039] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0040] See also Figure 1, which is a schematic diagram of a silicon carbide crystal cutting wire fracture detection system provided in an embodiment of the present application. The silicon carbide crystal cutting wire fracture detection system 100 includes: a wire break alarm 101 and an impedance detection rod 102. The impedance detection rod 102 is connected to the wire break alarm 101 through a wire to realize data transmission.
[0041] As a physical detection element, the impedance detection rod 102 is usually installed on one side of the guide wheel and is insulated from the device housing (i.e., the target reference point). The guide wheel plays an important role in guiding and supporting the cutting line during the silicon carbide crystal cutting process. By placing the impedance detection rod 102 next to the guide wheel, the silicon carbide crystal cutting line break detection system 100 can quickly and accurately detect the situation where the cutting line breaks and flies up at high speed. When the wire network is working normally, the impedance detection rod 102 maintains a safe distance from the wire network to ensure that its impedance value to the device housing is maintained at a high level (usually greater than 10MΩ).
[0042] When the cutting line breaks and flies up at high speed, the broken cutting line may touch or approach the impedance detection rod 102. The touch or approach event causes the impedance value of the impedance detection rod 102 to the device housing to drop rapidly. If the disconnection alarm 101 detects through the impedance detection rod 102 that the impedance value of the impedance detection rod 102 to the target reference point is less than the preset impedance threshold, the alarm mechanism is immediately triggered (for example, through sound and light alarms, signal output, etc.) to notify the operator as quickly as possible. After receiving the alarm, the operator can immediately take measures to deal with the disconnection event to avoid equipment damage, product scrapping, and even personal injury.
[0043] Specifically, the disconnection alarm 101 can obtain the output current and output voltage output by the impedance detection rod 102. If the impedance value of the impedance detection rod 102 to the target reference point calculated based on the output current and output voltage is less than a preset impedance threshold, an alarm indication is triggered.
[0044] It should be noted that the above embodiment is explained by taking the silicon carbide crystal cutting line break detection system 100 as including an impedance detection rod 102. In another specific implementation, in order to ensure the stability and safety of the cutting process, the silicon carbide crystal cutting line break detection system 100 may also include multiple groups of impedance detection rods 102. Multiple groups of impedance detection rods 102 are arranged around the guide wheel to form an all-round detection network to ensure that no matter which direction the cutting line flies after breaking, it can be detected in time. When the cutting line breaks and touches or approaches any one or more groups of impedance detection rods 102, the impedance value detected by the broken wire alarm 101 will cause a rapid drop. Once this impedance value is less than the preset impedance threshold, the broken wire alarm 101 will immediately trigger an alarm indication. As a result, the joint action of multiple groups of impedance detection rods 102 significantly expands the detection range and improves the efficiency and accuracy of broken wire detection.
[0045] It should also be noted that in addition to real-time monitoring of the impedance value of the impedance detection rod 102 to the target reference point and triggering an alarm indication when an abnormality is detected, the disconnection alarm 101 can also cancel the triggered alarm indication after receiving a reset pulse, which is convenient for operators to debug equipment, troubleshoot or reset the system. Specifically, it may be necessary to cancel the triggered alarm indication due to a false alarm or the need to reset the system. The disconnection alarm 101 provides a reset port (such as a Res port). If the reset port receives a reset pulse, the disconnection alarm 101 can determine the legitimacy of the pulse, and accordingly cancel the current alarm state and restore to a normal detection state, so that normal cutting line break detection can be performed again. As a result, the operator can cancel the alarm indication at any time as needed, and perform operations such as equipment debugging, troubleshooting or system reset.
[0046] It should also be noted that the disconnection alarm 101 can obtain historical disconnection data every preset time (such as every hour, every day, etc.). These historical disconnection data include but are not limited to disconnection time, disconnection position, impedance change value before and after disconnection, disconnection type (such as single break, multiple continuous break, etc.) and disconnection environment. Subsequently, according to the historical disconnection data obtained, the disconnection alarm 101 will perform data analysis, and by analyzing the characteristics and trends of the disconnection event, the disconnection alarm 101 can dynamically adjust the preset impedance threshold. When it is detected that the impedance value is less than the preset impedance threshold after adjustment, it means that the cutting line may have been broken or abnormally contacted. At this time, the alarm will immediately trigger an alarm indication. Thus, the silicon carbide crystal cutting line fracture detection system 100 adapts to different cutting conditions and requirements by dynamically adjusting the preset impedance threshold, which not only improves the accuracy and reliability of detection, but also reduces the risk of false alarms and missed reports, and provides a more stable and safe guarantee for the cutting process of silicon carbide crystals.
[0047] See also Figure 2 , which is a terminal schematic diagram of a silicon carbide crystal cutting line fracture detection system provided in an embodiment of the present application. Figure 2 The following is explained using a silicon carbide crystal cutting wire fracture detection system 10 including four channels (X1, X2, X3, X4):
[0048] Specifically, the X1 channel includes: a detection port P1, a detection port P2, a positive input power supply, and a negative input power supply. The detection port P1 and the detection port P2 are respectively connected to two impedance detection rods 102 through wires to perform independent monitoring of the two-wire network. The positive input power supply (24V) and the negative input power supply (0V) together constitute the power supply circuit of the silicon carbide crystal cutting wire fracture detection system 10, providing the voltage required for the entire silicon carbide crystal cutting wire fracture detection system 10 to work.
[0049] The X2 channel includes: voltage output port, system reset port and alarm output port. The voltage output ports Vp1 and Vp2 are the voltage output ports of the detection port P1 and detection port P2 respectively, and output the detected impedance change information in the form of DC 0-10V voltage. When the line impedance change is detected, the output voltage will change accordingly to indicate the impedance state. When the alarm output port detects that the line impedance is lower than the preset impedance threshold, a DC 24V voltage signal is generated to indicate that a disconnection event has occurred.
[0050] The X3 channel includes: Current output ports. These four current output ports output the detected impedance change information in the form of 0-20mA current, which complements the voltage output and improves the accuracy and reliability of detection.
[0051] The X4 channel includes: a ground port. The ground port provides a reference potential for the silicon carbide crystal cutting wire fracture detection system 10 to ensure the stability and consistency of the potential between the ports.
[0052] After the silicon carbide crystal cutting line break detection system 100 is powered on, the red light is on, indicating that the silicon carbide crystal cutting line break detection system 100 is currently in an inoperative state. At this time, a 24V reset pulse signal needs to be sent to the silicon carbide crystal cutting line break detection system 100 through the system reset port, and the green light is then on, indicating that the silicon carbide crystal cutting line break detection system 100 has been successfully initialized and started working.
[0053] When the silicon carbide crystal cutting wire fracture detection system 100 is working, the impedance of the connected wire network to the ground will be detected in real time (this embodiment is explained by taking the ground as an example, and in actual application, it can also be any target reference point). When the wire network is in a normal state and there is no alarm, the alarm output port outputs a DC24V voltage value, indicating a no alarm state. The current output port outputs a current value greater than 5.790mA, and the specific value depends on the setting of the sensitivity dial switch and the actual impedance of the wire network. The voltage output port outputs a voltage value greater than 1.27V. Similarly, the specific value is also affected by the sensitivity and the impedance of the wire network.
[0054] When the detected impedance value is less than the preset impedance threshold value set by the silicon carbide crystal cutting wire break detection system 100, the silicon carbide crystal cutting wire break detection system 100 enters the alarm state. The alarm output port outputs a 0V alarm signal, indicating that an abnormality has been detected. The output current value of the current output port is adjusted to 5.750mA, and the output voltage value of the voltage output port is adjusted to 1.25V. These changes indicate that the silicon carbide crystal cutting wire break detection system 100 has detected an impedance abnormality.
[0055] When the impedance value of the wire network returns to normal, the output of the current output port and the voltage output port will return to normal values, but the alarm output port still outputs 0V, indicating that the alarm state has not been automatically released. To release the alarm state, the reset pulse signal must be input again through the system reset port. After reset, the silicon carbide crystal cutting wire fracture detection system 100 re-enters the normal detection state, the green light is on, the red light is off, and the alarm output port resumes outputting the DC24V voltage value.
[0056] It should be noted that the above numerical values are only examples, and this application does not limit the specific values.
[0057] In summary, the present application provides a silicon carbide crystal cutting wire fracture detection system, which integrates a wire break alarm and an impedance detection rod, and compares the impedance value of the impedance detection rod to the target reference point with the preset impedance threshold, and completes the monitoring and judgment of the impedance value almost instantly, effectively avoiding equipment damage, product scratches or more serious personal injuries caused by the high-speed flying of the cutting line. In addition, the timely alarm signal enables the operator to respond quickly and stop the equipment operation, thereby reducing the large amount of time spent on equipment shutdown, wire network cleaning and rewiring, and improving the overall production efficiency. Furthermore, during equipment maintenance or regular inspection, it is only necessary to touch the impedance detection rod and the wire network with a wire or a metal tool to complete the functional inspection, without the need for complex destructive inspection and recovery work, reducing the difficulty and cost of maintenance. Therefore, the silicon carbide crystal cutting wire fracture detection system of the present application not only improves production safety and efficiency, but also reduces maintenance costs and product defective rates, and provides strong support for the optimization of silicon carbide crystal cutting process and cost reduction and efficiency improvement.
[0058] See also Figure 3 , which is a flow chart of a method for detecting a break in a silicon carbide crystal cutting line provided in an embodiment of the present application. The method is applied to a silicon carbide crystal cutting line break detection system, which includes a break alarm and an impedance detection rod, and the impedance detection rod is connected to the break alarm through a wire.
[0059] Silicon carbide crystal cutting wire fracture detection methods include:
[0060] S301: If the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered.
[0061] In some specific implementations, the silicon carbide crystal cutting wire fracture detection system includes a plurality of groups of impedance detection rods, each group of impedance detection rods is respectively arranged on one side of the guide wheel;
[0062] If the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than the preset impedance threshold, an alarm indication is triggered, including:
[0063] If it is detected by any one or more groups of impedance detection rods that the impedance value of the impedance detection rod to the target reference point is less than the preset impedance threshold, an alarm indication is triggered.
[0064] In some specific implementations, the method for detecting fracture of a silicon carbide crystal cutting line further includes:
[0065] After the alarm indication is triggered, if a reset pulse is received through the reset port of the disconnection alarm, the alarm indication is released.
[0066] In some specific implementations, if the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered, including:
[0067] Acquire historical disconnection data every preset time, the historical disconnection data including at least one of disconnection time, disconnection location, impedance change value before and after disconnection, disconnection type and disconnection environment;
[0068] Adjust the preset impedance threshold based on historical disconnection data;
[0069] If the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than the adjusted preset impedance threshold, an alarm indication is triggered.
[0070] In some specific implementations, if the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered, including:
[0071] If the impedance value of the impedance detection rod to the target reference point calculated based on the output current and output voltage of the impedance detection rod is less than the preset impedance threshold, an alarm indication is triggered.
[0072] In summary, the present application provides a method for detecting the breakage of a silicon carbide crystal cutting line. By integrating a wire break alarm and an impedance detection rod, the impedance detection rod compares the impedance value of the target reference point with the preset impedance threshold, and the monitoring and judgment of the impedance value are completed almost instantly, effectively avoiding equipment damage, product scratches or more serious personal injuries caused by the high-speed flying of the cutting line. In addition, the timely alarm signal enables the operator to respond quickly and stop the equipment operation, thereby reducing the large amount of time spent on equipment shutdown, wire network cleaning and rewiring, and improving the overall production efficiency. Furthermore, during equipment maintenance or regular inspection, the functional inspection can be completed by simply touching the impedance detection rod and the wire network with a wire or a metal tool, without the need for complex destructive inspection and recovery work, reducing the maintenance difficulty and cost. Therefore, the present application's method for detecting the breakage of a silicon carbide crystal cutting line not only improves production safety and efficiency, but also reduces maintenance costs and product defective rates, providing strong support for the optimization of silicon carbide crystal cutting processes and reducing costs and increasing efficiency.
[0073] See also Figure 4 , which is a schematic diagram of a computer-readable medium provided in an embodiment of the present application. The computer-readable medium 400 stores a computer program 411, which implements the above-mentioned Figure 1 Steps of a method for detecting fractures in a cutting line of a silicon carbide crystal.
[0074] It should be noted that in the context of the present application, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
[0075] It should be noted that the machine-readable medium mentioned above in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. The computer readable signal medium may also be any computer readable medium other than a computer readable storage medium, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. The program code contained on the computer readable medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (radio frequency), etc., or any suitable combination of the above.
[0076] Although the subject matter has been described in language specific to structural features and / or methodological logical actions, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. On the contrary, the specific features and actions described above are merely example forms of implementing the claims.
[0077] Although several specific implementation details are included in the above discussion, these should not be interpreted as limiting the scope of the present application. Certain features described in the context of a separate embodiment can also be implemented in a single embodiment in combination. On the contrary, the various features described in the context of a single embodiment can also be implemented in multiple embodiments individually or in any suitable sub-combination.
[0078] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosed concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.
Claims
1. A silicon carbide crystal cutting wire fracture detection system, It is characterized in that The silicon carbide crystal cutting wire break detection system comprises: a wire break alarm and an impedance detection rod, wherein the impedance detection rod is connected to the wire break alarm through a wire; The disconnection alarm is used to trigger an alarm indication if it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold.
2. The silicon carbide crystal cutting wire fracture detection system according to claim 1, It is characterized in that The silicon carbide crystal cutting wire fracture detection system comprises a plurality of groups of impedance detection rods, each group of impedance detection rods being respectively arranged on one side of the guide wheel; The disconnection alarm is specifically used to trigger an alarm indication if it is detected by any one or more groups of impedance detection rods that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold.
3. The silicon carbide crystal cutting wire fracture detection system according to claim 1, It is characterized in that The disconnection alarm is further configured to, after the alarm indication is triggered, release the alarm indication if a reset pulse is received through a reset port of the disconnection alarm.
4. The silicon carbide crystal cutting wire fracture detection system according to claim 1, It is characterized in that The disconnection alarm is specifically used for: Acquire historical disconnection data every preset time period, wherein the historical disconnection data includes at least one of disconnection time, disconnection location, impedance change value before and after disconnection, disconnection type and disconnection environment; adjusting the preset impedance threshold according to the historical disconnection data; If it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than the adjusted preset impedance threshold, an alarm indication is triggered.
5. The silicon carbide crystal cutting wire fracture detection system according to claim 1, It is characterized in that The disconnection alarm is specifically used to trigger an alarm indication if the impedance value of the impedance detection rod to a target reference point calculated based on the output current and output voltage of the impedance detection rod is less than a preset impedance threshold.
6. A method for detecting fracture of a silicon carbide crystal cutting line, It is characterized in that Applicable to a silicon carbide crystal cutting wire fracture detection system, the silicon carbide crystal cutting wire fracture detection system comprises a wire break alarm and an impedance detection rod, the impedance detection rod is connected to the wire break alarm through a wire; the silicon carbide crystal cutting wire fracture detection method comprises: If it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered.
7. The method for detecting fracture of a silicon carbide crystal cutting line according to claim 6, It is characterized in that The silicon carbide crystal cutting wire fracture detection system comprises a plurality of groups of impedance detection rods, each group of impedance detection rods being respectively arranged on one side of the guide wheel; If the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, triggering an alarm indication includes: If it is detected by any one or more groups of impedance detection rods that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, an alarm indication is triggered.
8. The method for detecting fracture of a silicon carbide crystal cutting line according to claim 6, It is characterized in that The silicon carbide crystal cutting line fracture detection method further comprises: After the alarm indication is triggered, if a reset pulse is received through the reset port of the disconnection alarm, the alarm indication is released.
9. The method for detecting fracture of a silicon carbide crystal cutting line according to claim 6, It is characterized in that If the impedance detection rod detects that the impedance value of the impedance detection rod to the target reference point is less than a preset impedance threshold, triggering an alarm indication includes: Acquire historical disconnection data every preset time period, wherein the historical disconnection data includes at least one of disconnection time, disconnection location, impedance change value before and after disconnection, disconnection type and disconnection environment; adjusting the preset impedance threshold according to the historical disconnection data; If it is detected by the impedance detection rod that the impedance value of the impedance detection rod to the target reference point is less than the adjusted preset impedance threshold, an alarm indication is triggered.
10. A computer readable medium having a computer program stored thereon, It is characterized in that When the computer program is executed by a processor, each step of the method for detecting breakage of a silicon carbide crystal cutting line according to any one of claims 6 to 9 is implemented.
Citation Information
Cited By
Conductive cutting line state detection method and device
CN120870242A
