Pressure sensing structure and pressure touch device

Abstract

The invention belongs to the technical field of pressure sensing, and discloses a pressure sensing structure and a pressure touch device. The pressure sensing device comprises a frame structure, a pressure sensing assembly and a bearing plate. Wherein the pressure sensing assembly is composed of an arc-shaped elastic sheet and an FPC pressure sensing film attached to the lower curved surface of the elastic sheet, and the FPC pressure sensing film is printed with a low-resistivity electrode and a high-resistivity semiconductor conductive film. When the pressure bearing plate is subjected to external pressure, the arc-shaped elastic sheet deforms under the pressure, so that the FPC upper electrode is in contact with the semiconductor part to form a loop, the contact part is short-circuited along with the increase of the pressure, the loop resistance is reduced, and the magnitude of the pressure is reflected through the change of the resistance value. The pressure sensing structure provided by the invention has sensitive and linear signal response, has good stability, and has the capability of multi-directional force detection.

Description

Technical Field

[0001] The present invention relates to the field of pressure sensing technology, and in particular to a pressure sensing structure and a touch control device using the pressure sensing structure. Background Art

[0002] With the development of consumer electronics and engineering control, pressure sensing technology has been increasingly widely used in related products and industrial equipment. The main function of pressure sensing technology is to accurately sense the size, direction and position of the applied force, help the system identify the pressure information, and thus formulate different pressure response strategies to enable electronic devices to achieve multiple functions.

[0003] Existing pressure sensing devices use a variety of pressure sensors for pressure detection, including MEMS pressure sensors, flexible pressure sensors (resistive, capacitive, piezoelectric), resistance strain gauges, fiber optic sensors, etc. These sensors detect pressure based on different sensing principles and are widely used in consumer electronics, medical devices, industrial control and other fields. However, the above pressure sensors have the following disadvantages, which limit the practicality of this type of sensing technology. MEMS sensors are not suitable for portable sensing devices due to their large size; flexible sensors have difficulty in achieving a trade-off between sensitivity and range, and their durability is significantly inferior to other sensors; resistance strain gauge signals have a small range of variation and are difficult to use in high-precision pressure detection scenarios; fiber optic sensors require an additional readout system, which increases the complexity of the sensing system.

[0004] Based on the above reasons, the existing pressure sensing solutions still have shortcomings in terms of structural size, sensing performance and durability. It is still a challenge to develop high-performance, easy-to-implement, stable and durable pressure sensing devices. Summary of the invention

[0005] In order to solve the defects and shortcomings in the prior art, the present invention provides a pressure sensing structure and a pressure touch device using the pressure sensing structure.

[0006] The pressure sensing structure of the present invention comprises an arc-shaped spring piece and a pressure sensing component arranged on the outer surface of the arc-shaped spring piece; a point on the arc-shaped spring piece is a fixed point.

[0007] The pressure sensing component includes a first section of a film, a second section of a film, a semiconductor conductive film, and an electrode; the arc-shaped spring piece is made of stainless steel or other materials, is prepared by bending or stamping process, and has good elasticity, will deform under pressure and can return to its original shape after the pressure is removed;

[0008] The electrodes are strip electrodes;

[0009] The first section of the film is arranged on the outer surface of the arc-shaped spring piece along the length direction of the arc-shaped spring piece;

[0010] The semiconductor conductive film is located on the surface of the first section of the film, and the electrode is located on the surface of the second section of the film.

[0011] The semiconductor conductive film has a high resistivity, the strip electrode has a low resistivity, both ends of the two parts are led out through wires, and there is a gap between the two parts;

[0012] The positions of the semiconductor conductive film and the electrode correspond to each other, and the shapes of the semiconductor conductive film and the electrode may also be the same.

[0013] A point or an area on the arc-shaped spring is set as a fixed point or a fixed area to fix the arc-shaped spring; in the initial state, the semiconductor conductive film and the electrode are not in contact. When pressure is applied to one end of the arc-shaped spring, the semiconductor conductive film and the electrode approach each other, and as the pressure increases, the semiconductor conductive film contacts the electrode, and the contact area between the semiconductor conductive film and the electrode increases.

[0014] Specifically, when pressure is applied to one end of the arc-shaped spring sheet, the arc-shaped spring sheet with an arc is compressed downward to produce deformation, and the FPC sensor is deformed along with the thin sheet, so that the semiconductor conductive film comes into contact with one end of the electrode, thereby forming a connected loop between the electrode and the semiconductor conductive film, and the resistance value is maximum at this time. As the pressure increases further, the arc-shaped spring sheet bends further, and the contact area between the semiconductor conductive film and the electrode increases under the squeezing action of the arc structure, causing the contacted part to be short-circuited. At this time, the effective length between the electrode and the semiconductor conductive film is shortened, and the resistance value of the loop is reduced. Therefore, the pressure sensing structure reflects the magnitude of the pressure through the change of the resistance signal, thereby realizing the detection of pressure.

[0015] Furthermore, the electrode part can be formed by preparing electrode materials such as copper, silver, and conductive silver paste on one end of the film by copper coating, screen printing, etc.;

[0016] The semiconductor conductive film can be obtained by printing semiconductor ink on the other end of the film by screen printing, scraping, spraying, etc., and there is a gap between the electrode and the semiconductor conductive film. In addition, the resistivity of the semiconductor ink is much greater than that of the electrode material, so the resistance of the semiconductor conductive film is much greater than that of the electrode at the other end.

[0017] Furthermore, a pressure sensing structure of the present invention also includes a first plate; one end of the arc-shaped spring piece is connected to the upper surface of the first plate, and the other end of the arc-shaped spring piece is a free end; the second section of the film is arranged on the upper surface of the first plate, and the electrode on the second section of the film corresponds to the position of the semiconductor conductive film.

[0018] Furthermore, the first section of the film and the second section of the film are connected via a bent portion, so as to facilitate integral molding.

[0019] Furthermore, the free end of the arc-shaped elastic sheet is connected to a second flat plate, and the second flat plate is parallel to the first flat plate. When applying pressure to the pressure sensing structure, pressure can be directly applied to the surface of the second flat plate, which is equivalent to increasing the pressure surface on which pressure can be applied.

[0020] The pressure sensing structure can be made by pasting an FPC sensing component on an arc-shaped spring sheet and then bending them together. While maintaining consistent pressure sensing performance, its structure and process are simpler.

[0021] Furthermore, the pressure sensing structure of the present invention also includes a bottom plate; when fixing the arc-shaped spring sheet, the midpoint of the arc-shaped spring sheet is fixedly connected to the upper surface of the bottom plate, and both ends of the arc-shaped spring sheet are free ends; the second section of the film is arranged on the upper surface of the flat plate, and the electrode on the second section of the film corresponds to the position of the semiconductor conductive film. There are two pressure sensing components; the pressure sensing components are symmetrically arranged;

[0022] Furthermore, a pressure sensing structure of the present invention further includes a pressure plate; the two free ends of the arc-shaped spring piece are connected to a second flat plate, the second flat plate is parallel to the bottom plate; the pressure plate is located on the upper surface of the two second flat plates. The pressure plate and the pressure sensing structure are detachably connected.

[0023] Furthermore, a cylinder is vertically arranged on the bottom plate; the arc-shaped spring piece and the pressure sensing component are both located in the cylinder; the cross section of the pressure plate is similar to that of the cylinder and is smaller than that of the cylinder.

[0024] The area of ​​the pressure plate is slightly smaller than the cross section of the cylinder, so that it can move longitudinally and deflect inside the cylinder. The pressure plate and the top of the pressure sensing structure are detachably connected by abutment or magnetic adsorption.

[0025] The pressure sensing structure has two pressure sensing components, which can be installed in the installation slot of the electronic device or on the surface of the touch object. The cylinder is used to protect the overall structure of the pressure touch device and enable the pressure sensing components and the pressure plate to move longitudinally along the structural frame.

[0026] Since there are pressure sensing components at both ends of the sensing structure, electrical signals that change with the pressure will be generated at both ends of the sensing structure. The sensing structure can simultaneously measure the changes in resistance at both ends and calculate the position of the pressure on the pressure plate, thereby realizing the detection of the size and position of the pressure.

[0027] Based on the pressure sensing structure of the present invention, the present invention also proposes a pressure touch device, including a base plate, a cylinder, a pressure plate and multiple pressure sensing structures; the cylinder and the multiple pressure sensing structures are all arranged on the surface of the base plate, and the pressure sensing structures are all located in the cylinder; the pressure plate is located on the upper surface of the multiple pressure sensing structures, and is connected to the upper surfaces of the two flat plates of the pressure sensing assembly, and the cross-section of the pressure plate is similar to the cross-section of the cylinder, and is smaller than the cross-section of the cylinder.

[0028] A pressure sensing structure is a pressure sensing unit, so a single pressure sensing structure can only detect the size of pressure. However, the combination of multiple such sensing structures can realize more specific pressure sensing functions. For example, two pressure sensing structures are placed opposite to each other in a straight line, and the dual sensing unit array formed can realize pressure size and single-axis direction detection; three or more sensing structures are placed in a ring array, and the multi-sensing unit array formed can realize pressure size and any direction detection on the plane, which has higher flexibility and scene adaptability.

[0029] Beneficial effects: Compared with the prior art, the pressure sensing structure and pressure touch device proposed in the present invention have the following beneficial effects:

[0030] (1) It has a simple structure and is lightweight, so it can be used in a variety of portable devices. (2) It uses a short-circuit resistor to achieve pressure sensing, which has high sensitivity and good linearity. In the initial state, the two conductive areas are separated from each other, avoiding the influence of zero drift on the sensing structure. (3) The arc-shaped thin film has good elasticity and can be restored to its original shape after multiple deformations, which greatly improves the service life of the sensor device. It is more durable than flexible sensors. (4) Different moduli can be selected, and the thickness of the arc-shaped thin film can be adjusted to change the pressure deformation characteristics of the sensing structure, thereby customizing the sensitivity and range of the pressure sensing device. (5) The pressure touch device uses a combination of multiple sensors to achieve single-point force and multi-directional force detection functions. It can be designed and assembled according to the application scenario and has high flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The technical solution of the embodiment of the present invention is further described in detail below through the drawings and examples.

[0032] Figure 1 is a schematic diagram of the pressure sensor structure in the first embodiment of the present invention;

[0033] Figure 2 is a schematic diagram of the pressure sensing structure in the first embodiment;

[0034] Figure 3 This is a lead-out diagram of the pressure sensing assembly of the present invention;

[0035] Figure 4is a schematic diagram of the pressure sensing structure in the third embodiment;

[0036] Figure 5 is a schematic diagram of a pressure touch device in Embodiment 4;

[0037] Among them, 11, arc-shaped spring piece; 12, first flat plate; 13, second flat plate;

[0038] 2. pressure sensing component; 21. first section of the film; 22. second section of the film; 23. bending portion; 24. semiconductor conductive film; 25. electrode;

[0039] 3. Frame structure; 31. Bottom plate; 32. Cylinder;

[0040] 4. Pressure plate. DETAILED DESCRIPTION

[0041] In order to more clearly illustrate the technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the embodiments and drawings. It should be understood that the drawings described here are only some embodiments of the present application and are not intended to limit the present invention.

[0042] Embodiment 1

[0043] like Figure 1 As shown, the pressure sensing structure of the present invention includes an arc-shaped spring piece 11 and an FPC pressure sensing component 2 arranged on the outer surface of the arc-shaped spring piece 11; the surface facing the center of the arc-shaped spring piece 11 is set as the inner surface of the arc-shaped spring piece 11, and the other side is the outer surface of the arc-shaped spring piece 11.

[0044] The FPC pressure sensing component 2 includes a first film section 21, a second film section 22, a semiconductor conductive film 24, and an electrode 25;

[0045] The semiconductor conductive film 24 is located on the surface of the first film segment 21, and the electrode 25 is located on the second film segment 22; the shape of the semiconductor conductive film 24 is the same as that of the electrode 25, and the positions are opposite;

[0046] The first film section 21 is arranged on the outer surface of the arc-shaped elastic sheet 11 along the length direction of the arc-shaped elastic sheet 11;

[0047] The first film section 21 and the second film section 22 are made of the same material, which is PI or PET film.

[0048] One end of the arc-shaped spring piece 11 is fixed on a plane, and the second section 22 of the film is also fixed on the plane, and the semiconductor conductive film 24 and the electrode 25 are opposite to each other; the other end of the arc-shaped spring piece 11 is a free end;

[0049] Wires are connected to the semiconductor conductive film 24 and the electrode 25 respectively, and are connected to the reading circuit as lead-out ends. When in use, the free end moves downward under the action of pressure, and the arc-shaped spring piece 11 drives the first section 21 of the film and the semiconductor conductive film 24 to move downward. When the pressure increases to a certain level, the end of the semiconductor conductive film 24 close to the plane first contacts the electrode 25, and the semiconductor conductive film 24 and the electrode 25 form a connecting loop. The pressure is further increased, and the contact area between the semiconductor conductive film 24 and the electrode 25 is further increased, and the resistance of the loop is further reduced until the contact area between the semiconductor conductive film 24 and the electrode 25 no longer changes, and the maximum range of pressure measurement is reached.

[0050] Embodiment 2

[0051] like Figure 2 As shown, the pressure sensing structure in this embodiment is based on the pressure sensing structure in the first embodiment, with the addition of a first plate 12 and a second plate 13 ; the first section 21 of the film and the second section 22 of the film are connected via a bending portion 23 .

[0052] One end of the arc-shaped spring piece 11 is connected to the upper surface of the first plate 12 , and the other end of the arc-shaped spring piece 11 is a free end connected to the second plate 13 . The first plate 12 is parallel to the second plate 13 . The bending portion 23 is located at the angle where the arc-shaped spring piece 11 is connected to the first plate 12 .

[0053] The first film section 21, the second film section 22, and the bent portion 23 are all PI films or PET films.

[0054] The preparation process of the FPC pressure sensing film structure is as follows: a long strip of electrode 25 and a semiconductor conductive film 24 are printed on a 0.05 mm thick PI film, with a gap between the electrode 25 and the semiconductor conductive film 24, and the two ends of the electrode 25 and the semiconductor conductive film 24 are led out by a wire, such as Figure 3 shown.

[0055] The electrode 25 can be prepared in the following manner: the conductive silver paste is screen-printed onto the PI film through a 300-400 mesh screen, and then heated at 80°C to 100°C for 30 minutes to obtain the long strip silver paste electrode 25.

[0056] The semiconductor conductive film 24 can be prepared by the following method: the semiconductor conductive ink is screen-printed on the other end of the PI film printed with the electrode 25 through a 300-350 mesh screen, and then heated at 80°C to 100°C for 2 hours to obtain the semiconductor conductive film 24.

[0057] Preferably, the semiconductor conductive ink can be a semiconductor ink obtained by dispersing and mixing one or more conductive particles such as carbon black, graphene, carbon nanotubes or metal powder, with a flexible resin solution and a corresponding curing agent. This ink has a certain conductivity, but its resistivity is much higher than that of the electrode material.

[0058] The pressure sensing structure in this embodiment can be prepared by laminating the arc-shaped spring piece 11 and the FPC pressure sensor and then bending them together, with both ends remaining straight.

[0059] In the initial state, the electrode 25 of the FPC sensor component is not in contact with the semiconductor conductive film 24. Under the action of pressure, the upper end of the elastic sheet bends downward so that the FPC semiconductor conductive film 24 is in contact with one end of the electrode 25, and as the pressure increases, the contact area also increases, causing the contact part to short-circuit, resulting in a decrease in the loop resistance, thereby reflecting the magnitude of the pressure.

[0060] Embodiment 3

[0061] like Figure 4 As shown, the pressure sensing structure includes a detachable pressure plate 4, an arc-shaped spring piece 11, a frame structure 3, and two FPC pressure sensing components 2 arranged on the outer surface of the arc-shaped spring piece 11; the surface facing the center of the arc-shaped spring piece 11 is set as the inner surface of the arc-shaped spring piece 11, and the other side is the outer surface of the arc-shaped spring piece 11.

[0062] The frame structure 3 is a structure with one end open, including a bottom plate 31 and a cylinder 32, the interface of the cylinder 32 is circular or square, etc.; the arc spring piece 11 and the two FPC pressure sensing components 2 are both located in the frame structure 3, the midpoint of the arc spring piece 11 is fixedly connected to the upper surface of the bottom plate 31, and both ends of the arc spring piece 11 are free ends; one end of the cylinder 32 is connected to the upper surface of the bottom plate 31, and the arc spring piece 11 and the two FPC pressure sensing components 2 are both located in the area surrounded by the cylinder 32. Specifically, the arc spring piece 11 and the bottom plate 31 are connected by gluing.

[0063] The FPC pressure sensing component 2 includes a first film section 21, a second film section 22, a semiconductor conductive film 24, and an electrode 25; the first film section 21 and the second film section 22 are connected by a bending portion 23; the first film section 21, the second film section 22 and the bending portion 23 can be integrally formed during production.

[0064] The semiconductor conductive film 24 is located on the surface of the first film segment 21, and the electrode 25 is located on the surface of the second film segment 22; the shape of the semiconductor conductive film 24 and the electrode 25 are opposite and the shapes can be the same;

[0065] The two FPC pressure sensing components 2 have the same structure and are symmetrically arranged. The first film section 21 is arranged on the outer surface of the arc-shaped spring piece 11 along the length direction of the arc-shaped spring piece 11 . The second film section 22 is arranged on the surface of the bottom plate 31 .

[0066] The FPC pressure sensor assembly 2 further includes two second flat plates 13 connected to two free ends of the arc-shaped elastic sheet 11 ; and the second flat plates 13 are parallel to the bottom plate 31 .

[0067] The pressure plate 4 is located on the surface of the pressure sensing assembly 2 and is connected by magnetic adsorption, and relative sliding can occur between the lower surface of the pressure plate 4 and the second flat plate 13;

[0068] Specifically, the arc-shaped spring piece 11 is a stainless steel sheet with a thickness of 0.1 to 0.3 mm obtained by stamping through an arc-shaped mold, and is fixed to the bottom plate 31 of the frame structure 3 by welding. The elasticity of the arc-shaped spring piece 11 is related to the material and thickness. The larger the modulus and the thicker the thickness, the more difficult it is for the thin sheet to deform. Therefore, the stress deformation characteristics of the sensing structure can be changed by changing the material and thickness of the thin sheet, and the pressure detection performance of the pressure sensing device of the present invention can be further changed.

[0069] Based on the above pressure sensing structure, the working principle is as follows: Connect the leads at both ends of the PFC sensor to the reading circuit. Figure 3 The middle electrode 25 is not in contact with the semiconductor conductive film 24, so the circuit can be regarded as an open circuit; when pressure acts on the pressure plate 4, the arc-shaped spring piece 11 is deformed under the extrusion force, and the angle between it and the bottom plate 31 of the frame structure 3 decreases. When the pressure increases to a certain extent, the electrode 25 near the bending portion 23 contacts the semiconductor conductive film 24. At this time, a connected circuit is formed between the electrode 25 and the semiconductor conductive film 24, but because the circuit is the longest at this time, the measured resistance value is large, and the pressure value at this time can be recorded as the trigger pressure; as the pressure further increases, the arc-shaped spring piece 11 is further deformed, and the contact area between the electrode 25 and the semiconductor conductive film 24 increases under the extrusion of the arc structure, so that the contacted part causes a short circuit, and the circuit resistance decreases; when the pressure further increases, the electrode 25 and the semiconductor conductive film 24 are completely attached, and at this time the circuit is completely covered by the short-circuit unit, and the circuit resistance reaches the minimum value. At this time, the pressure value is the maximum range of the pressure detection of the pressure sensing unit.

[0070] When the pressure on the pressure plate 4 is removed, the arc-shaped spring sheet 11 returns to its initial state under the action of elasticity. In this process, the contact area between the electrode 25 and the semiconductor gradually decreases to separation, and the electrical signal output by the pressure sensing structure also returns to its initial value without pressure. In summary, the output resistance value of the pressure sensing structure decreases as the pressure increases, thereby being able to reflect the information of the applied pressure.

[0071] Furthermore, the pressure sensing structure can also detect the point of action of pressure on the pressure plate 4, specifically in the following manner: since the width of the pressure bearing member is slightly smaller than the inner groove of the frame structure 3, the pressure bearing member can move vertically and tilt inside the frame structure 3. Specifically, when pressure acts on the midpoint of the pressure plate 4, the deformation amplitudes of the left and right elastic sheets of the pressure sensing structure are the same, so the distances of movement of the two FPC pressure sensing components 2 pasted on the arc-shaped spring sheet 11 are also the same, so the extrusion area between the electrodes 25 and the semiconductor conductive film 24 on the two FPC sensors is also the same, and at this time, the two FPC pressure sensing components 2 have the same or similar resistance changes; when pressure acts on one end of the pressure plate 4, the spring sheet at this end is deformed more, resulting in a larger resistance change amplitude of the FPC sensor at this end, while the spring sheet at the other end is deformed less, so the resistance change amplitude is also smaller, and the point of action of pressure on the pressure plate 4 can be calculated by the ratio of the resistance change amounts ΔR1 and ΔR2 of the two FPC pressure sensing components 2. In summary, the pressure sensing structure described in the first embodiment can detect the pressure magnitude and the action position under the joint action of the pressure sensing units at both ends.

[0072] Embodiment 4

[0073] like Figure 5 As shown, this specific embodiment designs a pressure touch device based on the pressure sensing structure in the second embodiment. The pressure sensing structure in the second embodiment has only one pressure sensing unit, so it is impossible to detect the pressure acting position.

[0074] The bottom surface of the pressure sensing unit can be connected and fixed on the surface of the electronic device by welding, gluing or other methods.

[0075] The pressure touch device provided in this embodiment includes a pressure plate 4, a frame structure 3, and a plurality of pressure sensing structures; the plurality of pressure sensing structures are arranged in the frame structure 3, and the pressure plate 4 is arranged on the upper surface of the pressure sensing structure; specifically, the pressure plate 4 is located on the upper surface of the second flat plate 13 of the pressure sensing structure;

[0076] The frame structure 3 includes a bottom plate 31 and a cylinder 32. The cylinder 32 is open at both ends, and one end of the cylinder 32 is fixedly connected to the bottom plate 31. The pressure sensing structures are evenly arranged on the same circumference, and the pressure sensing structures are fixed to the bottom plate 31 by gluing. The cylinder 32 protects the multiple pressure sensing structures inside, and at the same time enables the top pressure plate 4 to move longitudinally along the cylinder 32 under pressure. There is magnetic adsorption between the pressure plate 4 and the multiple pressure sensing structures. The number of pressure sensing structures in this embodiment is four.

[0077] In addition to being able to detect the magnitude of pressure, the above-mentioned four pressure sensing structures can also detect the position of pressure application. The specific implementation method is as follows: when pressure is applied to the center position of the top pressure plate 4, the arc-shaped spring pieces 11 of the four pressure sensing structures show the same deformation amplitude, thereby squeezing the four FPC pressure sensing films so that the connecting circuit formed between the electrode 25 on the film and the semiconductor conductive film 24 has the same or similar resistance signal. This process is consistent with the corresponding part in Example 3; when pressure is applied to the edge position of the pressure plate 4, the pressure sensing structure near the pressure application point undergoes a larger deformation, and the sensing structure at a farther distance undergoes a smaller deformation. Therefore, the resistance of the FPC pressure sensing film close to the pressure application point is smaller, so that the position of the pressure application point can be determined by calculating the mutual ratio between the resistance signal changes ΔR1, ΔR2, ΔR3 and ΔR4 of the four pressure sensing structures.

[0078] Furthermore, a flexible contact point can be attached to the pressure plate 4 on the top of the touch device. By pressing or pushing the contact point, the pressure plate 4 can be driven to slide up and down and tilt, so that the size and direction of the force can be detected through the coordinated action of four pressure sensing units, thereby realizing arbitrary direction detection of planar force.

[0079] The above are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modification, equivalent replacement and improvement made on the specific implementation mode within the spirit and principle of this application and based on the ideas provided by the present invention shall be included in the protection scope of the present invention.

Claims

1. A pressure sensing structure, characterized in that: It comprises an arc-shaped spring piece (11) and a pressure sensing component (2) arranged on the outer surface of the arc-shaped spring piece (11); The pressure sensing component (2) comprises a first film section (21), a second film section (22), a semiconductor conductive film (24), and an electrode (25); The first section (21) of the film is arranged on the outer surface of the arc-shaped elastic sheet (11) along the length direction of the arc-shaped elastic sheet (11); The semiconductor conductive film (24) is located on the surface of the first section (21) of the film, and the electrode (25) is located on the second section (22) of the film; the positions of the semiconductor conductive film (24) and the electrode (25) correspond to each other.

2. A pressure sensing structure according to claim 1, characterized in that: Also includes a first plate (12); One end of the arc-shaped spring piece (11) is connected to the upper surface of the first flat plate (12), and the other end of the arc-shaped spring piece (11) is a free end; The second section (22) of the thin film is arranged on the upper surface of the first flat plate (12), and the electrode (25) on the second section (22) of the thin film corresponds to the position of the semiconductor conductive thin film (24).

3. A pressure sensing structure according to claim 1 or 2, characterized in that: The first film section (21) and the second film section (22) are connected via a bent portion (23).

4. A pressure sensing structure according to claim 3, characterized in that: The free end of the arc-shaped elastic piece (11) is also connected to a second flat plate (13); the second flat plate (13) is parallel to the first flat plate (12).

5. A pressure sensing structure according to claim 1, characterized in that: Also includes a bottom plate (31); The midpoint of the arc-shaped spring piece (11) is fixedly connected to the upper surface of the bottom plate (31), and both ends of the arc-shaped spring piece (11) are free ends. The second section (22) of the thin film is arranged on the upper surface of the flat plate, and the electrode (25) on the second section (22) of the thin film corresponds to the position of the semiconductor conductive thin film (24).

6. A pressure sensing structure according to claim 5, characterized in that: There are two pressure sensing components (2); and the two pressure sensing components (2) are symmetrically arranged.

7. A pressure sensing structure according to claim 6, characterized in that: Also includes a pressure plate (4); The two free ends of the arc-shaped spring piece (11) are connected to a second flat plate (13), and the second flat plate (13) is parallel to the bottom plate (31); The pressure bearing plate (4) is located on the upper surfaces of the two second flat plates (13).

8. A pressure sensing structure according to claim 7, characterized in that: A cylinder (32) is disposed on the bottom plate (31); the arc-shaped spring piece (11) and the pressure sensing component (2) are both located in the cylinder (32); The cross section of the pressure plate (4) is similar to the cross section of the cylinder (32), and is smaller than the cross section of the cylinder (32).

9. A pressure touch device based on the pressure sensing structure as claimed in claim 4, characterized in that: A bottom plate (31), a cylinder (32), a pressure-bearing plate (4), and a plurality of pressure sensing structures; The cylinder (32) and the plurality of pressure sensing structures are all arranged on the surface of the bottom plate (31), and the pressure sensing structures are all located in the cylinder (32); The pressure plate (4) is located on the upper surfaces of the multiple pressure sensing structures and is connected to the upper surface of the second flat plate of the pressure sensing assembly (2). The cross section of the pressure plate (4) is similar to the cross section of the cylinder (32) and is smaller than the cross section of the cylinder (32).

10. The pressure touch device according to claim 9, characterized in that: A plurality of pressure sensing structures are evenly distributed on the same circumference.

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