Display panel and manufacturing method thereof

By first attaching a polarizer and performing specific cutting processing in the display panel manufacturing, the problem of film shrinking or film curling of the substrate during the cutting process is solved, the bonding yield of the circuit board is improved, and the process quality is ensured.

CN119105210APending Publication Date: 2024-12-10HANNSTAR DISPLAY CORP
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Patent Information

Application Number
CN202310669176.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-07
Publication Date
2024-12-10

AI Technical Summary

Technical Problem

During the assembly of the display panel, insufficient flexibility of the substrate leads to prone to film shrinkage or film curling during cutting, resulting in difficult separation of the bonding pad or poor process.

Method used

During the manufacturing process of the display panel, the polarizer is first attached to the substrate in an entire surface, and through specific cutting line configurations and steps, the portion where the substrate overlaps the bonding area is removed, and the bonding pad is exposed to improve the cutting process. yield.

Benefits of technology

It effectively avoids the film shrinkage or film curling of the substrate during the cutting process, ensures the bonding yield of the circuit board, and improves the quality of subsequent processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a display panel which comprises a first substrate, a second substrate, a liquid crystal layer, a first polaroid, a second polaroid and a circuit board. The first substrate is provided with a display area and a bonding area outside the display area. The second substrate is overlapped with the first substrate, and the bonding area of the first substrate is exposed. The liquid crystal layer is arranged between the first substrate and the second substrate and overlaps the display area. The first polaroid is arranged on the surface, away from the second substrate, of the first substrate. The second polaroid is arranged on the surface, away from the first substrate, of the second substrate. The circuit board is bonded to the bonding area of the first substrate. The first side wall, facing the joint area, of the second substrate is tangent and flush with the second side wall, facing the joint area, of the second polaroid. The invention also provides a manufacturing method of the display panel.
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Description

Technical Field

[0001] The present invention relates to a display panel and a manufacturing method thereof, and in particular to a display panel with a flexible substrate and a manufacturing method thereof. Background Art

[0002] Generally speaking, during the assembly process of the display panel, the liquid crystal layer is sandwiched between the two substrates and sealed with a sealant, while the bonding pads set in the peripheral area of ​​one substrate are covered by the other substrate. Therefore, after assembly, the other substrate must be cut to expose the bonding pads for bonding the circuit board. However, when the substrate is flexible but not stiff enough, film shrinkage or warping is likely to occur during the cutting process of the substrate, resulting in the part to be cut and removed being difficult to separate or poor operation. Summary of the invention

[0003] The present invention is directed to a display panel, the bonding yield of the circuit board of which is higher.

[0004] The present invention is directed to a method for manufacturing a display panel, which has a better yield rate in the substrate cutting process for exposing the bonding pad.

[0005] According to an embodiment of the present invention, a display panel includes a first substrate, a second substrate, a liquid crystal layer, a first polarizer, a second polarizer and a circuit board. The first substrate is provided with a display area and a bonding area outside the display area. The second substrate is arranged to overlap with the first substrate, and the bonding area of ​​the first substrate is exposed. The liquid crystal layer is arranged between the first substrate and the second substrate, and overlaps with the display area. The first polarizer is arranged on a surface of the first substrate facing away from the second substrate. The second polarizer is arranged on a surface of the second substrate facing away from the first substrate. The circuit board is bonded to the bonding area of ​​the first substrate. The first side wall of the second substrate facing the bonding area is aligned with the second side wall of the second polarizer facing the bonding area.

[0006] In the display panel according to the embodiment of the present invention, the second substrate further has a third side wall facing the bonding area. The third side wall is perpendicular to the first side wall. The second polarizer further has a fourth side wall facing the bonding area, and the third side wall of the second substrate is aligned with the fourth side wall of the second polarizer.

[0007] In the display panel according to an embodiment of the present invention, the second substrate further has a fifth side wall facing the bonding area and opposite to the third side wall. The fifth side wall is perpendicular to the first side wall. The second polarizer further has a sixth side wall facing the bonding area and opposite to the fourth side wall, and the fifth side wall of the second substrate is tangent to the sixth side wall of the second polarizer.

[0008] In the display panel according to the embodiment of the present invention, the first side wall, the third side wall and the fifth side wall define a notch of the second substrate, and the circuit board is bonded to the bonding area of ​​the first substrate through the notch of the second substrate.

[0009] In the display panel according to an embodiment of the present invention, the first substrate is further provided with a peripheral area other than the display area and the bonding area. The second substrate does not overlap the peripheral area. The bonding area and the peripheral area are arranged along a first direction. The second substrate has a first side edge and a second side edge that are opposite to each other along the first direction. The first side wall extends from the first side edge to the second side edge and also faces the peripheral area.

[0010] In the display panel according to the embodiment of the present invention, the display panel further includes a first notch and a second notch. The first notch is arranged at one side of the bonding area. The first notch sidewalls of the first notch defined by the first substrate, the second substrate, the first polarizer, and the second polarizer are tangent to each other. The second notch is arranged at the other side of the bonding area. The second notch sidewalls of the second notch defined by the first substrate, the second substrate, the first polarizer, and the second polarizer are tangent to each other.

[0011] In the display panel according to the embodiment of the present invention, the first notch sidewall and the second notch sidewall of the first substrate define a protruding portion of the first substrate, and a bonding area is disposed on the protruding portion.

[0012] In the display panel according to an embodiment of the present invention, the first notch, the bonding area and the second notch are arranged along a first direction. The first substrate has a first side edge and a second side edge that are opposite to each other along the first direction. The first notch side wall of the first substrate extends from the first side edge, and the second notch side wall of the first substrate extends from the second side edge.

[0013] According to an embodiment of the present invention, a method for manufacturing a display panel includes assembling a first substrate and a second substrate, so that a liquid crystal layer is sandwiched between the first substrate and the second substrate, attaching a first polarizer to a surface of the first substrate facing away from the second substrate, attaching a second polarizer to a surface of the second substrate facing away from the first substrate, and cutting the second substrate and the second polarizer along a first cutting line to remove a portion of the second substrate and the second polarizer overlapping in a bonding area, and exposing the bonding area and a bonding area where a circuit board is bonded to the first substrate. The first substrate is provided with a display area and a bonding area outside the display area. The liquid crystal layer overlaps the display area.

[0014] In the manufacturing method of the display panel according to the embodiment of the present invention, the step of cutting the second substrate and the second polarizer according to the first cutting line includes cutting the second substrate and the second polarizer according to the first line segment of the first cutting line and cutting the second substrate and the second polarizer according to the second line segment and the third line segment of the first cutting line. The second line segment and the third line segment are located on opposite sides of the bonding area, and each is perpendicular to the first line segment. After removing the portion overlapping with the bonding area, the second substrate and the second polarizer form a notch corresponding to the first cutting line, and the circuit board is bonded to the bonding area of ​​the first substrate via the notch of the second substrate and the second polarizer.

[0015] In the manufacturing method of the display panel according to the embodiment of the present invention, the second substrate has a first side edge and a second side edge located at opposite sides of the display area and the bonding area, and the first cutting line extends from the first side edge to the second side edge.

[0016] In the manufacturing method of the display panel according to an embodiment of the present invention, it also includes cutting the first substrate, the second substrate, the first polarizer and the second polarizer along a second cutting line to remove the portions of the first substrate, the second substrate, the first polarizer and the second polarizer located on one side of the joining area and form a first notch, and cutting the first substrate, the second substrate, the first polarizer and the second polarizer along a third cutting line to remove the portions of the first substrate, the second substrate, the first polarizer and the second polarizer located on the other side of the joining area and form a second notch.

[0017] In the method for manufacturing a display panel according to an embodiment of the present invention, before removing the portion of the second substrate and the second polarizer overlapping in the bonding area, the first notch and the second notch are formed.

[0018] In the manufacturing method of the display panel according to the embodiment of the present invention, the first substrate has a first side edge and a second side edge which are separated from each other and a third side edge connecting the first side edge and the second side edge. The first cutting line is parallel to the third side edge of the first substrate. The second cutting line extends from the first side edge to the third side edge in a bent manner, and the third cutting line extends from the second side edge to the third side edge in a bent manner.

[0019] In the method for manufacturing a display panel according to an embodiment of the present invention, after the first notch and the second notch are formed, a protrusion is formed on the first substrate, and the circuit board is bonded to the bonding area on the protrusion.

[0020] Based on the above, in a method for manufacturing a display panel according to an embodiment of the present invention, the polarizer is first attached to the substrate over its entire surface before removing the overlapping portion of the substrate and the bonding area. This can prevent the substrate from shrinking or warping during the cutting process due to insufficient stiffness, thereby improving the bonding yield of the circuit board in subsequent manufacturing processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a display panel according to a first embodiment of the present invention;

[0022] Figure 2 yes Figure 1 A cross-sectional schematic diagram of a display panel;

[0023] Figure 3 yes Figure 1 A front view schematic diagram of a display panel;

[0024] FIG. 4A to FIG. 4E yes Figure 1A schematic diagram of a manufacturing process of a display panel;

[0025] Figure 5 is a schematic diagram of a display panel according to a second embodiment of the present invention;

[0026] Fig. 6A and Figure 6B yes Figure 5 A schematic diagram of a manufacturing process of a display panel;

[0027] Figure 7 is a schematic diagram of a display panel according to a third embodiment of the present invention;

[0028] FIG. 8A to FIG. 8C yes Figure 7 Schematic diagram of the manufacturing process of the display panel.

[0029] Description of Reference Numerals

[0030] 10, 20, 30: display panel;

[0031] AM: counterpoint mark;

[0032] BA: junction area;

[0033] BP: bonding pad;

[0034] CB: Circuit Board;

[0035] CL1, CL1-A, CL1-B, CL2, CL3: cutting line;

[0036] DA: display area;

[0037] LCL: Liquid crystal layer;

[0038] N, N1, N2: gap;

[0039] nsw1a, nsw1b, nsw1c, nsw1d, nsw2a, nsw2b, nsw2c, nsw2d: notch side wall;

[0040] P, P”, P1, P2, P3: Partial;

[0041] PA: peripheral area;

[0042] POL1, POL1-A, POL2, POL2-A, POL2-B: polarizer;

[0043] PT: convex part;

[0044] SE1, SE2, SE1”, SE2”, SE3: lateral edge;

[0045] sg1, sg2, sg3: line segments;

[0046] SL: frame glue layer;

[0047] SP: septum;

[0048] SUB1, SUB1-A, SUB2, SUB2-A, SUB2-B: substrate;

[0049] SUB1s, SUB2s: surface;

[0050] sw1, sw2, sw3, sw4, sw5, sw6, sw1', sw2', sw1", sw2": side wall;

[0051] WH: wheel knife;

[0052] X, Y, Z: direction;

[0053] A-A': section line. DETAILED DESCRIPTION

[0054] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0055] Figure 1 is a schematic diagram of a display panel according to a first embodiment of the present invention. Figure 2 yes Figure 1 A schematic cross-sectional view of a display panel. Figure 3 yes Figure 1 A front view schematic diagram of a display panel. FIG. 4A to FIG. 4E yes Figure 1 Schematic diagram of the manufacturing process of the display panel. Figure 2 correspond Figure 1 At the section line A-A'.

[0056] Please refer to Figures 1 to 3, the display panel 10 includes a first substrate SUB1, a second substrate SUB2 and a liquid crystal layer LCL. The first substrate SUB1 is provided with a display area DA, a peripheral area PA and a bonding area BA outside the display area DA and the peripheral area PA. The second substrate SUB2 and the first substrate SUB1 are arranged to overlap along the direction Z. If not specifically mentioned below, the overlapping relationship between the two components is defined by the direction Z and will not be repeated. In the present embodiment, the first substrate SUB1 and the second substrate SUB2 are, for example, flexible substrates, and their materials may include polyimide (PI), polycarbonate (PC), polymethylmethacrylate (PMMA), cycloolefin polymer (COP), cellulose triacetate (TAC) or other suitable polymer sheets.

[0057] The liquid crystal layer LCL is disposed between the first substrate SUB1 and the second substrate SUB2, and overlaps the display area DA. In the present embodiment, the thickness of the liquid crystal layer LCL can be adjusted by configuring a plurality of spacers SP. A sealant layer SL is further disposed between the first substrate SUB1 and the second substrate SUB2 to bond the two substrates, and the liquid crystal layer LCL is filled in the sealed space surrounded by the sealant layer SL, but is not limited thereto.

[0058] The display panel 10 further includes a first polarizer POL1, a second polarizer POL2 and a circuit board CB. The first polarizer POL1 is disposed on a surface SUB1s of the first substrate SUB1 that is away from the second substrate SUB2. The second polarizer POL2 is disposed on a surface SUB2s of the second substrate SUB2 that is away from the first substrate SUB1. In this embodiment, the first polarizer POL1 and the second polarizer POL2 are respectively attached to the first substrate SUB1 and the second substrate SUB2 in their entirety.

[0059] In detail, the second substrate SUB2 and the second polarizer POL2 respectively have a first side wall sw1 and a second side wall sw2 facing the bonding area BA, and the first side wall sw1 is aligned with the second side wall sw2. In the present embodiment, the second substrate SUB2 further has a third side wall sw3 and a fifth side wall sw5 facing the bonding area BA and opposite to each other, and the second polarizer POL2 further has a fourth side wall sw4 and a sixth side wall sw6 facing the bonding area BA and opposite to each other. The third side wall sw3 of the second substrate SUB2 is aligned with the fourth side wall sw4 of the second polarizer POL2. The fifth side wall sw5 of the second substrate SUB2 is aligned with the sixth side wall sw6 of the second polarizer POL2.

[0060] More specifically, in the present embodiment, the first side wall sw1, the third side wall sw3 and the fifth side wall sw5 of the second substrate SUB2 and the second side wall sw2, the fourth side wall sw4 and the sixth side wall sw6 of the second polarizer POL2 can define a notch N that exposes the bonding area BA between the second substrate SUB2 and the second polarizer POL2. The circuit board CB is bonded to the bonding area BA of the first substrate SUB1 via the notch N between the second substrate SUB2 and the second polarizer POL2.

[0061] For example, the bonding area BA exposed by the notch N may be provided with a plurality of bonding pads BP and two alignment marks AM, but is not limited thereto. In other embodiments, the number of bonding pads BP and alignment marks AM may be adjusted according to different design requirements. The circuit board CB is, for example, a flexible printed circuit board (FPC) or a chip on film (COF), and may include a plurality of signal pins (not shown). The circuit board CB may be electrically connected to the pixel driving layer (not shown) on the first substrate SUB1 via a one-to-one bonding relationship between these signal pins and the plurality of bonding pads BP, but is not limited thereto. For example, a thermal compression bonding process may be used to achieve a bonding relationship between the signal pins of the circuit board CB and the bonding pads BP on the first substrate SUB1, but is not limited thereto.

[0062] The following is an exemplary description of the manufacturing process of the display panel 10 .

[0063] Please refer to Figure 4A and Figure 2 First, assemble the first substrate SUB1 and the second substrate SUB2 so that a liquid crystal layer LCL is sandwiched between the first substrate SUB1 and the second substrate SUB2. It is particularly noted that after the two substrates are assembled, the bonding pads BP and the alignment marks AM in the bonding area BA of the first substrate SUB1 will be covered by the second substrate SUB2. Therefore, in order to bond with the circuit board CB, the portion of the second substrate SUB2 that overlaps with the bonding area BA must be cut off to expose the bonding pads BP and the alignment marks AM.

[0064] It is particularly noted that before removing the portion of the second substrate SUB2 overlapping the bonding area BA, the first polarizer POL1 is first attached to the surface SUB1s of the first substrate SUB1 away from the second substrate SUB2, and the second polarizer POL2 is first attached to the surface SUB2s of the second substrate SUB2 away from the first substrate SUB1. Figure 4A and Figure 4B In this embodiment, the polarizer may be attached to the substrate in its entirety, but the present invention is not limited thereto. In other embodiments, the polarizer may only cover the display area DA, the bonding area BA and part of the peripheral area PA of the substrate.

[0065] By attaching the polarizer, the stiffness of the attached substrate can be effectively improved, thereby avoiding the problem of film shrinkage or film warping of the substrate in the subsequent cutting process.

[0066] Please refer to Figure 4C and Figure 4D After the polarizer is attached, the second substrate SUB2 and the second polarizer POL2 are cut along the first cutting line CL1. For example, in the present embodiment, the first cutting line CL1 may include a first line segment sg1, a second line segment sg2, and a third line segment sg3. For example, the second line segment sg2 and the third line segment sg3 are located on opposite sides of the bonding area BA along the direction X, and are optionally perpendicular to the first line segment sg1. More specifically, the first line segment sg1 may extend in the direction X, and the second line segment sg2 and the third line segment sg3 may extend in the direction Y and be connected to opposite ends of the first line segment sg1 in the direction X.

[0067] In the cutting process of the second substrate SUB2 and the second polarizer POL2, the wheel cutter WH (or laser) may first cut the second substrate SUB2 and the second polarizer POL2 along the second line segment sg2 and the third line segment sg3 of the first cutting line CL1, and form two cuts located at opposite sides of the bonding area BA (such as Figure 4D The two cutouts reveal the third side wall sw3 and the fifth side wall sw5 of the second substrate SUB2 and the fourth side wall sw4 and the sixth side wall sw6 of the second polarizer POL2.

[0068] For example, while the wheel cutter WH cuts the second substrate SUB2 and the second polarizer POL2 along the second line segment sg2 and the third line segment sg3 of the first cutting line CL1, it also cuts the first substrate SUB1 and the first polarizer POL1. Therefore, the two cuts formed by the cutting may also optionally penetrate the first substrate SUB1 and the first polarizer POL1. That is, in this embodiment, the cutting performed along the second line segment sg2 and the third line segment sg3 of the first cutting line CL1 is a full-cut cutting of the first substrate SUB1, the second substrate SUB2, the first polarizer POL1 and the second polarizer POL2, but is not limited thereto. In another variant embodiment, the cutting performed along the second line segment sg2 and the third line segment sg3 of the first cutting line CL1 may also be a single-sided cutting of only the second substrate SUB2 and the second polarizer POL2.

[0069] Next, the wheel cutter WH (or laser) cuts the second substrate SUB2 and the second polarizer POL2 along the first line segment sg1 of the first cutting line CL1 to remove the portion P of the second substrate SUB2 and the second polarizer POL2 overlapping in the bonding area BA, and exposes a plurality of bonding pads BP and alignment marks AM in the bonding area BA, as shown in FIG. Figure 4D and Figure 4E It is easy to understand that the cutting of the second substrate SUB2 and the second polarizer POL2 according to the first line segment sg1 of the first cutting line CL1 is a single-side cutting of the second substrate SUB2 and the second polarizer POL2.

[0070] In another variant embodiment, the step of cutting the second substrate SUB2 and the second polarizer POL2 along the first line segment sg1 of the first cutting line CL1 may also be performed before the step of cutting the second substrate SUB2 and the second polarizer POL2 along the second line segment sg2 and the third line segment sg3 of the first cutting line CL1.

[0071] Please refer to Figure 4E It is particularly noted that the second substrate SUB2 and the second polarizer POL2 form a corresponding Figure 4C The notch N of the first cutting line CL1 also exposes the first side wall sw1 of the second substrate SUB2 and the second side wall sw2 of the second polarizer POL2.

[0072] After the second substrate SUB2 and the second polarizer POL2 are formed with a notch N exposing the bonding area BA, a bonding process is performed between the circuit board CB and the first substrate SUB1, so that the circuit board CB is electrically bonded to the bonding pad BP in the bonding area BA via the notch N. Figure 1 For example, during the bonding process between the circuit board CB and the bonding pad BP, the circuit board CB can be first aligned with the bonding pad BP using the alignment mark AM in the bonding area BA and then thermally pressed to ensure that each signal pin (not shown) on the circuit board CB is electrically bonded to the correct bonding pad BP.

[0073] At this point, the manufacturing of the display panel 10 is completed.

[0074] Since the first substrate SUB1 and the second substrate SUB2 are respectively attached with the first polarizer POL1 and the second polarizer POL2 during the cutting process, the problem of film shrinkage or film warping of the two substrates during the cutting process can be effectively avoided, thereby ensuring the surface flatness of the two substrates to improve the bonding yield of the circuit board CB in the subsequent process.

[0075] Other embodiments will be listed below to explain the present disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the aforementioned embodiments and will not be repeated below.

[0076] Figure 5 is a schematic diagram of a display panel according to a second embodiment of the present invention. Fig. 6A and Figure 6Byes Figure 5 Schematic diagram of the manufacturing process of the display panel. Figure 5 The display panel 20 of this embodiment and Figure 1 Specifically, in this embodiment, the second substrate SUB2-A further exposes the peripheral areas PA located on opposite sides of the bonding area BA along the direction X, that is, the bonding area BA and the peripheral area PA are arranged along the direction X.

[0077] It is particularly noted that the second substrate SUB2-A has a first side edge SE1 and a second side edge SE2 that are opposite to each other along the direction X and are located on opposite sides of the display area DA and the bonding area BA. The first side wall sw1' and the second side wall sw2' of the second substrate SUB2-A and the second polarizer POL2-A toward the bonding area BA extend from the first side edge SE1 of the second substrate SUB2-A to the second side edge SE2 and also toward the peripheral area PA.

[0078] Different from Figure 4C In the manufacturing process of the display panel 20 of the present embodiment, the first cutting line CL1-A according to which the second substrate SUB2-A and the second polarizer POL2-A are cut is extended from the first side edge SE1 of the second substrate SUB2-A to the second side edge SE2 (such as Fig. 6A More specifically, the first cutting line CL1-A extends through the peripheral area PA and the bonding area BA on one side outside the display area DA.

[0079] Therefore, after cutting and removing the portion P" of the second substrate SUB2-A and the second polarizer POL2-A overlapping the bonding area BA, the bonding area BA and the peripheral area PA will be exposed at the same time, and the first side wall sw1' and the second side wall sw2' of the second substrate SUB2-A and the second polarizer POL2-A facing the bonding area BA and the peripheral area PA will also extend between the first side edge SE1 and the second side edge SE2 of the second substrate SUB2-A (such as Figure 6B shown).

[0080] Since the other steps of the manufacturing method of the display panel 20 are similar to Figure 1 For detailed description of the display panel 10, please refer to the relevant paragraphs of the aforementioned embodiment, which will not be repeated here.

[0081] It is particularly noted that since the first substrate SUB1 and the second substrate SUB2-A are respectively attached with the first polarizer POL1 and the second polarizer POL2-A during the cutting process, the problem of film shrinkage or film warping of the two substrates during the cutting process can be effectively avoided, thereby ensuring the surface flatness of the two substrates to improve the bonding yield of the circuit board CB in the subsequent process.

[0082] Figure 7 is a schematic diagram of a display panel according to a third embodiment of the present invention. FIG. 8A to FIG. 8C yes Figure 7 Schematic diagram of the manufacturing process of the display panel. Figure 7 The display panel 30 of this embodiment and Figure 1 The difference between the display panels 10 is that the first substrate and the second substrate are cut in different ways.

[0083] For example, the manufacturing method of the display panel 30 of the present embodiment may further include cutting the first substrate SUB1-A, the second substrate SUB2-B, the first polarizer POL1-A and the second polarizer POL2-B according to the second cutting line CL2 to remove the portion P1 of the first substrate SUB1-A, the second substrate SUB2-B, the first polarizer POL1-A and the second polarizer POL2-B located on one side of the bonding area BA and forming a first notch N1, and cutting the first substrate SUB1-A, the second substrate SUB2-B, the first polarizer POL1-A and the second polarizer POL2-B according to the third cutting line CL3 to remove the portion P2 of the first substrate SUB1-A, the second substrate SUB2-B, the first polarizer POL1-A and the second polarizer POL2-B located on the other side of the bonding area BA and forming a second notch N2, as shown in FIG. Fig. 8A and Figure 8B From another perspective, after the first notch N1 and the second notch N2 are formed, a protrusion PT is formed on the first substrate SUB1-A, and a bonding pad BP and an alignment mark AM are disposed on the protrusion PT.

[0084] In this embodiment, the first substrate SUB1-A has a first side edge SE1″ and a second side edge SE2″ which are opposite to each other along the direction X, and a third side edge SE3 connecting the first side edge SE1″ and the second side edge SE2″. It is particularly noted that the first cutting line CL1-B is parallel to the third side edge SE3 of the first substrate SUB1-A (eg Figure 8B As shown), the second cutting line CL2 extends from the first side edge SE1″ to the third side edge SE3 in a bent manner, and the third cutting line CL3 extends from the second side edge SE2″ to the third side edge SE3 in a bent manner (as shown Fig. 8A shown).

[0085] Please refer to Figure 8B and Figure 8CAfter forming the first notch N1 and the second notch N2, the second substrate SUB2-B and the second polarizer POL2-B are cut along the first cutting line CL1-B to remove the portion P3 of the second substrate SUB2-B and the second polarizer POL2-B overlapping in the bonding area BA and expose the bonding pad BP and the alignment mark AM on the first substrate SUB1-A and the first side wall sw1” and the second side wall sw2” of the second substrate SUB2-B and the second polarizer POL2-B facing the bonding area BA and being flush with each other. However, the present invention is not limited to this. In another variant embodiment, the step of cutting the second substrate SUB2-B and the second polarizer POL2-B along the first cutting line CL1-B may also be performed before the step of forming the first notch N1 and the second notch N2.

[0086] Since the other steps of the manufacturing method of the display panel 30 are similar to Figure 1 For detailed description of the display panel 10, please refer to the relevant paragraphs of the aforementioned embodiment, which will not be repeated here.

[0087] It is particularly noted that since the first substrate SUB1-A and the second substrate SUB2-B are respectively attached with the first polarizer POL1-A and the second polarizer POL2-B during the cutting process, the problem of film shrinkage or film warping of the two substrates during the cutting process can be effectively avoided, thereby ensuring the surface flatness of the two substrates to improve the bonding yield of the circuit board CB in the subsequent process.

[0088] Please refer to Figure 7 ,based on FIG. 8A to FIG. 8C In the cutting steps shown, in the display panel 30 of the present embodiment, the first polarizer POL1-A, the first substrate SUB1-A, the second substrate SUB2-B and the second polarizer POL2-B respectively have a first notch sidewall nsw1a, a first notch sidewall nsw1b, a first notch sidewall nsw1c and a first notch sidewall nsw1d defining the first notch N1, and these first notch sidewalls are tangent to each other. On the other hand, the first polarizer POL1-A, the first substrate SUB1-A, the second substrate SUB2-B and the second polarizer POL2-B also respectively have a second notch sidewall nsw2a, a second notch sidewall nsw2b, a second notch sidewall nsw2c and a second notch sidewall nsw2d defining the second notch N2, and these second notch sidewalls are tangent to each other.

[0089] It is particularly noted that the first notch side wall nsw1b and the second notch side wall nsw2b of the first substrate SUB1-A can define a protruding portion PT of the first substrate SUB1-A, and a bonding area BA is provided on the protruding portion PT. The circuit board CB is electrically bonded in the bonding area BA on the protruding portion PT. In other words, the first notch side wall nsw1b of the first substrate SUB1-A can extend from the first side edge SE1" to the third side edge SE3, and the second notch side wall nsw2b of the first substrate SUB1-A can extend from the second side edge SE2" to the third side edge SE3.

[0090] In summary, the manufacturing method of the display panel according to one embodiment of the present invention firstly attaches the polarizer to the substrate on the entire surface before removing the overlapping portion of the substrate and the bonding area. This can avoid the problem of film shrinkage or film warping during the cutting process due to insufficient stiffness of the substrate, thereby improving the bonding yield of the circuit board in the subsequent manufacturing process.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that: include: A first substrate having a display area and a bonding area outside the display area; A second substrate is overlapped with the first substrate and exposes the bonding area of ​​the first substrate; A liquid crystal layer, disposed between the first substrate and the second substrate and overlapping the display area; A first polarizer is disposed on a surface of the first substrate facing away from the second substrate; A second polarizer is disposed on a surface of the second substrate facing away from the first substrate; as well as A circuit board is bonded to the bonding area of ​​the first substrate, wherein a first side wall of the second substrate facing the bonding area is aligned with a second side wall of the second polarizer facing the bonding area.

2. The display panel according to claim 1, characterized in that: The second substrate also has a third side wall facing the joining area, the third side wall is perpendicular to the first side wall, the second polarizer also has a fourth side wall facing the joining area, and the third side wall of the second substrate is aligned with the fourth side wall of the second polarizer.

3. The display panel according to claim 2, characterized in that: The second substrate also has a fifth side wall facing the joining area and opposite to the third side wall, and the fifth side wall is perpendicular to the first side wall. The second polarizer also has a sixth side wall facing the joining area and opposite to the fourth side wall, and the fifth side wall of the second substrate is flush with the sixth side wall of the second polarizer.

4. The display panel according to claim 3, characterized in that: The first side wall, the third side wall and the fifth side wall define a notch of the second substrate, and the circuit board is joined to the joining area of ​​the first substrate via the notch of the second substrate.

5. The display panel according to claim 1, characterized in that: The first substrate is also provided with a peripheral area outside the display area and the bonding area, the second substrate does not overlap the peripheral area, the bonding area and the peripheral area are arranged along a first direction, the second substrate has a first side edge and a second side edge that are opposite to each other along the first direction, the first side wall extends from the first side edge to the second side edge and also faces the peripheral area.

6. The display panel according to claim 1, characterized in that: Also includes: A first notch is disposed at one side of the bonding area, wherein the first notch sidewalls of the first substrate, the second substrate, the first polarizer, and the second polarizer respectively defining the first notch are tangent to each other; as well as The second notch is disposed at the other side of the bonding area, wherein the second notch side walls defined by the first substrate, the second substrate, the first polarizer, and the second polarizer are aligned with each other.

7. The display panel according to claim 6, characterized in that: The first notch sidewall and the second notch sidewall of the first substrate define a protruding portion of the first substrate, and the bonding area is disposed on the protruding portion.

8. The display panel according to claim 7, characterized in that: The first notch, the bonding area and the second notch are arranged along a first direction. The first substrate has a first side edge and a second side edge that are opposite to each other along the first direction. The first notch side wall of the first substrate extends from the first side edge. The second notch side wall of the first substrate extends from the second side edge.

9. A method for manufacturing a display panel, characterized in that: include: Assembling a first substrate and a second substrate so that a liquid crystal layer is sandwiched between the first substrate and the second substrate, the first substrate is provided with a display area and a bonding area outside the display area, and the liquid crystal layer overlaps the display area; Attaching a first polarizer to a surface of the first substrate facing away from the second substrate; attaching a second polarizer to a surface of the second substrate facing away from the first substrate, wherein the second substrate and the second polarizer overlap in the joining area; Cutting the second substrate and the second polarizer along a first cutting line to remove the overlapping portions of the second substrate and the second polarizer in the joining area and expose the joining area; as well as A circuit board is bonded to the bonding area of ​​the first substrate.

10. The method for manufacturing a display panel according to claim 9, wherein: The step of cutting the second substrate and the second polarizer along the first cutting line includes: cutting the second substrate and the second polarizer according to the first line segment of the first cutting line; and The second substrate and the second polarizer are cut according to the second line segment and the third line segment of the first cutting line, wherein the second line segment and the third line segment are located at opposite sides of the bonding area and are respectively perpendicular to the first line segment. The second substrate and the second polarizer form a notch corresponding to the first cutting line after removing the portion overlapping the bonding area, and the circuit board is bonded to the bonding area of ​​the first substrate via the notch of the second substrate and the second polarizer.

11. The method for manufacturing a display panel according to claim 9, wherein: The second substrate has a first side edge and a second side edge located at two opposite sides of the display area and the bonding area, and the first cutting line extends from the first side edge to the second side edge.

12. The method for manufacturing a display panel according to claim 9, wherein: Also includes: Cutting the first substrate, the second substrate, the first polarizer, and the second polarizer along a second cutting line to remove portions of the first substrate, the second substrate, the first polarizer, and the second polarizer located on one side of the bonding area and form a first notch; as well as The first substrate, the second substrate, the first polarizer and the second polarizer are cut along a third cutting line to remove portions of the first substrate, the second substrate, the first polarizer and the second polarizer located on the other side of the joining area and form a second notch.

13. The method for manufacturing a display panel according to claim 12, characterized in that: Before removing the portion of the second substrate and the second polarizer overlapping the bonding area, the first notch and the second notch are formed.

14. The method for manufacturing a display panel according to claim 12, wherein: The first substrate has a first side edge and a second side edge that are opposite to each other and a third side edge connecting the first side edge and the second side edge, wherein the first cutting line is parallel to the third side edge of the first substrate, the second cutting line extends from the first side edge to the third side edge in a bent manner, and the third cutting line extends from the second side edge to the third side edge in a bent manner.

15. The method for manufacturing a display panel according to claim 12, wherein: After the first notch and the second notch are formed, a protruding portion is formed on the first substrate, and the circuit board is joined to the joining area on the protruding portion.