Display panel, display device and preparation method of display panel

Abstract

The invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a substrate, an isolation structure, a light-emitting function layer and a first packaging layer, the isolation structure is arranged on one side of the substrate, and the isolation structure is enclosed to form an opening structure. The light-emitting functional layer is arranged on one side of the substrate, and the light-emitting functional layer comprises a plurality of light-emitting structures arranged in the opening structure. The first packaging layer is arranged on the side, away from the substrate, of the light-emitting functional layer and comprises a plurality of packaging parts arranged corresponding to the light-emitting structures. Wherein the thicknesses of the packaging parts corresponding to at least part of the light-emitting structures with different colors are different. According to the embodiment of the invention, the thickness of the packaging part corresponding to the light-emitting structure which is prepared and formed previously is larger, so that the risk that the packaging part corresponding to the light-emitting structure which is formed previously is damaged due to subsequent etching treatment of the light-emitting structure and part of the light-emitting structure fails is reduced, and the use reliability of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Flat display panels such as Organic Light Emitting Display (OLED) panels and display panels using light emitting diode (LED) devices have the advantages of high image quality, power saving, thin body and wide application range. They are widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc., becoming the mainstream in display devices. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve reliability.

[0004] In a first aspect, an embodiment of the present application provides a display panel, the display panel includes a substrate, an isolation structure, a light-emitting functional layer and a first encapsulation layer, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses an opening structure. The light-emitting functional layer is arranged on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting structures arranged in the opening structure. The first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, and the first encapsulation layer includes a plurality of encapsulation parts arranged corresponding to the light-emitting structures. Among them, the thickness of the encapsulation parts corresponding to at least some of the light-emitting structures of different colors is different.

[0005] In some embodiments, the packaging portion includes a first portion, an orthographic projection of the first portion on the substrate is located outside an orthographic projection of the isolation structure on the substrate, and at least some of the first portions corresponding to light-emitting structures of different colors have different thicknesses.

[0006] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate. The orthographic projection of the first part on the substrate is located outside the orthographic projection of the second isolation portion on the substrate.

[0007] In some embodiments, the display panel further comprises a first electrode layer disposed on a side of the light-emitting functional layer away from the substrate, the first electrode layer comprising a plurality of first electrodes disposed at intervals. The first isolation portion comprises a conductive material, and the first electrode overlaps the first isolation portion.

[0008] In some embodiments, the plurality of light-emitting structures include a first light-emitting structure and a second light-emitting structure having different colors, and the stability of the light-emitting material in the first light-emitting structure is greater than the stability of the light-emitting material in the second light-emitting structure.

[0009] The multiple encapsulation parts include a first encapsulation part located on a side of the first light emitting structure away from the substrate, and a second encapsulation part located on a side of the second light emitting structure away from the substrate, and the thickness of the first encapsulation part is greater than that of the second encapsulation part.

[0010] In some embodiments, the first light emitting structure is used to emit red light or green light, and the second light emitting structure is used to emit blue light.

[0011] In some embodiments, the plurality of light-emitting structures further include a third light-emitting structure having a color different from the first light-emitting structure and the second light-emitting structure, and the stability of the light-emitting material in the second light-emitting structure is greater than the stability of the light-emitting material layer in the third light-emitting structure.

[0012] The multiple encapsulation parts include a third encapsulation part located at a side of the third light emitting structure away from the substrate, and the thickness of the second encapsulation part is greater than that of the third encapsulation part.

[0013] In some embodiments, the first light emitting structure is used to emit red light, the second light emitting structure is used to emit green light, and the third light emitting structure is used to emit blue light.

[0014] In some embodiments, the multiple light-emitting structures include a first light-emitting structure and a second light-emitting structure with different colors, the multiple packaging parts include a first packaging part located on the side of the first light-emitting structure away from the substrate, and a second packaging part located on the side of the second light-emitting structure away from the substrate, and the etching selection ratio of the second packaging part to the first packaging part is SR1, SR1≥1.

[0015] In some embodiments, an etching selectivity ratio of the third packaging portion to the second packaging portion is SR2, and SR2≥1.

[0016] In some embodiments, SR1=1, and the first encapsulation portion and the second encapsulation portion are made of the same material.

[0017] In some embodiments, SR1>1, the first encapsulation portion includes silicon oxide, and the second encapsulation portion includes silicon oxynitride.

[0018] In some embodiments, SR2>1, the second encapsulation portion includes silicon oxynitride, and the third encapsulation portion includes silicon nitride.

[0019] In some embodiments, the display panel further includes a first electrode layer disposed between the light-emitting functional layer and the first encapsulation layer, and the first electrode layer includes a plurality of first electrodes disposed corresponding to the plurality of light-emitting structures.

[0020] In some embodiments, at least some of the light emitting structures of different colors have different thicknesses of the first electrodes corresponding to them.

[0021] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion sequentially arranged in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate. The first isolation portion includes a conductive material, and the first electrode is overlapped with the first isolation portion.

[0022] In some embodiments, the display panel further includes a second encapsulation layer disposed on a side of the first encapsulation layer away from the substrate, the second encapsulation layer covers a plurality of encapsulation portions, and the second encapsulation layer includes a first surface away from the substrate, the first surface being parallel to a plane where the substrate is located.

[0023] In some embodiments, the second encapsulation layer may include an organic material.

[0024] In some embodiments, the display panel further includes a third encapsulation layer disposed on a side of the second encapsulation layer facing away from the substrate, and the third encapsulation layer covers the plurality of encapsulation parts.

[0025] In some embodiments, the first encapsulation layer and the third encapsulation layer include inorganic materials.

[0026] In some embodiments, the thickness of the packaging part corresponding to the light emitting structures of different colors is different.

[0027] In some embodiments, the encapsulation parts corresponding to light emitting structures of the same color have the same thickness.

[0028] In a second aspect, an embodiment of the present application provides a display panel, the display panel includes a substrate, an isolation structure, a light-emitting functional layer and a first encapsulation layer, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses an opening structure. The light-emitting functional layer is arranged on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting structures arranged in the opening structure. The first encapsulation layer is arranged on the side of the light-emitting functional layer away from the substrate, and the first encapsulation layer includes a plurality of encapsulation parts arranged corresponding to the light-emitting structures. Among them, the materials of the encapsulation parts corresponding to at least some of the light-emitting structures of different colors are different.

[0029] In a third aspect, an embodiment of the present application provides a flexible display device, comprising the display panel in any of the aforementioned embodiments.

[0030] In a fourth aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0031] An isolation structure is formed on one side of the substrate, and the isolation structure encloses an opening structure;

[0032] forming a first light emitting structure in each opening structure and a first packaging material layer covering each first light emitting structure;

[0033] The first packaging material layer is patterned to form a first packaging portion corresponding to a portion of the first light-emitting structure, and the first light-emitting structure in a portion of the opening structure is removed. The etching time corresponding to the first packaging material layer is H1.

[0034] forming a second light emitting structure in each opening structure and a second packaging material layer covering each second light emitting structure, wherein the thickness of the first packaging material layer is greater than the thickness of the second packaging material layer;

[0035] The second packaging material layer is patterned to form a second packaging portion corresponding to a portion of the second light emitting structure, and the second light emitting structure in a portion of the opening structure is removed. The corresponding etching time of the second packaging material layer is H2, wherein H1>H2.

[0036] The embodiments of the present application provide a display panel, a display device and a method for preparing a display panel. According to the preparation order of the light-emitting structures inside the display panel, the thickness of the packaging parts corresponding to at least some of the light-emitting structures of different colors can be set differently, so that the thickness of the packaging parts corresponding to the light-emitting structures prepared previously is larger, thereby reducing the risk of damage to the packaging parts corresponding to the light-emitting structures formed previously due to subsequent etching treatments of the light-emitting structures and the corresponding packaging materials, thereby reducing the risk of failure of some light-emitting structures, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] Figure 1 is a schematic cross-sectional structure diagram of a display panel provided in an embodiment of the present application;

[0039] Figure 2 yes Figure 1 Schematic diagram of the enlarged structure of the middle region Q;

[0040] Figure 3 This is a top view structural diagram of another isolation structure and light-emitting structure in a display panel provided in an embodiment of the present application.

[0041] Figure 4 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0042] Figure 5 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0043] Figure 6 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0044] Figure 7 is a structural schematic diagram of a display device provided in an embodiment of the present application;

[0045] Figure 8 is a flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0046] Figures 9a to 9e It is a process structure schematic diagram of a method for preparing a display panel provided in an embodiment of the present application;

[0047] Fig.10 It is a schematic diagram of the cross-sectional structure of another display panel provided in an embodiment of the present application.

[0048] Marking Description:

[0049] 10. Substrate;

[0050] 20. Isolation structure; 21. Opening structure; 22. First isolation part; 23. Second isolation part;

[0051] 30. Light-emitting functional layer; 31. Light-emitting structure; 31a. First light-emitting structure; 31b. Second light-emitting structure; 31c. Third light-emitting structure;

[0052] 40, first encapsulation layer; 41, encapsulation part; 41a, first encapsulation part; 41b, second encapsulation part; 41c, third encapsulation part; 411, first part; 412, second part;

[0053] 50. first electrode layer; 51. first electrode;

[0054] 60. second electrode layer; 61. second electrode;

[0055] 70. A second encapsulation layer;

[0056] 80. The third encapsulation layer;

[0057] 41a', a first packaging material layer; 41b', a second packaging material layer;

[0058] X, thickness direction. DETAILED DESCRIPTION

[0059] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0060] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0061] In the related art, an isolation structure may be provided in the display panel, and the isolation structure is used to separate different light-emitting structures. However, during the use of the display panel, display failure may easily occur.

[0062] The inventors have discovered through research that this is because during the preparation of the display panel, the material used to form a light-emitting structure of a specific color and the packaging material corresponding to the light-emitting structure will fall into the opening structure formed by the isolation structure. Then, it is necessary to use an etching process to remove the packaging material in part of the opening structure and the material that forms the light-emitting structure of a specific color to complete the preparation of the light-emitting structure and the corresponding packaging part. Thereafter, the above process is repeated to form materials of other light-emitting structures of specific colors and packaging materials corresponding to the light-emitting structure in each opening structure, and then the packaging materials in part of the opening structure and the corresponding light-emitting structure are removed through etching and other processes. In this process, the etching process corresponding to the light-emitting structure formed later is likely to damage the light-emitting structure formed previously and the packaging material corresponding thereto, thereby causing some of the light-emitting structures to fail and resulting in the risk of display abnormalities.

[0063] In view of this, first of all, please refer to Figure 1 and Figure 2The embodiment of the present application provides a display panel, which includes a substrate 10, an isolation structure 20, a light-emitting functional layer 30 and a first encapsulation layer 40. The isolation structure 20 is arranged on one side of the substrate 10, and the isolation structure 20 encloses an opening structure 21. The light-emitting functional layer 30 is arranged on one side of the substrate 10, and the light-emitting functional layer 30 includes a plurality of light-emitting structures 31 arranged in the opening structure 21. The first encapsulation layer 40 is arranged on the side of the light-emitting functional layer 30 away from the substrate 10, and the first encapsulation layer 40 includes a plurality of encapsulation parts 41 arranged corresponding to the light-emitting structures 31. Among them, the thickness of the encapsulation parts 41 corresponding to at least some of the light-emitting structures 31 of different colors is different.

[0064] The substrate 10 mainly plays a supporting role, and other film layers are stacked on the substrate 10 in sequence. The stacking arrangement mentioned here means that the other film layers are arranged in sequence along the thickness direction X of the substrate 10. Among them, a variety of film layer structures can be arranged in the substrate 10, and the specific film layer structure composition of the substrate 10 is not limited in the embodiment of the present application.

[0065] The isolation structure 20 may be located on the pixel definition layer, or the isolation structure 20 may be located on the planarization layer. The location of the isolation structure 20 is not specifically limited herein.

[0066] The isolation structure 20 and the light-emitting functional layer 30 are located on the same side of the substrate 10. The isolation structure 20 encloses a plurality of opening structures 21. The size and shape of the isolation structure 20 are not limited in the embodiment of the present application. Figures 1 to 3 The orthographic projection of the isolation structure 20 on the substrate 10 is a mesh structure.

[0067] The light-emitting functional layer 30 includes a plurality of light-emitting structures 31, which are arranged in a plurality of opening structures 21. The plurality of light-emitting structures 31 include but are not limited to a red light-emitting structure 31 for emitting red light, a green light-emitting structure 31 for emitting green light, and a blue light-emitting structure 31 for emitting blue light. Each light-emitting structure 31 may include a stacked hole injection layer (HOL), a hole transport layer (HTL), a light-emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL).

[0068] The plurality of opening structures 21 enclosed by the isolation structure 20 may correspond to the light emitting structures 31 one to one, and one light emitting structure 31 is disposed in one opening structure 21. Alternatively, a plurality of light emitting structures 31 are disposed in one opening structure 21, for example, a plurality of light emitting structures 31 of the same color are disposed in one opening structure 21.

[0069] The first encapsulation layer 40 is located on the side of the light-emitting functional layer 30 away from the substrate 10 . The first encapsulation layer 40 can be used to protect the light-emitting structure 31 to reduce the probability of water and oxygen invading the light-emitting structure 31 , thereby improving the reliability of the light-emitting structure 31 .

[0070] The first encapsulation layer 40 includes a plurality of encapsulation parts 41, each of which is respectively arranged corresponding to each light emitting structure 31 to achieve encapsulation of the light emitting structure 31. In some embodiments, the plurality of light emitting structures 31 are arranged in a one-to-one correspondence with the plurality of encapsulation parts 41, thereby achieving independent encapsulation of the light emitting structure 31. Alternatively, one encapsulation part 41 is arranged corresponding to the plurality of light emitting structures 31, and the plurality of light emitting structures 31 are encapsulated by one encapsulation part 41, for example, a plurality of light emitting structures 31 of the same color are encapsulated by one encapsulation part 41.

[0071] On this basis, in the embodiment of the present application, the thickness of the packaging portion 41 corresponding to at least some of the light emitting structures 31 of different colors is set to be different, so as to reduce the probability of failure of the light emitting structure 31 .

[0072] Specifically, taking the preparation of the red light-emitting structure 31 before the green light-emitting structure 31 as an example, due to the existence of the isolation structure 20, the red light-emitting structure 31 and the corresponding encapsulation part 41 will be prepared and formed before the green light-emitting structure 31. Then, according to the preparation sequence, the embodiment of the present application can adjust the thickness of the encapsulation part 41 corresponding to the red light-emitting structure 31 to increase appropriately, so that its thickness is greater than the thickness of the encapsulation part 41 corresponding to the green light-emitting structure 31. In this way, when the green light-emitting structure 31 is etched and prepared, the probability of the encapsulation part 41 corresponding to the red light-emitting structure 31 being completely etched and removed can be reduced, thereby ensuring the effective encapsulation of the red light-emitting structure 31, reducing the risk of failure of the red light-emitting structure 31, and improving the reliability of the display panel.

[0073] In addition, for each light emitting structure 31 of different colors, the thickness of the corresponding packaging part 41 can be set differently as needed, or the thickness of the corresponding packaging part 41 can be set to be the same as needed. The embodiment of the present application is not limited to this, as long as the thickness of the packaging part 41 corresponding to some light emitting structures 31 of different colors in the display panel is different.

[0074] In summary, the embodiments of the present application can set the thickness of the packaging part 41 corresponding to at least some of the light emitting structures 31 of different colors to be different according to the preparation order of the light emitting structure 31 inside the display panel, so that the thickness of the packaging part 41 corresponding to the previously prepared light emitting structure 31 is larger, thereby reducing the risk of damage to the packaging part 41 corresponding to the previously formed light emitting structure 31 due to subsequent etching treatment of the light emitting structure 31 and the corresponding packaging material, thereby reducing the risk of failure of some light emitting structures 31, thereby improving the reliability of the display panel.

[0075] In some embodiments, the isolation structure 20 may be an integrated structure, such as an inverted trapezoidal structure, which may be formed by a layer of material. Alternatively, the isolation structure 20 may be a split structure, such as a T-shaped structure or an I-shaped structure, which may be formed by multiple layers of material. The shape of the isolation structure 20 is not limited here, and the isolation structure 20 may be able to isolate the light-emitting functional layer.

[0076] In some embodiments, the packaging portion 41 includes a first portion 411 , the orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the isolation structure 20 on the substrate 10 , and at least some of the light emitting structures 31 of different colors have different thicknesses of the first portion 411 .

[0077] The packaging part 41 includes a first portion 411 and a second portion 412. The first portion 411 corresponds to the opening structure 21, that is, the orthographic projection of the first portion 411 on the substrate 10 can cover the orthographic projection of the light emitting structure 31 on the substrate 10, and the orthographic projection of the second portion 412 on the substrate 10 is located within the orthographic projection of the isolation structure 20 on the substrate 10. Figure 2 In the figure, the boundary between the first part 411 and the second part 412 is indicated by a dotted line.

[0078] Generally, the first part 411 plays a major role in packaging the light emitting structure 31. If the first part 411 is damaged due to the etching process, it is easy to cause the risk of failure of the corresponding light emitting structure 31. In view of this, the embodiment of the present application sets the thickness of the first part 411 corresponding to at least some of the light emitting structures 31 of different colors to be different, ensuring that the thickness of the first part 411 in the packaging part 41 corresponding to at least some of the light emitting structures 31 prepared first is as large as possible, thereby reducing the probability of the subsequent etching process completely damaging the previously formed first part 411, thereby ensuring that each light emitting structure 31 can emit light reliably and improving the light emission reliability of the display panel.

[0079] It should be noted that, for the second portion 412, the second portion 412 is connected to the first portion 411. Since the orthographic projection of the second portion 412 on the substrate 10 is located within the orthographic projection of the isolation structure 20 on the substrate 10, that is, the second portion 412 is located outside the opening structure 21, whether the second portion 412 is damaged usually has little effect on the light-emitting structure 31. Therefore, the thickness of the second portion 412 corresponding to the light-emitting structures 31 of different colors can be set to be the same or different. Optionally, the thickness of the second portion 412 corresponding to at least some of the light-emitting structures 31 of different colors is the same.

[0080] In some embodiments, Figure 1 and Figure 2 As shown, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 which are sequentially arranged in a direction away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The orthographic projection of the first portion 411 on the substrate 10 is located outside the orthographic projection of the second isolation portion 23 on the substrate 10.

[0081] The isolation structure 20 includes at least two structures, namely, a first isolation part 22 and a second isolation part 23. The specific sizes of the first isolation part 22 and the second isolation part 23 are not limited in the embodiment of the present application. For example, the orthographic projections of the first isolation part 22 and the second isolation part 23 on the substrate 10 are both mesh structures.

[0082] Since the orthographic projection of the first isolating portion 22 on the substrate 10 is located within the orthographic projection of the second isolating portion 23 on the substrate 10, that is, the second isolating portion 23 is at least partially arranged beyond the first isolating portion 22 in a direction parallel to the plane where the substrate 10 is located. This design helps in the preparation process of the light-emitting structure 31, so that the light-emitting material falling into the opening structure 21 can be separated from the light-emitting material located on the side of the second isolating portion 23 away from the substrate 10, thereby meeting the preparation requirements of the light-emitting structure 31.

[0083] In some embodiments, Figure 1 and Figure 2 As shown, the plurality of light emitting structures 31 include a first light emitting structure 31 a and a second light emitting structure 31 b having different colors, and the stability of the light emitting material in the first light emitting structure 31 a is greater than the stability of the light emitting material in the second light emitting structure 31 b.

[0084] The plurality of encapsulation parts 41 include a first encapsulation part 41a located on the side of the first light emitting structure 31a away from the substrate 10, and a second encapsulation part 41b located on the side of the second light emitting structure 31b away from the substrate 10. The thickness of the first encapsulation part 41a is greater than that of the second encapsulation part 41b.

[0085] The "luminescence stability" mentioned in the embodiments of the present application refers to the time it takes for the luminescent material to fail under certain conditions. The higher the luminescence stability, the less likely the corresponding luminescent structure 31 will fail, and its service life will usually be longer.

[0086] In the related art, the preparation order of the light emitting structures 31 in the display panel may be determined according to the light emitting stability corresponding to different light emitting structures 31. Specifically, the light emitting structure 31 with high light emitting stability is usually prepared first, that is, the light emitting structure 31 that is not prone to failure and deformation is prepared first, and then the light emitting structure 31 with poor light emitting stability is prepared. Furthermore, the preparation order of the first light emitting structure 31a is usually before the preparation order of the second light emitting structure 31b.

[0087] In view of this, in the embodiment of the present application, according to the preparation sequence corresponding to the light-emitting structure 31, the thickness of the packaging part 41 corresponding to the first light-emitting structure 31a with higher light-emitting stability is greater than the thickness of the packaging part 41 corresponding to the second light-emitting structure 31b. Therefore, when the second light-emitting structure 31b and its packaging part 41 are etched, the probability of damage to the packaging part 41 corresponding to the first light-emitting structure 31a is reduced, which helps to improve the packaging reliability of the first light-emitting structure.

[0088] Similarly, in some optional embodiments, the plurality of light emitting structures 31 further include a third light emitting structure 31c having a different color from the first light emitting structure 31a and the second light emitting structure 31b, and the stability of the light emitting material in the second light emitting structure 31b is greater than the stability of the light emitting material layer in the third light emitting structure 31c.

[0089] The plurality of encapsulation parts 41 include a third encapsulation part 41 c located at a side of the third light emitting structure 31 c away from the substrate 10 , and the thickness of the second encapsulation part 41 b is greater than that of the third encapsulation part 41 c .

[0090] Furthermore, in some optional embodiments, the first light emitting structure 31a is used to emit red light, the second light emitting structure 31b is used to emit green light, and the third light emitting structure 31c is used to emit blue light. That is, the preparation order of the light emitting structure 31 can be red, green, and blue, and the thickness of the corresponding packaging part 41 tends to gradually decrease.

[0091] It should be noted that, assuming that the preparation order of the light-emitting structure 31 is red, green, and blue, the stabilities of the red light-emitting material, the green light-emitting material, and the blue light-emitting material decrease in sequence, that is, the red light-emitting material has the highest stability and is prepared first, followed by the green light-emitting material with the second highest stability, and then the blue light-emitting material with the third highest stability.

[0092] In the above optional embodiment, the thicknesses of the encapsulation parts 41 corresponding to the first light emitting structure 31 a , the second light emitting structure 31 b , and the third light emitting structure 31 c are different.

[0093] In some other optional embodiments, the thicknesses of the encapsulation parts 41 corresponding to the light emitting structures of two colors among the first light emitting structure 31 a , the second light emitting structure 31 b , and the third light emitting structure 31 c are different.

[0094] For example, the first light emitting structure 31a is used to emit red light or green light, and the second light emitting structure 31b is used to emit blue light. Specifically, the thickness of the packaging part 41 corresponding to the light emitting structure for emitting blue light is less than the thickness of the packaging part 41 corresponding to the light emitting structure for emitting red light, and the thickness of the packaging part 41 corresponding to the light emitting structure for emitting blue light is less than the thickness of the packaging part 41 corresponding to the light emitting structure for emitting green light.

[0095] In some embodiments, an etching selectivity ratio of the second encapsulation portion 41 b to the first encapsulation portion 41 a is SR1, and SR1≧1.

[0096] The “etching selectivity ratio” mentioned in the embodiments of the present application refers to: the relative etching rate of one material compared to another material under the same etching conditions. The etching selectivity ratio is usually related to the properties of the material.

[0097] SR1≥1 indicates that the etching rate of the second packaging part 41b is not less than the etching rate of the first packaging part 41a. Furthermore, since the thickness of the first packaging part 41a is greater than the thickness of the second packaging part 41b, the etching time corresponding to the second packaging part 41b is less than the etching time of the first packaging part 41a.

[0098] It can be known from the above content that the second light emitting structure 31 b is prepared and formed after the first light emitting structure 31 a , so the second packaging part 41 b corresponding to the second light emitting structure 31 b is also prepared and formed after the first light emitting structure 31 a .

[0099] On this basis, the embodiment of the present application controls the thickness of the second packaging part 41b to be smaller than that of the first packaging part 41a, and makes the etching selectivity ratio of the second packaging part 41b to the first packaging part 41a not less than 1, so as to reduce the etching time corresponding to the second packaging part 41b, so that the etching time corresponding to the second packaging part 41b is less than the etching time of the first packaging part 41a, thereby reducing the probability of damage to the first packaging part 41a due to excessive etching of the second packaging part 41b, thereby improving the packaging reliability of the first light-emitting structure 31a.

[0100] Similarly, in some embodiments, the etching selectivity ratio of the third encapsulation portion 41 c to the second encapsulation portion is SR2, and SR2 ≥ 1. This means that the etching rate of the third encapsulation portion 41 c is not less than the etching rate of the second encapsulation portion 41 b.

[0101] This design can reduce the etching time corresponding to the third packaging part 41c, so that the etching time corresponding to the third packaging part 41c is less than the etching time of the second packaging part 41b, thereby reducing the probability of damage to the second packaging part 41b due to excessive etching of the third packaging part 41c, thereby improving the packaging reliability of the second light-emitting structure 31b.

[0102] In some implementations, the first encapsulation portion 41 a and the second encapsulation portion 41 b are made of the same material, and SR=1.

[0103] This design does not require using different materials to separately prepare the first encapsulation portion 41 a and the second encapsulation portion 41 b , thereby reducing the material costs corresponding to the first encapsulation portion 41 a and the second encapsulation portion 41 b and reducing the manufacturing cost of the display panel.

[0104] In some embodiments, SR1>1, the first encapsulation part 41a includes silicon oxide, and the second encapsulation part 41b includes silicon oxynitride. Under the same conditions, the etching rate of silicon oxynitride is generally greater than the etching rate of silicon oxide, and the thickness of the second encapsulation part 41b is also less than the thickness of the first encapsulation part 41a, so it can be ensured that the etching time corresponding to the second encapsulation part 41b is less than the etching time of the first encapsulation part 41a, thereby improving the reliability of display panel manufacturing.

[0105] In some embodiments, SR2>1, the second encapsulation part 41b includes silicon oxynitride, and the third encapsulation part 41c includes silicon nitride. Under the same conditions, the etching rate of silicon nitride is generally greater than the etching rate of silicon oxynitride, and the thickness of the third encapsulation part 41c is also less than the thickness of the second encapsulation part 41b, so it can be ensured that the etching time corresponding to the third encapsulation part 41c is less than the etching time of the second encapsulation part 41b, thereby improving the reliability of display panel manufacturing.

[0106] In some embodiments, see Figure 4 The display panel further includes a first electrode layer 50 disposed between the light-emitting functional layer 30 and the first encapsulation layer 40 , and the first electrode layer 50 includes a plurality of first electrodes 51 disposed corresponding to the plurality of light-emitting structures 31 .

[0107] The first electrode layer 50 is located on the side of the light-emitting functional layer 30 away from the substrate 10, and includes a plurality of first electrodes 51, which are arranged corresponding to the plurality of light-emitting structures 31, and are used to drive the light-emitting structures 31 to realize light-emitting display. Exemplarily, the first electrode 51 is a cathode.

[0108] Optionally, the display panel further includes a second electrode layer 60, the second electrode layer 60 is located on the side of the light-emitting functional layer 30 facing the substrate 10, and the second electrode layer 60 includes a plurality of second electrodes 61 arranged corresponding to the light-emitting structure 31. Exemplarily, the second electrode 61 is an anode, and the first electrode 51 and the second electrode 61 jointly drive the light-emitting structure 31 to realize light-emitting display.

[0109] Due to the existence of the isolation structure 20, the first electrode layer 50 can include a plurality of first electrodes 51 located in different opening structures 21 without the need for a fine metal mask. This helps to reduce the mask cost required for display panel preparation and is suitable for mass production.

[0110] In some embodiments, at least some of the light emitting structures 31 of different colors correspond to different thicknesses of the first electrodes 51 . Figure 4 In the embodiment, the thickness of the first electrode 51 corresponding to the first light emitting structure 31 a is greater than the thickness of the first electrode 51 corresponding to the second light emitting structure 31 b.

[0111] The first electrode 51 is located between the light emitting structure 31 and the packaging part 41. If the packaging part 41 is over-etched, the first electrode 51 is easily exposed, causing the risk of the first electrode 51 being damaged by etching. On this basis, the embodiment of the present application can make the thickness of the first electrode 51 corresponding to the light emitting structure 31 prepared first larger according to the preparation order of the light emitting structures 31 of different colors, so that the first electrode 51 can have a certain risk resistance, thereby reducing the probability that the first electrode 51 corresponding to the previously formed light emitting structure 31 is excessively damaged and cannot work normally due to the etching process of the packaging part 41 corresponding to the subsequent light emitting structure 31, thereby improving the reliability of each first electrode 51 corresponding to the different light emitting structures 31 and ensuring that the display panel can be used normally.

[0112] In some embodiments, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 which are sequentially arranged in a direction away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The first isolation portion 22 includes a conductive material, and the first electrode 51 is overlapped with the first isolation portion 22.

[0113] Due to the existence of the isolation structure 20, the first electrodes 51 corresponding to different light-emitting structures 31 are arranged at intervals from each other. On this basis, in order to enable at least part of the first electrodes 51 to obtain the corresponding potential signal, the first isolation part 22 is provided in the embodiment of the present application to include a conductive structure, and the first electrode 51 overlaps the first isolation part 22. This design enables at least part of the first electrode 51 to be electrically connected to the first isolation part 22, and then a specific potential signal is transmitted to the first electrode 51 through the first isolation part 22, so as to realize the drive control of at least part of the first electrode 51.

[0114] In some embodiments, see Figure 5 The display panel also includes a second encapsulation layer 70 arranged on the side of the first encapsulation layer 40 away from the substrate 10, the second encapsulation layer 70 covers the plurality of encapsulation portions 41, and the second encapsulation layer 70 includes a first surface away from the substrate 10, and the first surface is parallel to the plane where the substrate 10 is located.

[0115] The first encapsulation layer 40 and the second encapsulation layer 70 are used together to achieve the encapsulation effect of the display panel, and the second encapsulation layer 70 is located on the side of the first encapsulation layer 40 away from the substrate 10. As can be seen from the foregoing, the thickness of the encapsulation portion 41 corresponding to at least some of the light-emitting structures 31 of different colors is different, so that the side of the first encapsulation layer 40 away from the substrate 10 is not a flat surface, which is easy to have an adverse effect on the upper film layer.

[0116] In view of this, during the preparation process of the embodiment of the present application, the size and shape of the second encapsulation layer 70 are controlled so that the second encapsulation layer 70 is a whole-surface structure, and the surface of the second encapsulation layer 70 facing away from the substrate 10 can be parallel to the plane where the substrate 10 is located, thereby reducing the impact on the subsequent film layer preparation.

[0117] Further optionally, the second encapsulation layer 70 may include an organic material. The organic material generally has a strong leveling property. Therefore, when forming the second encapsulation layer 70 , it helps to achieve a smooth surface on the side of the second encapsulation layer 70 facing away from the substrate 10 .

[0118] In some embodiments, see Figure 6 The display panel further includes a third encapsulation layer 80 disposed on a side of the second encapsulation layer 70 facing away from the substrate 10 , and the third encapsulation layer 80 covers the plurality of encapsulation portions 41 .

[0119] Similar to the second encapsulation layer 70, the third encapsulation layer 80 is also a whole surface structure and can cover multiple encapsulation parts 41. The first encapsulation layer 40, the second encapsulation layer 70 and the third encapsulation layer 80 can together form a thin film encapsulation structure to improve the encapsulation effect of the display panel.

[0120] Optionally, the first encapsulation layer 40 and the third encapsulation layer 80 include inorganic materials.

[0121] In some embodiments, the thickness of the packaging portion 41 corresponding to the light emitting structures 31 of different colors is different.

[0122] In the embodiment of the present application, the thickness of the corresponding encapsulation part 41 can be set to decrease in sequence according to the preparation order of the light emitting structures 31 of different colors, so as to help ensure the reliability of the encapsulation part 41 corresponding to each light emitting structure 31 and the reliability of the light emitting structure 31. Optionally, the thickness of the encapsulation part 41 corresponding to the light emitting structures 31 of the same color is the same.

[0123] In a second aspect, an embodiment of the present application provides a display panel, the display panel includes a substrate, an isolation structure, a light-emitting functional layer and a first encapsulation layer, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses an opening structure. The light-emitting functional layer is arranged on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting structures arranged in the opening structure. The first encapsulation layer is arranged on the side of the light-emitting functional layer away from the substrate, and the first encapsulation layer includes a plurality of encapsulation parts arranged corresponding to the light-emitting structures. Among them, the materials of the encapsulation parts corresponding to at least some of the light-emitting structures of different colors are different.

[0124] In some embodiments, the etching rates of the packaging parts corresponding to at least some of the light-emitting structures of different colors are different. Specifically, the plurality of light-emitting structures include a first light-emitting structure, a second light-emitting structure, and a third light-emitting structure of different colors, and the plurality of packaging parts include: a first packaging part located on a side of the first light-emitting structure away from the substrate, a second packaging part located on a side of the second light-emitting structure away from the substrate, and a third packaging part located on a side of the third light-emitting structure away from the substrate, and the etching rates of at least two of the first packaging part, the second packaging part, and the third packaging part are different.

[0125] For example, the first light-emitting structure is used to emit red light, the second light-emitting structure is used to emit green light, and the third light-emitting structure is used to emit blue light, and the etching rates of the first packaging part, the second packaging part, and the third packaging part increase in sequence. In the embodiment of the present application, the materials of the packaging parts corresponding to at least some of the light-emitting structures of different colors can be set differently according to the preparation order of the light-emitting structures inside the display panel, so that the etching time of the packaging part corresponding to the light-emitting structure prepared later is less than the etching time of the packaging part corresponding to the light-emitting structure prepared previously, thereby reducing the risk of damage to the packaging part corresponding to the light-emitting structure formed previously due to the etching process of the subsequent light-emitting structure and the corresponding packaging material, causing some light-emitting structures to fail, thereby improving the reliability of the display panel.

[0126] It should be noted that in the embodiment of the present application, the thicknesses of different packaging parts may be the same or different, and the embodiment of the present application does not limit this.

[0127] Third, see Figure 7 , an embodiment of the present application provides a flexible display device, comprising the display panel in any of the aforementioned embodiments.

[0128] The flexible display device provided in the embodiment of the present application has the beneficial effects of the display panel in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the display panel, which will not be repeated in the embodiment of the present application.

[0129] Fourth, please refer to Figure 8 9 , an embodiment of the present application provides a method for preparing a display panel, including:

[0130] S100: forming an isolation structure on one side of the substrate.

[0131] See also Figure 9a In step S100, the isolation structure 20 encloses the opening structure 21. The specific structure of the isolation structure 20 is not limited in the embodiment of the present application. Exemplarily, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 sequentially arranged in a direction away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10.

[0132] S110: forming a first light-emitting structure in each opening structure and a first packaging material layer covering each first light-emitting structure.

[0133] See also Figure 9b In step S110, due to the existence of the isolation structure 20, the first light emitting structure 31a is formed in each opening structure 21, and the first light emitting structures 31a in different opening structures 21 are arranged at intervals from each other. The first encapsulation material layer 41a' can be a whole surface structure.

[0134] S120 : patterning the first packaging material layer and removing a portion of the first light emitting structure in the opening structure 21 .

[0135] See also Fig.9c In step S120, the first packaging material layer is etched to form a first packaging portion 41a corresponding to the first light-emitting structure 31a. Then, the first light-emitting structure 31a in the opening structure 21 is removed, that is, the first light-emitting structure 31a not corresponding to the first packaging portion 41a is removed by etching. The etching time corresponding to the first packaging material layer is H1.

[0136] S130: forming a second light emitting structure in each opening structure and a second packaging material layer covering the second light emitting structure.

[0137] See also Figure 9d In step S130, due to the existence of the isolation structure 20, the second light emitting structure 31b is formed in each opening structure 21, and the second light emitting structures 31b located in different opening structures 21 are arranged at intervals from each other. The second packaging material layer can be a full-surface structure. The thickness of the first packaging material layer is greater than the thickness of the second packaging material layer 41b'.

[0138] S140 : patterning the second packaging material layer, and removing a portion of the second light emitting structure 31 b in the opening structure 21 .

[0139] See also Fig.9e In step S140, the second packaging material layer and the second light emitting structure 31b are processed in a similar manner to the first packaging material layer and the first light emitting structure 31a, and will not be described in detail in this embodiment of the present application. The etching time corresponding to the second packaging material layer is H2, where H1>H2.

[0140] In this process, since the etching time of the second packaging material layer is shorter than that of the first packaging material layer, the probability of excessive damage to the first packaging portion 41a due to the etching of the second packaging material layer and the second light-emitting structure 31b can be reduced, thereby ensuring that the first packaging portion 41a can play a packaging and protective role for the first light-emitting structure 31a and improving the reliability of the display panel.

[0141] It should be noted that the embodiment of the present application does not limit how to control the etching time of the first packaging material layer and the second packaging material layer. For example, the thickness of the first packaging material layer can be controlled to be greater than the thickness of the second packaging material layer, so that H1>H2; or the materials of the first packaging material layer and the second packaging material layer can be controlled to be different, so that the etching selectivity ratio of the second packaging material layer to the first packaging material layer is greater than 1, thereby achieving H1>H2.

[0142] In addition, when the thickness of the first packaging material layer 41a' is greater than the thickness of the second packaging material layer 41b', part of the material in the first packaging material layer 41a' may be removed during the etching process of the second packaging material layer 41b', so that the thickness of the finally formed first packaging part 41a may be greater than the thickness of the second packaging part 41b.

[0143] Although the embodiments disclosed in this application are as above, the contents described are only embodiments adopted for facilitating the understanding of this application and are not intended to limit the present invention. Any technician in the technical field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of protection of this application shall still be subject to the scope defined in the attached claims.

[0144] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate, and the isolation structure is enclosed to form an opening structure; A light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting structures disposed in the opening structure; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts arranged corresponding to the light-emitting structure; Wherein, at least some of the light emitting structures of different colors correspond to different thicknesses of the packaging parts.

2. The display panel according to claim 1, characterized in that: The encapsulation portion includes a first portion, the orthographic projection of the first portion on the substrate is located outside the orthographic projection of the isolation structure on the substrate, and at least some of the light-emitting structures of different colors have different thicknesses of the first portion; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially arranged in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The orthographic projection of the first portion on the substrate is located outside the orthographic projection of the second isolation portion on the substrate.

3. The display panel according to claim 1, characterized in that: The plurality of light-emitting structures include a first light-emitting structure and a second light-emitting structure having different colors, and the stability of the light-emitting material in the first light-emitting structure is greater than the stability of the light-emitting material in the second light-emitting structure; The plurality of encapsulation parts include a first encapsulation part located on a side of the first light emitting structure away from the substrate, and a second encapsulation part located on a side of the second light emitting structure away from the substrate, wherein the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part; Preferably, the first light emitting structure is used to emit red light or green light, and the second light emitting structure is used to emit blue light; Preferably, the plurality of light-emitting structures further include a third light-emitting structure having a color different from that of the first light-emitting structure and the second light-emitting structure, and the stability of the light-emitting material in the second light-emitting structure is greater than the stability of the light-emitting material in the third light-emitting structure; The multiple packaging parts include a third packaging part located on the side of the third light-emitting structure away from the substrate, and the thickness of the second packaging part is greater than the thickness of the third packaging part; preferably, the first light-emitting structure is used to emit red light, the second light-emitting structure is used to emit green light, and the third light-emitting structure is used to emit blue light.

4. The display panel according to claim 1, characterized in that: The plurality of light-emitting structures include a first light-emitting structure and a second light-emitting structure having different colors, the plurality of encapsulation parts include a first encapsulation part located on a side of the first light-emitting structure away from the substrate, and a second encapsulation part located on a side of the second light-emitting structure away from the substrate, and an etching selection ratio between the second encapsulation part and the first encapsulation part is SR1, SR1≥1; Preferably, the plurality of light-emitting structures further include a third light-emitting structure having a color different from that of the first light-emitting structure and the second light-emitting structure, and the plurality of encapsulation parts include a third encapsulation part located on a side of the third light-emitting structure away from the substrate; The etching selection ratio between the third encapsulation part and the second encapsulation part is SR2, SR2≥1; Preferably, SR1=1, the first packaging part and the second packaging part are made of the same material; Preferably, SR1>1, the first encapsulation portion includes silicon oxide, and the second encapsulation portion includes silicon oxynitride; Preferably, SR2>1, the second encapsulation portion includes silicon oxynitride, and the third encapsulation portion includes silicon nitride.

5. The display panel according to claim 1, characterized in that: It also includes a first electrode layer disposed between the light-emitting functional layer and the first encapsulation layer, the first electrode layer including a plurality of first electrodes disposed corresponding to the plurality of light-emitting structures; Preferably, at least some of the light emitting structures of different colors correspond to different thicknesses of the first electrodes; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially arranged in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The first isolation portion includes a conductive material, and the first electrode is overlapped with the first isolation portion.

6. The display panel according to claim 1, characterized in that: It also includes a second encapsulation layer disposed on a side of the first encapsulation layer away from the substrate, the second encapsulation layer covers the plurality of encapsulation portions, the second encapsulation layer includes a first surface away from the substrate, the first surface is parallel to the plane where the substrate is located; Preferably, the second encapsulation layer comprises an organic material; Preferably, the display panel further comprises a third encapsulation layer disposed on a side of the second encapsulation layer away from the substrate, and the third encapsulation layer covers the plurality of encapsulation parts; Preferably, the first encapsulation layer and the third encapsulation layer comprise inorganic materials.

7. The display panel according to claim 1, characterized in that: The thickness of the packaging part corresponding to the light emitting structures of different colors is different; Preferably, the packaging parts corresponding to the light emitting structures of the same color have the same thickness.

8. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate, and the isolation structure is enclosed to form an opening structure; A light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a plurality of light-emitting structures disposed in the opening structure; A first encapsulation layer is arranged on a side of the light-emitting functional layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts arranged corresponding to the light-emitting structure; Wherein, at least some of the light emitting structures of different colors correspond to different materials of the packaging parts.

9. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 8.

10. A method for preparing a display panel, characterized in that: include: An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses an opening structure; forming a first light emitting structure in each of the opening structures and a first packaging material layer covering each of the first light emitting structures; The first packaging material layer is patterned to form a first packaging portion corresponding to a portion of the first light-emitting structure, and a portion of the first light-emitting structure in the opening structure is removed. The etching time corresponding to the first packaging material layer is H1. forming a second light emitting structure in each of the opening structures and a second packaging material layer covering each of the second light emitting structures; The second packaging material layer is patterned to form a second packaging portion corresponding to a portion of the second light emitting structure, and the second light emitting structure in a portion of the opening structure is removed. The corresponding etching time of the second packaging material layer is H2, H1>H2.

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