Pressure detection tool for bonding equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a bonding equipment pressure detection tool, which comprises a detection main body, a pressure bearing piece and at least two pressure sensors, the pressure sensor is located between the detection main body and the pressure-bearing piece, the pressure sensor is arranged at the first end of the detection main body, and the pressure-bearing piece is supported on the pressure sensor. In the use process of the bonding equipment pressure detection tool, the detection tool is placed on the lower disc device, the pressure-bearing piece faces the upper disc device, the upper disc device moves downwards to apply downward pressure to the pressure-bearing piece, and the pressures of different positions of the pressure-bearing piece are detected through the pressure sensors so as to detect the stress uniformity of the pressure-bearing piece. The position and posture of the disc loading device are adjusted according to the measured data, so that the pressure uniformity of the disc loading device during pressure applying is improved, the bonding effect is improved, and the bonding yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a bonding equipment pressure detection tool. Background Art

[0002] In the field of semiconductor technology, wafer bonding refers to a method of tightly bonding wafers together through chemical and physical effects. Wafer bonding can be applied to the preparation of SOI materials.

[0003] Wafer thermal compression bonding must be performed under certain temperature, vacuum and pressure. Therefore, the uniformity of pressure and the accuracy of pressure value are crucial. Pressure deviation will directly affect the quality of the bonding process and further affect the bonding yield.

[0004] After the bonding machine has been working for a long time, it is found that the yield of wafer bonding will decrease. The reason is that after the bonding machine has been used for a long time, the pressure head of the bonding machine will deviate, resulting in poor uniformity of the pressure applied by the pressure head to the wafer. At this time, it is urgent to calibrate the process parameters of the pressure head, but the existing bonding machine is not equipped with tooling for calibrating the pressure head.

[0005] In order to solve the above problems, the utility model provides a bonding equipment pressure detection tool, which is used to detect and calibrate the pressure head of the bonding equipment, so as to improve the equipment quality and product yield. Utility Model Content

[0006] The utility model aims to provide a bonding equipment pressure detection tool, which is used for detecting and calibrating the pressure head of the bonding equipment, so as to improve the equipment quality and product yield.

[0007] The utility model provides a bonding equipment pressure detection tool, comprising: a detection body, a pressure bearing member and at least two pressure sensors;

[0008] The pressure sensor is located between the detection body and the pressure-bearing member. The pressure sensor is arranged at the first end of the detection body, and the pressure-bearing member is supported by the pressure sensor.

[0009] Optionally, the bonding equipment pressure detection tool further includes at least two distance sensors, wherein the distance sensors are arranged at the first end of the detection body, and there is a gap between the distance sensors and the pressure-bearing member.

[0010] Optionally, the number of the pressure sensors and the distance sensors is the same, and each of the pressure sensors is paired one-to-one with each of the distance sensors.

[0011] Optionally, the first end of each of the distance sensors is arranged at the first end of the detection body, and the second ends of each of the distance sensors are coplanar.

[0012] Optionally, the bonding equipment pressure detection tool further includes a height adjustment member, and the height adjustment member is detachably provided between at least one pressure sensor and the first end of the detection body.

[0013] Optionally, the detection body is cylindrical, and one end of the detection body along its axial direction serves as the first end; and or; the pressure-bearing member is disc-shaped.

[0014] Optionally, when the detection body is cylindrical and the pressure-bearing member is disc-shaped, the outer diameter of the pressure-bearing member is the same as the outer diameter of the detection body.

[0015] Optionally, a cable groove is provided at the first end of the detection body.

[0016] Optionally, a first groove is provided at the first end of the detection body, and a part of the pressure sensor is provided in the first groove;

[0017] When the bonding device pressure detection tooling includes a height adjustment member, the height adjustment member is disposed in the first groove and is located between the groove bottom of the first groove and the pressure sensor;

[0018] And / or; when the bonding equipment pressure detection tooling includes a distance sensor, a second groove is provided at the first end of the detection body, and at least a portion of the distance sensor is provided in the second groove.

[0019] Optionally, the bonding equipment pressure detection tool further includes a control unit and a display unit, the pressure sensor and the distance sensor are connected to the control unit, and the control unit is connected to the display unit.

[0020] Configured in this way, the bonding equipment pressure detection tooling in the utility model is placed on the lower disk device during use, with the pressure-bearing part facing the upper disk device. The upper disk device moves downward to apply downward pressure to the pressure-bearing part, and the pressure at different positions of the pressure-bearing part is detected by various pressure sensors to detect the uniformity of the force on the pressure-bearing part. The position of the upper disk device is adjusted according to the measured data, thereby improving the uniformity of pressure when the upper disk device applies pressure, thereby improving the bonding effect and the bonding yield.

[0021] The bonding equipment pressure detection tooling of the utility model is also provided with a distance detection sensor. Through the configuration of this structure, the horizontality of the pressure-bearing part can be easily adjusted, thereby eliminating the interference of the pressure detection due to the large horizontality error, which is conducive to improving the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the working principle of the bonding device of some embodiments of the utility model;

[0023] Figure 2 It is a structural schematic diagram of a bonding equipment pressure detection tooling of some embodiments of the utility model;

[0024] Figure 3 It is an internal schematic diagram of a bonding equipment pressure detection tooling of some embodiments of the utility model;

[0025] Figure 4 A schematic diagram of the internal structure of a bonding device pressure detection tooling according to some embodiments of the utility model;

[0026] Figure 5 This is a structural block diagram of a bonding equipment pressure detection tooling according to some embodiments of the present utility model.

[0027] The reference numerals are as follows:

[0028] 100-bonding cavity; 200-upper plate device; 300-lower plate device;

[0029] 10-detection body; 11-first groove; 12-second groove; 13-cable groove; 14-cable;

[0030] 20-pressure bearing parts;

[0031] 30-pressure sensor;

[0032] 40- distance sensor;

[0033] 50- control unit;

[0034] 60-Display unit. DETAILED DESCRIPTION

[0035] The following is a further detailed description of the bonding equipment pressure detection tooling proposed by the utility model in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0036] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0037] Please refer to Figure 1 As shown, this is a schematic diagram of the working principle of a bonding device.

[0038] It mainly includes a bonding cavity 100 , an upper plate device 200 and a lower plate device 300 .

[0039] The bonding chamber 100 provides a sealed space to create a sealed environment for high vacuum. The upper plate device 200 can be raised and lowered in the bonding chamber 100. The upper plate device 200 has pressurization and heating functions. The lower plate device 300 is generally fixed in the bonding chamber 100. The lower plate device 300 is located below the upper plate device 200. The lower plate device 300 can also integrate a heating function. The upper plate device 200 acts as a pressure head. When the upper plate device 200 moves downward, it can apply pressure to the wafer placed on the lower plate device 300 to meet the pressure requirements of wafer bonding. At the same time, the upper plate device 200 and the lower plate device 300 can also heat the wafer to meet the temperature requirements of wafer bonding.

[0040] When the bonding device is used for a long time, the pressure uniformity of the mounting device 200 applied to the wafer is poor. This embodiment provides a bonding device pressure detection tool, which is used to detect the pressure of the mounting device 200.

[0041] Please combine Figure 2 and Figure 3 As shown, the bonding equipment pressure detection tooling includes: a detection body 10, a pressure-bearing part 20 and five pressure sensors 30.

[0042] Since the existing wafers are usually round, the pressure head (upper plate device 200) and the lower plate device 300 of the bonding equipment are usually set to be disc-shaped. Therefore, the overall shape of the detection tool in this embodiment is adapted to the existing bonding equipment and is set to be cylindrical.

[0043] like Figure 2 As shown, in this embodiment, the outer contour of the bonding equipment pressure detection tooling is cylindrical as a whole, wherein the detection body 10 is cylindrical, the pressure-bearing part 20 is disc-shaped, and the outer diameter of the pressure-bearing part 20 is the same as the outer diameter of the detection body 10 to facilitate coaxial alignment of the two.

[0044] Combination Figure 3 As shown, Figure 3 The upper end of the detection body 10 is used as the first end, and five pressure sensors 30 are all arranged at the first end of the detection body 10. Among the five pressure sensors 30, one pressure sensor 30 is roughly arranged at the center of the detection body 10, and the other four pressure sensors 30 are circumferentially arranged around the central axis of the detection body 10. The pressure sensor 30 is located between the detection body 10 and the pressure-bearing member 20, and the pressure-bearing member 20 is supported by the pressure sensor 30. The distribution of the above pressure sensors is conducive to uniformly detecting the pressure on the pressure-bearing member 20.

[0045] The first end of the pressure sensor 30 ( Figure 3 The lower end of the detection body 10 is arranged at the first end ( Figure 3 The upper end of the pressure sensor 30 ( Figure 3 The upper end of the support member is supported by the pressure-bearing member 20.

[0046] The pressure-bearing member 20 can be naturally supported on the pressure sensor 30. In addition, to ensure the stability of the pressure-bearing member 20, the lower end of the pressure-bearing member 20 can be connected to multiple guide rods, and the upper end (first end) of the detection body 10 can be axially provided with a sliding hole, and the guide rods are slidably arranged in the sliding hole. Through the arrangement of the guide rods, on the one hand, the pressure-bearing member 20 can be positioned radially and circumferentially, and on the other hand, the axial freedom of the pressure-bearing member 20 is not guaranteed, and the axial force of the pressure-bearing member 20 will not be interfered with.

[0047] The pressure sensor 30 is used to detect the pressure of the pressure-bearing part 20. The pressure sensor can be a piezoresistive pressure sensor, an inductive pressure sensor, a capacitive pressure sensor, etc. The structure, installation and use of the pressure sensor are all existing technologies and will not be repeated here.

[0048] During use of the above-mentioned bonding equipment pressure detection tooling, the detection tooling is placed on the lower disk device 300, and the pressure-bearing part 20 is facing the upper disk device 200. The upper disk device 200 moves downward to apply downward pressure to the pressure-bearing part 20, and the pressure at different positions of the pressure-bearing part 20 is detected by each pressure sensor 30 to detect the uniformity of the force on the pressure-bearing part 20. The posture of the upper disk device 200 is adjusted according to the measured data, thereby improving the uniformity of pressure when the upper disk device 200 applies pressure, so as to improve the bonding effect and improve the bonding yield.

[0049] In some alternative embodiments, the outer diameter of the pressure-bearing member 20 may be larger than the outer diameter of the detection body 10, and a groove matching the outer diameter of the detection body 10 may be provided at the lower end of the pressure-bearing member 20, and the pressure-bearing member 20 is covered on the upper end (first end) of the detection body 10, and the inner wall of the groove on the pressure-bearing member 20 conforms to the outer periphery of the upper end of the detection body 10. At this time, the pressure-bearing member 20 is radially positioned, and the pressure-bearing member 20 can freely move relative to the axial direction of the detection body 10, so as to more accurately detect the pressure of the pressure-bearing member 20.

[0050] In some alternative embodiments, the pressure-bearing member may be connected to the first end of the detection body 10 via a connecting member, and the connecting member may be, for example, a screw, an elastic connecting member, or a clamping member.

[0051] In some alternative embodiments, the number of pressure sensors 30 may be adaptively adjusted based on actual detection requirements, for example, two, three, four or more pressure sensors 30 may be provided.

[0052] In some alternative embodiments, the shape of the bonding equipment pressure detection tooling can be adaptively adjusted based on usage requirements. For example, it can be adaptively adjusted based on the shape of the pressure head (upper plate device 200) and the lower plate device 300 of the bonding equipment, or it can be adaptively adjusted based on the shape of the wafer to be bonded.

[0053] Please continue to refer to Figure 3 As shown, the bonding equipment pressure detection tooling further includes five distance sensors 40 . The distance sensors 40 are disposed at the first end of the detection body 10 . There is a gap between the distance sensors 40 and the pressure-bearing member 20 .

[0054] The first end ( Figure 3 The lower end of the detection body 10 is arranged at the first end ( Figure 3The upper end of each distance sensor 40 ( Figure 3 The second end of the distance sensor 40 also serves as a distance detection end. The distance sensor 40 may be an optical distance sensor, an ultrasonic distance sensor, a laser distance sensor, etc. The structure, installation and use of the distance sensor 40 are all existing methods and will not be described in detail here.

[0055] Since there is a gap between the second end of the distance sensor 40 and the pressure-bearing member 20, and the pressure-bearing member 20 is supported on the second end ( Figure 3 The upper end of the distance sensor 40 is substantially Figure 3 The upper end of the pressure sensor 30 is lower than the second end of the pressure sensor 30 ( Figure 3 middle).

[0056] Each distance sensor 40 detects the distance from the pressure-bearing part 20 to adjust the level of the pressure-bearing part 20 and ensure that the pressure-bearing part 20 is level. For example, each distance sensor 40 measures multiple groups of distances from the pressure-bearing part 20. If each group of distances is within the error range, such as the error is less than 10um, it is considered to be level; if it exceeds the error, it is considered that the pressure-bearing part 20 is not level and needs to be adjusted. After the level of the pressure-bearing part 20 is adjusted, observe the values ​​displayed by each pressure sensor 30 at this time, and use the values ​​at this time as the initial value.

[0057] In this embodiment, in order to facilitate adjustment of the level of the pressure-bearing member 20 based on the data of the distance sensor 40 , the number of the pressure sensors 30 and the distance sensors 40 are the same, and each of the pressure sensors 30 is paired with each of the distance sensors 40 .

[0058] like Figure 3 and Figure 4 As shown, each pressure sensor 30 is equipped with a distance sensor 40 next to it, and the two are used in pairs. The pairing method uses distance as a reference, and the distance sensor 40 closest to the pressure sensor 30 naturally forms a pair. The distance between the two sensors in each pair is adjusted based on the process requirements. In this embodiment, a composite sensor integrating pressure and distance sensing can also be used, that is, the pressure sensor 30 and the distance sensor 40 are integrated into one.

[0059] Through the above pairing, if the distance measured by one of the distance sensors 40 is abnormal, the levelness of the pressure-bearing member 20 can be adjusted by adjusting the height of the pressure sensor 30 paired with it, which facilitates the adjustment of the pressure-bearing member 20. By adjusting the levelness of the pressure-bearing member 20, the interference of the pressure detection due to the large levelness error is eliminated, which is conducive to improving the detection accuracy.

[0060] In some alternative embodiments, the number of distance sensors 40 can be adaptively adjusted based on actual detection requirements. For example, two, three, four or more distance sensors 40 can be provided as long as the number of pressure sensors 30 and distance sensors 40 is consistent.

[0061] To further facilitate the height adjustment of the pressure sensor 30 , the bonding equipment pressure detection tooling also includes a height adjustment member (not shown in the figure), and the height adjustment member is detachably arranged between at least one pressure sensor 30 and the first end of the detection body 10 .

[0062] The height adjustment member can be disassembled and assembled based on the adjustment requirements to adjust the height of the pressure sensor 30. In this embodiment, the height adjustment member adopts a gasket. To facilitate the addition of the gasket, a first groove 11 is provided at the first end of the detection body 10. A part of the pressure sensor 30 is provided in the first groove 11, and another part is located outside the first groove 11 and supported on the pressure bearing member 20. The height adjustment member is provided in the first groove 11 and is located between the groove bottom of the first groove 11 and the pressure sensor 30.

[0063] like Figure 3 and Figure 4 As shown, the pressure sensor 30 is cylindrical as a whole, and the first groove 11 is a cylindrical groove that fits the pressure sensor 30. The height adjustment member is preferably a disc-shaped or annular gasket, and the gasket fits the first groove 11. The height adjustment of the pressure sensor 30 is achieved by adding or removing gaskets in the first groove 11.

[0064] In some alternative embodiments, the height adjustment member may be a pad or a member with a lifting function, such as a hydraulic structure. The shape of the height adjustment member may be adaptively adjusted based on its installation position.

[0065] like Figure 4 As shown, the first end of the detection body 10 is provided with a second groove 12, and a part or all of the distance sensor 40 is disposed in the second groove 12. Similarly, the shape of the second groove 12 is conformably matched with the shape of the distance sensor 40 to meet the installation and positioning requirements of the distance sensor 40, and the distance sensor 40 can be fixed inside the second groove 12 by bonding or magnetic attraction.

[0066] Please continue to refer to Figure 4As shown, a cable groove 13 is provided at the first end of the detection body 10. The cable groove 13 is used for wiring, and the cable groove 13 is in a tree-like structure. Each cable groove 13 is respectively connected to each first groove 11 and the second groove 12, and each cable groove 13 finally converges and is connected to the outer peripheral wall of the detection body 10. The pressure sensor 30 and the distance sensor 40 are both connected to cables 14, and each cable is routed through the cable groove 13 and passed to the outside of the detection body 10 to be connected to the external detection circuit.

[0067] like Figure 5 As shown, in some alternative embodiments, the bonding equipment pressure detection tooling further includes a control unit 50 and a display unit 60 , the pressure sensor 30 and the distance sensor 40 are connected to the control unit 50 , and the control unit 50 is connected to the display unit 60 .

[0068] The data detected by the pressure sensor 30 and the distance sensor 40 are transmitted to the control unit 50 , and the control unit 50 can display the data on the display unit 60 in the form of graphics or text after calculation.

[0069] The control unit 50 generally includes at least one processor, which may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0070] The at least one processor can communicate with a plurality of peripheral devices via the bus subsystem. These peripheral devices may include a storage system, a user interface input device, a display unit 60, and a network interface.

[0071] The network interface provides an interface to an external network and / or other devices. The network interface includes one or more interfaces known in the art, such as LAN, WLAN, Bluetooth, other wired and wireless interfaces, and the like.

[0072] User interface input devices may include keyboards, pointing devices such as mice, trackballs, touch pads or graphic tablets, scanners, foot pedals, joysticks, touch screens embedded in displays, audio input devices such as voice recognition systems, microphones, and other types of input devices. In general, the term "input device" is intended to include a variety of conventional and proprietary devices and methods for inputting information into a control unit.

[0073] The display unit 60 may include a display subsystem, a printer, a fax machine, or a non-visual display such as an audio output device. The display subsystem may be a flat panel device, such as a liquid crystal display (LCD), a light emitting diode (LED) display, a touch screen display, etc. The display subsystem may also provide a non-visual display such as via an audio output device. Generally speaking, the term "output device" is intended to include various conventional and proprietary devices and methods for outputting information from the control unit 50 to a user.

[0074] The storage system can store basic programming and data structures that implement various functions of the utility model. For example, as described herein, databases and modules that implement the functions of the utility model method can be stored in the storage system. These software modules are usually executed by a processor. In a distributed environment, the software modules can be stored on multiple computer systems and executed by processors of multiple computer systems. The storage system usually includes a memory subsystem and a file storage system. The memory subsystem usually includes multiple memories, including a main random access memory (RAM) for storing instructions and data during program execution and a read-only memory (ROM) in which fixed instructions are stored. The file storage subsystem provides permanent non-volatile storage for program and data files. The file storage system 60 may include a hard disk drive and associated removable media, a compact disk (CD) drive, an optical drive, a DVD, a solid-state memory and / or other removable media. One or more of these drives may be located at a remote location on other connected computers at other sites connected to the control unit 50. The modules that implement the functions of the utility model can be stored by the file storage system.

[0075] The bus subsystem provides a means for the various components and subsystems of the control unit 50 to communicate with each other as expected. The various subsystems and components of the control unit 50 do not have to be in the same physical location, but can be distributed at various locations within the distributed network. The bus subsystem can be a single bus, or multiple buses can be set based on demand.

[0076] The control unit 50 described above is intended to be used as an example only to illustrate only one embodiment of the present invention. Due to the ever-changing nature of computers and networks, in other alternative embodiments, the control unit 50 may also have certain differences from the configuration of the control unit described above, which will not be repeated here.

[0077] The use process of the above-mentioned bonding equipment pressure detection tooling is as follows:

[0078] The distance data is collected by the pressure sensor 30 and the distance sensor 40, and the data is processed by methods such as median filtering, and then fed back to the display unit 60;

[0079] The height of the pressure sensor 30 is adjusted based on the distance data collected by the distance sensor 40 to adjust the horizontality of the pressure-bearing member 20 to ensure that the pressure-bearing member 20 is level.

[0080] After the horizontality of the pressure-bearing member 20 is adjusted, the values ​​displayed by each pressure sensor 30 are observed and taken as initial values.

[0081] The bonding equipment pressure detection tooling is sent into the bonding cavity 100, wherein the bonding equipment pressure detection tooling is placed on the lower plate device 300, and the upper plate device 200 moves downward to apply pressure to the pressure-bearing part 20, and the pressure is detected by each pressure sensor 30 to calculate the pressure uniformity.

[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0083] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A bonding equipment pressure detection tool, characterized in that: include: A detection body, a pressure-bearing member and at least two pressure sensors; The pressure sensor is located between the detection body and the pressure-bearing member. The pressure sensor is arranged at the first end of the detection body, and the pressure-bearing member is supported by the pressure sensor.

2. The bonding equipment pressure detection tool as claimed in claim 1, characterized in that: The bonding equipment pressure detection tool further includes at least two distance sensors, wherein the distance sensors are arranged at the first end of the detection body, and there is a gap between the distance sensors and the pressure-bearing member.

3. The bonding equipment pressure detection tool as claimed in claim 2, characterized in that: The number of the pressure sensors is the same as the number of the distance sensors, and each of the pressure sensors is paired with each of the distance sensors one by one.

4. The bonding equipment pressure detection tool as claimed in claim 2, characterized in that: The first end of each of the distance sensors is arranged at the first end of the detection body, and the second ends of each of the distance sensors are coplanar.

5. The bonding equipment pressure detection tool as claimed in claim 1, characterized in that: The bonding equipment pressure detection tool also includes a height adjustment member, and the height adjustment member is detachably arranged between at least one pressure sensor and the first end of the detection body.

6. The bonding equipment pressure detection tool as claimed in claim 1, characterized in that: The detection body is cylindrical, and one end of the detection body along its axial direction serves as the first end; and or; the pressure-bearing member is disc-shaped.

7. The bonding equipment pressure detection tool as claimed in claim 6, characterized in that: When the detection body is cylindrical and the pressure-bearing member is disc-shaped, the outer diameter of the pressure-bearing member is the same as the outer diameter of the detection body.

8. The bonding equipment pressure detection tool as claimed in any one of claims 1 to 7, characterized in that: The first end of the detection body is provided with a cable groove.

9. The bonding equipment pressure detection tool as claimed in any one of claims 1 to 7, characterized in that: The first end of the detection body is provided with a first groove, and a part of the pressure sensor is provided in the first groove; When the bonding device pressure detection tooling includes a height adjustment member, the height adjustment member is disposed in the first groove and is located between the groove bottom of the first groove and the pressure sensor; And / or; when the bonding equipment pressure detection tooling includes a distance sensor, the first end of the detection body is provided with a second groove, and at least a portion of the distance sensor is arranged in the second groove.

10. The bonding equipment pressure detection tool as claimed in claim 2, characterized in that: The bonding equipment pressure detection tool also includes a control unit and a display unit, the pressure sensor and the distance sensor are connected to the control unit, and the control unit is connected to the display unit.

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