Wafer dicing machine for processing light-emitting panel components

Abstract

The present invention relates to the technical field of wafer scribing machines, and discloses a wafer scribing machine for processing light-emitting panel components, comprising a scribing machine box, a product to be processed, an XY axis moving platform mounted on the inner side of the bottom of the scribing machine box, a laser scribing mechanism mounted on the inner side of the top of the scribing machine box, and a control panel installed on one side of the scribing machine box, wherein a hollow ring plate is arranged on the top of the XY axis moving platform. The wafer scribing machine for processing light-emitting panel components can be installed before processing the product to be processed, and can use a plurality of pressure detection components to perform multi-point pressure centering on the product to be processed while the meshing output component is synchronously rotated by the meshing transmission inverted T-shaped ring plate through the gear ring, so as to ensure the accuracy of alignment between the product to be processed and the laser scribing mechanism, and then after being used in combination with the wafer scribing machine consisting of the scribing machine box, the laser scribing mechanism, the laser scribing mechanism, the drain valve pipe and the control panel, the processing efficiency and processing quality can be further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer dicing machines, and in particular to a wafer dicing machine for processing light-emitting panel components. Background Art

[0002] As a self-luminous element, the light-emitting panel has the advantages of being light, thin, high brightness, low power consumption, wide viewing angle, high response speed, and flexibility. Therefore, it is used in various high-performance display and lighting fields. As the demand for the use of light-emitting panels increases, in order to further improve production efficiency, it is necessary to improve the light-emitting panel production equipment.

[0003] For example, in the wafer dicing machine used to process semiconductor components in light-emitting panels, although there is an automatic positioning structure for the initial positioning of the product to be processed, the operation basis of the automatic positioning structure is that the appearance dimensions of the product to be processed are qualified, and the detection and operation positions are usually fixed. However, in the actual production process, there are always products to be processed with unqualified appearance dimensions. This is an objective phenomenon and cannot be avoided. If it cannot be discovered before the specific dicing process, the entire product to be processed will be scrapped after the non-center positioning processing, resulting in a large loss. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a wafer dicing machine for processing light-emitting panel components, which solves the problems raised in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer dicing machine for processing light-emitting panel components, comprising a dicing machine box, a product to be processed, an XY axis moving platform mounted on the inner side of the bottom of the dicing machine box, a laser dicing mechanism mounted on the inner side of the top of the dicing machine box, and a control panel installed on one side of the dicing machine box, wherein a hollow ring plate is arranged on the top of the XY axis moving platform, a negative suction component and an inverted T-shaped ring plate are respectively mounted inside the hollow ring plate, and the output structure of the negative suction component can perform negative suction limiting on the product to be processed;

[0008] A support seat is installed between the bottom of the hollow ring plate and the top of the XY-axis moving platform, a gear ring is mounted on the outer side of the hollow ring plate, one side of the gear ring is meshingly connected with an engagement output component, and a plurality of pressure detection components are mounted inside the inverted T-shaped ring plate, and the detection ends of the plurality of pressure detection components can elastically contact with the product to be processed placed on the top of the negative suction component.

[0009] Preferably, both sides of the front end of the dicing machine box are hingedly connected with protective doors, and one side of the bottom of the dicing machine box is fixedly sleeved with a drain valve pipe.

[0010] Preferably, the negative suction component includes a transition circular plate, a ceramic negative pressure suction cup, an annular tube and a negative pressure pump. The surface of the transition circular plate is fixedly connected to the inner wall of the inner ring structure of the hollow ring plate. The top of the ceramic negative pressure suction cup serves as the output structure of the negative suction component and is sleeved inside the transition circular plate and is coplanar with the top surface of the transition circular plate. The output end of the negative pressure pump is connected to the bottom of the annular tube. A transition tube is fixedly connected between the top of the annular tube and the bottom of the ceramic negative pressure suction cup. The negative suction component is used to perform negative suction positioning on the positioned product to be processed to meet the requirements of automated positioning.

[0011] Preferably, an inverted T-shaped ring groove is provided inside the hollow ring plate, and the bottom of the inverted T-shaped ring plate is clamped on the inner side of the top of the inverted T-shaped ring groove, and sealing rings are nested between the surface of the outer ring structure of the inverted T-shaped ring plate and the inner wall of the outer ring structure of the inverted T-shaped ring groove, and between the surface of the inner ring structure of the inverted T-shaped ring plate and the inner wall of the inner ring structure of the inverted T-shaped ring groove, thereby improving the sealing performance between the inverted T-shaped ring plate and the hollow ring plate without interfering with the rotational movement of the inverted T-shaped ring plate in the hollow ring plate.

[0012] Preferably, an auxiliary bearing is mounted on the outer side of the bottom of the inverted T-shaped ring plate, and a transition sleeve is installed between the outer ring structure surface of the auxiliary bearing and the top surface of the hollow ring plate. There is a clearance space between the transition sleeve and the gear ring, and the combined transition sleeve and auxiliary bearing are used to improve the stability of the inverted T-shaped ring plate and the hollow ring plate after mounting.

[0013] Preferably, the meshing output component includes a transmission gear and a brake stepper motor, the output end of the brake stepper motor is transmission-connected to the middle of the transmission gear, one side of the transmission gear is meshingly connected to one side of the gear ring, and a fixed seat is fixedly connected between the shell surface of the brake stepper motor and the surface of the hollow ring plate.

[0014] Preferably, the plurality of pressure detection components are specifically set to three, the interior of the inverted T-shaped ring plate is provided with three give way grooves, and the middle parts of the three give way grooves are provided with slide grooves communicated with themselves, the three pressure detection components all include a transition sleeve, a T-rod, a pressure sensor and a first buffer spring, the transition sleeve is sleeved in the corresponding give way groove and spatially communicated with each other, one end of the T-rod is movably sleeved in the give way groove, and the other end of the T-rod is clamped and penetrates the inverted T-shaped ring plate and extends to the top range of the negative suction component, the pressure sensor is fixedly sleeved in the interior of the transition sleeve, and the pressure sensing surface of the pressure sensor can be fitly connected with one end of the T-rod, the two ends of the first buffer spring are respectively fixedly connected to the inner wall of the give way groove and the surface of one end of the T-rod, and the plurality of pressure detection components can be used to perform multi-point synchronous extrusion limiting and multi-point detection on the product to be processed during the synchronous rotation with the product to be processed, so as to reflect the appearance size of the product to be processed in real time.

[0015] Preferably, the synchronous limit assembly comprises an inverted L-shaped plate, a movable rod, a second buffer spring, a hemispherical shell and a metal ball, one end of the bottom of the inverted L-shaped plate is fixedly connected to the surface of the middle part of the corresponding T-shaped rod and is clamped in the slide groove, the middle part of the movable rod is clamped on the inner side of one end of the top of the inverted L-shaped plate, the two ends of the second buffer spring are respectively fixedly connected to the surface of one end of the top of the inverted L-shaped plate and to the surface of the top end of the movable rod, the top of the hemispherical shell is fixedly connected to the bottom end of the movable rod, the metal ball is clamped in the interior of the hemispherical shell and can elastically contact with the top surface of the product to be processed set on the top of the negative suction assembly, three arc-shaped baffles are installed on the inner wall of the inner ring structure of the hollow ring plate, and the surfaces of the three arc-shaped baffles correspond one by one to the inner walls of the three corresponding positions of the inner ring structure of the hollow ring plate, forming three storage spaces, thereby preventing the pressure detection assembly from contacting the product to be processed in the processed state.

[0016] Preferably, a plurality of curved infusion valve tubes are mounted on the top of the inverted T-shaped ring plate, and the plurality of curved infusion valve tubes can communicate with the inner space of the hollow ring plate through the inverted T-shaped ring plate, and the output ends of the plurality of curved infusion valve tubes are all oriented toward the inclined structure at the top of the negative suction component, thereby satisfying comprehensive spray cooling during the cutting process of the processed product, and a drainage arc groove which is not connected to its own space is provided at the bottom of the inner ring structure of the hollow ring plate, and the drainage arc groove provides a cooling liquid reflux channel.

[0017] Preferably, a water pump and a coolant tank are installed on the top of the dicing machine case, the input end of the water pump is sleeved inside the coolant tank, and the output end of the water pump is connected to a composite liquid guiding hose, one end of the composite liquid guiding hose is a spiral elastic structure and is sleeved inside one side of the bottom of the hollow ring plate, which can not only meet the use requirements of the input coolant channel, but also can undergo structural deformation to make way.

[0018] Beneficial Effects

[0019] The present invention provides a wafer dicing machine for processing light-emitting panel components, which has the following beneficial effects:

[0020] 1. The wafer dicing machine for processing components of light-emitting panels can be installed before processing the products to be processed. At the same time, the meshing output component can use multiple pressure detection components to perform multi-point pressure and centering on the products to be processed while the inverted T-shaped ring plate rotates synchronously through the meshing transmission of the gear ring, so as to ensure the accuracy of alignment between the products to be processed and the laser dicing mechanism. Then, after being used in combination with the wafer dicing machine consisting of a dicing machine box, a laser dicing mechanism, a laser dicing mechanism, a drain valve pipe and a control panel, the processing efficiency and processing quality can be further improved.

[0021] 2. The wafer dicing machine for processing light-emitting panel components has three pressure detection components. When the inverted T-shaped ring plate rotates and presses the product to be processed, multiple sets of pressure data are generated. After the average value and data value difference are calculated, it can reflect whether the appearance size of the product to be processed is qualified, thereby timely avoiding the probability of defective product processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a front view schematic diagram of the XY axis moving platform of the structure of the present invention;

[0023] Figure 2 It is a front view schematic diagram of the structure of the present invention;

[0024] Figure 3 It is a left side schematic diagram of the structure of the present invention;

[0025] Figure 4 It is a front view schematic diagram of the hollow ring plate in the structure of the present invention;

[0026] Figure 5 It is a bottom view schematic diagram of the negative suction component of the structure of the present invention;

[0027] Figure 6 It is a partial cross-sectional schematic diagram of the structural pressure detection assembly of the present invention;

[0028] Figure 7 It is a top view schematic diagram of the negative suction component of the structure of the present invention;

[0029] Figure 8 It is a partial cross-sectional schematic diagram of the inverted T-shaped ring plate of the present invention;

[0030] Fig. 9 It is a partial cross-sectional schematic diagram of the structural synchronous limit assembly of the present invention;

[0031] Fig.10 The structure of the present invention Figure 6A magnified schematic diagram of center A.

[0032] In the figure: 1. Slicing machine box; 2. XY axis moving platform; 3. Laser slicing mechanism; 4. Drain valve pipe; 5. Control panel; 6. Protective door; 7. Hollow ring plate; 8. Product to be processed; 9. Negative suction component; 91. Transition circular plate; 92. Ceramic negative pressure suction cup; 93. Ring pipe; 94. Negative pressure pump; 10. Inverted T-shaped ring plate; 11. Gear ring; 12. Meshing output component; 121. Transmission gear; 122. Brake stepper motor; 13. Pressure Detection assembly; 131, transition sleeve; 132, T-bar; 133, pressure sensor; 134, first buffer spring; 14, synchronous limit assembly; 141, inverted L-shaped plate; 142, movable rod; 143, second buffer spring; 144, hemispherical shell; 145, metal ball; 15, arc baffle; 16, curved infusion valve tube; 17, drainage arc groove; 18, water pump; 19, coolant tank; 20, composite liquid guide hose; 21, sealing ring. DETAILED DESCRIPTION

[0033] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0034] See also Figure 1-10 A wafer dicing machine for processing light-emitting panel components, comprising a dicing machine box 1, a product to be processed 8, an XY axis moving platform 2 mounted on the inner side of the bottom of the dicing machine box 1, a laser dicing mechanism 3 mounted on the inner side of the top of the dicing machine box 1, and a control panel 5 installed on one side of the dicing machine box 1. Both sides of the front end of the dicing machine box 1 are hingedly connected with a protective door 6, and one side of the bottom of the dicing machine box 1 is fixedly sleeved with a drain valve pipe 4;

[0035] A hollow ring plate 7 is provided on the top of the XY axis moving platform 2, and a negative suction component 9 and an inverted T-shaped ring plate 10 are respectively installed inside the hollow ring plate 7. The output structure of the negative suction component 9 can perform negative suction limiting on the product 8 to be processed. The negative suction component 9 includes a transition circular plate 91, a ceramic negative pressure suction cup 92, an annular tube 93 and a negative pressure pump 94. The surface of the transition circular plate 91 is fixedly connected to the inner wall of the inner ring structure of the hollow ring plate 7. The top of the ceramic negative pressure suction cup 92 is set inside the transition circular plate 91 as the output structure of the negative suction component 9 and is coplanar with the top surface of the transition circular plate 91. The output end of the negative pressure pump 94 is connected to the bottom of the annular tube 93. A transition tube is fixedly connected between the top of the annular tube 93 and the bottom of the ceramic negative pressure suction cup 92. The negative suction component 9 is used to perform negative suction positioning on the positioned product 8 to be processed, so as to meet the requirements of automated positioning. The hollow ring plate 7 is required to be provided with an inverted T-shaped ring groove inside, and the bottom of the inverted T-shaped ring plate 10 is clamped on the inner side of the top of the inverted T-shaped ring groove. A sealing ring 21 is nested between the surface of the outer ring structure of the inverted T-shaped ring plate 10 and the inner wall of the outer ring structure of the inverted T-shaped ring groove, and between the surface of the inner ring structure of the inverted T-shaped ring plate 10 and the inner wall of the inner ring structure of the inverted T-shaped ring groove. Thus, the sealing performance between the inverted T-shaped ring plate 10 and the hollow ring plate 7 is improved while not interfering with the rotation and movement of the inverted T-shaped ring plate 10 in the hollow ring plate 7. An auxiliary bearing is installed on the outer side of the bottom of the inverted T-shaped ring plate 10, and a transition sleeve is installed between the outer ring structure surface of the auxiliary bearing and the top surface of the hollow ring plate 7. There is a make way space between the transition sleeve and the gear ring 11, and the combined transition sleeve and auxiliary bearing are used to improve the stability of the inverted T-shaped ring plate 10 and the hollow ring plate 7 after being installed.

[0036] A support seat is installed between the bottom of the hollow ring plate 7 and the top of the XY-axis moving platform 2, a gear ring 11 is sleeved on the outer side of the hollow ring plate 7, and a meshing output component 12 is meshedly connected to one side of the gear ring 11. The meshing output component 12 includes a transmission gear 121 and a brake stepping motor 122. The output end of the brake stepping motor 122 is transmission-connected to the middle of the transmission gear 121, and one side of the transmission gear 121 is meshedly connected to one side of the gear ring 11. A fixed seat is fixedly connected between the shell surface of the brake stepping motor 122 and the surface of the hollow ring plate 7. A plurality of pressure detection components 13 are sleeved inside the inverted T-shaped ring plate 10, and the detection ends of the plurality of pressure detection components 13 can all be in elastic contact with the product 8 to be processed placed on the top of the negative suction component 9;

[0037] The plurality of pressure detection components 13 are specifically set to three, and three give-way grooves are set inside the inverted T-shaped ring plate 10, and the middle of the three give-way grooves are all set with slide grooves communicating with themselves, and the three pressure detection components 13 all include a transition sleeve 131, a T-shaped rod 132, a pressure sensor 133 and a first buffer spring 134, the transition sleeve 131 is sleeved in the corresponding give-way groove and is spatially communicated, one end of the T-shaped rod 132 is movably sleeved in the give-way groove, and the other end of the T-shaped rod 132 is clamped and penetrates the inverted T-shaped ring plate 10 and along to the negative Within the top range of the suction component 9, the pressure sensor 133 is fixedly sleeved inside the transition sleeve 131, and the pressure sensing surface of the pressure sensor 133 can be fitted and connected with one end of the T-shaped rod 132. The two ends of the first buffer spring 134 are respectively fixedly connected to the inner wall of the clearance groove and the surface of one end of the T-shaped rod 132. By using multiple pressure detection components 13, the product 8 to be processed can be subjected to multi-point synchronous extrusion limiting and multi-point detection during the synchronous rotation of the product 8 to be processed, so as to reflect the appearance and size of the product 8 to be processed in real time.

[0038] The synchronous limit assembly 14 includes an inverted L-shaped plate 141, a movable rod 142, a second buffer spring 143, a hemispherical shell 144 and a metal ball 145. One end of the bottom of the inverted L-shaped plate 141 is fixedly connected to the surface of the middle part of the corresponding T-shaped rod 132 and clamped in the slide groove. The middle part of the movable rod 142 is clamped on the inner side of one end of the top of the inverted L-shaped plate 141. The two ends of the second buffer spring 143 are respectively fixedly connected to the surface of one end of the top of the inverted L-shaped plate 141 and the surface of the top end of the movable rod 142. The top of the hemispherical shell 144 is fixedly connected to the bottom end of the movable rod 142, and the metal ball 145 is clamped inside the hemispherical shell 144 and can elastically contact with the top surface of the product to be processed 8 set on the top of the negative suction component 9. Three arc-shaped baffles 15 are installed on the inner wall of the inner ring structure of the hollow ring plate 7. The surfaces of the three arc-shaped baffles 15 correspond to the inner walls of the inner ring structure of the hollow ring plate 7 at three corresponding positions, forming three storage spaces, thereby preventing the pressure detection component 13 from contacting the product to be processed 8 in the processed state;

[0039] A plurality of curved infusion valve tubes 16 are mounted on the top of the inverted T-shaped ring plate 10, and the plurality of curved infusion valve tubes 16 can communicate with the internal space of the hollow ring plate 7 through the inverted T-shaped ring plate 10, and the output ends of the plurality of curved infusion valve tubes 16 are all inclined toward the top of the negative suction component 9, thereby satisfying the comprehensive spray cooling during the cutting process of the processed product 8. A drainage arc groove 17 which is not connected to its own space is provided at the bottom of the inner ring structure of the hollow ring plate 7, and the drainage arc groove 17 provides a cooling liquid reflux channel. A water pump 18 and a cooling liquid tank 19 are installed on the top of the dicing machine case 1, and the input end of the water pump 18 is mounted inside the cooling liquid tank 19, and the output end of the water pump 18 is connected to a composite liquid guiding hose 20, and one end of the composite liquid guiding hose 20 is a spiral elastic structure and is mounted inside one side of the bottom of the hollow ring plate 7. In addition to meeting the use requirements of the input cooling liquid channel, the structure can also be deformed to make way.

[0040] Working principle:

[0041] Embodiment 1

[0042] Place the product 8 to be processed on the top surface of the transition circular plate 91, start the brake stepper motor 122, and the output end of the brake stepper motor 122 drives the transmission gear 121 to rotate synchronously, and then the transmission gear 121 engages with the transmission gear ring 11, and then the auxiliary bearing. With the support of the transition sleeve, the gear ring 11 will drive the inverted T-shaped ring plate 10 and the three pressure detection components 13 and three synchronous limit components 14 set on the inverted T-shaped ring plate 10 to rotate synchronously, so that the other ends of the three T-shaped rods 132 move out of their corresponding storage spaces and under the elastic reset action of the corresponding first buffer springs 134, the other ends of the three T-shaped rods 132 all contact the surface of the product 8 to be processed and apply reverse pressure to their corresponding pressure sensors 133, so as to perform multi-point pressure on the product 8 to be processed;

[0043] At the same time, the three synchronous limit assemblies 14 move synchronously with their respective corresponding T-shaped rods 132 until the metal balls 145 inside the three synchronous limit assemblies 14 are all in contact with the top surface of the product 8 to be processed, so as to limit the degree of freedom in the longitudinal direction of the product 8 to be processed. Then, during the fixed-pitch rotation output of the brake stepper motor 122, the product 8 to be processed will be pressed and aligned by the three pressure detection assemblies 13 at multiple points, until the transition sleeves 131 inside the three pressure detection assemblies 13 return to the storage space, and the brake stepper motor 122 is closed.

[0044] Start the negative pressure pump 94 inside the negative suction component 9, and the negative pressure pump 94 performs negative suction limiting on the product 8 to be processed which is placed on the top surface of the transition circular plate 91 and has been pressed and centered through the laser scribing mechanism 3. Then, close the two protective doors 6, start the XY-axis moving platform 2 and the laser scribing mechanism 3, and scribing the product 8 to be processed according to the preset program.

[0045] Embodiment 2

[0046] For the automatic positioning of the product 8 to be processed, it is sufficient to operate according to the contents of the above-mentioned embodiment 1. When the product 8 to be processed needs to be rinsed and cooled during the processing, the water pump 18 can be started synchronously during the slicing process. The water pump 18 transports the coolant in the coolant tank 19 to the inside of the hollow ring plate 7 through the composite liquid guiding hose 20, and then the product 8 to be processed during the processing is fully rinsed and cooled through the inverted T-shaped ring plate 10 and the multiple curved liquid infusion valve tubes 16 arranged on the top of the inverted T-shaped ring plate 10.

[0047] Embodiment 3

[0048] When large-scale processing is required, a detection cycle can be selected. For the specific product 8 to be processed, the product 8 to be processed is placed on the top surface of the transition circular plate 91, and the brake stepper motor 122 is started. The output end of the brake stepper motor 122 drives the transmission gear 121 to rotate synchronously, and then the transmission gear 121 engages with the transmission gear ring 11, and then the auxiliary bearing. With the support of the transition sleeve, the gear ring 11 will drive the inverted T-shaped ring plate 10 and the three pressure detection components 13 and three synchronous limit components 14 arranged on the inverted T-shaped ring plate 10 to rotate synchronously, so that the other ends of the three T-shaped rods 132 move out of their respective corresponding storage spaces and under the elastic reset action of the respective corresponding first buffer springs 134, the other ends of the three T-shaped rods 132 all contact the surface of the product 8 to be processed and apply reverse pressure to their respective corresponding pressure sensors 133, and perform multi-point pressure on the product 8 to be processed. The three synchronous limit components 14 move synchronously with their respective corresponding T-shaped rods 132 until the metal balls 145 inside the three synchronous limit components 14 all fit the top surface of the product 8 to be processed, thereby limiting the degree of freedom in the longitudinal direction of the product 8 to be processed;

[0049] Record multiple groups of pressure data output by the three pressure sensors 133 and calculate the average value, compare the average value with the standard value and calculate the data difference. If it exceeds the standard range, it means that the product 8 to be processed is unqualified. On the contrary, if it does not exceed the standard range, it means that the product 8 to be processed is unqualified, then continue to move down for processing.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer dicing machine for processing light-emitting panel components, comprising a dicing machine box (1), a product to be processed (8), an XY axis moving platform (2) mounted on the inner side of the bottom of the dicing machine box (1), a laser dicing mechanism (3) mounted on the inner side of the top of the dicing machine box (1), and a control panel (5) mounted on one side of the dicing machine box (1), characterized in that: A hollow ring plate (7) is arranged on the top of the XY axis moving platform (2), and a negative suction component (9) and an inverted T-shaped ring plate (10) are respectively mounted inside the hollow ring plate (7), and the output structure of the negative suction component (9) can perform negative suction limiting on the product to be processed (8); A support seat is installed between the bottom of the hollow ring plate (7) and the top of the XY axis moving platform (2); a gear ring (11) is sleeved on the outer side of the hollow ring plate (7); one side of the gear ring (11) is meshingly connected with a meshing output component (12); a plurality of pressure detection components (13) are sleeved inside the inverted T-shaped ring plate (10), and the detection ends of the plurality of pressure detection components (13) are capable of elastically contacting a product to be processed (8) placed on the top of the negative suction component (9); The plurality of pressure detection components (13) are specifically arranged as three, the inverted T-shaped ring plate (10) is provided with three clearance grooves inside, and the middle of the three clearance grooves is provided with a slide groove communicating with itself, and the three pressure detection components (13) each include a transition sleeve (131), a T-shaped rod (132), a pressure sensor (133) and a first buffer spring (134), the transition sleeve (131) is sleeved in the corresponding clearance groove and is spatially communicated with each other, the T-shaped rod (132) One end of the first buffer spring (134) is movably sleeved in the clearance groove, and the other end of the T-shaped rod (132) is clamped and penetrates the inverted T-shaped ring plate (10) and extends along the top of the negative suction component (9), the pressure sensor (133) is fixedly sleeved inside the transition sleeve (131), and the pressure sensing surface of the pressure sensor (133) can be closely connected with the end of the T-shaped rod (132), and the two ends of the first buffer spring (134) are respectively fixedly connected to the inner wall of the clearance groove and the surface of one end of the T-shaped rod (132); The synchronous limit assembly (14) comprises an inverted L-shaped plate (141), a movable rod (142), a second buffer spring (143), a hemispherical shell (144) and a metal ball (145), wherein one end of the bottom of the inverted L-shaped plate (141) is fixedly connected to the surface of the middle part of the corresponding T-shaped rod (132) and is clamped in the slide groove, the middle part of the movable rod (142) is clamped to the inner side of the top end of the inverted L-shaped plate (141), and the two ends of the second buffer spring (143) are respectively fixedly connected to the surface of the top end of the inverted L-shaped plate (141) and fixedly connected to the movable rod (142). On the surface of the top end of the movable rod (142), the top of the hemispherical shell (144) is fixedly connected to the bottom end of the movable rod (142), the metal ball (145) is clamped in the interior of the hemispherical shell (144) and can elastically contact with the top surface of the product to be processed (8) set on the top of the negative suction component (9), and three arc-shaped baffles (15) are installed on the inner wall of the inner ring structure of the hollow ring plate (7), and the surfaces of the three arc-shaped baffles (15) correspond to the inner walls of the inner ring structure of the hollow ring plate (7) at three corresponding positions, forming three storage spaces.

2. A wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: Both sides of the front end of the dicing machine box (1) are hingedly connected to protective doors (6), and one side of the bottom of the dicing machine box (1) is fixedly sleeved with a drain valve pipe (4).

3. The wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: The negative suction component (9) comprises a transition circular plate (91), a ceramic negative pressure suction cup (92), an annular tube (93) and a negative pressure pump (94); the surface of the transition circular plate (91) is fixedly connected to the inner wall of the inner ring structure of the hollow annular plate (7); the top end of the ceramic negative pressure suction cup (92) is sleeved inside the transition circular plate (91) as the output structure of the negative suction component (9) and is arranged coplanar with the top surface of the transition circular plate (91); the output end of the negative pressure pump (94) is connected to the bottom of the annular tube (93); and a transition tube is fixedly connected between the top of the annular tube (93) and the bottom of the ceramic negative pressure suction cup (92).

4. The wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: An inverted T-shaped ring groove is provided inside the hollow ring plate (7), the bottom of the inverted T-shaped ring plate (10) is clamped on the inner side of the top of the inverted T-shaped ring groove, and a sealing ring (21) is nested between the surface of the outer ring structure of the inverted T-shaped ring plate (10) and the inner wall of the outer ring structure of the inverted T-shaped ring groove, and between the surface of the inner ring structure of the inverted T-shaped ring plate (10) and the inner wall of the inner ring structure of the inverted T-shaped ring groove.

5. The wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: An auxiliary bearing is sleeved on the outer side of the bottom of the inverted T-shaped ring plate (10), a transition sleeve is installed between the outer ring structure surface of the auxiliary bearing and the top surface of the hollow ring plate (7), and a clearance space exists between the transition sleeve and the gear ring (11).

6. The wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: The meshing output assembly (12) comprises a transmission gear (121) and a brake stepping motor (122); an output end of the brake stepping motor (122) is transmission-connected to a middle portion of the transmission gear (121); one side of the transmission gear (121) is meshingly connected to one side of a gear ring (11); and a fixing seat is fixedly connected between a shell surface of the brake stepping motor (122) and a surface of the hollow ring plate (7).

7. The wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: A plurality of curved infusion valve tubes (16) are mounted on the top of the inverted T-shaped ring plate (10), and the plurality of curved infusion valve tubes (16) are able to communicate with the internal space of the hollow ring plate (7) through the inverted T-shaped ring plate (10), and the output ends of the plurality of curved infusion valve tubes (16) are all inclined toward the top of the negative suction component (9), and a drainage arc groove (17) that is not connected to the inner space of the hollow ring plate (7) is provided at the bottom of the inner ring structure of the hollow ring plate (7).

8. The wafer dicing machine for processing light-emitting panel components according to claim 1, characterized in that: A water pump (18) and a coolant tank (19) are installed on the top of the dicing machine box (1); the input end of the water pump (18) is sleeved inside the coolant tank (19); the output end of the water pump (18) is connected to a composite liquid guiding hose (20); one end of the composite liquid guiding hose (20) is a spiral elastic structure and is sleeved inside one side of the bottom of the hollow ring plate (7).

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