Semiconductor grinding and polishing device

Abstract

The invention belongs to the technical field of semiconductor processing, and discloses a semiconductor grinding and polishing device. The semiconductor grinding and polishing device comprises a stirring assembly, a filtering assembly and a grinding disc, the stirring assembly comprises a shaft rod, a stirring paddle and a stirring barrel, and openings are formed in the two ends of the stirring barrel and used for containing a grinding material and a polishing material; the shaft rod is a hollow rod, extends in the vertical direction and is rotationally arranged in the stirring barrel, the shaft rod is provided with an air outlet hole, and the air outlet hole can jet out high-pressure air flow to loosen the polishing and grinding material; the stirring paddle is arranged on the shaft rod in the horizontal direction, and the shaft rod rotates to drive the stirring paddle to rotate so as to stir grinding materials and polishing materials. The filter assembly comprises a filter element and a liquid storage tank, the polishing material can flow to the liquid storage tank from the bottom of the stirring barrel, the filter element is arranged in the liquid storage tank, and the polishing material can be added into the stirring barrel after being filtered by the filter element; the grinding disc is arranged on the shaft rod and rotates along with the shaft rod to grind and polish the semiconductor. Through the stirring assembly and the filtering assembly, the semiconductor processing precision and quality are improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, and in particular to a semiconductor grinding and polishing device. Background Art

[0002] The most important basic material in integrated circuits and semiconductor devices is silicon wafers. The surface condition of silicon wafers directly affects the quality and yield of integrated circuits and devices. The materials used to process the surface of silicon wafers are called grinding materials and polishing materials. During the production process, semiconductors need to be polished by grinding and polishing equipment.

[0003] However, in actual application, the grinding and polishing device still has many defects, such as: 1. It does not have the function of filtering and recycling the recycled polishing material (polishing liquid), which causes the polishing material to accumulate impurities during the recycling process, easily scratching the semiconductor surface during polishing, and reducing the quality of the semiconductor; 2. It does not have the stirring function, resulting in the use of micropowder particles (abrasives) in the grinding material. The micropowder particles will gather at the bottom of the grinding and polishing device when grinding and polishing, which will not only damage the grinding and polishing device, but also cause uneven grinding, reducing the processing accuracy of the semiconductor. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor grinding and polishing device to solve the problem that the grinding and polishing device in the prior art does not have the function of filtering and recycling the recycled polishing material; does not have the stirring function, so as to improve the processing accuracy and quality of semiconductor processing.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A semiconductor grinding and polishing device, comprising:

[0007] A stirring assembly, the stirring assembly comprising a shaft, a stirring paddle and a stirring barrel, the stirring barrel having openings at both ends for accommodating abrasive materials and polishing materials; the shaft is a hollow rod, extending in a vertical direction and rotatably disposed in the stirring barrel, the shaft is provided with an air outlet, the air outlet can eject a high-pressure airflow to loosen and polish the abrasive materials; the stirring paddle is disposed on the shaft in a horizontal direction, the rotation of the shaft can drive the stirring paddle to rotate, so as to stir the abrasive materials and the polishing materials;

[0008] A filter assembly, the filter assembly comprising a filter element and a liquid storage tank, the polishing material can flow from the bottom of the mixing barrel to the liquid storage tank, the filter element is arranged in the liquid storage tank, the polishing material can be added to the mixing barrel from the top of the mixing barrel after being filtered by the filter element;

[0009] A grinding disc is arranged on the shaft to rotate with the shaft and grind and polish the semiconductor.

[0010] As an optional technical solution for a semiconductor grinding and polishing device, the stirring assembly also includes a lifting paddle, the lifting paddle spiral disk is arranged at one end of the shaft near the bottom of the stirring barrel, and the lifting paddle rotates with the shaft to lift up the grinding material and the polishing material at the bottom of the stirring barrel.

[0011] As an optional technical solution for a semiconductor grinding and polishing device, the stirring assembly also includes a cleaning paddle. The spiral disk of the cleaning paddle is provided on the shaft and abuts against the inner wall of the stirring barrel. The cleaning paddle rotates with the shaft to scrape off the grinding material and the polishing material remaining on the inner wall of the stirring barrel.

[0012] As an optional technical solution for the semiconductor grinding and polishing device, the stirring assembly also includes a barrel cover, which is hollow inside and detachably arranged on the open end of the stirring barrel, and the shaft rod passes through the barrel cover and is rotatably arranged on the barrel cover.

[0013] As an optional technical solution for a semiconductor grinding and polishing device, the stirring assembly also includes an air inlet pipe and an air inlet pump, the air inlet pipe is connected to the barrel cover, the air inlet pump is arranged on the air inlet pipe, and the part of the shaft rod located inside the barrel cover is provided with an air inlet hole, and the air is driven by the air inlet pump, enters the air inlet hole through the air inlet pipe and is ejected from the air outlet.

[0014] As an optional technical solution for a semiconductor grinding and polishing device, the filtering assembly also includes a filter tube and a spiral rod. The filter tube is arranged at the bottom of the stirring barrel and is selectively connected to the stirring barrel. The spiral rod is arranged on the filter tube and rotates along the horizontal direction. The spiral rod rotates to stir the grinding material and the polishing material.

[0015] As an optional technical solution for a semiconductor grinding and polishing device, the filter assembly also includes a recovery box, a suction pump and a first infusion tube. The filter tube is arranged in the recovery box. A filter hole is arranged at the bottom of the filter tube. The polishing material flows into the recovery box through the filter hole. The first infusion tube connects the recovery box and the liquid storage tank. The suction pump is arranged in the first infusion tube to draw the polishing material into the liquid storage tank.

[0016] As an optional technical solution for a semiconductor grinding and polishing device, the filter assembly also includes a liquid inlet hood, a delivery pump and a second infusion tube. The liquid inlet hood is arranged on the top of the stirring barrel along the horizontal direction. The interior of the liquid inlet hood is hollow and a liquid outlet hole is provided on the side wall. The second infusion tube connects the filter element and the liquid inlet hood. The delivery pump is arranged on the second infusion tube to add the polishing material to the stirring barrel.

[0017] As an optional technical solution for a semiconductor grinding and polishing device, the semiconductor grinding and polishing device also includes a cooling component, which includes a cooling hood and a refrigerator. The cooling hood is arranged outside the stirring barrel, and the interior of the cooling hood is hollow and filled with coolant. The coolant is used to exchange heat with the stirring barrel, and the refrigerator is used to cool the coolant.

[0018] As an optional technical solution for the semiconductor grinding and polishing device, the semiconductor grinding and polishing device further includes a control component, and the control component includes a controller, and the controller is communicatively connected with the stirring component, the filtering component and the cooling component.

[0019] Beneficial effects of the present invention:

[0020] The present invention provides a semiconductor grinding and polishing device, comprising a stirring component, a filtering component and a grinding disc. The stirring component comprises a shaft, a stirring paddle and a stirring barrel. The stirring barrel has openings at both ends for accommodating grinding materials and polishing materials. The shaft is a hollow rod, which extends in a vertical direction and is rotatably arranged in the stirring barrel. The shaft is provided with an air outlet, which can spray out a high-pressure airflow to loosen and polish the grinding materials. The stirring paddle is arranged on the shaft in a horizontal direction, and the rotation of the shaft can drive the stirring paddle to rotate to stir the grinding materials and the polishing materials. The filtering component comprises a filter element and a liquid storage tank, and the polishing materials can flow from the bottom of the stirring barrel to the liquid storage tank. The filter element is arranged in the liquid storage tank, and the polishing materials can be added to the stirring barrel from the top of the stirring barrel after being filtered by the filter element. The grinding disc is arranged on the shaft to rotate with the shaft and grind and polish the semiconductor. High-pressure airflow is sprayed through the hollow shaft to loosen the grinding material, and the grinding material and polishing material are stirred by the stirring paddle to prevent the accumulation of grinding materials from damaging the semiconductor grinding and polishing device. The polishing material is filtered through the filter element and then added to the stirring barrel to achieve filtering and recycling of the polishing material, avoiding the polishing material from scratching the semiconductor, thereby improving the processing accuracy and quality of semiconductor processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of a semiconductor grinding and polishing device provided by an embodiment of the present invention;

[0022] Figure 2 The structure of the semiconductor grinding and polishing device provided by the embodiment of the present invention is shown in FIG. Figure 1 ;

[0023] Figure 3 The structure of the semiconductor grinding and polishing device provided by the embodiment of the present invention is shown in FIG. Figure 2 ;

[0024] Figure 4 The structure of the semiconductor grinding and polishing device provided by the embodiment of the present invention is shown in FIG. Figure 3 ;

[0025] Figure 5 It is a front view of a semiconductor grinding and polishing device provided by an embodiment of the present invention.

[0026] In the figure:

[0027] 100, stirring assembly; 110, shaft; 111, air outlet; 112, air inlet; 113, driving motor; 120, stirring paddle; 130, stirring barrel; 131, control valve; 140, lifting paddle; 150, cleaning paddle; 160, barrel cover; 170, air inlet pipe; 180, air inlet pump; 190, filter;

[0028] 200, filter assembly; 210, filter element; 220, liquid storage tank; 230, filter tube; 231, filter hole; 240, screw rod; 241, constant speed motor; 242, tube cover; 250, recovery box; 251, slag cover; 252, servo motor; 260, suction pump; 270, first infusion tube; 280, liquid inlet cover; 281, liquid outlet hole; 290, delivery pump; 2010, second infusion tube; 2020, screw rod; 2030, scraper;

[0029] 300, grinding disc;

[0030] 400, cooling assembly; 410, cooling cover; 420, refrigerator; 430, pressure relief valve;

[0031] 500, control component; 510, controller;

[0032] 600, bottom box; 610, box door; 611, heat dissipation holes. DETAILED DESCRIPTION

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0034] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0037] During the production process, semiconductors need to be polished by a grinding and polishing device. However, in actual application, the grinding and polishing device still has many defects, such as: 1. It does not have the function of filtering and recycling the recycled polishing material (polishing liquid), resulting in the accumulation of impurities in the polishing material during the recycling process, which easily scratches the semiconductor surface during polishing, reducing the quality of the semiconductor; 2. It does not have the stirring function, resulting in the use of micro-powder particles (abrasives) in the grinding material. The micro-powder particles will gather at the bottom of the grinding and polishing device when grinding and polishing, which will not only damage the grinding and polishing device, but also cause uneven grinding, reducing the processing accuracy of the semiconductor.

[0038] To solve the above problems, this embodiment provides a semiconductor grinding and polishing device. Figure 1-Figure 4, including a stirring assembly 100, a filtering assembly 200 and a grinding disc 300, the stirring assembly 100 includes a shaft 110, a stirring paddle 120 and a stirring barrel 130, the stirring barrel 130 has openings at both ends for accommodating grinding materials and polishing materials; specifically, the stirring barrel 130 is formed by splicing a straight cylinder and a conical barrel, and the conical barrel is arranged at the bottom to facilitate the outflow of grinding materials and polishing materials; the shaft 110 is a hollow rod, extending in the vertical direction and rotatably arranged in the stirring barrel 130; specifically, the shaft 110 extends from the top of the stirring barrel 130 to the bottom of the stirring barrel 130, and the shaft 110 is provided with an air outlet 111, and a plurality of air outlets 111 are arranged at intervals along the extension direction of the shaft 110, and the air outlet 111 can spray high-pressure airflow to loosen the polishing grinding materials; the stirring paddle 120 is arranged at the shaft in the horizontal direction The rod 110, specifically, the stirring paddle 120 is set to be a cone shape, fixed to the shaft 110 by a connecting rod, and a plurality of air outlet holes 111 are set on the connecting rod; in this embodiment, two stirring paddles 120 or four stirring paddles 120 form a group, and two groups of stirring paddles 120 are set in total and are spaced apart along the extension direction of the shaft 110; the rotation of the shaft 110 can drive the stirring paddle 120 to rotate to stir the grinding material and the polishing material; the filter assembly 200 includes a filter element 210 and a liquid storage tank 220, and the polishing material can flow from the bottom of the stirring barrel 130 to the liquid storage tank 220, the filter element 210 is arranged in the liquid storage tank 220, and the polishing material can be filtered by the filter element 210 and then added to the stirring barrel 130 from the top of the stirring barrel 130; the grinding disc 300 is arranged on the shaft 110 to rotate with the shaft 110 and grind and polish the semiconductor. In this embodiment, two grinding discs 300 are disposed on the shaft 110 at intervals and are staggered with the two groups of stirring paddles 120 .

[0039] A high-pressure airflow is sprayed through the hollow shaft 110 to loosen the grinding material, and the grinding material and the polishing material are stirred by the stirring paddle 120 to prevent the grinding material from accumulating and damaging the semiconductor grinding and polishing device; the polishing material is filtered by the filter element 210 and then added to the stirring barrel 130 to achieve filtering and recycling of the polishing material, prevent the polishing material from scratching the semiconductor, and improve the processing accuracy and quality of semiconductor processing.

[0040] Furthermore, the stirring assembly 100 further includes a lifting paddle 140, the spiral disk of which is disposed at one end of the shaft 110 close to the bottom of the stirring barrel 130, and the lifting paddle 140 rotates with the shaft 110 to turn up the grinding material and the polishing material at the bottom of the stirring barrel 130. Specifically, one edge of the lifting paddle 140 is spirally welded or bonded to the shaft 110, and the lifting paddle 140 is located at a section of the shaft 110 close to the stirring barrel 130. As the lifting paddle 140 rotates, the grinding material and the polishing material at the bottom of the stirring barrel 130 can be driven to turn up and then fall down, thereby preventing the grinding material and the polishing material from being accumulated at the bottom of the stirring barrel 130 for a long time.

[0041] Furthermore, the stirring assembly 100 further includes a cleaning paddle 150, which is spirally disposed on the shaft 110 and abuts against the inner wall of the stirring barrel 130. The cleaning paddle 150 rotates with the shaft 110 to scrape off the grinding material and polishing material remaining on the inner wall of the stirring barrel 130. Specifically, the cleaning paddle 150 is configured to be in a spiral ribbon shape and spirals from the top of the stirring barrel 130 to the bottom of the stirring barrel 130, and is connected to the shaft 110 through a rod. In order to improve the cleaning effect of the cleaning paddle 150, the cleaning paddle 150 can be tilted at an angle to abut against the inner wall of the stirring barrel 130.

[0042] Furthermore, the stirring assembly 100 also includes a barrel cover 160, which can close the stirring barrel 130 to prevent the grinding material and polishing material from splashing during the operation of the stirring barrel 130. The barrel cover 160 is hollow inside and can be detachably arranged at the open end of the stirring barrel 130. The shaft 110 passes through the barrel cover 160 and is rotatably arranged on the barrel cover 160. In this embodiment, threads can be set at the top of the stirring barrel 130 and the port of the barrel cover 160, so that the barrel cover 160 and the stirring barrel 130 are threadedly connected. In other embodiments, buckles or fasteners can also be set between the stirring barrel 130 and the barrel cover 160, and examples are not given one by one here. Furthermore, a drive motor 113 is set at one end of the shaft 110 that passes through the barrel cover 160, and the drive motor 113 can drive the shaft 110 to rotate.

[0043] Furthermore, the stirring assembly 100 further includes an air intake pipe 170 and an air intake pump 180. The air intake pipe 170 is communicated with the barrel cover 160. The air intake pump 180 is arranged on the air intake pipe 170. The part of the shaft 110 located inside the barrel cover 160 is provided with an air intake hole 112. The air is driven by the air intake pump 180, enters the air intake hole 112 through the air intake pipe 170, and is ejected from the air outlet hole 111. Specifically, a filter 190 is also arranged on the air intake pipe 170. The air enters the air intake pipe 170 after filtering dust and impurities through the filter 190, so as to prevent dust and impurities from clogging the air intake hole 112 and the air outlet hole 111. Furthermore, a pressure relief valve 430 is arranged on the barrel cover 160, and the pressure relief valve 430 is communicated with the inside of the barrel cover 160, so as to prevent the air pressure in the barrel cover 160 from being unbalanced.

[0044] Furthermore, the filter assembly 200 further includes a filter tube 230 and a spiral rod 240. The filter tube 230 is disposed at the bottom of the mixing barrel 130 and selectively communicates with the mixing barrel 130. The spiral rod 240 is disposed on the filter tube 230 and rotates in a horizontal direction. The spiral rod 240 rotates to stir the grinding material and the polishing material. Specifically, a control valve 131 is disposed between the filter tube 230 and the bottom of the mixing barrel 130 to selectively connect or disconnect the filter tube 230 and the mixing barrel 130.

[0045] Further, the spiral rod 240 passes through one end of the filter tube 230 and is connected to the uniform speed motor 241, and the uniform speed motor 241 drives the spiral rod 240 to rotate so as to transport the abrasive material from one end of the filter tube 230 to the other end. The other end of the filter tube 230 is detachably provided with a pipe cover 242, and the detachable pipe cover 242 facilitates the removal of the used abrasive material. In this embodiment, the pipe cover 242 is fixed to the filter tube 230 by bolts. In other embodiments, the pipe cover 242 can be threadedly connected to the filter tube 230. Further, the paddle of the spiral rod 240 abuts against the inner wall of the filter tube 230, and during the rotation of the spiral rod 240, the inner wall of the filter tube 230 can be scraped, so that the filter tube 230 is convenient to clean.

[0046] Furthermore, the filter assembly 200 further includes a recovery box 250, a suction pump 260 and a first liquid infusion pipe 270. The filter tube 230 is disposed in the recovery box 250. A filter hole 231 is disposed at the bottom of the filter tube 230. When the uniform speed motor 241 drives the screw rod 240 to rotate to transport the abrasive material from one end of the filter tube 230 to the other end, the polishing material flows into the recovery box 250 through the filter hole 231. The first liquid infusion pipe 270 connects the recovery box 250 and the liquid storage tank 220. The suction pump 260 is disposed in the first liquid infusion pipe 270 to draw the polishing material into the liquid storage tank 220. Specifically, the suction port of the suction pump 260 is set at a certain height so that the polishing material filtered from the filter tube 230 can be left to settle in the recovery box 250, and then the suction pump 260 extracts the upper clear liquid. Furthermore, a slag outlet is provided at the bottom of the recovery box 250, and the slag outlet is sealed by a slag cover 251 to facilitate cleaning of impurities after static sedimentation.

[0047] Further, the filter assembly 200 further includes a screw rod 2020 and a scraper 2030. The screw rod 2020 is rotatably arranged in the recycling box 250 in the horizontal direction. The scraper 2030 is provided with a threaded hole. The scraper 2030 is sleeved on the screw rod 2020 through the threaded hole and abuts against the inner wall of the recycling box 250 and the outer wall of the filter tube 230. The scraper 2030 moves along the screw rod 2020 to clean the recycling box 250 and the filter tube 230. Specifically, the screw rod 2020 passes through one end of the recycling box 250 and is connected to a servo motor 252. The servo motor 252 can drive the screw rod 2020 to rotate, so that the scraper 2030 changes the screw connection position on the screw rod 2020; the scraper 2030 can be set to a rubber material to fit the inner wall of the recycling box 250, the outer wall of the filter tube 230 and the filter hole 231, so as to prevent the impurities such as abrasive materials from clogging the filter hole 231.

[0048] Furthermore, the filter assembly 200 further includes a liquid inlet cover 280, a delivery pump 290 and a second liquid inlet pipe 2010. The liquid inlet cover 280 is horizontally arranged on the top of the stirring barrel 130. The liquid inlet cover 280 is hollow inside and has a liquid outlet 281 on the side wall. The second liquid inlet pipe 2010 connects the filter element 210 and the liquid inlet cover 280. The delivery pump 290 is arranged in the second liquid inlet pipe 2010 to add the polishing material to the stirring barrel 130. After the delivery pump 290 is started, a negative pressure environment is formed in the liquid storage tank 220, thereby driving the polishing material to pass through the filter element 210 and enter the second liquid inlet pipe 2010.

[0049] Furthermore, the semiconductor grinding and polishing device also includes a cooling assembly 400, which includes a cooling cover 410 and a refrigerator 420. The cooling cover 410 is arranged outside the stirring barrel 130, and the interior of the cooling cover 410 is hollow and filled with a coolant, the coolant is used to exchange heat with the stirring barrel 130, and the refrigerator 420 is used to cool the coolant. Specifically, the cooling assembly 400 also includes a pressure relief valve 430, which is connected to the interior of the cooling cover 410 to selectively relieve the pressure of the cooling cover 410. The pressure relief valve 430 can monitor the air pressure in the cooling cover 410 in real time, and when the air pressure in the cooling cover 410 reaches a critical value, the cooling cover 410 is automatically relieved.

[0050] Furthermore, the semiconductor grinding and polishing device also includes a bottom box 600, and the recovery box 250 and the liquid storage box 220 are both placed in the bottom box 600. The bottom box 600 can not only realize the integrated design of the filtering component 200, but also play a supporting role for the stirring component 100.

[0051] Further, see Figure 5 The semiconductor grinding and polishing device further includes a control assembly 500, which includes a controller 510. The controller 510 is communicatively connected with the stirring assembly 100, the filtering assembly 200, and the cooling assembly 400. Specifically, the bottom box 600 includes a box door 610, and opening the box door 610 facilitates the inspection of the structure inside the bottom box 600; the controller 510 is arranged on the box door 610. A plurality of heat dissipation holes 611 are arranged at intervals on the box door 610 to prevent the controller 510 from overheating during use.

[0052] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A semiconductor grinding and polishing device, characterized in that: include: A stirring assembly (100), the stirring assembly (100) comprising a shaft (110), a stirring paddle (120) and a stirring barrel (130), the stirring barrel (130) having openings at both ends for accommodating abrasive materials and polishing materials; the shaft (110) is a hollow rod, extending in a vertical direction and rotatably disposed in the stirring barrel (130), the shaft (110) being provided with an air outlet (111), the air outlet (111) being capable of ejecting a high-pressure airflow to loosen and polish the abrasive materials; the stirring paddle (120) being disposed on the shaft (110) in a horizontal direction, the rotation of the shaft (110) being capable of driving the stirring paddle (120) to rotate, so as to stir the abrasive materials and the polishing materials; A filter assembly (200), the filter assembly (200) comprising a filter element (210) and a liquid storage tank (220), the polishing material can flow from the bottom of the stirring barrel (130) to the liquid storage tank (220), the filter element (210) is arranged in the liquid storage tank (220), and the polishing material can be added to the stirring barrel (130) from the top of the stirring barrel (130) after being filtered by the filter element (210); A grinding disc (300) is arranged on the shaft (110) so as to rotate along with the shaft (110) and grind and polish the semiconductor.

2. The semiconductor grinding and polishing device according to claim 1, characterized in that: The stirring assembly (100) further comprises a lifting paddle (140), wherein a spiral disk of the lifting paddle (140) is arranged at one end of the shaft (110) close to the bottom of the stirring barrel (130), and the lifting paddle (140) rotates with the shaft (110) to turn up the grinding material and the polishing material at the bottom of the stirring barrel (130).

3. The semiconductor grinding and polishing device according to claim 1, characterized in that: The stirring assembly (100) further comprises a cleaning paddle (150), the spiral disk of the cleaning paddle (150) being arranged on the shaft (110) and abutting against the inner wall of the stirring barrel (130), the cleaning paddle (150) rotating along with the shaft (110) to scrape off the grinding material and the polishing material remaining on the inner wall of the stirring barrel (130).

4. The semiconductor grinding and polishing device according to claim 1, characterized in that: The stirring assembly (100) further comprises a barrel cover (160), the barrel cover (160) is hollow inside and is detachably arranged at the open end of the stirring barrel (130), and the shaft (110) passes through the barrel cover (160) and is rotatably arranged on the barrel cover (160).

5. The semiconductor grinding and polishing device according to claim 4, characterized in that: The stirring assembly (100) also includes an air intake pipe (170) and an air intake pump (180), wherein the air intake pipe (170) is connected to the barrel cover (160), and the air intake pump (180) is arranged on the air intake pipe (170). The part of the shaft (110) located inside the barrel cover (160) is provided with an air intake hole (112), and air is driven by the air intake pump (180), enters the air intake hole (112) through the air intake pipe (170), and is ejected from the air outlet hole (111).

6. The semiconductor grinding and polishing device according to claim 1, characterized in that: The filter assembly (200) further comprises a filter tube (230) and a spiral rod (240); the filter tube (230) is disposed at the bottom of the stirring barrel (130) and is selectively connected to the stirring barrel (130); the spiral rod (240) is rotatably disposed on the filter tube (230) along the horizontal direction; the spiral rod (240) rotates to stir the grinding material and the polishing material.

7. The semiconductor grinding and polishing device according to claim 6, characterized in that: The filter assembly (200) further comprises a recovery box (250), a suction pump (260) and a first liquid infusion pipe (270); the filter pipe (230) is arranged in the recovery box (250); a filter hole (231) is arranged at the bottom of the filter pipe (230); the polishing material flows into the recovery box (250) through the filter hole (231); the first liquid infusion pipe (270) connects the recovery box (250) and the liquid storage tank (220); the suction pump (260) is arranged on the first liquid infusion pipe (270) to draw the polishing material into the liquid storage tank (220).

8. The semiconductor grinding and polishing device according to claim 1, characterized in that: The filter assembly (200) further comprises a liquid inlet cover (280), a delivery pump (290) and a second liquid infusion pipe (2010); the liquid inlet cover (280) is arranged at the top of the stirring barrel (130) along the horizontal direction; the liquid inlet cover (280) is hollow inside and a liquid outlet hole (281) is arranged on the side wall; the second liquid infusion pipe (2010) connects the filter element (210) and the liquid inlet cover (280); the delivery pump (290) is arranged on the second liquid infusion pipe (2010) to add the polishing material to the stirring barrel (130).

9. The semiconductor grinding and polishing device according to any one of claims 1 to 8, characterized in that: The semiconductor grinding and polishing device also includes a cooling component (400), and the cooling component (400) includes a cooling cover (410) and a refrigerator (420). The cooling cover (410) is arranged outside the stirring barrel (130), and the interior of the cooling cover (410) is hollow and filled with a cooling liquid. The cooling liquid is used to exchange heat with the stirring barrel (130), and the refrigerator (420) is used to cool the cooling liquid.

10. The semiconductor grinding and polishing device according to claim 9, characterized in that: The semiconductor grinding and polishing device further comprises a control component (500), wherein the control component (500) comprises a controller (510), and the controller (510) is communicatively connected with the stirring component (100), the filtering component (200) and the cooling component (400).

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