Manufacturing method of generic semiconductor large-scale aluminum alloy gas distribution plate

Abstract

The invention relates to the technical field of gas distribution plate production and manufacturing, and particularly discloses a generic semiconductor large aluminum alloy gas distribution plate manufacturing method which comprises the following steps that S01, a gas distribution bottom plate and a gas distribution cover plate are machined according to a drawing, and the gas distribution bottom plate comprises a ventilation channel, a gas inlet hole and a gas outlet hole; s02, cleaning the gas distribution bottom plate and the gas distribution cover plate; s03, the gas distribution cover plate is knocked into a cover plate groove formed in a port of the gas distribution bottom plate, a stirring friction welding program is simulated, and after it is confirmed that a track and welding parameters are correct, friction welding is conducted so that the gas distribution cover and the gas distribution bottom plate can be welded into the gas distribution plate; and S04, the gas distribution plate is put into a heating furnace to be annealed, so that the welding stress is eliminated. According to the method, the defect probability of the gas distribution plate in the production process can be reduced, the repair possibility is reduced, the production efficiency is improved, meanwhile, the size of the gas distribution plate obtained through machining after stress release is good, and the assembly reliability of the gas distribution plate is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of gas distribution plate production and manufacturing, and in particular to a method for manufacturing a pan-semiconductor large-scale aluminum alloy gas distribution plate. Background Art

[0002] Aluminum alloy has low density, high specific strength, good electrical conductivity, thermal conductivity, corrosion resistance and weldability, good processing performance, long service life and easy recycling, so it has a wide range of applications. The pan-semiconductor aluminum alloy gas distribution plate disperses the gas from the air inlet into multiple fluids, while making each flow unobstructed, ensuring that the flow rate in each channel is basically the same, and the fluid is discharged from the outlet at a uniform and constant speed, which can provide good fluidization condition preparation conditions.

[0003] The smaller the outlet holes of the gas distribution plate, the smaller the gas flowing through it is cut, the larger the area of ​​contact between the gas and the workpiece, and the better the mixing effect. Many process technologies that require uniform fluid conditions can be carried out in the uniform fluidized environment created by the gas distribution plate. Large aluminum alloy gas distribution plates can provide a fluidized environment in a larger area, and the number of outlet holes on the gas distribution plate will increase accordingly. The contact area between the fluid flowing out of the gas distribution plate and the workpiece will be larger, and the probability of the gas reacting with the workpiece will increase, which greatly improves the production efficiency of the workpiece, so the market demand is very large.

[0004] Fusion welding technology cannot be used for large aluminum alloy air distribution plates because the cover plate is thin and the heat input of fusion welding is large, there is a possibility of burning of the metal material of the cover plate. At the same time, the deformation and residual internal stress after welding are large. Summary of the invention

[0005] The purpose of the present invention is to provide a method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate to solve the above-mentioned problems.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A method for manufacturing a large-scale aluminum alloy gas distribution plate for a pan-semiconductor, comprising the following steps:

[0008] S01. According to the drawings, an air distribution bottom plate and an air distribution cover plate are respectively processed, wherein the air distribution bottom plate includes a ventilation channel, an air inlet hole and an air outlet hole;

[0009] S02, cleaning the air distribution bottom plate and the air distribution cover plate;

[0010] S03, knocking the air distribution cover plate into the cover plate groove opened at the port of the air distribution bottom plate, simulating the stir friction welding procedure, confirming that the trajectory and welding parameters are correct, and then friction welding to weld the air distribution cover and the air distribution bottom plate into an air distribution plate;

[0011] S04, placing the gas distribution plate into a heating furnace for annealing to eliminate welding stress;

[0012] S05, removing burrs on the surface of the air distribution plate, and then shaping the cover plate surface and the back surface of the air distribution cover plate to ensure that the flatness of the cover plate surface and the back surface is within 1 mm;

[0013] S06, using a machine tool to process the remaining features and shapes on the gas distribution plate, and checking whether the gas distribution plate is qualified after the processing;

[0014] S07, placing the air distribution plate on a large platform, and using a tapping machine to process the threaded holes according to the drawing, and blowing away the remaining aluminum chips;

[0015] S08, plugging the air outlet of the air distribution plate, then inputting a certain pressure of gas through the air pipe connecting the air inlet of the air distribution bottom plate, and then placing the air distribution plate in a clean water pool, observing whether bubbles emerge from the weld area, and determining whether there is air leakage in the weld;

[0016] S09. After confirming that there is no air leakage on the air distribution plate, use a high-pressure water gun to blow dry the water stains on the surface of the air distribution plate, and use sandpaper to remove the surface oxide until the surface is bright and not over-polished;

[0017] S10, the polished air distribution plate is placed in an ultrasonic cleaning tank for cleaning, and after cleaning until there is no stain on the surface, a high-pressure water gun is used to blow dry the water stains on the surface of the air distribution plate until there is no stain visible to the naked eye, and then the plate is transported to a heating furnace for drying;

[0018] S11. After drying, the air distribution plate is placed in a clean dust-free room, and the scratches on the surface of the air distribution plate are polished with sandpaper and a scouring pad until they are invisible to the naked eye. The residues in the air inlet, air outlet and threaded holes are taken out, and the dirt in the holes is wiped clean with a dust-free cloth soaked in alcohol or acetone. The surface of the air distribution plate is wiped clean with a dust-free cloth soaked in alcohol or acetone until there is no stain visible to the naked eye on the dust-free cloth.

[0019] Preferably, the step S02 of cleaning the air distribution bottom plate and the air distribution cover plate includes:

[0020] S21. After the processing of the parts is completed, use compressed air to blow away the debris adhering to the ventilation channel and the surfaces of the air distribution bottom plate and the air distribution cover plate;

[0021] S22, placing the workpiece into an ultrasonic cleaning tank to clean the oil stains;

[0022] S23. Use a high-pressure water gun to clean the inside of the ventilation channel and the surfaces of the air distribution bottom plate and the air distribution cover plate, leaving no visible stains, and then transfer them to the heating furnace for drying.

[0023] Preferably, the ultrasonic cleaning tank in step S22 contains an acidic or alkaline degreasing agent.

[0024] Preferably, after the air distribution bottom plate and the cover plate are assembled in step S03, metal pins with a diameter equal to the air inlet and outlet holes are knocked into the air inlet and outlet holes, and the length of the pins is greater than the length of the air inlet and outlet holes.

[0025] Preferably, the pin is removed after the friction stir welding is completed in step S03.

[0026] Preferably, in step S04, the annealing temperature of the air distribution plate is 120-200° C., and the annealing time is 8-12 hours.

[0027] Preferably, the sandpaper used in step S09 is generally sandpaper with a mesh size of 240 or above.

[0028] A pan-semiconductor large-scale aluminum alloy air distribution plate, applied to the manufacturing method of the pan-semiconductor large-scale aluminum alloy air distribution plate described in the above-mentioned technology, comprises an air distribution plate composed of an air distribution bottom plate and an air distribution cover plate, the bottom of the inner side of the air distribution bottom plate is provided with a ventilation groove, the ventilation groove is divided into a bottom groove and a cover plate groove, the bottom groove is below the cover plate groove, and the width is narrower than the cover plate groove, the depth of the cover plate groove is equal to the thickness of the air distribution cover plate, and the basic size of the outer contour of the cover plate groove is equal to that of the air distribution cover plate, and the outer shape of the air distribution cover plate should be slightly smaller than the cover plate groove, for clearance fit, so as to facilitate assembly and welding.

[0029] Preferably, the bottom groove is located below the cover plate groove;

[0030] The width of the bottom groove is smaller than the width of the cover plate groove;

[0031] The depth of the cover plate groove is consistent with the thickness of the air distribution cover plate;

[0032] The outer contour of the cover plate groove is consistent with the outer contour of the air distribution cover plate;

[0033] The air distribution cover plate covers the cover plate groove and maintains a clearance fit.

[0034] Preferably, the number of the ventilation channels is a plurality of equidistantly arranged channels, and the lengths thereof decrease from the center to both sides, but the widths remain unchanged, and the air inlet holes are connected to the plurality of ventilation channels.

[0035] In the above technical solution, the present invention provides a method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate, which has the following beneficial effects:

[0036] 1. The metal deposition process is realized by using the principle of layered accumulation and friction extrusion plastic deformation processing, which effectively overcomes the defects of pores, cracks, etc. in the aluminum alloy fusion welding joint, and has the advantages of small residual stress and deformation of the joint, and environmental protection and no pollution.

[0037] 2. The gas flowing through the outlet holes of the gas distribution plate is cut into smaller pieces, and the overall contact area between the gas and the workpiece is larger, the probability of the gas reacting with the workpiece increases, the mixing effect is better, and the operability is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0039] Figure 1 A flowchart provided for an embodiment of the present invention;

[0040] Figure 2 Schematic diagram of the air distribution bottom plate and bottom plate grooves provided in an embodiment of the present invention.

[0041] Description of reference numerals:

[0042] 1. Air distribution bottom plate; 1-1. Cover plate groove; 1-2. Bottom groove. DETAILED DESCRIPTION

[0043] In order to clearly and completely describe the technical solutions in the embodiments of the present invention in combination with the embodiments of the present invention, it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Embodiment 1

[0045] like Figure 1 The method for manufacturing a large-scale aluminum alloy gas distribution plate for a pan-semiconductor comprises the following steps:

[0046] S01. According to the drawings, the air distribution bottom plate 1 and the air distribution cover plate are processed respectively. The air distribution bottom plate 1 includes ventilation channels 1-2, air inlet holes and air outlet holes;

[0047] S02, cleaning the air distribution bottom plate 1 and the air distribution cover plate;

[0048] S03, knocking the air distribution cover plate into the cover plate groove 1-1 opened at the port of the air distribution bottom plate 1, simulating the stir friction welding procedure, confirming that the trajectory and welding parameters are correct, and then friction welding to weld the air distribution cover and the air distribution bottom plate 1 into an air distribution plate;

[0049] S04, placing the gas distribution plate into a heating furnace for annealing to eliminate welding stress;

[0050] S05. Remove the burrs on the surface of the air distribution plate, and then shape the cover plate surface and the back surface of the air distribution cover plate to ensure that the flatness of the cover plate surface and the back surface is within 1mm;

[0051] S06. Use machine tools to process the remaining features and shapes on the air distribution plate, and check whether the air distribution plate is qualified after processing;

[0052] S07. Place the air distribution plate on a large platform, and use a tapping machine to machine the threaded holes according to the drawing, and blow away the remaining aluminum chips;

[0053] S08, plug the air outlet of the air distribution plate, then input a certain pressure of gas into the air inlet connecting the air pipe and the air distribution bottom plate 1, then put the air distribution plate into a clean water pool, observe whether bubbles emerge from the weld area, and determine whether there is any weld leakage;

[0054] S09. After confirming that there is no air leakage on the air distribution board, use a high-pressure water gun to blow away the water stains on the surface of the air distribution board, and use sandpaper to remove the surface oxide until the surface is bright and not over-polished;

[0055] S10, the polished air distribution plate is placed in an ultrasonic cleaning tank for cleaning. After cleaning until there is no stain on the surface, a high-pressure water gun is used to blow dry the water stains on the surface of the air distribution plate until there is no stain visible to the naked eye, and then the plate is transferred to a heating furnace for drying;

[0056] S11. After drying, place the air distribution plate in a clean dust-free room, use sandpaper and scouring pad to polish the scratches on the surface of the air distribution plate until they are invisible to the naked eye, remove the residues in the air inlet, air outlet and threaded holes, wipe the dirt in the holes with a dust-free cloth soaked in alcohol or acetone, and wipe the surface of the air distribution plate with a dust-free cloth soaked in alcohol or acetone until there is no stain visible to the naked eye on the dust-free cloth.

[0057] After drying, check whether the size and features of the air distribution board are consistent with the drawings, whether the appearance of the air distribution board meets the requirements, and whether it is neat and without stains. Then pack the qualified air distribution boards according to the requirements, ensure that the packaging is intact, implement certain protective measures, and store them in the warehouse.

[0058] Furthermore, step S02 is to clean the air distribution bottom plate 1 and the air distribution cover plate, including:

[0059] S21. After the processing of the parts is completed, compressed air is used to blow away the debris adhering to the inside of the ventilation channel 1-2 and the surfaces of the air distribution bottom plate and the air distribution cover plate;

[0060] S22, placing the workpiece into an ultrasonic cleaning tank to clean the oil stains;

[0061] S23. Use a high-pressure water gun to clean the inside of the ventilation channel 1-2 and the surfaces of the air distribution bottom plate and the air distribution cover plate, leaving no visible stains, and then transfer them to the heating furnace for drying.

[0062] Secondly, the ultrasonic cleaning tank in step S22 contains an acidic or alkaline degreasing agent.

[0063] Furthermore, after the air distribution bottom plate and the cover plate are assembled in step S03, metal pins with a diameter equal to the size of the air inlet and outlet holes are knocked into the air inlet and outlet holes, and the length of the pins is greater than the length of the air inlet and outlet holes. The pins are removed after the stir friction welding is completed.

[0064] Furthermore, in step S04, the annealing temperature of the gas distribution plate is 120-200° C., and the annealing time is 8-12 hours.

[0065] In the above technology, the metal deposition process is realized by using the principle of layered accumulation and friction extrusion plastic deformation processing, which effectively overcomes the defects of pores and cracks in aluminum alloy fusion welding joints, and has the advantages of small residual stress and deformation of the joints, environmental protection and no pollution. The gas flowing through the outlet holes of the gas distribution plate is cut smaller, the larger the area of ​​contact between the gas and the workpiece, the higher the probability of reaction between the gas and the workpiece, the better the mixing effect, and the higher the operability.

[0066] Embodiment 2

[0067] like Figure 2 As shown, the pan-semiconductor large aluminum alloy air distribution plate manufactured according to the method provided in Example 1 is composed of an air distribution bottom plate 1 and an air distribution cover plate. A ventilation groove 1-2 is provided at the inner bottom of the air distribution bottom plate 1, and the groove is divided into a bottom groove and a cover plate groove. The bottom groove is located below the cover plate groove, and its width is narrower than the cover plate groove. The depth of the cover plate groove matches the thickness of the air distribution cover plate, and the basic dimensions of its outer contour are consistent with those of the air distribution cover plate. The outer shape of the air distribution cover plate is slightly smaller than the cover plate groove to achieve clearance fit, which is convenient for assembly and welding.

[0068] Further, the bottom groove is located below the cover plate groove, and its width is smaller than the width of the cover plate groove. The depth of the cover plate groove is the same as the thickness of the air distribution cover plate, and the outer contour matches the outer contour of the air distribution cover plate. The air distribution cover plate covers the cover plate groove and maintains a clearance fit.

[0069] Furthermore, there are a plurality of ventilation channels 1-2, which are arranged at equal intervals, and the lengths decrease from the center to both sides, but the widths remain unchanged. The air inlet is connected to the plurality of ventilation channels 1-2.

[0070] In the above technology, the probability of defects in the gas distribution plate during the production process is reduced, the possibility of rework is reduced, and the production efficiency is improved. The gas distribution plate obtained after stress release has a good size, which ensures the reliability of the gas distribution plate assembly. Large gas distribution plates can provide a uniform fluidization environment in a larger area, and the number of air outlets on the gas distribution plate also increases. The contact area between the fluid flowing out of the gas distribution plate and the workpiece is larger, which greatly improves the production efficiency of the downstream workpieces in the supply chain. In addition, the design of the pan-semiconductor large aluminum alloy gas distribution plate has many advantages. First of all, its aluminum alloy material not only ensures the strength and stability of the structure, but also has excellent thermal conductivity, which helps to maintain temperature stability during high-speed gas flow and reduce the impact of thermal stress on the gas distribution plate.

[0071] Secondly, the special layout design of the ventilation channels 1-2 on the air distribution plate, that is, the equidistant arrangement of the number and the characteristics of decreasing length from the center to both sides but keeping the same width, makes the gas distribution more uniform, reduces the dead corners and eddy currents of the air flow, and improves the utilization efficiency of the gas. This design also helps to reduce the noise generated by the gas flow and improve the comfort of the overall working environment.

[0072] Furthermore, the clearance fit design between the gas distribution plate and the cover plate not only facilitates assembly and disassembly, but also helps to form a tiny buffer layer during the gas flow process, reducing the direct impact of the gas on the gas distribution plate, thereby extending the service life of the gas distribution plate.

[0073] Finally, the gas distribution plate plays a key role in the production process downstream of the supply chain. Its increased number of outlet holes and larger fluid contact area allow the gas to more fully contact the workpiece, improving the efficiency of chemical reactions or physical treatments. This not only shortens the production cycle, but also improves the quality and consistency of the product, bringing significant economic benefits to the production line downstream of the supply chain.

[0074] In summary, the pan-semiconductor large aluminum alloy gas distribution plate has shown great potential and value in semiconductor manufacturing and other related fields with its unique design, excellent performance and broad application prospects.

[0075] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0076] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for manufacturing a large-scale aluminum alloy gas distribution plate for a pan-semiconductor, characterized in that: The following steps are involved: S01. According to the drawings, an air distribution bottom plate (1) and an air distribution cover plate are respectively processed, wherein the air distribution bottom plate (1) comprises a ventilation channel (1-2), an air inlet hole and an air outlet hole; S02, cleaning the air distribution bottom plate (1) and the air distribution cover plate; S03, knocking the air distribution cover plate into the cover plate groove (1-1) opened at the port of the air distribution bottom plate (1), simulating the stir friction welding procedure, confirming that the trajectory and welding parameters are correct, and then friction welding to weld the air distribution cover and the air distribution bottom plate (1) into an air distribution plate; S04, placing the gas distribution plate into a heating furnace for annealing to eliminate welding stress; S05, removing burrs on the surface of the air distribution plate, and then shaping the cover plate surface and the back surface of the air distribution cover plate to ensure that the flatness of the cover plate surface and the back surface is within 1 mm; S06, using a machine tool to process the remaining features and shapes on the gas distribution plate, and checking whether the gas distribution plate is qualified after the processing; S07, placing the air distribution plate on a large platform, and using a tapping machine to process the threaded holes according to the drawing, and blowing away the remaining aluminum chips; S08, blocking the air outlet of the air distribution plate, then inputting gas of a certain pressure through the air pipe connecting the air inlet of the air distribution bottom plate (1), and then placing the air distribution plate in a clean water pool to observe whether bubbles emerge from the weld area to determine whether there is air leakage in the weld; S09. After confirming that there is no air leakage on the air distribution plate, use a high-pressure water gun to blow dry the water stains on the surface of the air distribution plate, and use sandpaper to remove the surface oxide until the surface is bright and not over-polished; S10, the polished air distribution plate is placed in an ultrasonic cleaning tank for cleaning, and after cleaning until there is no stain on the surface, a high-pressure water gun is used to blow dry the water stains on the surface of the air distribution plate until there is no stain visible to the naked eye, and then the plate is transported to a heating furnace for drying; S11. After drying, the air distribution plate is placed in a clean dust-free room, and the scratches on the surface of the air distribution plate are polished with sandpaper and a scouring pad until they are invisible to the naked eye. The residues in the air inlet, air outlet and threaded holes are taken out, and the dirt in the holes is wiped clean with a dust-free cloth soaked in alcohol or acetone. The surface of the air distribution plate is wiped clean with a dust-free cloth soaked in alcohol or acetone until there is no stain visible to the naked eye on the dust-free cloth.

2. The method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 1, characterized in that: The step S02 of cleaning the air distribution bottom plate (1) and the air distribution cover plate comprises: S21. After the processing of the parts is completed, use compressed air to blow away the debris adhering to the inside of the ventilation channel (1-2) and the surfaces of the air distribution bottom plate and the air distribution cover plate; S22, placing the workpiece into an ultrasonic cleaning tank to clean the oil stains; S23, use a high-pressure water gun to clean the inside of the ventilation channel (1-2) and the surfaces of the air distribution bottom plate and the air distribution cover plate, leaving no visible stains, and then transfer to a heating furnace for drying.

3. The method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 2, characterized in that: The ultrasonic cleaning tank in step S22 contains an acidic or alkaline degreasing agent.

4. The method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 1, characterized in that: After the air distribution bottom plate and the cover plate are assembled in step S03, metal pins with a diameter equal to that of the air inlet and outlet holes are knocked into the air inlet and outlet holes, and the length of the pins is greater than the length of the air inlet and outlet holes.

5. The method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 1, characterized in that: After the friction stir welding is completed in step S03, the pin is taken out.

6. The method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 1, characterized in that: In step S04, the annealing temperature of the gas distribution plate is 120-200° C., and the annealing time is 8-12 hours.

7. The method for manufacturing a large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 2, characterized in that: The sandpaper used in step S09 is generally 240 mesh or above.

8. A large-scale pan-semiconductor aluminum alloy gas distribution plate, characterized in that: A method for manufacturing a pan-semiconductor large-scale aluminum alloy air distribution plate as described in any one of claims 1 to 7, comprising an air distribution plate composed of an air distribution bottom plate (1) and an air distribution cover plate, wherein a ventilation groove (1-2) is provided at the bottom of the inner side of the air distribution bottom plate (1), and the ventilation groove (1-2) is divided into a bottom groove and a cover plate groove, wherein the bottom groove is below the cover plate groove and is narrower than the cover plate groove, the depth of the cover plate groove is equal to the thickness of the air distribution cover plate, and the basic dimensions of the outer contour of the cover plate groove are equal to those of the air distribution cover plate, and the outer contour of the air distribution cover plate should be slightly smaller than the cover plate groove for clearance fit to facilitate assembly and welding.

9. The large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 3, characterized in that: The bottom groove is located below the cover plate groove; The width of the bottom groove is smaller than the width of the cover plate groove; The depth of the cover plate groove is consistent with the thickness of the air distribution cover plate; The outer contour of the cover plate groove is consistent with the outer contour of the air distribution cover plate; The air distribution cover plate covers the cover plate groove and maintains a clearance fit.

10. The large-scale pan-semiconductor aluminum alloy gas distribution plate according to claim 3, characterized in that: The number of the ventilation channels (1-2) is a plurality of equidistantly arranged channels, and the lengths decrease from the center to both sides, but the widths remain unchanged; the air inlet is connected to the plurality of ventilation channels (1-2).

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