Double-sided efficient heat dissipation airtight packaging structure and preparation method thereof

Abstract

The invention belongs to the technical field of microelectronic heat dissipation, and discloses a double-sided efficient heat dissipation airtight packaging structure and a preparation method thereof.The double-sided efficient heat dissipation airtight packaging structure comprises a packaging substrate, an electric connector is arranged in a groove in the bottom of the packaging substrate, a sealing mechanism is arranged at the top of the packaging substrate, and a heat dissipation mechanism is arranged at the top of the sealing mechanism; heat conduction fins are arranged between the heat dissipation mechanism and the sealing mechanism, a chip is arranged in the sealing mechanism, and leakage monitoring mechanisms are arranged at the tops of protrusions of the outer wall of the heat dissipation mechanism. Through combination of two heat dissipation modes of liquid cooling and air cooling, the packaging structure can rapidly reduce the internal temperature of equipment, guarantee stable operation of the chip and improve the reliability of the equipment. The design of the sealing mechanism ensures that the internal environment of the package is isolated from the outside, pollutants are prevented from invading, an internal chip and other electronic elements are protected, the sealing pipe and the internal leakage monitoring mechanism can monitor possible leakage in time, and an important guarantee is provided for safe operation of equipment.

Description

Technical Field

[0001] The present application relates to the field of microelectronic heat dissipation technology, and more specifically, to a double-sided high-efficiency heat dissipation hermetic packaging structure and a preparation method thereof. Background Art

[0002] With the rapid development of microelectronics technology, the integration of microelectronic devices is getting higher and higher, and the power density is also getting higher and higher, resulting in increasingly prominent heat dissipation problems. Although traditional heat dissipation methods, such as metal packaging and ceramic packaging, can meet the heat dissipation needs to a certain extent, they all have some disadvantages, such as poor environmental tolerance and poor electrical performance of metal packaging; ceramic packaging has poor heat dissipation effect. Therefore, how to develop a packaging structure that can ensure airtightness and efficient heat dissipation has become a problem that needs to be solved in the current field of microelectronic heat dissipation technology. In order to solve the above problems, the present application provides a double-sided high-efficiency heat dissipation airtight packaging structure and its preparation method. Summary of the invention

[0003] The present application provides a double-sided high-efficiency heat dissipation airtight packaging structure and a preparation method thereof using the following technical solutions:

[0004] A double-sided high-efficiency heat dissipation airtight packaging structure and a preparation method thereof, comprising a packaging substrate, an electrical connector is provided in a groove at the bottom of the packaging substrate, a sealing mechanism is provided on the top of the packaging substrate, a heat dissipation mechanism is provided on the top of the sealing mechanism, heat-conducting fins are provided between the heat dissipation mechanism and the sealing mechanism, a chip is provided in the sealing mechanism, and a leakage monitoring mechanism is provided on the top of the protrusion on the outer wall of the heat dissipation mechanism.

[0005] Furthermore, the electrical connector includes evenly distributed electrical connection bumps.

[0006] Furthermore, the heat dissipation mechanism includes a heat dissipation shell, in which a spiral linear liquid-cooling flow pipe is provided, and liquid-cooling heat exchangers are provided at both ends of the liquid-cooling flow pipe away from the heat dissipation shell, and symmetrical grille brackets are provided between the inner walls of the heat dissipation shell, and an air-cooling motor is provided on the top of the grille bracket, and an evenly distributed air-cooling fan is provided on the outer wall between the opposite grille brackets at the output end of the air-cooling motor.

[0007] Furthermore, both ends of the liquid-cooled flow pipe penetrate the outer wall of the heat dissipation shell and extend outside the heat dissipation shell to communicate with the liquid-cooled heat exchanger. The liquid-cooled heat exchanger is located outside the heat dissipation shell. The output end of the air-cooled motor penetrates the top grille bracket and is connected to the bottom grille bracket. There are four air-cooling fans, and the air-cooling fans are all located between two opposite grille brackets.

[0008] Furthermore, the sealing mechanism includes a frame, a ring-shaped sealing groove is formed on the top of the frame, fixing feet are formed on the four corners of the inner wall of the frame, mounting ears are formed on both sides of the frame, symmetrical slots are formed on adjacent sides of the frame away from the mounting ears, a cover plate is formed on the top of the frame, symmetrical blocks are formed on both sides of the cover plate close to the slots, and an annular sealing convex ring is formed on the bottom of the cover plate.

[0009] Furthermore, between the chip clamping and the fixing foot, the cover plate is mounted on the surrounding frame through the mutual clamping of the clamping block and the clamping groove, and the sealing groove and the sealing convex ring are clamped to each other.

[0010] Furthermore, the invention comprises a sealing tube, a pressure alarm is provided on the top of the sealing tube, a first electric contact is provided on the top of the inner wall of the sealing tube, a second electric contact is provided on the top of the inner wall of the sealing tube, and the second electric contact is located above the first electric contact, and the protrusions of the first electric contact and the second electric contact are connected to each other.

[0011] Furthermore, the method comprises the following steps: preparing the required materials; installing the surrounding frame on the packaging substrate by welding and screws; installing the chip on the packaging substrate and interconnecting it with the electrical connector; installing the heat dissipation mechanism on the chip through the cover plate, so that the heat-conducting fins and the chip are in contact with each other through the heat-conducting gel applied between them; and installing the cover plate on the surrounding frame by clamping the clamp block and the clamping slot.

[0012] In summary, this application includes the following beneficial technical effects:

[0013] By combining liquid cooling and air cooling, the packaging structure can quickly reduce the internal temperature of the equipment and ensure the stable operation of the chip. The design of the sealing mechanism ensures that the environment inside the package is isolated from the outside world, prevents the intrusion of pollutants, and protects the internal chips and other electronic components. The sealing tube and the internal leakage monitoring mechanism can timely monitor possible leaks, providing important guarantees for the safe operation of the equipment. The packaging structure adopts a modular design, which makes the installation and disassembly of each component more convenient and improves maintenance efficiency. The entire packaging structure can be easily assembled through welding, screw installation, clamping and other methods. Due to the modular design and detachable connection method, some components of the packaging structure can be replaced separately after damage, which improves resource utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of this application;

[0015] Figure 2 This is a schematic diagram of the structure of the present application when viewed from above;

[0016] Figure 3 This is a schematic diagram of the heat-conducting fin structure of the present application;

[0017] Figure 4 This is a schematic diagram of the liquid cooling flow tube structure of this application;

[0018] Figure 5 This is a schematic diagram of the air-cooling fan structure of this application;

[0019] Figure 6 This is a schematic diagram of the frame structure of this application;

[0020] Figure 7 This is a schematic diagram of the cover structure of this application;

[0021] Figure 8 This is a schematic diagram of the leakage monitoring mechanism structure of this application.

[0022] Description of the numbers in the figure:

[0023] 1. Packaging substrate; 2. Heat dissipation mechanism; 201. Heat dissipation housing; 202. Liquid-cooled flow pipe; 203. Liquid-cooled heat exchanger; 204. Grille bracket; 205. Air-cooled fan; 206. Air-cooled motor; 3. Sealing mechanism; 301. Frame; 302. Mounting ear; 303. Fixed foot; 304. Sealing groove; 305. Card slot; 306. Cover plate; 307. Card block; 308. Sealing convex ring; 4. Electrical connector; 5. Thermal fins; 6. Leakage monitoring mechanism; 601. Sealing tube; 602. Pressure alarm; 603. First electrical contact; 604. Second electrical contact; 7. Chip. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0025] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Example:

[0028] The present application discloses a double-sided high-efficiency heat dissipation airtight packaging structure and a preparation method thereof. Figure 1-Figure 8 , including a packaging substrate 1, an electrical connector 4 is provided in a groove at the bottom of the packaging substrate 1, a sealing mechanism 3 is provided on the top of the packaging substrate 1, a heat dissipation mechanism 2 is provided on the top of the sealing mechanism 3, a heat conducting fin 5 is provided between the heat dissipation mechanism 2 and the sealing mechanism 3, a chip 7 is provided in the sealing mechanism 3, and a leakage monitoring mechanism 6 is provided on the top of the protrusion on the outer wall of the heat dissipation mechanism 2. The double-sided high-efficiency heat dissipation airtight packaging structure adopts a double-sided heat dissipation design, that is, heat dissipation mechanisms are provided on the top and bottom of the chip, which realizes rapid heat dissipation and uniform distribution of heat, and effectively improves the heat dissipation efficiency. At the same time, the airtightness and reliability of the packaging structure are ensured by the setting of the sealing mechanism and the leakage monitoring mechanism, and a good working environment and protection are provided for the electronic components. The application of the heat conducting fins further improves the heat conduction efficiency, so that the heat can be transferred to the heat dissipation mechanism more quickly, thereby improving the heat dissipation performance of the entire packaging structure. In summary, the double-sided high-efficiency heat dissipation airtight packaging structure achieves efficient heat dissipation performance and good airtightness through its unique design and component configuration, and provides a strong guarantee for the reliable operation of electronic components.

[0029] The electrical connector 4 includes evenly distributed electrical connection bumps, and the electrical connector 4 realizes electrical connection through the evenly distributed electrical connection bumps. These bumps are made of metal with good electrical conductivity and have good electrical conductivity and corrosion resistance. They realize stable electrical connection by contacting with the contact points in the processor socket. The evenly distributed electrical connection bumps can ensure that the spacing between the connection points is consistent, reduce the local concentration of current, and improve the stability and reliability of the connection.

[0030] The heat dissipation mechanism 2 includes a heat dissipation shell 201, a spiral-shaped liquid cooling flow pipe 202 is arranged inside the heat dissipation shell 201, and liquid cooling heat exchangers 203 are arranged at both ends of the liquid cooling flow pipe 202 away from the heat dissipation shell 201. Symmetrical grid brackets 204 are arranged between the inner walls of the heat dissipation shell 201, and a wind cooling motor 206 is arranged on the top of the grid bracket 204. The output end of the wind cooling motor 206 is located on the outer wall between the grid brackets 204, and a uniformly distributed wind cooling fan 205 is arranged. The heat dissipation mechanism 2 adopts a heat dissipation method that combines liquid cooling and air cooling to improve the heat dissipation efficiency. A spiral-shaped liquid cooling flow pipe 202 is arranged inside the heat dissipation shell 201, and the internal heat is taken away by the circulation of the coolant, and heat exchange is performed with an external cold source through the liquid cooling heat exchanger 203. At the same time, symmetrical grille brackets 204 are arranged between the inner walls of the heat dissipation housing 201, and air-cooling motors 206 and evenly distributed air-cooling fans 205 are arranged on the top grille bracket 204, so as to further improve the heat dissipation efficiency through air-cooling heat dissipation. This comprehensive heat dissipation method can effectively reduce the temperature of the equipment and ensure stable and reliable operation of the equipment.

[0031] Both ends of the liquid-cooled flow pipe 202 penetrate the outer wall of the heat dissipation shell 201 and extend to the outside of the heat dissipation shell 201 to be interconnected with the liquid-cooled heat exchanger 203. The liquid-cooled heat exchanger 203 is located outside the heat dissipation shell 201. The output end of the air-cooled motor 206 penetrates the top grille support 204 and is interconnected with the bottom grille support 204. There are four air-cooled fans 205, and the air-cooled fans 205 are located between two grille supports 204. The heat dissipation mechanism 2 combining liquid cooling and air cooling, through the circulation work of the liquid-cooled flow pipe 202 and the liquid-cooled heat exchanger 203, and the operation of the air-cooled motor 206 and the air-cooled fan 205, can effectively reduce the temperature of the equipment and ensure that the equipment operates in a stable and reliable environment.

[0032] The sealing mechanism 3 comprises a surrounding frame 301, a ring-shaped sealing groove 304 is formed on the top of the surrounding frame 301, fixing feet 303 are formed at the four corners of the inner wall of the surrounding frame 301, mounting ears 302 are formed on both sides of the surrounding frame 301, symmetrical clamping grooves 305 are formed on the adjacent sides of the surrounding frame 301 away from the mounting ears 302, a cover plate 306 is formed on the top of the surrounding frame 301, symmetrical clamping blocks 307 are formed on both sides of the cover plate 306 close to the clamping groove 305, and a ring-shaped sealing convex ring 308 is formed at the bottom of the cover plate 306. The sealing mechanism 3 is composed of the surrounding frame 301, the mounting ears 302, the clamping groove 305, the cover plate 306, the clamping blocks 307 and the sealing convex ring 308. The surrounding frame 301 is a main structure, fixed on the basic structure by the fixing feet 303, and connected with other components by the mounting ears 302. The cover plate 306 cooperates with the card slot 305 on the surrounding frame 301 through the card block 307 to achieve quick installation and removal. At the same time, the sealing convex ring 308 at the bottom of the cover plate 306 cooperates with the sealing groove 304 at the top of the surrounding frame 301 to form a tight sealing interface, effectively preventing the invasion of external pollutants and protecting the internal electronic components from damage. This design not only ensures the sealing performance of the sealing mechanism, but also provides a convenient maintenance and replacement method.

[0033] The chip 7 is engaged with the fixed foot 303, the cover plate 306 is mounted on the surrounding frame 301 through the mutual engagement of the block 307 and the slot 305, the sealing groove 304 and the sealing convex ring 308 are engaged with each other, and the sealing mechanism 3 is composed of the surrounding frame 301, the mounting ear 302, the slot 305, the cover plate 306, the block 307 and the sealing convex ring 308. The surrounding frame 301 is a main structure, fixed on the basic structure through the fixed foot 303, and connected with other components through the mounting ear 302. The cover plate 306 cooperates with the slot 305 on the surrounding frame 301 through the block 307 to achieve rapid installation and removal. At the same time, the sealing convex ring 308 at the bottom of the cover plate 306 cooperates with the sealing groove 304 at the top of the surrounding frame 301 to form a tight sealing interface, effectively preventing the invasion of external pollutants and protecting the internal electronic components from damage. This design not only ensures the sealing performance of the sealing mechanism, but also provides a convenient maintenance and replacement method.

[0034] The 6 includes a sealing tube 601, a pressure alarm 602 is provided on the top of the sealing tube 601, a first electrical contact 603 is provided on the top of the inner wall of the sealing tube 601, a second electrical contact 604 is provided on the top of the inner wall of the sealing tube 601, and the second electrical contact 604 is located above the first electrical contact 603, and the first electrical contact 603 and the second electrical contact 604 are connected to each other at the protrusions. The leakage monitoring mechanism 6 realizes the monitoring and alarm functions of possible leakage through the cooperation of the sealing tube 601, the pressure alarm 602, and the first electrical contact 603 and the second electrical contact 604. When the internal pressure of the sealing tube 601 is abnormal or leakage occurs, the pressure alarm 602 will sound an alarm, and the connection state between the electrical contacts will also change, triggering the monitoring device to sound an alarm. This design can effectively monitor and warn of potential leakage and ensure the safe operation of the equipment.

[0035] The method comprises the following steps: preparing the required materials; installing the surrounding frame 301 on the packaging substrate 1 by welding and screws; installing the chip 7 on the packaging substrate 1 and interconnecting it with the electrical connector 4; installing the heat dissipation mechanism 2 on the chip 7 through the cover plate 306, so that the heat-conducting fins 5 and the chip 7 are in contact with each other through the heat-conducting gel applied between them; and installing the cover plate 306 on the surrounding frame 301 by clamping the clamp block 307 and the clamp slot 305.

[0036] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A double-sided high-efficiency heat dissipation hermetic packaging structure, comprising a packaging substrate (1), Features: An electrical connector (4) is provided in the groove at the bottom of the packaging substrate (1), a sealing mechanism (3) is provided on the top of the packaging substrate (1), a heat dissipation mechanism (2) is provided on the top of the sealing mechanism (3), a heat conducting fin (5) is provided between the heat dissipation mechanism (2) and the sealing mechanism (3), a chip (7) is provided in the sealing mechanism (3), and a leakage monitoring mechanism (6) is provided on the top of the protrusion on the outer wall of the heat dissipation mechanism (2).

2. A double-sided high-efficiency heat dissipation airtight packaging structure according to claim 1, Features: The electrical connector (4) comprises evenly distributed electrical connection bumps.

3. A double-sided high-efficiency heat dissipation airtight packaging structure according to claim 1, Features: The heat dissipation mechanism (2) comprises a heat dissipation shell (201), a spiral-shaped liquid-cooling flow pipe (202) is arranged in the heat dissipation shell (201), and liquid-cooling heat exchangers (203) are arranged at two ends of the liquid-cooling flow pipe (202) away from the heat dissipation shell (201); symmetrical grille brackets (204) are arranged between opposite inner walls of the heat dissipation shell (201), and a wind-cooling motor (206) is arranged at the top of the grille bracket (204); and the output end of the wind-cooling motor (206) is located on the outer wall between the opposite grille brackets (204), and evenly distributed wind-cooling fans (205) are arranged.

4. A double-sided high-efficiency heat dissipation airtight packaging structure according to claim 3, Features: Both ends of the liquid-cooled flow pipe (202) penetrate the outer wall of the heat dissipation shell (201) and extend to the outside of the heat dissipation shell (201) to be interconnected with the liquid-cooled heat exchanger (203); the liquid-cooled heat exchanger (203) is located outside the heat dissipation shell (201); the output end of the air-cooled motor (206) penetrates the top grille support (204) and is connected to the bottom grille support (204); there are four air-cooled fans (205), and the air-cooled fans (205) are all located between two grille supports (204) opposite to each other.

5. The double-sided high-efficiency heat dissipation airtight packaging structure according to claim 1, Features: The sealing mechanism (3) comprises a surrounding frame (301), an annular sealing groove (304) is provided at the top of the surrounding frame (301), fixing feet (303) are provided at four corners of the inner wall of the surrounding frame (301), mounting ears (302) are provided on both sides of the surrounding frame (301), symmetrical clamping grooves (305) are provided on adjacent sides of the surrounding frame (301) away from the mounting ears (302), a cover plate (306) is provided at the top of the surrounding frame (301), symmetrical clamping blocks (307) are provided on both sides of the cover plate (306) close to the clamping grooves (305), and an annular sealing convex ring (308) is provided at the bottom of the cover plate (306).

6. A double-sided high-efficiency heat dissipation airtight packaging structure according to claim 5, Features: The chip (7) is engaged with the fixing foot (303), the cover plate (306) is mounted on the surrounding frame (301) through the mutual engagement of the engagement block (307) and the engagement groove (305), and the sealing groove (304) and the sealing convex ring (308) are engaged with each other.

7. A double-sided high-efficiency heat dissipation airtight packaging structure according to claim 1, Features: The (6) comprises a sealed tube (601), a pressure alarm (602) is provided at the top of the sealed tube (601), a first electrical contact (603) is provided at the top of the inner wall of the sealed tube (601), a second electrical contact (604) is provided at the top of the inner wall of the sealed tube (601), and the second electrical contact (604) is located above the first electrical contact (603), and the first electrical contact (603) and the second electrical contact (604) are connected to each other at their protrusions.

8. A method for preparing a double-sided high-efficiency heat dissipation airtight packaging structure according to any one of claims 1 to 6, It is characterized in that The method comprises the following steps: preparing required materials; installing a surrounding frame (301) on a packaging substrate (1) by welding and screws; installing a chip (7) on the packaging substrate (1) and interconnecting the chip (7) with an electrical connector (4); installing a heat dissipation mechanism (2) on the chip (7) through a cover plate (306), so that the heat conducting fins (5) and the chip (7) are in contact with each other through a heat conducting gel applied therebetween; and installing the cover plate (306) on the surrounding frame (301) by clamping it with a clamp block (307) and a clamping slot (305).

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