A molding device for precision chip processing

Abstract

The present invention discloses a molding device for precision chip processing, which relates to the field of chip molding technology, and includes a machine base, which is used for stable support of molding components, and a load-bearing plate and a frame are fixedly installed on the top of the machine base respectively; a stamping assembly, which is used for precision chip stamping molding, and a hydraulic press is fixedly installed on the top of the stamping assembly; a support assembly, which is used for guiding and limiting the stamping assembly; a buffer assembly, which is used for precision chip stamping protection; and the support assembly is fixedly installed in the middle of the top of the load-bearing plate. The molding device for precision chip processing, through the stamping assembly, as the hydraulic press moves downward, the front pressing module first contacts the inner support extrusion part, and is coated on the outer side of the inner support extrusion part, so that the stamping block is buffered by the inner support extrusion part when stamping the chip, avoiding direct contact between the stamping block and the chip when it moves downward, resulting in excessive force on the chip and damage.

Description

Technical Field

[0001] The invention relates to the technical field of chip molding, in particular to molding equipment for precision chip processing. Background Art

[0002] The main function of a chip is to complete calculations and process tasks. An integrated circuit is a circuit packaged into a small component. Chips are used in various electronic devices and have a wide range of uses.

[0003] The existing chip packaging process includes wafer grinding, cutting, die bonding, wire bonding, molding, cutting, etc. During the production process, when making different packaging forms, due to the different frame sizes of different substrates, during the molding process (pressing the bare chip into the groove of the substrate, which has the function of flattening the chip and evenly gluing), depending on the different products, on the one hand, the substrate needs to be replaced, and on the other hand, the molding die that adapts to the substrate needs to be replaced. Therefore, we have encountered the following technical defects in actual operation that need to be overcome.

[0004] At present, when precision chip processing molding equipment presses precision chips, most of them use cylinders to directly press the mold onto the precision chip. The force between the two is strong and there is a lack of buffering. Since there are many circuits distributed inside the chip, it is easy for the pressing mold to damage the chip. Summary of the invention

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A molding device for precision chip processing, comprising a machine base, the machine base is used for stably supporting the molding component, and a bearing plate and a frame are fixedly installed on the top of the machine base;

[0006] A stamping assembly, which is used for precision chip stamping and forming, and a hydraulic press is fixedly installed on the top of the stamping assembly;

[0007] A support assembly, which is used for guiding and limiting the stamping assembly;

[0008] A buffer component, which is used for precision chip stamping protection;

[0009] The support assembly is fixedly installed in the middle of the top of the carrier plate, the support assembly is fixedly connected to the machine base through the carrier plate, the buffer assembly is fixedly installed inside the support assembly, and the buffer assembly and the stamping assembly are arranged on the same central axis, and the stamping assembly is adapted to the support assembly; the staff installs the substrate in the placement groove, and then places the chip cover on the top of the substrate. At this time, the staff starts the hydraulic press to make the stamping assembly go down and stamp the chip. Since the top mold arranged in the stamping assembly is adapted to the substrate model, the chip is stamped and adapted to the substrate at this time, so that the chip is pressed in the groove of the substrate, so that the chip is stamped into shape.

[0010] The support assembly includes a support frame, a shell is fixedly installed inside the support frame, a fixing plate is arranged inside the shell, the fixing plate is fixedly connected to the support frame, and a positioning plate is fixedly installed between opposite surfaces of the fixing plate. The positioning plate limits the buffer stabilizer, and when the external cover is downwardly covered on the outside of the inner support extrusion part, the support frame guides and limits the external cover, thereby improving the accuracy of the stamping block during stamping.

[0011] Preferably, the positioning plate is adapted to the buffer assembly, two support frames are provided, both of the two support frames are fixedly mounted on the top of the supporting plate, and the support frames are symmetrically arranged with the supporting plate as the center, and the bottom of the shell is fixedly connected to the supporting plate.

[0012] Preferably, the punching assembly includes a hydraulic rod, a top shell is fixedly installed at the bottom of the hydraulic rod, a pressing module is fixedly installed at the bottom of the top shell, a punching block is fixedly installed at the middle of the bottom of the pressing module, and an external cover is fixedly installed at the bottom side of the pressing module. As the hydraulic press moves downward, the punching module first contacts the inner support extrusion member and covers the outer side of the inner support extrusion member, so that the punching block is buffered by the inner support extrusion member when punching the chip, avoiding direct contact between the punching block and the chip when it moves downward, resulting in excessive force on the chip and damage.

[0013] Preferably, the hydraulic rod is fixedly mounted at the middle of the bottom of the hydraulic press, the punching block is matched with the buffer assembly, and the external cover is coated on the outer surface of the buffer assembly, and the external cover is matched with the support frame.

[0014] Preferably, the buffer assembly includes a frame plate, and inner support extrusion pieces are fixedly installed on both sides of the top of the frame plate. Two inner support extrusion pieces are provided, and the two inner support extrusion pieces are symmetrically arranged with the frame plate as the center. A placement groove is provided in the middle of the top of the frame plate, and positioning grooves are provided on both sides of the outer surface of the frame plate. Two positioning grooves are provided, and the two positioning grooves are symmetrically arranged with the placement groove as the center. The staff places the substrate in the placement groove, and the inner support extrusion piece provided on the top of the placement groove is set as an airbag structure. When the compression module moves downward, the inner support extrusion piece is squeezed, so that the inner support extrusion piece is deformed to buffer the compression module.

[0015] Preferably, the inner support extrusion member is arranged below the pressing module, and the inner support extrusion member is extruded and adapted with the pressing module through an external cover, and a buffer stabilizing member is provided inside the positioning groove, and two groups of the buffer stabilizing members are provided, and the two groups of the buffer stabilizing members are symmetrically arranged with the frame plate as the center, and a through rod is fixedly installed between the opposite surfaces of the buffer stabilizing member, and the buffer stabilizing member extends through the positioning plate to the inside thereof, and the buffer stabilizing member is extruded and adapted with the positioning plate. When the stamping assembly is stamping, the stamping block stamps the placement groove, and at this time, the frame plate is pressed to squeeze the buffer stabilizing member, so that the buffer stabilizing members on both sides are squeezed and deformed in the positioning plate, and slide downward. When the stamping assembly completes the stamping and lifts upward, the buffer stabilizing member is lifted upward and reset.

[0016] Preferably, the inner support extrusion member comprises a bent frame, an inclined plate is fixedly mounted on the top of the bent frame, the inclined plates are symmetrically arranged with the placement groove as support, extrusion blocks are fixedly mounted on the outer surface of the inclined plates, a bent rod is fixedly mounted on the top of the extrusion blocks, and a support rod is fixedly mounted on the bottom of the bent rod. The extrusion blocks and the support rod are arranged as an airbag structure, and when the pressure module is pressed downward, the extrusion blocks and the support rod are squeezed and deformed, and the bent rod is driven to move downward.

[0017] Preferably, the bending frame, the extrusion block and the support rod are fixedly mounted on the top of the frame plate in sequence, the bending rod is mounted above the placement slot, and the bending rod, the support rod and the extrusion block are all extruded and adapted to the pressing module. The bending rod is set as an arc-shaped structure, and when in contact with the pressing module, the top surface of the arc-shaped bending rod contacts the pressing module, so that the support rod and the extrusion block remain stable when being extruded.

[0018] Preferably, the buffer stabilizer includes a clamping shaft, two of which are provided, a round block is fixedly mounted on the bottom of each of the two clamping shafts, a segmented plate is fixedly mounted on the outer surface of each of the round blocks, and a bent plate is fixedly mounted on the outer surface of the segmented plate.

[0019] Preferably, a support strip is fixedly installed at the bottom of the round block away from the side of the segmented plate, the support strip is fixedly installed at the top edge of the positioning plate, and fixed blocks are fixedly installed at both ends of the outer surface of the support strip, the fixed blocks are fixedly connected to the through rod, the clamping shaft is fixedly installed inside the positioning groove, the segmented plate and the bent plate extend through the positioning plate to the inside thereof, and the bent plate is squeezed and adapted to the positioning plate. When the placement groove is squeezed, the frame plate is driven to move downward, at which time the round block in the positioning groove moves downward, and the segmented plate is deformed when squeezed, thereby driving the frame plate to descend, and multiple groups of buffer stabilizers are supported on both sides of the frame plate to maintain the stability of the frame plate when it descends.

[0020] The present invention provides a molding device for precision chip processing. It has the following beneficial effects:

[0021] 1. The forming equipment for precision chip processing uses a stamping assembly. As the hydraulic press moves downward, the front pressing module first contacts the inner support extrusion part and is covered on the outside of the inner support extrusion part, so that the stamping block is buffered by the inner support extrusion part when stamping the chip, avoiding direct contact with the chip when the stamping block moves downward, causing excessive force on the chip and damage.

[0022] Second, the precision chip processing molding equipment limits the buffer stabilizing part through the positioning plate, and when the external cover is downwardly covered on the outside of the inner support extrusion part, the support frame guides and limits the external cover, thereby improving the accuracy of the stamping block during stamping.

[0023] 3. The forming equipment for precision chip processing is that the staff places the substrate in the placement slot, and the inner support extrusion piece set at the top of the placement slot is set as an airbag structure. When the pressing module moves down, the inner support extrusion piece is punched, so that the inner support extrusion piece is deformed to buffer the pressing module. When the punching assembly is punching, the punching block punches the placement slot. At this time, the frame plate is punched to squeeze the buffer stabilizing piece, so that the buffer stabilizing pieces on both sides are squeezed and deformed in the positioning plate, sliding downward. When the punching assembly completes the punching and lifts up, the buffer stabilizing piece is lifted up and reset.

[0024] Fourth, the precision chip processing molding equipment is configured with an airbag structure through the extrusion block and the support rod. When the pressing module is pressed downward, the extrusion block and the support rod are squeezed and deformed, and the bending rod is driven to move downward. The bending rod is configured as an arc structure. When it contacts the pressing module, the top surface of the arc-shaped bending rod contacts the pressing module, so that the support rod and the extrusion block remain stable when being squeezed.

[0025] 5. The precision chip processing molding equipment drives the frame plate to move downward when the placement groove is squeezed. At this time, the round block in the positioning groove moves downward and causes the segmented plate to deform when squeezed, thereby driving the frame plate to descend. Multiple groups of buffer stabilizers are supported on both sides of the frame plate to maintain the stability of the frame plate when it descends. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the external structure of a molding device for precision chip processing according to the present invention;

[0027] Figure 2 This is a schematic diagram of the external structure of a precision chip processing molding device from another angle of the present invention;

[0028] Figure 3 This is a schematic diagram of the connection structure between the support assembly and the buffer assembly of the present invention;

[0029] Figure 4 It is a schematic diagram of the cross-sectional structure of the stamping assembly of the present invention;

[0030] Figure 5 This is a schematic diagram of the support assembly structure of the present invention;

[0031] Figure 6 This is a schematic diagram of the structure of the buffer assembly of the present invention;

[0032] Figure 7 This is a schematic diagram of the cross-sectional structure of the frame plate of the present invention;

[0033] Figure 8 This is a schematic diagram of the structure of the inner support extrusion member of the present invention;

[0034] Fig. 9 It is a schematic diagram of the structure of the buffer stabilizing member of the present invention.

[0035] In the figure: 1. hydraulic press; 2. stamping assembly; 21. hydraulic rod; 22. top shell; 23. pressing module; 24. external cover; 25. stamping block; 3. supporting assembly; 31. outer shell; 32. supporting frame; 33. fixing plate; 34. positioning plate; 4. bearing plate; 5. frame; 6. base; 7. buffer assembly; 71. inner support extrusion member; 711. bending rod; 712. supporting rod; 713. extrusion block; 714. inclined plate; 715. bending frame; 72. through rod; 73. frame plate; 74. buffer stabilizing member; 741. fixing block; 742. round block; 743. supporting bar; 744. clamping shaft; 745. segmented plate; 746. bending plate; 75. placement groove; 76. positioning groove. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0037] The first embodiment, as Figures 1 to 4 As shown, the present invention provides a technical solution: a molding device for precision chip processing, comprising a machine base 6, the machine base 6 is used for stably supporting the molding component, and a bearing plate 4 and a frame 5 are fixedly installed on the top of the machine base 6;

[0038] A stamping assembly 2, which is used for precision chip stamping and forming, and a hydraulic press 1 is fixedly installed on the top of the stamping assembly 2;

[0039] A support assembly 3, which is used for guiding and limiting the stamping assembly 2;

[0040] A buffer component 7, which is used for precision chip stamping protection;

[0041] The support assembly 3 is fixedly installed in the middle of the top of the carrier plate 4, and the support assembly 3 is fixedly connected to the machine base 6 through the carrier plate 4. The buffer assembly 7 is fixedly installed inside the support assembly 3, and the buffer assembly 7 and the stamping assembly 2 are arranged on the same central axis, and the stamping assembly 2 is adapted to the support assembly 3; the staff installs the substrate in the placement groove 75, and then puts the chip cover on the top of the substrate. At this time, the staff starts the hydraulic press 1 to make the stamping assembly 2 go down and stamp the chip. Since the top mold arranged in the stamping assembly 2 is adapted to the substrate model, the chip is stamped and adapted to the substrate at this time, so that the chip is pressed in the groove of the substrate, so that the chip is stamped into shape.

[0042] The punching assembly 2 includes a hydraulic rod 21, a top shell 22 is fixedly installed at the bottom of the hydraulic rod 21, a pressing module 23 is fixedly installed at the bottom of the top shell 22, a punching block 25 is fixedly installed at the middle of the bottom of the pressing module 23, and an external cover 24 is fixedly installed at the bottom side of the pressing module 23. As the hydraulic press 1 moves downward, the punching assembly 2 first contacts the inner support extrusion member 71 and covers the outer side of the inner support extrusion member 71, so that the punching block 25 is buffered by the inner support extrusion member 71 when punching the chip, avoiding the punching block 25 directly contacting the chip when it moves downward, causing the chip to be damaged due to excessive force.

[0043] The hydraulic rod 21 is fixedly installed in the middle of the bottom of the hydraulic press 1 , the punch block 25 is matched with the buffer assembly 7 , and the external cover 24 is covered on the outer surface of the buffer assembly 7 , and the external cover 24 is matched with the support frame 32 .

[0044] The second embodiment is based on the first embodiment. Figure 5 to Figure 6 As shown, the support assembly 3 includes a support frame 32, a housing 31 is fixedly installed inside the support frame 32, a fixing plate 33 is arranged inside the housing 31, the fixing plate 33 is fixedly connected to the support frame 32, and a positioning plate 34 is fixedly installed between opposite surfaces of the fixing plate 33. The positioning plate 34 limits the buffer stabilizing member 74, and the support frame 32 guides and limits the external cover 24 when the external cover 24 is downwardly covered on the outside of the internal support extrusion member 71, thereby improving the accuracy of the punching block 25 during punching.

[0045] The positioning plate 34 is adapted to the buffer assembly 7 , and two support frames 32 are provided. Both support frames 32 are fixedly mounted on the top of the supporting plate 4 , and the support frames 32 are symmetrically arranged with the supporting plate 4 as the center. The bottom of the shell 31 is fixedly connected to the supporting plate 4 .

[0046] The third embodiment is based on the first and second embodiments. Figures 7 to 9 As shown, the buffer assembly 7 includes a frame plate 73, and inner support extrusion pieces 71 are fixedly installed on both sides of the top of the frame plate 73. Two inner support extrusion pieces 71 are provided, and the two inner support extrusion pieces 71 are symmetrically arranged with the frame plate 73 as the center. A placement groove 75 is opened in the middle of the top of the frame plate 73, and positioning grooves 76 are opened on both sides of the outer surface of the frame plate 73. Two positioning grooves 76 are provided, and the two positioning grooves 76 are symmetrically arranged with the placement groove 75 as the center. The staff places the substrate in the placement groove 75, and the inner support extrusion piece 71 set on the top of the placement groove 75 is set as an airbag structure. When the compression module 23 moves downward, the inner support extrusion piece 71 is stamped, so that the inner support extrusion piece 71 is deformed to buffer the compression module 23.

[0047] The inner support extrusion member 71 is arranged below the pressing module 23, and the inner support extrusion member 71 is extruded and adapted with the pressing module 23 through the external cover 24. The internal clamp of the positioning groove 76 is provided with a buffer stabilizing member 74. The buffer stabilizing member 74 is provided with two groups. The two groups of the buffer stabilizing members 74 are symmetrically arranged with the frame plate 73 as the center. A through rod 72 is fixedly installed between the opposite surfaces of the buffer stabilizing member 74. The buffer stabilizing member 74 penetrates the positioning plate 34 and extends to the inside thereof, and the buffer stabilizing member 74 is extruded and adapted with the positioning plate 34. When the stamping assembly 2 is stamped, the stamping block 25 stamps the placement groove 75. At this time, the frame plate 73 is pressed to squeeze the buffer stabilizing member 74, so that the buffer stabilizing members 74 on both sides are squeezed and deformed in the positioning plate 34, and slide downward. When the stamping assembly 2 completes the stamping and lifts upward, the buffer stabilizing member 74 is lifted upward and reset.

[0048] The inner support extrusion member 71 includes a bent frame 715, a tilted plate 714 is fixedly installed on the top of the bent frame 715, and the tilted plate 714 is symmetrically arranged with the placement groove 75 as support, and the outer surface of the tilted plate 714 is fixedly installed with an extrusion block 713, and the top of the extrusion block 713 is fixedly installed with a bent rod 711, and the bottom of the bent rod 711 is fixedly installed with a support rod 712. The extrusion block 713 and the support rod 712 are set as an airbag structure. When the compression module 23 is squeezed downward, the extrusion block 713 and the support rod 712 are squeezed and deformed, and drive the bent rod 711 to move downward.

[0049] The bending frame 715, the extrusion block 713 and the support rod 712 are fixedly installed on the top of the frame plate 73 in sequence, and the bending rod 711 is arranged above the placement groove 75. The bending rod 711, the support rod 712 and the extrusion block 713 are all extruded and adapted to the pressing module 23. The bending rod 711 is set as an arc structure. When contacting the pressing module 23, the top surface of the arc-shaped bending rod 711 contacts the pressing module 23, so that the support rod 712 and the extrusion block 713 remain stable when being extruded.

[0050] The buffer stabilizer 74 includes a clamping shaft 744, and two clamping shafts 744 are provided. A round block 742 is fixedly installed at the bottom of the two clamping shafts 744, and a segmented plate 745 is fixedly installed on the outer surface of the round block 742. A bent plate 746 is fixedly installed on the outer surface of the segmented plate 745.

[0051] A support bar 743 is fixedly installed at the bottom of the round block 742 away from the side of the segmented plate 745. The support bar 743 is fixedly installed at the top edge of the positioning plate 34. The two ends of the outer surface of the support bar 743 are fixedly installed with fixed blocks 741. The fixed blocks 741 are fixedly connected to the through rod 72. The clamping shaft 744 is fixedly installed inside the positioning groove 76. The segmented plate 745 and the bent plate 746 penetrate the positioning plate 34 and extend to the inside thereof, and the bent plate 746 is pressed and adapted to the positioning plate 34. When the placement groove 75 is squeezed, the frame plate 73 is driven to move downward. At this time, the round block 742 in the positioning groove 76 moves downward, and the segmented plate 745 is deformed when squeezed, thereby driving the frame plate 73 to descend. In addition, multiple groups of buffer stabilizers 74 are supported on both sides of the frame plate 73 to maintain the stability of the frame plate 73 when it descends.

[0052] When in use, the staff installs the substrate in the placement groove 75, and then places the chip cover on the top of the substrate. At this time, the staff starts the hydraulic press 1 to make the stamping assembly 2 move downward and stamp the chip. Since the top mold set in the stamping assembly 2 is compatible with the substrate model, the chip is stamped and adapted to the substrate, so that the chip is pressed into the groove of the substrate, so that the chip is stamped into shape.

[0053] The positioning plate 34 limits the buffer stabilizing member 74 , and the support frame 32 guides and limits the external cover 24 when the external cover 24 covers the outside of the internal support extrusion member 71 downward, thereby improving the accuracy of the punching block 25 during punching.

[0054] As the hydraulic press 1 moves downward, the pressing module 23 of the stamping assembly 2 first contacts the inner support extrusion piece 71 and is wrapped around the outer side of the inner support extrusion piece 71, so that the stamping block 25 is buffered by the inner support extrusion piece 71 when stamping the chip, avoiding direct contact between the stamping block 25 and the chip when descending, causing the chip to be damaged due to excessive force.

[0055] The staff places the substrate in the placement groove 75. The inner support extrusion piece 71 set on the top of the placement groove 75 is set as an airbag structure. When the pressing module 23 moves downward, the inner support extrusion piece 71 is stamped to cause the inner support extrusion piece 71 to deform to cushion the pressing module 23.

[0056] When the stamping assembly 2 is stamping, the stamping block 25 stamps the placement groove 75. At this time, the frame plate 73 is pressed to squeeze the buffer stabilizing member 74, so that the buffer stabilizing members 74 on both sides are squeezed and deformed in the positioning plate 34, and slide downward. When the stamping assembly 2 completes the stamping and lifts upward, the buffer stabilizing member 74 is lifted upward and reset.

[0057] The extrusion block 713 and the support rod 712 are configured as an airbag structure. When the pressing module 23 is pressed downward, the extrusion block 713 and the support rod 712 are squeezed and deformed, and the bending rod 711 is driven to move downward.

[0058] The curved rod 711 is configured as an arc-shaped structure. When in contact with the pressing module 23, the top surface of the curved rod 711 is in contact with the pressing module 23, so that the support rod 712 and the pressing block 713 remain stable when being squeezed.

[0059] When the placement groove 75 is squeezed, the frame plate 73 is driven to move downward. At this time, the round block 742 in the positioning groove 76 moves downward, and the segmented plate 745 is deformed when squeezed, thereby driving the frame plate 73 to descend. In addition, multiple groups of buffer stabilizers 74 are supported on both sides of the frame plate 73 to maintain the stability of the frame plate 73 when it descends.

[0060] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A molding device for precision chip processing, characterized in that: include: A machine base (6), the machine base (6) being used for stably supporting the formed component, a bearing plate (4) and a machine frame (5) being respectively fixedly mounted on the top of the machine base (6); A punching assembly (2), the punching assembly (2) being used for precision chip punching and forming, a hydraulic press (1) being fixedly mounted on the top of the punching assembly (2); A support assembly (3), the support assembly (3) being used for guiding and limiting the punch assembly (2); A buffer component (7), the buffer component (7) being used for precision chip stamping protection; The support assembly (3) is fixedly mounted at the middle of the top of the bearing plate (4), the support assembly (3) is fixedly connected to the machine base (6) via the bearing plate (4), the buffer assembly (7) is fixedly mounted inside the support assembly (3), the buffer assembly (7) and the punching assembly (2) are arranged on the same central axis, and the punching assembly (2) is adapted to the support assembly (3); The support assembly (3) comprises a support frame (32), a housing (31) is fixedly mounted inside the support frame (32), a fixing plate (33) is arranged inside the housing (31), the fixing plate (33) is fixedly connected to the support frame (32), and a positioning plate (34) is fixedly mounted between opposite surfaces of the fixing plate (33); The punching assembly (2) comprises a hydraulic rod (21), a top shell (22) is fixedly mounted on the bottom of the hydraulic rod (21), a pressing module (23) is fixedly mounted on the bottom of the top shell (22), a punching block (25) is fixedly mounted in the middle of the bottom of the pressing module (23), and an external cover (24) is fixedly mounted on the side of the bottom of the pressing module (23); The hydraulic rod (21) is fixedly mounted at the middle of the bottom of the hydraulic press (1); the punching block (25) is compatible with the buffer assembly (7); the external cover (24) is covered on the outer surface of the buffer assembly (7); and the external cover (24) is compatible with the support frame (32); The buffer assembly (7) comprises a frame plate (73), and inner support extrusion members (71) are fixedly mounted on both sides of the top of the frame plate (73), and two inner support extrusion members (71) are provided, and the two inner support extrusion members (71) are symmetrically arranged with the frame plate (73) as the center; a placement groove (75) is provided in the middle of the top of the frame plate (73), and positioning grooves (76) are provided on both sides of the outer surface of the frame plate (73), and two positioning grooves (76) are provided, and the two positioning grooves (76) are symmetrically arranged with the placement groove (75) as the center; The inner support extrusion member (71) is arranged below the pressing module (23), and the inner support extrusion member (71) is extruded and fitted with the pressing module (23) through the external cover (24); a buffer stabilizing member (74) is provided inside the positioning groove (76); two groups of the buffer stabilizing members (74) are provided, and the two groups of the buffer stabilizing members (74) are symmetrically arranged with the frame plate (73) as the center; a through rod (72) is fixedly installed between opposite surfaces of the buffer stabilizing member (74); the buffer stabilizing member (74) penetrates the positioning plate (34) and extends to the inside thereof, and the buffer stabilizing member (74) is extruded and fitted with the positioning plate (34).

2. The molding equipment for precision chip processing according to claim 1, characterized in that: The positioning plate (34) is compatible with the buffer assembly (7), two support frames (32) are provided, the two support frames (32) are fixedly mounted on the top of the bearing plate (4), and the support frames (32) are symmetrically arranged with the bearing plate (4) as the center, and the bottom of the housing (31) is fixedly connected to the bearing plate (4).

3. The molding equipment for precision chip processing according to claim 1, characterized in that: The inner support extrusion member (71) comprises a bent frame (715), an inclined plate (714) is fixedly mounted on the top of the bent frame (715), the inclined plates (714) are symmetrically arranged with the placement groove (75) as support, an extrusion block (713) is fixedly mounted on the outer surface of each of the inclined plates (714), a bent rod (711) is fixedly mounted on the top of each of the extrusion blocks (713), and a support rod (712) is fixedly mounted on the bottom of each of the bent rods (711).

4. The molding equipment for precision chip processing according to claim 3 is characterized in that: The bending frame (715), the extrusion block (713) and the support rod (712) are fixedly mounted on the top of the frame plate (73) in sequence, the bending rod (711) is mounted above the placement groove (75), and the bending rod (711), the support rod (712) and the extrusion block (713) are all extruded and adapted to the pressing module (23).

5. The molding equipment for precision chip processing according to claim 1, characterized in that: The buffer stabilizing member (74) comprises a clamping shaft (744), two of which are provided, a round block (742) being fixedly mounted on the bottom of each of the two clamping shafts (744), a segmented plate (745) being fixedly mounted on the outer surface of each of the segmented plates (745), and a bent plate (746) being fixedly mounted on the outer surface of each of the segmented plates (745).

6. The molding equipment for precision chip processing according to claim 5, characterized in that: A support bar (743) is fixedly installed at the bottom of the round block (742) on the side away from the segmented plate (745), and the support bar (743) is fixedly installed at the top edge of the positioning plate (34). Fixed blocks (741) are fixedly installed at both ends of the outer surface of the support bar (743), and the fixed blocks (741) are fixedly connected to the through rod (72). The clamping shaft (744) is fixedly installed inside the positioning groove (76). The segmented plate (745) and the bent plate (746) penetrate the positioning plate (34) and extend into the interior thereof, and the bent plate (746) is extruded and adapted to the positioning plate (34).

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