Exposure assembly and photoetching equipment with same

Abstract

The invention discloses an exposure assembly and photoetching equipment with the same, the exposure assembly comprises a light source, a beam splitter, a bearing part and detection equipment, the beam splitter and the light source are oppositely arranged, and the beam splitter is configured to decompose and guide passing light; the bearing part and the beam splitter are oppositely arranged, and the bearing part is used for bearing parts; the detection equipment and the beam splitter are oppositely arranged, and the detection equipment is arranged on the side, away from the bearing piece, of the beam splitter; and the light penetrates through the beam splitter and then enters the detection equipment for sensing analysis. The beam splitter is arranged in the exposure assembly and can reflect and decompose the passing light, so that the detection equipment can detect the light reflected by the bearing part to monitor and feed back the use condition of the exposure assembly in real time, and the exposure performance of the exposure assembly is adjusted according to the current detection structure; therefore, the output performance of the exposure assembly in the using process can meet the current requirement, and the exposure effect and the exposure efficiency are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure devices, and in particular to an exposure assembly and a photolithography device having the same. Background Art

[0002] In the prior art, during the production process of a circuit board, it is necessary to use an exposure device to perform optical etching on it. In the actual use process, since the progress of the specific etching process of circuit boards of different models and different requirements is often different, it is necessary to detect the etching condition of the circuit board. In the related art, it is usually adopted to detect the circuit board after the etching is completed, and adjust the output performance of the exposure assembly according to the detection results. It is impossible to adjust the etching performance according to the real-time situation during the etching process to affect the etching effect of the circuit board, and the production efficiency of the exposure equipment is affected. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present invention is to provide an exposure assembly, which can detect the etching status of a circuit board in real time during the etching process and adjust the exposure performance according to the detection result, so that the etching effect of the circuit board is improved and the production efficiency of the exposure assembly is improved.

[0004] Another object of the present invention is to provide a lithography device, wherein the exposure assembly as shown above is provided in the lithography device.

[0005] According to an embodiment of the present invention, the exposure assembly includes: a light source, a beam splitter, a carrier and a detection device, wherein the beam splitter is arranged opposite to the light source, and the beam splitter is configured to decompose and guide the passing light; the carrier is arranged opposite to the beam splitter, and the carrier is used to carry light; the detection device is arranged opposite to the beam splitter, and the detection device is arranged on a side of the beam splitter away from the carrier; wherein the light source emits light to the beam splitter, and the beam splitter is used to decompose and refract the passing light, and act on the carrier for exposure processing, and then the carrier reflects the light to the beam splitter, and the light passes through the beam splitter and enters the detection device for sensing and analysis.

[0006] According to the exposure assembly of the embodiment of the present invention, a beam splitter is provided in the exposure assembly. The beam splitter can reflect and decompose the passing light, so that the detection equipment can detect the light reflected by the carrier, so as to monitor and feedback the use of the exposure assembly in real time, and adjust the exposure performance of the exposure assembly according to the current detection structure, so that the output performance of the exposure assembly during use can meet the current demand, so as to improve the exposure effect and exposure efficiency.

[0007] In some embodiments, the beam splitter includes: a lens, a first film layer and a second film layer; the first film layer is disposed on one side of the lens; and the second film layer is disposed on the other side of the lens.

[0008] In some embodiments, at least a portion of the first film layer is a transmissive layer and / or at least a portion of the first film layer is a reflective layer, and the second film layer is an anti-reflective layer.

[0009] In some embodiments, the first film layer and the second film layer are coated on the lens using a coating process.

[0010] In some embodiments, it further includes: an anti-reflection portion, which is disposed on a side of the beam splitter away from the carrier, and the anti-reflection portion is spaced apart from the detection device.

[0011] In some embodiments, the anti-reflection portion is an anti-reflection film.

[0012] In some embodiments, a carrying portion is provided on the carrying member, and the carrying portion is used to carry a circuit board for exposure, and the carrying portion is arranged opposite to the beam splitter.

[0013] In some embodiments, the detection device is a detection camera.

[0014] In some embodiments, it also includes: a first light guide part and a second light guide part, the light source is arranged on one side of the first light guide part, the beam splitter is arranged on the other side of the first light guide part, the light source emits light that acts on the beam splitter through the first light guide part; the beam splitter is arranged on one side of the second light guide part, the supporting component is arranged on the other side of the second light guide part, and the beam splitter emits light that acts on the supporting component through the second light guide part.

[0015] A lithography apparatus according to an embodiment of the present invention includes: the exposure assembly as described above.

[0016] According to the lithography device of the embodiment of the present invention, an exposure assembly as shown above is provided in the lithography device. Since a beam splitter is provided in the exposure assembly, the beam splitter can reflect and decompose the passing light, so that the detection equipment can detect the light reflected by the carrier, so as to monitor and feedback the use of the exposure assembly in real time, and adjust the exposure performance of the exposure assembly according to the current detection structure, so that the output performance of the exposure assembly during use can meet the current demand, so as to improve the exposure effect and exposure efficiency, so that the use performance of the lithography device is improved.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 is a schematic structural diagram of an exposure assembly according to an embodiment of the present invention; Reference numerals: Exposure assembly 10, Light source 100, Beam splitter 200, lens 210, first film layer 220, second film layer 230, The carrier 300, Testing equipment 400, Anti-reflection unit 500, The first light guide unit 600, The second light guide part 700, Polarizer 800. DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0020] Reference below Figure 1 An exposure assembly 10 according to an embodiment of the present invention is described, comprising: a light source 100 , a beam splitter 200 , a carrier 300 and a detection device 400 .

[0021] Specifically, the beam splitter 200 is arranged opposite to the light source 100, and the beam splitter 200 is constructed to decompose and guide the passing light; the carrier 300 is arranged opposite to the beam splitter 200, and the carrier 300 is used to carry the light; the detection device 400 is arranged opposite to the beam splitter 200, and the detection device 400 is arranged on the side of the beam splitter 200 away from the carrier 300; wherein, the light source 100 emits light to the beam splitter 200, and the beam splitter 200 is used to decompose and refract the passing light, and act on the carrier 300 for exposure processing, and then the carrier 300 reflects the light to the beam splitter 200, and the light passes through the beam splitter 200 and enters the detection device 400 for sensing and analysis.

[0022] It should be noted that, during the use of the lithography equipment, it is suitable to use the exposure assembly 10 to optically etch the circuit board, and in the specific etching process, it is suitable to use the light source 100 to emit light, and the light is transmitted to the beam splitter 200 for decomposition and transmission, and then part of the light passes through the beam splitter 200 and the anti-reflection part 500 for elimination, and most of the light is suitable to be reflected by the beam splitter 200 to be transmitted to the carrier 300, so that the circuit board provided on the carrier 300 can be etched, and the light after etching is suitable to be reflected on the carrier 300 and transmitted to the beam splitter 200, and the beam splitter 200 is suitable to transmit the light to transmit it to the detection device 400 for sensor detection, and the detected structure is analyzed to adjust the process processing performance accordingly.

[0023] According to the exposure assembly 10 of the embodiment of the present invention, a beam splitter 200 is provided in the exposure assembly 10. The beam splitter 200 can reflect and decompose the passing light, so that the detection device 400 can detect the light reflected by the carrier 300, so as to monitor and feedback the use of the exposure assembly 10 in real time, and adjust the exposure performance of the exposure assembly 10 according to the current detection structure, so that the output performance of the exposure assembly 10 during use can meet the current demand, so as to improve the exposure effect and exposure efficiency.

[0024] In some embodiments, the beam splitter 200 includes: a lens 210, a first film layer 220, and a second film layer 230; the first film layer 220 is disposed on one side of the lens 210; and the second film layer 230 is disposed on the other side of the lens 210. It can be understood that the beam splitter 200 is suitable for including the lens 210, the first film layer 220, and the second film layer 230. The lens 210 is suitable for transmitting light, and the first film layer 220 and the second film layer 230 are disposed on both sides of the lens 210, so that the lenses 210 on both sides can have different properties, thereby realizing the transmission or reflection of light, so as to form light outputs with different properties of the beam splitter 200.

[0025] In some embodiments, at least a portion of the first film layer 220 is a transmission layer and / or at least a portion of the first film layer 220 is a reflection layer, and the second film layer 230 is an anti-reflection layer. It should be noted that the first film layer 220 is disposed on the side of the lens 210 facing the light source 100, so that the first film layer 220 is suitable for reflecting light, so that the light is reflected onto the carrier 300 for exposure processing, and the exposed light is suitable for transmission through the first film layer 220 to be transmitted to the detection device 400 for detection feedback. Therefore, the first film layer 220 is constructed as a film layer in which a transmission layer and a reflection layer are mixed, so that the first film layer 220 can have a combination of reflection and transmission properties. The second film layer 230 is constructed as an anti-reflection layer, so that the transmitted light is suitable for passing through the detection, and avoids being exposed again through the beam splitter 200, so that the exposure performance of the exposure assembly 10 is more reliable.

[0026] In some embodiments, the first film layer 220 and the second film layer 230 are coated on the lens 210 by a coating process. It is understood that the first film layer 220 and the second film layer 230 are arranged to be coated on the lens 210 by a coating process so that the first film layer 220 and the second film layer 230 can be used according to the designed settings, so that the light can be reflected and exposed and transmitted and detected according to the design, so that the beam splitter 200 has a higher performance to meet the use.

[0027] In some embodiments, the exposure assembly 10 further includes: an anti-reflection unit 500, which is disposed on the side of the beam splitter 200 away from the carrier 300, and the anti-reflection unit 500 is spaced apart from the detection device 400. It is understandable that when the light emitted by the light source 100 is reflected by the beam splitter, part of the light is also suitable for being transmitted through the beam splitter 200. In order to avoid the effect of this part of the transmitted light on the performance of the exposure assembly 10, the anti-reflection unit 500 is suitable for being constructed so that the anti-reflection unit 500 can eliminate the above-mentioned transmitted light, so that the performance of the exposure assembly 10 is improved.

[0028] In some embodiments, the anti-reflection portion 500 is an anti-reflection film. It is understood that the anti-reflection portion 500 is constructed using the anti-reflection film so that the anti-reflection film can be arranged at a suitable position so that the light of the exposure assembly 10 can be eliminated as designed.

[0029] In some embodiments, a carrying portion is provided on the carrying member 300, and the carrying portion is used to carry the circuit board for exposure, and the carrying portion is arranged opposite to the beam splitter 200. That is, during the construction process of the carrying member 300, it is suitable to be configured with a carrying portion, and the carrying portion is suitable for carrying the circuit board or the mask plate for exposure, so that the exposure performance of the exposure assembly 10 can act on the circuit board or the mask plate according to the design for exposure processing.

[0030] In some embodiments, the detection device 400 is a detection camera. It is understood that when the detection device 400 is set as a detection camera, the light that passes through the beam splitter 200 and enters the detection camera can form an image accordingly, so that the image is analyzed to achieve real-time detection, and the output performance of the exposure assembly 10 is adjusted according to the detection result.

[0031] In some embodiments, the exposure assembly 10 further includes: a first light guide 600 and a second light guide 700, the light source 100 is disposed on one side of the first light guide 600, the beam splitter 200 is disposed on the other side of the first light guide 600, the light source 100 emits light to act on the beam splitter 200 through the first light guide 600; the beam splitter 200 is disposed on one side of the second light guide 700, the carrier 300 is disposed on the other side of the second light guide 700, and the beam splitter 200 emits light to act on the carrier 300 through the second light guide 700. That is to say, during the use of the exposure assembly 10, it is also suitable to construct the first light guide 600 and the second light guide 700, so that the light can act on the beam splitter 200 through the first light guide 600 according to the design, and act on the carrier 300 through the second light guide 700, so as to avoid interference of stray light on the exposure process, thereby making the use performance of the exposure assembly 10 more stable and reliable.

[0032] In some embodiments, a polarizer 800 may be provided between the beam splitter 200 and the detection device 400 so that the polarizer 800 can filter the light passing therethrough, and the detection device 400 can detect the required light according to the design, so that the detection effect of the detection device 400 is more accurate and reliable.

[0033] The lithography device according to the embodiment of the present invention includes: the exposure assembly 10 as described above. That is, the 405nm laser beam is irradiated onto the beam splitter 200 through two lenses 210, and the reflected light R in a specific proportion enters the processing surface of the mask to perform normal mask exposure processing, and the remaining proportion of the transmitted light T will pass through the beam splitter 200 and be absorbed by the anti-reflection film to prevent light pollution. The light beam R incident on the mask will partially reflect the light into the loop due to the material properties, and the reflected light in the loop will be transmitted again through the beam splitter 200 in proportion and imaged on the CCD camera equipped with a polarizer 800, thereby realizing real-time monitoring of the processing status of the mask.

[0034] In this way, by providing the exposure assembly 10 as shown above in the lithography device, since the beam splitter 200 is provided in the exposure assembly 10, the beam splitter 200 can reflect and decompose the passing light, so that the detection device 400 can detect the light reflected by the carrier, so as to monitor and feedback the use of the exposure assembly 10 in real time, and adjust the exposure performance of the exposure assembly 10 according to the current detection structure, so that the output performance of the exposure assembly 10 during use can meet the current demand, so as to improve the exposure effect and exposure efficiency, so that the use performance of the lithography device is improved.

[0035] Other structures and operations of the lithography apparatus according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0037] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An exposure assembly, It is characterized in that include: light source; A beam splitter, the beam splitter is arranged opposite to the light source, and the beam splitter is configured to decompose and guide the passing light; A carrier, the carrier is arranged opposite to the beam splitter, and the carrier is used for carrying the beam splitter; A detection device, the detection device is arranged opposite to the beam splitter, and the detection device is arranged on a side of the beam splitter away from the carrier; Among them, the light source emits light to the beam splitter, and the beam splitter is used to decompose and refract the passing light and act on the carrier for exposure processing. Then the carrier reflects the light to the beam splitter. After the light passes through the beam splitter, it enters the detection equipment for sensing and analysis.

2. The exposure assembly according to claim 1, It is characterized in that The beam splitter comprises: lens; A first film layer, wherein the first film layer is disposed on one side of the lens; A second film layer is disposed on the other side of the lens.

3. The exposure assembly according to claim 2, It is characterized in that At least a portion of the first film layer is a transmission layer and / or at least a portion of the first film layer is a reflection layer, and the second film layer is an anti-reflection layer.

4. The exposure assembly according to claim 3, It is characterized in that The first film layer and the second film layer are coated on the lens by using a coating process.

5. The exposure assembly according to claim 1, It is characterized in that Also includes: The anti-reflection part is arranged on a side of the beam splitter away from the supporting member, and the anti-reflection part is arranged at a distance from the detection device.

6. The exposure assembly according to claim 5, It is characterized in that The anti-reflection part is an anti-reflection film.

7. The exposure assembly according to claim 1, It is characterized in that The carrier is provided with a carrying portion, and the carrying portion is used to carry a circuit board for exposure, and the carrying portion is arranged opposite to the beam splitter.

8. The exposure assembly according to claim 1, It is characterized in that The detection device is a detection camera.

9. The exposure assembly according to claim 1, It is characterized in that Also includes: A first light guide part, wherein the light source is disposed on one side of the first light guide part, and the beam splitter is disposed on the other side of the first light guide part, and the light emitted by the light source acts on the beam splitter through the first light guide part; The second light guide part, the beam splitter is arranged on one side of the second light guide part, the supporting component is arranged on the other side of the second light guide part, and the beam splitter guides the light to act on the supporting component through the second light guide part.

10. A lithography apparatus, It is characterized in that include: An exposure assembly as claimed in any one of claims 1 to 9.

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