Etching device for circuit board surface processing and use method thereof

Abstract

The invention relates to the technical field of circuit board etching, and particularly discloses an etching device for circuit board surface processing and a use method thereof, the etching device comprises a machine body, and further comprises a clamping mechanism arranged in the machine body and used for clamping a circuit board; the conveying mechanism is arranged at one side of the machine body and is used for feeding the circuit board; through the arrangement of the clamping mechanism, a circuit board can be rapidly clamped, through the cooperative control of a first rack and a driving gear, the circuit board can be clamped through a flexible clamping jaw while moving, the circuit board does not need to be fixed manually, and through the arrangement of a second rack, clamping of the flexible clamping jaw can be relieved, so that the clamping efficiency is improved. Compared with the prior art, the clamping mechanism has the advantages that the circuit board can be effectively protected by the aid of the characteristics of the flexible clamping jaws, the circuit boards with different thicknesses can be clamped, and the applicability of the clamping mechanism is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board etching, in particular to an etching device for circuit board surface processing and a use method thereof. Background Art

[0002] Circuit boards are a common type of electronic component in daily life. They usually require multiple processing steps before they are put into use. Etching is a relatively important step. First, a layer of lead-tin anti-corrosion layer is pre-plated on the copper foil part of the outer layer of the board that needs to be retained, that is, the graphic part of the circuit. Then, the remaining copper foil is corroded chemically. This process is called etching.

[0003] The announcement number CN115767930B discloses a circuit board double-sided etching device and etching method thereof, comprising an etching box, a first motor is fixed to the outside of the etching box through a first mounting plate, the output shaft end of the first motor passes through the etching box and extends to the inside of the etching box, and a clamping mechanism is arranged, the clamping mechanism is used to fix the circuit board parallel to the inside of the etching box, and the first motor is used to flip the clamping mechanism 180 degrees. This device is provided with a cleaning mechanism, the cleaning mechanism first moves upward for a distance and then contacts the bottom surface of the circuit board, and at the same time the cleaning mechanism will rotate to clean the bottom of the circuit board, during which the cleaning mechanism will also move back and forth left and right, so that the cleaning mechanism cleans different parts of the circuit board, which is conducive to comprehensive cleaning of the gelatinous plate aggregates at the bottom of the circuit board.

[0004] In the prior art, the above-mentioned device clamps the circuit board through a clamping mechanism, and then performs etching. After the etching, the clamping mechanism is rotated to clean the circuit board using a cleaning mechanism. However, it is found in use that the circuit board is installed by manually placing it in the clamping mechanism, and it needs to be fixed after placement, and etching can only be performed after fixation. After the etching work is completed, the circuit board needs to be taken down and a new circuit board needs to be replaced. This undoubtedly increases the work steps and the workload of the workers. Etching in groups reduces work efficiency and cannot meet the needs of large-scale circuit board etching work. Summary of the invention

[0005] The purpose of the present invention is to provide an etching device for circuit board surface processing and a method of using the same to solve the following technical problems: (1) How to improve the efficiency of circuit board etching; (2) How to meet the needs of large-scale etching work.

[0006] The purpose of the present invention can be achieved through the following technical solutions: An etching device for processing the surface of a circuit board comprises a body and also comprises: A clamping mechanism, arranged in the body, for clamping the circuit board; The conveying mechanism is arranged on one side of the machine body and is used for loading the circuit board; The etching mechanism is arranged in the middle of the machine body and is used for etching the circuit board; The cleaning mechanism is arranged on the side corresponding to the conveying mechanism and is used for unloading and cleaning the circuit board; A movable screw rod is arranged on the top of the machine body and is used to drive the clamping mechanism to move; The curved slide rail is arranged below the moving lead screw and is used to drive the clamping mechanism to move to the etching mechanism for etching work.

[0007] Further, the clamping mechanism includes a moving block; the moving block is threadedly connected to the moving screw rod; the side wall of the moving block is fixedly connected to a telescopic column; the end of the telescopic column away from the moving block is fixedly connected to a slider; the bottom of the slider is fixedly connected to a connecting shaft; the end of the connecting shaft away from the slider is rotatably connected to a driving gear; the end of the driving gear away from the connecting shaft is rotatably connected to a fixed column; the end of the fixed column away from the driving gear is fixedly connected to a lifting warehouse; a driving shaft is arranged in the fixed column; the driving shaft is fixedly connected to the driving gear; the lifting warehouse is rotatably connected to a lifting screw rod; the end of the driving shaft away from the driving gear is fixedly connected to the lifting screw rod; A lifting block is threadedly connected to the lifting screw rod; a compression column is fixedly connected to the side wall of the lifting block; a sealing warehouse is fixedly connected to the end of the lifting warehouse away from the fixed column; a compression warehouse is fixedly connected to the sealing warehouse; the end of the compression warehouse away from the sealing warehouse is slidably connected to the compression column; a sealing gasket is fixedly connected to the end of the compression column away from the lifting block; the sealing gasket is arranged in the compression warehouse; a flexible clamp is fixedly connected to the end of the sealing warehouse away from the compression warehouse; the flexible clamp is inflatable; a first rack is fixedly connected to the side wall of the body; a second rack is fixedly connected to the side of the body away from the first rack; the driving gear is movably engaged with the first rack and the second rack.

[0008] Furthermore, the etching mechanism includes an etching chamber; the etching chamber is arranged in the middle of the machine body and is fixedly connected to the machine body; a pulley is rotatably connected to the middle of the slider; the slider and the pulley are arranged below the curved slide rail and abut against the bottom of the curved slide rail; the moving block is arranged above the curved slide rail.

[0009] Furthermore, the bottom side wall of the etching chamber is rotatably connected to a stirring shaft; the stirring shaft is provided with multiple groups; a stirring plate is fixedly connected to the stirring shaft; the outer wall of the etching chamber is rotatably connected to a driven shaft; the driven shaft is provided with multiple groups; the output end of the driven shaft is fixedly connected to the input end of the stirring shaft; a connecting rack is sleeved on the driven shaft; a connecting column is fixedly connected to the side wall of the sealing chamber; the end of the connecting column away from the sealing chamber is fixedly connected to a driven rack; the driven rack is movably engaged with the connecting rack.

[0010] Furthermore, the conveying mechanism includes a conveying platform; the conveying platform is arranged below the first rack; and a conveying clamp is arranged inside the conveying platform.

[0011] Furthermore, the cleaning mechanism includes a cleaning bin; a fixed bin is fixedly connected to the bottom of the cleaning bin; a telescopic spring is fixedly connected inside the fixed bin; a fixed block is fixedly connected to one end of the telescopic spring away from the fixed bin; the fixed block is slidably connected inside the fixed bin; second sponge strips are clamped on the side walls on both sides of the cleaning bin; and a first sponge strip is clamped on the top of the cleaning bin.

[0012] Furthermore, a discharge pipe is fixedly connected to the bottom of the machine body; a valve is fixedly connected to the discharge pipe; a main motor is fixedly connected to the side wall of the machine body; and the movable screw rod and the conveying platform are electrically connected to the main motor.

[0013] A method for using an etching device for processing a circuit board surface comprises the following steps: S1, first, the circuit board is transported to the bottom of the clamping mechanism through the conveying clamp in the conveying mechanism, and then the movable screw is driven to rotate to drive the clamping mechanism to move to the top of the circuit board. While moving, the circuit board is clamped by the flexible clamping claw, and the clamping mechanism is continuously moved after being clamped. The clamping mechanism is moved to the top of the etching chamber by the setting of the curved slide rail, so that the circuit board is immersed in the etching chamber for etching. After the immersion is completed, the movable screw is driven to rotate to move the clamping mechanism to the top of the cleaning chamber, and then the flexible clamping claw cancels the clamping of the circuit board, and the circuit board will fall into the cleaning chamber and wait for collection by the staff after cleaning; S2, while moving, using a driven rack and other structures to stir the etching chamber so that the etching liquid is fully in contact with the circuit board; S3, at the same time, the etching liquid remaining on the circuit board is absorbed by the first sponge bar and the second sponge bar in the cleaning chamber to avoid the etching liquid remaining on the circuit board and affecting subsequent operations.

[0014] Beneficial effects of the present invention: (1) The present invention can quickly clamp the circuit board by setting the clamping mechanism, and can use the flexible clamping claw to clamp the circuit board while moving through the coordinated control of the first rack and the driving gear, without the need for manual fixation of the circuit board, and can release the clamping of the flexible clamping claw by setting the second rack, without the need for staff to disassemble it, further improving the efficiency, and using the characteristics of the flexible clamping claw to effectively protect the circuit board, while being able to clamp circuit boards of different thicknesses, thereby improving the applicability of the clamping mechanism.

[0015] (2) When the clamping mechanism in the present invention moves, the clamping mechanism will descend to the top of the etching chamber under the action of the curved slide rail. When the clamping mechanism reaches the top of the etching chamber, the driven rack arranged on its side will mesh with the connecting rack on the side wall of the etching chamber. After the connection, the clamping mechanism will be continuously driven to move, which will drive the connecting rack to move. When moving, it will drive the driven shaft to rotate, thereby driving the stirring shaft in the etching chamber to rotate, thereby stirring the etching liquid and making the etching liquid fully contact with the circuit board.

[0016] (3) The present invention can absorb the etching liquid on the circuit board through the first sponge bar in the cleaning chamber, and at the same time clamp the circuit board through the fixed block. While clamping, the second sponge bar is used to absorb the residual etching liquid on the circuit board, thereby achieving the effect of cleaning the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below in conjunction with the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the machine body in the present invention; Figure 2 It is a schematic diagram of the overall structure of the conveying mechanism in the present invention; Figure 3 It is a schematic diagram of the overall structure of the discharge pipe in the present invention; Figure 4 It is a cross-sectional view of the overall structure of the machine body in the present invention; Figure 5 It is a schematic diagram of the overall structure of the clamping mechanism in the present invention; Figure 6 is a cross-sectional view of the overall structure of the clamping mechanism of the present invention; Figure 7 yes Figure 6 The enlarged view of point A in the middle; Figure 8 It is a schematic diagram of the overall structure of the etching chamber in the present invention; Fig. 9 is a cross-sectional view of the overall structure of the etching chamber in the present invention; Fig.10 It is a schematic diagram of the overall structure of the cleaning bin in the present invention; Fig.11 It is a sectional view of the overall structure of the cleaning bin in the present invention.

[0019] Description of the drawings: 1. Machine body; 11. Moving screw rod; 12. Main motor; 13. Curved slide rail; 14. First rack; 15. Second rack; 2. Clamping mechanism; 21. Moving block; 211. Telescopic column; 22. Sliding block; 221. Pulley; 23. Connecting shaft; 24. Driving gear; 25. Fixed column; 251. Driving shaft; 26. Lifting bin; 27. Lifting screw rod; 271. Lifting block; 28. Compression column; 281. Compression bin; 282. Sealing pad; 29 , sealing chamber; 291, flexible clamp; 292, connecting column; 293, driven rack; 3, conveying mechanism; 31, conveying platform; 32, conveying splint; 4, etching mechanism; 41, etching chamber; 42, stirring shaft; 43, stirring plate; 44, driven shaft; 45, connecting rack; 46, discharge pipe; 47, valve; 5, cleaning mechanism; 51, cleaning chamber; 52, first sponge bar; 53, second sponge bar; 54, fixed chamber; 55, telescopic spring; 56, fixed block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1-Figure 11 As shown, the present application provides an etching device for circuit board surface processing, including a body 1, and also including: A clamping mechanism 2, disposed in the body 1, for clamping the circuit board; A conveying mechanism 3, which is arranged on the machine body 1 and is used for loading the circuit board; The etching mechanism 4 is arranged in the middle of the body 1 and performs the etching work of the circuit board; A cleaning mechanism 5 is provided on a side corresponding to the conveying mechanism 3 and is used for unloading and cleaning the circuit board; A movable screw rod 11 is arranged on the top of the machine body 1 and is used to drive the clamping mechanism 2 to move; The curved slide rail 13 is arranged below the moving screw rod 11 and is used to drive the clamping mechanism 2 to move to the etching mechanism 4 to perform etching work; During operation, in the prior art, the above device clamps the circuit board through the clamping mechanism 2, and then performs etching. After the etching, the clamping mechanism 2 is rotated to clean the circuit board using the cleaning mechanism. However, it is found in use that the circuit board is installed by manually placing it in the clamping mechanism 2, and it needs to be fixed after placement, and the etching work can be performed after it is fixed. After the etching work is completed, the circuit board needs to be taken down and a new circuit board is placed again, which undoubtedly increases the working steps and the workload of the workers. Etching in groups reduces the working efficiency and cannot meet the needs of large quantities of circuit boards. In order to prevent such incidents from happening during the circuit board etching work, first, the circuit board is placed in the conveying mechanism 3, and the circuit board is conveyed to the bottom of the clamping mechanism 2 by the conveying mechanism 3, and then the circuit board is clamped by the clamping mechanism 2, and then the screw rod 11 is moved to drive the clamping mechanism 2 to move, and during the movement, the clamping mechanism 2 is guided by the curved slide rail 13 to reach the etching mechanism 4 and perform the etching work. After the work is completed, the clamping mechanism 2 reaches the cleaning mechanism 5 for unloading, and the circuit boards are cleaned and collected by the staff, and then the clamping mechanism 2 returns to the top of the conveying mechanism 3 to perform the etching work of the next group of circuit boards.

[0022] like Figure 4-Figure 7As shown, the clamping mechanism 2 includes a moving block 21; the moving block 21 is threadedly connected to the moving screw rod 11; the side wall of the moving block 21 is fixedly connected to a telescopic column 211; the end of the telescopic column 211 away from the moving block 21 is fixedly connected to a slider 22; the bottom of the slider 22 is fixedly connected to a connecting shaft 23; the end of the connecting shaft 23 away from the slider 22 is rotatably connected to a driving gear 24; the end of the driving gear 24 away from the connecting shaft 23 is rotatably connected to a fixed column 25; the end of the fixed column 25 away from the driving gear 24 is fixedly connected to a lifting warehouse 26; a driving shaft 251 is arranged in the fixed column 25; the driving shaft 251 is fixedly connected to the driving gear 24; the lifting warehouse 26 is rotatably connected to a lifting screw rod 27; the end of the driving shaft 251 away from the driving gear 24 is fixedly connected to the lifting screw rod 27; A lifting block 271 is threadedly connected to the lowering rod 27; a compression column 28 is fixedly connected to the side wall of the lifting block 271; a sealing bin 29 is fixedly connected to the end of the lifting bin 26 away from the fixed column 25; a compression bin 281 is fixedly connected to the sealing bin 29; an end of the compression bin 281 away from the sealing bin 29 is slidably connected to the compression column 28; an end of the compression column 28 away from the lifting block 271 is fixedly connected to a sealing gasket 282; the sealing gasket 282 is arranged in the compression bin 281; an end of the sealing bin 29 away from the compression bin 281 is fixedly connected to a flexible clamp 291; the flexible clamp 291 is inflatable; a first rack 14 is fixedly connected to the side wall of the body 1; a second rack 15 is fixedly connected to the side of the body 1 away from the first rack 14; the driving gear 24 is movably meshed with the first rack 14 and the second rack 15; During operation, after the circuit board is transported to the bottom of the clamping mechanism 2 by the conveying mechanism 3, the movable screw 11 is first driven to rotate. When rotating, the movable screw 11 drives the clamping mechanism 2 to move toward the etching mechanism 4 and the cleaning mechanism 5. When the clamping mechanism 2 is in the initial state, the driving gear 24 in the clamping mechanism 2 is meshed and connected with the first rack 14. While moving, the first rack 14 is used to drive the driving gear 24 to rotate. When rotating, the driving gear 24 will drive the lifting screw 27 in the lifting bin 26 to rotate through the driving shaft 251. When rotating, the lifting screw 27 will drive the lifting block 271 to descend. When the lifting block 271 descends, the compression column 28 is used to pump air into the compression chamber 281 and the sealing chamber 29, and the air is squeezed into the flexible clamping claw 291, so that the flexible clamping claw 291 changes its shape to clamp the circuit board, and the gasket 282 can prevent gas leakage. The flexible clamping claw 291 is in a tilted state when not inflated. After inflating, the flexible clamping claw 291 bends at the same time to clamp the circuit board, and the distance moved by the driving gear 24 on the first rack 14 is consistent with the distance the flexible clamping claw 291 reaches above the circuit board. At the same time, the moving distance can control the compression column 28 to push the gas The gas in the flexible clamping jaw 291 is completely filled. After the circuit board is clamped, the clamping mechanism 2 is driven to the etching mechanism 4 to perform etching on the circuit board. After the etching is completed, the clamping mechanism 2 is driven to the other end of the machine body 1, that is, the cleaning mechanism 5. When the clamping mechanism 2 moves, it will be meshed and connected with the second rack 15, and the lifting screw 27 will be driven to rotate again through the second rack 15. This rotation will drive the lifting block 271 to rise, thereby releasing the gas in the flexible clamping jaw 291, so that the flexible clamping jaw 291 loses its grip on the circuit board, thereby unloading the circuit board and cleaning it. By setting the clamping mechanism 2, the circuit board can be clamped quickly, and by the coordinated control of the first rack 14 and the driving gear 24, the circuit board can be clamped by the flexible clamping claw 291 while moving, without the need for manual fixation of the circuit board, and by setting the second rack 15, the clamping of the flexible clamping claw 291 can be released, without the need for staff to disassemble it, further improving the efficiency, and by utilizing the characteristics of the flexible clamping claw 291, the circuit board can be effectively protected, and at the same time, circuit boards of different thicknesses can be clamped, thereby improving the applicability of the clamping mechanism 2.

[0023] like Figure 2 and Figure 6 As shown, the etching mechanism 4 includes an etching chamber 41; the etching chamber 41 is arranged in the middle of the machine body 1 and is fixedly connected to the machine body 1; the middle of the slider 22 is rotatably connected with a pulley 221; the slider 22 and the pulley 221 are arranged below the curved slide rail 13 and abut against the bottom of the curved slide rail 13; the moving block 21 is arranged above the curved slide rail 13; During operation, the pulley 221 on the slider 22 abuts against the bottom of the curved slide rail 13 and is connected and pulled through the telescopic columns 211 on both sides. When the movable screw rod 11 drives the clamping mechanism 2 to move toward the etching chamber 41, the pulley 221 moves at the bottom of the curved slide rod and is guided by the curved slide rod while moving, driving the lifting chamber 26 and the flexible clamp 291 to descend. When descending, the telescopic column 211 is pulled. The telescopic column 211 is spring-set. When the clamping mechanism 2 reaches the etching chamber 41, it is also the lowest point of the curved slide rail 13, thereby facilitating the etching of the circuit board. After the etching operation is completed, the curved slide rail 13 guides the clamping mechanism 2 to rise again. When rising, the telescopic column 211 rebounds, and continuously abuts the pulley 221 against the curved slide rail 13, thereby facilitating the unloading of the circuit board.

[0024] like Figure 5-Figure 9 As shown, the bottom side wall of the etching chamber 41 is rotatably connected to a stirring shaft 42; the stirring shaft 42 is provided with multiple groups; a stirring plate 43 is fixedly connected to the stirring shaft 42; the outer wall of the etching chamber 41 is rotatably connected to a driven shaft 44; the driven shaft 44 is provided with multiple groups; the output end of the driven shaft 44 is fixedly connected to the input end of the stirring shaft 42; a connecting rack 45 is sleeved on the driven shaft 44; a connecting column 292 is fixedly connected to the side wall of the sealing chamber 29; a driven rack 293 is fixedly connected to the end of the connecting column 29 away from the sealing chamber 29; the driven rack 293 is movably meshed with the connecting rack 45; During operation, when the clamping mechanism 2 is driven to move, the clamping mechanism 2 will descend to the top of the etching chamber 41 under the action of the curved slide rail 13. When the clamping mechanism 2 reaches the top of the etching chamber 41, the driven rack 293 arranged on its side will be meshed and connected with the connecting rack 45 on the side wall of the etching chamber 41. After the connection, the clamping mechanism 2 will be continuously driven to move, which will drive the connecting rack 45 to move. When moving, it will drive the driven shaft 44 to rotate, thereby driving the stirring shaft 42 in the etching chamber 41 to rotate, thereby realizing the stirring of the etching liquid, so that the etching liquid is fully in contact with the circuit board.

[0025] like Figure 2 As shown, the conveying mechanism 3 includes a conveying platform 31; the conveying platform 31 is arranged below the first rack 14; a conveying clamping plate 32 is arranged inside the conveying platform 31; During operation, the circuit board is placed on the conveying platform 31, clamped by the conveying clamping plate 32, and conveyed to the bottom of the clamping mechanism 2, and then the etching work is carried out.

[0026] like Fig.10 and Fig.11As shown, the cleaning mechanism 5 includes a cleaning bin 51; a fixed bin 54 is fixedly connected to the bottom of the cleaning bin 51; a telescopic spring 55 is fixedly connected inside the fixed bin 54; a fixed block 56 is fixedly connected to one end of the telescopic spring 55 away from the fixed bin 54; the fixed block 56 is slidably connected inside the fixed bin 54; second sponge strips 53 are clamped to the side walls on both sides of the cleaning bin 51; and a first sponge strip 52 is clamped to the top of the cleaning bin 51; During operation, after the etching operation is completed, the clamping mechanism 2 carries the circuit board to the top of the cleaning chamber 51, and then the flexible clamping claw 291 of the second rack 15 loses its clamping ability. At this time, the circuit board will fall into the cleaning chamber 51. When arriving in the cleaning chamber 51, the circuit board first contacts with the first sponge bar 52, and the etching liquid remaining on the circuit board is adsorbed by the first sponge bar 52. After adsorption, the circuit board continues to drop and reaches the middle of the bottom fixed block 56. The inertia of the falling circuit board squeezes the fixed block 56 into the fixed chamber 54. After squeezing, the telescopic spring 55 rebounds and clamps the circuit board again using the fixed block 56. When the circuit board falls and contacts the fixed block 56, the circuit board itself will vibrate, and the vibration will vibrate out the unabsorbed etching liquid, which will then be adsorbed by the second sponge bar 53. Then the staff can take the circuit board out of the cleaning chamber 51. After working for a period of time, the first sponge bar 52 and the second sponge bar 53 can be taken out for cleaning or replacement to avoid loss of water absorption capacity due to long-term use.

[0027] like Figure 3 As shown, a discharge pipe 46 is fixedly connected to the bottom of the machine body 1; a valve 47 is fixedly connected to the discharge pipe 46; a main motor 12 is fixedly connected to the side wall of the machine body 1; and the moving screw rod 11 and the conveying platform 31 are electrically connected to the main motor 12; During operation, the etching liquid in the etching chamber 41 can be discharged through the discharge pipe 46, which is convenient for replacement and use. The valve 47 can control the opening and closing of the discharge pipe 46, and the conveying mechanism 3 and the moving screw 11 are both driven by the main motor 12, which is convenient for cooperating with the clamping mechanism 2.

[0028] See also Figure 1-Figure 11 As shown, the present application provides a method for using an etching device for surface processing of a circuit board, comprising the following steps: S1, first, the circuit board is transported to the bottom of the clamping mechanism 2 through the conveying clamping plate 32 in the conveying mechanism 3, and then the movable screw rod 11 is driven to rotate to drive the clamping mechanism 2 to move above the circuit board. While moving, the circuit board is clamped by the flexible clamping claw 291, and the clamping claw continues to move after being clamped. The clamping mechanism 2 is moved to the top of the etching chamber 41 by the setting of the curved slide rail 13, so that the circuit board is immersed in the etching chamber 41 for etching. After the immersion is completed, the movable screw rod 11 is driven to rotate to move the clamping mechanism 2 to the top of the cleaning chamber 51, and then the flexible clamping claw 291 cancels the clamping of the circuit board, and the circuit board will fall into the cleaning chamber 51, and wait for the staff to collect it after cleaning; S2, while moving, the etching chamber 41 is stirred by means of the driven rack 293 and other structures, so that the etching liquid is fully in contact with the circuit board; S3, at the same time, the etching liquid remaining on the circuit board is absorbed by the first sponge strip 52 and the second sponge strip 53 in the cleaning chamber 51, so as to avoid the etching liquid remaining on the circuit board and affecting the subsequent operation; During operation, first, the circuit board is transported to the bottom of the clamping mechanism 2 through the conveying clamping plate 32 in the conveying mechanism 3, and then the movable screw rod 11 is driven to rotate to drive the clamping mechanism 2 to move above the circuit board. While moving, the circuit board is clamped by the flexible clamping claw 291, and the circuit board is continuously moved after being clamped. The clamping mechanism 2 is moved to the top of the etching chamber 41 by the setting of the curved slide rail 13, so that the circuit board is immersed in the etching chamber 41 for etching. After the immersion is completed, the movable screw rod 11 is driven to rotate to move the clamping mechanism 2 to the top of the cleaning chamber 51, and then the flexible clamping claw 291 cancels the clamping of the circuit board, and the circuit board will fall into the cleaning chamber 51, and wait for the staff to collect it after cleaning. While moving, the etching chamber 41 is stirred by the driven rack 293 and other structures to make the etching liquid fully contact with the circuit board. At the same time, the etching liquid remaining on the circuit board is adsorbed by the first sponge bar 52 and the second sponge bar 53 in the cleaning chamber 51 to avoid the residual etching liquid on the circuit board and affect the subsequent operation.

[0029] Working principle of the present invention: In the prior art, the above device clamps the circuit board through the clamping mechanism 2, and then performs etching. After the etching, the clamping mechanism 2 is rotated to clean the circuit board using the cleaning mechanism. However, it is found in use that the installation of the circuit board is manually placed in the clamping mechanism 2, and it needs to be fixed after placement, and the etching work can be performed after fixation. After the etching work is completed, the circuit board needs to be taken down and a new circuit board is placed again, which undoubtedly increases the working steps and the workload of the workers. Etching in groups reduces the work efficiency and cannot meet the needs of large quantities. In order to prevent such incidents from happening, first, the circuit board is placed in the conveying mechanism 3, and the circuit board is conveyed to the bottom of the clamping mechanism 2 by the conveying mechanism 3, and then the circuit board is clamped by the clamping mechanism 2, and then the screw rod 11 is moved to drive the clamping mechanism 2 to move. During the movement, the clamping mechanism 2 is guided by the curved slide rail 13 to reach the etching mechanism 4 and perform the etching work. After the work is completed, the clamping mechanism 2 reaches the cleaning mechanism 5 for unloading, and the circuit boards are cleaned and collected by the staff. Then the clamping mechanism 2 returns to the top of the conveying mechanism 3 to perform the etching work of the next group of circuit boards.

[0030] Among them, after the circuit board is transported to the bottom of the clamping mechanism 2 by the conveying mechanism 3, the moving screw 11 is first driven to rotate. When rotating, the moving screw 11 will drive the clamping mechanism 2 to move toward the etching mechanism 4 and the cleaning mechanism 5. When the clamping mechanism 2 is in the initial state, the driving gear 24 in the clamping mechanism 2 is meshed and connected with the first rack 14. While moving, the first rack 14 will be used to drive the driving gear 24 to rotate. When rotating, the driving gear 24 will drive the lifting screw 27 in the lifting bin 26 to rotate through the driving shaft 251. When rotating, the lifting screw 27 will drive the lifting block 271 to descend. When the descending block 271 descends, the compression column 28 is used to pump air into the compression chamber 281 and the sealing chamber 29, and the air is squeezed into the flexible clamping claw 291, so that the flexible clamping claw 291 changes its shape to clamp the circuit board, and the gasket 282 can prevent gas leakage. The flexible clamping claw 291 is in a tilted state when not inflated. After inflating, the flexible clamping claw 291 bends at the same time to clamp the circuit board, and the distance moved by the driving gear 24 on the first rack 14 is consistent with the distance the flexible clamping claw 291 reaches above the circuit board. At the same time, the moving distance can control the compression column 28 to push the gas The gas in the flexible clamping jaw 291 is completely filled. After the circuit board is clamped, the clamping mechanism 2 is driven to the etching mechanism 4 to perform etching on the circuit board. After the etching is completed, the clamping mechanism 2 is driven to the other end of the machine body 1, that is, the cleaning mechanism 5. When the clamping mechanism 2 moves, it will be meshed and connected with the second rack 15, and the lifting screw 27 will be driven to rotate again through the second rack 15. This rotation will drive the lifting block 271 to rise, thereby releasing the gas in the flexible clamping jaw 291, so that the flexible clamping jaw 291 loses its grip on the circuit board, thereby unloading the circuit board and cleaning it. By setting the clamping mechanism 2, the circuit board can be clamped quickly, and by the coordinated control of the first rack 14 and the driving gear 24, the circuit board can be clamped by the flexible clamping claw 291 while moving, without the need for manual fixation of the circuit board, and by setting the second rack 15, the clamping of the flexible clamping claw 291 can be released, without the need for staff to disassemble it, further improving the efficiency, and by utilizing the characteristics of the flexible clamping claw 291, the circuit board can be effectively protected, and at the same time, circuit boards of different thicknesses can be clamped, thereby improving the applicability of the clamping mechanism 2.

[0031] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An etching device for processing the surface of a circuit board, comprising a body (1), characterized in that: Also includes: A clamping mechanism (2), arranged in the body (1) and used for clamping the circuit board; A conveying mechanism (3) is arranged on one side of the machine body (1) and is used for loading circuit boards; An etching mechanism (4) is arranged in the middle of the machine body (1) and is used for etching a circuit board; A cleaning mechanism (5) is arranged on a side corresponding to the conveying mechanism (3) and is used for unloading and cleaning circuit boards; A movable screw rod (11) is arranged on the top of the machine body (1) and is used to drive the clamping mechanism (2) to move; The curved slide rail (13) is arranged below the moving lead screw (11) and is used to drive the clamping mechanism (2) to move to the etching mechanism (4) to perform etching work.

2. The etching device for circuit board surface processing according to claim 1, characterized in that: The clamping mechanism (2) comprises a moving block (21); the moving block (21) is threadedly connected to the moving screw rod (11); a telescopic column (211) is fixedly connected to a side wall of the moving block (21); an end of the telescopic column (211) away from the moving block (21) is fixedly connected to a slider (22); a connecting shaft (23) is fixedly connected to the bottom of the slider (22); an end of the connecting shaft (23) away from the slider (22) is rotatably connected to a driving gear (24); the driving gear (24) is The end away from the connecting shaft (23) is rotatably connected to a fixing column (25); the end of the fixing column (25) away from the driving gear (24) is fixedly connected to a lifting bin (26); a driving shaft (251) is arranged inside the fixing column (25); the driving shaft (251) is fixedly connected to the driving gear (24); a lifting screw rod (27) is rotatably connected inside the lifting bin (26); the end of the driving shaft (251) away from the driving gear (24) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the lifting screw rod (27); the lifting screw rod (27) is fixedly connected to the driving gear (24 ... A lifting block (271) is threadedly connected to the rod (27); a compression column (28) is fixedly connected to the side wall of the lifting block (271); an end of the lifting bin (26) away from the fixed column (25) is fixedly connected to a sealing bin (29); a compression bin (281) is fixedly connected to the sealing bin (29); an end of the compression bin (281) away from the sealing bin (29) is slidably connected to the compression column (28); an end of the compression column (28) away from the lifting block (271) is fixedly connected to a sealing pad (2 82); the sealing pad (282) is arranged in the compression chamber (281); the end of the sealing chamber (29) away from the compression chamber (281) is fixedly connected to a flexible clamp (291); the flexible clamp (291) is inflatable; the side wall of the body (1) is fixedly connected to a first rack (14); the side of the body (1) away from the first rack (14) is fixedly connected to a second rack (15); the driving gear (24) is movably engaged with the first rack (14) and the second rack (15).

3. The etching device for circuit board surface processing according to claim 2, characterized in that: The etching mechanism (4) comprises an etching chamber (41); the etching chamber (41) is arranged in the middle of the machine body (1) and is fixedly connected to the machine body (1); a pulley (221) is rotatably connected to the middle of the slider (22); the slider (22) and the pulley (221) are arranged below the curved slide rail (13) and abut against the bottom of the curved slide rail (13); and the moving block (21) is arranged above the curved slide rail (13).

4. The etching device for circuit board surface processing according to claim 3, characterized in that: The bottom side wall of the etching chamber (41) is rotatably connected to a stirring shaft (42); the stirring shaft (42) is provided with a plurality of groups; a stirring plate (43) is fixedly connected to the stirring shaft (42); the outer wall of the etching chamber (41) is rotatably connected to a driven shaft (44); the driven shaft (44) is provided with a plurality of groups; an output end of the driven shaft (44) is fixedly connected to an input end of the stirring shaft (42); a connecting rack (45) is sleeved on the driven shaft (44); a connecting column (292) is fixedly connected to the side wall of the sealing chamber (29); an end of the connecting column (292) away from the sealing chamber (29) is fixedly connected to a driven rack (293); the driven rack (293) is movably meshed with the connecting rack (45).

5. The etching device for circuit board surface processing according to claim 4, characterized in that: The conveying mechanism (3) comprises a conveying platform (31); the conveying platform (31) is arranged below the first rack (14); and a conveying clamping plate (32) is arranged inside the conveying platform (31).

6. The etching device for circuit board surface processing according to claim 5, characterized in that: The cleaning mechanism (5) comprises a cleaning chamber (51); a fixed chamber (54) is fixedly connected to the bottom of the cleaning chamber (51); a telescopic spring (55) is fixedly connected inside the fixed chamber (54); a fixed block (56) is fixedly connected to one end of the telescopic spring (55) away from the fixed chamber (54); the fixed block (56) is slidably connected inside the fixed chamber (54); second sponge strips (53) are clamped to the side walls on both sides of the cleaning chamber (51); and a first sponge strip (52) is clamped to the top of the cleaning chamber (51).

7. The etching device for circuit board surface processing according to claim 6, characterized in that: The bottom of the machine body (1) is fixedly connected to a discharge pipe (46); the discharge pipe (46) is fixedly connected to a valve (47); the side wall of the machine body (1) is fixedly connected to a main motor (12); the movable screw rod (11) is electrically connected to the conveying platform (31) and the main motor (12).

8. A method for using an etching device for processing a circuit board surface, characterized in that: The following steps are involved: S1, first, the circuit board is transported to the bottom of the clamping mechanism (2) via the transport clamping plate (32) in the transport mechanism (3), then the movable lead screw (11) is driven to rotate and drive the clamping mechanism (2) to move above the circuit board, and the circuit board is clamped by the flexible clamping claw (291) while moving, and the clamping mechanism (2) is continuously moved after being clamped, and the clamping mechanism (2) is moved to the top of the etching chamber (41) by the setting of the curved slide rail (13), so that the circuit board is immersed in the etching chamber (41) for etching, and after the immersion is completed, the movable lead screw (11) is driven to rotate so that the clamping mechanism (2) is moved to the top of the cleaning chamber (51), and then the flexible clamping claw (291) cancels the clamping of the circuit board, and the circuit board falls into the cleaning chamber (51), and waits for collection by staff after being cleaned; S2, while moving, using a driven rack (293) and other structures to stir the etching chamber (41) so that the etching liquid is fully in contact with the circuit board; S3, at the same time, the etching liquid remaining on the circuit board is absorbed by the first sponge strip (52) and the second sponge strip (53) in the cleaning chamber (51), so as to avoid the etching liquid remaining on the circuit board and affecting subsequent operations.

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