Temperature measurement protection socket for integrated circuit

Abstract

The invention provides an integrated circuit temperature measurement protection socket which comprises the steps that a shell is installed on a circuit board of an integrated circuit, heat of components is transmitted through a heat conduction assembly, and a temperature detection device detects the heat transmitted by the heat conduction assembly and generates a temperature detection signal. The control device receives the temperature detection signal and judges the magnitude of the current temperature and the set temperature of the component; when the component temperature is higher than the set temperature, the control device cuts off the power supply of the integrated circuit. Through the closed-loop control mode, the temperature of the component can be monitored in real time, and when the temperature is too high, the power supply is cut off to ensure the safety of the whole integrated circuit. According to the mode of externally installing the socket, the area of a component is not increased, and the complexity of an integrated circuit is not obviously increased.

Description

Technical Field

[0001] The present invention generally relates to the technical field of integrated circuits, and in particular to an integrated circuit temperature measurement protection socket. Background Art

[0002] With the development of integrated circuits and advanced packaging technology, the integration of integrated circuits is getting higher and higher. Since components generate heat when working, the heat per unit area of ​​the package rises rapidly, making the heating problem of integrated circuits in high-speed computing systems increasingly prominent, seriously affecting the improvement of computing speed and circuit safety.

[0003] The existing solution is to monitor the temperature of components only by adding sensors. This method does not have a closed-loop control method that makes corresponding adjustments based on the temperature. Therefore, only the current temperature of the component can be known. When the temperature is too high, no corresponding control can be made to eliminate the impact of high temperature. Moreover, adding temperature sensors to components will also cause the component area to be too large, the circuit design to be too complicated, and safety to be difficult to ensure. Summary of the invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide an integrated circuit temperature measurement protection socket.

[0005] The present invention provides an integrated circuit temperature measurement protection socket, comprising:

[0006] A housing, wherein the housing is detachably mounted on components of the integrated circuit;

[0007] A heat-conducting component, which is mounted on the housing and is used to abut against components in the integrated circuit;

[0008] A temperature detection device, which is mounted on the housing and is used to detect the temperature of the heat-conducting component and obtain a temperature detection signal;

[0009] A control device is installed on the housing and is electrically connected to the temperature detection device and the integrated circuit. The control device is used to receive the temperature detection signal and cut off the power supply of the integrated circuit when it is determined that the temperature of the component is greater than or equal to the set temperature according to the temperature detection signal.

[0010] According to the technical solution provided by the present invention, the heat conduction component includes:

[0011] A connecting piece, the connecting piece is fixedly mounted on the housing;

[0012] A plurality of heat-conducting needles are fixedly mounted on the connecting piece and are arranged perpendicular to the connecting piece; one end of the heat-conducting needle passes through the connecting piece and the shell in sequence and abuts against the component, and the other end abuts against the temperature detection device.

[0013] According to the technical solution provided by the present invention, the plurality of heat-conducting needles are evenly distributed along the surface of the connecting member.

[0014] According to the technical solution provided by the present invention, the housing comprises:

[0015] A first housing, wherein the first housing is detachably mounted on the components of the integrated circuit, and the heat conducting component is fixedly mounted on the first housing;

[0016] A second shell, the second shell is rotatably mounted on an edge of one side of the first shell, and the temperature detection device and the control device are both fixedly mounted on the second shell;

[0017] The second housing has a first state and a second state;

[0018] When in the first state, the second shell is engaged with the edge of the other side of the first shell, so that the temperature detection device abuts against the heat conduction component;

[0019] When in the second state, the second shell is separated from the edge of the other side of the first shell, so that the temperature detection device is separated from the heat conduction component.

[0020] According to the technical solution provided by the present invention, the housing further includes:

[0021] A buckle assembly is installed on the second shell and is used to be snapped with the first shell when the second shell is in the first state to fix the relative position of the first shell and the second shell.

[0022] According to the technical solution provided by the present invention, the first shell has a clamping protrusion;

[0023] The buckle assembly comprises:

[0024] A clamping member, the clamping member being rotatably mounted on the second housing;

[0025] An elastic member, one end of which is fixedly connected to the second shell, and the other end of which is fixedly connected to the clamping member.

[0026] According to the technical solution provided by the present invention, the temperature detection device includes:

[0027] A plurality of temperature sensors are installed on the shell and are respectively used to detect the temperatures of the plurality of heat-conducting components to obtain the temperature detection signals.

[0028] According to the technical solution provided by the present invention, the control device includes:

[0029] an analog-to-digital conversion module, the analog-to-digital conversion module being mounted on the housing and electrically connected to the temperature sensor, for receiving the temperature detection signal and converting the temperature detection signal from an analog signal to a digital signal to obtain a temperature signal;

[0030] A data processing module, the data processing module is used to receive the temperature signal and determine the size of the temperature of the component and the set temperature according to the temperature signal;

[0031] When the temperature of the component is greater than or equal to a set temperature, the data processing module is further used to cut off the power supply of the integrated circuit.

[0032] The beneficial effects of the present invention are:

[0033] Design an integrated circuit temperature measurement protection socket, install the shell on the circuit board of the integrated circuit, use the heat conducting component to transfer the heat of the components, the temperature detection device detects the heat transferred by the heat conducting component, and generates a temperature detection signal. The control device receives the temperature detection signal and determines the size of the current temperature of the component and the set temperature; when the temperature of the component is greater than the set temperature, the control device cuts off the power supply of the integrated circuit. Through the above closed-loop control method, the temperature of the components can be monitored in real time. When the temperature is too high, the power supply is cut off to ensure the safety of the entire integrated circuit. This external installation socket method will not increase the area of ​​the components and will not significantly increase the complexity of the integrated circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0035] Figure 1 It is a structural schematic diagram of an integrated circuit temperature measurement protection socket;

[0036] Figure 2 is a cross-sectional view of a buckle assembly;

[0037] Figure 3 This is a schematic diagram of the circuit connection relationship of the integrated circuit temperature measurement protection socket;

[0038] Among them: 1. Shell; 2. Heat-conducting component; 3. Connector; 4. Heat-conducting needle; 5. Buckle assembly; 6. Snap-on protrusion; 7. Snap-on component; 8. Elastic component; 9. Temperature sensor; 10. Control device; 11. First shell; 12. Second shell; 13. Support protrusion. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0040] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0041] Please refer to Figure 1 The present invention provides an integrated circuit temperature measurement protection socket, comprising:

[0042] A housing 1, wherein the housing 1 can be detachably mounted on components of the integrated circuit;

[0043] A heat-conducting component 2, wherein the heat-conducting component 2 is mounted on the housing 1 and is used to abut against components in the integrated circuit;

[0044] A temperature detection device, which is installed on the housing 1 and is used to detect the temperature of the heat-conducting component 2 to obtain a temperature detection signal;

[0045] The control device 10 is installed on the housing 1 and is electrically connected to the temperature detection device and the integrated circuit. The control device 10 is used to receive the temperature detection signal and cut off the power supply of the integrated circuit when it is determined that the temperature of the component is greater than or equal to the set temperature according to the temperature detection signal.

[0046] Specifically, the set temperature is 125 degrees Celsius, and can also be set according to the maximum temperature that the components can actually withstand. Different components have different corresponding set temperatures.

[0047] The work process includes:

[0048] The temperature detection device detects the heat transferred by the heat-conducting component 2 and generates a temperature detection signal;

[0049] The control device 10 receives the temperature detection signal, obtains a first voltage value of the temperature detection signal, and determines the magnitude of the first voltage value and a set voltage value corresponding to the set temperature;

[0050] The voltage value is proportional to the temperature, so the higher the temperature, the higher the voltage value;

[0051] When the first voltage value is less than or equal to the set voltage value, continue to use the temperature detection device to detect the temperature of the component;

[0052] When the first voltage value is greater than the set voltage value, it means that the temperature of the component is greater than the set temperature, and the control device 10 cuts off the power supply of the integrated circuit to avoid damage to the integrated circuit, thereby completing the closed loop of control.

[0053] Through the above closed-loop control method, the temperature of components can be monitored in real time. When the temperature is too high, the power supply is cut off to ensure the safety of the entire integrated circuit. This external socket installation method will not increase the area of ​​components and will not significantly increase the complexity of the integrated circuit.

[0054] In some implementations, the integrated circuit temperature measurement protection socket can be installed on all components that are prone to heat on the entire integrated circuit. The temperature of each component during normal operation is different, so the set temperature of the integrated circuit temperature measurement protection socket connected to it is also different.

[0055] When a component exceeds the corresponding set temperature, the control device 10 cuts off the power supply of the entire integrated circuit to avoid damage.

[0056] Furthermore, the heat conducting component 2 comprises:

[0057] A connecting member 3, wherein the connecting member 3 is fixedly mounted on the housing 1;

[0058] A plurality of heat-conducting needles 4 are fixedly mounted on the connecting member 3 and are arranged perpendicular to the connecting member 3; one end of the heat-conducting needle 4 passes through the connecting member 3 and the shell 1 in sequence and abuts against the component, and the other end abuts against the temperature detection device.

[0059] Furthermore, the plurality of heat-conducting needles 4 are evenly distributed along the surface of the connecting member 3. Since the connecting member 3 is set to face the component, the plurality of heat-conducting needles 4 are evenly distributed along the surface of the component.

[0060] Furthermore, the temperature detection device comprises:

[0061] A plurality of temperature sensors 9 are installed on the housing 1 and are used to detect the temperatures of the plurality of heat-conducting components 2 to obtain the temperature detection signals.

[0062] Specifically, refer to Figure 2The multiple temperature sensors 9 are respectively in contact with the multiple heat-conducting needles 4. Since the multiple heat-conducting needles 4 are evenly distributed along the surface of the component, the multiple temperature sensors 9 can detect the temperature of different parts of the component to improve the detection accuracy.

[0063] By using the heat conducting needle 4 to transfer temperature, the temperature sensor 9 can be slightly away from the component when detecting the temperature of the corresponding part of the component, so as to avoid the temperature of other parts of the component affecting the detected temperature of the current part, thereby reducing interference and improving the accuracy of detection.

[0064] The temperature signals detected by the multiple temperature sensors 9 are synthesized to obtain a final temperature detection signal. This approach can reduce the impact of errors, improve monitoring accuracy, and reduce misjudgment.

[0065] Furthermore, the housing 1 comprises:

[0066] A first housing 11, wherein the first housing 11 is detachably mounted on components of the integrated circuit, and the heat conducting component 2 is fixedly mounted on the first housing 11;

[0067] A second shell 12, the second shell 12 is rotatably mounted on an edge of one side of the first shell 11, and the temperature detection device and the control device 10 are both fixedly mounted on the second shell 12;

[0068] The second housing 12 has a first state and a second state;

[0069] When in the first state, the second shell 12 is engaged with the edge of the other side of the first shell 11 so that the temperature detection device abuts against the heat conducting component 2;

[0070] When in the second state, the second shell 12 is separated from the edge of the other side of the first shell 11 , so that the temperature detection device is separated from the heat-conducting component 2 .

[0071] Specifically, the two shells that can rotate relative to each other are provided to facilitate the experimenter to replace the heat conducting component 2 and the sensor. In some cases, it is not necessary to detect the temperature of the components, and the second shell 12 can be placed in the second state.

[0072] Furthermore, the housing further comprises:

[0073] The buckle assembly 5 is installed on the second shell 12 and is used for being engaged with the first shell 11 when the second shell 12 is in the first state, so as to fix the relative position of the first shell 11 and the second shell 12.

[0074] Furthermore, the first housing 11 has a snap-fit ​​protrusion 6;

[0075] The buckle assembly 5 comprises:

[0076] A clamping member 7, wherein the clamping member 7 is rotatably mounted on the second housing 12;

[0077] An elastic member 8 , one end of which is fixedly connected to the second shell 12 , and the other end of which is fixedly connected to the clamping member 7 , is used to drive the clamping member 7 and the clamping protrusion 6 to be clamped to each other.

[0078] Specifically, the buckle assembly 5 can stably fix the relative positions of the two shells, and can ensure that heat can be directly transferred to the sensor during the detection process to avoid missed detection.

[0079] The card connection process includes:

[0080] The clamping member 7 with a clamping hook abuts against the clamping protrusion 6, so that the clamping member 7 rotates positively relative to the second housing 12 and compresses the elastic member 8; in this embodiment, the elastic member 8 is a spring;

[0081] The hook passes over the clamping protrusion 6, and then drives the clamping member 7 with the hook to rotate in the opposite direction relative to the second housing 12 through the elastic member 8 to restore the initial state;

[0082] The inner side wall of the hook abuts against the engaging protrusion 6, indicating that the engaging is completed.

[0083] In some embodiments, the end surface of the second shell 12 on which the clamping member 7 is mounted and which is away from the elastic member 8 further has a supporting protrusion 13 for supporting the clamping member 7 so that it is parallel to the end surface of the second shell 12 .

[0084] Furthermore, the control device 10 comprises:

[0085] an analog-to-digital conversion module, the analog-to-digital conversion module being mounted on the housing 1 and electrically connected to the temperature sensor 9, for receiving the temperature detection signal and converting the temperature detection signal from an analog signal to a digital signal to obtain a temperature signal;

[0086] A data processing module, the data processing module is used to receive the temperature signal and determine the size of the temperature of the component and the set temperature according to the temperature signal;

[0087] When the temperature of the component is greater than or equal to a set temperature, the data processing module is further used to cut off the power supply of the integrated circuit.

[0088] Specifically, refer to Figure 3The temperature detection device detects the heat transferred by the heat-conducting component 2, and after generating a temperature detection signal, it is transmitted to the analog-to-digital conversion module to convert the analog signal into a digital signal, thereby improving the anti-interference ability of the signal and further improving the accuracy of the detection.

[0089] Then the data processing module receives the temperature signal converted into a digital signal, obtains the first voltage value corresponding thereto, and determines the magnitude of the first voltage value and the set voltage value corresponding to the set temperature (implemented by an internal comparison circuit);

[0090] Since the voltage value is proportional to the temperature, when the first voltage value is greater than the set voltage value, it means that the temperature of the component is greater than the set temperature, and the normally closed switch connected to the data processing module is controlled to cut off the power supply of the integrated circuit. This method can avoid damage to the integrated circuit and complete the closed loop of control.

[0091] The above description is only a preferred embodiment of the present invention and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present invention is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in the present invention (but not limited to) to form a technical solution.

Claims

1. An integrated circuit temperature measurement protection socket, characterized in that: include: A housing (1), wherein the housing (1) is detachably mounted on components of an integrated circuit; A heat-conducting component (2), the heat-conducting component (2) being mounted on the housing (1) and being used for abutting against components in the integrated circuit; A temperature detection device, the temperature detection device being mounted on the housing (1) and being used to detect the temperature of the heat-conducting component (2) to obtain a temperature detection signal; A control device (10) is mounted on the housing (1) and is electrically connected to the temperature detection device and the integrated circuit, and is used to receive the temperature detection signal and cut off the power supply of the integrated circuit when it is determined according to the temperature detection signal that the temperature of the component is greater than or equal to a set temperature.

2. The integrated circuit temperature measurement protection socket according to claim 1, characterized in that: The heat conducting component (2) comprises: A connecting member (3), wherein the connecting member (3) is fixedly mounted on the housing (1); A plurality of heat-conducting needles (4), each of which is fixedly mounted on the connecting member (3) and arranged perpendicular to the connecting member (3); one end of the heat-conducting needle (4) sequentially passes through the connecting member (3) and the housing (1) to abut against the component, and the other end of the heat-conducting needle (4) abuts against the temperature detection device.

3. The integrated circuit temperature measurement protection socket according to claim 2, characterized in that: The plurality of heat-conducting needles (4) are evenly distributed along the surface of the connecting member (3).

4. The integrated circuit temperature measurement protection socket according to claim 1, characterized in that: The housing (1) comprises: A first housing (11), wherein the first housing (11) is detachably mounted on components of the integrated circuit, and the heat conducting component (2) is fixedly mounted on the first housing (11); a second shell (12), the second shell (12) being rotatably mounted on an edge of one side of the first shell (11), the temperature detection device and the control device (10) both being fixedly mounted on the second shell (12); The second shell (12) has a first state and a second state; When in the first state, the second shell (12) is engaged with the edge of the other side of the first shell (11) so that the temperature detection device abuts against the heat-conducting component (2); When in the second state, the second shell (12) is separated from the edge of the other side of the first shell (11), so that the temperature detection device is separated from the heat conduction component (2).

5. The integrated circuit temperature measurement protection socket according to claim 4, characterized in that: The housing further comprises: A buckle assembly (5), the buckle assembly (5) being mounted on the second shell (12) and being used for buckling with the first shell (11) when the second shell (12) is in the first state, so as to fix the relative position of the first shell (11) and the second shell (12).

6. The integrated circuit temperature measurement protection socket according to claim 5, characterized in that: The first housing (11) is provided with a clamping protrusion (6); The buckle assembly (5) comprises: A clamping member (7), wherein the clamping member (7) is rotatably mounted on the second shell (12); An elastic member (8), one end of the elastic member (8) is fixedly connected to the second shell (12), and the other end of the elastic member (8) is fixedly connected to the clamping member (7).

7. The integrated circuit temperature measurement protection socket according to claim 1, characterized in that: The temperature detection device comprises: A plurality of temperature sensors (9) are installed on the housing (1) and are used to detect the temperatures of the plurality of heat-conducting components (2) respectively to obtain the temperature detection signals.

8. The integrated circuit temperature measurement protection socket according to claim 1, characterized in that: The control device (10) comprises: an analog-to-digital conversion module, the analog-to-digital conversion module being mounted on the housing (1) and electrically connected to the temperature sensor (9), and being used to receive the temperature detection signal and convert the temperature detection signal from an analog signal into a digital signal to obtain a temperature signal; A data processing module, the data processing module is used to receive the temperature signal and determine the size of the temperature of the component and the set temperature according to the temperature signal; When the temperature of the component is greater than or equal to a set temperature, the data processing module is further used to cut off the power supply of the integrated circuit.

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