Mounting plate and method of manufacturing the same

Abstract

The invention relates to a mounting plate and a method of manufacturing the same. A mounting plate to be attached to a housing as an attachment target includes a component and a mounting portion on which the component is mounted but offset from a designed mounting position of the mounting portion. The mounting plate includes at least one attachment member coupled to the mounting portion. The at least one attachment member is configured to be attached to the housing. The at least one attachment member includes a configuration defined to coincide with information about a deviation of a designed mounting position of the component relative to the mounting portion.

Description

Technical Field

[0001] The present disclosure relates to mounting plates and methods of making mounting plates. Background Art

[0002] Japanese Patent Application Publication No. 2003-304038 discloses a printed board including a product board on which components are mounted, a separation board, and a connection portion connecting the product board and the separation board to each other. The separation board is used for fixing the printed board when the components are mounted on the product board. Cutting the connection portion of the printed board allows the printed board to be divided into a product board and a separation board on which the components are implemented. The product board on which the components are implemented is mounted to, for example, a housing as a mounting target of the product board. Summary of the invention

[0003] At least one component, such as an image sensor, to be mounted on a mounting plate, such as the product plate described above, requires a high mounting position accuracy relative to the housing to which the mounting plate is mounted. For this reason, such a component needs to be mounted on the mounting plate at a predetermined corresponding design position relative to the housing.

[0004] Particularly, the installation position of at least one component relative to the housing depends on the actual installation position of the mounting plate to the housing. For this reason, the mounting plate must also be installed on the predetermined corresponding design position of the housing.

[0005] At least one component may unfortunately be mounted on the mounting plate in a position that deviates from a predetermined corresponding design position of the mounting plate.

[0006] This may result in at least one component deviating from the predetermined corresponding design position of the mounting plate relative to the housing even if the mounting plate is mounted to the predetermined corresponding design position of the housing. Such deviation of at least one component from the corresponding design position of the mounting plate relative to the housing may result in a degradation of the performance of at least one component, particularly when a high mounting position accuracy relative to the housing is required for at least one component.

[0007] From this perspective, the present disclosure attempts to provide mounting plates to be mounted to a housing, each of which enables at least one component mounted at a position of the mounting plate deviating from a corresponding design position to have higher mounting position accuracy relative to the housing.

[0008] In addition, the present disclosure seeks to provide a method of manufacturing a mounting plate to be mounted to a housing; the mounting plate enables at least one component mounted at a position of the mounting plate deviating from a corresponding designed position to have a higher mounting position accuracy relative to the housing.

[0009] A first exemplary aspect of the present disclosure provides a mounting plate to be attached to a housing as an attachment target. The mounting plate includes a component and a mounting portion, the component is mounted on the mounting portion, but deviates from the designed mounting position of the mounting portion. The mounting plate includes at least one attachment member connected to the mounting portion. At least one attachment member is configured to be attached to the housing. At least one attachment member has a configuration defined to be consistent with information about the deviation of the designed mounting position of the component relative to the mounting portion.

[0010] A second exemplary aspect of the present disclosure provides an assembly plate. The assembly plate includes: a plurality of mounting plates, each of the mounting plates being a mounting plate according to the first exemplary aspect; and a frame arranged to surround the mounting plates and combine the mounting plates with each other as an assembly. Each of the mounting plates includes at least one connection portion connected to a mounting portion. At least one connection portion of each of the mounting plates is configured to be cuttable for separating a corresponding one of the mounting plates from the assembly plate. At least one connection portion serves as at least one attachment member.

[0011] A third exemplary aspect of the present disclosure provides a method for manufacturing a plurality of mounting plates to be attached to a housing. The method comprises:

[0012] (I) preparing an assembly panel, the assembly panel comprising: a plurality of mounting panels, each of the plurality of mounting panels comprising a mounting portion and at least one coupling portion coupled to the mounting portion; and a frame arranged to surround the mounting panels and combine the mounting panels with each other as an assembly, the at least one coupling portion of each mounting panel being configured to couple the frame to the mounting portion of the corresponding mounting panel;

[0013] (II) mounting the component on the mounting portion of each of the mounting plates according to the designed mounting position of the mounting portion;

[0014] (III) detecting an actual mounting position of the component on the mounting portion of each of the mounting plates;

[0015] (IV) determining whether the detected actual mounting position of the component on the mounting portion of each of the mounting plates deviates from the designed mounting position of the mounting portion of a corresponding one of the mounting plates;

[0016] (V) in response to determining that the detected actual mounting position of the component on the mounting portion of at least one of the mounting boards deviates from the design mounting position of the corresponding mounting portion of at least one of the mounting boards, calculating information about a deviation of the component of the mounting portion of at least one of the mounting boards relative to the design mounting position of the mounting portion of the at least one mounting board;

[0017] (VI) cutting at least one connecting portion of each of the mounting plates to separate each of the mounting plates from the assembly plate accordingly.

[0018] The cutting step includes: in response to determining that the detected actual mounting position of the component on the mounting portion of the at least one mounting plate deviates from the corresponding design mounting position of the mounting portion of the at least one mounting plate, cutting at least one connecting portion of the at least one mounting plate according to the calculated information about the deviation of the component of the mounting portion of the at least one mounting plate relative to the design mounting position of the mounting portion of the at least one mounting plate. The at least one connecting portion of each of the mounting plates is used as at least one attachment member to be attached to the housing after the cutting step. The at least one attachment member of the at least one mounting plate has a configuration defined to be consistent with the calculated information about the deviation of the component relative to the design mounting position of the mounting portion of the at least one mounting plate.

[0019] Each of the first to third exemplary aspects causes the actual mounting position of the component relative to the housing to be close to the designed mounting position of the component relative to the housing even if the component is mounted on the mounting portion of at least one mounting plate in a case where the actual mounting portion thereof deviates from the designed mounting position of the mounting portion. Therefore, this improves the accuracy of the actual mounting position of the component relative to the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other aspects of the present disclosure will become apparent from the following description of embodiments with reference to the accompanying drawings, in which:

[0021] Figure 1 is a plan view schematically illustrating an assembled board including a mounting plate according to an example embodiment;

[0022] Figure 2 is a plan view schematically illustrating a mounting plate cut from an assembly plate;

[0023] Figure 3 is a plan view schematically illustrating a mounting plate according to an exemplary embodiment attached to a housing;

[0024] Figure 4 is a plan view schematically illustrating a comparative example in which an actual mounting position of a component is inclined relative to a designed mounting position on a mounting portion of a mounting plate;

[0025] Figure 5 is a plan view schematically illustrating a comparative example in which a mounting plate is attached to a housing with the component tilted relative to a designed mounting position;

[0026] Figure 6is a plan view schematically illustrating an exemplary embodiment in which an actual mounting position of a component is tilted relative to a designed mounting position on a mounting portion of a mounting plate;

[0027] Figure 7 is a plan view schematically illustrating an exemplary embodiment in which a mounting plate is attached to a housing with the component tilted relative to a designed mounting position;

[0028] Figure 8 is a plan view schematically illustrating an assembled plate before a mounting plate according to an exemplary embodiment is mounted thereon;

[0029] Fig. 9 is a plan view schematically illustrating an assembled plate after a mounting plate according to an exemplary embodiment is mounted thereon;

[0030] Fig.10 is a flow chart schematically illustrating a method of manufacturing a mounting plate according to an exemplary embodiment;

[0031] Fig.11A is an enlarged plan view schematically illustrating how to cut the mounting plate when the component is tilted relative to the designed mounting position;

[0032] Fig. 11B is an enlarged plan view schematically illustrating how the mounting plate is cut without tilting; and

[0033] Fig.12 is an enlarged view schematically illustrating how a mounting plate is cut in the event of a linear deviation of a component relative to a designed mounting position. DETAILED DESCRIPTION

[0034] The following reference Figures 1 to 11B An exemplary embodiment of the present disclosure is described. In the embodiment and its modifications, descriptions of the same parts assigned with the same reference numerals between the exemplary embodiment and its modifications are omitted or simplified to avoid duplicate descriptions.

[0035] Figure 1 An assembly board 1 including a mounting board 10 according to an exemplary embodiment is illustrated. The assembly board 1 is configured as a printed circuit board (PCB) having, for example, a substantially rectangular plate-like shape. The assembly board 1 includes an insulating substrate having opposite first and second main surfaces and one or more conductive wiring patterns printed on, for example, the first main surface of the insulating substrate. For example, the assembly board 1 includes six mounting boards 10 according to an exemplary embodiment. The six mounting boards 10 of the assembly board 1 can be configured to be cut out individually from the assembly board 1.

[0036] For example, six mounting plates 10 are arranged in two rows and three columns in the respective transverse and longitudinal directions of the assembly plate 1 .

[0037] For example, in Figure 1 In the figure, the three mounting plates 10 arranged from left to right in the upper row will also be referred to as the upper left mounting plate 10A1, the upper middle mounting plate 10A2 and the upper right mounting plate 10A3. Similarly, the remaining three mounting plates 10 arranged from left to right in the lower row will also be referred to as the lower left mounting plate 10A4, the lower middle mounting plate 10A5 and the lower right mounting plate 10A6.

[0038] The assembly board 1 includes a frame 3 that surrounds six mounting plates 10 and combines the six mounting plates 10 with each other as an assembly. The assembly board 1 also includes a plurality of cutouts 5 between the assembly of the mounting plates 10 and the frame 3.

[0039] Each of the cutouts 5 has a rectangular shape when viewed in a direction perpendicular to the first and second main surfaces of the assembled board 1 .

[0040] The cutouts 5 include a first group of cutouts 5 provided for the upper row of mounting plates 10A1 to 10A3 and a second group of cutouts 5 provided for the lower row of mounting plates 10A4 to 10A6.

[0041] The cutouts 5 in the first group include a left side cutout 5a1, a top cutout 5a2, a bottom cutout 5a3, and a common side cutout 5a4 for the left upper mounting plate 10A1. The cutouts 5 in the first group include a common side cutout 5a4, a top cutout 5a5, a bottom cutout 5a6, and a common side cutout 5a7 for the middle upper mounting plate 10A2. The cutouts 5 in the first group include a common side cutout 5a7, a top cutout 5a8, a bottom cutout 5a9, and a right side cutout 5a10 for the right upper mounting plate 10A3.

[0042] The left side cutout 5a1, the top cutout 5a2, the bottom cutout 5a3 and the common side cutout 5a4 are arranged to have a generally rectangular shape to surround the upper left mounting plate 10A1. This enables the upper left mounting plate 10A1 to be cut out more easily from the assembly plate 1. Similarly, the common side cutout 5a4, the top cutout 5a5, the bottom cutout 5a6 and the common side cutout 5a7 are arranged to have a generally rectangular or square shape to surround the middle upper mounting plate 10A2. This enables the middle upper mounting plate 10A2 to be cut out more easily from the assembly plate 1. In addition, the common side cutout 5a7, the top cutout 5a8, the bottom cutout 5a9 and the right side cutout 5a10 are arranged to have a generally rectangular or square shape to surround the upper right mounting plate 10A3. This enables the upper right mounting plate 10A3 to be cut out more easily from the assembly plate 1.

[0043] The cutouts 5 in the second group similarly include: a left side cutout 5a1, a top cutout 5a2, a bottom cutout 5a3, and a common side cutout 5a4 for the left lower mounting plate 10A4; a common side cutout 5a4, a top cutout 5a5, a bottom cutout 5a6, and a common side cutout 5a7 for the middle lower mounting plate 10A5; and a common side cutout 5a7, a top cutout 5a8, a bottom cutout 5a9, and a right side cutout 5a10 for the right lower mounting plate 10A6. The arrangement of the cutouts 5a1 to 5a10 in the second group around the lower row mounting plates 10A4 to 10A6 is the same as the arrangement of the cutouts 5a1 to 5a10 in the first group around the upper row mounting plates 10A1 to 10A3.

[0044] Each mounting board 10 serves as a PCB on which different types of components are mounted.

[0045] Each mounting plate 10 includes a mounting portion 11 and a coupling portion 12 coupled to the mounting portion 11. The mounting portion 11 has a thin rectangular plate-like shape and has first and second opposite main surfaces, and the first main surface of the mounting portion 11 of each mounting plate 10 serves as a mounting surface. The mounting surface of the mounting portion 11 has a center point O serving as a reference point O.

[0046] The following describes the relationship between the cutouts 5a1 to 5a10 surrounding the upper row mounting plates 10A1 to 10A3 in the first group and the corresponding coupling portions 12.

[0047] Each of the left side cutout 5a1 , the common side cutout 5a4 , the common side cutout 5a7 , and the right side cutout 5a10 has opposite first and second ends in the longitudinal direction thereof corresponding to the transverse direction of the assembly board 1 .

[0048] The first end of the left side cutout 5a1 is arranged to face the first end of the top cutout 5a2, and the first end of the top cutout 5a2 is closer to the left side cutout 5a1 than the second end of the top cutout 5a2, wherein a portion of the frame 3 is located between the first end of the left side cutout 5a1 and the first end of the top cutout 5a2. The portion of the frame 3 located between the first end of the left side cutout 5a1 and the first end of the top cutout 5a2 serves as a corresponding one of the connecting portions 12. The second end of the top cutout 5a2, which is closer to the first end of the common side cutout 5a4, is arranged to face the first end of the common side cutout 5a4, wherein a portion of the frame 3 is located between the second end of the top cutout 5a2 and the first end of the common side cutout 5a4. The portion of the frame 3 located between the second end of the top cutout 5a4 and the first end of the common side cutout 5a4 serves as a corresponding one of the connecting portions 12.

[0049] The first end of the common side cutout 5a4 is arranged to face the first end of the top cutout 5a5, and the first end of the top cutout 5a5 is closer to the common side cutout 5a4 than the second end of the top cutout 5a5, wherein a portion of the frame 3 is located between the first end of the common side cutout 5a4 and the first end of the top cutout 5a5. The portion of the frame 3 located between the first end of the common side cutout 5a4 and the first end of the top cutout 5a5 serves as a corresponding one of the connecting portions 12. The second end of the top cutout 5a5, which is closer to the first end of the common side cutout 5a7, is arranged to face the first end of the common side cutout 5a7, wherein a portion of the frame 3 is located between the second end of the top cutout 5a5 and the first end of the common side cutout 5a7. The portion of the frame 3 located between the second end of the top cutout 5a5 and the first end of the common side cutout 5a7 serves as a corresponding one of the connecting portions 12.

[0050] The first end of the common side cutout 5a7 is arranged to face the first end of the top cutout 5a8, and the first end of the top cutout 5a8 is closer to the common side cutout 5a7 than the second end of the top cutout 5a8, wherein a portion of the frame 3 is located between the first end of the common side cutout 5a7 and the first end of the top cutout 5a8. The portion of the frame 3 located between the first end of the common side cutout 5a7 and the first end of the top cutout 5a8 serves as a corresponding one of the connecting portions 12. The second end of the top cutout 5a8, which is closer to the first end of the right side cutout 5a10, is arranged to face the first end of the right side cutout 5a10, wherein a portion of the frame 3 is located between the second end of the top cutout 5a8 and the first end of the right side cutout 5a10. The portion of the frame 3 located between the second end of the top cutout 5a8 and the first end of the right side cutout 5a10 serves as a corresponding one of the connecting portions 12.

[0051] The second end of the left side cutout 5a1 is arranged to face the first end of the bottom cutout 5a3, and the first end of the bottom cutout 5a3 is closer to the left side cutout 5a1 than the second end of the bottom cutout 5a3, wherein a portion of the frame 3 is located between the second end of the left side cutout 5a1 and the first end of the bottom cutout 5a3. The portion of the frame 3 located between the second end of the left side cutout 5a1 and the first end of the bottom cutout 5a3 serves as a corresponding one of the connecting portions 12. The second end of the bottom cutout 5a3, which is closer to the second end of the common side cutout 5a4, is arranged to face the second end of the common side cutout 5a4, wherein a portion of the frame 3 is located between the second end of the bottom cutout 5a3 and the second end of the common side cutout 5a4. The portion of the frame 3 located between the second end of the bottom cutout 5a4 and the second end of the common side cutout 5a4 serves as a corresponding one of the connecting portions 12.

[0052] The second end of the common side cutout 5a4 is arranged to face the first end of the bottom cutout 5a6, and the first end of the bottom cutout 5a6 is closer to the common side cutout 5a4 than the second end of the bottom cutout 5a6, wherein a portion of the frame 3 is located between the second end of the common side cutout 5a4 and the first end of the bottom cutout 5a6. The portion of the frame 3 located between the second end of the common side cutout 5a4 and the first end of the bottom cutout 5a6 serves as a corresponding one of the connecting portions 12. The second end of the bottom cutout 5a6, which is closer to the second end of the common side cutout 5a7, is arranged to face the second end of the common side cutout 5a7, wherein a portion of the frame 3 is located between the second end of the bottom cutout 5a6 and the second end of the common side cutout 5a7. The portion of the frame 3 located between the second end of the bottom cutout 5a6 and the second end of the common side cutout 5a7 serves as a corresponding one of the connecting portions 12.

[0053] The second end of the common side cutout 5a7 is arranged to face the first end of the bottom cutout 5a9, and the first end of the bottom cutout 5a9 is closer to the common side cutout 5a7 than the second end of the bottom cutout 5a9, wherein a portion of the frame 3 is located between the second end of the common side cutout 5a7 and the first end of the bottom cutout 5a9. The portion of the frame 3 located between the second end of the common side cutout 5a7 and the first end of the bottom cutout 5a9 serves as a corresponding one of the connecting portions 12. The second end of the bottom cutout 5a9, which is closer to the second end of the right side cutout 5a10, is arranged to face the second end of the right side cutout 5a10, wherein a portion of the frame 3 is located between the second end of the bottom cutout 5a9 and the second end of the right side cutout 5a10. The portion of the frame 3 located between the second end of the bottom cutout 5a9 and the second end of the right side cutout 5a10 serves as a corresponding one of the connecting portions 12.

[0054] The relationship between the cutouts 5a1 to 5a10 around the lower row mounting plates 10A4 to 10A6 in the second group and the corresponding connecting portions 12 is the same as the relationship between the cutouts 5a1 to 5a10 around the upper row mounting plates 10A1 to 10A3 in the first group.

[0055] The connecting portion 12 of each mounting plate 10 is connected to the frame 3 of the assembly plate 1. Figure 1 As illustrated in FIG. 1 , one or more components 20 may be mounted on a mounting surface of the mounting portion 11 of each mounting plate 10 .

[0056] For example, the component 20 is mounted on the mounting surface of the mounting portion 11 of each mounting board 10 by reflow soldering, thereby implementing the component 20 on the mounting portion 11. After the reflow soldering process, the boundary between the frame 3 and the coupling portion 12 is cut, so that the six mounting boards 10 are separated from the assembly board 1.

[0057] The mounting portion 11 of each mounting plate 10 has a substantially rectangular shape when viewed in a direction perpendicular to the first main surface and the second main surface. The mounting portion 11 of each mounting plate 10 has a pair of long sides 111 and 112 and a pair of short sides 113 and 114; these long sides and short sides 111 to 114 constitute the substantially rectangular shape of the mounting portion 11. The long sides 111 and 112 are arranged to extend linearly in parallel to each other, and the short sides 113 and 114, which are shorter in length than the long sides 111 and 112, are also arranged to extend linearly in parallel to each other.

[0058] Long side 111 has both a first end portion and a second end portion connected to first ends of short sides 113 and 114, respectively. Similarly, long side 112 has both a first end portion and a second end portion connected to second ends of short sides 113 and 114, respectively; the second ends of short sides 113 and 114 are opposite to their first ends.

[0059] like Figure 2 As illustrated in FIG. 1 , each of the connecting portions 12 is arranged to extend outwardly in a direction parallel to the short sides 113 and 114 from a corresponding one of: (i) a first end of the long side 111, (ii) a second end of the long side 111, (iii) a first end of the long side 112, and (iv) a second end of the long side 112. Each of the connecting portions 12 has a predetermined length in a direction parallel to the short sides 113 and 114, and has a predetermined width in a direction parallel to the long sides 111 and 112.

[0060] That is, each mounting plate 10 is cut out from the assembly plate 1, wherein each of the connecting portions 12 is connected to a corresponding one of: (i) the first end of the long side 111, (ii) the second end of the long side 111, (iii) the first end of the long side 112, and (iv) the second end of the long side 112.

[0061] As the component 20 mounted on the mounting portion 11 of each mounting board 10, an image sensor such as a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor may be used; the image sensor 20 may be applied to an image capturing device not shown.

[0062] An example in which the component 20 of each mounting plate 10 is an image sensor applied to an image capturing device mounted in a vehicle is described below.

[0063] A mounting plate 10 is described below, on which a component 20 , namely an image sensor, is implemented.

[0064] Component 20 being an image sensor requires precise alignment relative to the image capture device.

[0065] When viewed in a direction perpendicular to the first and second main surfaces of the mounting portion 11, the component 20 of the mounting board 10, namely the image sensor, has a substantially rectangular shape. Figure 2 As illustrated in FIG, the component 20 has a center point O1 serving as a reference point O1, a pair of first side surfaces 21 and 22 corresponding to the long sides 111 and 112 of the mounting portion 11, respectively, and a pair of second side surfaces 23 and 24 corresponding to the short sides 113 and 114 of the mounting portion 11, respectively.

[0066] The designed installation position of the component 20 on the installation surface of the installation portion 11, that is, the designed installation area is determined so that:

[0067] (I) the center point O1 of the component 20 is aligned with the center point O of the mounting surface of the mounting portion 11;

[0068] (II) the first side surfaces 21 and 22 are parallel to the corresponding long sides 111 and 112 of the mounting portion 11;

[0069] (III) The second side surfaces 23 and 24 are parallel to the respective short sides 113 and 114 of the mounting portion 11 .

[0070] It should be noted that another component or one or more other components may be mounted on the mounting portion 11 of each mounting plate 10 .

[0071] like Figure 3 As shown in the figure, the mounting plate 10 that has been cut out from the assembly plate 1 is mounted to the housing 30 of the image capture device, which is not shown. The housing 30 constitutes the shell of the image capture device and is directly attached to the vehicle. The housing 30 has, for example, a bottomed rectangular tubular shape with an internal hollow space, and is configured so that the mounting plate 10 can be mounted in the internal hollow space of the housing 30.

[0072] The housing 30 has four inner peripheral surfaces 31 , namely, a pair of first inner peripheral surfaces 31A1 and 31A2 and a pair of second inner peripheral surfaces 31B1 and 31B2 . The housing 30 has a predetermined central axis defined by the four inner peripheral surfaces 31 .

[0073] That is, when the mounting plate 10 is installed in the internal hollow space of the shell 30 in such a way that the center point O is located on the central axis of the shell 30, the long sides 111 and 112 of the mounting portion 11 are arranged to face the corresponding first inner peripheral surfaces 31A1 and 31A2 of the shell 30, and the short sides 113 and 114 of the mounting portion 11 are arranged to face the corresponding second inner peripheral surfaces 31B1 and 31B2 of the shell 30.

[0074] Specifically, the mounting plate 10 is mounted in the inner hollow space of the housing 30 while the selected two of the coupling portions 12 are attached to the corresponding one of the inner peripheral surfaces of the housing 30. The selected two of the coupling portions 12 will be referred to as the attachment members 40. The exemplary embodiment uses the coupling portions 12 linearly extending from the long sides 111 of the mounting portion 11 as the attachment members 40. That is, the attachment member 40 of the mounting portion 11 of the mounting plate 10 is attached to the first inner peripheral surface 31A1 of the housing 30.

[0075] Each of the connecting portions 12 has a face at its extended end; the end face of each of the attaching members 40 will be referred to as an attaching face 41. When the mounting portion 10 is mounted in the internal hollow space of the housing 30, the attaching face 41 of the attaching member 40 is attached to the first inner peripheral face 31A1 of the housing 30. More specifically, the attaching face 41 of the attaching member 40 is pressed to abut against the first inner peripheral face 31A1 of the housing 30, thereby causing the mounting plate 10 to be attached to the housing 30 in a fixed manner. This fixed attachment of the mounting plate 10 to the housing 30 determines the mounting position of the mounting plate 10 relative to the housing 30, thereby causing the mounting position of the component 20 mounted on the mounting plate 10 relative to the housing 30 to be determined. That is, the designed mounting position of the component 20 relative to the housing 30 is based on the designed mounting position of the mounting plate 10 relative to the housing 30.

[0076] like Figure 3 As illustrated in FIG. 1 , the designed mounting position of the component 20 relative to the mounting plate 10 according to the exemplary embodiment is determined such that:

[0077] (I) the center point O1 of the component 20 is aligned with the center point O of the mounting surface of the mounting portion 11;

[0078] (II) the first side surfaces 21 and 22 are parallel to the corresponding long sides 111 and 112 of the mounting portion 11;

[0079] (III) The second side surfaces 23 and 24 are parallel to the respective short sides 113 and 114 of the mounting portion 11 .

[0080] The component 20 may be mounted on the mounting surface of the mounting portion 11 of the mounting plate 10, but may be misaligned with respect to a predetermined mounting position on the mounting portion 11 relative to the mounting plate 10. For example, Figure 4 A comparative example is illustrated in which the actual mounting position of the component 20 is tilted at an angle θ relative to the designed mounting position on the mounting surface of the mounting portion 11, wherein the center point O1 of the component 20 is aligned with the center point O of the mounting surface of the mounting portion 11. That is, the comparative example shows that the component 20 is mounted on the mounting portion 11, but each of the first side surfaces 21 and 22 is tilted at an angle θ relative to a corresponding one of the long sides 111 and 112 of the mounting portion 11 and each of the second side surfaces 23 and 24 is tilted at an angle θ relative to a corresponding one of the short sides 113 and 114 of the mounting portion 11.

[0081] like Figure 4 As illustrated in , let us assume that the attachment surface 41 of each of the two attachment members 40 that have been cut out from the assembly plate 1 is parallel to the long sides 111 and 112 of the mounting plate 10 .

[0082] In this assumption, let us also assume that the attachment surface 41 of the attachment member 40 of the mounting plate 10 is pressed to be connected to the first inner peripheral surface 31A1 of the shell 30 when the center point O of the mounting plate 10 matches the predetermined center axis of the shell 30, thereby causing the mounting plate 10 to be mounted to the shell 30 in a fixed manner.

[0083] This results in the component 20 being mounted to the housing 30 while the component 20 is tilted at an angle θ about the designed mounting position relative to the housing 30, as shown in FIG. Figure 5 This is because the mounting position of the component 20 is based on the mounting position of the mounting plate 10 relative to the housing 30. That is, when the component 20 is mounted on the mounting portion 11 so as to be misaligned with the designed mounting position relative to the housing 30, mounting the mounting plate 10 to the housing 30 will cause the component 20 mounted to the housing 30 to have a misalignment with the designed mounting position relative to the housing 30.

[0084] When the component 20 is tilted at an angle θ relative to the designed mounting position of the mounting portion 11, the misalignment of the component 20 as an image sensor with the designed mounting position relative to the housing 30 will cause the component (image sensor) 20 of the image capture device to capture a tilted image. This will cause the image capture device to perform one or more software tasks that are not necessary to correct the tilt of the captured image.

[0085] From this perspective, if Figure 6As illustrated in FIG. 1 , the mounting plate 10 according to the exemplary embodiment is configured so that each of the attachment members 40 has a configuration defined to be consistent with the deviation information about the designed mounting position of the component 20 relative to the mounting portion 11. The deviation information about the component 20 indicates a directional deviation between the actual mounting position of the component 20 of at least one mounting plate 10 and the designed mounting position of the component 20.

[0086] Specifically, Figure 6 As illustrated in , the mounting plate 10 according to the exemplary embodiment is configured such that the attachment surface 41 of each of the attachment members 40 is formed to have an inclination consistent with the inclination of the designed mounting position of the component 20 relative to the mounting portion 11 .

[0087] More specifically, the mounting plate 10 is cut out from the assembly plate 1 so that each attachment member 40 (12) has an attachment surface 41 formed on an extended end thereof; the attachment surface 41 is inclined at a predetermined angle relative to a direction parallel to the long side 111; the predetermined angle matches the inclination angle θ of the component 20 relative to the designed mounting position of the mounting portion 11. The predetermined angle formed by the direction extending along the attachment surface 41 and the direction parallel to the long side 111 matches the inclination angle θ of the component 20.

[0088] The mounting plate 10 is cut out from the assembly plate 1 when the extended end portion of each attachment member 40 (12) is cut along a virtual plane VL3 extending at an angle θ relative to a direction parallel to the long side 111. In other words, the extended end portion of each attachment member 40 is cut along a virtual cutting plane VL3 extending parallel to the first side surfaces 21 and 22 of the component 20, so that the attachment surface 41 of the extended end portion of each attachment member 40 (12) formed by the cutting is parallel to the first side surfaces 21 and 22 of the component 20.

[0089] Reference Figure 7 , the actual mounting position of the component 20 to the mounting plate 10 is described below when the mounting plate 10 is attached to the housing 30, and the mounting plate 10 has the attachment surface 41 explained above.

[0090] The attachment surface 41 of each attachment member 40 (12) is formed to be inclined in accordance with the inclination of the designed installation position of the component 20 relative to the mounting portion 11, and is pressed to be fixed to the first inner surface 31A1 of the housing 30. This causes the mounting plate 10 to be mounted to the housing 30 with the long side 111 of the mounting plate 10 inclined at an angle θ relative to the first inner peripheral surface 31A1 of the housing 30, as shown in FIG. Figure 7Therefore, even if the component 20 is mounted on the mounting portion 11 and tilted at an angle θ relative to the designed mounting position of the mounting portion 11, the actual mounting position of the component 20 relative to the housing 30 is close to the designed mounting position of the component 20 relative to the housing 30. Specifically, the component 20 is mounted to the housing 30 so that the first side surfaces 21 and 22 are parallel to the first inner peripheral surface 31A1 of the housing 30.

[0091] Therefore, even if component 20, ie, an image sensor, is mounted on mounting portion 11 and tilted at an angle θ relative to the designed mounting position of mounting portion 11, this eliminates the need to perform one or more otherwise unnecessary software tasks, such as a captured image correction task.

[0092] The configuration of the mounting plate 10 according to the exemplary embodiment set forth above has been described.

[0093] Next, refer to the following Figures 8 to 10 A method of manufacturing the mounting board 10 according to an exemplary embodiment is described.

[0094] First, if Figure 8 As shown in the figure, the method performs Fig.10 In step S1, a board preparation step is performed to prepare an assembly board 1, on which the assembly board 1 is mounted such as Figure 1 Specifically, the assembly plate 1 includes a frame 3, a first set of cutouts 5 (5a1 to 5a10) for the upper row of mounting plates 10A1 to 10A3, and a second set of cutouts 5 (5a1 to 5a10) for the lower row of mounting plates 10A4 to 10A6.

[0095] Next, the method executes Fig.10 The surface mounting process in step S2.

[0096] As a first example, the assembly board 1 has a center point, i.e., a reference point, and also has a first two-dimensional coordinate system defined around the center point. In the first two-dimensional coordinate system, a predetermined design mounting position for the component 20, i.e., a predetermined design rectangular mounting area, is determined in advance for each of the mounting boards 10 (10A1 to 10A6).

[0097] As a second example, the mounting surface of the mounting portion of each of the mounting plates 10 (10A1 to 10A6) has a second two-dimensional coordinate system defined around the center point O of the mounting surface. In the second two-dimensional coordinate system of each of the mounting plates 10 (10A1 to 10A6), a predetermined design mounting position for the component 20, that is, a predetermined design rectangular mounting area, is determined in advance for a corresponding one of the mounting plates 10 (10A1 to 10A6).

[0098] The surface mounting process sequentially holds the components 20 and sequentially mounts the components 20 on the designed mounting positions of the respective mounting boards 10 ( 10A1 to 10A6 ).

[0099] Then, the surface mounting process solders the component 20 to the mounting surface of the mounting portion 11 of each of the mounting boards 10 ( 10A1 to 10A6 ) by reflow soldering.

[0100] After the surface mounting process, the method performs Fig.10 The actual installation position detection process in step S3. Fig.10 In step S3 of the actual mounting position detection process, a camera 50 for capturing an image of at least a first two-dimensional coordinate system of the assembly board 1 and an image processing device 60 (see FIG. 1 ) connected to the camera 50 for performing image processing on the captured image are prepared. Fig. 9 ).

[0101] Specifically, the actual installation position detection process controls the camera 50 to capture one or more images of the first two-dimensional coordinate system of the assembly board 1 or the second two-dimensional coordinate system of each installation board 10. Then, the actual installation position detection process instructs the image processing device 60 to perform image processing on the captured one or more images to detect the actual installation position of each component 20 in the first two-dimensional coordinate system of the assembly board 1 or the actual installation position of each component 20 in the second two-dimensional coordinate system of the corresponding installation board 10, respectively.

[0102] The actual installation position detection process in step S3 of the method can use another measuring device to detect the actual installation position of each component 20 in the first two-dimensional coordinate system of the assembly board 1 or the actual installation position of each component 20 in the second two-dimensional coordinate system of the corresponding installation board 10.

[0103] Next, the method executes Fig.10 Specifically, the method compares the detected actual installation position of the component 20 of each mounting plate 10 with the designed installation position of the component 20 of the corresponding mounting plate 10 to correspondingly determine whether the detected actual installation position of the component 20 of each mounting plate 10 in the deviation determination process in step S4 deviates from the designed installation position of the component 20 of the corresponding mounting plate 1.

[0104] In response to determining that the detected actual mounting position of component 20 of each mounting board 10 does not deviate from the designed mounting position of component 20 of the corresponding mounting board 1 (No in step S4), the method proceeds to step S6 while skipping the operation in step S5.

[0105] Additionally, in response to determining that the detected actual mounting position of the component 20 of at least one mounting board 10 deviates from the designed mounting position of the component 20 of the corresponding mounting board 1 (Yes in step S4), the method executes Fig.10 The deviation information calculation process for at least one mounting plate 10 in step S5.

[0106] Specifically, the deviation information calculation process uses the image processing device 60 to calculate deviation information for at least one mounting board 10, which deviation information represents, for example, the directional deviation between the actual mounting position of the component 20 of at least one mounting board 10 and the designed mounting position of the component 20 of at least one mounting board 10.

[0107] Fig.11A An example is shown in which the actual mounting position of the component 20 of the upper-middle mounting plate 10A2 is not aligned with the designed mounting position of the component 20 of the upper-middle mounting plate 10A2, so that the designed mounting position is tilted by an angle θ relative to the designed mounting position of the component 20 of the upper-middle mounting plate 10A2 in a case where the center point O1 of the component 20 is aligned with the center point O of the mounting surface of the mounting portion 11 of the upper-middle mounting plate 10A2. More specifically, the first side surface 21 of the component 20 mounted on the mounting portion 11 of the upper-middle mounting plate 10A2 is tilted by an angle θ relative to the long side 111 of the mounting plate 10A2.

[0108] In this example, the deviation information calculation process uses the image processing device 60 to calculate deviation information for the upper center mounting plate 10A2 , the deviation information indicating, for example, a deviation by an angle θ counterclockwise relative to the designed mounting position of the component 20 .

[0109] exist Fig.10 A negative determination in step S4 or Fig.10 After the deviation information calculation process in step S5, the method performs Fig.10 The cutting process in step S6.

[0110] exist Fig.10 After the negative determination in step S4 , the cutting process of the method performs a normal cutting process for all the mounting boards 10 .

[0111] Specifically, in step S6, a conventional cutting process uses, for example, a cutting machine not shown to cut the connecting portion 12 of each mounting plate 10 along a direction parallel to the long side 111 of the corresponding mounting plate 10 to separate the corresponding mounting plate 10 from the frame 3 of the assembly plate 1 accordingly.

[0112] For example, Fig. 11B An example of a cutting process for the upper left mounting plate 10A1 without deviation is schematically illustrated.

[0113] Specifically, Fig.11A As illustrated in the figure, the following method causes the upper left mounting plate 10A1 to be cut out from the assembly plate 1: (i) each connecting portion 12, i.e., each attachment member 40, extending outward from the long side 111 of the mounting portion 11 of the upper left mounting plate 10A1 is cut along a virtual cutting plane VL1, wherein the virtual cutting plane VL1 passes through a predetermined cutting point of the corresponding connecting portion 12 in its length direction and is parallel to the long side 111 of the corresponding mounting plate 10; and (ii) each connecting portion 12 extending outward from the long side 112 of the mounting portion 11 of the upper left mounting plate 10A1 is cut along a virtual cutting plane VL2, wherein the virtual cutting plane VL2 passes through a predetermined regular cutting point of the corresponding connecting portion 12 in its length direction and is parallel to the long side 112 of the corresponding mounting plate 10.

[0114] On the contrary, Fig.10 After the deviation information calculation process in step S5 , the cutting process of the method performs a deviation correction cutting process for at least one mounting board 10 , and performs a normal cutting process for the remaining one or more aligned mounting boards 10 .

[0115] Specifically, the deviation correction cutting process uses, for example, a cutting machine not shown in the figure to cut the attachment member 12 (40) of at least one mounting plate 10 according to the deviation information, that is, the directional deviation between the actual mounting position of the component 20 of at least one mounting plate 10 and the designed mounting position of the component 20. In addition, the deviation correction cutting process uses, for example, a cutting machine not shown in the figure to cut each of the remaining connecting portions 12 of at least one mounting plate 10 in a direction parallel to the long side 112 of the corresponding one of the remaining mounting plates 10.

[0116] For example, Fig.11A An example of a cutting process for the middle upper mounting plate 10A2 having an inclination of the angle θ set forth above is schematically illustrated.

[0117] Specifically, Fig.11A As illustrated in FIG. 1 , the deviation correction cutting process cuts each attachment member 12 (40) extending outward from the long side 111 of the mounting portion 11 of the middle upper mounting plate 10A2 along a virtual cutting plane VL3 that has been rotated counterclockwise by an angle θ from a conventional virtual cutting line VL1; the virtual cutting line VL1 is parallel to the long side 111. In addition, the deviation correction cutting process cuts each of the remaining connecting portions 12 extending outward from the long side 112 of the mounting portion 11 of the middle upper mounting plate 10A2 along a virtual cutting plane VL2 that passes through a predetermined conventional cutting point of the corresponding connecting portion 12 in its length direction and is parallel to the long side 112 of the corresponding mounting plate 10.

[0118] This results in all six mounting plates 10 being separated from the frame 3 of the assembly plate 1 .

[0119] Next, the method executes Fig.10 The attaching process of step S7 is to attach each of the six mounting boards 10 cut out from the assembly board 1 .

[0120] Specifically, the attachment process prepares six housings 30 of the image capture device and arranges the six housings 30 in a two-dimensional manner. Then, the attachment process installs the corresponding six mounting plates 10 into the hollow spaces of the corresponding six housings 30. Then, the attachment process presses the attachment surface 41 of the attachment member 40 of each mounting plate 10 onto the first inner peripheral surface 31A1 of the corresponding housing 30 to attach each mounting plate 10 to the corresponding housing 30 in a fixed manner.

[0121] In particular, if Figure 6 and Figure 7 As illustrated in , the attachment surface 41 of the extended end of each attachment member 40 of at least one mounting plate 10 is parallel to the first side surfaces 21 and 22 of the component 20 whose actual mounting position is inclined at an angle θ relative to the designed mounting position.

[0122] This results in at least one mounting plate 10 being mounted to the housing 30 with the long side 111 of the at least one mounting plate 10 tilted at an angle θ relative to the first inner peripheral surface 31A1 of the housing 30, as shown in FIG. Figure 7 Therefore, even if the component 20 is mounted on the mounting portion 11 and tilted at an angle θ relative to the designed mounting position of the mounting portion 11, the actual mounting position of the component 20 relative to the housing 30 is close to the designed mounting position of the component 20 relative to the housing 30. Specifically, the component 20 of at least one mounting plate 10 is mounted to the housing 30 so that the first side surfaces 21 and 22 are parallel to the first inner peripheral surface 31A1 of the housing 30.

[0123] As described above, the mounting plate 10 according to the exemplary embodiment includes the mounting portion 11 on which the component 20 is mounted. The mounting plate 10 according to the exemplary embodiment includes the attachment member 40 coupled to the mounting portion 11. Each of the attachment members 40 to be attached to the housing 30 has a configuration defined to be consistent with the deviation information about the designed mounting position of the component 20 relative to the mounting portion 11. The deviation information about the component 20 indicates a directional deviation of an actual mounting position of the component 20 of the mounting plate 10 from a designed mounting position of the component 20.

[0124] Therefore, even if the component 20 is mounted on the mounting portion 11 of the mounting plate 10 with its actual mounting portion deviating from the designed mounting position of the mounting portion 11, the actual mounting position of the component 20 relative to the housing 30 is close to the designed mounting position of the component 20 relative to the housing 30. Therefore, the accuracy of the actual mounting position of the component 20 relative to the housing 30 is improved.

[0125] In addition, the exemplary embodiment provides the following advantageous advantages.

[0126] The housing 30 has at least an inner peripheral surface 31A1 to which the mounting plate 10 is attached, and each of the attachment members 40 of the mounting plate 10 has an attachment surface 41 to be attached to the inner peripheral surface 31A1 of the housing 31. The attachment surface 41 of each of the attachment members 40 is formed to have an inclination that conforms to the inclination of the designed mounting position of the component 20 relative to the mounting portion 11.

[0127] The inclination of the attachment surface 41 of each of the attachment members 40, which is consistent with the inclination of the designed mounting position of the component 20 relative to the mounting portion 11, causes the actual mounting position of the component 20 relative to the housing 30 to be close to the designed mounting position of the component 20 relative to the housing 30. Therefore, this improves the accuracy of the actual mounting position of the component 20 relative to the housing 30.

[0128] The assembly panel 1 according to the exemplary embodiment includes a mounting panel 10 and a frame 3, which surrounds the mounting panel 10 and combines the mounting panels 10 with each other as an assembly. Each mounting panel 10 includes a coupling portion 12 coupled to the frame 3. The coupling portion 12 of each mounting panel 10 is configured to be cuttable for separating the corresponding mounting panel from the assembly panel 1. At least two of the coupling portions 12 serve as attachment members 40.

[0129] Therefore, each mounting plate 10 has a simpler configuration compared to a configuration including an attachment member in addition to the coupling portion 12 .

[0130] The component 20 to be mounted on the mounting portion 11 of each mounting board 10 is an image sensor.

[0131] If the component 20 as the image sensor is mounted and tilted relative to the designed mounting position of the mounting portion 11, such tilting of the component 20 will cause the component (image sensor) 20 of the image capture device to capture a tilted image. This will cause the image capture device to execute one or more software tasks that are not necessary to correct the tilt of the captured image.

[0132] In contrast, even if component 20 as an image sensor is mounted tilted relative to the designed mounting position of mounting portion 11, the above configuration of mounting board 10 eliminates the need to perform one or more otherwise unnecessary software tasks of correcting the tilt of the captured image.

[0133] The exemplary embodiments of the present disclosure set forth above have been described. The present disclosure is not limited to the above exemplary embodiments, and various modifications may be made, for example, as follows.

[0134] The mounting plate 10 according to the exemplary embodiment is attached to the housing 30 of the image capturing device, but the mounting plate 10 may be attached to the housing of another device.

[0135] The component 20 according to the exemplary embodiment is an image sensor, but the other component is, for example, a receiving portion connector or a pluggable connector. A receiving portion connector, such as a socket or a hole connector, is configured to receive such a pluggable connector therein. A pluggable connector, such as a plug or a pin, is configured to be pluggable into such a receiving portion connector.

[0136] If component 20, which is one of a pair of pluggable connectors and a receiving part connector, is installed to deviate from the designed installation position of the mounting portion 11, such deviation of component 20, which is one of a pair of pluggable connectors and a receiving part connector, will require adjustment of the position of the other of the pair of pluggable connectors and a receiving part connector in order to align one of the pair of pluggable connectors and a receiving part connector with the other of the pair of pluggable connectors and a receiving part connector.

[0137] In contrast, even if component 20, which is one of a pair of pluggable connectors and a receiving portion connector, is installed to deviate from the designed mounting position of mounting portion 11, the above-mentioned configuration of mounting plate 10 does not require adjustment of the position of the other of a pair of pluggable connectors and a receiving portion connector.

[0138] The mounting plate 10 according to the exemplary embodiment is configured such that the attachment surface 41 of each of the attachment members 40 is formed to have an inclination that conforms to the inclination of the designed mounting position of the component 20 relative to the mounting portion 11. The present disclosure is not limited to the above configuration.

[0139] Specifically, let us assume that the component 20 of the middle upper mounting plate 10A2 is mounted on the mounting portion 11 so as to deviate from the designed mounting position on the mounting portion 11 by a deviation D in the extending direction of the second side surfaces 23 and 24 (see Fig.12 ).

[0140] In this case, the deviation information calculation process in step S5 uses the image processing device 60 to calculate the deviation information for the middle and upper mounting plate 10A2, which deviation information represents the lower deviation measured in deviation D between the actual mounting position of the component 20 of the middle and upper mounting plate 10A2 and the designed mounting position of the component 20 of the middle and upper mounting plate 10A2.

[0141] Then, the deviation correction cutting process in step S6 cuts each of the attachment members 12 (40) extending outward from the long side 111 of the mounting portion 11 of the middle upper mounting plate 10A2 along the virtual cutting plane VL1A shifted to pass through the correction cutting point shifted from the predetermined regular cutting point through which the regular virtual cutting line VL1 passes by a deviation D. In addition, the deviation correction cutting process cuts each of the remaining coupling portions 12 extending outward from the long side 112 of the mounting portion 11 of the middle upper mounting plate 10A2 along the regular virtual cutting plane VL2 passing through the predetermined regular cutting point of the corresponding coupling portion 12 in its length direction and parallel to the long side 112 of the corresponding mounting plate 10.

[0142] One or more components in the exemplary embodiments are not necessarily essential components, except for the following cases: (i) one or more components are described as one or more essential components; or (ii) one or more components are essential in principle.

[0143] The specific values ​​disclosed in the exemplary embodiments, each of which represents the number of components, physical quantities and / or ranges of physical parameters, are not limited thereto, except in the following cases: (i) the specific value is obviously indispensable; or (ii) the specific value is indispensable in principle.

[0144] The specific structural or functional relationship between the components described in each exemplary embodiment is not limited thereto, except in the following cases: (1) the specific structural or functional relationship is described as indispensable; or (2) the specific structural or functional relationship is required in principle.

[0145] The present disclosure includes the following first to fifth technical concepts.

[0146] The first technical concept is a mounting plate (10) to be attached to a housing (30) as an attachment target. The mounting plate includes a component (20) and a mounting portion (11), the component being mounted on the mounting portion, but deviating from a designed mounting position of the mounting portion. The mounting plate includes at least one attachment member (40) connected to the mounting portion. The at least one attachment member is configured to be attached to the housing. The at least one attachment member has a configuration defined to be consistent with information about a deviation of the component from a designed mounting position of the mounting portion.

[0147] In a second technical concept dependent on the first technical concept, the housing has at least an inner peripheral surface to which the mounting plate is attached. At least one attachment member of the mounting plate has an attachment surface (41) to be attached to the inner peripheral surface of the housing. The component (20) is installed to be inclined relative to the designed installation position of the mounting portion or linearly deviated from the designed installation position. The attachment surface of at least one attachment member is formed to have an inclination consistent with the inclination of the component relative to the designed installation position of the mounting portion, or at least one attachment member is formed to have a specific configuration consistent with the linear deviation of the component relative to the designed installation position of the mounting portion.

[0148] The third technical concept is an assembly plate (1). The assembly plate comprises: a plurality of mounting plates, each of which is a mounting plate according to the first technical concept; and a frame, which is arranged to surround the mounting plates and combine the mounting plates with each other into an assembly. Each of the mounting plates comprises at least one connecting portion (12) connected to the mounting portion. At least one connecting portion of each of the mounting plates is configured to be cuttable so as to separate a corresponding one of the mounting plates from the assembly plate. At least one connecting portion serves as at least one attachment member.

[0149] In a fourth technical concept dependent on the first technical concept, the component is an image sensor.

[0150] A fifth technical concept is a method for manufacturing a plurality of mounting plates (10) to be attached to a housing. The method comprises:

[0151] (I) preparing an assembly panel, the assembly panel comprising: a plurality of mounting panels, each of the plurality of mounting panels comprising a mounting portion (11) and at least one connecting portion (12) connected to the mounting portion; and a frame (3) arranged to surround the mounting panels and combine the mounting panels with each other as an assembly, the at least one connecting portion of each mounting panel being configured to connect the frame to the mounting portion of the corresponding mounting panel;

[0152] (II) mounting the component on the mounting portion of each of the mounting plates according to the designed mounting position of the mounting portion;

[0153] (III) detecting an actual mounting position of the component on the mounting portion of each of the mounting plates;

[0154] (IV) determining whether an actual mounting position of the detected component on the mounting portion of each of the mounting plates deviates from a designed mounting position of the mounting portion of a corresponding one of the mounting plates;

[0155] (V) in response to determining that the detected actual mounting position of the component on the mounting portion of at least one of the mounting boards deviates from the design mounting position of the corresponding mounting portion of at least one of the mounting boards, calculating information about a deviation of the component of the mounting portion of at least one of the mounting boards relative to the design mounting position of the mounting portion of the at least one mounting board;

[0156] (VI) cutting at least one connecting portion of each of the mounting plates to separate each of the mounting plates from the assembly plate accordingly.

[0157] The cutting step includes: in response to determining that the detected actual mounting position of the component on the mounting portion of the at least one mounting plate deviates from the corresponding design mounting position of the mounting portion of the at least one mounting plate, cutting at least one connecting portion of the at least one mounting plate according to the calculated information about the deviation of the component of the mounting portion of the at least one mounting plate relative to the design mounting position of the mounting portion of the at least one mounting plate. The at least one connecting portion of each of the mounting plates is used as at least one attachment member to be attached to the housing after the cutting step. The at least one attachment member of the at least one mounting plate has a configuration defined to be consistent with the calculated information about the deviation of the component relative to the design mounting position of the mounting portion of the at least one mounting plate.

[0158] In a sixth technical concept dependent on the fifth technical concept, the housing has at least an inner peripheral surface to which the mounting plate is attached. At least one attachment member of the mounting plate has an attachment surface to be attached to the inner peripheral surface of the housing. The determination step determines whether the actual mounting position of the detected component on the mounting portion of each mounting plate in the mounting plates deviates from the designed mounting position of the mounting portion of a corresponding one of the mounting plates in the mounting plates so that the component is installed to be inclined relative to the designed mounting position of the mounting portion or linearly deviates from the designed mounting position. The cutting step is such that: (i) the attachment surface of at least one attachment member is formed to have an inclination consistent with the inclination of the designed mounting position of the component relative to the mounting portion; or (ii) at least one attachment member has a specific configuration defined to be consistent with the linear deviation of the designed mounting position of the component relative to the mounting portion.

Claims

1. A mounting plate to be attached to a housing as an attachment target, the mounting plate comprising: part; a mounting portion on which the component is mounted, but deviates from a designed mounting position of the mounting portion; as well as at least one attachment member coupled to the mounting portion, the at least one attachment member configured to attach to the housing, The at least one attachment member includes a configuration defined to be consistent with information regarding a deviation of the designed mounting position of the component relative to the mounting portion.

2. The mounting plate of claim 1, wherein: The housing has at least an inner peripheral surface, and the mounting plate is attached to the inner peripheral surface; The at least one attachment member of the mounting plate has an attachment surface that is attached to the inner peripheral surface of the housing; The component is mounted to be inclined relative to the designed mounting position of the mounting portion or to be linearly deviated from the designed mounting position; and The attachment surface of the at least one attachment member is formed to have an inclination consistent with the inclination of the component relative to the designed installation position of the mounting portion, or the at least one attachment member is formed to have a specific configuration consistent with the linear deviation of the component relative to the designed installation position of the mounting portion.

3. An assembly board comprising: a plurality of mounting plates, each of the mounting plates being a mounting plate according to claim 1; as well as a frame arranged to surround the mounting plates and to combine the mounting plates with each other as an assembly, Each of the mounting plates includes at least one connection portion connected to the mounting portion, the at least one connection portion of each of the mounting plates being configured to be cuttable for separating a corresponding one of the mounting plates from the assembly plate, The at least one joint serves as the at least one attachment member.

4. The mounting plate of claim 1, wherein: The component is an image sensor.

5. A method of manufacturing a plurality of mounting plates to be attached to a housing, the method comprising: Prepare an assembled board, the assembled board comprising: a plurality of mounting plates, each of the mounting plates comprising a mounting portion and at least one coupling portion coupled to the mounting portion; and a frame arranged to surround the mounting plates and combine the mounting plates with each other as an assembly, the at least one connecting portion of each mounting plate being configured to connect the frame with the mounting portion of the corresponding mounting plate; Mounting a component on the mounting portion of each of the mounting plates according to a designed mounting position of the mounting portion; detecting an actual mounting position of the component on the mounting portion of each of the mounting plates; determining whether the detected actual mounting position of the component on the mounting portion of each of the mounting plates deviates from the designed mounting position of the mounting portion of a corresponding one of the mounting plates; responsive to determining that the detected actual mounting position of the component on the mounting portion of at least one of the mounting boards deviates from the corresponding designed mounting position of the mounting portion of the at least one mounting board, calculating information about a deviation of the component of the mounting portion of the at least one mounting board relative to the designed mounting position of the mounting portion of the at least one mounting board; and cutting the at least one connecting portion of each of the mounting plates to separate each of the mounting plates from the assembly plate accordingly, The cutting steps include: In response to determining that the detected actual mounting position of the component on the mounting portion of the at least one mounting board deviates from the corresponding designed mounting position of the mounting portion of the at least one mounting board, cutting the at least one connecting portion of the at least one mounting board according to the calculated information about the deviation of the component of the mounting portion of the at least one mounting board relative to the designed mounting position of the mounting portion of the at least one mounting board, the at least one connecting portion of each of the mounting plates serving as at least one attachment member to be attached to the housing after the cutting step, The at least one attachment feature of the at least one mounting plate includes a configuration defined to be consistent with calculated information regarding a deviation of the designed mounting position of the component relative to the mounting portion of the at least one mounting plate.

6. The method according to claim 5, wherein: The housing has at least an inner peripheral surface, and the mounting plate is attached to the inner peripheral surface; The at least one attachment member of the mounting plate has an attachment surface that is attached to the inner peripheral surface of the housing; The determining step determines whether the detected actual mounting position of the component on the mounting portion of each of the mounting plates deviates from the designed mounting position of the mounting portion of a corresponding one of the mounting plates so that the component is mounted to be inclined relative to the designed mounting position of the mounting portion or linearly deviates from the designed mounting position; and The cutting step causes: (i) the attachment surface of the at least one attachment member to be formed to have an inclination consistent with the inclination of the designed installation position of the component relative to the mounting portion; or (ii) the at least one attachment member to have a specific configuration defined to be consistent with the linear deviation of the designed installation position of the component relative to the mounting portion.

Images