Vapor phase coating device and vapor phase coating method

Abstract

The invention relates to a gas phase coating apparatus and a gas phase coating method. The gas phase coating device comprises a vacuum chamber, the vacuum chamber comprises a bearing disc and a sealing cover, the bearing disc is provided with a bearing face, a material containing cavity sunken in the bearing face and an air channel which is communicated with the material containing cavity, bypasses the bearing face and is communicated to the upper side of the bearing face, the sealing cover is connected to the bearing disc in a sealed mode, and a coating cavity is defined by the sealing cover and the bearing disc; the coating cavity is communicated with the material containing cavity through an air channel, and the coating cavity covers the bearing surface; the vacuum cavity obstructing device is communicated with the vacuum chamber, and the vacuum cavity obstructing device has a conducting state and a closed state; and the external channel is communicated with the vacuum chamber through the vacuum cavity blocker. The gas phase coating device can be suitable for manufacturing experimental-level semiconductors.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor equipment, and in particular to a vapor coating device and a vapor coating method. Background Art

[0002] In the manufacturing process of semiconductor devices, the process of coating the surface of silicon wafers is often involved. Silicon wafers are one of the most commonly used substrate materials in semiconductor manufacturing, and the development of surface coating technology began with the continuous pursuit of semiconductor device performance and function. Coating technology can form a dense and uniform film on the surface of silicon wafers to achieve improved performance.

[0003] In some processes, the silicon wafer surface needs to be vapor-coated with hexamethyldisilazane (HMDS). Hexamethyldisilazane is a commonly used silicon surface coating agent, usually used to form a thin layer of organic silicon coating on the surface of silicon wafers. It plays a role in promoting photoresist adhesion, improving process stability, and preventing pollution in the semiconductor manufacturing industry.

[0004] HDMS coating on the surface of silicon wafers is mainly a large-scale, large-area, high-cost industrial coating process, which is very unfriendly to experimental semiconductor manufacturing research. Simple experimental-level techniques such as spin coating and spray coating are often liquid-phase coating. For example, spin coating: dripping the solution onto the surface of the silicon wafer and rotating the silicon wafer to evenly distribute it to form a thin film; manual coating: using a brush, roller, etc. to apply the material to the surface of the silicon wafer; spray coating: using a sprayer to spray the material onto the surface of the silicon wafer to form a thin film. These methods have poor uniformity, are easily affected by impurities, and have poor coating effects. Summary of the invention

[0005] The disclosed embodiment provides a vapor phase coating device, which includes: a vacuum chamber, the vacuum chamber includes a support tray and a sealing cover, the support tray has a supporting surface, a material holding cavity recessed in the supporting surface, and an air passage connected to the material holding cavity and bypassing the supporting surface to connect to the upper side of the supporting surface, the sealing cover is sealingly connected to the support tray, the sealing cover and the support tray define a coating cavity, the coating cavity is connected to the material holding cavity through the air passage, and the coating cavity covers the supporting surface; a vacuum cavity barrier connected to the vacuum chamber, the vacuum cavity barrier has a conducting state and a closed state; and an external channel connected to the vacuum chamber through the vacuum cavity barrier.

[0006] By setting up a vacuum chamber, it is possible to simultaneously accommodate the raw materials for coating and the parts to be coated, and by cleverly utilizing the layout of the airway, vapor phase coating is achieved in a compact space. The vapor phase coating device of the embodiment of the present disclosure has a compact structure and is easy to use; it can be applied to experimental semiconductor manufacturing. The vapor phase coating device can be used to achieve vapor phase coating with good coating effect.

[0007] In some embodiments, a recessed raw material pool is provided at the center of the material holding cavity.

[0008] Such an arrangement can easily ensure that the raw materials are concentrated in the raw material pool at the center, which is conducive to the uniform diffusion of the raw materials.

[0009] In some embodiments, the cross-section of the material holding cavity is circular, and the cross-section of the coating cavity is circular.

[0010] Such an arrangement facilitates the matching with silicon wafers and has a smaller external size; it is also beneficial to ensure uniform diffusion of the raw material gas.

[0011] In some embodiments, a plurality of air channels are evenly distributed around the material holding cavity.

[0012] With such arrangement, the multiple air passages can evenly transport the raw material gas from the material holding chamber to the coating chamber.

[0013] In some embodiments, the vacuum cavity barrier is located on the sealing cover, the vacuum cavity barrier is sealed to the sealing cover, and the vacuum cavity barrier is connected to the center of the coating cavity.

[0014] With such arrangement, the vapor phase coating device has a simple structure and occupies a small space in the horizontal direction; it is convenient for disassembly, assembly and vacuuming.

[0015] In some embodiments, the vapor phase coating device further comprises a fluorinated sealing ring, which is disposed between the support tray and the sealing cover, and is used to sealably fit the support tray and the sealing cover.

[0016] Such an arrangement helps to improve the sealing effect of the vapor phase coating device in a high temperature environment.

[0017] In some embodiments, the support tray and the sealing cover are flange-connected, the vacuum chamber barrier and the vacuum chamber are flange-connected, and the external channel and the vacuum chamber barrier are flange-connected.

[0018] With such arrangement, the vacuum chamber has a simple and compact structure and reliable installation; the vapor coating device has a reliable structure and good sealing performance.

[0019] In some embodiments, the vapor phase coating device further comprises two handles, the two handles are fixed to the sealing disk, and the two handles are located on both sides of the vacuum chamber barrier.

[0020] Such an arrangement makes it easy to take and place the sealing cover or move the vapor coating device; and ensures a compact structure without affecting the vacuum chamber barrier.

[0021] In some embodiments, the vapor phase coating device further comprises a holding sheet, which is suitable for being placed on the supporting surface and used for holding the to-be-coated object whose size is smaller than that of the material holding cavity.

[0022] With such an arrangement, the vapor phase coating device can be used to coat non-standard parts, small-sized parts, broken parts, etc.; the vapor phase coating device has good applicability and can be used in a variety of applications at a relatively low cost.

[0023] The disclosed embodiment also provides a vapor coating method, which is based on the aforementioned vapor coating device, and includes: placing a raw material into a material holding chamber; placing a workpiece to be coated on a supporting surface; evacuating the vacuum chamber through an external channel and a vacuum chamber barrier in a conductive state; and heating the vacuum chamber to allow the raw material to be vapor-coated on the surface of the workpiece to be coated.

[0024] By using the aforementioned vapor phase coating device, vapor phase coating can be performed on the object to be coated. The vapor phase coating method of the embodiment of the present disclosure realizes experimental-level semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of a vapor phase coating device according to an embodiment of the present disclosure;

[0026] Figure 2 is a schematic top view of a vapor phase coating device according to an embodiment of the present disclosure;

[0027] Figure 3 is a schematic structural block diagram of a vapor phase coating system according to an embodiment of the present disclosure;

[0028] Figure 4 A flow chart of the preparation steps of the vapor coating method according to an embodiment of the present disclosure;

[0029] Figure 5 A flow chart of the processing steps of the vapor coating method according to an embodiment of the present disclosure;

[0030] Figure 6 A flow chart of the steps of taking out a piece in the vapor phase coating method according to an embodiment of the present disclosure;

[0031] Figure 7 It is a schematic flowchart of the vapor phase coating method according to an embodiment of the present disclosure.

[0032] Description of reference numerals: 1. vacuum chamber; 2. tray; 201. supporting surface; 202. material holding chamber; 203. airway; 204. raw material pool; 21. first flange; 3. sealing cover; 301. coating chamber; 31. second flange; 4. vacuum chamber barrier; 41. first interface; 42. second interface; 43. adjustment part; 5. external channel; 6. fluorinated sealing ring; 7. handle; 8. holding sheet;

[0033] 100. Vapor coating device; 200. Part to be coated; 210. Raw material; 220. Coating; 300. Vacuum pump; 400. Vapor coating system; 500. Heating device. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and understandable, the specific implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure. However, the embodiments of the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the embodiments of the present disclosure, so the embodiments of the present disclosure are not limited by the specific examples of the embodiments disclosed below.

[0035] In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "perpendicular", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present disclosure.

[0036] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. Exemplarily, the first interface may also be referred to as the second interface, and the second interface may also be referred to as the first interface. In the description of the embodiments of the present disclosure, "multiple" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, the terms "connected", "connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a flexible connection, or a rigid connection along at least one direction; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or directly connected with the presence of an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. The terms "installed", "set", "fixed", etc. can be broadly understood as connection. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0039] As used in the present disclosure, the terms "layer" and "region" refer to a portion of a material that includes an area with a certain thickness. The layer can extend horizontally, vertically and / or along a tapered surface. A layer can be an area of ​​a uniform or non-uniform continuous structure, and its thickness perpendicular to the extension direction may not be greater than the thickness of the continuous structure. A layer can include multiple layers, which can be multiple stacked layers or multiple layers extending discretely. The shapes of various areas and layers in the drawings and their relative sizes and positional relationships are only exemplary, and may actually deviate due to manufacturing tolerances or technical limitations, and the design can be adjusted according to actual needs.

[0040] refer to Figure 1 , Figure 1 1 shows a vapor coating device according to an embodiment of the present disclosure. In an exemplary embodiment, the vapor coating device 100 includes a vacuum chamber 1 and a vacuum chamber barrier 4. The vacuum chamber barrier 4 is connected to the vacuum chamber 1. The vapor coating device 100 may also include an external channel 5, which is connected to the vacuum chamber 1 through the vacuum chamber barrier 4.

[0041] Combination Figure 2 and Figure 4 As shown, Figure 2 The vapor phase coating device 100 in the embodiment of the present disclosure is shown. In some embodiments, the vacuum chamber 1 includes a tray 2 and a sealing cover 3. Both the tray 2 and the sealing cover 3 are roughly disc-shaped and can extend along the XY plane. Exemplarily, the tray 2 and the sealing cover 3 can be docked along the Z-axis direction. The material of the tray 2 and the sealing cover 3 can be stainless steel, or other temperature-resistant materials that do not affect the raw material 210 for coating.

[0042] The support tray 2 has a support surface 201. Exemplarily, the support surface 201 is lower than the top surface of the support tray 2 along the Z-axis direction. The support tray 2 may include a limiting side surface or a limiting column surrounding the support surface 201 and higher than the support surface 201.

[0043] The tray 2 also has a material holding cavity 202, which can be recessed in the supporting surface 201 along the Z-axis direction. The material holding cavity 202 is used to hold the raw material 210. Figure 4 The supporting surface 201 is used to support the object 200 to be coated. The supporting surface 201 can surround the material holding cavity 202. The material holding cavity 202 can expose most of the lower surface of the object 200 to be coated.

[0044] The supporting tray 2 further has an air passage 203 , which is connected to the material holding cavity 202 , and the air passage 203 bypasses the supporting surface 201 and is connected to the upper side of the supporting surface 201 .

[0045] The sealing cover 3 is sealingly connected to the tray 2, and the sealing cover 3 and the tray 2 define a coating chamber 301. Optionally, the supporting surface 201 of the tray 2 and the surface for fitting the sealing cover 3 are substantially flush, and the sealing cover 3 is provided with a recessed coating chamber 301; or, the lower end of the sealing cover 3 includes a plane flush with the substrate, the tray 2 has a coating chamber 301, and the supporting surface 201 can be the bottom surface of the coating chamber; or, the tray 2 has a groove located on the upper side of the supporting surface 201, and the sealing cover 3 also has a groove, and the two grooves are connected to obtain the coating chamber 301. The area of ​​the coating chamber 301 is larger than the outer contour area of ​​the supporting surface 201, which is conducive to ensuring that the upper surface of the piece 200 to be coated is completely exposed and not covered. The coating chamber 301 is connected to the material holding chamber 202 through the air channel 203. When the piece 200 to be coated is set on the supporting surface 201, the piece 200 to be coated will not completely block the air channel 203.

[0046] Exemplarily, the vacuum chamber 1 has a vacuum cavity, and the vacuum cavity includes a material holding cavity 202, an air passage 203 and a coating cavity 301 that are interconnected. The sealing cover 3 and the tray 2 can cooperate to define the vacuum cavity. Exemplarily, the sealing cover 3 and the tray 2 can be flatly docked, or the outer peripheral surfaces can be fitted, or the steps can be embedded.

[0047] The vacuum chamber barrier 4 has an on state and a closed state. When the vacuum chamber barrier 4 is in the on state, the vacuum chamber of the vacuum chamber 1 can be connected to the outside through the vacuum chamber barrier 4; when the vacuum chamber barrier 4 is in the closed state, the vacuum chamber of the vacuum chamber 1 can be hermetically isolated from the external space.

[0048] Exemplarily, the external channel 5 is connected to the vacuum chamber 1 through the vacuum chamber barrier 4. The external channel 5 and the vacuum chamber barrier 4 may be detachable structures or may be formed integrally. The external channel 5 is suitable for external connection, for example, connected to the vacuum pump 300.

[0049] In the vapor coating device 100 of the embodiment of the present disclosure, the vacuum chamber 1 can simultaneously accommodate the raw material 210 for coating and the object to be coated 200, and the layout of the gas channel 203 is cleverly utilized to implement vapor coating in a compact space. The vapor coating device 100 of the embodiment of the present disclosure has a compact structure and is easy to use; it can be applied to experimental-level semiconductor manufacturing.

[0050] The vapor phase coating device 100 can be used to realize vapor phase coating with good coating effect; it can form a coating 220 with good uniformity, good cleanliness and good stability on the surface of the object 200 to be coated.

[0051] refer to Figure 1 In some embodiments, the vapor coating device 100 further includes a holding sheet 8, which is suitable for being placed on the supporting surface 201 and used to hold the to-be-coated part 200 whose size is smaller than the material holding cavity 202 or smaller than the inner diameter of the annular supporting surface 201. The vapor coating device 100 can be used to coat non-standard parts, small-sized parts, broken parts, etc.; the vapor coating device 100 has good applicability and can be used in a variety of applications at a relatively low cost.

[0052] Exemplarily, the supporting surface 201 is suitable for placing a 4-inch silicon wafer, and the holding sheet 8 may not be used at this time. The supporting surface 201 cannot support a silicon wafer smaller than 4 inches, and at this time, the holding sheet 8 may be placed, and then the small silicon wafer may be placed on the holding sheet 8.

[0053] In some embodiments, a recessed raw material pool 204 is provided at the center of the material holding cavity 202 , which can easily ensure that the raw material 210 is concentrated in the raw material pool 204 at the center, thereby facilitating uniform diffusion of the raw material 210 .

[0054] In some embodiments, the cross section of the material holding chamber 202 is circular, and the cross section of the coating chamber 301 is circular, which is convenient for matching with the object 200 to be coated, and the vacuum chamber 1 has a smaller outer size; it is conducive to ensuring the uniform diffusion of the raw material gas. The thickness of the material holding chamber 202 and the coating chamber 301 is along the Z-axis direction, and the cross section may refer to the surface perpendicular to the Z-axis direction. Exemplarily, the cross section of the material holding chamber 202 and the cross section of the coating chamber 301 are each roughly circular, and the supporting surface 201 is roughly annular; the cross section of the material holding chamber 202 and the cross section of the coating chamber 301 can also be other shapes.

[0055] The air passage 203 may be directly connected to the coating chamber 301 or indirectly connected to the coating chamber 301. Figure 4 , the airway 203 can completely avoid the supporting surface 201. Figure 1 and Figure 2 The top opening of the air channel 203 can be larger, for example, made into a groove shape, and a part of the top opening of the air channel 203 can extend into the outer contour of the supporting surface 201.

[0056] In some embodiments, the vacuum chamber 1 has a plurality of air channels 203, which are evenly distributed around the material holding chamber 202, and the plurality of air channels 203 can evenly transport the raw material gas from the material holding chamber 202 to the coating chamber 301. Optionally, eight evenly distributed air channels 203 may be provided, or six, ten or other numbers of air channels 203 may be provided. Exemplarily, the air outlets at the upper ends of the air channels 203 are arranged in a circle, evenly corresponding to the coating chamber 301.

[0057] In some embodiments, the vacuum chamber barrier 4 is located on the sealing cover 3, and the vacuum chamber barrier 4 is sealed and connected to the sealing cover 3. The gas phase coating device 100 has a simple structure and occupies a small space in the horizontal direction; it is convenient for disassembly and vacuuming. Exemplarily, the vacuum chamber barrier 4 is connected to the center of the coating chamber 301, and the sealing cover 3 is easy to manufacture. In other embodiments, the vacuum chamber barrier 4 can also be connected to other positions, can also be connected to the vacuum chamber, can be connected to the coating chamber 301, and can also be connected to the material holding chamber 202.

[0058] In some embodiments, the vapor phase coating device 100 further includes a fluorinated sealing ring 6, which is disposed between the support tray 2 and the sealing cover 3. The fluorinated sealing ring 6 is used to seal the support tray 2 and the sealing cover 3, which helps to improve the sealing effect of the vapor phase coating device 100 in a high temperature environment. The butt joint surface between the support tray 2 and the sealing cover 3 can be a plane substantially parallel to the XY plane, and the fluorinated sealing ring 6 can be disposed in a sealing groove provided in the support tray 2, which surrounds the vacuum chamber and is spaced from the vacuum chamber.

[0059] In some embodiments, the tray 2 and the sealing cover 3 are flange-connected. The tray 2 may include a first flange portion 21, which may be the outermost circle of the tray 2. The sealing cover 3 may include a second flange portion 31, which may be the outermost circle of the sealing cover 3. The vapor coating device 100 includes bolts, such as hexagonal bolts, and the first flange portion 21 and the second flange portion 31 may be locked with the bolts.

[0060] Exemplarily, the first flange portion 21 is provided with a threaded hole, the second flange portion 31 may be provided with a through hole, and the bolt may pass through the through hole of the sealing cover 3 and be threadedly connected to the threaded hole of the first flange portion 21. The support tray 2 may be set to have a flat bottom, which is easy to place and has a simple structure. At the same time, the sealing cover 3 is easy to disassemble and assemble, and can ensure the sealing performance of the vacuum chamber.

[0061] Exemplarily, the vacuum chamber barrier 4 is flange-connected to the vacuum chamber 1. The vacuum chamber barrier 4 may include a first interface 41 and a second interface 42. The first interface 41 may be provided with a flange structure, and is fastened to the sealing cover 3 by other bolts. The vacuum chamber 1 has a simple and compact structure and is reliably installed.

[0062] Optionally, the external channel 5 is flange-connected to the vacuum chamber barrier 4, and the external channel 5 can be flange-connected to the second interface 42 of the vacuum chamber barrier 4. The vapor phase coating device 100 has a reliable structure and good sealing performance. The external end of the external channel 5 can be configured as a quick-release structure.

[0063] Exemplarily, the vacuum chamber barrier 4 further includes an adjusting portion 43, through which the vacuum chamber barrier 4 can be switched to a conducting state or a closed state. The adjusting portion 43 can be rotated forward or backward relative to the body of the vacuum chamber barrier 4 to achieve conducting or closing.

[0064] In some embodiments, the vapor coating device 100 further includes handles 7, for example, two handles 7. The two handles 7 can be fixed to the sealing cover 3, which is convenient for taking and placing the sealing cover when the sealing cover 3 is separated from the tray 2, and is also convenient for moving the vapor coating device 100 when the sealing cover 3 is connected to the tray 2.

[0065] Exemplarily, two handles 7 are located on both sides of the vacuum chamber barrier 4, ensuring a compact structure without affecting the vacuum chamber barrier 4. The handles 7 are arranged roughly along the X-axis direction and arranged along the Y-axis direction. The external channel 5 can be arranged on one side of the vacuum chamber barrier 4 along the X-axis direction.

[0066] refer to Figure 3 The embodiment of the present disclosure further provides a vapor coating system 400, which includes a vapor coating device 100 and a vacuum pump 300. The vacuum pump 300 can evacuate the vapor coating device 100, specifically, it can extract the gas in the vacuum chamber of the vacuum chamber 1 through the external channel 5 and the vacuum chamber barrier 4.

[0067] Exemplarily, the vapor coating system 400 further includes a heating device 500 for heating the vapor coating device 100 .

[0068] refer to Figures 4 to 7 The vapor coating method 1000 provided in the embodiment of the present disclosure can be implemented based on the aforementioned vapor coating device 100, and can implement the preparation step, the processing step and the removal step. Exemplarily, the vapor coating method 1000 includes steps S101 to S104.

[0069] Combination Figure 4 As shown in the first step, step S101 , the raw material 210 is placed into the material holding chamber 202 .

[0070] Step S102 , placing the object 200 to be coated on the supporting surface 201 . In some embodiments, the object 200 to be coated can be placed on a holding sheet 8 , and the holding sheet 8 is placed on the supporting surface 201 .

[0071] Combination Figure 4 As shown in the second step, step S103, the vacuum chamber 1 is evacuated. Exemplarily, the vacuum chamber 1 is evacuated through the external channel 5 and the vacuum chamber barrier 4 in the conductive state. After evacuation, the vacuum chamber barrier 4 is adjusted to a closed state.

[0072] refer to Figure 5 Step S104 , heating the vacuum chamber 1 . During the heating of the vacuum chamber 1 , the raw material 210 is converted into gaseous raw material gas, which enters the coating chamber 301 through the gas channel 203 , and then the raw material 210 is gas-phase coated on the surface of the object 200 to form a coating 220 .

[0073] The vapor coating method 1000 of the embodiment of the present disclosure can perform vapor coating on the object to be coated 200, and can realize experimental-level semiconductor manufacturing, which is convenient for research. The vapor coating method 1000 can produce a coating 220 with good uniformity, good stability, and good cleanliness.

[0074] refer to Figure 6 Exemplarily, the vapor phase coating method 1000 further includes a step of taking out the article. After forming the coating 220, the vacuum chamber barrier 4 can be adjusted to a conducting state. External gas enters the vacuum chamber 1 through the external channel 5 and the conducting state vacuum chamber barrier 4, and then the sealing cover 3 can be removed from the tray 2, and then the article to be coated 200 that has been vapor phase coated can be taken out.

[0075] For example, the raw material 210 is hexamethyldisilazane, and the object to be coated 200 is a silicon wafer. In the vapor phase coating method 1000 , 0.5 ml to 5 ml of liquid HMDS can be dropped into the raw material pool 204 of the tray 2 .

[0076] A 4-inch silicon wafer can be placed on the supporting surface 201 of the tray 2. In other embodiments, a silicon wafer smaller than 4 inches can be placed on the holding sheet 8. The sealing cover 3 is mounted on the tray 2, and the bolts are tightened to achieve sealing.

[0077] The vacuum chamber barrier 4 is in a conducting state, and the external channel 5 is connected to the vacuum pump 300, and the vacuum chamber 1 is evacuated by the vacuum pump 300. The gas in the coating chamber 301, the air channel 203 and the material holding chamber 202 is evacuated, so that the vacuum chamber barrier 4 is in a closed state.

[0078] The heating device 500 may be used for heating, and the heating device 500 may be an oven. Exemplarily, the heating temperature is 125° to 130°, and the heating time is 0.5h to 2h.

[0079] After the vapor coating is completed, wait for the vapor coating device 100 to cool down. The vacuum chamber barrier 4 is turned on, and gas enters the vacuum chamber of the vacuum chamber 1. After the internal and external air pressures are relatively balanced, the sealing cover 3 is removed, and then the silicon wafer coated with HMDS is taken out. The upper and lower surfaces of the silicon wafer can be coated with HMDS, and the coating 220 on the upper surface is more complete.

[0080] The disclosed embodiment realizes a laboratory-level, simple-to-operate, low-cost vapor phase coating device 100, and realizes a uniform, clean, and stable vapor phase coating method 1000. Hexamethyldisilazane can be coated on the surface of a silicon wafer.

[0081] The technical features of the embodiments disclosed above can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] In the embodiments disclosed above, unless otherwise clearly specified and limited, the execution order of each step is not limited, for example, it can be executed in parallel, or it can be executed successively in different orders. The sub-steps of each step can also be executed alternately. The above-mentioned various forms of processes can be used, and steps can be reordered, added or deleted, as long as the desired results of the technical solution provided in the embodiment of the present disclosure can be achieved, and this document does not limit it here.

[0083] The embodiments disclosed above only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of patent protection of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the scope of patent protection required by the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A vapor coating device, characterized in that: include: A vacuum chamber, the vacuum chamber comprising a support tray and a sealing cover, the support tray having a support surface, a material holding cavity recessed in the support surface, and an air passage connected to the material holding cavity and bypassing the support surface to connect to the upper side of the support surface, the sealing cover being sealingly connected to the support tray, the sealing cover and the support tray defining a coating cavity, the coating cavity being connected to the material holding cavity through the air passage, and the coating cavity covering the support surface; A vacuum chamber barrier is connected to the vacuum chamber, and the vacuum chamber barrier has an on state and a closed state; as well as An external channel is connected to the vacuum chamber through the vacuum chamber barrier.

2. The vapor coating device according to claim 1, wherein: A concave raw material pool is provided at the center of the material holding cavity.

3. The vapor phase coating device according to claim 2, wherein: The cross section of the material holding cavity is circular, and the cross section of the coating cavity is circular.

4. The vapor phase coating device according to claim 2, wherein: A plurality of air passages are evenly distributed and arranged around the material holding cavity.

5. The vapor phase coating device according to claim 1, wherein: The vacuum cavity barrier is located on the sealing cover, the vacuum cavity barrier is sealed and connected to the sealing cover, and the vacuum cavity barrier is connected to the center position of the coating cavity.

6. The vapor phase coating device according to any one of claims 1 to 5, wherein: It also includes a fluorinated sealing ring, which is arranged between the support tray and the sealing cover, and is used to seal the support tray and the sealing cover.

7. The vapor coating device according to any one of claims 1 to 5, wherein: The support tray and the sealing cover are flange-connected, the vacuum chamber barrier and the vacuum chamber are flange-connected, and the external channel and the vacuum chamber barrier are flange-connected.

8. The vapor phase coating device according to any one of claims 1 to 5, wherein: It also includes two handles, which are fixed to the sealing disk and are located on both sides of the vacuum chamber barrier.

9. The vapor phase coating device according to any one of claims 1 to 5, wherein: It also includes a containing sheet, which is suitable for being placed on the supporting surface and used for containing the to-be-coated parts whose size is smaller than that of the containing cavity.

10. A vapor phase coating method, characterized in that: Based on the vapor coating device according to any one of claims 1 to 9, the vapor coating method comprises: Putting raw materials into the material holding cavity; Placing the workpiece to be coated on the supporting surface; The vacuum chamber is evacuated through the external channel and the vacuum chamber barrier in the conductive state; and The vacuum chamber is heated to allow the raw material to be gas-phase coated on the surface of the object to be coated.

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