Vacuum bubble pumping machine for silicon chip after dispensing

Abstract

The invention relates to the technical field of silicon chip production and processing, in particular to a vacuum bubble pumping machine for a silicon chip after dispensing. The vacuum bubble pumping machine for the silicon chip after dispensing comprises a workbench, a vacuumizing device, a feeding conveying line, a discharging conveying line, a feeding mechanism and a discharging mechanism, and the vacuumizing device, the feeding conveying line, the discharging conveying line, the feeding mechanism and the discharging mechanism are arranged on the workbench. The feeding mechanism is used for obtaining silicon chips of the feeding conveying line and conveying the silicon chips to the vacuumizing device, and the discharging mechanism is used for obtaining the silicon chips subjected to vacuumizing treatment in the vacuumizing device and conveying the silicon chips to the discharging conveying line. The vacuum transfer device has the advantages that the structural design is reasonable, mechanical feeding, discharging, transferring and vacuumizing operation can be achieved, the number of manual participation links is small, production is more standardized, product quality improvement is facilitated, and the machining efficiency is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon chip production and processing, and in particular to a silicon chip post-glue dispensing vacuum bubbling machine. Background Art

[0002] In the silicon chip processing process, there is a step of dispensing glue on the silicon chip. Since there may be bubbles in the glue after dispensing, vacuum treatment is generally performed after dispensing.

[0003] At present, most of the traditional vacuum extraction devices use manual opening of the door, and then put the carrier containing the silicon chip in for vacuum extraction. After that, the door is opened again, and the carrier is manually taken out and transferred to the next processing link. This processing method is basically a combination of manual labor and equipment, with low processing efficiency and high labor costs.

[0004] Based on this, it is necessary to develop a silicon chip post-dispensing vacuum bubble extraction machine to overcome the above technical problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a vacuum bubbling machine after silicon chip dispensing, which effectively overcomes the defects of the prior art.

[0006] The technical solution of the present invention to solve the above technical problems is as follows:

[0007] A silicon chip post-glue dispensing vacuum bubbling machine comprises a workbench and a vacuum device, a loading conveyor line, a unloading conveyor line, a loading mechanism and a unloading mechanism respectively installed on the workbench, wherein the loading conveyor line and the unloading conveyor line are distributed on both sides of the vacuum device, the loading mechanism is used to obtain the silicon chip from the loading conveyor line and transport it to the vacuum device, and the unloading mechanism is used to obtain the silicon chip after vacuum treatment in the vacuum device and transport it to the unloading conveyor line.

[0008] Based on the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, a cabinet is provided at the lower end of the workbench, and a clean box is provided at the upper end. Both ends of the clean box are respectively provided with material openings corresponding to the loading conveyor line and the unloading conveyor line.

[0010] Furthermore, the vacuum device comprises a base plate, a vacuum base, a sealing chamber and a lifting mechanism. The lower end of the vacuum base is mounted on the upper end of the workbench through a bracket. The edges of the vacuum base are spaced apart with a plurality of connecting rods vertically passing through the base. The upper ends of the connecting rods are connected to the lower ends of the sealing chambers, and the lower ends of the connecting rods are connected to the base plate. The lifting mechanism is mounted on the workbench and connected to the base plate, and is used to drive the base plate to drive the connecting rods and the sealing chamber to move downward until they are sealed and fitted to the upper end of the vacuum base, or to drive the base plate to drive the connecting rods and the sealing chamber to move upward. A placement rack for placing carriers in multiple layers is provided on the upper end of the vacuum base, and a vacuum port is provided on the base that passes through the base from top to bottom, and the lower end of the vacuum port is connected to the vacuum equipment through a pipeline.

[0011] Furthermore, the placement rack includes two vertically arranged and parallel spaced shelf plates, and the relatively close sides of the two shelf plates are symmetrically and spaced apart from each other with multiple layers of slots, and the two ends of the carrier are respectively inserted into the two slots of the same layer, and a through area extending toward both sides of the vacuum pumping device is formed between the two shelf plates, and the spacing between the two shelf plates is adjustable.

[0012] Furthermore, the above-mentioned loading conveyor line and unloading conveyor line are both belt conveyor lines, and their conveying directions are toward the two ends of the above-mentioned vacuum pumping device.

[0013] Furthermore, the above-mentioned feeding mechanism includes a first linear moving module, a second linear moving module, a third linear moving module and a carrier fixture. The above-mentioned first linear moving module is assembled on the above-mentioned workbench and is located on the side of the above-mentioned feeding conveyor line. The above-mentioned first linear moving module is connected to the above-mentioned second linear moving module, the above-mentioned second linear moving module is connected to the above-mentioned third linear moving module, and the above-mentioned third linear moving module is connected to the above-mentioned carrier fixture. The above-mentioned first linear moving module is used to drive the above-mentioned second linear moving module to move horizontally along the conveying direction of the above-mentioned feeding conveyor line, the above-mentioned second linear moving module is used to drive the above-mentioned third linear moving module to move vertically, and the above-mentioned third linear moving module is used to drive the above-mentioned carrier fixture to move horizontally in an orientation perpendicular to the conveying direction of the above-mentioned feeding conveyor line.

[0014] Furthermore, the first linear motion module, the second linear motion module and the third linear motion module are all electric linear motion modules.

[0015] Furthermore, the above-mentioned carrier clamp includes a mounting plate, two anti-dropping claws, two groups of suction cup frames, two groups of suction cups and a claw cylinder. The above-mentioned mounting plate is horizontally arranged, and one end of the above-mentioned suction cup frames is connected to the above-mentioned third linear motion module. The two groups of the above-mentioned suction cup frames are installed at intervals at the lower part of the other end of the above-mentioned mounting plate, and the distance between the two is adjustable. The two groups of the above-mentioned suction cups are respectively installed at the lower ends of the two groups of the above-mentioned suction cup frames, and are respectively connected to negative pressure equipment through pipelines. The two above-mentioned anti-dropping claws are distributed at intervals on the side where the two groups of the above-mentioned suction cup frames are away from each other. The above-mentioned claw cylinder is installed at the lower end of the above-mentioned mounting plate, and is respectively connected to the two above-mentioned anti-dropping claws, and is used to drive the two above-mentioned anti-dropping claws to move closer or farther relative to each other. The sides of the lower ends of the two above-mentioned anti-dropping claws that are close to each other are respectively provided with mating grooves adapted to the two ends of the carrier.

[0016] Furthermore, the structure of the above-mentioned unloading mechanism is consistent with that of the above-mentioned loading mechanism.

[0017] Furthermore, the above-mentioned vacuum pumping devices are provided in plurality and are arranged in a row at intervals.

[0018] The beneficial effects of the present invention are: reasonable structural design, capable of realizing mechanized loading, unloading, transfer and vacuuming operations, less manual participation, more standardized production, conducive to improving product quality, and greatly improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the vacuum bubbling machine after silicon chip dispensing of the present invention;

[0020] Figure 2 It is a structural schematic diagram of the vacuum bubble extraction machine for silicon chip glue dispensing from another perspective of the present invention;

[0021] Figure 3 It is a schematic diagram of the structure of the vacuum bubbling machine after silicon chip dispensing of the present invention after removing the loading conveying line and the unloading conveying line;

[0022] Figure 4 It is a structural schematic diagram of the vacuum pumping device in the vacuum pumping machine for silicon chip glue dispensing of the present invention;

[0023] Figure 5 It is a structural schematic diagram of another perspective of the vacuum pumping device in the vacuum pumping machine for silicon chip post-gluing of the present invention;

[0024] Figure 6 It is a structural schematic diagram of a feeding mechanism in a vacuum bubbling machine after silicon chip dispensing of the present invention;

[0025] Figure 7 It is a structural schematic diagram of another perspective of the feeding mechanism in the vacuum bubbling machine after silicon chip dispensing of the present invention;

[0026] Figure 8It is a structural schematic diagram of a carrier fixture in a vacuum bubbling machine after silicon chip dispensing of the present invention;

[0027] Fig. 9 It is a structural schematic diagram of another perspective of the carrier clamp in the vacuum bubble extraction machine after silicon chip dispensing of the present invention.

[0028] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0029] 1. Workbench; 2. Vacuuming device; 3. Loading conveyor line; 4. Unloading conveyor line; 5. Loading mechanism; 6. Unloading mechanism; 21. Bottom plate; 22. Vacuuming base; 23. Sealing chamber; 24. Lifting mechanism; 25. Placement rack; 51. First linear motion module; 52. Second linear motion module; 53. Third linear motion module; 54. Carrier fixture; 231. Connecting rod; 251. Shelf plate; 541. Mounting plate; 542. Anti-drop clamp; 543. Suction cup rack; 544. Suction cup. DETAILED DESCRIPTION

[0030] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0031] Example: Figure 1 , 2 As shown in Figure 3, the vacuum bubbling machine for silicon chip glue dispensing after the present embodiment includes a workbench 1 and a vacuum device 2, a loading conveyor line 3, a unloading conveyor line 4, a loading mechanism 5 and a unloading mechanism 6 respectively installed on the above-mentioned workbench 1. The above-mentioned loading conveyor line 3 and the unloading conveyor line 4 are distributed on both sides of the above-mentioned vacuum device 2. The above-mentioned loading mechanism 5 is used for obtaining the carrier equipped with the carrier from the above-mentioned loading conveyor line 3 and transporting it to the above-mentioned vacuum device 2. The above-mentioned unloading mechanism 6 is used for obtaining the carrier after vacuum treatment in the above-mentioned vacuum device 2 and transporting it to the above-mentioned unloading conveyor line 4.

[0032] In the vacuum blister machine for silicon chip dispensing of the present embodiment, the conveying directions of the loading conveyor line 3 and the unloading conveyor line 4 are parallel (towards the two ends of the workbench 1 respectively, and the two are arranged in parallel on both sides of the vacuum device 2), and the carrier of the silicon chip after dispensing is placed on the loading conveyor line 3 and transported to one side of the vacuum device 2, and then the loading mechanism 5 obtains the incoming material and transfers it to the vacuum device 2 for vacuuming, and after the vacuuming is completed, the unloading mechanism 6 obtains the carrier from the vacuum device 2, and then transfers it to the unloading conveyor line 4, and then the unloading conveyor line 4 is transported downstream, more specifically, one end (feeding end) of the loading conveyor line 3 can be connected to the feeding production line, and one end (discharging end) of the unloading conveyor line 4 can be connected to the unloading production line to transport to the next production link. The overall structural design is reasonable, and mechanized loading, unloading, transfer and vacuuming operations can be realized, with fewer manual participation links, more standardized production, which is conducive to improving product quality and greatly improving processing efficiency.

[0033] As a preferred embodiment, a cabinet is provided at the lower end of the workbench 1, and a clean box is provided at the upper end. Both ends of the clean box are provided with material openings corresponding to the loading conveyor line 3 and the unloading conveyor line 4, respectively.

[0034] In the above implementation scheme, the relevant operating devices (electrical components and tools) of the entire device can be placed in the cabinet at the lower end, a clean box is installed on the upper end of the workbench 1 (FFU is installed on the top of the clean box to purify the inner cavity), and an industrial computer connected to each electrical component in the device (such as the loading conveyor line 3, the unloading conveyor line 4, the vacuum device 2, etc.) is installed outside the clean box to realize automated and intelligent control operation.

[0035] It should be noted that a material inlet is provided at one end of the clean box, and a material outlet is provided at the other end. The material inlet is connected to the feed end of the loading conveyor line 3, and the material outlet is connected to the discharge end of the unloading conveyor line 4. The above-mentioned feeding production line is arranged outside one end of the clean box, and the discharge end of the feeding production line and the feeding end of the loading conveyor line 3 are closely connected to each other at the material inlet. The above-mentioned unloading production line is arranged outside the other end of the clean box, and the feed end of the unloading production line and the discharge end of the unloading conveyor line 4 are closely connected to each other at the material outlet.

[0036] As a preferred embodiment, Figure 4 and 5As shown, the vacuum device 2 includes a bottom plate 21, a vacuum base 22, a sealing chamber 23 and a lifting mechanism 24. The lower end of the vacuum base 22 is mounted on the upper end of the workbench 1 through a bracket. The edges of the vacuum base 22 are respectively provided with a plurality of connecting rods 231 vertically passing through it. The upper ends of the connecting rods 231 are respectively connected to the lower ends of the sealing chamber 23, and the lower ends of the connecting rods 231 are respectively connected to the bottom plate 21. The lifting mechanism 24 is mounted on the workbench 1 and connected to the bottom plate 21, and is used to drive the bottom plate 21 to drive the connecting rods 231 and the sealing chamber 23 to move downward until they are sealed and fitted to the upper end of the vacuum base 22, or to drive the bottom plate 21 to drive the connecting rods 231 and the sealing chamber 23 to move upward. The upper end of the vacuum base 22 is provided with a placement rack 25 for placing carriers in multiple layers up and down. The vacuum base 22 is provided with a vacuum port running through it up and down, and the lower end of the vacuum port is connected to the vacuum equipment through a pipeline.

[0037] In the above embodiment, after the loading mechanism 5 loads the carrier with silicon chips into the placement rack 25, the loading mechanism 5 is retracted, and the lifting mechanism 24 drives the bottom plate 21, the connecting rod 231 and the sealing chamber 23 to move downward, so that the sealing chamber 23 covers the placement rack 25, and moves to the lower end of the sealing chamber 23 and the upper end of the vacuum base 22 to seal and fit, and then the vacuum equipment is turned on to vacuumize the chamber formed between the sealing chamber 23 and the vacuum base 22. After the vacuum treatment is completed, the lifting mechanism 24 drives the sealing chamber 23 to move upward and open, and the unloading mechanism 6 takes out the carrier from the placement rack 25, and transfers it to the unloading conveyor line 4 for conveying downstream. The entire structural design is very reasonable, and can mechanically realize the opening and closing of the warehouse, loading, unloading, and vacuuming operations.

[0038] In this embodiment, the lifting mechanism 24 can be a cylinder.

[0039] It should be noted that a sealing strip or other structure can be provided at the lower open edge of the sealing chamber 23 to improve the sealing performance, so as to achieve a better seal after the sealing chamber 23 is moved downward, which is beneficial to the subsequent vacuuming operation. In addition, the vacuuming equipment can be a conventional negative pressure device on the market.

[0040] As a preferred embodiment, the placement rack 25 includes two vertically arranged and parallel spaced shelf plates 251, and the relatively close sides of the two shelf plates 251 are symmetrically and spaced apart from each other with multiple layers of slots, and the two ends of the carrier are respectively inserted into the two slots of the same layer, and a through area extending toward both sides of the vacuum pumping device 2 is formed between the two shelf plates 251, and the spacing between the two shelf plates 251 is adjustable.

[0041] In the above embodiment, the two shelves 251 are symmetrically distributed, and the multi-layer slots on the sides close to each other can hold multiple carriers (the two ends of the carrier are respectively inserted into the slots on the same layer of the two shelves 251). After the multi-layer carriers are placed on the shelf 251, the sealing chamber 23 is moved down and closed for a vacuum treatment. This can perform vacuum treatment on a large number of silicon chips after glue dispensing at one time, with high efficiency.

[0042] In this embodiment, the loading conveyor line 3 and the unloading conveyor line 4 are both belt conveyor lines (adaptable conveyor lines on the market can be used), and their conveying directions are toward the two ends of the vacuum pumping device 2. Among them, the loading conveyor line 3 and the unloading conveyor line 4 can be arranged in a line with multiple sections of belt conveyor lines to achieve long-distance transportation.

[0043] As a preferred embodiment, Figure 6 and 7 As shown, the feeding mechanism 5 includes a first linear moving module 51, a second linear moving module 52, a third linear moving module 53 and a carrier fixture 54. The first linear moving module 51 is installed on the workbench 1 and is located on the side of the feeding conveyor line 3. The first linear moving module 51 is connected to the second linear moving module 52, the second linear moving module 52 is connected to the third linear moving module 53, and the third linear moving module 53 is connected to the carrier fixture 54. The first linear moving module 51 is used to drive the second linear moving module 52 to move horizontally along the conveying direction of the feeding conveyor line 3, the second linear moving module 52 is used to drive the third linear moving module 53 to move vertically, and the third linear moving module 53 is used to drive the carrier fixture 54 to move horizontally in an orientation perpendicular to the conveying direction of the feeding conveyor line 3.

[0044] In the above-mentioned implementation scheme, the first linear movable module 51 can drive the second linear movable module 52, the third linear movable module 53 and the carrier fixture 54 to move horizontally along the conveying direction of the loading conveyor line 3, the second linear movable module 52 can drive the third linear movable module 53 and the carrier fixture 54 to move horizontally along the conveying direction perpendicular to the loading conveyor line 3 to move closer to or away from the vacuum device 2, and the third linear movable module 53 can drive the carrier fixture 54 to move up and down. Such coordination can enable the carrier fixture 54 to move to any position in the conveying direction of the loading conveyor line 3, and at the same time, can enable the carrier fixture 54 to move horizontally closer to or away from the placement rack 25 of the vacuum device 2, and the up and down movement of the carrier fixture 54 can insert carriers at different heights in the placement rack 25. The design is very clever.

[0045] In this embodiment, the first linear motion module 51 , the second linear motion module 52 and the third linear motion module 53 are all electric linear modules of suitable models available on the market.

[0046] As a preferred embodiment, Figure 8 and 9 As shown, the carrier fixture 54 includes a mounting plate 541, two anti-drop clamping claws 542, two groups of suction cup frames 543, two groups of suction cups 544 and a clamping claw cylinder (indicated by M in the figure). The mounting plate 541 is horizontally arranged, and one end of the mounting plate 541 is connected to the third linear motion module 53. The two groups of suction cup frames 543 are spaced apart at the lower part of the other end of the mounting plate 541, and the distance between the two is adjustable. The two groups of suction cups 544 are respectively mounted on the two groups of suction cup frames 543. The two anti-drop jaws 542 are spaced apart at one side of the two groups of suction cup frames 543 away from each other. The jaw cylinder is mounted on the lower end of the mounting plate 541 and are respectively connected to the two anti-drop jaws 542 for driving the two anti-drop jaws 542 to move closer or farther away from each other. The lower ends of the two anti-drop jaws 542 are close to each other on one side thereof and are respectively provided with engaging grooves matched with the two ends of the carrier.

[0047] In the above embodiment, after the carrier fixture 54 moves to the carrier above the conveying surface of the feeding conveyor line 3, the two groups of suction cups 544 respectively adsorb the carrier under the negative pressure provided by the negative pressure device, and then, as the carrier fixture 54 rises upward, the claw cylinder drives the two anti-drop claws 542 to clamp from both sides of the carrier (specifically, the side ends of the two sides of the carrier are respectively embedded in the embedding grooves of the anti-drop claws 542), which plays a role in preventing it from falling. After obtaining the carrier, as the carrier fixture 54 moves close to the placement rack 25, to After reaching the slot height of the corresponding layer (at this time, the height of the carrier is consistent with the height of the slot of the corresponding layer), the two ends of the carrier are inserted from one side of the slot and are completely embedded in the placement rack 25 as the carrier fixture 54 moves. After that, the suction cup 544 contacts and adsorbs, and the anti-drop clamp 542 is released. The carrier fixture 54 returns to its original position with the linkage of the first linear moving module 51, the second linear moving module 52, and the third linear moving module 53. The entire carrier fixture 54 can effectively obtain the carrier and transport it to the placement rack 25 for stacking layer by layer.

[0048] In this embodiment, the unloading mechanism 6 has the same structure as the loading mechanism 5. The structure and operation principle of the unloading mechanism 6 are the same as those of the loading mechanism 5, except that the unloading mechanism 6 obtains the carrier from the placement rack 25 and then places it on the unloading conveyor line 4.

[0049] As a preferred embodiment, the above-mentioned vacuum pumping devices 2 are provided in plurality and are arranged in a row at intervals.

[0050] In the above embodiment, a plurality of vacuum pumping devices 2 are provided, and are arranged in a row along the conveying direction of the loading conveyor line 3 at intervals to realize multi-station vacuum processing, wherein the loading conveyor line 3 and the unloading conveyor line 4 can fully cover the plurality of vacuum pumping devices 2, and the loading mechanism 5 and the unloading mechanism 6 can realize the loading and unloading operations of the plurality of vacuum pumping devices 2.

[0051] It should be particularly emphasized that the silicon chip post-dispensing vacuum bubble extraction machine of this embodiment is equipped with a control system (including an industrial computer), and all electrical components involved in the device can be connected to the control system to achieve automated and intelligent control operation.

[0052] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0054] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0057] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A vacuum bubbling machine for silicon chip dispensing. Features: The invention comprises a workbench (1) and a vacuum device (2), a loading conveyor line (3), a unloading conveyor line (4), a loading mechanism (5) and a unloading mechanism (6) respectively mounted on the workbench (1); the loading conveyor line (3) and the unloading conveyor line (4) are distributed on both sides of the vacuum device (2); the loading mechanism (5) is used to obtain a carrier equipped with a carrier from the loading conveyor line (3) and transport it to the vacuum device (2); the unloading mechanism (6) is used to obtain a carrier that has been vacuumed in the vacuum device (2) and transport it to the unloading conveyor line (4).

2. A vacuum bubbling machine for silicon chip dispensing according to claim 1, Features: A cabinet is provided at the lower end of the workbench (1), and a clean box is provided at the upper end; both ends of the clean box are provided with material openings corresponding to the loading conveyor line (3) and the unloading conveyor line (4), respectively.

3. A vacuum bubbling machine for silicon chip dispensing according to claim 1, Features: The vacuum extraction device (2) comprises a bottom plate (21), a vacuum extraction base (22), a sealing chamber (23) and a lifting mechanism (24); the lower end of the vacuum extraction base (22) is mounted on the upper end of the workbench (1) through a bracket; the edges of the vacuum extraction base (22) are respectively provided with a plurality of connecting rods (231) vertically penetrating the vacuum extraction base (22); the upper ends of the connecting rods (231) are respectively connected to the lower ends of the sealing chamber (23); the lower ends of the connecting rods (231) are respectively connected to the bottom plate (21); the lifting mechanism (24) is mounted on the workbench (1); The workbench (1) is connected to the bottom plate (21) and is used to drive the bottom plate (21) to drive the connecting rod (231) and the sealing chamber (23) to move downward until they are sealed against the upper end of the vacuum base (22), or to drive the bottom plate (21) to drive the connecting rod (231) and the sealing chamber (23) to move upward. The upper end of the vacuum base (22) is provided with a placement rack (25) for placing carriers in multiple layers up and down. The vacuum base (22) is provided with a vacuum port running through it from top to bottom, and the lower end of the vacuum port is connected to a vacuum device through a pipeline.

4. A vacuum bubbling machine for silicon chip dispensing according to claim 3, Features: The placement rack (25) comprises two shelf plates (251) arranged vertically and spaced in parallel, and the two shelf plates (251) are symmetrically provided with multiple slots spaced up and down on the relatively close sides thereof, and the two ends of the carrier are respectively inserted into the two slots of the same layer, and a through area extending toward the two sides of the vacuum pumping device (2) is formed between the two shelf plates (251), and the spacing between the two shelf plates (251) is adjustable.

5. A vacuum bubbling machine for silicon chip dispensing according to claim 3, Features: The loading conveyor line (3) and the unloading conveyor line (4) are both belt conveyor lines, and their conveying directions are toward the two ends of the vacuum pumping device (2).

6. A vacuum bubbling machine for silicon chip dispensing according to claim 5, Features: The feeding mechanism (5) comprises a first linear moving module (51), a second linear moving module (52), a third linear moving module (53) and a carrier fixture (54); the first linear moving module (51) is mounted on the workbench (1) and is located on the side of the feeding conveyor line (3); the first linear moving module (51) is connected to the second linear moving module (52); the second linear moving module (52) is connected to the third linear moving module (53); the third linear moving module (53) is connected to the carrier fixture (54); the first linear moving module (51) is used to drive the second linear moving module (52) to move horizontally along the conveying direction of the feeding conveyor line (3); the second linear moving module (52) is used to drive the third linear moving module (53) to move vertically; and the third linear moving module (53) is used to drive the carrier fixture (54) to move horizontally in a direction perpendicular to the conveying direction of the feeding conveyor line (3).

7. A vacuum bubbling machine for silicon chip dispensing according to claim 6, Features: The first linear motion module (51), the second linear motion module (52) and the third linear motion module (53) are all electric linear modules.

8. A vacuum bubbling machine for silicon chip dispensing according to claim 6, Features: The carrier fixture (54) comprises a mounting plate (541), two anti-drop clamping claws (542), two groups of suction cup frames (543), two groups of suction cups (544) and a clamping claw cylinder. The mounting plate (541) is horizontally arranged, and one end of the mounting plate (541) is connected to the third linear motion module (53). The two groups of suction cup frames (543) are spaced apart at the lower part of the other end of the mounting plate (541), and the distance between the two groups is adjustable. The two groups of suction cups (544) are respectively mounted on the two groups of suction cup frames (543). The two anti-drop clamps (542) are spaced apart and distributed on the side away from each other of the two groups of suction cup frames (543). The clamp cylinder is mounted on the lower end of the mounting plate (541) and is respectively connected to the two anti-drop clamps (542) for driving the two anti-drop clamps (542) to move closer or farther relative to each other. The sides of the lower ends of the two anti-drop clamps (542) that are close to each other are respectively provided with fitting grooves that match the two ends of the carrier.

9. A vacuum bubbling machine for silicon chip dispensing according to claim 6, Features: The structure of the unloading mechanism (6) is consistent with that of the loading mechanism (5).

10. A vacuum bubbling machine for silicon chip after glue dispensing according to any one of claims 1 to 9, Features: The vacuum extraction devices (2) are provided in plurality and are arranged in a row at intervals.

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