Static loading device and static loading method for temperature compensation of semiconductor balance
By designing static loading devices and methods, using vector decomposition and temperature control boxes, the zero point and sensitivity drift problems under the temperature change of semiconductor balance are solved, efficient temperature compensation is achieved, and testing accuracy and efficiency are improved.
Patent Information
- Application Number
- CN202411310672.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2024-12-13
AI Technical Summary
The prior art is difficult to effectively solve the problems of zero point drift and sensitivity drift of semiconductor balances under temperature changes, which affects its use effect.
A static loading device and corresponding method are designed to achieve simultaneous loading of six components through vector decomposition. The angle of attack and rolling angle of the semiconductor balance are adjusted by rotary dial and loading sheet, and temperature compensation is combined with the temperature control box to obtain zero points and sensitivity. Drift data.
The simultaneous loading of six component loads is achieved, which simplifies the temperature compensation process, improves accuracy and work efficiency, and reduces the test workload.
Smart Images
Figure CN119124546A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of wind tunnel tests, and in particular relates to a static loading device and a static loading method for temperature compensation of a semiconductor balance. Background Art
[0002] The wind tunnel balance is a key test sensor used in the aerodynamic measurement test of aircraft in the wind tunnel. It is a non-standard six-component force sensor with certain special features. Commonly used wind tunnel balances are mainly resistance balances and semiconductor balances. Compared with resistance balances, semiconductor balances have higher strain sensitivity, but their zero drift and sensitivity drift are also more sensitive to temperature changes, so the compensation effect of the zero drift and sensitivity drift of semiconductor balances directly affects the use of the balance. In order to reduce the temperature drift of the semiconductor balance, it needs to be sent to a temperature control box for repeated compensation to stabilize its zero point, temperature drift and sensitivity to meet the use requirements.
[0003] Currently, there is an urgent need to develop a static loading device and a static loading method for temperature compensation of a semiconductor balance. Summary of the invention
[0004] One technical problem to be solved by the present invention is to provide a static loading device for temperature compensation of a semiconductor balance. Another technical problem to be solved by the present invention is to provide a static loading method for temperature compensation of a semiconductor balance, so as to overcome the defects of the prior art.
[0005] The static loading device for temperature compensation of a semiconductor balance of the present invention is characterized in that a vertical pillar is fixed on a horizontal base of the static loading device, a lower buckle ring is fixed on the top of the pillar, the upper buckle ring and the lower buckle ring are symmetrical up and down, and a left ear piece and a right ear piece are respectively extended to the left and right on the contact surface of the upper buckle ring and the lower buckle ring, and the upper buckle ring and the lower buckle ring are fixedly connected by bolts penetrating the left ear piece and the right ear piece to form a buckle ring assembly; The swivel is installed in the circular cavity of the buckle assembly, and the swivel rotates around the central axis of the buckle assembly in the circular cavity; the swivel has an opening, and a mounting platform is arranged on the inner wall of the swivel corresponding to the opening, a turntable is fixed on the mounting platform, the rear end of the support rod is inserted into the turntable, and the front end of the support rod passes through the opening and extends out of the buckle assembly; The front end of the support rod is fixed with a semiconductor balance, and a loading head is mounted on the semiconductor balance.
[0006] Furthermore, the upper buckle ring is provided with a plurality of pin holes distributed along the circumferential direction, and each pin hole corresponds to an attack angle α of a semiconductor balance.
[0007] Furthermore, the fixed turntable is fixed on the mounting platform by n screws evenly distributed along the circumference, the central angle between adjacent screws is 360° / n, and by rotating and fixing the turntable, the rolling angle γ of the semiconductor balance can be changed in steps of 360° / n.
[0008] Furthermore, the loading head is provided with a loading piece extending radially along the loading head, and the loading piece rotates around the circumference of the loading head to change the rolling angle γ of the semiconductor balance; the loading piece is provided with a loading point, and a through hole is opened at the loading point.
[0009] The static loading method for temperature compensation of a semiconductor balance of the present invention comprises the following steps: S10. Installing a static loading device for semiconductor balance temperature compensation; A static loading device for temperature compensation of a semiconductor balance is installed on a ground operating table, and the attack angle α and the roll angle γ of the semiconductor balance are adjusted to the values required by the test plan table to obtain a test piece; S20. Place the test piece in a temperature control box for loading and cable connection; Place the test piece in the temperature control box, and install the weight through the through hole of the loading point according to the loading value required by the test plan to complete the loading of the semiconductor balance, and connect the data transmission cable of the semiconductor balance to the computer; S30. Conduct static loading test of semiconductor balance temperature compensation; According to the test plan, gradually increase the temperature of the temperature control box from room temperature. At each temperature, complete the data collection of the semiconductor balance and store it in the computer; S40. Perform data processing; Data processing is performed to obtain the zero drift and sensitivity drift compensation data of the six components of the semiconductor balance.
[0010] Furthermore, the data processing comprises the following steps: S41. Determine the posture and load weight of the semiconductor balance; Tilt the support pole downward in the horizontal direction α Angle; set the turntable to 0° roll angle, and set the roll angle of the loading plate to γ; then the angle of attack of the semiconductor balance is α， The roll angle is γ; The vertical distance between the loading point and the center axis of the semiconductor balance is L 1 ; The axial distance between the balance center and the loading point along the center axis of the semiconductor balance is L 2 ; The hanging weight at the loading point is G The weight is loaded; S42. Perform force system decomposition; Under the earth's axis system XYZ, three components of force are generated on the loading point, which are X Component force F xg , Y Component force F yg ,as well as Z Component force F zg , the specific relationship is: ; in, G is gravity; Since the axial distance between the balance center and the loading point along the center axis of the semiconductor balance is L 2 ; Therefore, the load at the loading point applies six components of load to the semiconductor balance at the same time. Under the balance body axis system XbYbZb, the axial forces are F xb , normal force F yb , lateral force F zb , rolling moment M xb , yaw moment M yb , and the pitch moment M zb , the specific relationship is: ; S43. Perform data processing; According to the temperature compensation signal conditioning method, the zero drift and sensitivity drift compensation data of each component under the balance axis system XbYbZb are obtained.
[0011] The static loading device and static loading method for semiconductor balance temperature compensation of the present invention have the following advantages: 1. The static loading device for temperature compensation of semiconductor balance of the present invention can realize simultaneous loading of six components through vector decomposition, while the conventional loading device can only realize single-time single-component loading of semiconductor balance; 2. The static loading device for temperature compensation of semiconductor balance of the present invention has a compact structure and a small volume, and can be directly placed in a temperature control box to realize loading tests at different temperatures; 3. The static loading method for temperature compensation of a semiconductor balance of the present invention has a simple loading process, which reduces the workload of temperature compensation testing; 4. The static loading method for temperature compensation of a semiconductor balance of the present invention can simultaneously obtain the zero point and sensitivity performance of the semiconductor balance during a single loading process; by changing the temperature in the temperature control box, the zero point drift and sensitivity drift performance of the semiconductor balance at different temperatures can be obtained.
[0012] In summary, the static loading device and static loading method for semiconductor balance temperature compensation of the present invention realize simultaneous loading of six component loads through vector decomposition, obtain zero drift and sensitivity drift compensation of the six components, simplify the temperature compensation process, improve temperature compensation accuracy, improve test work efficiency, reduce test workload, and have engineering practical value. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1a It is a structural schematic diagram (axonometric view) of a static loading device for temperature compensation of a semiconductor balance according to the present invention; Figure 1b It is a structural schematic diagram (front view) of a static loading device for temperature compensation of a semiconductor balance according to the present invention; Figure 1c It is a structural schematic diagram (top view) of a static loading device for temperature compensation of a semiconductor balance of the present invention; Figure 1d It is a structural schematic diagram (side view) of a static loading device for temperature compensation of a semiconductor balance of the present invention; Figure 2 The pitch angle adjustment mechanism ( Figure 1a A partial cross-section enlarged view); Figure 3 A roll angle adjustment mechanism in a static loading device for temperature compensation of a semiconductor balance according to the present invention; Figure 4 It is a schematic diagram of the force system decomposition of the static loading device for temperature compensation of a semiconductor balance of the present invention; Figure 5 This is a schematic diagram of the coordinates of the earth's axis system and the balance body's axis system.
[0014] In the figure, 1. base; 2. support; 3. upper buckle; 4. lower buckle; 5. swivel; 6. pin hole; 7. turntable; 8. support rod; 9. loading head; 10. loading plate; 11. loading point; 12. semiconductor balance; 13. balance centering; 14. temperature control box. DETAILED DESCRIPTION
[0015] The present invention is described in detail below with reference to the accompanying drawings and embodiments.
[0016] Embodiment: The static loading device for temperature compensation of a semiconductor balance of this embodiment is characterized by: Figure 1a~Figure 1d , Figure 2 , Figure 3 A vertical pillar 2 is fixed on the horizontal base 1 of the static loading device, a lower buckle ring 4 is fixed on the top of the pillar 2, the upper buckle ring 3 and the lower buckle ring 4 are symmetrical up and down, and the contact surfaces of the upper buckle ring 3 and the lower buckle ring 4 are provided with a left ear piece and a right ear piece extending to the left and right respectively, and the upper buckle ring 3 and the lower buckle ring 4 are fixedly connected by bolts penetrating the left ear piece and the right ear piece to form a buckle ring assembly; The swivel 5 is installed in the circular cavity of the buckle assembly, and the swivel 5 rotates around the central axis of the buckle assembly in the circular cavity; the swivel 5 has an opening, and a mounting platform is provided on the inner wall of the swivel 5 corresponding to the opening, a turntable 7 is fixed on the mounting platform, the rear end of the support rod 8 is inserted into the turntable 7, and the front end of the support rod 8 passes through the opening and extends out of the buckle assembly; A semiconductor balance 12 is fixed to the front end of the support rod 8 , and a loading head 9 is mounted on the semiconductor balance 12 .
[0017] Furthermore, the upper buckle ring 3 is provided with a plurality of pin holes 6 distributed along the circumferential direction, and each pin hole 6 corresponds to an attack angle α of a semiconductor balance 12 .
[0018] Furthermore, the fixed turntable 7 is fixed to the mounting platform by n screws evenly distributed along the circumference, and the central angle between adjacent screws is 360° / n. By rotating and fixing the turntable 7, the roll angle γ of the semiconductor balance 12 can be changed in steps of 360° / n.
[0019] Furthermore, the loading head 9 is provided with a loading piece 10 extending radially along the loading head 9, and the loading piece 10 rotates around the circumference of the loading head 9 to change the roll angle γ of the semiconductor balance 12; the loading piece 10 is provided with a loading point 11, and a through hole is opened at the loading point 11.
[0020] The static loading method for temperature compensation of a semiconductor balance of the present invention comprises the following steps: S10. Installing a static loading device for semiconductor balance temperature compensation; A static loading device for temperature compensation of a semiconductor balance is installed on a ground operating table, and the attack angle α of the semiconductor balance 12 and the roll angle γ of the semiconductor balance 12 are adjusted to the values required by the test plan table to obtain a test piece; S20. The test piece is placed in the temperature control box 14 for loading and cable connection; Place the test piece in the temperature control box 14, and according to the loading value required by the test plan, hoist the weight through the through hole of the loading point 11 to complete the loading of the semiconductor balance 12, and connect the data transmission cable of the semiconductor balance 12 to the computer; S30. Conduct static loading test of semiconductor balance temperature compensation; According to the test schedule, the temperature of the temperature control box 14 is gradually increased from room temperature. At each temperature, data collection of the semiconductor balance 12 is completed and stored in the computer; S40. Perform data processing; Data processing is performed to obtain zero drift and sensitivity drift compensation data of six components of the semiconductor balance 12.
[0021] Furthermore, the data processing comprises the following steps: S41 determines the posture and load weight of the semiconductor balance 12; like Figure 4 As shown, the support rod 8 is tilted downward in the horizontal direction. α The turntable 7 is set to a roll angle of 0°, and the roll angle of the loading plate 10 is set to γ; the angle of attack of the semiconductor balance 12 is α， The roll angle is γ; The vertical distance between the loading point 11 and the central axis of the semiconductor balance 12 is L 1 The axial distance between the balance center 13 and the loading point 11 along the central axis of the semiconductor balance 12 is L 2 ; The hanging weight at the loading point 11 is G The weight is loaded; S42. Perform force system decomposition; like Figure 5 As shown, under the earth axis system XYZ, three components of force are generated on the loading point 11, which are X Component force F xg , Y Component force F yg ,as well as Z Component force F zg , the specific relationship is: ; in, G is gravity; Since the axial distance between the balance center 13 and the loading point 11 along the central axis of the semiconductor balance 12 is L 2 Therefore, the load at the loading point 11 applies six components of load to the semiconductor balance 12 at the same time. Under the balance body axis system XbYbZb, the axial forces are F xb , normal force F yb , lateral force Fzb , rolling moment M xb , yaw moment M yb , and the pitch moment M zb , the specific relationship is: ; S43. Perform data processing; According to the temperature compensation signal conditioning method, the zero drift and sensitivity drift compensation data of each component under the balance axis system XbYbZb are obtained.
[0022] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and implementation modes. For those familiar with the art, all features disclosed in the present invention, or steps in all methods or processes disclosed, except for mutually exclusive features and / or steps, can be combined in any way without departing from the principles of the present invention. The present invention is not limited to the specific details and illustrations shown and described herein.
Claims
1. A static loading device for temperature compensation of a semiconductor balance, characterized in that: A vertical support (2) is fixed on a horizontal base (1) of the static loading device, a lower buckle ring (4) is fixed on the top of the support (2), an upper buckle ring (3) and a lower buckle ring (4) are symmetrical in upper and lower directions, a left ear piece and a right ear piece are provided on the contact surface of the upper buckle ring (3) and the lower buckle ring (4) and extend to the left and right respectively, and the upper buckle ring (3) and the lower buckle ring (4) are fixedly connected by bolts penetrating the left ear piece and the right ear piece to form a buckle ring assembly; The swivel (5) is installed in the circular cavity of the buckle assembly, and the swivel (5) rotates around the central axis of the buckle assembly in the circular cavity; the swivel (5) has an opening, and a mounting platform is arranged on the inner wall of the swivel (5) corresponding to the opening, and a rotating disk (7) is fixed on the mounting platform, the rear end of the support rod (8) is inserted into the rotating disk (7), and the front end of the support rod (8) passes through the opening and extends out of the buckle assembly; A semiconductor balance (12) is fixed to the front end of the support rod (8), and a loading head (9) is mounted on the semiconductor balance (12).
2. The static loading device for temperature compensation of a semiconductor balance according to claim 1, characterized in that: The upper buckle ring (3) is provided with a plurality of pin holes (6) distributed along the circumferential direction, and each pin hole (6) corresponds to an attack angle α of a semiconductor balance (12).
3. The static loading device for temperature compensation of a semiconductor balance according to claim 1, characterized in that: The fixed turntable (7) is fixed on the mounting platform by n screws evenly distributed along the circumference, the central angle between adjacent screws is 360° / n, and by rotating and fixing the turntable (7), the roll angle γ of the semiconductor balance (12) can be changed in steps of 360° / n.
4. The static loading device for temperature compensation of a semiconductor balance according to claim 1, characterized in that: The loading head (9) is provided with a loading sheet (10) extending radially from the loading head (9); the loading sheet (10) rotates around the circumference of the loading head (9) to change the roll angle γ of the semiconductor balance (12); a loading point (11) is provided on the loading sheet (10), and a through hole is opened at the loading point (11).
5. A static loading method for semiconductor balance temperature compensation, which is used in a static loading device for semiconductor balance temperature compensation as claimed in any one of claims 1 to 4, characterized in that: The following steps are involved: S10. Installing a static loading device for semiconductor balance temperature compensation; A static loading device for temperature compensation of a semiconductor balance is installed on a ground operating table, and an attack angle α of the semiconductor balance (12) and a roll angle γ of the semiconductor balance (12) are adjusted to values required by a test plan table to obtain a test piece; S20. Place the test piece in a temperature control box (14) for loading and cable connection; The test piece is placed in a temperature control box (14), and a weight is hoisted through the through hole of the loading point (11) according to the loading value required by the test plan table to complete the loading of the semiconductor balance (12), and at the same time, the data transmission cable of the semiconductor balance (12) is connected to the computer; S30. Conduct static loading test of semiconductor balance temperature compensation; According to the requirements of the test plan, the temperature of the temperature control box (14) is gradually increased from room temperature, and at each temperature, data collection of the semiconductor balance (12) is completed and stored in the computer; S40. Perform data processing; Data processing is performed to obtain zero drift and sensitivity drift compensation data of six components of the semiconductor balance (12).
6. The static loading method for temperature compensation of a semiconductor balance according to claim 5, characterized in that: The data processing comprises the following steps: S41. Determine the posture and load weight of the semiconductor balance (12); Tilt the support rod (8) downward in the horizontal direction. α angle; the turntable (7) is set to a roll angle of 0°, and the roll angle of the loading plate (10) is set to γ; then the angle of attack of the semiconductor balance (12) is α， The roll angle is γ; The vertical distance between the loading point (11) and the central axis of the semiconductor balance (12) is L 1 The axial distance between the balance center (13) and the loading point (11) along the central axis of the semiconductor balance (12) is L 2 ; The hanging weight at the loading point (11) is G The weight is loaded; S42. Perform force system decomposition; Under the earth's axis system XYZ, three components of force are generated on the loading point (11), which are X Component force F xg , Y Component force F yg ,as well as Z Component force F zg , the specific relationship is: ； in, G is gravity; Since the axial distance between the balance center (13) and the loading point (11) along the central axis of the semiconductor balance (12) is L 2 Therefore, the loading at the loading point (11) simultaneously applies six components of load to the semiconductor balance (12). Under the balance body axis system XbYbZb, the axial forces are F xb , normal force F yb , lateral force F zb , rolling moment M xb , yaw moment M yb , and the pitch moment M zb , the specific relationship is: ； S43. Perform data processing; According to the temperature compensation signal conditioning method, the zero drift and sensitivity drift compensation data of each component under the balance axis system XbYbZb are obtained.