A multi-modal press head device for chip nanosilver sintering

Abstract

The present application relates to the field of chip sintering technology, and specifically discloses a multimodal pressure head device for chip nanosilver sintering, which includes a substrate and at least two hydraulic plates arranged on the substrate, each hydraulic plate is provided with a hydraulic channel, the hydraulic channels are respectively connected to the hydraulic system, and the hydraulic system outputs at least two different hydraulic pressures to each hydraulic channel; each hydraulic plate is installed with at least one hydraulic cylinder, and the hydraulic cylinder is connected to the hydraulic channel of the corresponding hydraulic plate; a plurality of pressure blocks are movably arranged on the substrate, the hydraulic cylinders correspond to the pressure blocks one by one, and each pressure block is respectively connected to the output shaft of each hydraulic cylinder, and each chip is pressurized by a separate pressure block, which can significantly avoid the problem of uneven force on the chip when the whole plate is pressed down, and the hydraulic system delivers different hydraulic pressures to the hydraulic channel to match the pressure requirements of different chip sintering. The present application has the advantages of uniform pressure output of the pressure head and independent adjustable pressure of different pressure heads.

Description

Technical Field

[0001] The present application relates to the field of chip sintering technology, and in particular to a multi-modal press head device for chip nanosilver sintering. Background Art

[0002] Nanosilver sintering technology is a low-temperature sintering technology developed in the late 1980s. It is a method of interconnecting power semiconductor devices and substrates by using nanosilver paste at a temperature lower than the melting point of the substrate, with or without pressure.

[0003] The low-temperature sintering mechanism of nanosilver belongs to solid-phase sintering, which forms a densified connection through the diffusion of atoms and finally forms a microscopic porous structure. It can obtain a sintered silver chip connection interface with high temperature resistance (>700℃) and high thermal conductivity (~240 W / m·K) under low temperature (<300℃) conditions. It is one of the most suitable interface connection technologies for wide bandgap semiconductor module packaging, a key technology in silicon carbide module packaging, and the most widely used technology at present.

[0004] In the nano-silver sintering process, pressure is the core factor affecting the quality of silver sintering. The pressure directly affects the void ratio, thermal conductivity, push-pull force and thickness of the silver layer after sintering. Therefore, how to provide accurate and stable sintering pressure is a key issue affecting the heat dissipation and reliability of automotive-grade power modules.

[0005] Existing silver sintering equipment mainly uses an integral pressure head, which uses a whole plate to press down, covering several AMB substrates at the same time, and pressing dozens of chips at the same time. Affected by the flatness of the mold plate and the product fixture, some chips will be subjected to large forces, while some chips will be subjected to small forces, that is, the chips are subjected to uneven forces. Those subjected to large forces may crack or even break, while those subjected to small forces will have insufficient sintering strength. Moreover, chips of different sizes and different force requirements may need to be connected on the AMB substrate, and the integral pressure head is even more difficult to meet the sintering pressure requirements of the chips. Summary of the invention

[0006] In order to improve the uniformity of chip force in silver sintering technology, the present application provides a multimodal pressure head device for chip nanosilver sintering, each chip corresponds to an independent pressure head, and different pressure heads can output different pressures according to the thickness of the chip and the sintering requirements. It can not only output stable and uniform pressure, but also provide targeted pressure output according to the special needs of different chips.

[0007] The multi-modal indenter device for nanosilver sintering of chips provided in the present application adopts the following technical solution:

[0008] A multi-modal press head device for chip nanosilver sintering, comprising:

[0009] substrate;

[0010] At least two hydraulic plates are stacked in sequence and connected to the base plate, and hydraulic channels are provided inside the at least two hydraulic plates and are connected to the hydraulic system respectively, and the hydraulic system outputs at least two different hydraulic pressures to different hydraulic channels respectively;

[0011] A plurality of hydraulic cylinders are respectively mounted on the at least two hydraulic plates and connected to the hydraulic channels of the corresponding hydraulic plates, and the positions of the hydraulic cylinders do not interfere with each other;

[0012] A plurality of pressing blocks are movably arranged on the base plate, used for respectively pressing different chips, corresponding to the hydraulic cylinders one by one, and connected to the movable ends of the corresponding hydraulic cylinders.

[0013] By adopting the above technical scheme, independent hydraulic cylinders are set according to the number and position of chips, and a single hydraulic cylinder and a single pressure block press a single chip, which greatly improves the uniformity of the force on the chip; multiple hydraulic cylinders are respectively installed on different hydraulic plates and connected to different hydraulic channels, so that the hydraulic cylinders can output different pressures, thereby meeting the special pressure requirements of different chips, improving the applicability of the pressing head equipment, and ensuring the sintering quality of the chip; hydraulic cylinders that interfere with each other in the same plane position are placed on different hydraulic plates to form mutual avoidance, ensuring that the spacing between the output shafts of multiple independent hydraulic cylinders can match the chip.

[0014] Optionally, a single hydraulic plate is provided with a plurality of hydraulic channels, and the plurality of hydraulic cylinders are respectively connected to corresponding hydraulic channels.

[0015] By adopting the above technical solution, by opening multiple hydraulic channels on the same hydraulic plate and connecting them to each hydraulic cylinder respectively, each hydraulic cylinder can output a different pressure value, thereby meeting the more complex and differentiated pressure requirements in the chip sintering process and further improving the applicability of the pressure head equipment.

[0016] Optionally, it also includes multiple transfer rods, which pass through the base plate and slide with the base plate. The multiple transfer rods correspond to the hydraulic cylinders one by one and are coaxially arranged with the output shafts of the corresponding hydraulic cylinders. The end of the transfer rod away from the hydraulic plate is connected to the corresponding pressure block. An elastic member is arranged between the transfer rod and the base plate. The output shaft of each hydraulic cylinder extends out to abut against the end of the transfer rod away from the pressure block and compress the elastic member.

[0017] By adopting the above technical solution, the transfer rod is used to realize the linkage between the hydraulic cylinder output shaft and the pressure block, which can shorten the required length of the hydraulic cylinder output shaft and effectively simplify the assembly structure.

[0018] Optionally, a heating plate is further included, wherein the heating plate is mounted on the substrate, and the heating plate is used to heat the pressing block and keep the pressing block within a set temperature range, and a second temperature sensor is arranged inside the heating plate.

[0019] By adopting the above technical solution, the pressing block and the mold for carrying the substrate heat the chip and the substrate at the same time, and maintain them within the set sintering temperature range to ensure the sintering quality of the chip.

[0020] Optionally, a second cooling channel is provided in the heating plate, and after sintering is completed, cooling medium is continuously passed through the second cooling channel.

[0021] By adopting the above technical solution, after the chip is sintered, a cooling medium is introduced into the second cooling channel to cool the sintered product to prevent the product from being oxidized when it comes out of the furnace at a high temperature.

[0022] Optionally, a cooling plate is further included, wherein the cooling plate is installed on a side of the heating plate close to the hydraulic plate, and a first cooling channel is opened in the cooling plate, and a cooling medium is continuously passed through the first cooling channel during the entire sintering process.

[0023] By adopting the above technical solution, during the entire process of chip silver sintering, the cooling medium is continuously introduced into the first cooling channel to further reduce the heat transfer from the heating plate to the hydraulic plate and the hydraulic cylinder, thereby effectively protecting the equipment.

[0024] Optionally, a first temperature sensor is provided in the cooling plate.

[0025] By adopting the above technical solution, the temperature near the hydraulic plate is monitored to avoid damage to the hydraulic cylinder caused by high temperature conduction.

[0026] Optionally, a heat insulation plate is provided between the cooling plate and the heating plate.

[0027] By adopting the above technical solution, the heat transfer from the heating plate to the hydraulic plate is reduced to avoid structural damage to the hydraulic cylinder.

[0028] Optionally, a receiving groove is provided on one side of the hydraulic plate close to the pressure block, and a plurality of assembly grooves are provided at the bottom of the receiving groove of the hydraulic plate. The hydraulic cylinder includes a cylinder body, a piston and a push rod. The cylinder body is installed in the assembly groove, the interior of the cylinder body is connected to the hydraulic channel, the piston is arranged inside the cylinder body, and the push rod is connected to the piston.

[0029] By adopting the above technical solution, the accommodating groove is used to accommodate part of the structure of the hydraulic cylinder, which facilitates the assembly of the hydraulic cylinder and forms a more compact structure, thereby reducing the size of the equipment.

[0030] Optionally, the cylinder body is threadably matched with an inner wall of the assembly groove, and a sealing ring is provided at the end of the cylinder body close to the hydraulic channel, and the sealing ring is clamped between the cylinder body and the bottom wall of the assembly groove.

[0031] By adopting the above technical solution, the screw connection installation method is faster and very easy to disassemble, which is more convenient for subsequent maintenance of the equipment.

[0032] In summary, the present application includes at least one of the following beneficial technical effects:

[0033] 1. Independent hydraulic cylinders are set according to the number and position of the chips. A single hydraulic cylinder and a single pressing block press a single chip, which greatly improves the uniformity of the force on the chip;

[0034] 2. Multiple hydraulic cylinders are installed on different hydraulic plates and connected to different hydraulic channels, so that the hydraulic cylinders can output different pressures, thereby meeting the special pressure requirements of different chips, improving the applicability of the pressure head equipment, and ensuring the sintering quality of the chips;

[0035] 3. Hydraulic cylinders that interfere with each other in the same plane are placed on different hydraulic plates to avoid each other, ensuring that the spacing between the output shafts of multiple independent hydraulic cylinders can match the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application;

[0037] Figure 2 is along Figure 1 Sectional view of AA in the middle;

[0038] Figure 3 yes Figure 2 Enlarged view at B in the middle;

[0039] Figure 4 This is a cross-sectional view showing the third hydraulic plate in Example 2 of the present application.

[0040] Figure numerals: 1. base plate; 2. hydraulic plate; 21. first hydraulic plate; 22. second hydraulic plate; 23. third hydraulic plate; 201. accommodating groove; 202. mounting groove; 3. hydraulic cylinder; 31. cylinder body; 32. piston; 33. push rod; 34. sealing ring; 4. hydraulic channel; 5. pressure block; 6. heating plate; 62. second cooling channel; 63. second temperature sensor; 7. heat insulation plate; 8. cooling plate; 81. first cooling channel; 82. first temperature sensor; 9. adapter rod; 10. accommodating cavity; 11. elastic member; 12. top plate; 13. shell. DETAILED DESCRIPTION

[0041] The following is combined with Figure 1-4 This application is described in further detail.

[0042] Embodiment 1:

[0043] The present application embodiment discloses a multi-modal press head device for sintering nanosilver chips, referring to Figure 1 , Figure 2 and Figure 3 , including a substrate 1 and at least two hydraulic plates 2 arranged on the substrate 1, each hydraulic plate 2 is stacked and connected to form a multi-layer structure, and each hydraulic plate 2 is provided with a hydraulic channel 4, the hydraulic channels 4 are respectively connected to the hydraulic system, and the hydraulic system outputs at least two different hydraulic pressures to each hydraulic channel 4; at the same time, each hydraulic plate 2 is installed with at least one hydraulic cylinder 3, and the hydraulic cylinder 3 is connected to the hydraulic channel 4 of the corresponding hydraulic plate 2; in addition, a plurality of pressing blocks 5 are movably arranged on the substrate 1, and the pressing blocks 5 are arranged corresponding to the number and position of the chips to be sintered on the substrate 1, the hydraulic cylinders 3 correspond to the pressing blocks 5 one by one, and each pressing block 5 is respectively connected to the output shaft of each hydraulic cylinder 3.

[0044] During specific operation, the hydraulic system transmits hydraulic pressure to the hydraulic channel 4, the output shaft of the hydraulic cylinder 3 extends out, and each pressure block 5 abuts against each chip respectively and applies pressure to the chip. Each chip is pressurized by a separate pressure block 5, which can significantly avoid the problem of uneven force on the chip under pressure of the entire plate and improve the uniformity of force on each chip. The hydraulic system transmits different hydraulic pressures to the hydraulic channel 4, so that the hydraulic cylinders 3 connected to different hydraulic channels 4 can output different pressures to match the pressure requirements for sintering different chips, greatly improving the applicability of the pressure head device and improving the sintering effect of the chip.

[0045] It should be noted that the hydraulic system in the present invention adopts a precision servo hydraulic system, each line of hydraulic oil is controlled by a separate pressure sensor, a separate servo proportional valve and a separate reversing valve, and each line of hydraulic oil can be set to the same pressure to match the pressurization requirements of the same chip.

[0046] As an example, in this embodiment, the number of hydraulic plates 2 can be 2, the number of pressure heads can be 9, and 9 hydraulic cylinders 3 can be correspondingly arranged, and the 9 hydraulic cylinders 3 are respectively installed on the 2 hydraulic plates 2. The above number is only an exemplary setting, and the present invention is not limited to the specific number of hydraulic plates 2, pressure heads and hydraulic cylinders 3.

[0047] It should be noted that, due to the relatively small size of the chip and the relatively large size of the conventional hydraulic cylinder 3, in terms of spatial layout, it is impossible to ensure that each chip corresponds to a separate hydraulic cylinder 3, and if a single hydraulic cylinder 3 is used to correspond to 2-4 chips, there is still the problem of uneven force on the chip. Therefore, the hydraulic cylinder 3 in the present invention is a specially customized small-size hydraulic cylinder 3, the overall diameter can be between 10-13mm, and the pressure resistance level can reach 50MPa, which can meet the pressure requirement of 18-20MPa in the conventional nanosilver sintering process.

[0048] Specifically, refer to Figure 2 and Figure 3 The hydraulic plate 2 close to the base plate 1 is called the first hydraulic plate 21, and the hydraulic plate 2 located on the side of the first hydraulic plate 21 away from the base plate 1 is called the second hydraulic plate 22. The first hydraulic plate 21 and the second hydraulic plate 22 are attached to each other and fixed. The hydraulic cylinder 3 installed on the first hydraulic plate 21 has its output shaft connected to the corresponding pressure block 5, and the hydraulic cylinder 3 installed on the second hydraulic plate 22 has its output shaft passing through the first hydraulic plate 21 and connected to the corresponding pressure block 5.

[0049] Further, see Figure 2 and Figure 3 , the second hydraulic plate 22 can be provided with two hydraulic channels 4, and the hydraulic cylinders 3 installed on the second hydraulic plate 22 are respectively connected to the two hydraulic channels 4. By using the hydraulic system to transport hydraulic oil of different pressure values ​​to the two hydraulic channels 4 of the second hydraulic plate 22, the hydraulic cylinders 3 installed on the second hydraulic plate 22 can output different pressures. In other words, by providing multiple hydraulic channels 4 on the same hydraulic plate 2 and connecting them to each hydraulic cylinder 3 respectively, each hydraulic cylinder 3 can output a different pressure value, thereby meeting more complex and more differentiated pressure requirements in the chip sintering process, and further improving the applicability of the press head equipment.

[0050] It should be noted that the pressure that the hydraulic cylinder 3 can output is closely related to its cylinder diameter. Under the premise of ensuring that the pressure output by the hydraulic cylinder 3 can meet the chip sintering requirements, the cylinder diameter of the hydraulic cylinder 3 cannot be reduced indefinitely. The chips on the substrate 1 are generally small in size, with a conventional size of about 5*5mm, and in many cases the distance between adjacent chips is relatively close. Therefore, when the hydraulic cylinders 3 corresponding to adjacent chips are installed on the same horizontal plane, their positions will interfere with each other. Even if different hydraulic cylinders 3 are supplied with hydraulic oil of different pressures, the effect of independent crimping cannot be achieved.

[0051] In this embodiment, the hydraulic cylinders 3 interfering with each other can be installed on different hydraulic plates 2 respectively. Figure 1 , in the horizontal direction, the hydraulic cylinder 3 installed on the first hydraulic plate 21 and the hydraulic cylinder 3 installed on the second hydraulic plate 22 interfere with each other in position, that is, they cannot be installed on the same horizontal plane;

[0052] By installing the hydraulic cylinders 3 that interfere with each other on different hydraulic plates 2, it is possible to effectively avoid each other and meet the sintering needs of multiple small-sized chips at close distances. Usually, two hydraulic plates 2 are provided to stagger the positions of multiple hydraulic cylinders 3, and it is only necessary to install the adjacent and interfering hydraulic cylinders 3 on different hydraulic plates 2.

[0053] It should be noted that conventional chips and substrates 1 are placed horizontally on the mold, and correspondingly, substrates 1 and hydraulic plates 2 are also arranged horizontally. Therefore, the aforementioned horizontal plane refers to the setting posture of the conventional pressing head device, but the present invention is not limited to the direction of arrangement of the pressing head device or the orientation of the pressing head.

[0054] Further, see Figure 2 and Figure 3 A heating plate 6 is installed on the side of the substrate 1 close to the hydraulic plate 2. A heating module is configured in the heating plate 6 to heat the pressing block 5 and maintain it within a set temperature range. During the sintering process, the pressing block 5 abuts against the chip and presses it. The pressing block 5 and the mold carrying the substrate 1 heat the chip and the substrate 1 at the same time and maintain it within the set sintering temperature range to ensure the sintering quality of the chip.

[0055] In addition, a second temperature sensor 63 is provided inside the heating plate 6 to monitor the temperature of the heating plate 6, thereby achieving high-precision temperature control; the heating module can be configured as a heating rod, which is inserted into the heating plate 6 and adopts PID control technology to improve the accuracy of temperature control. The heating rod can be a titanium electric heating tube, a quartz electric heating tube, etc., but the present invention is not limited to the heating rod and its type, model, material, etc.

[0056] Further, see Figure 2 and Figure 3 A second cooling channel 62 is provided in the heating plate 6, and the second cooling channel 62 is connected to an external cooling medium supply device. After the chip is sintered, a cooling medium is introduced to cool the sintered product to prevent the product from being oxidized when it is out of the furnace at a high temperature.

[0057] Further, refer to Figure 2 and Figure 3 A heat insulation board 7 is provided between the heating board 6 and the first hydraulic board 21. The heat insulation board 7 is made of a material with heat insulation performance to reduce the heat transfer from the heating board 6 to the hydraulic board 2 to avoid structural damage to the hydraulic cylinder 3. The heat insulation board 7 can be made of ceramic fiber material, carbon fiber reinforced material, etc., but the present invention is not limited to the heat insulation board 7 and its performance, material, etc.

[0058] Reference Figure 2 and Figure 3A cooling plate 8 is provided on the side of the first hydraulic plate 21 close to the base plate 1. The cooling plate 8 is attached to and fixed to the first hydraulic plate 21. A first cooling channel 81 is provided in the cooling plate 8. The first cooling channel 81 is connected to an external cooling medium supply device. During the entire process of chip silver sintering, cooling medium is continuously introduced into the first cooling channel 81 to further reduce the heat transfer from the heating plate 6 to the hydraulic plate 2 and the hydraulic cylinder 3, effectively protecting the equipment. In addition, a first temperature sensor 82 is provided in the cooling plate 8 to monitor the temperature near the hydraulic plate 2 to avoid damage to the hydraulic cylinder 3 caused by high temperature conduction.

[0059] It should be noted that the cooling medium introduced into the first cooling channel 81 or the second cooling channel 62 can be water, mineral oil, synthetic oil, etc., but the present invention is not limited to the cooling medium and its type, performance, etc.; the first temperature sensor 82 and the second temperature sensor 63 can be PT100 thermal resistor, thermocouple, etc., but the present invention is not limited to the temperature sensor and its type, performance, etc.

[0060] Reference Figure 2 and Figure 3 , a plurality of transfer rods 9 are provided on the heating plate 6. In this embodiment, 9 transfer rods 9 are provided corresponding to the hydraulic cylinder 3 and the pressing block 5. Each transfer rod 9 passes through the heating plate 6 and the base plate 1. The cooling plate 8 and the heat insulation plate 7 are provided with a receiving cavity 10 at the output shaft of each hydraulic cylinder 3. The end of the transfer rod 9 away from the hydraulic plate 2 extends from the base plate 1 and is fixed to the pressing block 5. The end of the transfer rod 9 close to the hydraulic plate 2 extends into the receiving cavity 10 and corresponds to the output shaft of each hydraulic cylinder 3. The hydraulic system supplies hydraulic oil to the hydraulic channel 4, and the output shaft of the hydraulic cylinder 3 extends and pushes the transfer rod 9 to move in the direction close to the chip, so that the pressing block 5 abuts against the chip and keeps the chip under continuous pressure.

[0061] At the same time, an elastic member 11 is sleeved on the transfer rod 9, and a boss is formed at the end of the transfer rod 9 located in the accommodating cavity 10. One end of the elastic member 11 abuts against the heating plate 6, and the other end abuts against the boss. When the output shaft of the hydraulic cylinder 3 extends, the transfer rod 9 moves and squeezes the elastic member 11. After the hydraulic system is depressurized, the output shaft of the hydraulic cylinder 3 retracts, and the transfer rod 9 automatically resets under the action of the elastic member 11.

[0062] Further, see Figure 2 and Figure 3, a receiving groove 201 for receiving a part of the structure of the hydraulic cylinder 3 is provided on the side of the hydraulic plate 2 close to the base plate 1, and a plurality of mounting grooves 202 for assembling the hydraulic cylinder 3 are provided at the bottom of the receiving groove 201 of the hydraulic plate 2, and the mounting grooves 202 match the number and size of the hydraulic cylinder 3. Among them, the hydraulic cylinder 3 includes a cylinder body 31, a piston 32 and a push rod 33. A cavity for the hydraulic oil to pass through is provided in the cylinder body 31, and the piston 32 is slidably arranged in the cavity and sealed with the inner wall of the cavity. The push rod 33 is penetrated in the cylinder body 31 and fixed on the side of the piston 32 close to the chip. The side of the cavity of the cylinder body 31 away from the push rod 33 is connected to the corresponding hydraulic channel 4. The hydraulic oil enters the cavity of the cylinder body 31 and pushes the piston 32 to move, thereby driving the push rod 33 to move, so as to pressurize the chip.

[0063] In addition, a sealing ring 34 is provided on one side of the cylinder body 31 close to the hydraulic channel 4. The sealing ring 34 is clamped between the cylinder body 31 and the hydraulic plate 2 to form a seal to prevent the hydraulic oil from leaking from the gap between the two.

[0064] In this embodiment, the cylinder body 31 can be threadedly connected to the inner wall of the installation groove 202. During assembly, the hydraulic cylinders 3 on the second hydraulic plate 22 can be threadedly connected in sequence first, and then the first hydraulic plate 21 can be installed on the second hydraulic plate 22, and then the hydraulic cylinders 3 on the first hydraulic plate 21 can be assembled in sequence. In addition, the cylinder body 31 can also be connected to the hydraulic plate 2 by other means such as welding, but the present invention is not limited to the connection method between the two.

[0065] Reference Figure 2 and Figure 3 , a top plate 12 is provided on the side of the second hydraulic plate 22 away from the base plate 1, a shell 13 is provided between the top plate 12 and the base plate 1, and the aforementioned hydraulic plate 2, cooling plate 8, heat insulation plate 7, and heating plate 6 are all located in the shell 13. The top plate 12 and the shell 13 can be made of POM material, which is insulated with high voltage and high temperature resistance, and can form an effective external protection for the pressure head device. In addition, the top plate 12 and the shell 13 can also be made of polycarbonate (PC), polyetheretherketone (PEEK) and other materials, but the present invention is not limited to the top plate 12, the shell 13 and their materials, shapes, etc.

[0066] The implementation principle of Example 1 of the present application is:

[0067] Independent hydraulic cylinders 3 are arranged according to the number and position of the chips. A single hydraulic cylinder 3 and a single pressing block 5 press a single chip, which greatly improves the uniformity of the force on the chip.

[0068] Multiple hydraulic cylinders 3 are respectively installed on different hydraulic plates 2 and connected to different hydraulic channels 4, so that the hydraulic cylinders 3 can output different pressures, thereby meeting the special pressure requirements of different chips, improving the applicability of the pressure head equipment, and ensuring the sintering quality of the chips;

[0069] The hydraulic cylinders 3 that interfere with each other at the same plane position are placed on different hydraulic plates 2 to avoid each other, ensuring that the spacing between the output shafts of the multiple independent hydraulic cylinders 3 can match the chip.

[0070] Embodiment 2:

[0071] The difference between this embodiment and embodiment 1 is that:

[0072] Reference Figure 4 A third hydraulic plate 23 is provided on the side of the second hydraulic plate 22 away from the base plate 1, and a hydraulic channel 4 is also provided in the third hydraulic plate 23, that is, a total of three hydraulic plates 2 are provided in this embodiment, and one of the hydraulic cylinders 3 is installed on the third hydraulic plate 23, and the hydraulic cylinder 3 is connected to the hydraulic channel 4 in the third hydraulic plate 23. The hydraulic system is used to output hydraulic oil of different pressures to the hydraulic channel 4 of the third hydraulic plate 23, and the hydraulic cylinder 3 can output a pressure different from that of other hydraulic cylinders 3.

[0073] It should be noted that, although two hydraulic plates 2 can normally displace the hydraulic cylinders 3 that interfere with each other among the multiple hydraulic cylinders 3, considering that the hydraulic channel 4 and the output shaft of the hydraulic cylinder 3 need to avoid each other, when the requirements are more complex, the layout of the hydraulic channel 4 is more difficult, and even unavoidable mutual interference may occur. By adding a hydraulic plate 2 and setting the unavoidable hydraulic cylinder 3 on the additional hydraulic plate 2, the layout difficulty of the hydraulic channel 4 can be effectively reduced, the occurrence of interference can be reduced, and the applicability of the pressure head equipment can be further improved, thereby meeting more complex sintering requirements.

[0074] In addition, when a chip requires an unconventional higher pressure, it may be necessary to set a corresponding hydraulic cylinder 3 with a larger cylinder diameter. By adding a hydraulic plate 2, the larger diameter hydraulic cylinder 3 can be arranged on the added hydraulic plate 2 to effectively form an avoidance and achieve a compact installation structure.

[0075] It is additionally noted that in other embodiments, other numbers of hydraulic plates 2 may be arranged according to actual needs. In this embodiment, three hydraulic plates 2 are taken as an example, but the present invention is not limited to the number of hydraulic plates 2 .

[0076] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-modal press head device for chip nanosilver sintering, characterized in that: include: substrate(1); At least two hydraulic plates (2) are stacked in sequence and connected to the base plate (1); each of the at least two hydraulic plates (2) is provided with a hydraulic channel (4) connected to the hydraulic system; A plurality of hydraulic cylinders (3) are respectively mounted on the at least two hydraulic plates (2) and are connected to the hydraulic channels (4) of the corresponding hydraulic plates (2), and the hydraulic cylinders (3) that interfere with each other at the same plane position are respectively mounted on different hydraulic plates (2); A plurality of pressing blocks (5) are movably arranged on the base plate (1), used for respectively pressing different chips, corresponding one to one with the hydraulic cylinders (3), and connected to the movable ends of the corresponding hydraulic cylinders (3); A single hydraulic plate (2) is provided with a plurality of hydraulic channels (4), a plurality of hydraulic cylinders (3) are respectively connected to corresponding hydraulic channels (4), and the hydraulic system outputs the same or different hydraulic pressures to each hydraulic channel (4).

2. A multi-modal press head device for nanosilver sintering of a chip according to claim 1, characterized in that: It also includes a plurality of transfer rods (9), the transfer rods (9) passing through the base plate (1) and slidingly cooperating with the base plate (1), the plurality of transfer rods (9) corresponding to the hydraulic cylinders (3) one by one, and being coaxially arranged with the output shafts of the corresponding hydraulic cylinders (3), the end of the transfer rod (9) away from the hydraulic plate (2) being connected to the corresponding pressure block (5), an elastic member (11) being arranged between the transfer rod (9) and the base plate (1), the output shaft of each hydraulic cylinder (3) extending out to abut against the end of the transfer rod (9) away from the pressure block (5), and compressing the elastic member (11).

3. The multi-modal press head device for nanosilver sintering of a chip according to claim 1, characterized in that: It also comprises a heating plate (6), the heating plate (6) being mounted on the base plate (1), the heating plate (6) being used to heat the pressing block (5) and keep the pressing block (5) within a set temperature range, and a second temperature sensor (63) being arranged in the heating plate (6).

4. A multi-modal press head device for nanosilver sintering of a chip according to claim 3, characterized in that: A second cooling channel (62) is provided in the heating plate (6); after sintering is completed, a cooling medium is continuously passed through the second cooling channel (62).

5. The multi-modal press head device for chip nanosilver sintering according to claim 3, characterized in that: It also includes a cooling plate (8), the cooling plate (8) being mounted on a side of the heating plate (6) close to the hydraulic plate (2), the cooling plate (8) being provided with a first cooling channel (81), the first cooling channel (81) continuously flowing with cooling medium during the entire sintering process.

6. The multi-modal press head device for nanosilver sintering of a chip according to claim 5, characterized in that: A first temperature sensor (82) is arranged in the cooling plate (8).

7. The multi-modal press head device for nanosilver sintering of a chip according to claim 5, characterized in that: A heat insulation plate (7) is provided between the cooling plate (8) and the heating plate (6).

8. The multi-modal press head device for nanosilver sintering of a chip according to claim 1, characterized in that: A receiving groove (201) is provided on one side of the hydraulic plate (2) close to the pressure block (5), and a plurality of assembly grooves are provided on the bottom of the receiving groove (201) of the hydraulic plate (2). The hydraulic cylinder (3) comprises a cylinder body (31), a piston (32) and a push rod (33). The cylinder body (31) is installed in the assembly groove, the interior of the cylinder body (31) is connected to the hydraulic channel (4), the piston (32) is arranged inside the cylinder body (31), and the push rod (33) is connected to the piston (32).

9. The multi-modal press head device for nanosilver sintering of a chip according to claim 8, characterized in that: The cylinder body (31) is threadably matched with the inner wall of the assembly groove. A sealing ring (34) is provided at the end of the cylinder body (31) close to the hydraulic channel (4). The sealing ring (34) is clamped between the cylinder body (31) and the bottom wall of the assembly groove.

Images