Automatic cleaning machine for ceramic plate belt sheet for silicon carbide wafer processing

Abstract

The invention discloses an automatic cleaning machine for a ceramic plate belt piece for silicon carbide wafer processing. The automatic cleaning machine comprises a rack; the base is rotatably mounted on the rack; the two fluid devices are arranged on one side of the base; the cleaning brush is arranged on one side of the base; the nitrogen nozzle faces the base; wherein the ceramic disc is placed on the base, a silicon carbide wafer is arranged on the ceramic disc, the side, facing the cleaning brush, of the base is obliquely arranged, the two-fluid device is provided with a two-fluid spray head, the two-fluid spray head faces the base, the cleaning brush is fixedly installed at the output end of the first driving motor, and the two-fluid device is fixedly installed on the rotating shaft. The rotating shaft is fixedly installed at the output end of the rotating cylinder. Compared with the prior art, the problems that cleaning is not thorough and resources are wasted due to the fact that polishing liquid cleaning is not timely in the existing silicon carbide wafer machining process are solved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to an automatic cleaning machine for ceramic discs used for processing silicon carbide wafers. Background Art

[0002] The main application areas of silicon carbide wafers are LED solid lighting and high-frequency devices. This material has excellent properties such as bandgap, drift velocity, breakdown voltage, thermal conductivity, high temperature resistance, etc. that are several times higher than traditional silicon. It has irreplaceable advantages in electronic applications such as high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, microwave, and extreme environment applications such as aerospace, military industry, and nuclear energy.

[0003] The fine polishing of silicon carbide usually adopts the single-sided CMP polishing method. After the CMP processing of the silicon carbide wafer bonded to the ceramic disk is completed, the residual polishing liquid remaining on the surface needs to be cleaned.

[0004] In the existing processing of silicon carbide wafers, the silicon carbide wafers need to be removed from the ceramic plate first and then cleaned, which easily leads to untimely cleaning of the silicon carbide wafers, not only making it difficult to thoroughly clean the residual polishing liquid, but also causing a waste of resources such as cleaning liquid, electricity, and time. Summary of the invention

[0005] The purpose of the present invention is to provide an automatic cleaning machine for ceramic discs used in silicon carbide wafer processing, so as to solve the problems of incomplete cleaning and waste of resources caused by untimely cleaning of polishing liquid in the existing silicon carbide wafer processing process.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: an automatic cleaning machine for ceramic discs for silicon carbide wafer processing, comprising:

[0007] frame;

[0008] A base, which is rotatably mounted on the frame;

[0009] A two-fluid device, which is disposed on one side of the base;

[0010] A cleaning brush is arranged on one side of the base;

[0011] a nitrogen nozzle directed toward the base;

[0012] Among them, the ceramic disk is placed on the base, a silicon carbide wafer is arranged on the ceramic disk, the base is inclined toward the cleaning brush side, a two-fluid nozzle is arranged on the two-fluid device, the two-fluid nozzle faces the base, the cleaning brush is fixedly installed at the output end of the first drive motor, the two-fluid device is fixedly installed on the rotating shaft, and the rotating shaft is fixedly installed at the output end of the rotating cylinder.

[0013] As a further description of the above technical solution:

[0014] Symmetrically arranged rollers are arranged on both sides of the cleaning brush. The rollers are rotatably mounted on the frame, the rollers are tilted, and the side walls of the rollers contact the side wall surface of the base.

[0015] As a further description of the above technical solution:

[0016] The ceramic disc is vacuum-adsorbed onto the surface of the base.

[0017] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0018] 1. In the present invention, after polishing, the silicon carbide wafer is sent to the cleaning machine together with the ceramic disc for cleaning. The cleaning machine is designed with a base for placing the ceramic disc, which can be compatible with ceramic discs of different sizes. The base is at a certain angle with the horizontal plane, so that when the two-fluid device flushes the residual polishing liquid on the surface of the silicon carbide wafer, the sewage flows away in time. After cleaning, the nitrogen nozzle dries the ceramic disc and the silicon carbide wafer to ensure the cleanliness of the surface of the ceramic disc and the silicon carbide wafer.

[0019] 2. In the present invention, the ceramic disc is cleaned to clean the polishing liquid residue on the silicon carbide wafer immediately after polishing, making the cleaning more efficient and simple, fully removing the polishing liquid, realizing resource saving in the cleaning process, and improving the production efficiency of the silicon carbide wafer.

[0020] 3. In the present invention, the base is driven to rotate by a motor, which in turn drives the ceramic disk on the base to rotate automatically. At the same time, the two-fluid device is driven to rotate by a rotary cylinder to adjust the distance between the two-fluid nozzle and the center of the base. As the base rotates, the two-fluid nozzle can rinse all positions on the ceramic disk. When the internal space of the cleaning machine is limited, the position adjustment of the two-fluid nozzle can be achieved, effectively ensuring the cleaning quality of the silicon carbide wafer.

[0021] 4. In the present invention, a cleaning brush is arranged on one side of the base to clean the edge of the ceramic disc during its rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 The present invention is a structural schematic diagram of an automatic cleaning machine for ceramic discs used in silicon carbide wafer processing.

[0024] Figure 2The figure is a cleaning schematic diagram of an automatic cleaning machine for ceramic discs used in silicon carbide wafer processing.

[0025] Figure 3 A schematic diagram of the installation of a base in an automatic cleaning machine for ceramic reels used in silicon carbide wafer processing Figure 1 .

[0026] Figure 4 A schematic diagram of the installation of a base in an automatic cleaning machine for ceramic reels used in silicon carbide wafer processing Figure 2 .

[0027] Legend:

[0028] 1. Frame; 11. Shield; 12. Second drive motor; 2. Base; 3. Two-fluid device; 31. Two-fluid nozzle; 32. Rotating shaft; 33. Rotating cylinder; 4. Cleaning brush; 41. First drive motor; 5. Nitrogen nozzle; 6. Drum; 7. Air filter; 9. Ceramic disc; 91. Silicon carbide wafer. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0032] In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0033] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Example 1

[0035] See also Figure 1-4 The present invention provides a technical solution: an automatic cleaning machine for ceramic discs used for processing silicon carbide wafers, comprising:

[0036] Rack 1;

[0037] A base 2 rotatably mounted on the frame 1;

[0038] A two-fluid device 3, which is arranged on one side of the base 2;

[0039] A cleaning brush 4 is arranged on one side of the base 2;

[0040] a nitrogen nozzle 5, which faces the base 2;

[0041] Among them, the ceramic disk 9 is placed on the base 2, and a silicon carbide wafer 91 is arranged on the ceramic disk 9. The base 2 is arranged inclined toward the cleaning brush 4. A two-fluid nozzle 31 is arranged on the two-fluid device 3, and the two-fluid nozzle 31 faces the base 2. The cleaning brush 4 is fixedly installed at the output end of the first drive motor 41, and the two-fluid device 3 is fixedly installed on the rotating shaft 32, and the rotating shaft 32 is fixedly installed at the output end of the rotating cylinder 33.

[0042] Ceramic disc cleaning can clean the polishing liquid residue on the silicon carbide wafer immediately after polishing, making the cleaning more efficient and simple, fully removing the polishing liquid, realizing resource saving in the cleaning process, and improving the production efficiency of silicon carbide wafers.

[0043] The cleaning brush 4 is provided with symmetrically arranged rollers 6 on both sides, and the rollers 6 are rotatably mounted on the frame 1. The rollers 6 are arranged obliquely, and the side walls of the rollers 6 contact the side wall surface of the base 2. The rollers 6 and the base 2 have the same inclination angle, forming a support for the base 2, effectively ensuring the stable rotation of the base 2, and preventing the ceramic plate 9 from falling and detaching from the base 2.

[0044] The cleaning brush 4 is a nylon brush, which improves wear resistance, prevents the generation of debris, and ensures the cleaning effect.

[0045] The frame 1 is provided with a second drive motor 12, which is used to drive the base 2 to rotate. The rotating shaft of the base 2 passes through the work surface and extends below the work surface. The output end of the second drive motor 12 drives the rotating shaft of the base 2 to rotate through a synchronous belt mechanism.

[0046] Working principle: After polishing, the silicon carbide wafer 91 is sent to the cleaning machine together with the ceramic disc 9 for cleaning. The cleaning machine is designed with a base 2 for placing ceramic discs, which can be compatible with ceramic discs 9 of different sizes. The base 2 is at a certain angle with the horizontal plane, which is convenient for the two-fluid device 3 to flush the residual polishing liquid on the surface of the silicon carbide wafer 91, and the sewage flows away in time. After cleaning, the nitrogen nozzle 5 dries the ceramic disc 9 and the silicon carbide wafer 91 to ensure the cleanliness of the surface of the ceramic disc 9 and the silicon carbide wafer 91. The cleaning brush 4 set on one side of the base 2 cleans the edge of the ceramic disc 9 during the rotation of the ceramic disc 9.

[0047] The base 2 is driven to rotate by a motor, which in turn drives the ceramic disk 9 on the base 2 to rotate automatically. At the same time, the two-fluid device 3 is driven to rotate by a rotating cylinder 33 to adjust the distance between the two-fluid nozzle 31 and the center of the base 2. As the base 2 rotates, the two-fluid nozzle 31 can rinse all positions on the ceramic disk 9. When the internal space of the cleaning machine is limited, the position adjustment of the two-fluid nozzle 31 can be achieved, thereby effectively ensuring the cleaning quality of the silicon carbide wafer 91.

[0048] Example 2

[0049] This embodiment further provides the following improved technical solution based on the above embodiment: the ceramic disk 9 is vacuum-adsorbed on the surface of the base 2 .

[0050] It is compatible with ceramic disks 9 of different sizes and simplifies the structure of the base 2 to avoid cleaning liquid and polishing liquid remaining on the base 2, thereby avoiding contamination of the ceramic disk 9 and silicon carbide wafer 91 that are subsequently cleaned.

[0051] Example 3

[0052] This embodiment further provides the following improved technical solutions based on the above embodiment: the nitrogen nozzle 5 is arranged above the cleaning brush 4. The nitrogen nozzle 5 sprays the ceramic disk 9 and the silicon carbide wafer 91 at the lowest point on the base 2 to avoid substances remaining on the ceramic disk 9 and the silicon carbide wafer 91, and cleans the cleaning brush 4 to ensure the subsequent cleaning quality of the brush.

[0053] Example 4

[0054] Based on the above embodiments, this embodiment further makes the following improved technical solutions: a baffle 11 is provided on the frame 1, and the base 2 is provided inside the baffle 11, which effectively controls the impact range of the cleaning of silicon carbide wafers in the cleaning machine and facilitates the collection of waste liquid.

[0055] The top edge of the shield 11 is bent outward to form a flange, which is convenient for disassembling and carrying the shield 11.

[0056] Example 5

[0057] This embodiment further provides the following improved technical solutions based on the above embodiments: an air filter 7 is provided on the top of the frame 1 to effectively ensure the cleanliness of the gas inside the cleaning machine and the cleaning quality of the silicon carbide wafers.

[0058] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An automatic cleaning machine for ceramic discs for silicon carbide wafer processing, characterized in that: include: frame; A base rotatably mounted on the frame; A two-fluid device, which is disposed on one side of the base; A cleaning brush, which is arranged on one side of the base; a nitrogen nozzle directed toward the base; Among them, a ceramic disk is placed on the base, a silicon carbide wafer is arranged on the ceramic disk, the base is arranged inclined toward the cleaning brush side, a two-fluid nozzle is arranged on the two-fluid device, the two-fluid nozzle faces the base, the cleaning brush is fixedly installed at the output end of the first drive motor, the two-fluid device is fixedly installed on the rotating shaft, and the rotating shaft is fixedly installed at the output end of the rotating cylinder.

2. The automatic cleaning machine for ceramic discs for silicon carbide wafer processing according to claim 1, characterized in that: The cleaning brush is provided with symmetrically arranged rollers on both sides. The rollers are rotatably mounted on the frame. The rollers are arranged obliquely, and the side walls of the rollers contact the side wall surface of the base.

3. The automatic cleaning machine for ceramic discs and tapes for silicon carbide wafer processing according to claim 1, characterized in that: The ceramic disk is vacuum-adsorbed on the surface of the base.

4. The automatic cleaning machine for ceramic discs and tapes for silicon carbide wafer processing according to claim 1, characterized in that: The nitrogen nozzle is arranged above the cleaning brush.

5. The automatic cleaning machine for ceramic discs and tapes for silicon carbide wafer processing according to claim 1, characterized in that: The cleaning brush is a nylon brush.

6. The automatic cleaning machine for ceramic discs and tapes for silicon carbide wafer processing according to claim 1, characterized in that: The frame is provided with a shield, and the base is arranged inside the shield.

7. The automatic cleaning machine for ceramic discs and tapes for silicon carbide wafer processing according to claim 1, characterized in that: The frame is provided with a second driving motor, and the second driving motor is used for driving the base to rotate.

8. The automatic cleaning machine for ceramic discs and tapes for silicon carbide wafer processing according to claim 1, characterized in that: An air filter is arranged on the top of the frame.

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