Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display panel which comprises a display area, a binding area and a bending area which is connected with the display area and the binding area in a bending manner; the back film layer is arranged on the backlight side of the display area; the supporting layer is arranged on the side, away from the display panel, of the back film layer; the circuit board is arranged on the side, away from the display panel, of the supporting layer and electrically connected with the display panel; the driving chip is arranged on one side, far away from the supporting layer, of the binding area; the electromagnetic shielding film is arranged on one side, far away from the supporting layer, of the driving chip; the electromagnetic shielding film extends in a first direction so as to cover the circuit board and the driving chip; the first electrode extends in the second direction so as to at least partially cover the bending area; wherein the first direction is perpendicular to the second direction, and the first direction is parallel to the surface of the display area.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the increasing popularity of OLED (Organic Light-Emitting Diode) technology, its application demand in the automotive, industrial control, medical, aviation and shipping industries is growing. Different from the application scenarios of mobile phones and most consumer-grade displays, the requirements for environmental adaptability, mechanical strength, electromagnetic compatibility (EMC) and other aspects of equipment in medical, industrial control, aviation and shipping environments far exceed those of general consumer-grade products. Therefore, consumer-grade displays in related technologies are not suitable for medical, industrial control, aviation and shipping environments. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a display module and a display device.

[0004] Based on the above objectives, the present application provides a display module, including:

[0005] The display panel comprises a display area and a binding area, and a bending area bending and connecting the display area and the binding area;

[0006] A back film layer, arranged on the backlight side of the display area;

[0007] A first adhesive layer is disposed on a side of the back film layer away from the display area;

[0008] A supporting layer, disposed on a side of the first adhesive layer away from the display panel;

[0009] A second adhesive layer is disposed on a side of the support layer away from the display area;

[0010] A circuit board is arranged on a side of the support layer away from the display panel and is electrically connected to the display panel;

[0011] A driving chip is arranged on a side of the binding area away from the supporting layer;

[0012] An electromagnetic shielding film is arranged on a side of the driving chip away from the supporting layer; the electromagnetic shielding film extends in a first direction to cover the circuit board and the driving chip; and extends in a second direction to at least partially cover the bending area; wherein the first direction is perpendicular to the second direction, and the first direction is parallel to the surface of the display area.

[0013] In some of the embodiments, in the direction in which the electromagnetic shielding film is away from the display panel, the electromagnetic shielding film includes a bonding layer, a first insulating layer, a conductive layer, a graphite layer, and a second insulating layer which are stacked.

[0014] In some embodiments, the electromagnetic shielding film includes a first region, a second region, and a third region connected in sequence in a first direction; wherein the first region covers the circuit board; the second region covers the driver chip; the third region extends in the second direction and at least partially covers the bending region;

[0015] Among them, the first insulating layer is at least arranged in the first region and the second region; the conductive layer is at least arranged in the first region and the second region; the graphite layer is at least arranged in the first region; and the second insulating layer is arranged in the first region, the second region and the third region.

[0016] In some embodiments, the first insulating layer is disposed in the first region and the second region; the conductive layer is disposed in the first region and the second region; and the graphite layer is disposed in the first region.

[0017] In some embodiments, the first insulating layer is disposed in the first region and the second region; the conductive layer is disposed in the first region and the second region; and the graphite layer is disposed in the first region and the second region.

[0018] In some embodiments, the first insulating layer is disposed in the first region, the second region and the third region; the conductive layer is disposed in the first region and the second region; and the graphite layer is disposed in the first region and the second region.

[0019] In some embodiments, the first insulating layer is disposed in the first region, the second region and the third region; the conductive layer is disposed in the first region, the second region and the third region; and the graphite layer is disposed in the first region and the second region.

[0020] In some embodiments, the first insulating layer is disposed in the first region, the second region and the third region; the conductive layer is disposed in the first region, the second region and the third region; and the graphite layer is disposed in the first region, the second region and the third region.

[0021] In some embodiments, the circuit board includes a first copper-exposed area located at a side away from the display panel; and the first insulating layer is provided with a through hole to avoid the copper-exposed area of ​​the circuit board and the driving chip.

[0022] In some of the embodiments, the electromagnetic shielding film further extends on at least one side along a third direction to cover at least one edge of the display area along the third direction; wherein the third direction is perpendicular to the surface of the display area and perpendicular to the second direction.

[0023] In some embodiments, the display module also includes a cover plate arranged on a side of the display area away from the circuit board; the electromagnetic shielding film extends to the cover plate at least in the second direction; and a conductive adhesive layer is provided at an end of the electromagnetic shielding film close to the cover plate at least in the second direction, and the conductive adhesive layer is used to bond the electromagnetic shielding film to the cover plate.

[0024] In some embodiments, the electromagnetic shielding film extends to the cover plate in the second direction and on at least one side along the third direction; and a conductive adhesive layer is provided at the end of the electromagnetic shielding film in the second direction close to the cover plate and at least one side along the third direction.

[0025] In some embodiments, the electromagnetic shielding film has a first hollow area in the conductive adhesive layer near the end of the cover plate in the second direction to avoid the bending area; the electromagnetic shielding film has a second hollow area in the conductive adhesive layer near at least one end of the cover plate along the third direction to avoid the conductive adhesive layer.

[0026] In some embodiments, the conductive adhesive layer is conductive foam; the adhesive layer is at least disposed on a side of the first insulating layer close to the display panel, and the adhesive layer avoids the conductive foam.

[0027] The present application also provides a display device, comprising a display module as described in any of the preceding items.

[0028] As can be seen from the above, the display module and display device provided by the present application, by setting up a display panel, include a display area and a binding area, and a bending area that is bent to connect the display area and the binding area; a back film layer, arranged on the backlight side of the display area; a first adhesive layer, arranged on the side of the back film layer away from the display area; a supporting layer, arranged on the side of the back film layer away from the display panel; a second adhesive layer, arranged on the side of the supporting layer away from the display area; a circuit board, arranged on the side of the supporting layer away from the display panel and electrically connected to the display panel; a driving chip, arranged on the side of the binding area away from the supporting layer; an electromagnetic shielding film, arranged on the driving chip The chip is away from the side of the support layer; the electromagnetic shielding film extends in the first direction to cover the circuit board and the driver chip; and extends in the second direction to at least partially cover the bending area; wherein the first direction is perpendicular to the second direction, and the first direction is parallel to the surface of the display area, which can maintain the display quality of the OLED while optimizing the module design, improving the overall mechanical strength and shock resistance of the OLED device, and enhancing the environmental adaptability of the flexible OLED module, so that it can work stably under various extreme climates and industrial conditions, thereby extending the product life, reducing damage caused by physical impact, simplifying the assembly process, and reducing maintenance costs. It can also promote the penetration of flexible OLED technology in non-traditional consumer electronics and open up new application markets, such as high-end medical imaging, precision industrial control interfaces, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1a An exploded view of a consumer-grade display module in the related art is shown;

[0031] Figure 1b The overall structure diagram of a consumer-grade display module in the related art is shown;

[0032] Figure 2a An exploded view of a display module according to an embodiment of the present application is shown;

[0033] Figure 2b An overall structural diagram of a display module according to an embodiment of the present application is shown;

[0034] Figure 2c Another overall structural diagram of the display module of an embodiment of the present application is shown;

[0035] Figure 3 This is a schematic diagram of the partition structure of the electromagnetic shielding film in the display module of the embodiment of the present application;

[0036] Figure 4a A schematic diagram of the structure of a display module with conductive foam according to an embodiment of the present application;

[0037] Figure 4b For Figure 4a An exploded view of a portion of the hierarchy of the corresponding display module;

[0038] Figure 4c For Figure 4a The corresponding exploded view shows another part of the hierarchy of the module;

[0039] Figure 4d For Figure 4a or Figure 4e a corresponding cross-sectional view of the third region of the electromagnetic shielding film;

[0040] Figure 4e This is another structural schematic diagram of a display module with conductive foam according to an embodiment of the present application;

[0041] Figure 4f For Figure 4e An exploded view of a portion of the hierarchy of the corresponding display module;

[0042] Figure 5a A schematic diagram of a hierarchical structure of each area of ​​the electromagnetic shielding film of an embodiment of the present application;

[0043] Figure 5b It is a schematic diagram of another hierarchical structure of each area of ​​the electromagnetic shielding film of an embodiment of the present application;

[0044] Figure 5c It is a schematic diagram of another hierarchical structure of each area of ​​the electromagnetic shielding film of an embodiment of the present application;

[0045] Figure 5d It is a schematic diagram of another hierarchical structure of each area of ​​the electromagnetic shielding film of an embodiment of the present application;

[0046] Figure 5e It is a schematic diagram of another hierarchical structure of each area of ​​the electromagnetic shielding film of an embodiment of the present application;

[0047] Figure 5f This is a schematic diagram of another hierarchical structure of each zone of the electromagnetic shielding film according to an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0049] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0050] Figure 1a-1b A schematic structural diagram of a consumer-grade display screen in the related art is shown.

[0051] like Figure 1a-1b As shown, the consumer-grade flexible OLED display screen in the related technology has a great demand for narrow bezels. Among them, the electromagnetic shielding film (EMI Tape) is usually only covered on the circuit board to improve the electromagnetic shielding performance. And the structure of the electromagnetic shielding film can usually include a conductive layer, a dielectric layer and an adhesive layer. Among them, the conductive layer is usually a metal foil (such as copper foil or aluminum foil), which is used to reflect and absorb electromagnetic waves and is a key part of the shielding effectiveness. The dielectric layer can usually be located between the conductive layer and the adhesive layer, and can be polyester film (PET), polyimide (PI) or other insulating materials to maintain the stability of the structure and provide a certain mechanical strength. The adhesive layer usually directly contacts the surface to be shielded so that the EMI Tape adheres firmly to the electronic component or housing. Common adhesives can include acrylic, silicone, etc., which need to have good conductivity or insulation properties, and need to maintain stable viscosity under different temperatures and environments.

[0052] For flexible OLED display screens in medical, industrial control, aviation and shipping environments, due to relatively harsh environmental conditions, for example, the medical field may have strong electromagnetic radiation and disinfectant corrosion, the industrial control field may have strong electromagnetic radiation and high temperature, and the aviation and shipping environments have strong electromagnetic radiation and are prone to extreme climates, which require earthquake resistance. Therefore, the flexible OLED display screens in medical, industrial control, aviation and shipping environments have higher environmental adaptability, mechanical strength and electromagnetic compatibility (EMC) and other requirements, which far exceed the requirements of general consumer-grade flexible OLED display screens. Therefore, the consumer-grade flexible OLED display screens in the relevant technology cannot meet the requirements for higher environmental adaptability, mechanical strength and electromagnetic compatibility (EMC). Therefore, how to optimize the frame design of the flexible OLED module to meet the non-critical requirements of the medical, industrial control and navigation fields for narrow frames without sacrificing display performance; how to effectively improve the weather resistance and mechanical strength of the flexible OLED display device in harsh environments to ensure long-term stable operation; how to enhance the electromagnetic compatibility (EMC) and earthquake resistance of OLED devices through design improvements to meet the stricter regulatory requirements in professional fields are urgent issues to be solved.

[0053] Based on this, an embodiment of the present application provides a display module, which covers the bending area with an electromagnetic shielding film, and additionally introduces a heat dissipation layer (such as a graphite layer) into the electromagnetic shielding film, and sets different hierarchical structures in different areas of the heat dissipation layer. It can solve the problems of weather resistance and mechanical strength in harsh environments to a certain extent without sacrificing display performance, and enhance the electromagnetic compatibility (EMC) and shock resistance of OLED devices.

[0054] like Figure 2a and Figure 4a As shown, the display module provided in the embodiment of the present application may include:

[0055] The display panel 11 comprises a display area 111 and a binding area 112, and a bending area 113 bending and connecting the display area 111 and the binding area 112;

[0056] A back film layer 12 is arranged on the backlight side of the display area 111; wherein the backlight side may be the side opposite to the light emitting side A;

[0057] A first adhesive layer 13, disposed on a side of the back film layer 12 away from the display area 111;

[0058] A supporting layer 14 is disposed on a side of the first adhesive layer 13 away from the display panel 11;

[0059] A second adhesive layer (such as the second adhesive layer 15a or the second adhesive layer 15b), disposed on a side of the support layer 14 away from the display area 111;

[0060] A circuit board 16 is disposed on a side of the support layer 14 away from the display panel 11 and is electrically connected to the display panel 11;

[0061] A driving chip 17 is disposed on a side of the binding area 112 away from the supporting layer 14;

[0062] The electromagnetic shielding film 18 is arranged on a side of the driving chip 17 away from the supporting layer 14; the electromagnetic shielding film 18 extends in a first direction X to cover the circuit board 16 and the driving chip 17; and extends in a second direction Y to at least partially cover the bending area 113; wherein the first direction X is perpendicular to the second direction Y, and the first direction X is parallel to the surface of the display area 111.

[0063] The display module provided in the embodiment of the present application is provided with a display panel 11, including a display area 111 and a binding area 112, and a bending area 113 bending and connecting the display area 111 and the binding area 112; a back film layer 12, which is arranged on the backlight side of the display area 111; a first adhesive layer 13, which is arranged on the side of the back film layer 12 away from the display area 111; a supporting layer 14, which is arranged on the side of the back film layer 12 away from the display panel 11; a second adhesive layer 15, which is arranged on the side of the supporting layer 14 away from the display area 111; a circuit board 16, which is arranged on the side of the supporting layer 14 away from the display panel 11 and is electrically connected to the display panel 11; a driving chip 17, which is arranged on the side of the binding area 112 away from the supporting layer 14; an electromagnetic The shielding film 18 is arranged on the side of the driving chip 17 away from the supporting layer 14; the electromagnetic shielding film 18 extends in the first direction X to cover the circuit board 16 and the driving chip 17; and extends in the second direction Y to at least partially cover the bending area 113; wherein the first direction X is perpendicular to the second direction Y, and the first direction X is parallel to the surface of the display area 111; while maintaining the display quality of the OLED, the module design is optimized, the overall mechanical strength and shock resistance of the OLED device are improved, and the environmental adaptability of the flexible OLED module is enhanced, and it can work stably under various extreme climates and industrial conditions, thereby extending the product life, reducing damage caused by physical impact, simplifying the assembly process, and reducing maintenance costs. It can also promote the penetration of flexible OLED technology in the field of non-traditional consumer electronics and open up new application markets, such as high-end medical imaging, precision industrial control interfaces, etc.

[0064] In some of the embodiments, a polarizer layer 19, an optical adhesive layer 20 and a cover layer 21 may be further provided on the light emitting side A of the display panel 11, along the side away from the electromagnetic shielding film 18. The polarizer layer 19 may be provided on the side of the display panel 11 away from the electromagnetic shielding film 18, and the polarizer layer 19 at least covers the display area 111. The optical adhesive layer 20 may be provided on the side of the polarizer layer 19 away from the substrate, and the coverage surface is the same as that of the polarizer layer 19. The cover layer 21 may be provided on the side of the optical adhesive layer 20 away from the polarizer layer 19, and the cover layer 21 at least covers the optical adhesive layer 20.

[0065] In some embodiments, such as Figure 2a , Figure 2b and Figure 2c As shown, the polarizer layer 19 (Polarizer, POL for short), the optical adhesive layer 20 and the cover layer 21 are sequentially bonded along the light emitting direction, that is, the direction away from the electromagnetic shielding film 18. The polarizer layer 19 can transmit the light emitted from the display area 111 of the display panel 11, whose vibration direction is the same as the light transmission axis of the polarizer layer 19, and absorb the light whose vibration direction is perpendicular to the light transmission axis of the polarizer layer 19. The cover layer 21 can be made of materials such as glass or plastic, and has the characteristics of being hard and transparent, scratch-resistant and drop-resistant, and can protect the display module, and the light emitted by each sub-pixel in the display layer c can be emitted through the cover layer 21. In this way, by setting the polarizer layer 19, the optical adhesive layer 20 and the cover layer 21, the support capacity of the display panel 11 is further increased, and the protection of the display panel 11 on the light emitting side A is achieved.

[0066] In some embodiments, such as Figure 2b and Figure 2c The edge area of ​​the cover layer 21, that is, the area not covering the display panel 11 and the edge area for covering the display panel 11, can be provided with an ink layer 22 to enhance wear resistance and have a certain anti-reflective function, and can also be used to print touch buttons and logos, etc. It can also prevent light leakage, etc. to a certain extent.

[0067] In some of the embodiments, the optical adhesive layer 20 may be an OCA adhesive layer, which is a transparent adhesive layer that allows the polarizer layer 19 to fit tightly with the cover layer 21 and has the advantages of good light transmittance and low bubble generation.

[0068] In some of the embodiments, the display panel 11 may be a flexible OLED screen, which is made of a flexible material, can be bent or rolled up, has the characteristic of self-luminescence, and displays images by activating organic materials through electric current without the need for a backlight. Usually, a display unit and a circuit are integrated in the display panel 11, which is the core layer of the display. The driver chip 17 supplies power to the pixels in the display panel 11, determines whether each pixel is lit and the brightness of the light, and is the key to the display effect. Connecting the driver chip 17 to the binding area 112 after the display panel 11 is bent can reduce the horizontal space occupied by the driver chip 17 on the display panel 11, thereby narrowing the border of the display module.

[0069] In some embodiments, the first adhesive layer 13 and the second adhesive layer (for example, the second adhesive layer 15a or the second adhesive layer 15b) can both be OCA adhesive layers, which are transparent adhesive layers, and can make the support layer 14 and the display panel 11 fit tightly, and have the advantages of not easily generating bubbles, etc. The second adhesive layer (for example, the second adhesive layer 15a or the second adhesive layer 15b) can include the second adhesive layer 15a and the second adhesive layer 15b, wherein the second adhesive layer 15a is used to bond the support layer 14 and the circuit board 16, and the second adhesive layer 15b is used to bond the support layer 14 and the bending area 113.

[0070] In some embodiments, the material of the support layer 14 may be a material such as metal that can play a supporting role, which is not limited in the embodiments of the present application. The metal material may be stainless steel or a shape memory alloy. Since the flexible display panel 11 is relatively soft, the support layer 14 can play a role in supporting the flexible display panel 11, thereby improving the support of the display module and protecting the flexible display panel 11.

[0071] In some embodiments, such as Figure 3 As shown, the circuit board 16 may include a circuit board 161 containing electronic components and a transfer circuit board 162. The circuit board 161 containing electronic components is a carrier board for electronic components and circuits, and may be a rigid PCB circuit board 16 or a flexible multi-layer FPC circuit board 16. The PCB board may also be an external control circuit board 16 in an OLED display. The FPC soft board is a soft and bendable circuit board 16, which is suitable for products with compact or curved designs. The transfer circuit board 162 may be a flexible FPC circuit board 16, which may be used to connect the display panel 11 with other electronic components.

[0072] Back to Figure 2b and Figure 2cIn some embodiments, the end of the electromagnetic shielding film 18 away from the bending area 113 in the first direction X can be bonded to the support layer 14 to achieve grounding. The electromagnetic shielding film 18 can extend to the cover plate in the second direction Y. In this way, the support layer 14 can be protected, and the grounding connection can be enhanced to improve the protective function of the electromagnetic shielding film 18. In addition, the overall mechanical strength and shock resistance of the display module (such as an OLED device) can be improved, the life of the display module (such as an OLED device) can be extended, and the damage caused by physical impact can be reduced.

[0073] In some embodiments, the electromagnetic shielding film 18 also extends on at least one side along the third direction Z to cover at least one edge of the display area 111 along the third direction Z; wherein the third direction Z is perpendicular to the surface of the display area 111 and perpendicular to the second direction Y. Specifically, the electromagnetic shielding film 18 may extend on one side along the third direction Z; or the electromagnetic shielding film 18 may extend on both sides along the third direction Z. In this way, the overall mechanical strength and shock resistance of the display module (such as an OLED device) can be further improved, the life of the display module (such as an OLED device) can be further extended, and damage caused by physical impact can be reduced.

[0074] In some of the embodiments, the electromagnetic shielding film 18 extends to the cover plate on at least one side along the third direction Z. Specifically, when the electromagnetic shielding film 18 extends only on one side along the third direction Z, it can extend to the cover plate. When the electromagnetic shielding film 18 extends only on both sides along the third direction Z, the electromagnetic shielding film 18 can extend to the cover plate on one side along the third direction Z, while the other side does not extend to the cover plate; the electromagnetic shielding film 18 can also extend to the cover plate on both sides along the third direction Z. In this way, the support layer 14 can be further protected, the ground connection can be further enhanced, and the protective function of the electromagnetic shielding film 18 can be further improved.

[0075] In some embodiments, in the direction in which the electromagnetic shielding film 18 is away from the display panel 11, such as Figure 5a-5fAs shown, the electromagnetic shielding film 18 may include a stacked adhesive layer, a first insulating layer 182, a conductive layer 183, a graphite layer 184 and a second insulating layer 185. Among them, the adhesive layer can be used to achieve the bonding of the electromagnetic shielding film 18 with the circuit board 16 or the driver chip 17 or the cover plate. Usually, the first insulating layer 182, the conductive layer 183, the graphite layer 184 and the second insulating layer 185 are bonded to each other, for example, the bonding can be achieved by corresponding adhesive layers with adhesive glue (such as insulating mylar glue). For example, the side of the second insulating layer 185 close to the display panel 11 can be provided with an adhesive layer, the graphite layer 184 can be a double-sided adhesive structure, and the conductive layer 183 and the second insulating layer 185 can be provided with adhesive layers on the side close to the display panel 11. In this way, the electromagnetic shielding film 18 can be tightly bonded to the circuit board 16 or the driver chip 17 or the inner side of the cover plate, so that the sealing and stability of the overall structure are improved, and the durability of the system and the reliability of long-term operation are further improved.

[0076] In some of the embodiments, the second insulating layer 185 can be a black insulating material with insulating glue (i.e., adhesive glue) embedded inside. This layer can not only provide a basic insulation barrier, but also enhance the stability and airtightness of the structure, and effectively block external environmental factors. The graphite layer 184 can be equipped with high-performance double-sided adhesive (usually pressure-sensitive adhesive PSA), which can not only enhance the EMI shielding effectiveness, but also facilitate firm adhesion with the upper and lower layer materials (such as the first insulating layer 182 and the conductive layer 183) to achieve good conductive continuity and heat dissipation capabilities. The conductive layer 183 is the core part and can be made of highly conductive copper foil or aluminum foil. This layer is the key to EMI protection. Through its excellent electromagnetic wave reflection and absorption characteristics, it can effectively build an electromagnetic shielding network to protect the internal circuit from external electromagnetic interference, while also limiting the leakage of internal signals to the outside. The first insulating layer 182 can also be a dark insulating film, which also has built-in insulating glue. This layer can not only continue to strengthen the insulation protection, but also have an open hole design to accurately correspond to the internal circuit or connection points (such as the connection between the copper leakage area and the components), so as to achieve the necessary signal penetration and maintain the overall EMI protection performance.

[0077] In some embodiments, such as Figure 3 , Figure 4a , Figure 4b , Figure 4c , Figure 4e and Figure 4fAs shown, at the edge where the electromagnetic shielding film 18 contacts the cover plate, a conductive adhesive layer 186 can be provided on the side where the electromagnetic shielding film 18 (i.e., the first insulating layer 182) contacts the cover plate, and the electromagnetic shielding film 18 and the cover plate are bonded by the conductive adhesive layer 186. Specifically, a conductive adhesive layer 186 can be provided at the end of the second insulating layer 185 on one side close to the cover plate. That is, the conductive adhesive layer 186 is provided at least at the end 1893 of the electromagnetic shielding film 18 close to the cover plate in the second direction Y. Specifically, the conductive adhesive layer 186 can be provided at the end of the electromagnetic shielding film 18 close to the cover plate in the second direction Y, and at least at one side along the third direction Z (e.g., the end on one side along the third direction Z or the ends on both sides along the third direction Z). In this way, the deployment of the conductive adhesive layer 186 can not only effectively bridge the electrostatic potential difference that may be formed between the cover plate and the display panel 11, and discharge the static electricity accumulation immediately, but also have long-term stable electrical contact and physical sealing performance due to its good compressibility and recovery, thereby significantly enhancing the anti-ESD performance of the entire display module. Therefore, it can not only strengthen the EMI protection system, but also further improve the durability of the display module and the safety experience of the user.

[0078] In some of the embodiments, the application range of the conductive adhesive layer 186 can be flexibly adjusted according to the actual structural layout and electrical safety requirements. If necessary, a refined avoidance design should be performed to avoid the OLED support layer 14 or other key sensitive components (such as the bending area 113 or sensitive electrical components, etc.), so as to maximize the grounding effect and ESD protection function of the conductive adhesive without affecting the OLED display performance. By setting the conductive adhesive layer 186, not only the EMI shielding performance is consolidated, but also the system integration and long-term operation stability of the entire display module are improved through refined design.

[0079] In some embodiments, the adhesive layer can avoid the conductive adhesive layer 186, for example, by providing a hollow area to avoid the conductive adhesive layer 186. The conductive adhesive layer 186 can provide a corresponding hollow area, such as Figure 4c , Figure 4d and Figure 4fAs shown, to avoid the bending zone 113 and the supporting layer 14. That is, the electromagnetic shielding film 18 may have a third hollow area in the first insulating layer 182 near the end of the cover plate in the second direction Y to avoid the corresponding conductive adhesive layer 186. The electromagnetic shielding film 18 may have a fourth hollow area in at least one end near the cover plate along the third direction Z to avoid the corresponding conductive adhesive layer 186. The electromagnetic shielding film 18 may have a first hollow area in the conductive adhesive layer 186 near the end of the cover plate in the second direction Y to avoid the bending zone 113; the electromagnetic shielding film 18 may have a second hollow area in at least one end near the cover plate along the third direction Z to avoid the conductive adhesive layer 186 (as shown in FIG. Figure 5f shown).

[0080] In some embodiments, the conductive adhesive layer 186 may be a conductive foam with double-sided adhesive. This can better enhance the ground connection with the inner side of the cover plate (e.g., the ink layer 22 area at the edge of the cover plate), facilitate the formation of a continuous low-impedance loop, achieve stability and reliability of electrical performance, and effectively suppress external electromagnetic interference and prevent problems caused by internal static electricity accumulation.

[0081] In some embodiments, such as Figure 3 As shown, the electromagnetic shielding film 18 may include a first area 187, a second area 188 and a third area 189 connected in sequence in the first direction X. The first area 187 covers the circuit board 16 (for example, the circuit board 161 containing electronic components and part of the adapter circuit board 162). The projection of the first area 187 on the support layer 14 can cover the projection of the circuit board 16 on the support layer 14. The first area 187 is the area of ​​the main electronic components and generates the most heat. The second area 188 covers the driver chip 17. The projection of the second area 188 on the support layer 14 can cover the projection of the driver chip 17 and part of the adapter circuit board 162 on the support layer 14. The second area 188 generates less heat than the first area 187. The third area 189 extends in the second direction Y and at least partially covers the bending area 113. The third region 189 may partially cover the bending zone 113; or may completely cover the bending zone 113, so as to further improve the overall mechanical strength and shock resistance of the display module (such as an OLED device), further extend the life of the display module (such as an OLED device), and reduce damage caused by physical impact.

[0082] In some embodiments, such as Figure 5a , Figure 5b , Figure 5c , Figure 5d and Figure 5eAs shown, the first insulating layer 182 is at least disposed in the first region 187 and the second region 188. Specifically, the first insulating layer 182 may be disposed in the first region 187 and the second region 188 (eg Figure 5d or Figure 5e ); or arranged in the first region 187, the second region 188 and the third region 189 (for example Figure 5a , Figure 5b or Figure 5c ). The conductive layer 183 is at least disposed in the first region 187 and the second region 188. Specifically, the conductive layer 183 may be disposed in the first region 187 and the second region 188 (eg Figure 5d or Figure 5e ); or arranged in the first region 187, the second region 188 and the third region 189 (for example Figure 5a , Figure 5b or Figure 5c ). The graphite layer 184 is at least disposed in the first region 187. Specifically, the graphite layer 184 may be disposed only in the first region 187 (eg Figure 5e ); or set in the first area 187 and the second area 188 (for example Figure 5b , Figure 5c or Figure 5d ); or arranged in the first region 187, the second region 188 and the third region 189 (for example Figure 5a The second insulating layer 185 is disposed in the first region 187, the second region 188 and the third region 189 (eg Figure 5a , Figure 5b , Figure 5c , Figure 5d or Figure 5e ).

[0083] In some embodiments, such as Figure 5e As shown, the first insulating layer 182 can be arranged in the first region 187 and the second region 188; the conductive layer 183 can be arranged in the first region 187 and the second region 188; the graphite layer 184 can be arranged only in the first region 187. The second insulating layer 185 can be arranged in the first region 187, the second region 188 and the third region 189. In this way, key components can be better protected from overheating damage and costs can be reduced to the greatest extent.

[0084] In some embodiments, the graphite layer 184 may be disposed at least in the first region 187 and the second region 188 (eg Figure 5a , Figure 5b , Figure 5cor Figure 5d Figure 5e ). For example, Figure 5d As shown, the first insulating layer 182 can be arranged in the first area 187 and the second area 188; the conductive layer 183 can be arranged in the first area 187 and the second area 188; the graphite layer 184 can be arranged in the first area 187 and the second area 188. The second insulating layer 185 can be arranged in the first area 187, the second area 188 and the third area 189. In this way, key components and components such as driver ICs can be better protected from overheating damage, and the cost can be reduced to a certain extent, and the conductive foam arranged in the third area 189 (that is, the end of the electromagnetic shielding film 18 close to the cover plate in the second direction Y) can also be avoided.

[0085] In some embodiments, the first insulating layer 182 may be disposed in the first region 187, the second region 188, and the third region 189 (eg, Figure 5a , Figure 5b or Figure 5c ). For example, Figure 5c As shown, the first insulating layer 182 can be arranged in the first region 187, the second region 188 and the third region 189; the conductive layer 183 can be arranged in the first region 187 and the second region 188; the graphite layer 184 can be arranged in the first region 187 and the second region 188. The second insulating layer 185 can be arranged in the first region 187, the second region 188 and the third region 189. In this way, key components and components such as driver ICs can be better protected from overheating damage, and the cost can be reduced to a certain extent.

[0086] In some embodiments, the conductive layer 183 may be disposed in the first region 187, the second region 188, and the third region 189 (eg, Figure 5a or Figure 5b ). For example, Figure 5b As shown, the first insulating layer 182 can be arranged in the first region 187, the second region 188 and the third region 189; the conductive layer 183 can be arranged in the first region 187, the second region 188 and the third region 189; the graphite layer 184 can be arranged in the first region 187 and the second region 188. The second insulating layer 185 can be arranged in the first region 187, the second region 188 and the third region 189. In this way, key components and components such as driver ICs can be better protected from overheating damage, the electromagnetic shielding capability of the third region 189 can be improved, and the cost can be reduced to a certain extent.

[0087] In some embodiments, for example Figure 5a As shown, the first insulating layer 182 can be arranged in the first region 187, the second region 188 and the third region 189. The conductive layer 183 can be arranged in the first region 187, the second region 188 and the third region 189. The graphite layer 184 can be arranged in the first region 187, the second region 188 and the third region 189. The second insulating layer 185 can be arranged in the first region 187, the second region 188 and the third region 189. In this way, the transfer of heat to the lower driving IC region can be blocked, and the heat dissipation performance of the display module and the electromagnetic shielding performance can be improved to the greatest extent, while simplifying the process and facilitating manufacturing.

[0088] In some embodiments, the circuit board 16 (for example, the circuit board 161 including electronic components and the adapter circuit board 162) may include a first copper-exposed area located on a side away from the display panel 11; the first insulating layer 182 may have through holes to avoid the copper-exposed area of ​​the circuit board 16 and the driver chip 17. Specifically, the first insulating layer 182 may have through holes in the first area 187, the second area 188, and the third area 189 (if any) to avoid the copper-exposed area of ​​the circuit board 16, the driver chip 17, and the internal circuits or connection points in the bending area 113.

[0089] The display module of the embodiment of the present application is a flexible OLED module design combined with EMI shielding tape, which can not only enhance the EMI protection of the display module, but also improve the overall mechanical stability of the display module. It can balance the display effect and the special needs of professional equipment. The weather resistance enhancement technology designed for harsh environments (by extending the EMI / shielding film) can enable OLED devices to maintain high performance in different usage scenarios. Therefore, in addition to giving full play to the excellent display performance of OLED (especially flexible OLED), it can also enhance its mechanical robustness, environmental tolerance, especially electromagnetic interference (EMI) protection and seismic performance in target application fields (such as industrial control, medical and naval applications), and can meet the demanding requirements in these professional fields.

[0090] Based on the same inventive concept, corresponding to any of the display modules in the above embodiments, the present application also provides a display device.

[0091] In some possible embodiments, the display device may further include a touch panel disposed on the display module.

[0092] In some of the embodiments, the display device may be a flexible display device.

[0093] In some of the embodiments, the display device can be applied to products or components with display functions, such as vehicle-mounted display screens, medical instrument display screens, and navigators.

[0094] The device of the above embodiment includes the corresponding display module in any of the above embodiments, and has the beneficial effects of the corresponding display module embodiment, which will not be described in detail here.

[0095] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0096] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0097] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0098] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises a display area and a binding area, and a bending area bending and connecting the display area and the binding area; A back film layer, arranged on the backlight side of the display area; A support layer, arranged on a side of the back film layer away from the display panel; A circuit board is arranged on a side of the support layer away from the display panel and is electrically connected to the display panel; A driving chip is arranged on a side of the binding area away from the supporting layer; An electromagnetic shielding film is arranged on a side of the driving chip away from the supporting layer; The electromagnetic shielding film extends in a first direction to cover the circuit board and the driving chip; And extends in the second direction to at least partially cover the bending area; wherein the first direction is perpendicular to the second direction, and the first direction is parallel to the surface of the display area.

2. The display module according to claim 1, characterized in that: In a direction in which the electromagnetic shielding film is away from the display panel, the electromagnetic shielding film includes a bonding layer, a first insulating layer, a conductive layer, a graphite layer and a second insulating layer which are stacked.

3. The display module according to claim 2, characterized in that: The electromagnetic shielding film comprises a first region, a second region and a third region connected in sequence in a first direction; wherein the first region covers the circuit board; the second region covers the driver chip; the third region extends in the second direction and at least partially covers the bending area; Among them, the first insulating layer is at least arranged in the first region and the second region; the conductive layer is at least arranged in the first region and the second region; the graphite layer is at least arranged in the first region; and the second insulating layer is arranged in the first region, the second region and the third region.

4. The display module according to claim 3, characterized in that: The first insulating layer is disposed in the first region and the second region; the conductive layer is disposed in the first region and the second region; and the graphite layer is disposed in the first region.

5. The display module according to claim 3, characterized in that: The first insulating layer is disposed in the first region and the second region; the conductive layer is disposed in the first region and the second region; and the graphite layer is disposed in the first region and the second region.

6. The display module according to claim 3, characterized in that: The first insulating layer is disposed in the first region, the second region, and the third region; the conductive layer is disposed in the first region and the second region; and the graphite layer is disposed in the first region and the second region.

7. The display module according to claim 3, characterized in that: The first insulating layer is disposed in the first region, the second region, and the third region; the conductive layer is disposed in the first region, the second region, and the third region; and the graphite layer is disposed in the first region and the second region.

8. The display module according to claim 3, characterized in that: The first insulating layer is disposed in the first region, the second region and the third region; the conductive layer is disposed in the first region, the second region and the third region; and the graphite layer is disposed in the first region, the second region and the third region.

9. The display module according to any one of claims 2 to 8, characterized in that: The circuit board includes a first copper-exposed area located at a side away from the display panel; the first insulating layer is provided with a through hole to avoid the copper-exposed area of ​​the circuit board and the driving chip.

10. The display module according to claim 2, characterized in that: The electromagnetic shielding film further extends on at least one side along a third direction to cover at least one edge of the display area along the third direction; wherein the third direction is perpendicular to the surface of the display area and perpendicular to the second direction.

11. The display module according to claim 10, characterized in that: The display module also includes a cover plate arranged on the side of the display area away from the circuit board; the electromagnetic shielding film extends to the cover plate at least in the second direction; and a conductive adhesive layer is provided at the end of the electromagnetic shielding film close to the cover plate at least in the second direction, and the conductive adhesive layer is used to bond the electromagnetic shielding film and the cover plate.

12. The display module according to claim 11, characterized in that: The electromagnetic shielding film extends to the cover plate in the second direction and on at least one side along the third direction; and a conductive adhesive layer is provided at the end of the electromagnetic shielding film in the second direction close to the cover plate and on at least one side along the third direction.

13. The display module according to claim 12, characterized in that: The electromagnetic shielding film has a first hollow area in the conductive adhesive layer near the end of the cover plate in the second direction to avoid the bending area; the electromagnetic shielding film has a second hollow area in the first insulating layer near at least one end of the cover plate along the third direction to avoid the conductive adhesive layer.

14. The display module according to claim 12, characterized in that: The conductive adhesive layer is conductive foam; the bonding layer is at least arranged on a side of the first insulating layer close to the display panel, and the bonding layer avoids the conductive foam.

15. A display device, characterized in that: It comprises the display module as claimed in any one of claims 1 to 14.

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