Ceramic chip removing device

Abstract

Provided is a ceramic chip removal device capable of easily removing ceramic chips, which are residues of a ceramic green sheet, from the surface of a support film. The ceramic chip removing device (100) is characterized by comprising a conveying mechanism (20) for conveying a film (1) which comprises a supporting film (3) and ceramic chips (7) which are residues of ceramic green sheets and are attached to the surface of the supporting film (3); and a peeling mechanism (40) for peeling the ceramic chips (7) from the support film (3), the peeling mechanism (40) having: a medium tank (41) in which a medium (43) is stored; and an ultrasonic element (45) that vibrates the medium (43) by applying ultrasonic waves to the medium (43), and the membrane (1) is configured so as to pass through the medium groove (41).

Description

Technical Field

[0001] The invention relates to a ceramic chip removing device. Background Art

[0002] As a method for manufacturing electronic components such as laminated ceramic capacitors, there is known a method of laminating ceramic green sheets obtained by forming ceramic materials into sheets before firing, press-forming them, and then firing and singulating them, thereby mass-producing small electronic components at one time.

[0003] Generally, in order to improve handling properties, a ceramic green sheet is formed on the surface of a resin film (also referred to as a supporting film) serving as a support, and is peeled off from the surface of the supporting film when used.

[0004] When the ceramic green sheet is peeled off from the support film, a part of the ceramic green sheet may remain on the surface of the support film. In order to recycle such a support film, a step of cleaning (removing) ceramic scraps, which are residues of the ceramic green sheet, is required.

[0005] For example, Patent Document 1 discloses a release film recycling method including a film cleaning step of bringing a first bonding roller into contact with a resin film to cause adherent matter adhered to the resin film to adhere to the first bonding roller.

[0006] Prior Art Literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2010-005597 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] However, in recent years, as electronic components have become smaller, the ceramic green sheet has been thinned. If the ceramic green sheet is thinned, the handling property is reduced. Therefore, in order to suppress this, the holding force between the ceramic green sheet and the support film may be increased.

[0011] Therefore, in the method described in Patent Document 1, the holding force between the ceramic green sheet and the support film is strong, and the ceramic scraps that are the residue of the ceramic green sheet may not be completely removed.

[0012] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a ceramic chip removing device capable of easily removing ceramic chips, which are residues of a ceramic green sheet, from the surface of a supporting film.

[0013] Means used to solve problems

[0014] The ceramic chip removal device of the present invention is characterized in that it comprises: a conveying mechanism for conveying a film including a supporting film and ceramic chips as residues of ceramic raw sheets attached to the surface of the supporting film; and a peeling mechanism for peeling the ceramic chips from the supporting film, the peeling mechanism comprising: a medium tank for storing a medium; and an ultrasonic element for applying ultrasonic waves to the medium to vibrate the medium, the film being configured to pass through the medium tank.

[0015] Effects of the Invention

[0016] According to the present invention, ceramic scraps, which are residues of the ceramic green sheet, can be easily removed from the surface of the supporting film. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention.

[0018] Figure 2 This is a cross-sectional view schematically showing an example of the ceramic chip removing device of the present invention.

[0019] Figure 3 yes Figure 2 A partial enlarged view of the peeling mechanism and its surroundings.

[0020] Figure 4 is a cross-sectional view schematically showing another example of the peeling mechanism.

[0021] Description of Reference Numerals

[0022] 1: membrane;

[0023] 3: Support membrane;

[0024] 3a: surface of the supporting film (upper surface);

[0025] 3b: surface of the supporting film (lower surface);

[0026] 5: Unpeeled ceramic green sheet;

[0027] 6: Peeling residue of ceramic green sheet;

[0028] 7: Ceramic chips;

[0029] 20: conveying mechanism;

[0030] 21: conveying roller;

[0031] 23: tension adjustment roller;

[0032] 25: suction roller;

[0033] 27: conveyor roller;

[0034] 40: stripping mechanism;

[0035] 41: medium tank;

[0036] 41a: first side surface of the dielectric tank;

[0037] 41b: the second side surface of the dielectric groove;

[0038] 41c: the third side of the dielectric slot;

[0039] 41d: the fourth side of the dielectric slot;

[0040] 41e: bottom surface of the medium tank;

[0041] 43: medium;

[0042] 45: Ultrasonic components;

[0043] 50: Roll-out mechanism;

[0044] 60: coiling mechanism;

[0045] 70: dust collecting mechanism;

[0046] 71: suction mouth;

[0047] 73: Suction hose;

[0048] 75: chip storage part;

[0049] 100: Ceramic chip removal device. DETAILED DESCRIPTION

[0050] The ceramic chip removal device of the present invention is described below. However, the present invention is not limited to the following structure, and can be appropriately changed and applied within the scope of not changing the main purpose of the present invention. In addition, the structure obtained by combining two or more of the preferred structures of the present invention described below is also the present invention.

[0051] In this specification, terms that indicate the relationship between elements (for example, "opposite", "orthogonal", etc.) and terms that indicate the shape of an element (for example, "rectangular", etc.) do not have strict meanings but rather indicate a range of substantial equivalence, for example, also including a difference of a few percent.

[0052] The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, and scales may differ from those of actual products.

[0053] [Ceramic chips removal device]

[0054] The ceramic chip removal device of the present invention is characterized in that it comprises: a conveying mechanism for conveying a film including a supporting film and ceramic chips as residues of ceramic raw sheets attached to the surface of the supporting film; and a peeling mechanism for peeling the ceramic chips from the supporting film, the peeling mechanism comprising: a medium tank for storing a medium; and an ultrasonic element for applying ultrasonic waves to the medium to vibrate the medium, the film being configured to pass through the medium tank.

[0055] Figure 1 This is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention.

[0056] Figure 1 The film 1 shown includes a support film 3 and ceramic chips 7 as residues of a ceramic green sheet adhering to the surface of the support film 3 .

[0057] The supporting film 3 has a sheet shape in which a surface 3 a serving as an upper surface and a surface 3 b serving as a lower surface face each other, and the ceramic chips 7 are attached to the surface 3 a serving as the upper surface of the supporting film 3 .

[0058] The film 1 is in a state where ceramic green sheets of a predetermined shape are cut out from a laminated sheet in which a support film 3 and ceramic green sheets are laminated and then peeled off.

[0059] Since a part of the ceramic green sheet stacked on the surface of the supporting film 3 is cut out for use, a part that is not cut out remains on the surface of the supporting film.

[0060] It is Figure 1 The ceramic green sheet 5 is shown as not being peeled off.

[0061] Even when the ceramic green sheet stacked on the surface of the support film 3 is peeled off, the ceramic green sheet may not be completely peeled off. In such a case, fine fragments of the ceramic green sheet (unpeeled fragments) remain on the surface of the support film after the ceramic green sheet is peeled off.

[0062] It is Figure 1 The peeling residue 6 of the ceramic green sheet is shown.

[0063] As described above, the ceramic green sheets 5 that have not been peeled off and the peeling residues 6 of the ceramic green sheets adhere to the surface 3 a of the film 1 as ceramic chips 7 .

[0064] The ceramic chip removing device of the present invention is a device for removing ceramic chips from the above-mentioned film.

[0065] Figure 2 This is a cross-sectional view schematically showing an example of the ceramic chip removing device of the present invention.

[0066] Figure 2The ceramic chip removing device 100 shown includes a conveying mechanism 20 and a peeling mechanism 40 .

[0067] The transport mechanism 20 is a mechanism for transporting the film 1 .

[0068] The transport mechanism 20 includes a transport roller 21 for transporting the film 1 , a dancer roller 23 for adjusting the tension of the transported film 1 , a suction roller 25 for preventing the propagation of the tension, and a transport roller 27 for moving the film 1 in a medium tank 41 described later.

[0069] Figure 2 The thin one-way arrow in shows the direction in which the film 1 is conveyed. In addition, the thin two-way arrow indicates that the dancer roller 23 can move in the up-and-down direction.

[0070] The film 1 is unwound from the unwinding mechanism 50 to the conveying mechanism 20 .

[0071] The peeling mechanism 40 is a mechanism for peeling ceramic chips from the support film.

[0072] Figure 2 The peeling mechanism 40 shown includes a medium tank 41 , a medium 43 stored in the medium tank 41 , and an ultrasonic element 45 .

[0073] The medium 43 is vibrated by ultrasonic waves generated by the ultrasonic element 45, and the film 1 is passed through the medium tank 41 using the conveying roller 27. Thus, the ceramic chips 7 can be peeled off and removed from the surface of the supporting film 3 constituting the film 1.

[0074] The ceramic chips 7 peeled off from the surface of the supporting film 3 are collected by the dust collecting mechanism 70 .

[0075] The dust collecting mechanism 70 includes a suction nozzle 71 for sucking the peeled ceramic chips 7 , a chip storage portion 75 for storing the ceramic chips 7 , and a suction hose 73 connecting the suction nozzle 71 and the chip storage portion 75 .

[0076] The film 1 (support film 3 ) from which the ceramic chips 7 have been peeled off by the peeling mechanism 40 is wound up by the winding mechanism 60 .

[0077] Although not shown, the ceramic chip removing device 100 may include a housing, and the conveying mechanism 20 , the peeling mechanism 40 , the unwinding mechanism 50 , the winding mechanism 60 , and the dust collecting mechanism 70 are arranged in the housing.

[0078] Hereinafter, each mechanism constituting the ceramic chip removing device of the present invention will be described.

[0079] (Conveying mechanism)

[0080] The transport mechanism is a mechanism for transporting the film.

[0081] As a conveyance mechanism, a conveyance roller which conveys a film by rotation is mentioned, for example.

[0082] The transport mechanism may include, in addition to the above-mentioned transport rollers, dancer rollers for adjusting the tension of the film being transported, suction rollers for preventing the tension from being transmitted to the upstream side, transport rollers for moving the film in the medium tank, and the like.

[0083] The speed (conveying speed) at which the film is conveyed by the conveying mechanism is not particularly limited, but is preferably 100 m / min or more.

[0084] The ceramic chip removing device of the present invention may include a winding-out mechanism and a winding-up mechanism.

[0085] The unwinding mechanism is a mechanism for unwinding the film with respect to the conveying mechanism.

[0086] The winding mechanism is a mechanism for winding up the film (support film) from which the ceramic chips have been removed.

[0087] The unwinding mechanism may also be configured to be rotatable. In this case, the film can be conveyed by the conveying mechanism, and the unwinding mechanism can be freely rotated to unwind the film.

[0088] (Peeling mechanism)

[0089] The peeling mechanism is a mechanism for peeling ceramic chips constituting the film from the supporting film.

[0090] The peeling mechanism includes a medium, a medium tank storing the medium, and an ultrasonic element for applying ultrasonic waves to the medium to vibrate the medium.

[0091] When the film passes through the medium tank, the ceramic chips collide with the medium vibrating due to the application of ultrasonic waves, whereby the ceramic chips are peeled off from the surface of the supporting film.

[0092] Reference Figure 3 An example of the peeling mechanism will be described.

[0093] Figure 3 yes Figure 2 A partial enlarged view of the peeling mechanism and its surroundings.

[0094] Figure 3 The peeling mechanism 40 shown includes a medium tank 41 , a medium 43 stored in the medium tank 41 , and an ultrasonic element 45 . The film 1 passes through the medium tank 41 .

[0095] The dielectric 43 is stored in the dielectric tank 41 , so when the film 1 passes through the dielectric tank 41 , the ceramic chips 7 constituting the film 1 come into contact with the dielectric 43 .

[0096] Ultrasonic waves are applied to the medium 43 by the ultrasonic element 45 .

[0097] The medium 43 stored in the medium tank 41 is vibrated by applying ultrasonic waves to the medium 43 through the ultrasonic element 45 .

[0098] exist Figure 3 , the medium 43 to which ultrasonic waves are applied by the ultrasonic element 45 is schematically shown vibrating. In practice, how the medium vibrates at which position varies depending on the number of ultrasonic elements, the positions where they are arranged, and the state of overlapping of ultrasonic waves.

[0099] When the ceramic chips 7 collide with the vibrating medium 43 , the vibrations are transmitted to the ceramic chips 7 , so that the ceramic chips 7 can be peeled off from the surface of the supporting film 3 .

[0100] The longer the vibrating medium 43 is in contact with the ceramic chips 7, the stronger the effect of peeling off the ceramic chips 7. Therefore, the longer the distance (time) of movement in the medium tank 41 is, the longer the film 1 is in contact with the vibrating medium 43, and the more the ceramic chips 7 are peeled off.

[0101] Furthermore, before the ceramic chips 7 are completely removed from the surface of the supporting film 3 , the ceramic chips 7 are completely removed from the surface of the supporting film 3 .

[0102] Preferably, Figure 3 As shown, the film 1 is inserted into the dielectric groove 41 so that the support film 3 constituting the film 1 is on the upper side and the ceramic chips 7 are on the lower side.

[0103] When the film 1 is oriented in the above-mentioned direction, the conveying roller 27 is in contact with the supporting film 3 , and while the conveying roller 27 is in contact with the film 1 , the ceramic chips 7 are also in contact with the vibrating medium 43 , so that the ceramic chips 7 are easily peeled off.

[0104] That is, it is preferable that the surface of the supporting film 3 that is not in contact with the conveying roller 27 is the surface to which the ceramic chips 7 are attached.

[0105] The ceramic chips 7 peeled off from the surface of the support film 3 are lighter than the medium 43, and therefore, due to vibration, they are wound around from the outside in the width direction of the support film 3 and move to the surface layer of the medium groove 41. The ceramic chips 7 moved to the surface layer of the medium groove 41 are collected by the dust collecting mechanism 70.

[0106] In addition, the inner width of the dielectric groove 41 (the width of the portion storing the dielectric 43 ) is preferably larger than the width of the membrane 1 .

[0107] If the inner width of the dielectric groove 41 is larger than the width of the film 1, a gap can be formed between the end of the film 1 in the width direction and the dielectric groove 41. Through this gap, the ceramic chips 7 peeled off from the lower surface of the film 1 can easily move to the surface layer of the dielectric groove 41, so that the peeled ceramic chips 7 can be easily recovered by the dust collecting mechanism 70.

[0108] The speed at which the film passes through the medium tank is preferably 100 m / min or more.

[0109] (medium)

[0110] The media is stored in the media tank.

[0111] The material constituting the medium is not particularly limited, and examples thereof include metals, ceramics, and resins.

[0112] A medium in which the material constituting the medium is metal is also referred to as a metal medium.

[0113] The medium is preferably a metallic medium comprising a metal.

[0114] As a metal constituting the dielectric, tungsten can be cited, for example.

[0115] When the medium is made of metal, the density of the medium increases. Therefore, even if the medium is of the same size, it is easy to apply energy required for peeling the ceramic chips to the ceramic chips.

[0116] When the medium contains tungsten, the medium may be composed of metal tungsten or a compound containing tungsten. Examples of the compound containing tungsten include tungsten carbide.

[0117] When the material constituting the medium is a resin, the medium is also referred to as a resin medium.

[0118] The medium is preferably a resin medium comprising a resin.

[0119] The resin constituting the medium is preferably the same type of resin as the resin constituting the supporting film.

[0120] In this case, even if a part of the medium adheres to the support film, no impurities are mixed in.

[0121] When the material constituting the medium is ceramic, the medium is also referred to as a ceramic medium.

[0122] The dielectric may also be a ceramic dielectric.

[0123] If the medium is made of ceramic, the medium is less likely to be worn, and thus mixing of impurities can be avoided.

[0124] The shape of the medium is not particularly limited, but the equivalent circle diameter of the cross section is preferably 0.2 mm or more and 5 mm or less.

[0125] When the equivalent circle diameter of the cross section of the medium is less than 0.2 mm, the kinetic energy that can be obtained by ultrasound is small, and sometimes the ceramic chips cannot be fully peeled off. When the equivalent circle diameter of the cross section of the medium exceeds 5 mm, the gap between the media becomes larger, and sometimes it becomes difficult to make the medium collide with the ceramic chips.

[0126] The medium preferably has a shape having irregular protrusions on the surface.

[0127] If the medium has irregular protrusions on the surface, the ceramic chips are easily peeled off when the medium collides with the ceramic chips.

[0128] (Media Slot)

[0129] The medium tank is a container for storing the medium.

[0130] The dielectric tank may be configured so that the film can pass through the dielectric tank.

[0131] The shape of the medium tank may be, for example, a shape in which the upper surface is open and the side surfaces and the bottom surface are closed. In this case, the medium stored in the medium tank is exposed on the upper surface of the medium tank.

[0132] The portion where the medium is exposed is also referred to as the surface layer of the medium groove.

[0133] In the case of the dielectric trench having the above-described shape, the film enters the dielectric trench from the upper surface thereof, changes the moving direction in the dielectric trench, and moves again from the upper surface thereof to the outside of the dielectric trench.

[0134] When the film moves in the medium tank, the ceramic chips collide with the vibrating medium, thereby peeling the ceramic chips from the surface of the supporting film.

[0135] If necessary, a conveying mechanism such as a conveying roller may be arranged in the medium tank.

[0136] By arranging a transport mechanism such as a transport roller in the medium tank, the traveling direction of the film can be changed in the medium tank.

[0137] By configuring the conveying rollers in the medium slot, the following conveying path can be obtained: Figure 3 As shown, the film 1 is moved from the upper surface of the dielectric tank 41 into the dielectric tank 41 , the moving direction is changed in the dielectric tank 41 , and the film 1 is moved again from the upper surface of the dielectric tank 41 to the outside of the dielectric tank 41 .

[0138] Preferably, a suction nozzle for sucking ceramic chips in the medium tank is provided near the upper surface of the medium tank.

[0139] The ceramic chips peeled off from the film in the dielectric tank are moved to the vicinity of the upper surface of the dielectric tank by the vibration.

[0140] Therefore, by providing a suction nozzle near the upper layer of the dielectric tank, ceramic chips generated in the dielectric tank can be recovered.

[0141] If the ceramic chips peeled off from the film are present excessively in the dielectric tank, the ceramic chips peeled off once may re-adhere to the surface of the supporting film.

[0142] The above-mentioned problem can be suppressed by using a suction nozzle to recover the ceramic chips in the medium tank.

[0143] A groove, a hole, or the like in which an ultrasonic element can be disposed may be provided in the dielectric tank.

[0144] (Ultrasonic components)

[0145] Ultrasonic elements are elements that generate ultrasonic waves.

[0146] The medium is vibrated by the generated ultrasonic waves.

[0147] The vibration frequency (frequency) of the ultrasonic wave is preferably 20 kHz or more and 40 kHz or less, more preferably 25 kHz or more and 30 kHz or less, and further preferably 28 kHz.

[0148] As an ultrasonic element, a bolt-fastened Langevin type vibrator (BL vibrator) or the like is exemplified.

[0149] The ultrasonic element may be arranged on the outside or inside of the dielectric tank.

[0150] The ultrasonic element may apply ultrasonic waves to the medium via a medium groove or directly to the medium.

[0151] A horn (ultrasonic horn) may be provided at the front end of the ultrasonic element.

[0152] If a horn is provided at the tip of the ultrasonic element, the amplitude of the ultrasonic wave can be amplified, and the ultrasonic wave can be directly applied to the medium by the horn.

[0153] A plurality of ultrasonic elements may be provided.

[0154] By arranging a plurality of ultrasonic elements in the dielectric tank, it is possible to cause only the medium at a predetermined position in the dielectric tank to vibrate due to the mutual superposition of ultrasonic waves generated by the plurality of ultrasonic elements.

[0155] That is, in the ceramic chip removing device of the present invention, preferably, a plurality of ultrasonic elements are arranged in the dielectric tank, and ultrasonic waves generated by the plurality of ultrasonic elements overlap each other to vibrate only the medium at a predetermined position in the dielectric tank.

[0156] Reference Figure 4An example of a peeling mechanism using a plurality of ultrasonic elements will be described.

[0157] Figure 4 is a cross-sectional view schematically showing another example of the peeling mechanism.

[0158] Figure 4 The dielectric tank 41 shown includes a first side surface 41 a , a second side surface 41 b , a third side surface 41 c , a fourth side surface 41 d , and a bottom surface 41 e .

[0159] A total of 15 ultrasonic elements 45 are arranged in 3 rows and 5 columns on the first side surface 41 a of the dielectric tank 41. Similarly, a total of 9 ultrasonic elements 45 are arranged in 3 rows and 3 columns on the second side surface 41 b of the dielectric tank 41.

[0160] For example, if ultrasonic waves are emitted simultaneously from the ultrasonic element 45 arranged at the position C of the first side surface 41a and the ultrasonic element 45 arranged at the positions F and H of the second side surface 41b, ultrasonic waves stronger than usual can be applied to the medium 43 in an area where the ultrasonic waves emitted from the ultrasonic element 45 arranged at the position C and the ultrasonic waves emitted from the ultrasonic element 45 arranged at the positions F and H overlap.

[0161] Here, the power input to each ultrasonic element 45 can be adjusted so that the medium 43 does not vibrate when ultrasonic waves are emitted from a single ultrasonic element 45 , but vibrates in a portion where ultrasonic waves overlap (resonance portion).

[0162] According to such a configuration, only the medium in a predetermined region can be vibrated by superimposing ultrasonic waves, so that the vibrating medium can collide with only a specific region of the film, and ceramic chips can be removed efficiently.

[0163] Furthermore, for example, by causing the ultrasonic elements 45 disposed at positions A, B, C, D, and E among the plurality of ultrasonic elements disposed on the first side surface 41a to sequentially generate ultrasonic waves at staggered times, the vibrating medium 43 can be continuously caused to collide with the “same position” of the film 1 moving in the medium tank 41. Therefore, ceramic chips can be removed efficiently.

[0164] (Supporting film)

[0165] A supporting film constituting a membrane suitable for use in the ceramic chip removing device of the present invention will be described.

[0166] As the support film constituting the membrane, a conventionally known support film can be appropriately used.

[0167] The support film may be, for example, a multilayer film in which a release layer is formed on one surface of a base film serving as a base layer, and a back surface resin layer is formed on the other surface.

[0168] Examples of the resin constituting the substrate layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polysulfone, polyetheretherketone, polyethersulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, and acrylic resin.

[0169] Among them, polyester is preferred from the viewpoint of ease of processing, durability, heat resistance, cost, and the like, and polyethylene terephthalate is particularly preferred.

[0170] In addition to the above-mentioned resin, a filler may be added to the base material layer.

[0171] The substrate film constituting the substrate layer may be an unstretched film, but is preferably a uniaxially or biaxially stretched film.

[0172] The release layer can be formed, for example, by applying a release layer-forming composition on one surface of a base film, and heating and curing the composition.

[0173] The back surface resin layer can be formed, for example, by applying a back surface resin layer forming composition on the other main surface of the base film, and heating and curing the composition.

[0174] The width of the supporting film is not particularly limited, but is preferably, for example, 100 mm or more and 200 mm or less.

[0175] (Ceramic chips)

[0176] The ceramic chips constituting the film which are suitable for use in the ceramic chip removing device of the present invention will be described.

[0177] The ceramic chips are residues of the ceramic green sheet disposed on the surface of the support film.

[0178] The ceramic green sheet can be obtained, for example, by applying a slurry prepared by adding a plasticizer and an organic solvent to a ceramic material such as barium titanate and an organic binder, onto the surface of a supporting film, and drying the slurry.

[0179] The ceramic green sheet can be handled together with the support film, and then the ceramic green sheet having a predetermined shape is cut out and peeled off from the support film, and then used in the production of electronic components.

[0180] The ceramic green sheets that are not peeled off from the support film and the fine fragments of the ceramic green sheets that remain on the surface of the support film after peeling (peeling residues) become ceramic chips.

[0181] As described above, the ceramic chips are residues of the ceramic green sheet remaining on the support film, and therefore the composition of the ceramic chips is the same as that of the ceramic green sheet.

[0182] Examples of the ceramic material include barium titanate.

[0183] Metal paste that becomes internal electrodes may be printed on the surface of the ceramic green sheet, and therefore, the ceramic scraps may contain residues of the metal paste.

[0184] The ceramic chip removing device of the present invention is preferably applied to a film to which ceramic chips having a thickness of 3 μm or less are attached.

[0185] Ceramic green sheets are thinned as electronic components are miniaturized, and ceramic green sheets with a thickness of 3 μm or less are sometimes used. If the thickness of the ceramic green sheet is 3 μm or less, in order to improve the operability of the ceramic green sheet, it is necessary to increase the holding force between the ceramic green sheet and the supporting film. In this case, it is sometimes difficult to peel the ceramic chips from the supporting film. If the ceramic chip removal device of the present invention is used, the peelability of the ceramic chips can be improved, and therefore it can also be appropriately applied to a film in which the ceramic chips with a thickness of 3 μm or less are strongly attached to the supporting film.

[0186] In this specification, the following matters are described.

[0187] The present disclosure (1) is a ceramic chip removal device, characterized in that it comprises:

[0188] a conveying mechanism that conveys a film including a supporting film and ceramic chips as residues of a ceramic green sheet adhering to a surface of the supporting film; and

[0189] a peeling mechanism for peeling the ceramic chips from the supporting film,

[0190] The peeling mechanism comprises: a medium tank storing a medium; and an ultrasonic element applying ultrasonic waves to the medium to vibrate the medium.

[0191] The membrane is configured to pass within the dielectric tank.

[0192] The present disclosure (2) is based on the ceramic chip removing device described in the present disclosure (1), wherein a suction nozzle for sucking the ceramic chips in the medium tank is provided near the surface layer of the medium tank.

[0193] The present disclosure (3) is a ceramic chip removing device according to the present disclosure (1) or (2), wherein the frequency of the ultrasonic wave generated by the ultrasonic element is 20 kHz or more and 40 kHz or less.

[0194] The present disclosure (4) is a ceramic chip removal device based on any combination of any of the items in the present disclosure (1) to (3), wherein the peeling mechanism has a plurality of the ultrasonic elements.

[0195] The ceramic chip removing device is configured to vibrate only the medium at a predetermined position in the medium tank by overlapping the ultrasonic waves generated by the plurality of ultrasonic elements.

[0196] The present disclosure (5) is a ceramic chip removing device based on any combination of any of the present disclosures (1) to (4), wherein the medium is a resin medium containing a resin.

[0197] The present disclosure (6) is a ceramic chip removing device based on any combination of any items in the present disclosure (1) to (4), wherein the medium is a metal medium containing metal.

Claims

1. A ceramic chip removal device, characterized in that: have: a conveying mechanism that conveys a film including a supporting film and ceramic chips as residues of a ceramic green sheet adhering to a surface of the supporting film; and a peeling mechanism for peeling the ceramic chips from the supporting film, The peeling mechanism comprises: a medium tank storing a medium; and an ultrasonic element applying ultrasonic waves to the medium to vibrate the medium. The membrane is configured to pass within the dielectric tank.

2. The ceramic chip removing device according to claim 1, wherein: A suction nozzle for sucking the ceramic chips in the dielectric tank is provided near the surface layer of the dielectric tank.

3. The ceramic chip removing device according to claim 1 or 2, wherein: The frequency of the ultrasonic wave generated by the ultrasonic element is greater than or equal to 20 kHz and less than or equal to 40 kHz.

4. The ceramic chip removing device according to any one of claims 1 to 3, wherein: The peeling mechanism has a plurality of ultrasonic elements. The ceramic chip removing device is configured to vibrate only the medium at a predetermined position in the medium tank by overlapping the ultrasonic waves generated by the plurality of ultrasonic elements.

5. The ceramic chip removing device according to any one of claims 1 to 4, wherein: The medium is a resin medium containing resin.

6. The ceramic chip removing device according to any one of claims 1 to 4, wherein: The medium is a metallic medium containing metal.

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