Translation type light sensing chip three-temperature sorting machine

Abstract

The invention relates to a translation type light sensing chip three-temperature sorting machine, which relates to the field of three-temperature sorting machines, and comprises a frame, one side of the top of the frame is sequentially provided with a Tray feeding module, an empty Tray module, an empty Tray module and three automatic Bin sorting modules, a high-precision feeding taking and placing module, a feeding shuttle car module, a testing head module, a discharging shuttle car module, a fixed Bin dividing module and a discharging taking and placing module are arranged on the other opposite side of the top of the frame, and an empty Tray carrying module, a camera pre-positioning module, a pre-warming module and a camera positioning module are arranged between the Tray feeding module and the feeding shuttle car module. And a refrigerating unit is arranged in the frame and below the pre-heating module. According to the invention, the use cost can be reduced, the carrying precision can be improved, the chip can be positioned, the output efficiency can be improved, a light path system required by the light sensing chip test is integrated, the fogging problem of the light source, the lens and the chip under the low-temperature condition is solved, and the accurate control of the temperature can be realized.

Description

Technical Field

[0001] The present invention relates to the field of three-temperature sorting machines, and in particular to a translational three-temperature sorting machine for photosensitive chips. Background Art

[0002] The three-temperature sorting machines currently on the market are all for ordinary IC chips, and there are no three-temperature sorting machines for photosensitive chips (including CIS, TOF, laser radar chips, etc.). With the use of automotive chips, three-temperature testing of photosensitive chips is required. There are currently some technical difficulties, especially in the low-temperature testing part. Ziyi's translational photosensitive chip three-temperature sorting machine has overcome these difficulties.

[0003] Existing IC three-temperature sorting machines, such as Figure 1 As shown, there are several disadvantages when targeting photosensitive chips: (1) The cost of replacement is high and maintenance is inconvenient; (2) The placement accuracy is low and can only adapt to the tolerance range of ±0.1mm; (3) Mechanical guidance and positioning can easily cause scratches on the product and damage the chip; (4) The probe part cannot integrate the optical path structure; (5) Under low temperature conditions, it is impossible to solve the fogging and low temperature resistance of the light source, lens, and chip itself; (6) The test station cannot reduce the chip temperature to the required test temperature.

[0004] The reasons for the above shortcomings are: (1) In the existing layout, there are two sets of loading and unloading shuttle modules and two sets of test head structures. Because the photosensitive chip probe part is expensive, occupies a large space, and has a low test cycle, this will increase the cost; (2) The existing synchronous belt structure has low accuracy without feedback; (3) The XY accuracy of pick-up and placement is low, and the height direction accuracy of the suction head is low. When the chip is placed in the pre-positioning module, the chip will collide with the side of the pre-positioning module and cause damage; (4) The existing test heads are all ordinary suction structures, which do not take into account the components required for photosensitive chip testing such as integrated light sources and lenses, and conventional components cannot be used under low temperature conditions. Special materials need to be used for high and low temperature environments; (5) Under low temperature conditions, the light source, lens and photosensitive chip surface will have the problem of fogging, which cannot be solved by the current three-temperature machine; (6) The current test station of the three-temperature machine is cooled by cold air. There are two problems with this cooling method. First, the temperature can only be reduced to -30℃, which cannot meet the test requirements; second, this cooling method has the disadvantage of uneven temperature control. Summary of the invention

[0005] The purpose of the present invention is to provide a translational photosensitive chip three-temperature sorting machine, which reduces the use cost, improves the handling accuracy, chip positioning, and output efficiency. It is compatible with a simple test board or a complete set of test machines, and integrates the optical path system required for photosensitive chip testing. It solves the fogging problem of the light source, lens, and chip itself under low temperature conditions, can perform low-temperature control on the test station, and can achieve precise temperature control.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the present invention provides a translational photosensitive chip three-temperature sorting machine, including a frame, wherein one side of the top of the frame is provided with a Tray loading module, an empty Tray outlet module, an empty Tray inlet module, and three automatic Bin modules in sequence, and the other side opposite to the top of the frame is provided with a high-precision loading and placing module, a loading shuttle module, a test head module, a unloading shuttle module, a fixed Bin module, and an unloading and placing module, an empty Tray transport module, a camera pre-positioning module, a pre-temperature module, and a camera positioning module are provided between the Tray loading module and the loading shuttle module, and a refrigeration unit is provided in the frame and below the pre-temperature module.

[0007] Preferably, a high-precision transmission mechanism is used in the moving parts of the high-precision loading and placing module and the loading shuttle module.

[0008] Preferably, for the photosensitive chip, the probe part only uses a set of suction head and light source system, and the refrigerant sets and controls the temperature of the temperature control component through the refrigerant pipeline.

[0009] In summary, the present invention includes the following beneficial technical effects:

[0010] The present invention can achieve: (1) a layout tailored to the characteristics of photosensitive chip testing, so that customers can use it at a low cost; (2) high-precision handling and chip positioning; (3) high UPH and high output efficiency; (4) the ability to connect to various test equipment and be compatible with a simple test board or a complete set of test machines; (5) the ability to integrate the optical path system required for photosensitive chip testing; (6) the ability to solve the fogging problem of the light source, lens, and chip itself under low temperature conditions; (7) the ability to perform low-temperature control on the test station and to achieve precise temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a top view schematic diagram of the prior art;

[0012] Figure 2 It is a structural schematic diagram of the prior art;

[0013] Figure 3 It is a schematic diagram of the structure of a test head module in the prior art;

[0014] Figure 4 The schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for the translational photosensitive chip of the present invention is as follows Figure 1 ;

[0015] Figure 5 The schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for the translational photosensitive chip of the present invention is as follows Figure 2 ;

[0016] Figure 6 This is a schematic diagram of the high-precision loading and placing module structure in a three-temperature sorting machine for translational photosensitive chips of the present invention. Figure 1 ;

[0017] Figure 7 This is a schematic diagram of the high-precision loading and placing module structure in a three-temperature sorting machine for translational photosensitive chips of the present invention. Figure 2 ;

[0018] Figure 8 The schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for the translational photosensitive chip of the present invention is as follows Figure 3 ;

[0019] Fig. 9 A schematic top view of a translational photosensitive chip three-temperature sorting machine of the present invention;

[0020] Fig.10 This is a schematic diagram of the overall structure of a translational photosensitive chip three-temperature sorting machine of the present invention;

[0021] Fig.11 The local structure of a three-temperature sorting machine for translational photosensitive chips of the present invention is shown in FIG. Figure 1 ;

[0022] Fig.12 The schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for the translational photosensitive chip of the present invention is as follows Figure 4 .

[0023] Reference numerals:

[0024] 1', loading and unloading shuttle module A; 2', testing module; 3', loading and unloading shuttle module B; 4', pre-positioning module; 5', loading and unloading module; 6', empty tray handling module; 7', fixed binning module; 8', unloading and unloading module; 9', tray loading module; 10', empty tray out module; 11', empty tray in module; 12', automatic binning module; 13', suction head system; 14', test head module;

[0025] 1. Tray loading module; 2. Empty Tray out module; 3. Empty Tray in module; 4. Automatic binning module; 5. Empty Tray handling module; 6. Camera pre-positioning module; 7. Pre-temperature module; 8. Camera positioning module; 9. High-precision loading and unloading module; 10. Loading shuttle module; 11. Test head module; 12. Unloading shuttle module; 13. Fixed binning module; 14. Unloading and unloading module; 15. Frame; 16. Refrigeration unit; 17. Light source system; 18. Temperature control component; 19. Suction plate with suction chip products; 20. Refrigerant pipeline; 21. Temperature control component; 22. Linear motor; 23. Test chamber; 24. Test station temperature control component. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The present embodiment is a translational photosensitive chip three-temperature sorting machine, including a tray loading module 1, an empty tray outlet module 2, an empty tray inlet module 3, an automatic binning module 4, an empty tray transport module 5, a camera pre-positioning module 6, a pre-temperature module 7, a camera positioning module 8, a high-precision loading and placing module 9, a loading shuttle module 10, a test head module 11, a unloading shuttle module 12, a fixed binning module 13, an unloading and placing module 14, a frame 15, and a refrigeration unit 16.

[0028] On one side of the top of the frame 15, there are arranged in sequence a tray loading module 1, an empty tray outlet module 2, an empty tray inlet module 3, and three automatic binning modules 4; on the other side opposite to the top of the frame 15, there are arranged a high-precision loading and placing module 9, a loading shuttle module 10, a test head module 11, an unloading shuttle module 12, a fixed binning module 13, and an unloading and placing module 14; between the tray loading module 1 and the loading shuttle module 10, there are arranged an empty tray transport module 5, a camera pre-positioning module 6, a pre-heating module 7, and a camera positioning module 8; and a refrigeration unit 16 is provided in the frame 15 and below the pre-heating module 7.

[0029] The test head module 11 includes a test cavity 23, in which a light source system 17, a temperature control component 18, and a suction plate 19 for sucking chip products are arranged from top to bottom. Two refrigerant pipes 20 are vertically arranged on both sides of the light source system 17, and the bottom of the refrigerant pipe 20 is connected to the two ends of the top surface of the temperature control component 18. The high-precision loading and placing module 9 is provided with two linear motors 22.

[0030] The implementation principle of the present invention is as follows:

[0031] The tray loaded with the photosensitive chip is transported to the designated position through the tray loading module 1, positioned and clamped, the camera pre-positioning module 6 pre-positions the chip, the high-precision loading and placing module 9 takes the chip from the tray, moves it to the camera positioning module 8, and performs precise positioning. After positioning, the chip is taken and transferred to the pre-heating module 7 for pre-heating or pre-cooling. After the pre-heating is completed, the high-precision loading and placing module 9 takes the chip from the pre-heating module 7, and then transfers it to the loading shuttle module 10. The loading shuttle module 10 transports the chip to the loading position of the test head module 11. The test head module 11 takes the chip from the loading shuttle module 10 and transfers it to the test station for high temperature or low temperature testing. After the test is completed, the test head module 11 outputs the tested chip to the unloading shuttle module 12. The unloading shuttle module 12 transfers the chip to the unloading position. The unloading and placing module 14 places the chip in the designated tray according to the test results.

[0032] Among them, the empty tray transport module 5 transports the empty tray of the tray loading module 1 to the empty tray outlet module 2 for stacking and output; the empty tray can also be transported from the empty tray inlet module 3 to the automatic binning module 4.

[0033] The refrigeration unit 16 performs precise low-temperature control on the pre-heating module 7 , the loading shuttle module 10 , and the test head module 11 during the test process. Fig.11 The temperature control component of the middle test station can provide a lower temperature for the test part, which can reach below -45℃, far exceeding the traditional -30℃, and the temperature control is more uniform and precise.

[0034] Comparison analysis with traditional IC three-temperature sorting machine:

[0035] from Figure 7 and Figure 2 The comparison, Figure 8 From the enlarged view, it can be clearly seen that the present invention has only one set of loading shuttle module 10 and unloading shuttle module 12, and only one set of fixture; there is also only one set of test head module 11, which reduces the use cost of customers and improves maintainability;

[0036] A high-precision transmission mechanism is used in the moving parts of the loading and placing module and the loading shuttle module 10, and a motion control algorithm is used to improve the picking and placing accuracy, so that the product will not be scratched when placed in the pre-positioning module.

[0037] from Figure 3 and Figure 4 By comparison, it can be seen that the probe parts of the two devices are different. The traditional IC three-temperature sorting machine cannot integrate the structure of the optical path part, but the present invention can.

[0038] Compared with the description of disadvantage (1) in the background technology:

[0039] like Figure 2 As shown, there are two sets of loading and unloading shuttle modules, the loading and unloading shuttle module A and the loading and unloading shuttle module B. Each shuttle has two sets of fixtures, one for loading and the other for unloading. Figure 2 As shown in the figure, there are two sets of test head structures; the test head part of the traditional chip only has a suction head system, such as Figure 3 shown.

[0040] For the photosensitive chip, the probe part includes the light source system and the suction head system. Figure 3 As shown, in the layout of the traditional IC test sorting machine, if the probe part of the photosensitive chip is arranged, it will take up a large space, be very inconvenient to maintain, and have high cost.

[0041] In the present invention, for the light sensing chip, the probe part only uses a set of suction head and light source system. The refrigerant sets and controls the temperature of the temperature control component through the refrigerant pipeline, thereby achieving temperature control of the product. Figure 5 shown.

[0042] Compared with the description of disadvantage (2) in the background technology:

[0043] In the existing IC three-temperature machines, the structure for handling chips is a synchronous belt mechanism, and there is no feedback element such as a magnetic scale in the horizontal direction. The result of this structure is low pick-and-place accuracy, which makes it less adaptable to products, especially photosensitive chips, which have high dimensional accuracy. This will cause scratches on the chips during the pick-and-place process. In this solution, in view of the high dimensional accuracy of photosensitive chips, a linear motor is used to drive the chip loading part of the handling mechanism, which ensures that the chip movement accuracy can be controlled within 100% during the loading and placing process.

[0044] ±0.01mm, no scratches on the product during the pick-up and placement process.

[0045] Compared with the description of disadvantage (3) in the background technology:

[0046] In the existing IC three-temperature machine, the positioning of the chip is mechanically positioned by the pre-heating module 7. Since the pick-and-place mechanism adopts a synchronous belt mechanism, the moving precision is low. When the chip is placed in the positioning groove of the pre-heating module 7, it will inevitably cause scratches with the chip. For traditional packaged chips, the impact is not great, but for photosensitive chips, the impact is relatively large. If it causes edge collapse, it will cause product defects. Therefore, in this scheme, three measures are taken to solve this problem. First, as mentioned above, a linear motor is used to drive the XY axis, thereby bringing high precision of movement. Second, before taking the material from the Tray, the product in the Tray is initially positioned by the "camera pre-positioning module 6", so that the suction head can ensure the consistency of accuracy when taking the material; third, after the suction head has taken the material, the product is positioned again by the "camera positioning module 8". The XY axis is placed in the positioning groove of the pre-heating tray after calibration according to the deviation value collected by the camera to avoid scratches between the chip and the pre-heating tray, thereby avoiding damage to the chip.

[0047] Compared with the description of disadvantage (4) in the background technology:

[0048] The existing IC three-temperature machines are for ordinary chips, and the requirements for the probe part are only to absorb, control the temperature and apply pressure. However, the test for photosensitive chips requires an optical path system, which needs to be added. In this solution, the optical path system can be easily integrated into the probe part, such as Figure 4 shown.

[0049] Compared with the description of disadvantage (5) in the background technology:

[0050] The existing IC three-temperature machine is aimed at traditional chips, whose surfaces are all plastic-sealed structures, which are not easy to form fog. A little fog does not affect the test. However, for photosensitive chips, there are some glass-like components. Under low temperature conditions, it is easy to form fog on the chip surface. If it is not properly solved, it will affect the passage of light and thus affect the test results. In this solution, the air dew point in the test cavity is controlled by the independence and sealing of the test cavity. At the same time, dry air with a low dew point is blown to the surface during the chip test, thereby ensuring that the chip surface will not fog during the test process.

[0051] Compared with the description of disadvantage (6) in the background technology:

[0052] The existing IC three-temperature machine only uses cold air to cool down the lower cover of the test station. Under normal circumstances, the temperature can only be reduced to -30℃, and the temperature control cannot be uniform. In this solution, not only the temperature of the cold air is controlled, but also the temperature of the lower cover of the test is controlled by refrigerant. This method can not only ensure low temperature, but also ensure temperature uniformity.

[0053] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A translation type photosensitive chip three-temperature sorting machine, characterized in that: The invention comprises a frame (15), wherein one side of the top of the frame (15) is provided with a tray loading module (1), an empty tray outlet module (2), an empty tray inlet module (3), and three automatic binning modules (4) in sequence; the other side opposite to the top of the frame (15) is provided with a high-precision loading and placing module (9), a loading shuttle module (10), a test head module (11), a unloading shuttle module (12), a fixed binning module (13), and an unloading and placing module (14); an empty tray transport module (5), a camera pre-positioning module (6), a pre-heating module (7), and a camera positioning module (8) are provided between the tray loading module (1) and the loading shuttle module (10); and a refrigeration unit (16) is provided in the frame (15) and below the pre-heating module (7).

2. The three-temperature sorting machine for translational photosensitive chips according to claim 1, characterized in that: A high-precision transmission mechanism is used in the moving parts of the high-precision loading and placing module (9) and the loading shuttle module (10).

3. The three-temperature sorting machine for translational photosensitive chips according to claim 1, characterized in that: For the photosensitive chip, the probe part only uses a set of suction head and light source system, and the refrigerant sets and controls the temperature of the temperature control component through the refrigerant pipeline.

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