Calibration method, device and computer equipment for chip mounting equipment

Abstract

The present application relates to a calibration method, device, computer equipment, computer-readable storage medium and computer program product for a chip mounting device. The method comprises: obtaining a first image corresponding to a first identifier and a second image corresponding to a second identifier; determining first coordinate data of the first identifier and second coordinate data of the second identifier according to the first image and the second image; determining a position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; determining error values ​​of the multiple dimensions corresponding to the position deviation value based on the correlation between the position deviation value and the error values ​​of multiple dimensions; calibrating the position of the mounting head and / or the carrier according to the error value to obtain a calibrated chip mounting device. The use of this method can improve calibration accuracy and efficiency.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a calibration method, device, and computer equipment for chip mounting equipment. Background Art

[0002] Flip-chip bonding is a semiconductor packaging technology in which the chip is inverted, with the soldering side facing down and connected directly to the substrate. During semiconductor processing, the flip-chip bonding technology solution can be used for chip mounting. The accuracy of chip mounting affects the quality of the produced products.

[0003] Generally, there are mechanical errors, coaxial errors, visual system errors, etc. in the mounting process. In the related art, the error compensation can be performed by physical limit or manual measurement. However, this method cannot guarantee the calibration accuracy and is inefficient. Summary of the invention

[0004] Based on this, it is necessary to provide a calibration method, device, and computer equipment for chip mounting equipment that can improve accuracy and efficiency in response to the above technical problems.

[0005] In a first aspect, the present application provides a calibration method for a chip mounting device, the device comprising a mounting head and a carrier, a calibration sheet being adsorbed on the mounting head, an alignment plate being placed on the carrier, a first mark being provided on the calibration sheet, and a second mark corresponding to the first mark being provided on the alignment plate, the method comprising:

[0006] Control the placement head to press down and fit, determine a first calibration matrix according to the relative position relationship of the first mark before and after the calibration sheet is pressed down; and calibrate the position of the placement head using the first calibration matrix to obtain a chip placement device after initial calibration;

[0007] For the chip mounting equipment after the initial calibration, controlling the mounting head to press down and mount, and obtaining a first image corresponding to the first mark and a second image corresponding to the second mark;

[0008] Determine first coordinate data of the first marker and second coordinate data of the second marker according to the first image and the second image;

[0009] Determine a position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; determine the error values ​​of the multiple dimensions corresponding to the position deviation value based on the correlation relationship between the position deviation value and the error values ​​of the multiple dimensions;

[0010] According to the error value, the position of the placement head and / or the carrier is calibrated, and the placement head is controlled to press down and perform calibration again until the error value is within a preset range, thereby obtaining a calibrated chip placement device.

[0011] In one embodiment, the error values ​​of the multiple dimensions include an offset error value and a rotation error value, and determining the error values ​​of the multiple dimensions corresponding to the position deviation value based on the correlation between the position deviation value and the error values ​​of the multiple dimensions includes:

[0012] Determine a first correlation relationship between the position deviation value and the offset error value, and a second correlation relationship between the position deviation value and the rotation error value;

[0013] The error values ​​of the multiple dimensions are determined according to the first association relationship, the second association relationship and the position deviation value.

[0014] In one embodiment, a plurality of first marks are provided on the calibration sheet, a plurality of second marks are provided on the alignment plate, the first marks correspond to the second marks one by one, and the error values ​​of the plurality of dimensions corresponding to the position deviation value are determined based on the correlation between the position deviation value and the error values ​​of the plurality of dimensions, including:

[0015] Based on the correlation between the position deviation value and the error values ​​of multiple dimensions, determining the equation relationship corresponding to each first identifier according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier;

[0016] The error values ​​of the multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers.

[0017] In one embodiment, determining the error values ​​of the multiple dimensions according to the multiple equation relationships corresponding to the multiple first identifiers includes:

[0018] Determine a plurality of equation relationships corresponding to the plurality of first identifiers;

[0019] The multiple equation relationships are processed using a preset data fitting algorithm to obtain error values ​​of the multiple dimensions.

[0020] In one embodiment, the equation relationship also includes at least one of a scaling difference and a measurement difference, and the scaling difference is determined based on the relative position relationship between the first marker and the center position of the calibration piece, and the relative position relationship between the second marker and the center position of the calibration piece.

[0021] In one embodiment, calibrating the position of the placement head and / or the stage according to the error value includes:

[0022] Determining a compensation value corresponding to the placement head according to the error value, and adjusting the position of the placement head according to the compensation value; and / or,

[0023] According to the error value, a compensation value corresponding to the carrier is determined, and the position of the carrier is adjusted according to the compensation value.

[0024] In one embodiment, acquiring a first image corresponding to the first identifier and a second image corresponding to the second identifier includes:

[0025] When the relative positional relationship between the placement head and the carrier meets a preset condition, a first image corresponding to the first mark and a second image corresponding to the second mark are acquired.

[0026] In one embodiment, the first mark is set as a dot, the second mark is set as a ring, and determining the first coordinate data of the first mark and the second coordinate data of the second mark according to the first image and the second image includes:

[0027] When the center position of the first mark on the first image and the center position of the second mark on the second image do not coincide, the center coordinate data of the first mark is determined as the first coordinate data and the center coordinate data of the second mark is determined as the second coordinate data.

[0028] In a second aspect, the present application further provides a calibration device for a chip mounting device, the device comprising a mounting head and a carrier, a calibration sheet being adsorbed on the mounting head, an alignment plate being placed on the carrier, a first mark being provided on the calibration sheet, and a second mark corresponding to the first mark being provided on the alignment plate, the device comprising:

[0029] A control module, used to control the placement head to press down and fit, determine a first calibration matrix according to the relative position relationship of the first mark before and after the calibration sheet is pressed down, and calibrate the position of the placement head using the first calibration matrix to obtain a chip placement device after initial calibration;

[0030] An acquisition module, used to acquire a first image corresponding to the first identifier and a second image corresponding to the second identifier;

[0031] A first determining module, configured to determine first coordinate data of the first identifier and second coordinate data of the second identifier according to the first image and the second image;

[0032] A second determination module is used to determine a position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; and determine the error values ​​of the multiple dimensions corresponding to the position deviation value based on the association relationship between the position deviation value and the error values ​​of the multiple dimensions;

[0033] The calibration module is used to calibrate the position of the placement head and / or the carrier according to the error value, and control the placement head to press down and perform calibration again until the error value is within a preset range, thereby obtaining a calibrated chip placement device.

[0034] In one embodiment, the error values ​​of the multiple dimensions include an offset error value and a rotation error value, and the second determination module is further configured to:

[0035] Determine a first correlation relationship between the position deviation value and the offset error value, and a second correlation relationship between the position deviation value and the rotation error value;

[0036] The error values ​​of the multiple dimensions are determined according to the first association relationship, the second association relationship and the position deviation value.

[0037] In one embodiment, a plurality of first marks are provided on the calibration sheet, a plurality of second marks are provided on the alignment plate, the first marks correspond to the second marks one by one, and the second determination module is further used for:

[0038] Based on the correlation between the position deviation value and the error values ​​of multiple dimensions, determining the equation relationship corresponding to each first identifier according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier;

[0039] The error values ​​of the multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers.

[0040] In one embodiment, the second determining module is further configured to:

[0041] Determine a plurality of equation relationships corresponding to the plurality of first identifiers;

[0042] The multiple equation relationships are processed using a preset data fitting algorithm to obtain error values ​​of the multiple dimensions.

[0043] In one embodiment, the equation relationship also includes at least one of a scaling difference and a measurement difference, and the scaling difference is determined based on the relative position relationship between the first marker and the center position of the calibration piece, and the relative position relationship between the second marker and the center position of the calibration piece.

[0044] In one embodiment, the calibration module is further used for:

[0045] Determining a compensation value corresponding to the placement head according to the error value, and adjusting the position of the placement head according to the compensation value; and / or,

[0046] According to the error value, a compensation value corresponding to the carrier is determined, and the position of the carrier is adjusted according to the compensation value.

[0047] In one embodiment, the acquisition module is further used for:

[0048] When the relative positional relationship between the placement head and the carrier meets a preset condition, a first image corresponding to the first mark and a second image corresponding to the second mark are acquired.

[0049] In one embodiment, the first identifier is set as a dot, the second identifier is set as a ring, and the first determining module is further configured to:

[0050] When the center position of the first mark on the first image and the center position of the second mark on the second image do not coincide, the center coordinate data of the first mark is determined as the first coordinate data and the center coordinate data of the second mark is determined as the second coordinate data.

[0051] In a third aspect, an embodiment of the present disclosure further provides a computer device, wherein the computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of any one of the methods in the embodiments of the present disclosure are implemented.

[0052] In a fourth aspect, the embodiments of the present disclosure further provide a computer-readable storage medium, wherein a computer program is stored thereon, and when the computer program is executed by a processor, the steps of any one of the methods in the embodiments of the present disclosure are implemented.

[0053] In a fifth aspect, the embodiments of the present disclosure further provide a computer program product, wherein the computer program product includes a computer program, and when the computer program is executed by a processor, the steps of any one of the methods in the embodiments of the present disclosure are implemented.

[0054] The calibration method, device, computer device, computer-readable storage medium and computer program product of the chip mounting equipment described above, when calibrating the chip mounting equipment, obtain a first image corresponding to the first marker on the calibration sheet and a second image corresponding to the second marker on the alignment plate, determine the first coordinate data of the first marker and the second coordinate data of the second marker based on the first image and the second image, determine the error values ​​of the multiple dimensions based on the first coordinate data and the second coordinate data based on the association between the position deviation value of the marker and the error values ​​of multiple dimensions, and use the error values ​​of multiple dimensions to participate in the calculation, so that the error factors of multiple dimensions where there is a deviation between the first coordinate data and the second coordinate data can be taken into account, thereby effectively improving the accuracy of the calculated error value; determine the position deviation value between the first marker and the second marker based on the first coordinate data and the second coordinate data, so that the error values ​​of multiple dimensions corresponding to the position deviation value can be quickly and accurately determined based on the association between the position deviation value of the marker and the error values ​​of multiple dimensions, thereby ensuring the accuracy and efficiency of the error value calculation. By calculating the error values ​​of multiple dimensions, the position of the mounting head and / or the carrier is calibrated to obtain a calibrated chip mounting device, so that the position between the mounting head and the carrier of the chip mounting device can be aligned to ensure the accuracy and reliability of the subsequent chip mounting. Since the calibration is performed through the error values ​​of multiple dimensions, the calibration accuracy is effectively guaranteed and it is suitable for more application scenarios. Furthermore, in this application, the first coordinate data and the second coordinate data are automatically identified through the images of the calibration sheet and the alignment plate, and the error values ​​of multiple dimensions are calculated to automatically calibrate the device, which improves the efficiency of device error compensation and reduces manual workload. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0056] Figure 1 A schematic diagram of a flow chart of a calibration method for a chip mounting device in one embodiment;

[0057] Figure 2 is a schematic diagram of a calibration sheet in one embodiment;

[0058] Figure 3 is a schematic diagram of an alignment plate in one embodiment;

[0059] Figure 4 A schematic diagram of a chip mounting device in one embodiment;

[0060] Figure 5 is a schematic diagram of a first image and a second image in one embodiment;

[0061] Figure 6 is a schematic diagram of a first image and a second image in another embodiment;

[0062] Figure 7 A schematic flow chart of a calibration method for chip mounting equipment in another embodiment;

[0063] Figure 8 is a schematic diagram of the decomposition of scaling error in one embodiment;

[0064] Fig. 9 is a schematic diagram of a scaling error in one embodiment;

[0065] Fig.10 A structural block diagram of a calibration device for chip mounting equipment in one embodiment;

[0066] Fig.11 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0067] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0068] In one embodiment, Figure 1 As shown, a calibration method for chip mounting equipment is provided. This embodiment uses the method applied to a terminal as an example for explanation. It is understandable that the method can also be applied to a server, and can also be applied to a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. In this embodiment, the device includes a mounting head and a carrier. A calibration sheet is adsorbed on the mounting head, and an alignment plate is placed on the carrier. A first mark is set on the calibration sheet, and a second mark corresponding to the first mark is set on the alignment plate. The method includes:

[0069] Step S110, acquiring a first image corresponding to the first identifier and a second image corresponding to the second identifier;

[0070] The chip mounting equipment includes a mounting head and a carrier. In one example, when the chip mounting equipment is used for chip mounting, the chip is adsorbed on the mounting head, the welding surface of the chip is opposite to the carrier, the welding surface is provided with solder joints, a substrate is provided on the carrier, and solder pads corresponding to the chip solder joints are provided on the substrate. The mounting head presses down to make the chip fit with the substrate on the carrier, and the solder joints are melted to form a connection with the solder pads to realize chip mounting.

[0071] Generally, chip mounting requires high precision, and mechanical errors, coaxial errors, visual system and other assembly errors will affect the mounting precision. For example, the chip mounting equipment can be calibrated to ensure the precision of the chip mounting equipment.

[0072] Optionally, calibration is performed using a calibration sheet and an alignment plate. During the calibration process, the calibration sheet is adsorbed on the mounting head, and the alignment plate is placed on the carrier. In one example, a first mark is provided on the calibration sheet, and a second mark corresponding to the first mark is provided on the alignment plate. The first mark may include one or more, and the second mark may include one or more. Among them, one first mark may correspond to one or more second marks, and one second mark may correspond to one or more first marks. The specific correspondence relationship can be determined according to the actual application scenario.

[0073] Figure 2 is a schematic diagram of a calibration sheet according to an exemplary embodiment, referring to Figure 2 As shown, a circular mark, that is, a first mark in the shape of a dot, is provided on the calibration sheet. In an example, a bar grid is also provided on the calibration sheet for calibration. Figure 3 is a schematic diagram of an alignment plate according to an exemplary embodiment, referring to Figure 3 As shown, a circular mark, i.e., a second mark in the shape of a circular ring, is provided on the alignment plate. In one example, a Bar grid is also provided on the alignment plate for comparison with the Bar grid on the calibration sheet for calibration. In one example, adsorption holes are also provided on the alignment plate for adsorbing the calibration sheet after the placement head is pressed down, so as to calibrate the chip placement equipment according to the coincidence and alignment relationship between the mark and the bar grid.

[0074] In a possible implementation, the adsorption of the calibration sheet and the initial position of the alignment plate can be automatically placed. Exemplarily, after the calibration sheet is transferred to the stage, the position of the calibration sheet can be obtained by using an image acquisition device, and the position of the calibration sheet can be corrected. The calibration sheet is moved so that the center of the calibration sheet moves to directly under the placement head, and the placement head presses down to adsorb the calibration sheet. The placement process of the alignment plate is similar to that of the calibration sheet. After being placed on the stage, the position is corrected and then moved to directly under the placement head. In one example, when performing position correction, the angle and center coordinates of the calibration sheet / alignment plate can be calculated based on the markings at the corners of the calibration sheet / alignment plate, and the angle correction and center alignment can be performed based on the center position of the placement head.

[0075] Optionally, after the placement head is pressed down, the alignment accuracy of the calibration sheet and the alignment plate can be observed by an image acquisition device, such as a coaxial camera, to obtain a first image of the first mark and a second image of the second mark.

[0076] Figure 4This is a schematic diagram of a chip mounting device according to an exemplary embodiment. A calibration sheet is adsorbed on the mounting head and aligned with the alignment plate. During the calibration process, image acquisition can be performed through a coaxial camera.

[0077] Exemplarily, before calibration is performed in the manner described in this embodiment, the calibration matrix can also be used for initial calibration. In one embodiment, the deflection of the upper and lower lenses of the coaxial camera is preset to 0, and the mounting head is pressed down completely vertically, and the deflection is also 0. The upper lens identifies the position coordinates of multiple first marks in the field of view of the calibration piece, and directly performs the first round of pressing and fitting. After completion, the lower camera of the coaxial camera is used to locate the first mark in the field of view of the calibration piece after pressing down, and the coordinates before pressing down are one-to-one correspondence. The affine transformation matrix is ​​calculated to obtain the first calibration matrix, which is used to compensate for the lens coaxial error and the verticality error of the mounting head pressing down; after the first round of calibration is completed, the mounting head presses down and absorbs the calibration piece in place. At this time, the upper lens identifies the first mark of the calibration piece, and the lower lens identifies the second mark of the alignment plate, and at the same time ensures the one-to-one correspondence between the first mark and the second mark. Finally, the rotation and translation relationship between the first mark of the calibration piece and the second mark of the alignment plate is calculated for compensation, and the lens coaxial error and the verticality error of the mounting head pressing down are corrected to complete the secondary pressing operation. After preliminary calibration by the above method, the calibration method described in this embodiment is executed to compensate for the error in the mechanical alignment movement.

[0078] Step S120, determining first coordinate data of the first marker and second coordinate data of the second marker according to the first image and the second image;

[0079] Exemplarily, the first coordinate data and the second coordinate data of the first identifier can be determined based on the first image and the second image. The first coordinate data and the second coordinate data are coordinate data corresponding to the first identifier and the second identifier respectively in the same coordinate system. In one example, the coordinate system can be determined according to the actual application scenario. For example, the center position of the calibration sheet or the center position of the alignment plate can be determined as the coordinate origin, and a coordinate system is established to determine the first coordinate data and the second coordinate data in combination with the first image and the second image.

[0080] Step S130, determining a position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; and determining error values ​​of the multiple dimensions corresponding to the position deviation value based on a correlation relationship between the position deviation value and the error values ​​of the multiple dimensions;

[0081] Exemplarily, after obtaining the first coordinate data and the second coordinate data, the error value is calculated. In one example, the correlation between the position deviation value of the marker and the error values ​​of multiple dimensions can be determined in advance according to the actual application scenario, and the correlation can be expressed by a relational expression or the like.

[0082] In one example, multiple dimensions may be determined based on different error types. For example, the error values ​​of multiple dimensions may include but are not limited to offset error values, rotation error values, scaling error values, measurement error values, etc.

[0083] Optionally, based on the relationship between the error values ​​of different dimensions and the marked position deviation value, the first coordinate data and the second coordinate data can be used to represent the error values ​​of multiple dimensions, and data fitting can be performed to calculate the error values ​​corresponding to the multiple dimensions through linear regression solution and other methods.

[0084] The position deviation value of the marker can be determined based on the coordinate data of the first marker and the coordinate data of the second marker. In one example, the position deviation value of the marker may include a lateral position deviation value and a longitudinal position deviation value. The lateral position deviation value can be determined based on the lateral coordinate of the first marker and the lateral coordinate of the second marker, and the longitudinal position deviation value can be determined based on the lateral coordinate of the first marker and the lateral coordinate of the second marker.

[0085] Exemplarily, the position deviation value between the first identifier and the second identifier is determined according to the first coordinate data and the second coordinate data. Optionally, a deviation vector can be determined according to the first coordinate data and the second coordinate data, and the position deviation amount can be obtained according to the deviation vector, wherein the deviation vectors of different dimensions can be determined according to the first coordinate data and the second coordinate data, respectively. In one example, the deviation vector can be split to obtain components in different directions, and the error value can be calculated based on the components in different directions.

[0086] Figure 5 is a schematic diagram of a first image and a second image according to an exemplary embodiment, referring to Figure 5 As shown, the dot is the first image corresponding to the first mark, and the ring is the second image corresponding to the second mark. The two overlap in the same coordinate system, and the subsequent error value can be calculated based on the coordinate data of the ring and the dot.

[0087] Step S140: calibrate the position of the placement head and / or the stage according to the error value to obtain a calibrated chip placement device.

[0088] Exemplarily, position calibration is performed according to the error value to obtain a calibrated chip mounting device. The position of the mounting head can be adjusted according to the error value; the position of the carrier can be adjusted according to the error value; or the positions of the mounting head and the carrier can be adjusted simultaneously according to the error value. In one example, a calibration compensation value can be calculated according to the error value, and the position of the mounting head and / or the carrier can be adjusted using the calibration compensation value.

[0089] Optionally, the movement of the placement head and the carrier may be achieved by movement of an axis, and when position adjustment is performed, it may be achieved by adjusting the position and / or rotation angle of the axis.

[0090] In a possible implementation, after the position calibration is completed, a new first image and a new second image can be acquired again, and the error value can be calculated again. If the error value is still outside the preset range, the calibration is continued until the adjusted error value is within the preset range. It can be considered that the placement alignment accuracy of the placement head and the carrier meets the requirements, and the calibration is completed. The calibration accuracy and reliability are further improved through multiple rounds of repeated calibration. Among them, the preset range can be set according to the accuracy requirements of chip placement in actual application scenarios. When the error value is within the preset range, it can be considered that the accuracy meets the requirements.

[0091] In the embodiment of the present disclosure, when calibrating a chip mounting device, a first image corresponding to a first marker on a calibration sheet and a second image corresponding to a second marker on an alignment plate are obtained, first coordinate data of the first marker and second coordinate data of the second marker are determined based on the first image and the second image, and error values ​​of multiple dimensions are determined based on the first coordinate data and the second coordinate data based on the association between the position deviation value of the marker and the error values ​​of multiple dimensions. By using the error values ​​of multiple dimensions to participate in the calculation, error factors of multiple dimensions where there are deviations between the first coordinate data and the second coordinate data can be taken into account, thereby effectively improving the accuracy of the calculated error value; the position deviation value between the first marker and the second marker is determined based on the first coordinate data and the second coordinate data, so that the error values ​​of multiple dimensions corresponding to the position deviation value can be quickly and accurately determined based on the association between the position deviation value of the marker and the error values ​​of multiple dimensions, thereby ensuring the accuracy and efficiency of the error value calculation. By calculating the error values ​​of multiple dimensions, the position of the mounting head and / or the carrier is calibrated to obtain a calibrated chip mounting device, so that the position between the mounting head and the carrier of the chip mounting device can be aligned to ensure the accuracy and reliability of the subsequent chip mounting. Since the calibration is performed through the error values ​​of multiple dimensions, the calibration accuracy is effectively guaranteed and it is suitable for more application scenarios. Furthermore, in this application, the first coordinate data and the second coordinate data are automatically identified through the images of the calibration sheet and the alignment plate, and the error values ​​of multiple dimensions are calculated to automatically calibrate the device, which improves the efficiency of device error compensation and reduces manual workload.

[0092] In one embodiment, the error values ​​of the multiple dimensions include an offset error value and a rotation error value, and determining the error values ​​of the multiple dimensions corresponding to the position deviation value based on the association relationship between the position deviation value and the error values ​​of the multiple dimensions includes:

[0093] Determine a first correlation relationship between the position deviation value and the offset error value, and a second correlation relationship between the position deviation value and the rotation error value;

[0094] The error values ​​of the multiple dimensions are determined according to the first association relationship, the second association relationship and the position deviation value.

[0095] Exemplarily, the error values ​​of multiple dimensions include an offset error value and a rotation error value, and the correlation between the error values ​​of different dimensions and the position deviation value is different. After the position deviation value is determined according to the first coordinate data and the second coordinate data, a first correlation between the position deviation value and the offset error value and a second correlation between the position deviation value and the rotation error value are determined. In one example, the correlation can be represented by an expression, the first correlation includes an expression between the position deviation value and the offset error value, and the second correlation includes an expression between the position deviation value and the rotation error value.

[0096] Optionally, error values ​​of multiple dimensions are determined based on the first association relationship, the second association relationship and the position error value, wherein an equation can be established through the first association relationship, the second association relationship and the position error value, and the equation is solved. The solution method may include but is not limited to linear regression, data fitting, etc., to obtain error values ​​of multiple dimensions.

[0097] In a possible implementation, the offset error is recorded as Trans and the rotation error is recorded as Rotate. The overall deflection angle of the calibration piece that causes the rotation offset R is defined as , the coordinates of the first marker are (X, Y), then the xy component of the rotation offset in the coordinate system can be obtained by the rotation formula (1) (2) around the fixed point.

[0098] (1)

[0099] (2)

[0100] In the disclosed embodiment, based on a first correlation relationship between the position deviation value and the offset error value, and a second correlation relationship between the position deviation value and the rotation error value, error values ​​of multiple dimensions are determined according to the first correlation relationship, the second correlation relationship, and the position deviation value, so that the error value can be calculated in combination with the correlation relationship between the offset error value, the rotation error value, and the position deviation value. The error value is calculated in a comprehensive manner in multiple dimensions, which ensures the accuracy of the error value calculation and is suitable for more application scenarios.

[0101] In one embodiment, a plurality of first marks are provided on the calibration sheet, a plurality of second marks are provided on the alignment plate, the first marks correspond to the second marks one by one, and the error values ​​of the plurality of dimensions corresponding to the position deviation value are determined based on the correlation between the position deviation value and the error values ​​of the plurality of dimensions, including:

[0102] Based on the correlation between the position deviation value and the error values ​​of multiple dimensions, determining the equation relationship corresponding to each first identifier according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier;

[0103] The error values ​​of the multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers.

[0104] Exemplarily, a plurality of first marks are provided on the calibration sheet, and a plurality of second marks are provided on the alignment plate, and the first marks and the second marks correspond to each other one by one. In one example, the first marks can be distributed at different positions on the calibration sheet, so that during calibration, different positions of the calibration sheet can be aligned with the alignment plate on the stage.

[0105] Optionally, according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier, an equation relationship corresponding to each first identifier is determined, and the equation relationship can be determined based on the correlation relationship between the position deviation value and the error values ​​of multiple dimensions. Multiple first identifiers can correspond to multiple equation relationships, and the error values ​​of multiple dimensions are determined according to the multiple equation relationships.

[0106] In the disclosed embodiments, based on the correlation between the position deviation value and the error values ​​of multiple dimensions, the equation relationship corresponding to each first identifier is determined according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier, and the error values ​​of multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers. The error values ​​are calculated by using the multiple equation relationships corresponding to the multiple first identifiers, which can further improve the accuracy of the calculated error values. The error values ​​obtained by fitting the multiple equation relationships are more consistent with the error values ​​in the actual scene, thereby ensuring the alignment accuracy between the placement head and the carrier in the subsequent calibration process.

[0107] In one embodiment, determining the error values ​​of the multiple dimensions according to the multiple equation relationships corresponding to the multiple first identifiers includes:

[0108] Determine a plurality of equation relationships corresponding to the plurality of first identifiers;

[0109] The multiple equation relationships are processed using a preset data fitting algorithm to obtain error values ​​of the multiple dimensions.

[0110] Exemplarily, when the error values ​​are calculated based on multiple equation relationships, the multiple equation relationships can be processed by a preset data fitting algorithm to obtain error values ​​in multiple dimensions.

[0111] In one example, the equation relationship can be converted into a matrix form, and the first coordinate data of multiple first identifiers and the second coordinate data of multiple second identifiers can be substituted into the matrix respectively. The least squares method is used to perform linear regression analysis to solve the error values ​​of multiple dimensions in the matrix.

[0112] Optionally, the preset data fitting algorithm may include but is not limited to linear regression, polynomial regression, neural network regression, etc., and may be specifically set according to the actual application scenario.

[0113] The disclosed embodiment determines multiple equation relationships corresponding to multiple first identifiers, and processes the multiple equation relationships using a preset data fitting algorithm to obtain error values ​​in multiple dimensions. By fitting with the preset data fitting algorithm, more accurate error values ​​that are more in line with actual scenarios can be obtained, further improving the accuracy and effectiveness of equipment calibration.

[0114] In one embodiment, the equation relationship also includes at least one of a scaling difference and a measurement difference, and the scaling difference is determined based on the relative position relationship between the first marker and the center position of the calibration piece, and the relative position relationship between the second marker and the center position of the calibration piece.

[0115] Exemplarily, the equation relationship also includes scaling difference and measurement difference. Among them, due to factors such as the quality of the calibration piece, suction stress, and temperature of the mounting head, scaling errors may occur, which are non-systematic errors and have large randomness. Therefore, the scaling difference corresponding to the scaling error is introduced into the equation relationship to improve the accuracy of the error value calculation, but the scaling difference is not used as a reference value for adjusting the calibration. The measurement error can be considered as a residual in the calculation process. There will be a residual after each group of identifications is calculated. When this residual is small enough, it can be considered that the calculated error value has a high accuracy.

[0116] In one example, the scaling difference can be determined based on the relative position relationship between the first mark and the center position of the calibration piece and the relative position relationship between the second mark and the center position of the calibration piece. That is, the scaling difference can be set to represent the error vector in the direction to the center of the calibration piece, and its magnitude is linearly related to the distance from the mark to the center position of the calibration piece. The scaling of all positions on the calibration piece can be considered as diverging or shrinking from the center outward, and the deformation degree is greater the closer to the outer edge.

[0117] In the embodiments of the present disclosure, the equation relationship also includes a scaling difference and a measurement difference. Since the scaling difference and the measurement difference do not belong to systematic errors, by adding the scaling difference and the measurement difference to the equation relationship, the influence of other factors such as random errors on position alignment can be taken into account during the calculation of the error value, thereby further improving the accuracy of the calculated error value and being suitable for more application scenarios.

[0118] In one embodiment, calibrating the position of the placement head and / or the stage according to the error value includes:

[0119] Determining a compensation value corresponding to the placement head according to the error value, and adjusting the position of the placement head according to the compensation value; and / or,

[0120] According to the error value, a compensation value corresponding to the carrier is determined, and the position of the carrier is adjusted according to the compensation value.

[0121] For example, during the calibration process, a compensation value is calculated based on the error value, and the compensation value is used to adjust the position of the device. Different adjustment schemes correspond to different compensation values, which can be determined based on actual application scenarios.

[0122] In one example, if the calibration method is to adjust the placement head, the compensation value corresponding to the placement head is determined according to the error value, and the position of the placement head is adjusted according to the compensation value; if the calibration method is to adjust the carrier, the compensation value corresponding to the carrier is determined according to the error value, and the position of the carrier is adjusted according to the compensation value.

[0123] Exemplarily, if the calculated error value is the error of the first identifier relative to the second identifier, then when calculating the compensation value corresponding to the placement head, the inversion processing can be performed, and when calculating the compensation value of the carrier, the inversion processing is not required; if the calculated error value is the error of the second identifier relative to the first identifier, then when calculating the compensation value corresponding to the placement head, the inversion processing is not required, and when calculating the compensation value of the carrier, the inversion processing is required.

[0124] In the embodiments of the present disclosure, during the calibration process, the compensation value corresponding to the placement head can be determined based on the error value, and the position of the placement head can be adjusted. The compensation value corresponding to the carrier can also be determined based on the error value, and the position of the carrier can be adjusted. By adjusting the position of the placement head and / or the carrier, the placement head and the carrier are aligned to ensure the accuracy of chip placement.

[0125] In one embodiment, acquiring a first image corresponding to the first identifier and a second image corresponding to the second identifier includes:

[0126] When the relative positional relationship between the placement head and the carrier meets a preset condition, a first image corresponding to the first mark and a second image corresponding to the second mark are acquired.

[0127] Exemplarily, when acquiring the first image and the second image, it is necessary to acquire the images when the relative position relationship between the mounting head and the carrier meets a preset condition, wherein the preset condition can be set according to an actual application scenario.

[0128] In a possible implementation, the relative position between the mounting head and the carrier when the mounting head is pressed down to the mounting position during chip mounting by the chip mounting device can be a relative position corresponding to a preset condition, and when the relative position relationship between the two meets the relative position, the first image and the second image are acquired. In one example, the mounting head can be controlled to be pressed down, and the first image and the second image can be acquired through a coaxial camera.

[0129] In the embodiment of the present disclosure, when the relative position between the mounting head and the carrier meets the preset conditions, the first image and the second image are acquired, thereby ensuring the accuracy of the error value subsequently calculated based on the first image and the second image, and improving the accuracy of equipment calibration.

[0130] In one embodiment, the first mark is set as a dot, the second mark is set as a ring, and determining the first coordinate data of the first mark and the second coordinate data of the second mark according to the first image and the second image includes:

[0131] When the center position of the first mark on the first image and the center position of the second mark on the second image do not coincide, the center coordinate data of the first mark is determined as the first coordinate data and the center coordinate data of the second mark is determined as the second coordinate data.

[0132] Exemplarily, the first mark is set as a dot, and the second mark is set as a ring. In one example, the diameter of the dot is less than or equal to the inner diameter of the ring.

[0133] After acquiring the first image and the second image, since the first mark is set as a dot and the second mark is set as a ring, the first image and the second image are overlapped in the same coordinate system. Based on the image, it can be directly determined whether the center positions of the first mark and the second mark coincide. If the two coincide, it means that the calibration sheet and the alignment plate are accurately aligned and no calibration is required. If the two do not coincide, it means that there is a deviation in the positions of the two and a precise calibration is required. In one example, the calibration sheet is adsorbed on the alignment plate and the first image and the second image are acquired. At this time, the overlapping images of the two can be regarded as the overlap of the first image containing the first mark and the second image containing the second mark.

[0134] Optionally, when the center position of the first marker and the corresponding center position of the second marker do not coincide, it is necessary to calculate the error value based on the coordinate data of the markers, wherein the center coordinate data of the first marker is determined as the first coordinate data corresponding to the first marker, and the center coordinate data of the second marker is determined as the second coordinate data corresponding to the second marker.

[0135] Figure 6 is a schematic diagram of a first image and a second image according to an exemplary embodiment, referring to Figure 6 As shown, whether calibration is required is determined based on whether the dot of the first mark coincides with the center of the circle of the second mark. Figure 6 The dot in the upper right corner and the center of the circle do not overlap, indicating that the calibration sheet and the alignment plate are not aligned and need to be calibrated.

[0136] In the embodiment of the present disclosure, the first mark is set as a dot and the second mark is set as a ring. It is possible to quickly and accurately determine whether there is a deviation between the dot and the ring based on the image, so that the error value can be calculated when there is a position deviation, thereby improving the efficiency of calibration and being suitable for more application scenarios.

[0137] Figure 7 FIG. 1 is a flow chart of a calibration method for a chip mounting device according to an exemplary embodiment. Figure 7 As shown, pre-alignment is performed when loading. After the calibration sheet is transferred to the carrier, the angle of the calibration sheet is corrected according to the position of the calibration sheet and the placement head, and the center is moved to the bottom of the placement head. The placement head presses down to adsorb the calibration sheet to complete the loading. The loading process of the alignment plate is the same as that of the calibration sheet. The angle is corrected by the carrier adsorption and then moved to the bottom of the placement head.

[0138] After the pre-alignment of the loading is completed, the mark is identified and fine alignment is performed. Specifically, the first mark on the calibration piece is identified by the upper lens of the image acquisition device, and the deflection of the upper and lower lenses of the image acquisition device is preset to 0. At the same time, the mounting head is pressed down completely vertically, and the deflection is also 0. The first round of pressing and fitting is directly performed. After completion, the lower camera is used to locate the first mark in the field of view of the calibration piece after pressing down, and it corresponds one-to-one with the coordinates before pressing down. The affine transformation matrix is ​​calculated to obtain the first calibration matrix, which is used to compensate for the lens coaxial error + the verticality error of the mounting head pressing down. After the first round of calibration is completed, the mounting head presses down and absorbs the calibration piece in place. At this time, the upper lens identifies the first mark of the calibration piece, and the lower lens identifies the second mark of the alignment plate. At the same time, the one-to-one correspondence between the first mark and the second mark is guaranteed. Finally, the rotation and translation relationship between the first mark of the calibration piece and the second mark of the alignment plate is calculated to compensate, and the lens coaxial error and the verticality error of the mounting head pressing down are corrected to complete the secondary pressing operation.

[0139] After the second pressing operation, multiple rounds of precision calibration are performed, and further calibration is performed based on the position information of the first mark and the second mark after pressing. Specifically, as shown in formula (3), the calibration piece alignment error △ is decomposed into: "offset error Trans", "rotation error Rotate", "scaling error Magni (related to the quality of the calibration piece, suction stress and placement head temperature)" and "measurement error Residual", where the offset error value corresponding to the offset error and the rotation error value corresponding to the rotation error are reference values ​​for calibration, and the scaling error and measurement error are non-systematic errors with large randomness. Therefore, the scaling difference corresponding to the scaling error and the measurement difference corresponding to the measurement error only participate in the calculation process, not in the calibration process, to ensure the accuracy of the calculation of the offset error and rotation error.

[0140] (3)

[0141] In this embodiment, the first mark is set as a dot, i.e., a circle mark, and the second mark is set as a circle, i.e., a circle mark. The overall deflection of the calibration sheet will cause each "circle mark" on the sheet to show a different "concentric deviation" from the "circle mark" on the alignment plate, such as Figure 6 . According to the global position of each circle mark on the calibration sheet and its concentric deviation, an equation is established, and the three unknowns "Trans", "Rotate" and "Magni" are solved by linear regression.

[0142] For example, the coordinate system of the mark point is used to describe each deviation vector, where each offset is split into x and y components as shown in formulas (4) and (5). Figure 8 As shown, the Magni component can be decomposed into Mx and My directions;

[0143] (4)

[0144] (5)

[0145] In one example, the error vector from the mark to the center of the calibration piece is regarded as a scaling error Magni, whose magnitude (magnitude) is linearly related to the distance from the mark to the center of the calibration piece, such as Fig. 9 As shown, the scaling of all positions on the calibration piece diverges or contracts from the center outward, and the degree of deformation is greater toward the outer edge.

[0146] The coordinates of the mark point are (X, Y). Since the Magni component is the direction of the center line, as shown in formulas (6) and (7), the vector angle is It can be obtained through the mark point coordinates and center distance D.

[0147] (6)

[0148] (7)

[0149] As shown in Figures (8) and (9), the linear characteristics of the scaling error and the center distance are obtained (hereinafter Magni_x is abbreviated as M x , Magni_y is abbreviated as M below y ) Scaling error in the X direction and scaling error in the Y direction.

[0150] (8)

[0151] (9)

[0152] The overall deflection angle of the calibration piece that causes the rotation offset R is defined as , then the xy component of the rotation offset in the coordinate system is R x , R y It can be obtained by rotating around a fixed point using formulas (10) and (11).

[0153] (10)

[0154] (11)

[0155] M x , M y and R x , R y Substituting into formula (4) and (5) respectively, we can obtain formula (12) and (13).

[0156] (12)

[0157] (13)

[0158] After rearrangement, we get formula (14) (15).

[0159] (14)

[0160] (15)

[0161] Since the deflection angle is generally is very close to 0°, and The derivative is 0 at 0, so when calculating, Considered as 0; simplify the equation group, organize all mark point data into a matrix form as shown in formula (16), use the least squares method to perform linear regression analysis, and solve Magni, Sin and Tx, Ty.

[0162] (16)

[0163] The error value is calculated ( , T x , T y ), the error value is negated, the system is error compensated, and the position of the placement head and / or the carrier is adjusted. In one example, Used to adjust the angle position, T x , T y Used to adjust the plane position. Then perform the pressing operation again, recalculate the error value after the pressing is completed, and perform error compensation again until the measured error value is within the preset range to complete the calibration.

[0164] In one example, after the calibration is completed, the bar grid images around the calibration sheet and the alignment plate can be collected for subsequent verification reference.

[0165] Through this embodiment, the accuracy of a single error correction is high, and it can be repeatedly verified after calibration, the accuracy is controllable, and the calibration process is fast and stable, which is suitable for more production needs.

[0166] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0167] Based on the same inventive concept, the embodiment of the present application also provides a calibration device for a chip mounting device for implementing the calibration method for a chip mounting device involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the calibration device for one or more chip mounting devices provided below can refer to the limitations of the calibration method for a chip mounting device above, and will not be repeated here.

[0168] In an exemplary embodiment, Fig.10As shown, a calibration device 1000 of a chip mounting device is provided, the device comprises a mounting head and a carrier, a calibration sheet is adsorbed on the mounting head, an alignment plate is placed on the carrier, a first mark is provided on the calibration sheet, and a second mark corresponding to the first mark is provided on the alignment plate, the device comprises:

[0169] An acquisition module 1010 is used to acquire a first image corresponding to the first identifier and a second image corresponding to the second identifier;

[0170] A first determining module 1020, configured to determine first coordinate data of the first identifier and second coordinate data of the second identifier according to the first image and the second image;

[0171] A second determination module 1030 is used to determine a position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; and determine the error values ​​of the multiple dimensions corresponding to the position deviation value based on the association relationship between the position deviation value and the error values ​​of the multiple dimensions;

[0172] The calibration module 1040 is used to calibrate the position of the placement head and / or the carrier according to the error value to obtain a calibrated chip placement device.

[0173] In one embodiment, the second determining module is further configured to:

[0174] Determine a position deviation value between the first marker and the second marker according to the first coordinate data and the second coordinate data;

[0175] Based on the association relationship between the identified position deviation value and the error values ​​of the multiple dimensions, the error values ​​of the multiple dimensions corresponding to the position deviation value are determined.

[0176] In one embodiment, the error values ​​of the multiple dimensions include an offset error value and a rotation error value, and the second determination module is further configured to:

[0177] Determine a first correlation relationship between the position deviation value and the offset error value, and a second correlation relationship between the position deviation value and the rotation error value;

[0178] The error values ​​of the multiple dimensions are determined according to the first association relationship, the second association relationship and the position deviation value.

[0179] In one embodiment, a plurality of first marks are provided on the calibration sheet, a plurality of second marks are provided on the alignment plate, the first marks correspond to the second marks one by one, and the second determination module is further used for:

[0180] Based on the correlation between the position deviation value and the error values ​​of multiple dimensions, determining the equation relationship corresponding to each first identifier according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier;

[0181] The error values ​​of the multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers.

[0182] In one embodiment, the second determining module is further configured to:

[0183] Determine a plurality of equation relationships corresponding to the plurality of first identifiers;

[0184] The multiple equation relationships are processed using a preset data fitting algorithm to obtain error values ​​of the multiple dimensions.

[0185] In one embodiment, the equation relationship also includes at least one of a scaling difference and a measurement difference, and the scaling difference is determined based on the relative position relationship between the first marker and the center position of the calibration piece, and the relative position relationship between the second marker and the center position of the calibration piece.

[0186] In one embodiment, the calibration module is further used for:

[0187] Determining a compensation value corresponding to the placement head according to the error value, and adjusting the position of the placement head according to the compensation value; and / or,

[0188] According to the error value, a compensation value corresponding to the carrier is determined, and the position of the carrier is adjusted according to the compensation value.

[0189] In one embodiment, the acquisition module is further used for:

[0190] When the relative positional relationship between the placement head and the carrier meets a preset condition, a first image corresponding to the first mark and a second image corresponding to the second mark are acquired.

[0191] In one embodiment, the first identifier is set as a dot, the second identifier is set as a ring, and the first determining module is further configured to:

[0192] When the center position of the first mark on the first image and the center position of the second mark on the second image do not coincide, the center coordinate data of the first mark is determined as the first coordinate data and the center coordinate data of the second mark is determined as the second coordinate data.

[0193] Each module in the calibration device of the chip mounting device can be implemented in whole or in part by software, hardware and a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each module.

[0194] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Fig.11 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the first image, the second image and other data involved in the method described in this embodiment. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a calibration method for a chip mounting device is implemented.

[0195] Those skilled in the art will understand that Fig.11 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0196] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0197] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0198] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0199] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0200] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0201] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0202] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A calibration method for chip mounting equipment, characterized in that: The device comprises a mounting head and a carrier, a calibration sheet is adsorbed on the mounting head, an alignment plate is placed on the carrier, a first mark is provided on the calibration sheet, and a second mark corresponding to the first mark is provided on the alignment plate, and the method comprises: Control the placement head to press down and fit, determine a first calibration matrix according to the relative position relationship of the first mark before and after the calibration sheet is pressed down; and calibrate the position of the placement head using the first calibration matrix to obtain a chip placement device after initial calibration; For the chip mounting equipment after the initial calibration, controlling the mounting head to press down and mount, and obtaining a first image corresponding to the first mark and a second image corresponding to the second mark; Determine first coordinate data of the first marker and second coordinate data of the second marker according to the first image and the second image; Determine the position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; determine the error values ​​of the multiple dimensions corresponding to the position deviation value based on the association relationship between the position deviation value and the error values ​​of multiple dimensions; the error values ​​of the multiple dimensions include an offset error value and a rotation error value, and determine the error values ​​of the multiple dimensions corresponding to the position deviation value based on the association relationship between the position deviation value and the error values ​​of multiple dimensions, including: determine a first association relationship between the position deviation value and the offset error value, and a second association relationship between the position deviation value and the rotation error value; determine the error values ​​of the multiple dimensions according to the first association relationship, the second association relationship and the position deviation value; According to the error value, the position of the placement head and / or the carrier is calibrated, and the placement head is controlled to press down and perform calibration again until the error value is within a preset range, thereby obtaining a calibrated chip placement device.

2. The method according to claim 1, characterized in that: The calibration sheet is provided with a plurality of first marks, the alignment plate is provided with a plurality of second marks, the first marks and the second marks correspond to each other one by one, and the error values ​​of the plurality of dimensions corresponding to the position deviation value are determined based on the correlation between the position deviation value and the error values ​​of the plurality of dimensions, including: Based on the correlation between the position deviation value and the error values ​​of multiple dimensions, determining the equation relationship corresponding to each first identifier according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier; The error values ​​of the multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers.

3. The method according to claim 2, characterized in that The determining the error values ​​of the multiple dimensions according to the multiple equation relationships corresponding to the multiple first identifiers includes: Determine a plurality of equation relationships corresponding to the plurality of first identifiers; The multiple equation relationships are processed using a preset data fitting algorithm to obtain error values ​​of the multiple dimensions.

4. The method according to claim 3, characterized in that The equation relationship also includes at least one of a scaling difference and a measurement difference, and the scaling difference is determined based on the relative position relationship between the first mark and the center position of the calibration piece, and the relative position relationship between the second mark and the center position of the calibration piece.

5. The method according to claim 1, characterized in that The step of calibrating the position of the placement head and / or the stage according to the error value comprises: Determining a compensation value corresponding to the placement head according to the error value, and adjusting the position of the placement head according to the compensation value; and / or, According to the error value, a compensation value corresponding to the carrier is determined, and the position of the carrier is adjusted according to the compensation value.

6. The method according to claim 1, characterized in that The acquiring a first image corresponding to the first identifier and a second image corresponding to the second identifier includes: When the relative position relationship between the placement head and the carrier meets a preset condition, a first image corresponding to the first mark and a second image corresponding to the second mark are acquired.

7. The method according to claim 1, characterized in that The first mark is set as a dot, the second mark is set as a ring, and determining the first coordinate data of the first mark and the second coordinate data of the second mark according to the first image and the second image includes: When the center position of the first mark on the first image and the center position of the second mark on the second image do not coincide, the center coordinate data of the first mark is determined as the first coordinate data and the center coordinate data of the second mark is determined as the second coordinate data.

8. A calibration device for chip mounting equipment, characterized in that: The device comprises a mounting head and a carrier, wherein a calibration sheet is adsorbed on the mounting head, an alignment plate is placed on the carrier, a first mark is arranged on the calibration sheet, and a second mark corresponding to the first mark is arranged on the alignment plate. The device comprises: A control module, used to control the placement head to press down and fit, determine a first calibration matrix according to the relative position relationship of the first mark before and after the calibration sheet is pressed down, and calibrate the position of the placement head using the first calibration matrix to obtain a chip placement device after initial calibration; An acquisition module, used to acquire a first image corresponding to the first identifier and a second image corresponding to the second identifier; A first determining module, used for determining first coordinate data of the first identifier and second coordinate data of the second identifier according to the first image and the second image; A second determination module is used to determine a position deviation value between the first identifier and the second identifier according to the first coordinate data and the second coordinate data; based on the association relationship between the position deviation value and the error values ​​of multiple dimensions, determine the error values ​​of the multiple dimensions corresponding to the position deviation value; the error values ​​of the multiple dimensions include an offset error value and a rotation error value, and the second determination module is further used to: determine a first association relationship between the position deviation value and the offset error value, and a second association relationship between the position deviation value and the rotation error value; determine the error values ​​of the multiple dimensions according to the first association relationship, the second association relationship and the position deviation value; The calibration module is used to calibrate the position of the placement head and / or the carrier according to the error value, and control the placement head to press down and perform calibration again until the error value is within a preset range, thereby obtaining a calibrated chip placement device.

9. The device according to claim 8, characterized in that The calibration sheet is provided with a plurality of first marks, the alignment plate is provided with a plurality of second marks, the first marks and the second marks correspond to each other one by one, and the second determination module is further used for: Based on the correlation between the position deviation value and the error values ​​of multiple dimensions, determining the equation relationship corresponding to each first identifier according to the first coordinate data of each first identifier and the second coordinate data of the corresponding second identifier; The error values ​​of the multiple dimensions are determined according to the multiple equation relationships corresponding to the multiple first identifiers.

10. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

Images