Anti-oxidation device provided with semiconductor equipment
By designing anti-oxidation devices for semiconductor equipment, using sealed rubber strips and nitrogen filling systems, the problem of solder wire oxidation is solved, extending service life, reducing production costs, and improving soldering quality.
Patent Information
- Application Number
- CN202411254884.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2024-12-13
AI Technical Summary
Solder wires are easily oxidized in the packaging process, resulting in short service life, affecting the chip soldering quality and increasing production costs.
An anti-oxidation device for semiconductor equipment is designed, using a T-chassis and a closed cover structure, combining sealed rubber strips, gas detection devices and nitrogen filling system to slow down the oxidation rate of solder wires and prevent it from being used through elastic insertion rods and push rod mechanisms. The cabinet door is opened directly to reduce air contact.
It extends the service life of solder wire, reduces production costs, effectively slows down the oxidation speed through sealing and nitrogen filling systems, and improves the welding quality.
Smart Images
Figure CN119133025A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor packaging technology, in particular to an anti-oxidation device provided with semiconductor equipment. Background Art
[0002] As time goes by and science and technology develop, the development and technology of electronic components also progress, and the parts of electronic components are also updated. Among them, the update and iteration of semiconductor packaging technology is also very important. The semiconductor packaging technology is to encapsulate the chip in the integrated circuit inside the protective shell, which has provided mechanical support and protected the chip from the influence of the external environment, and realized the connection of the external circuit. The choice of packaging technology also depends on many factors, such as the size of the chip, performance requirements, application environment, etc., and different packaging forms have different characteristics and advantages. For example, plastic packaging is usually used in consumer electronics, while ceramic packaging is more suitable for high temperature and high reliability applications. In the packaging process, there is a DB soft solder process, and in this process, the solder wire will be oxidized due to contact with the air, so that the service life of the solder wire is only 120 hours, which will cause the solder wire to be unable to be used due to oxidation. If used, it will cause quality problems in the welding of the chip. Therefore, the oxidized solder wire can only be scrapped, resulting in extremely high production costs. Summary of the invention
[0003] The object of the present invention is to provide an anti-oxidation device provided with a semiconductor device to solve the problem in the above-mentioned background technology that the solder wire is easily oxidized and cannot be used.
[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an anti-oxidation device provided with semiconductor equipment, comprising a chassis, the chassis is T-shaped, and closed covers are fixedly installed on the outer surfaces of both sides of the chassis, a rotating chuck is rotatably installed inside the chassis, and an elastic sheet is provided on the outer surface of the rotating chuck, and a solder storage tray is clamped and installed on the outer surface of the rotating chuck, the solder storage tray stores solder wire inside, and the solder storage tray and the rotating chuck are concentrically designed, a cabinet door is provided on the outer surface of the chassis, and movable hinges are respectively provided on the outer surfaces of the cabinet door and the closed cover, and the movable hinges are rotatably connected, and a sealing fool-proofing structure is provided between the closed cover and the cabinet door, and the oxidation rate of the solder wire in the solder storage tray is reduced by the sealing fool-proofing structure.
[0005] Preferably, the sealing and fool-proofing structure comprises: a sealing rubber strip, which is fixedly mounted on the outer surface of one side of the cabinet door, and the side surfaces of the cabinet door are respectively fitted with the outer surfaces of the closing cover and the chassis, the side surfaces of the sealing rubber strip are respectively fitted with the outer surfaces of the closing cover and the chassis, a pushing rod is slidably mounted on the outer surface of the cabinet door, and elastic plug rods are fixedly mounted on both sides of the pushing rod, an anti-fool-proofing rotating rod is rotatably mounted on the outer surface of the pushing rod, and the outer surface of the anti-fool-proofing rotating rod is fitted with the outer surface of the pushing rod, one end of the elastic plug rod is inserted into the chassis, and the outer surface of one end of the push rod is fitted with the outer surface of the cabinet door.
[0006] By adopting the above technical scheme, the cabinet door can be closed so that the sealing rubber strip can fit with the chassis and the closing cover, so that the closing cover can be closed and sealed, preventing external air from entering the interior of the closing cover, slowing down and reducing the oxidation of the solder wire wrapped in the solder storage tray, and at the same time, the cabinet door can be closed and buckled on the closing cover through the elastic plug rod, and the cabinet door will not be opened directly through the anti-fool rotating rod on the outer surface of the push rod, thereby reducing the probability of the cabinet door being opened directly without determining the nitrogen content, reducing the contact between the solder wire and the air, extending the service life of the solder wire, and reducing the production cost.
[0007] Preferably, a gas detection device is fixedly installed inside the chassis, and the gas detection device is located inside the closed cover, and the outer surface of the closed cover is in contact with the outer surface of the gas detection device.
[0008] By adopting the above technical solution, the gas composition and content in the closed cover can be measured by the gas detection device, and nitrogen can be added again when the nitrogen content in the closed cover is insufficient to slow down the oxidation rate of the solder wire.
[0009] Preferably, the rotating shaft at one end of the movable hinge passes through the outer surface of the other movable hinge, and a nut is threadedly installed on the outer surface of the rotating shaft of the movable hinge, so that the movable hinges can be separated.
[0010] By adopting the above technical solution, the nut on the movable hinge shaft can be removed to separate the movable hinge, so that the cabinet door can be separated from the closing cover, which makes it convenient to remove the cabinet door and replace the consumable sealing rubber strip.
[0011] Preferably, an elastic latch is slidably mounted on one end of the chassis away from the elastic insertion rod, and one end of the elastic latch is inclined, the outer surface of the elastic latch is engaged with the outer surface of the cabinet door, and the cabinet door is in contact with the outer surface of the chassis.
[0012] By adopting the above technical solution, when the solder wire in the solder storage tray needs to be replaced, the cabinet door can be opened and rotated along the rotating axis of the movable hinge. The cabinet door will be blocked by the chassis, and at the same time, the elastic latch will be pushed by the cabinet door through the inclined surface of the elastic latch, so that the cabinet door can be fixed after opening, which is convenient for taking out and placing the solder storage tray.
[0013] Preferably, an observation window is fixedly mounted on the outer surface of the cabinet door, and the observation window is at the same height as the solder storage tray, and one end of the solder storage tray does not fit the outer surface of the closure cover.
[0014] By adopting the above technical solution, the usage of the solder wire in the solder storage tray in the closed cover can be directly checked through the observation window.
[0015] Preferably, the outer surfaces of both sides of the closed cover are provided with snap-fitting docking mechanisms, which facilitate the delivery of nitrogen into the interior of the closed cover, thereby reducing the oxidation rate of the solder wire, extending the use time of the solder wire and reducing the use cost of the solder wire.
[0016] By adopting the above technical solution, nitrogen can be delivered into the interior of the closed cover through the connecting hose and discharged to the outside through the connecting hose on the other side, so that the interior of the closed cover can be filled with nitrogen, reducing the oxidation rate of the solder wire, extending the service life of the solder wire, and reducing the cost during use.
[0017] Preferably, the snap-fit docking mechanism includes: a snap base, which is fixedly arranged on the outer surface of the closing cover, and a through hole is provided on the side surface of the closing cover, a groove is provided inside the snap base, and a sleeve is inserted into the inside of the snap base, and an elastic snap sheet is provided on the outer surface of the sleeve, the elastic snap sheet is engaged with the groove of the snap base, and the snap base and the interface tube are concentrically designed, an electromagnetic switch is fixedly installed on the side surface of one end of the sleeve, and a connecting hose is fixedly installed on the end of the electromagnetic switch away from the snap base.
[0018] By adopting the above technical solution, when the connecting hose is damaged, the connecting hose can be conveniently replaced. At the same time, when the sleeve is inserted into the interior of the snap base, the elastic snap sheet will be deformed, and when the sleeve is fully inserted into the snap base, the snap base will engage with the elastic snap sheet, so that the connecting hose is fixed to the side surface of the closed cover, which is convenient for connecting and replacing the hose, and can cooperate with the detection of the gas detection device to start or stop the electromagnetic switch to allow nitrogen to enter the closed cover.
[0019] Preferably, a rubber valve sheet is provided at one end of the closing cover away from the connecting hose, and the rubber valve sheet is embedded in the interior of the closing cover, and the outer surface of the closing cover fits with the outer surface of the rubber valve sheet, a fixing sheet is embedded on the outer surface of the closing cover, and the outer surface of the fixing sheet fits with the outer surface of the rubber valve sheet, and the rubber valve sheet and the fixing sheet are concentrically designed, the inner surface of the rubber valve sheet fits with the outer surface of the interface pipe, and the interface pipe and the fixing sheet are concentrically designed.
[0020] By adopting the above technical solution, the rubber valve sheet can prevent gas leakage and air from entering when the interface tube is inserted. At the same time, when the rubber valve sheet is damaged after long-term use, the fixing sheet can be removed, and the rubber valve sheet can be taken out and replaced, so that the gas will not interact with the outside world and oxidize the solder wire.
[0021] Preferably, a tin wire outlet tube is embedded and installed on the outer surface of one end of the closing cover away from the cabinet door, and the connection between the tin wire outlet tube and the closing cover is chamfered, a tightening cover is threadedly installed on the outer surface of the tin wire outlet tube, and the tightening cover and the tin wire outlet tube are concentrically designed, a rubber sealing sheet is arranged between the tin wire outlet tube and the tightening cover, and the outer surfaces of the rubber sealing sheet are respectively fitted with the outer surfaces of the tin wire outlet tube and the tightening cover, a circular hole is opened on the outer surface of the rubber sealing sheet, and the circular hole of the rubber sealing sheet is fitted with the outer surface of the solder wire, the tightening cover and the rubber sealing sheet are concentrically designed, and the rubber sealing sheet and the tin wire outlet tube are concentrically designed.
[0022] By adopting the above technical solution, the solder wire can be passed through the tin wire outlet tube to the outside during use, and the solder wire that has passed through will pass through the rubber sealing sheet and isolate the air from entering the interior of the closed cover. When using solder wires of different thicknesses, the tightening cap can be unscrewed from the tin wire outlet tube and the rubber sealing sheet can be replaced to adapt to solder wires of different thicknesses.
[0023] Compared with the prior art, the invention has the following beneficial effects: the anti-oxidation device provided with semiconductor equipment: 1. When in use, the cabinet door needs to be closed. After the cabinet door is closed, the outer surface of the sealing rubber strip will fit with the outer surface of the chassis and the closed cover, isolating the gap between the closed cover, the chassis and the cabinet door, so that the external gas will not enter the closed cover, and when the nitrogen rushes into the closed cover, it will not be discharged to the outside. Through the sealing of the closed cover and the rushing nitrogen, the oxidation rate of the solder wire is slowed down and reduced, the use time of the solder wire is extended, and the use cost of welding is reduced; 2. When closing the cabinet door, you need to move the push rod so that it slides on the outer surface of the cabinet door. When the push rod slides, it will drive the elastic plug rod to move together, so that the cabinet door can rotate and fit with the closed cover and the chassis. At the same time, you can check the remaining amount of solder wire in the solder storage tray at any time through the observation window. Then you can loosen the push rod so that the elastic plug rod can be reset and fit with the chassis. Then turn the anti-fool rotating rod so that the anti-fool rotating rod fits with the outer surface of the cabinet door, so that the push rod cannot be pushed, reducing the probability of opening the cabinet door without checking the nitrogen content. 3. When the sealing rubber strip is damaged, the cabinet door can be rotated and pulled out, so that the cabinet door rotates along the rotating shaft of the movable hinge, and the cabinet door contacts the outer surface of the chassis, which pushes the elastic latch open, so that the elastic latch moves inside the chassis, and the elastic latch is stuck in the outer surface of the cabinet door, so that the cabinet door can be erected to facilitate the installation and removal of the solder storage tray; 4. The connecting hose can be installed on one side of the electromagnetic switch, and then the sleeve can be inserted into the inside of the buckle base, so that the elastic buckle sheet can be engaged with the groove of the buckle base, and the interface tube can be inserted into the inside of the closed cover and fit with the rubber valve sheet, reducing the probability of nitrogen leaking from the closed cover to the outside, and preventing external air from entering the closed cover, so that the connecting hose and the electromagnetic switch can be easily replaced when damaged, and reducing the probability of gas exchange; 5. When inserting the solder storage tray into the rotating chuck, you need to first pull out the solder wire and insert it into the tin wire outlet tube. The inclined design of the tin wire outlet tube and the closing cover makes it smoother to pull out the solder wire, and the solder wire will pass through the rubber sealing sheet and fit with the outer surface of the rubber sealing sheet, so that air will not pass through the gap between the rubber sealing sheet and the solder wire, thereby maintaining the sealing of the closing cover. When using solder wires of different thicknesses, the tightening cap can be removed from the tin wire outlet tube, and rubber sealing sheets of different specifications can be replaced to maintain the seal between the rubber sealing sheet and the solder wire. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the chassis and the closed cover of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the chassis and the sleeve of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the chassis and the rotating chuck of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the solder storage tray and the sealing cover of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the connecting hose and the closing cover of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the buckle base and the closing cover of the present invention; Figure 7This is a schematic diagram of the three-dimensional structure of the chassis and the sealing rubber strip of the present invention; Figure 8 It is a schematic diagram of the cross-sectional three-dimensional structure of the push rod and the fool-proof rotating rod of the present invention; Fig. 9 It is a schematic diagram of the exploded three-dimensional structure of the tin wire outlet tube and the tightening cover of the present invention; Fig.10 It is a schematic diagram of the cross-sectional three-dimensional structure of the buckle base and the elastic buckle piece of the present invention.
[0025] In the figure: 1. chassis; 2. movable hinge; 3. cabinet door; 4. observation window; 5. rotating chuck; 6. push rod; 7. foolproof rotating rod; 8. elastic plug rod; 9. sealing rubber strip; 10. snap base; rubber 11. valve plate; 12. fixing plate; 13. sleeve; 14. elastic snap plate; 15. electromagnetic switch; 16. interface pipe; 17. connecting hose; 18. tin wire outlet pipe; 19. tightening cover; 20. rubber sealing sheet; 21. gas detection device; 22. solder storage tray; 23. closing cover; 24. elastic latch. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0027] See also Figure 1-10 The present invention provides a technical solution: an anti-oxidation device provided with semiconductor equipment, comprising a chassis 1, the chassis 1 is T-shaped, and closed covers 23 are fixedly installed on the outer surfaces of both sides of the chassis 1, a rotating chuck 5 is rotatably installed inside the chassis 1, and an elastic sheet is provided on the outer surface of the rotating chuck 5, and a solder storage tray 22 is clamped and installed on the outer surface of the rotating chuck 5, solder wire is stored inside the solder storage tray 22, and the solder storage tray 22 and the rotating chuck 5 are concentrically designed, a cabinet door 3 is provided on the outer surface of the chassis 1, and the cabinet door 3 and the outer surface of the closed cover 23 are respectively provided with movable hinges 2, and the movable hinges 2 are rotatably connected.
[0028] Through the T-shaped design of the chassis 1, the chassis 1 can hold two solder storage trays 22, and by rotating the chuck 5, when using to extract the solder wire, the solder storage tray 22 can be rotated to make it easier to extract the solder wire, and by rotating the elastic sheet of the chuck 5, the solder storage tray 22 can be fixed and engaged when it is installed in the rotating chuck 5.
[0029] A sealing fool-proofing structure is provided between the closing cover 23 and the cabinet door 3, and the oxidation rate of the solder wire in the solder storage tray 22 is reduced by the sealing fool-proofing structure. The sealing fool-proofing structure comprises: a sealing rubber strip 9, which is fixedly mounted on the outer surface of one side of the cabinet door 3, and the side surfaces of the cabinet door 3 are respectively fitted with the outer surfaces of the closing cover 23 and the chassis 1, and the side surfaces of the sealing rubber strip 9 are respectively fitted with the outer surfaces of the closing cover 23 and the chassis 1, a pushing rod 6 is slidably mounted on the outer surface of the cabinet door 3, and elastic plug rods 8 are fixedly mounted on both sides of the pushing rod 6, an anti-foolproofing rotating rod 7 is rotatably mounted on the outer surface of the pushing rod 6, and the outer surface of the anti-foolproofing rotating rod 7 is fitted with the outer surface of the pushing rod 6, one end of the elastic plug rod 8 is inserted into the chassis 1, and the outer surface of one end of the pushing rod 6 is fitted with the outer surface of the cabinet door 3.
[0030] The gap between the chassis 1 and the cabinet door 3 can be sealed by the sealing rubber strip 9, so that air will not enter the interior of the closed cover 23, and the nitrogen rushing into the closed cover 23 will not leak to the outside, so that the solder wire will not oxidize too quickly. The pushing movement can drive the push rod 6 to slide, so that the elastic plug rod 8 can be engaged and fixed with the chassis 1, so that the cabinet door 3 can be fixed and closed. At the same time, the rotation of the anti-fool rotating rod 7 and the engagement with the cabinet door 3 can effectively prevent the operator from directly opening the cabinet door 3 to cause air to enter the closed cover 23, and prevent the cabinet door 3 from being directly opened without confirming the nitrogen content. At the same time, the nitrogen and the external air will not communicate with each other, thereby reducing the oxidation rate of the solder wire and reducing the cost of use during welding.
[0031] A gas detection device 21 is fixedly installed inside the chassis 1 , and the gas detection device 21 is located inside the closed cover 23 , and the outer surface of the closed cover 23 is in contact with the outer surface of the gas detection device 21 .
[0032] The nitrogen content in the closed cover 23 can be detected by the gas detection device 21, so that when the nitrogen content is too low, nitrogen can be automatically injected to maintain the nitrogen content in the closed cover 23.
[0033] The rotating shaft at one end of the movable hinge 2 passes through the outer surface of the other movable hinge 2, and a nut is threadedly installed on the outer surface of the rotating shaft of the movable hinge 2, so that the movable hinges 2 can be separated.
[0034] After long-term use, the sealing rubber strip 9 will be worn and damaged. At this time, the nut on the rotating shaft of the movable hinge 2 can be removed, and the cabinet door 3 can be rotated to separate the movable hinge 2, so that the cabinet door 3 can be removed from the closing cover 23, which is convenient for replacing the sealing rubber strip 9.
[0035] An elastic latch 24 is slidably mounted on one end of the chassis 1 away from the elastic insertion rod 8, and one end of the elastic latch 24 is inclined. The outer surface of the elastic latch 24 is engaged with the outer surface of the cabinet door 3, and the cabinet door 3 is in contact with the outer surface of the chassis 1.
[0036] When the cabinet door 3 rotates upward, the cabinet door 3 will fit with the outer surface of the chassis 1 and push the elastic latch 24 to move. After the elastic latch 24 is engaged with the cabinet door 3, the position of the cabinet door 3 will be fixed, making it convenient to replace the solder storage tray 22 after the solder wire is used up and take the solder storage tray 22 out of the closing cover 23.
[0037] An observation window 4 is fixedly mounted on the outer surface of the cabinet door 3 , and the observation window 4 is at the same height as the solder storage tray 22 , and one end of the solder storage tray 22 does not fit the outer surface of the closing cover 23 .
[0038] Through the observation window 4 on the outer surface of the cabinet door 3, the use status of the solder storage tray 22 inside the closed cover 23 can be clearly observed, and the amount of solder wire in the solder storage tray 22 can be clearly known, so as to know when to replace the solder storage tray 22.
[0039] The outer surfaces of both sides of the closed cover 23 are provided with snap-fitting docking mechanisms, which facilitate nitrogen delivery into the interior of the closed cover 23, thereby reducing the oxidation rate of the solder wire, extending the use time of the solder wire and reducing the use cost of the solder wire.
[0040] When the electromagnetic switch 15 is damaged, the elastic snap-on piece 14 can be pressed to disengage the elastic snap-on piece 14 from the snap-on base 10, so that the sleeve 13 can be easily pulled out from the snap-on base 10, and the electromagnetic switch 15 and the sleeve 13 can be replaced as a whole, thereby reducing the difficulty and cost of replacing the electromagnetic switch 15.
[0041] The snap-fit docking mechanism includes: a snap-fit base 10, which is fixedly arranged on the outer surface of the closing cover 23, and a through hole is opened on the side surface of the closing cover 23, a groove is opened inside the snap-fit base 10, and a sleeve 13 is inserted inside the snap-fit base 10, and an elastic snap-fit piece 14 is arranged on the outer surface of the sleeve 13, the elastic snap-fit piece 14 is snapped with the groove of the snap-fit base 10, and the snap-fit base 10 and the interface pipe 16 are concentrically designed, an electromagnetic switch 15 is fixedly installed on the side surface of one end of the sleeve 13, and a connecting hose 17 is fixedly installed on the end of the electromagnetic switch 15 away from the snap-fit base 10.
[0042] When the gas detection device 21 detects that the nitrogen content in the closed cover 23 is insufficient, the electromagnetic switch 15 will open, allowing the nitrogen to be discharged from the connecting hose 17 into the closed cover 23, so that the gas in the closed cover 23 can be discharged to the outside through the connecting hose 17 on the other side, allowing the nitrogen to fill the interior of the closed cover 23 and reduce the oxidation rate of the solder wire.
[0043] A rubber valve sheet 11 is provided at one end of the closing cover 23 away from the connecting hose 17, and the rubber valve sheet 11 is embedded in the interior of the closing cover 23, and the outer surface of the closing cover 23 is fitted with the outer surface of the rubber valve sheet 11, and a fixing sheet 12 is embedded and installed on the outer surface of the closing cover 23, and the outer surface of the fixing sheet 12 is fitted with the outer surface of the rubber valve sheet 11, and the rubber valve sheet 11 and the fixing sheet 12 are concentrically designed, and the inner surface of the rubber valve sheet 11 is fitted with the outer surface of the interface tube 16, and the interface tube 16 and the fixing sheet 12 are concentrically designed.
[0044] When the sleeve 13 is fully inserted into the interior of the snap base 10 through the rubber valve sheet 11, the elastic snap sheet 14 will be deformed and snapped with the snap base 10, and the interface tube 16 will be fully inserted into the interior of the rubber valve sheet 11, so that the rubber valve sheet 11 can fill the gap between the interface tube 16 and the closing cover 23, and prevent the interaction between the gas and the closing cover 23, so that the air will not enter the closing cover 23 from the snap base 10, and when the rubber valve sheet 11 is used for a long time and is damaged, the fixing sheet 12 can be removed and the rubber valve sheet 11 can be replaced, so that nitrogen will not escape from the closing cover 23, and the rubber valve sheet 11 can be easily replaced.
[0045] A tin wire outlet tube 18 is embedded and installed on the outer surface of one end of the closing cover 23 away from the cabinet door 3, and the connection between the tin wire outlet tube 18 and the closing cover 23 is chamfered, and a tightening cover 19 is threadedly installed on the outer surface of the tin wire outlet tube 18, and the tightening cover 19 and the tin wire outlet tube 18 are concentrically designed, a rubber sealing sheet 20 is arranged between the tin wire outlet tube 18 and the tightening cover 19, and the outer surfaces of the rubber sealing sheet 20 are respectively fitted with the outer surfaces of the tin wire outlet tube 18 and the tightening cover 19, a circular hole is opened on the outer surface of the rubber sealing sheet 20, and the circular hole of the rubber sealing sheet 20 is fitted with the outer surface of the solder wire, the tightening cover 19 and the rubber sealing sheet 20 are concentrically designed, and the rubber sealing sheet 20 and the tin wire outlet tube 18 are concentrically designed.
[0046] Through the inclined design between the tin wire outlet tube 18 and the closing cover 23, the solder wire can be passed into the tin wire outlet tube 18 more smoothly. At the same time, when the solder wire passes through the rubber sealing sheet 20, the gap between the solder wire and the rubber sealing sheet 20 can be removed, so that air will not enter the closing cover 23. When solder wires of different thicknesses need to be used, the tightening cover 19 can be unscrewed and different rubber sealing sheets 20 can be replaced, so that nitrogen will not leak to the outside when solder wires of different thicknesses are used.
[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An anti-oxidation device provided with semiconductor equipment, comprising a chassis (1), the chassis (1) being of T-shaped design, and having closed covers (23) fixedly mounted on the outer surfaces of both sides of the chassis (1), a rotating chuck (5) being rotatably mounted inside the chassis (1), and having an elastic sheet disposed on the outer surface of the rotating chuck (5), and having a solder storage tray (22) mounted on the outer surface of the rotating chuck (5), the solder storage tray (22) storing solder wire inside, and having a concentric design between the solder storage tray (22) and the rotating chuck (5), a cabinet door (3) being disposed on the outer surface of the chassis (1), and having movable hinges (2) disposed on the outer surface of the cabinet door (3) and the closed cover (23), and having a rotatable connection between the movable hinges (2), Features: A sealing fool-proof structure is provided between the sealing cover (23) and the cabinet door (3), and the oxidation rate of the solder wire in the solder storage tray (22) is reduced by the sealing fool-proof structure.
2. An anti-oxidation device provided with a semiconductor device according to claim 1, Features: The sealing foolproof structure comprises: a sealing rubber strip (9), wherein the sealing rubber strip (9) is fixedly mounted on the outer surface of one side of the cabinet door (3), and the side surface of the cabinet door (3) is respectively in contact with the outer surfaces of the closing cover (23) and the chassis (1), and the side surfaces of the sealing rubber strip (9) are respectively in contact with the outer surfaces of the closing cover (23) and the chassis (1), a push rod (6) is slidably mounted on the outer surface of the cabinet door (3), and elastic plug rods (8) are fixedly mounted on both sides of the push rod (6), an foolproof rotating rod (7) is rotatably mounted on the outer surface of the push rod (6), and the outer surface of the foolproof rotating rod (7) is in contact with the outer surface of the push rod (6), one end of the elastic plug rod (8) is plugged into the chassis (1), and the outer surface of one end of the push rod (6) is in contact with the outer surface of the cabinet door (3).
3. An anti-oxidation device provided with a semiconductor device according to claim 1, Features: A gas detection device (21) is fixedly installed inside the chassis (1), and the gas detection device (21) is located inside the closed cover (23), and the outer surface of the closed cover (23) is in contact with the outer surface of the gas detection device (21).
4. The anti-oxidation device provided with a semiconductor device according to claim 1, Features: The rotating shaft at one end of the movable hinge (2) passes through the outer surface of the other movable hinge (2), and a nut is threadedly mounted on the outer surface of the rotating shaft of the movable hinge (2), so that the movable hinges (2) can be separated from each other.
5. The anti-oxidation device provided with a semiconductor device according to claim 1, Features: An elastic latch (24) is slidably mounted on one end of the chassis (1) away from the elastic insertion rod (8), and one end of the elastic latch (24) is inclined. The outer surface of the elastic latch (24) is engaged with the outer surface of the cabinet door (3), and the cabinet door (3) is in contact with the outer surface of the chassis (1).
6. The anti-oxidation device provided with a semiconductor device according to claim 1, Features: An observation window (4) is fixedly mounted on the outer surface of the cabinet door (3), and the observation window (4) is at the same height as the solder storage tray (22), and one end of the solder storage tray (22) does not fit the outer surface of the sealing cover (23).
7. The anti-oxidation device provided with a semiconductor device according to claim 1, Features: The outer surfaces of both sides of the closed cover (23) are provided with snap-fitting docking mechanisms, which facilitate nitrogen delivery into the interior of the closed cover (23), thereby reducing the oxidation rate of the solder wire, extending the use time of the solder wire and reducing the use cost of the solder wire.
8. An anti-oxidation device provided with a semiconductor device according to claim 7, Features: The buckle docking mechanism comprises: a buckle base (10), the buckle base (10) is fixedly arranged on the outer surface of the closing cover (23), and the side surface of the closing cover (23) is provided with a through hole, the buckle base (10) is provided with a groove inside, and a sleeve (13) is inserted into the buckle base (10), and the outer surface of the sleeve (13) is provided with an elastic buckle piece (14), the elastic buckle piece (14) is engaged with the groove of the buckle base (10), and the buckle base (10) and the interface pipe (16) are of concentric design, an electromagnetic switch (15) is fixedly installed on the side surface of one end of the sleeve (13), and a connecting hose (17) is fixedly installed on the end of the electromagnetic switch (15) away from the buckle base (10).
9. The anti-oxidation device provided with a semiconductor device according to claim 1, Features: A rubber valve sheet (11) is provided at one end of the closure cover (23) away from the connecting hose (17), and the rubber valve sheet (11) is embedded in the interior of the closure cover (23), and the outer surface of the closure cover (23) is in contact with the outer surface of the rubber valve sheet (11); a fixing sheet (12) is embedded in the outer surface of the closure cover (23), and the outer surface of the fixing sheet (12) is in contact with the outer surface of the rubber valve sheet (11), and the rubber valve sheet (11) and the fixing sheet (12) are of concentric design; the inner surface of the rubber valve sheet (11) is in contact with the outer surface of the interface tube (16), and the interface tube (16) and the fixing sheet (12) are of concentric design.
10. The anti-oxidation device provided with a semiconductor device according to claim 1, Features: A tin wire outlet tube (18) is embedded and installed on the outer surface of one end of the closure cover (23) away from the cabinet door (3), and the connection between the tin wire outlet tube (18) and the closure cover (23) is chamfered. A tightening cover (19) is threadedly installed on the outer surface of the tin wire outlet tube (18), and the tightening cover (19) and the tin wire outlet tube (18) are concentrically designed. A rubber sealing sheet (20) is arranged between the tin wire outlet tube (18) and the tightening cover (19), and the outer surfaces of the rubber sealing sheet (20) are respectively fitted with the outer surfaces of the tin wire outlet tube (18) and the tightening cover (19). A circular hole is opened on the outer surface of the rubber sealing sheet (20), and the circular hole of the rubber sealing sheet (20) is fitted with the outer surface of the solder wire. The tightening cover (19) and the rubber sealing sheet (20) are concentrically designed, and the rubber sealing sheet (20) and the tin wire outlet tube (18) are concentrically designed.