Heat dissipation device and electronic equipment

Abstract

The invention relates to the technical field of electronic equipment accessories, in particular to a heat dissipation device and electronic equipment. According to the heat dissipation device and the electronic equipment, the heat dissipation device comprises a heat dissipation shell and a fan, the heat dissipation shell is arranged on the outer side of an equipment body of the electronic equipment, the fan is arranged in the heat dissipation shell, and the heat dissipation shell is provided with a first air inlet part and a first air outlet part which communicate with each other; the first air inlet part is configured to be arranged corresponding to a first function module of the electronic equipment, and the first air outlet part is configured to be arranged close to a second function module of the electronic equipment. The fan enables the first air inlet part to suck in hot air flow generated by the first function module, so that the hot air flow flows along the interior of the heat dissipation shell and passes through the second function module, and air flows generated by the first function module and the second function module jointly flow out of the first air outlet part, so that heat dissipation of the first function module and the second function module is achieved. And the situation that the electronic equipment is damaged due to too high operating temperature is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment accessories, and in particular to a heat dissipation device and an electronic equipment. Background Art

[0002] As electronic devices (such as mobile phones, tablets, e-books, laptops, etc.) have more and more functions, the use of electronic devices occupies most of people's daily lives. As the use time increases, the heat generated by electronic devices is also increasing. Among them, the source of heat is mainly the central processing unit (CPU) of the electronic device. The CPU generates a lot of heat energy when working, which increases the temperature of the electronic device and affects the service life of the electronic device. However, as an electroacoustic transducer, the speaker of the electronic device also has a serious heating problem when its power consumption is high. Summary of the invention

[0003] The present application discloses a heat dissipation device and an electronic device, which can dissipate heat for a first functional module and a second functional module, thereby preventing the electronic device from being damaged due to excessively high operating temperature.

[0004] In order to achieve the above-mentioned purpose, in a first aspect, the present application discloses a heat dissipation device, which is applied to an electronic device, wherein the electronic device comprises a device body, and a first functional module and a second functional module arranged in the device body, and the heat dissipation device comprises:

[0005] a heat dissipation housing, the heat dissipation housing being configured to be disposed on the outside of the device body, the heat dissipation housing being provided with a first air inlet and a first air outlet which are in communication with each other, the first air inlet being configured to be disposed corresponding to the first functional module, and the first air outlet being configured to be disposed close to the second functional module to discharge a hot air flow generated by the second functional module; and

[0006] A fan is disposed in the heat dissipation housing, and is configured to inhale the hot air flow generated by the first functional module through the first air inlet portion so that the hot air flow flows out along the interior of the heat dissipation housing to the first air outlet portion.

[0007] In some possible embodiments, the heat dissipation shell is provided with a through slot connected to the first air outlet portion corresponding to the second functional module, and the heat dissipation device also includes a heat dissipation component, which is arranged in the through slot, and the heat dissipation component is configured to be close to or contact the area of ​​the device body corresponding to the second functional module to dissipate heat for the second functional module.

[0008] In some possible implementations, the heat dissipation component includes:

[0009] a heat conducting member, the heat conducting member being disposed at the opening of the through slot, the heat conducting member being configured to be close to or in contact with a region of the device body corresponding to the second functional module so as to conduct a heat flow generated by the second functional module; and

[0010] A heat sink, wherein the heat sink is disposed on a side of the heat conductive member away from an opening of the through slot, and the heat sink is located in the heat dissipation housing, the heat sink is disposed corresponding to the first air outlet, and the heat sink is configured to blow an air flow toward the first air outlet through the first air inlet to drive the hot air conducted by the heat sink to flow out toward the first air outlet.

[0011] In some possible implementations, the heat sink forms a plurality of heat dissipation channels in the heat dissipation housing at a position adjacent to the first air outlet, and the plurality of heat dissipation channels are all connected to the first air outlet; and / or,

[0012] The heat dissipation assembly further includes a cooling element, which is located between the heat conducting element and the heat dissipation element. The cooling element has a cold end and a hot end along a thickness direction. The cold end is connected to the heat conducting element, and the hot end is connected to the heat dissipation element.

[0013] In some possible embodiments, the heat dissipation device also includes a guide pipe, which is arranged in the heat dissipation shell, and one end of the guide pipe is provided with a second air inlet, and the second air inlet is configured to flow into the hot air flow sucked into the first air inlet part, and the other end of the guide pipe is provided with a second air outlet connected to the second air inlet, and the second air outlet is configured to be set corresponding to the heat dissipation component so that the hot air flow can flow through the heat dissipation component in a concentrated manner and be discharged to the first air outlet.

[0014] In some possible embodiments, the first air inlet is facing the surface of the device body and is spaced apart from the surface of the device body, the first air inlet is spaced apart from the first air outlet, and the direction of the first air inlet intersects with the direction of the first air outlet, the air inlet surface of the fan faces the first air inlet, and the fan is spaced apart from the first air outlet.

[0015] In some possible implementations, the heat dissipation device further includes a circuit board and a temperature module, the circuit board and the temperature module are arranged in the heat dissipation housing, the temperature module is electrically connected to the circuit board, the temperature module is configured to detect the temperature of the device body and output an electrical signal to the circuit board, and the circuit board is configured to adjust the speed of the fan according to the electrical signal; and / or,

[0016] The heat dissipation housing is configured to be detachably arranged on the device body.

[0017] In a second aspect, the present application also discloses an electronic device, comprising a device body and a heat dissipation device as described in the first aspect above, wherein the heat dissipation device is arranged on the outside of the device body, the device body comprises a first functional module and a second functional module, and the heat dissipation device is configured to dissipate heat from the first functional module and the second functional module.

[0018] In some possible implementations, the device body includes a front side, a back side, and a peripheral side surface enclosed and connected between the front side and the back side, the front side is provided with a display screen, and the heat dissipation housing is located on the back side;

[0019] The first air outlet is arranged toward the peripheral side surface, and the first air inlet is arranged toward the back surface; and / or,

[0020] The first functional module includes a speaker module, and the second functional module includes a CPU module.

[0021] In some possible embodiments, the device body includes relative top and bottom ends, the peripheral side includes two side walls along a first direction, the first air outlet is arranged at least toward one of the side walls and close to the top end, and the side wall is configured as a surface for a user to hold the device body.

[0022] Compared with the prior art, the beneficial effects of this application are:

[0023] The heat dissipation device and electronic device disclosed in the present application are applied to the electronic device. The heat dissipation device includes a heat dissipation housing and a fan. The heat dissipation housing is arranged outside the device body of the electronic device, and the fan is arranged in the heat dissipation housing. The heat dissipation housing is provided with a first air inlet and a first air outlet that are connected. The first air inlet is configured to correspond to the first functional module of the electronic device, and the first air outlet is configured to be close to the second functional module of the electronic device. The first air inlet is sucked into the hot air flow generated by the first functional module by the fan, so that the hot air flow flows along the inside of the heat dissipation housing and passes through the second functional module, and the airflow generated by the two is discharged from the first air outlet together, thereby achieving heat dissipation of the first functional module and the second functional module, and avoiding the electronic device from being damaged due to excessive operating temperature. In addition, since the heat dissipation device can effectively improve the heating condition of the device body, it can effectively improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a structural schematic diagram of an electronic device with a heat sink in the related art;

[0026] Figure 2 A schematic diagram of the structure of an electronic device disclosed in an embodiment of the present application;

[0027] Figure 3 It is an exploded schematic diagram of an electronic device disclosed in an embodiment of the present application;

[0028] Figure 4 A side view of an electronic device disclosed in an embodiment of the present application;

[0029] Figure 5 A schematic diagram of the structure of the heat dissipation device disclosed in an embodiment of the present application;

[0030] Figure 6 A schematic diagram of the structure of the fan, air guide duct, and heat dissipation assembly disclosed in an embodiment of the present application from one perspective;

[0031] Figure 7 A schematic diagram of the structure of the fan, air guide duct, and heat dissipation assembly disclosed in an embodiment of the present application from another perspective;

[0032] Figure 8 This is an exploded view of the fan, air guide duct, and heat dissipation assembly disclosed in the embodiment of the present application.

[0033] Description of reference numerals:

[0034] a-electronic equipment; b-radiator;

[0035] 100-heat dissipation device; 1-heat dissipation housing; 11-first air inlet; 12-first air outlet; 13-through slot;

[0036] 2-fan; 21-air inlet surface;

[0037] 3-heat dissipation assembly; 31-heat conducting member; 311-heat conducting pad; 32-heat dissipation member; 321-heat sink; 3211-heat dissipation channel; 33-refrigeration member; 331-cold end; 332-hot end;

[0038] 4- flow guide pipe; 41- second air inlet; 42- second air outlet;

[0039] 5- clamping part;

[0040] 200-electronic device; 201-equipment body; 2011-front; 2012-back; 2013-side surface; 2013a-side wall surface; 202-first functional module; 202a-speaker module; 203-second functional module; 203a-CPU module; 204-camera module;

[0041] F1-first direction; F2-second direction; S1-top; S2-bottom. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0044] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0045] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0047] As electronic devices (such as mobile phones, tablets, e-books, laptops, etc.) have more and more functions, the use of electronic devices occupies most of people's daily lives. The increase in usage time and the performance of electronic devices will increase the heat generated by electronic devices. To solve the problem of serious heat generation of electronic devices, please refer to Figure 1 , Figure 1Schematic diagram of the structure of an electronic device with a heat sink in the related art. In the related art, heat sink b is mostly used to dissipate heat at a local position of electronic device a, mainly to dissipate heat at the middle part of electronic device a, corresponding to the area of ​​the motherboard. Although such a heat sink design is miniaturized, it cannot take into account the heat dissipation requirements of multiple functional modules.

[0048] Considering that the device body of an electronic device usually includes a CPU module and a speaker module. As the functions of the device body increase and the usage time increases, the performance requirements of the device body are also getting stronger, making the processing power of the CPU module stronger and stronger, which leads to the CPU module generating more and more heat. In addition, as users have higher requirements for the volume and sound quality of the speaker module, the speaker module has a large power in a high-volume scenario, which also makes the speaker module generate more heat.

[0049] The above heating problems will cause the operating temperature of the device body to be too high, resulting in a reduced user experience and damage to the device body. Among them, the speaker module is usually located in the lower middle area of ​​the electronic device, and the CPU module is usually located in the area on the side of the device body away from the camera module. The two are a certain distance away from the device body, and a small radiator cannot dissipate heat for both at the same time.

[0050] In view of this, the present application provides a heat dissipation device and an electronic device, which can use the flowing airflow to achieve common heat dissipation for the first functional module and the second functional module, thereby avoiding the electronic device from being damaged due to excessive operating temperature. At the same time, since the heat dissipation device can effectively improve the heating condition of the device body, the user experience is effectively improved.

[0051] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0052] Please also read Figure 2-Figure 4 , Figure 2 is a schematic diagram of the structure of an electronic device disclosed in an embodiment of the present application, Figure 3 is an exploded schematic diagram of an electronic device disclosed in an embodiment of the present application, Figure 4 The side view of the electronic device disclosed in the embodiment of the present application. The embodiment of the present application provides an electronic device 200, which includes a device body 201 and a heat dissipation device 100, wherein the heat dissipation device 100 is arranged outside the device body 201 so that the heat dissipation device 100 can dissipate heat from the device body 201, thereby preventing the electronic device 200 from being damaged due to excessive operating temperature.

[0053] The device body 201 may include, for example, a shell and a display screen. The shell may include, for example, a middle frame and a back cover. The middle frame and the back cover are enclosed and connected, and the display screen is connected to the middle frame and the back cover. Therefore, the display screen, the middle frame and the back cover jointly define the internal space of the device body 201. The internal space can be used to install functional components of the device body 201, such as a battery, a motherboard, a central processing unit (CPU) module 203, a microphone module, a camera module 204, a mobile communication module, an audio module, a processor, a universal serial bus (USB) interface, a charging management module, a power management module, a charging interface, a headphone interface, a speaker module 202a, and a subscriber identification module (SIM) card interface and other functional components.

[0054] The electronic device 200 in the present application can be used as a smart phone, for example, and its overall shape is usually rectangular, that is, the overall shape of the housing of the device body 201 is usually rectangular. Of course, as other examples, when the electronic device 200 is used as other devices, it can also be in other shapes, such as round, square, trapezoidal, etc., which is not limited in the embodiments of the present application.

[0055] Of course, as other examples, the electronic device 200 may also be other devices such as a tablet computer, a handheld computer, etc.

[0056] Optionally, the device body 201 includes a first functional module 202 and a second functional module 203 , both of which are disposed in the device body, and the heat dissipation device 100 is configured to dissipate heat from the first functional module 202 and the second functional module 203 .

[0057] Optionally, the first functional module 202 and the second functional module 203 may be arranged adjacent to each other, or the first functional module 202 and the second functional module 203 may be arranged at intervals. For example, the first functional module 202 may include but is not limited to the speaker module 202a, and the second functional module 203 may include but is not limited to the CPU module 203a. Usually, the speaker module 202a and the CPU module 203a are arranged at intervals. Thus, the heat dissipation device 100 of the present application can achieve heat dissipation of the two functional modules arranged at intervals at the same time, which is helpful to avoid the electronic device 200 from being damaged due to excessive operating temperature. At the same time, since the heat dissipation device 100 can effectively improve the heating condition of the device body 201, the user experience is effectively improved.

[0058] Of course, it is understandable that the first functional module 202 may also be a CPU module 203a, and the second functional module 203 may also be a speaker module 202a. The two functional modules may be arranged close to each other or adjacent to each other with a small distance between them.

[0059] Considering that the device body 201 of the electronic device 200 usually includes a CPU module 203a and a speaker module 202a. As the functions of the device body 201 become more and more and the use time becomes longer and longer, the performance requirements of the device body 201 become stronger and stronger, so that the processing capacity of the CPU module 203a becomes stronger and stronger, which leads to the increasing heat generation of the CPU module 203a. In addition, due to the increase in the volume and sound quality requirements of the user for the speaker module 202a, the power of the speaker module 202a is relatively large in the high volume scene, so that the heat generation of the speaker module 202a is also relatively serious. The above-mentioned heating problem will cause the operating temperature of the device body 201 to be too high, resulting in the reduction of the user's use experience and the damage of the device body 201. Based on this, the present application improves the heating problem of the CPU module 203a and the speaker module 202a in the device body 201 by adding a heat dissipation device 100 on the back 2012 of the device body 201, thereby reducing the occurrence of damage to the device body 201 due to the heating problem.

[0060] In order to facilitate understanding of the specific structure of the heat dissipation device 100 , the specific structure of the heat dissipation device 100 will be described in detail below with reference to the accompanying drawings.

[0061] Please also read Figure 2 , Figure 5-Figure 6 , Figure 5 is a schematic diagram of the structure of the heat dissipation device disclosed in the embodiment of the present application, Figure 6 The schematic diagram of the structure of the fan, air guide tube, and heat dissipation assembly disclosed in the embodiment of the present application from a perspective. The embodiment of the present application provides a heat dissipation device 100, which is applied to an electronic device 200, and the electronic device 200 includes a device body 201 and a first functional module 202 and a second functional module 203 arranged in the device body 201. The heat dissipation device 100 includes a heat dissipation housing 1 and a fan 2. The heat dissipation housing 1 is configured to be arranged on the outside of the device body 201. The heat dissipation housing 1 is provided with a first air inlet 11 and a first air outlet 12 that are connected. The first air inlet 11 is configured to correspond to the first functional module 202, and the first air outlet 12 is configured to be arranged close to the second functional module 203 to discharge the hot air flow generated by the second functional module 203. At the same time, the fan 2 is arranged in the heat dissipation housing 1, and the fan 2 is configured to inhale the hot air flow generated by the first functional module 202 through the first air inlet 11, so that the hot air flow flows out to the first air outlet 12 along the inside of the heat dissipation housing 1.

[0062] Thus, the fan 2 can inhale the hot air flow at the corresponding position of the first functional module 202 through the first air inlet 11, and the hot air flow flows inside the heat dissipation housing 1 through the air flow direction formed by the fan 2, and flows to the first air outlet 12 close to the second functional module 203. The forced convection formed by the fan 2 enables the air flow to flow through the second functional module 203 and the hot air flow generated by the second functional module 203 to flow out from the first air outlet 12. In this way, the fan 2 can be used to dissipate heat for the first functional module 202 and the second functional module 203, thereby effectively reducing the heat of the corresponding areas of the first functional module 202 and the second functional module 203, and avoiding the damage of the device body 201 due to excessive operating temperature. At the same time, the heat dissipation device 100 can effectively improve the heating condition of the electronic device 200, thereby effectively improving the user experience.

[0063] Please also read Figures 2 to 5 In some embodiments, the device body 201 includes a front side 2011, a back side 2012, and a peripheral side 2013 enclosed and connected between the front side 2011 and the back side 2012. The front side 2011 is provided with a display screen, and the heat dissipation housing 1 of the heat dissipation device 100 is located at the back side 2012. It can be understood that since the front side 2011 is provided with a display screen, the back side 2012 and the peripheral side 2013 enclosed and connected between the front side 2011 and the back side 2012 form the outer shell of the device body 201, and the outer shell includes a middle frame and a back cover, the middle frame and the back cover are enclosed and connected, and the display screen is connected to the middle frame and the back cover. The first functional module 202 and the second functional module 203 are both arranged in the display screen, the middle frame and the back cover to jointly define the internal space of the device body 201, and the heat of the first functional module 202 and the second functional module 203 will be conducted to the outside of the device body 201 through the back cover. Therefore, the heat dissipation housing 1 is located on the back side 2012 of the device body 201 (i.e., the back cover of the housing), and can dissipate heat for the first functional module 202 and the second functional module 203, thereby preventing the electronic device 200 from being damaged due to excessive operating temperature. At the same time, since the heat dissipation device 100 can effectively improve the heating condition of the device body 201, the user experience is effectively improved.

[0064] Optionally, the first air outlet 12 is arranged toward the peripheral side surface 2013, and the first air inlet 11 is arranged toward the back surface 2012. Since the heat of the device body 201 is conducted to the external space of the back surface 2012 of the device body 201 through the back cover, the first air inlet 11 is arranged toward the back surface 2012, and the air suction surface of the fan 2 can be used to correspond to the first air inlet 11, so that the hot air flow on the back surface 2012 of the device body 201 can be sucked into the hot air flow generated by the first functional module 202 through the first air inlet 11, so that the hot air flow flows out to the first air outlet 12 along the inside of the heat dissipation housing 1. The first air outlet 12 is arranged toward the peripheral side surface 2013. On the one hand, the first air outlet 12 needs to avoid being arranged toward the back surface 2012 of the device body 201. This is because the airflow discharged from the first air outlet 12 is a hot airflow. If the first air outlet 12 is arranged toward the back surface 2012 of the device body 201, the hot airflow will return to the back cover, so that the heating problem of the device body 201 cannot be improved, and it is difficult for the device body 201 to achieve heat dissipation. On the other hand, the first air outlet 12 avoids being arranged toward the side of the heat dissipation housing 1 away from the back surface of the device body, which not only allows the hot airflow to be discharged from the external space of the device body 201, but also when the user's hand is toward the back surface 2012 of the device body 201 when holding it, the hot airflow will not blow toward the user's hand, thereby effectively improving the heat dissipation effect of the device body 201 while increasing the user's experience.

[0065] Optionally, the device body 201 includes a top S1 and a bottom S2 opposite to each other, the peripheral side surface 2013 includes two side wall surfaces 2013a along the first direction F1, and the first air outlet 12 is arranged at least toward one of the side wall surfaces 2013a and close to the top S1 of the device body, and the side wall surface 2013a is configured as a surface for the user to hold the device body 201. Since the main ways for the user to hold the device body 201 include horizontal holding and vertical holding, in the horizontal holding mode, the user's holding position is on the top side wall surface and the bottom side wall surface of the peripheral side surface 2013 along the second direction F2. In the vertical holding mode, the user's holding position is at a position where the side wall surface 2013a along the first direction F1 is close to the bottom S2 of the device body 201. At this time, the first air outlet 12 is arranged toward one of the side wall surfaces 2013a along the first direction F1 and close to the top S1 of the device body 201, which can avoid the user's hand and prevent the hot air flow from blowing to the user's hand, thereby improving the user's use experience. Taking a rectangular smart phone as an example, the first direction F1 is the width direction of the mobile phone, and the second direction F2 is the length direction of the mobile phone.

[0066] Optionally, the first air inlet 11 may be, but is not limited to, an air inlet hole, or a combination of an air inlet hole and an air inlet net. Exemplarily, the first air inlet 11 may be an air inlet hole, and there may be multiple air inlet holes, and the multiple air inlet holes may be arranged at intervals, and the aperture and interval of the air inlet holes may be set as needed. For example, the aperture of the air inlet hole may be set smaller, thereby isolating the dust in the air outside the heat dissipation housing 1, and preventing dust from accumulating on the blades of the fan 2 and causing the operating efficiency of the fan 2 to decrease. In addition, the intervals between the air inlet holes may be set smaller, so that the number of air inlet holes is greater, thereby making the first air inlet 11 inhale a larger flow of hot air, thereby improving the heat dissipation effect of the heat dissipation device 100. Among them, the shape of the air inlet hole may be circular, square, rectangular, etc., and the embodiment of the present application does not specifically limit this.

[0067] Optionally, when the heat dissipation device 100 is applied to the electronic device 200 , it can be fixed to the device body 201 of the electronic device 200 , or it can be detachable from the device body 201 .

[0068] For example, the heat dissipation housing 1 of the heat dissipation device 100 can be directly fixed to the device body 201 by, for example, adhesive bonding. Alternatively, the heat dissipation housing 1 of the heat dissipation device 100 can be detachably connected to the device body 201 by, for example, snap-fitting or magnetic attraction.

[0069] The following is an example.

[0070] See also Figure 5 In some embodiments, the heat dissipation housing 1 is configured to be detachably mounted on the device body 201. The detachable design of the heat dissipation device 100 effectively improves the flexibility and expandability of the device body 201, so that the heat dissipation device 100 can be disassembled when the device body 201 does not need to dissipate heat, thereby making the electronic device 200 lighter. In addition, the detachable design can also facilitate the replacement and maintenance of the heat dissipation device 100, making the heat dissipation device 100 more adaptable. The heat dissipation housing 1 can be mounted on the back 2012 of the device body 201 by means of magnetic attraction, clamping, etc.

[0071] Optionally, the heat dissipation device 100 further includes two clamping parts 5, which are respectively arranged on both sides of the heat dissipation housing 1 along the first direction F1, and a limit spring (not shown) is connected between one of the clamping parts 5 and the heat dissipation housing 1. The limit spring changes the clamping distance between the two clamping parts 5, thereby clamping or releasing the device body 201, thereby realizing the detachable design of the heat dissipation device 100 from the device body 201. In this way, the use flexibility and adaptability of the heat dissipation device 100 can be effectively improved.

[0072] Optionally, the clamping portion has a first end and a second end along the first direction F1, the first end is connected to one side of the heat dissipation housing along the first direction F1, and the second end is provided with a hook portion, which is used to hook the side wall surface 2013a of the device body 201. The two clamping portions 5 cooperate together to clamp or release the device body 201, thereby achieving the connection between the heat dissipation device 100 and the device body 201.

[0073] Please refer again Figure 5 In some embodiments, the heat dissipation housing 1 is provided with a through slot 13 connected to the first air outlet 12 at a position corresponding to the second functional module 203, and the heat dissipation device 100 further includes a heat dissipation component 3, which is arranged at the through slot 13. The heat dissipation component 3 is configured to be close to or in contact with the area of ​​the device body 201 corresponding to the second functional module 203, so as to dissipate heat from the second functional module 203. Since the through slot 13 corresponds to the area of ​​the second functional module 203, the heat dissipation component 3 is arranged at the through slot 13 and close to or in contact with the device body 201, so that the heat dissipation component 3 can better conduct the heat of the second functional module 203 to the heat dissipation component 3, thereby improving the heat dissipation effect of the second functional module 203, dissipating the corresponding area of ​​the second functional module 203, and thus avoiding the situation where the electronic device 200 is damaged due to excessively high operating temperature. At the same time, since the heat of the device body 201 is reduced, the user experience can also be effectively improved.

[0074] See also Figure 7 , Figure 7 This is a schematic diagram of the structure of the fan, air guide tube, and heat dissipation assembly disclosed in the embodiment of the present application from another perspective. Optionally, the heat dissipation assembly 3 includes a heat conductive member 31 and a heat dissipation member 32. The heat conductive member 31 is arranged at the opening of the through slot 13. The heat conductive member 31 is configured to be close to or in contact with the area of ​​the device body 201 corresponding to the second functional module 203 to conduct the hot air flow generated by the second functional module 203. By using the heat conductive member 31 to be close to or in contact with the area of ​​the device body 201 corresponding to the second functional module 203, the heat conductive member 31 conducts the hot air flow generated by the second functional module 203, which can effectively improve the heat dissipation effect of the second functional module 203.

[0075] Optionally, the heat conducting member 31 may include a heat conducting pad 311, which is used to fill the air gap between the area of ​​the device body 201 corresponding to the second functional module 203 and the heat dissipating member 32, so that the heat can be efficiently conducted to the heat dissipating member 32, thereby improving the heat dissipation performance of the heat dissipating device 100. The material of the heat conducting pad 311 can be a heat conducting material such as silicone, rubber, plastic, ceramic, metal, etc. The heat conducting pad 311 has the characteristics of heat conduction, waterproofness, and friction resistance, so that when the heat dissipating component 3 is close to or in contact with the device body 201, a good heat conduction effect can be achieved, thereby achieving heat dissipation of the device body 201.

[0076] In addition, the heat sink 32 is arranged on the side of the heat conductor 31 away from the opening of the through slot 13, and the heat sink 32 is located in the heat dissipation housing 1. The heat sink 32 is arranged corresponding to the first air outlet 12. The heat sink 32 is configured to drive the hot air conducted by the heat sink 32 to flow out of the first air outlet 12 through the air flow blown toward the first air outlet 12 by the first air inlet 11. Since the heat sink 32 is arranged on one side of the heat conductor 31, the heat of the heat conductor 31 is conducted to the heat sink 32, and the heat sink 32 can absorb the heat conducted by the heat conductor 31. At the same time, convection is realized by using the air flow blown toward the first air outlet 12 by the first air inlet 11, so that the heat conducted by the heat conductor 31 is taken away by the flowing hot air flow, thereby effectively improving the heat dissipation performance of the heat dissipation device 100.

[0077] See also Figure 8 , Figure 8 The following is an exploded view of the fan, air guide tube, and heat dissipation assembly disclosed in the embodiment of the present application. Optionally, the heat dissipation element 32 forms a plurality of heat dissipation channels 3211 in the heat dissipation housing 1 near the first air outlet 12, and the plurality of heat dissipation channels 3211 are all connected to the first air outlet 12. The airflow of the first air inlet 11 can pass through the plurality of heat dissipation channels 3211 and then flow out of the first air outlet 12, which can effectively improve the convection effect of the hot air flow. The flowing hot air flow can discharge the heat of the second functional module 203 to the first air outlet through the heat dissipation channels 3211, so that the heat dissipation effect of the corresponding area of ​​the second functional module 203 is improved, thereby avoiding the electronic device 200 from being damaged due to excessive operating temperature.

[0078] It is understandable that the heat sink 32 may include a plurality of heat sinks 321 arranged at intervals, and a heat dissipation channel 3211 is formed between two adjacent heat sinks 321, and the heat dissipation channel 3211 can drive the hot air flow conducted by the heat sink 32 to flow out to the first air outlet 12 through the air flow blown from the first air inlet 11 to the first air outlet 12. In addition, the design of the plurality of heat sinks 321 can increase the overall surface area of ​​the heat sink 32, so that the area of ​​heat transfer during the heat dissipation process is increased, thereby effectively improving the heat dissipation effect of the heat sink 32, and further improving the heat dissipation performance of the heat dissipation device 100.

[0079] At the same time, the heat sink 321 can be made of metal materials such as aluminum, copper, and silver. The metal material has good thermal conductivity and can effectively exchange the heat conducted by the heat conductor 31 on the heat sink, thereby improving the heat dissipation performance and heat dissipation effect of the heat dissipation device 100. The shape of the heat sink 321 can be rectangular, square, etc., which is not limited in the embodiment of the present application.

[0080] Optionally, the heat dissipation assembly 3 further includes a refrigeration element 33, which is located between the heat conductive element 31 and the heat dissipation element 32. The refrigeration element 33 has a cold end 331 and a hot end 332 along the thickness direction, the cold end 331 is connected to the heat conductive element 31, and the hot end 332 is connected to the heat dissipation element 32. The cold end 331 of the refrigeration element 33 is connected to the heat conductive element 31, so that the lower temperature of the cold end 331 and the higher temperature of the heat conductive element 31 are heat-transferred, and when the temperature of the heat conductive element 31 drops, the device body 201 close to or in contact with the heat conductive element 31 can transfer heat with the heat conductive element 31, thereby dissipating heat from the device body 201. In addition, the hot end 332 of the refrigeration element 33 is connected to the heat sink 32, and the heat generated by the refrigeration element 33 is transferred by the heat sink 32, and the airflow from the first air inlet 11 to the first air outlet 12 is used to realize forced convection of the heat sink 32, thereby accelerating the convection heat dissipation effect of the heat sink 100, and further improving the heat dissipation performance of the heat sink 100. In addition, since the temperature of the cold end 331 of the refrigeration element 33 is relatively low, condensed water will be formed at the cold end 331, and the heat conductive element 31 can also play a waterproof role, preventing the condensed water generated by the refrigeration element 33 from flowing to the device body 201, thereby avoiding damage to the electronic device 200.

[0081] Among them, the refrigeration component 33 may include a semiconductor refrigeration plate, which can make the two ends of the galvanic couple a cold end 331 that absorbs heat and a hot end 332 that releases heat when direct current passes through a galvanic couple formed by two different semiconductor materials in series. The heat conductor 31 is connected to the cold end 331, and the heat sink 32 is connected to the hot end 332. The heat generated by the second functional module 203 can be transferred and dissipated by forced convection of the heat sink 32 and the fan 2, thereby achieving the heat dissipation effect of the heat dissipation component 3 on the second functional module 203, thereby improving the heat dissipation performance of the heat dissipation device 100.

[0082] Optionally, the heat dissipation assembly 3 further includes a first heat conduction layer (not shown) and a second heat conduction layer (not shown), the first heat conduction layer is arranged between the heat conduction member 31 and the cooling member 33, and the second heat conduction layer is arranged between the heat dissipation member 32 and the cooling member 33, the first heat conduction layer and the second heat conduction layer can effectively reduce the air gap between the heat conduction member 31 and the cooling member 33, and between the heat dissipation member 32 and the cooling member 33, so that the two surfaces are in full contact, thereby improving the heat conduction effect between the heat conduction member 31 and the cooling member 33, and between the heat dissipation member 32 and the cooling member 33, and further improving the heat dissipation effect of the heat dissipation assembly 3. Among them, the material of the first heat conduction layer and the second heat conduction layer can be thermal conductive silicone grease.

[0083] Please refer again Figure 8Optionally, the heat dissipation device 100 further includes a guide tube 4, which is disposed in the heat dissipation housing 1. A second air inlet 41 is disposed at one end of the guide tube 4. The second air inlet 41 is configured to flow into the hot air flow sucked by the first air inlet 11. A second air outlet 42 connected to the second air inlet 41 is disposed at the other end of the guide tube 4. The second air outlet 42 is configured to be arranged corresponding to the heat dissipation component 3 so that the hot air flow is concentrated to flow through the heat dissipation component 3 and discharged to the first air outlet 12. The guide tube 4 can concentrate the hot air flow sucked by the first air inlet 11, and correspondingly concentrate it to flow to the heat dissipation channel 3211 of the heat dissipation element 32, and then be discharged from the first air outlet 12. The design of the guide tube 4 can concentrate the air flow, effectively improve the effect of forced convection in the heat dissipation device 100, and thus improve the heat dissipation performance of the heat dissipation device 100.

[0084] In some embodiments, the first air inlet 11 and the device body 201 (see Figure 2 , Figure 3 ) and are spaced apart from the surface of the device body 201, the first air inlet 11 and the first air outlet 12 are spaced apart, and the direction of the first air inlet 11 intersects with the direction of the first air outlet 12, the air inlet surface 21 of the fan 2 faces the first air inlet 11, and the fan 2 and the first air outlet 12 are spaced apart. Since the fan 2 generates suction and thrust through rotating blades to drive the air flow, the air inlet surface 21 of the fan 2 requires sufficient space to inhale air. Therefore, the first air inlet 11 is spaced apart from the surface of the device body 201, which can provide space for the air inlet surface 21 of the fan 2, thereby improving the rotation efficiency of the fan 2 and the flow speed of the airflow, thereby improving the heat dissipation performance of the heat dissipation device 100. At the same time, compared with the existing radiator in which the air inlet surface of the fan is set toward the side away from the device body, the present application sets the air inlet surface 21 of the fan 2 toward the first functional module 202, so as to effectively utilize the air inlet surface 21 of the fan 2, so that the heat dissipation device 100 can suck the hot air flow generated by the first functional module 202 through the first air inlet part 11 and dissipate heat.

[0085] In addition, the first air inlet 11 and the first air outlet 12 are arranged at intervals, and the direction of the first air inlet 11 intersects with the direction of the first air outlet 12. Since the first air inlet 11 is facing the back side 2012 of the device body 201, the air outlet of the first air outlet 12 intersects with the air inlet of the first air inlet 11, that is, the hot air flow discharged from the heat dissipation device 100 will not blow toward the user's hands, thereby improving the user's experience.

[0086] At the same time, the interval between the first air inlet 11 and the surface of the device body 201 is 0.8mm-1.5mm. Exemplarily, the interval between the first air inlet 11 and the surface of the device body 201 includes but is not limited to 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc. When the interval between the first air inlet 11 and the surface of the device body 201 is too small, the air inlet surface 21 of the fan 2 does not have enough air inlet space, which will reduce the speed and flow rate of air inflow, thereby reducing the heat dissipation performance of the heat dissipation device 100. When the interval between the first air inlet 11 and the surface of the device body 201 is too large, the air suction performance of the fan 2 for the hot air flow generated by the device body 201 is reduced, and the heat generated by the first functional module 202 corresponding to the first air inlet 11 cannot be effectively sucked into the heat dissipation device 100, so that the heat dissipation effect of the heat dissipation device 100 on the device body 201 is reduced.

[0087] In some embodiments, the heat dissipation device 100 further includes a circuit board (not shown) and a temperature module (not shown). The circuit board and the temperature module are arranged in the heat dissipation housing 1. The temperature module is electrically connected to the circuit board. The temperature module is used to detect the temperature of the device body 201 and output an electrical signal to the circuit board. The circuit board can adjust the speed of the fan 2 according to the electrical signal, thereby realizing the regulation of the heat dissipation performance of the heat dissipation device 100. The heat dissipation device 100 can operate with a lower heat dissipation efficiency when the temperature of the device body 201 is low, and operate with a higher heat dissipation efficiency when the temperature of the device body 201 is high, thereby improving the heat dissipation effect of the heat dissipation device 100 on the heat dissipation housing 1. At the same time, it can also effectively reduce the energy consumption of the heat dissipation device 100 and extend the use time of the power supply of the heat dissipation device 100. It can be understood that the heat dissipation device 100 also includes a power socket (not shown), which is arranged at a through hole of the heat dissipation housing 1. The power socket is electrically connected to the circuit board and is used to supply power to the circuit board. The power socket can be connected to an external power supply to supply power to the circuit board.

[0088] It is understandable that the temperature module can be a thermistor, a thermocouple, an infrared sensor, etc. Among them, the thermistor has a higher temperature measurement accuracy and a faster response speed. Since the temperature of the device body 201 is greatly affected by the external environment, the thermistor can meet the heat dissipation requirements of the heat dissipation device 100 for the device body 201 quickly and efficiently, thereby improving the heat dissipation performance and heat dissipation effect of the heat dissipation device 100.

[0089] The following is a brief description of the heat dissipation method of the heat dissipation device 100 during use:

[0090] Combination Figure 2 and Figure 4The dotted arrow in the figure shows the flow direction of the airflow of the heat dissipation device during the heat dissipation process. First, the heat dissipation device 100 is set on the outside of the device body 201. At this time, the first air inlet 11 is set corresponding to the first functional module 202, and the first air outlet 12 is set close to the second functional module 203. The air inlet surface 21 of the fan 2 corresponds to the first air inlet 11. The fan 2 is used to suck the hot air flow in the area corresponding to the first functional module 202 into the heat dissipation housing 1, and the hot air flow is concentrated to the heat dissipation component 3 through the air guide 4. Among them, the heat dissipation component 3 is used to approach or contact the area corresponding to the second functional module 203 of the device body 201 to dissipate the heat of the second functional module 203. Through the forced convection of the fan 2, the airflow flowing out through the air guide 4 passes through the heat dissipation component 3, and the hot air flow of the heat dissipation component 3 is discharged from the first air outlet 12, thereby achieving heat dissipation of the first functional module 202 and the second functional module 203.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, applied to electronic equipment, characterized in that: The electronic device comprises a device body, and a first functional module and a second functional module arranged in the device body, and the heat dissipation device comprises: a heat dissipation housing, the heat dissipation housing being configured to be disposed on the outside of the device body, the heat dissipation housing being provided with a first air inlet and a first air outlet which are in communication with each other, the first air inlet being configured to be disposed corresponding to the first functional module, and the first air outlet being configured to be disposed close to the second functional module to discharge a hot air flow generated by the second functional module; and A fan is disposed in the heat dissipation housing, and is configured to inhale the hot air flow generated by the first functional module through the first air inlet portion so that the hot air flow flows out along the interior of the heat dissipation housing to the first air outlet portion.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation shell is provided with a through slot connected to the first air outlet portion corresponding to the second functional module. The heat dissipation device also includes a heat dissipation component, which is arranged in the through slot. The heat dissipation component is configured to be close to or contact the area of ​​the device body corresponding to the second functional module to dissipate heat for the second functional module.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation component comprises: a heat conducting member, the heat conducting member being disposed at the opening of the through slot, the heat conducting member being configured to be close to or in contact with a region of the device body corresponding to the second functional module so as to conduct a heat flow generated by the second functional module; and A heat sink, wherein the heat sink is disposed on a side of the heat conductive member away from an opening of the through slot, and the heat sink is located in the heat dissipation housing, the heat sink is disposed corresponding to the first air outlet, and the heat sink is configured to blow an air flow toward the first air outlet through the first air inlet to drive the hot air conducted by the heat sink to flow out toward the first air outlet.

4. The heat dissipation device according to claim 3, characterized in that: The heat dissipation element enables the heat dissipation housing to form a plurality of heat dissipation channels at a position adjacent to the first air outlet, and the plurality of heat dissipation channels are all connected to the first air outlet; and / or, The heat dissipation assembly further includes a cooling element, which is located between the heat conducting element and the heat dissipation element. The cooling element has a cold end and a hot end along a thickness direction. The cold end is connected to the heat conducting element, and the hot end is connected to the heat dissipation element.

5. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device also includes a guide pipe, which is arranged in the heat dissipation shell, and one end of the guide pipe is provided with a second air inlet, and the second air inlet is configured to flow into the hot air flow sucked by the first air inlet part, and the other end of the guide pipe is provided with a second air outlet connected with the second air inlet, and the second air outlet is configured to be set corresponding to the heat dissipation component so that the hot air flow can flow through the heat dissipation component in a concentrated manner and be discharged to the first air outlet.

6. The heat dissipation device according to claim 1, characterized in that: The first air inlet portion faces the surface of the device body and is spaced apart from the surface of the device body, the first air inlet portion is spaced apart from the first air outlet portion, and the direction of the first air inlet portion intersects with the direction of the first air outlet portion, the air inlet surface of the fan faces the first air inlet portion, and the fan is spaced apart from the first air outlet portion.

7. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation device further includes a circuit board and a temperature module, wherein the circuit board and the temperature module are arranged in the heat dissipation housing, the temperature module is electrically connected to the circuit board, the temperature module is configured to detect the temperature of the device body and output an electrical signal to the circuit board, and the circuit board is configured to adjust the speed of the fan according to the electrical signal; and / or, The heat dissipation housing is configured to be detachably arranged on the device body.

8. An electronic device, characterized in that: It includes a device body and a heat dissipation device as described in any one of claims 1 to 7, wherein the heat dissipation device is arranged on the outside of the device body, the device body includes a first functional module and a second functional module, and the heat dissipation device is configured to dissipate heat from the first functional module and the second functional module.

9. The electronic device according to claim 8, characterized in that: The device body comprises a front side, a back side and a peripheral side surface enclosed and connected between the front side and the back side, the front side is provided with a display screen, and the heat dissipation housing is located on the back side; The first air outlet is arranged toward the peripheral side surface, and the first air inlet is arranged toward the back surface; and / or, The first functional module includes a speaker module, and the second functional module includes a CPU module.

10. The electronic device according to claim 9, characterized in that: The device body includes a relative top and bottom end, the peripheral side includes two side walls along a first direction, the first air outlet is arranged at least toward one of the side walls and close to the top end, and the side wall is configured as a surface for a user to hold the device body.

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