Wafer bonding device

Abstract

The invention relates to a wafer bonding device, which comprises a cleaning shed, a bearing assembly, a film cutting assembly, a film pasting assembly, a bonding lower cavity assembly and a bonding upper cavity assembly, and is characterized in that the bearing assembly is used for bearing quartz glass to move below the film cutting assembly and the film pasting assembly, and the film cutting assembly is used for cutting a glue film on the quartz glass; the film pasting assembly is used for tightly pasting an adhesive film and quartz glass, the bonding lower cavity assembly is used for placing the quartz glass with the film pasted and driving the quartz glass with the film pasted to ascend during bonding, and the bonding upper cavity assembly is used for adsorbing a wafer and providing a vacuum environment and downward pressure so as to enable bonding to be tighter. According to the invention, the bonding lower cavity assembly is raised, the bonding upper cavity assembly is pressed down, and the formed closed body is vacuumized, so that the bonding effect is effectively improved; according to the invention, the quartz glass film pasting device and the wafer bonding device are integrated, so that the production efficiency is effectively improved; the whole device is protected by the clean shed, and the device is effectively prevented from being polluted.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer preparation, and more specifically, to a wafer bonding device. Background Art

[0002] With the rapid development of science and technology, the semiconductor industry occupies an increasingly important position worldwide. In this industry, in semiconductor equipment, wafers are a basic material for manufacturing semiconductor chips. A 12-inch wafer with a thickness of 50 microns is as thin as paper, and it is difficult to carry out subsequent processes such as lithography and wet processing. In order to save costs, all companies hope not to replace existing equipment, which creates the demand for wafer bonding;

[0003] The bonding machine is used to bond two wafers or substrates with different properties face to face, and combine them into one by applying certain external conditions, such as pressure, temperature and voltage. Two wafers can be bonded or wafers and quartz glass can be bonded. Wafer bonding technology is widely used in advanced packaging, MEMS, 3D interconnection, LED manufacturing and special substrate manufacturing, and is becoming an indispensable R&D and production tool in the semiconductor and MEMS fields. The existing traditional method is to stack wafers and quartz glass and then press them together to form a bond, which has problems such as poor bonding effect, low efficiency and easy pollution. Summary of the invention

[0004] The technical problem to be solved by the present invention is poor bonding effect, low efficiency and easy contamination. In view of the above defects of the prior art, a wafer bonding device is provided.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A wafer bonding device is constructed, wherein the device comprises a frame, a clean room, a bearing assembly, a film cutting assembly, a film pasting assembly, a bonding lower cavity assembly and a bonding upper cavity assembly, wherein the bearing assembly, the film cutting assembly, the film pasting assembly, the bonding lower cavity assembly and the bonding upper cavity assembly are all arranged in the clean room, and the clean room is arranged on the frame;

[0007] The bearing assembly is movably disposed below the film cutting assembly and the film attaching assembly, and is used to bear the quartz glass;

[0008] The film cutting assembly is arranged at the side of the film sticking assembly and is used to cut the adhesive film so that the size and shape of the adhesive film are the same as those of the quartz glass;

[0009] The film sticking assembly is located at one side of the frame and is used to stick a film on the quartz glass;

[0010] The bonding lower cavity assembly is arranged on the other side of the frame and is used to place the film-attached quartz glass;

[0011] The bonding upper cavity assembly is arranged above the bonding lower cavity assembly and is used to absorb the wafer so as to complete the bonding between the wafer and the film-attached quartz glass.

[0012] Furthermore, the bonding lower cavity assembly includes a protective cover and a lower cavity assembly, the protective cover and the lower cavity assembly are both connected to the frame, the protective cover is used to protect the lower cavity assembly, the lower cavity assembly includes a lower cavity shell, a bonding lifting assembly, a lifting assembly mounting plate, a lifting platform guide rail and a lifting platform, the lifting assembly mounting plate is arranged inside the lower cavity shell and fixedly connected to the lower cavity shell, the lifting platform guide rail is arranged on the inner wall of the lower cavity shell, the lifting platform is slidably connected to the lower cavity shell through the lifting platform guide rail, the bonding lifting assembly is arranged on the lifting assembly mounting plate, the bonding lifting assembly output end is fixedly connected to the lifting platform and is used to drive the lifting platform to perform lifting movement, and the lifting platform is used to place the film-bonded quartz glass.

[0013] Furthermore, the bonded upper cavity assembly is located above the bonded lower cavity assembly, and the bonded upper cavity assembly includes a bonded upper cavity base, a bonded downward pressure cylinder and an upper cavity assembly, the bonded upper cavity base is fixedly connected to the frame, the bonded downward pressure cylinder is arranged on the bonded upper cavity base, the output end of the bonded downward pressure cylinder is connected to the upper cavity assembly, and is used to drive the upper cavity assembly to be pressed downward so that the upper cavity and the lower cavity form an enclosed space.

[0014] Furthermore, the upper cavity assembly includes an upper cavity connecting plate, an upper cavity shell, a bonding suction plate and a bonding vacuum assembly. The upper cavity assembly is connected to the output end of the bonding downward pressure cylinder through the upper cavity connecting plate, and the upper cavity shell is connected to the cavity connecting plate. The bonding suction plate is located in the upper cavity shell and is used to adsorb wafers. The bonding vacuum assembly is used to vacuum the interior of the upper cavity shell.

[0015] Furthermore, the outer shell diameter of the lower cavity is smaller than the outer shell diameter of the upper cavity, and the lifting platform is arranged corresponding to the bonding suction plate.

[0016] Furthermore, the supporting assembly includes a horizontal module and a supporting platform, the supporting platform is provided with a heating element and an adsorption element for adsorbing and heating the quartz glass, the supporting platform is arranged above the horizontal module, and the horizontal module is used to drive the quartz glass to move under the film cutting assembly and the film pasting assembly.

[0017] Furthermore, the horizontal module includes a first linear module and a second linear module, the second linear module is arranged above the first linear module, the supporting platform is arranged above the second linear module, and the first linear module and the second linear module cooperate to move the supporting platform along the direction of the first linear module and the direction of the second linear module.

[0018] Furthermore, the film cutting assembly includes a film cutting base frame, a film cutting mounting plate, a rotating module and a cutting knife assembly. The film cutting base frame is fixedly connected to the film sticking assembly, the film cutting mounting plate is fixedly connected to the film cutting base frame, and the film cutting mounting plate is provided with a through hole; the rotating module is located above the film cutting mounting plate, and the cutting knife assembly is provided below the film cutting mounting plate. The rotating module is connected to the cutting knife assembly through the through hole, and is used to drive the cutting knife assembly to rotate relative to the quartz glass.

[0019] Furthermore, the cutting knife assembly includes a film cutting cylinder and a film cutting knife. The output end of the film cutting cylinder is connected to the film cutting knife and is used to drive the film cutting knife to move up and down relative to the quartz glass. The rotating module and the film cutting cylinder cooperate to drive the film cutting knife to rotate and move up and down. The film cutting knife is used to cut the adhesive film so that the size and shape of the adhesive film are the same as those of the quartz glass.

[0020] Furthermore, the film sticking assembly includes a film sticking base frame, a film sticking lifting assembly, a pressing assembly and an attaching assembly. The film sticking base frame is fixedly connected to the frame, one end of the film sticking lifting assembly is connected to the film sticking base frame, and the other end is connected to the pressing assembly, the output end of the pressing assembly is connected to the attaching assembly, the film sticking lifting assembly is used to drive the pressing assembly and the attaching assembly to perform lifting and lowering movements, and the pressing assembly is used to drive the attaching assembly to press downward.

[0021] Furthermore, the attaching assembly includes an attaching box, an attaching roller and an attaching vacuum assembly, the attaching box is connected to the pressing assembly, the attaching roller is arranged in the attaching box and connected to the attaching box, the attaching roller is used to attach a film to the quartz glass, and the attaching vacuum assembly is used to perform vacuum treatment on the attaching box.

[0022] The beneficial effects of the present invention are:

[0023] 1. The present invention proposes that the lower cavity assembly on which the film-attached wafer is placed moves upward during bonding, and the upper cavity assembly on which the wafer is adsorbed moves downward during bonding, which is conducive to a tighter pressing of the quartz glass and the wafer, and effectively improves the bonding effect;

[0024] 2. The present invention proposes to perform vacuum treatment on the closed space formed by the bonding lower cavity assembly and the bonding upper cavity assembly, which is beneficial to avoid bubbles during bonding and further improves the bonding effect;

[0025] 3. The present invention proposes the integration of quartz glass film lamination and wafer bonding device, which is beneficial to the subsequent processing of wafers and effectively improves production efficiency;

[0026] 4. The present invention proposes to use various components in the clean room protection device to effectively avoid contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is an overall structural diagram of a wafer bonding device in one embodiment of the present invention;

[0028] Figure 2 is a three-dimensional diagram of a wafer bonding device hidden in a clean booth in one embodiment of the present invention;

[0029] Figure 3 is a three-dimensional diagram of a carrier assembly in one embodiment of the present invention;

[0030] Figure 4 is a three-dimensional diagram of a membrane cutting assembly according to an embodiment of the present invention;

[0031] Figure 5 is a three-dimensional diagram of a film sticking assembly in one embodiment of the present invention;

[0032] Figure 6 is a three-dimensional diagram of an attachment roller in one embodiment of the present invention;

[0033] Figure 7 is a three-dimensional diagram of a bonding lower cavity assembly in one embodiment of the present invention;

[0034] Figure 8 is a bottom view of a bonding lower cavity assembly in one embodiment of the present invention;

[0035] Fig. 9 is a three-dimensional diagram of a bonding upper cavity assembly in one embodiment of the present invention;

[0036] Fig.10 1 is a bottom view of a bonding lower cavity assembly in one embodiment of the present invention.

[0037] Explanation of reference numbers: 1. Rack; 2. Clean room; 3. Load-bearing assembly; 4. Film cutting assembly; 5. Film pasting assembly; 6. Bonding lower chamber assembly; 7. Bonding upper chamber assembly;

[0038] 11. Control box; 31. Horizontal module; 311. Load-bearing guide rail; 312. First linear module; 313. Second linear module; 32. Load-bearing platform; 321. Load-bearing box; 322. Heating bottom plate; 323. Load-bearing suction plate;

[0039] 41. Film cutting chassis; 42. Film cutting mounting plate; 43. Rotating module; 431. Rotating driving member; 432. Rotating shaft; 44. Cutter assembly; 441. Rotating connecting plate; 442. Film cutting cylinder guide rail; 443. Film cutting cylinder connecting plate; 444. Film cutting cylinder; 445. Film cutting knife;

[0040] 51. Film sticking chassis; 52. Film sticking lifting assembly; 521. Film sticking lifting driving member; 522. Cylinder mounting plate; 523. Lifting guide shaft; 524. Film sticking lifting guide rail; 525. Guide rail connecting block; 53. Pressing assembly; 531. Film sticking pressing cylinder; 532. Cylinder guide shaft; 54. Attaching assembly; 541. Attaching box; 542. Attaching roller;

[0041] 61. Protective cover; 62. Lower cavity assembly; 621. Lower cavity housing; 622. Bonding lifting assembly; 6221. Bonding lifting drive member; 6222. Synchronous wheel; 6223. Transmission shaft; 623. Lifting assembly mounting plate; 624. Lifting platform guide rail; 625. Lifting platform; 626. Limiting piece;

[0042] 71. Upper cavity base frame; 72. Bonding downward pressure cylinder; 73. Upper cavity assembly; 731. Upper cavity connecting plate; 732. Upper cavity lifting guide rail; 733. Upper cavity connecting block; 734. Upper cavity shell; 735. Bonding suction plate; 736. Vacuum control switch. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0044] Please refer to the attached Figure 1-Figure 10 The present invention proposes a wafer bonding device, comprising a clean booth 2, a bearing assembly 3, a film cutting assembly 4, a film attaching assembly 5, a bonding lower cavity assembly 6 and a bonding upper cavity assembly 7, wherein the bearing assembly 3, the film cutting assembly 4, the film attaching assembly 5, the bonding lower cavity assembly 6 and the bonding upper cavity assembly 7 are all arranged in the clean booth 2, and the clean booth 2 is arranged on a frame 1;

[0045] The carrying component 3 is movably arranged below the film cutting component 4 and the film sticking component 5, and is used to carry the quartz glass; the film cutting component 4 is arranged on the side of the film sticking component 5, and is used to cut the adhesive film so that the adhesive film and the quartz glass have the same size and shape; the film sticking component 5 is located on one side of the frame 1, and is used to stick the film on the quartz glass; the bonding lower cavity component 6 is arranged on the other side of the frame 1, and is used to place the film-sticked quartz glass; the bonding upper cavity component 7 is arranged above the bonding lower cavity component 6, and is used to adsorb the wafer, so that the wafer and the film-sticked quartz glass are bonded.

[0046] In this embodiment, the clean room 2, the bearing assembly 3, the film sticking assembly 5, the bonding lower chamber assembly 6 and the bonding upper chamber assembly 7 are all arranged on the frame 1; the bearing assembly 3 includes a horizontal module 31 and a bearing platform 32, and the bearing platform 32 is provided with an adsorption member and a heating member for adsorbing and heating the quartz glass. The adsorption member is conducive to preventing the quartz glass from slipping, and the heating member is conducive to the quartz glass film sticking more tightly. The bearing platform 32 is arranged on the horizontal module 31, and the horizontal module 31 drives the quartz glass to move under the film cutting assembly 4 and the film sticking assembly 5; the film cutting assembly 4 is arranged on the side of the film sticking assembly 5, and the film cutting assembly 4 includes a rotating module 43 The cutting assembly 44 is used to cut the film so that the film is the same size and shape as the quartz glass. In a specific embodiment, the carrying assembly 3 transports the quartz glass to the bottom of the film cutting assembly 4. The film material is in the form of a sheet. The sheet film can be covered on the quartz glass manually. The film cutting assembly 4 cuts the sheet film to the same size and shape as the quartz glass. The film pasting assembly 5 includes a film pasting lifting assembly 52, a pressing assembly 53, an attaching assembly 54 and an attaching vacuum assembly. The film pasting lifting assembly 52 is used to drive the pressing assembly 53. The pressing assembly 53 is used to drive the attaching assembly 54 to press downward, the attaching assembly 54 is used to apply film to the quartz glass, and the attaching vacuum assembly is used to perform vacuum treatment. In a specific embodiment, after the lifting assembly drives the pressing assembly 53 and the attaching assembly 54 to rise, the carrying assembly 3 transports the quartz glass to the bottom of the film attaching assembly 5, and the pressing assembly 53 drives the attaching assembly 54 to press downward, so that the attaching assembly 54 and the carrying assembly 3 form a closed space, and the attaching axis vacuum assembly performs vacuum treatment on the closed space, which is beneficial to avoid bubbles when the quartz glass is applied with film, and further Improve the bonding effect of the quartz glass film; the bonding lower chamber assembly 6 is arranged on the other side of the frame 1, and the bonding lower chamber assembly 6 includes a bonding lifting assembly 622 and a lower chamber assembly 62, and the lower chamber assembly 62 includes a lifting platform 625, and the bonding lifting assembly 622 is used to drive the lifting platform 625 to perform lifting movement, and the lifting platform 625 is used to place the film-bonded quartz glass. In a specific embodiment, the film-bonded quartz glass is manually transported from the bearing assembly 3 to the lifting platform 625. When bonding is performed, the bonding lifting assembly 622 will drive the lifting platform 625 to perform an upward movement, which is conducive to a tighter bonding between the quartz glass and the wafer;The bonding upper cavity assembly 7 is arranged above the bonding lower cavity assembly 6. The bonding upper cavity assembly 7 includes a bonding downward pressure cylinder 72, a lower cavity assembly 62 and a bonding vacuum assembly. The lower cavity assembly 62 includes a bonding suction plate 735. The bonding downward pressure cylinder 72 is used to drive the bonding suction plate 735 to perform a downward pressure movement. The bonding suction plate 735 is used to adsorb the wafer. The bonding vacuum assembly is used to perform a vacuum treatment. In a specific embodiment, the bonding upper cavity assembly 7 drives the quartz glass to rise, and the bonding lower cavity assembly 6 drives the wafer to press down, which is conducive to a tighter bonding between the wafer and the quartz glass. The upper cavity assembly 73 and the lower cavity assembly 62 form a closed space. The bonding vacuum assembly performs a vacuum treatment on the closed space, which effectively avoids the generation of bubbles during bonding and further improves the bonding effect.

[0047] The present invention proposes that the lower cavity assembly 62 on which the film-attached wafer is placed moves upward during bonding, and the bonding upper cavity assembly 7 on which the wafer is adsorbed moves downward during bonding, which is beneficial to the tighter pressing of the quartz glass and the wafer, and effectively improves the bonding effect; the present invention proposes to vacuum the enclosed space formed by the bonding lower cavity assembly 6 and the bonding upper cavity assembly 7, which is beneficial to avoid the generation of bubbles during bonding and further improves the bonding effect; the present invention proposes to integrate the quartz glass film attachment and the wafer bonding device, which is beneficial to the subsequent processing of the wafer and effectively improves the production efficiency; the present invention proposes to use the components in the clean shed 2 protection device to effectively avoid contamination.

[0048] Please refer to Figure 2 and Figure 3 The bearing assembly 3 includes a horizontal module 31 and a bearing platform 32. The horizontal module 31 includes a first linear module 312 and a second linear module 313. The second linear module 313 is arranged above the first linear module 312. The bearing platform 32 is arranged above the second linear module 313. The first linear module 312 and the second linear module 313 cooperate to move the bearing platform 32 along the direction of the first linear module 312 and the direction of the second linear module 313. The bearing platform 32 is provided with a heating element and an adsorption element for adsorbing and heating the quartz glass. The bearing platform 32 is arranged above the horizontal module 31. The horizontal module 31 is used to drive the quartz glass to move below the film cutting assembly 4 and the film pasting assembly 5.

[0049] In the specific implementation: the horizontal module 31 includes a bearing rail 311, a first linear module 312 and a second linear module 313, and the bearing platform 32 includes a bearing box 321, a heating base plate 322 and a bearing suction plate 323; the bearing rail 311 is fixedly connected to the frame 1, and in a specific embodiment, the bearing rail 311 includes two; the first linear module 312 is located between the two bearing rails 311, and the first linear module 312 is parallel to the bearing rail 311, and the second linear module 313 is slidably arranged on the first linear module 312, and the first linear module 312 drives the second linear module 313 to move along the direction of the first linear module 312; The box body 321 is slidably arranged on the second linear module 313, and the second linear module 313 drives the bearing box body 321 to move along the direction of the second linear module 313; the first linear module 312 and the second linear module 313 cooperate to move to drive the quartz glass to move under the film cutting assembly and the film pasting assembly 5; the heating bottom plate 322 is located on the bearing box body 321 and is fixedly connected to the bearing box body 321, and a bearing suction plate 323 is provided above the heating bottom plate 322 and is used to heat the bearing suction plate 323, and the bearing suction plate 323 is used to absorb the quartz glass; the absorption of the quartz glass effectively prevents the quartz glass from slipping, and heating the quartz glass is conducive to a tighter film pasting of the quartz glass.

[0050] Please refer to Figure 2 and Figure 4 The film cutting assembly 4 includes a film cutting base frame 41, a film cutting mounting plate 42, a rotating module 43 and a cutting knife assembly 44. The film cutting base frame 41 is fixedly connected to the frame 1, and the film cutting mounting plate 42 is fixedly connected to the film cutting base frame 41. The film cutting mounting plate 42 is provided with a through hole; the rotating module 43 is located above the film cutting mounting plate 42, and the cutting knife assembly 44 is arranged below the film cutting mounting plate 42. The rotating module 43 is connected to the cutting knife assembly 44 through the through hole, and is used to drive the cutting knife assembly 44 to rotate relative to the quartz glass; the cutting knife assembly 44 includes a film cutting cylinder 444 and a film cutting knife 445. The output end of the film cutting cylinder 444 is connected to the film cutting knife 445, and is used to drive the film cutting knife 445 to perform lifting and lowering movements relative to the quartz glass. The rotating module 43 and the film cutting cylinder 444 cooperate to drive the film cutting knife 445 to rotate and lift. The film cutting knife 445 is used to cut the adhesive film so that the adhesive film and the quartz glass have the same size and shape.

[0051] In the specific implementation, the film cutting assembly 4 includes a film cutting base frame 41, a film cutting mounting plate 42, a rotating module 43 and a cutting knife assembly 44, the rotating module 43 includes a rotating driving member 431 and a rotating shaft 432, the cutting knife assembly 44 includes a rotating connecting plate 441, a film cutting cylinder guide rail 442, a film cutting cylinder connecting plate 443, a film cutting cylinder 444 and a film cutting knife 445; the film cutting base frame 41 is fixedly connected to the film sticking assembly 5, the film cutting mounting plate 42 is fixedly connected to the film cutting base frame 41, the rotating driving member 431 and the rotating shaft 432, the cutting knife assembly 44 includes a rotating connecting plate 441, a film cutting cylinder guide rail 442, a film cutting cylinder connecting plate 443, a film cutting cylinder 444 and a film cutting knife 445. 31 is located on the film cutting mounting plate 42 and is used to drive the rotating shaft 432 to rotate. The film cutting mounting plate 42 is provided with a through hole. One end of the rotating shaft 432 is located above the film cutting mounting plate 42, and the other end passes through the through hole to connect with the cutter assembly 44 and is used to drive the cutter assembly 44 to rotate. The rotating connecting plate 441 is connected to the output end of the rotating shaft 432. A film cutting cylinder guide rail 442 is provided below the rotating connecting plate 441. The film cutting cylinder connecting plate 443 is slidably connected to the film cutting cylinder guide rail 442. The cylinder 444 is fixedly connected to the film cutting cylinder connecting plate 443, and the output end of the film cutting cylinder 444 is connected to the film cutting knife 445, and is used to drive the film cutting knife 445 to move up and down; the rotating module 43 and the film cutting cylinder 444 cooperate to drive the film cutting knife 445 to rotate and move up and down, and the film cutting knife 445 is used to cut the film so that the size and shape of the film and the quartz glass are the same; in a specific embodiment, the rotating driving member 431 can be a servo motor; the bearing assembly 3 will The quartz glass is transported to the bottom of the film cutting assembly 4. The film is in sheet form when it is loaded. The sheet film can be covered on the quartz glass manually. The film cutting assembly 4 cuts the sheet film to the same size and shape as the quartz glass; the film cutting cylinder connecting plate 443 and the film cutting cylinder guide rail 442 are slidably connected to absorb the rotational displacement error, avoid the film cutting knife 445 from getting stuck when rotating to cut the film, and facilitate more accurate film cutting; the quartz glass is filmed to avoid contamination of the quartz glass and facilitate subsequent processing of the wafer.

[0052] Please refer to Figure 2 , Figure 5 and Figure 6 The film sticking component 5 includes a film sticking base frame 51, a film sticking lifting component 52, a pressing component 53 and an attaching component 54. The film sticking base frame 51 is fixedly connected to the frame 1. One end of the film sticking lifting component 52 is connected to the film sticking base frame 51, and the other end is connected to the pressing component 53. The output end of the pressing component 53 is connected to the attaching component 54. The film sticking lifting component 52 is used to drive the pressing component 53 and the attaching component 54 to perform lifting and lowering movements, and the pressing component 53 is used to drive the attaching component 54 to press downward; the attaching component 54 includes an attaching box 541, an attaching roller 542 and an attaching vacuum assembly. The attaching box 541 is connected to the pressing component 53. The attaching roller 542 is arranged in the attaching box 541 and connected to the attaching box 541. The attaching roller 542 is used to apply film to the quartz glass, and the attaching vacuum assembly is used to perform vacuum treatment on the attaching box 541.

[0053] In specific implementation: the film sticking assembly 5 includes a film sticking base frame 51, a film sticking lifting assembly 52, a pressing assembly 53 and an attaching assembly 54. The film sticking lifting assembly 52 includes a film sticking lifting driving member 521, a cylinder mounting plate 522, a lifting guide shaft 523, a film sticking lifting guide rail 524 and a guide rail connecting block 525. The pressing assembly 53 includes a film sticking pressing cylinder 531 and a cylinder guide shaft 532. The attaching assembly 54 includes an attaching box 541, an attaching roller 542 and an attaching vacuum assembly. The film sticking base frame 51 is fixedly connected to the frame 1. The lifting drive member is arranged on the film sticking base frame 51, and the output end of the lifting drive member is connected to the cylinder mounting plate 522. A film sticking lifting guide rail 524 is arranged on the inner side of the film sticking base frame 51. The cylinder mounting plate 522 is connected to the film sticking lifting guide rail 524 through a guide rail connecting block 525, and is slidably connected to the film sticking base frame 51. The film sticking pressing cylinder 531 is arranged on the cylinder mounting plate 522. One end of the lifting guide shaft 523 is connected to the cylinder mounting plate 522, and the other end is connected to the sticking box body 541. The sticking roller 542 is arranged in the sticking box body 541 and is connected to the sticking roller 542. The attachment box 541 is fixedly connected, and the lifting drive component is used to drive the cylinder mounting plate 522, the film pressing cylinder 531, the attachment box 541 and the attachment roller 542 to perform lifting and lowering movements synchronously; the output end of the film pressing cylinder 531 passes through the cylinder mounting plate 522 and is connected to the attachment box 541 through the lifting guide shaft 523, and the film pressing cylinder 531 is used to drive the attachment box 541 and the attachment roller 542 to press downward; in a specific embodiment, the film lifting drive component 521 can adopt a servo motor; the lifting component drives the pressing component After 53 and the attaching assembly 54 rise, the carrying assembly 3 transports the quartz glass with the surface covered with the adhesive film to the bottom of the film attaching assembly 5, and the pressing assembly 53 drives the attaching assembly 54 to press downward, and the attaching assembly 54 applies downward pressure to the surface of the quartz glass, and the attaching assembly 54 and the carrying assembly 3 form a closed space, and the attaching shaft vacuum assembly vacuumizes the closed space, and the attaching roller 542 tightly attaches the film to the surface of the quartz glass, which is beneficial to avoid bubbles when the quartz glass is filmed, and further improves the bonding effect of the quartz glass film.

[0054] Please refer to Figure 2 , Figure 7 and Figure 8The bonding lower cavity assembly 6 includes a protective cover 61 and a lower cavity assembly 62, both of which are connected to the frame 1, the protective cover 61 is used to protect the lower cavity assembly 62, the lower cavity assembly 62 includes a lower cavity shell 621, a bonding lifting assembly 622, a lifting assembly mounting plate 623 and a lifting platform 625, the lifting assembly mounting plate 623 is arranged inside the lower cavity shell 621, and is fixedly connected to the lower cavity shell 621, the lifting platform 625 is slidably connected to the lower cavity shell 621, the bonding lifting assembly 622 is arranged on the lifting assembly mounting plate 623, the output end of the bonding lifting assembly 622 is fixedly connected to the lifting platform 625, and is used to drive the lifting platform 625 to perform lifting movement, and the lifting platform 625 is used to place the film-attached quartz glass.

[0055] In the specific implementation: the bonding lower cavity assembly 6 includes a protective cover 61 and a lower cavity assembly 62, the lower cavity assembly 62 includes a lower cavity shell 621, a bonding lifting assembly 622, a lifting assembly mounting plate 623, a lifting platform guide rail 624 and a lifting platform 625, and the bonding lifting assembly 622 includes a bonding lifting drive 6221, a synchronous wheel 6222 and a transmission shaft 6223; the protective cover 61 is located at the periphery of the lower cavity assembly 62 and is used to protect the lower cavity assembly 62, the lifting assembly mounting plate 623 is arranged inside the lower cavity shell 621 and is fixedly connected to the lower cavity shell 621, the bonding lifting drive 6221 and the synchronous wheel 6222 are located on the lifting assembly mounting plate 623, the bonding lifting drive 6221 drives the synchronous wheel 6222 to rotate through the transmission belt, and the output end of the synchronous wheel 6222 is connected to the transmission shaft 6223 and is used to drive the transmission shaft 6223 to move up and down. movement; the lifting platform guide rail 624 is arranged on the inner wall of the lower cavity shell 621, and the lifting platform 625 is slidably connected to the lower cavity shell 621 through the lifting platform guide rail 624, and the output end of the transmission shaft 6223 is connected to the lifting platform 625 and is used to drive the lifting platform 625 to perform lifting movement; in a specific embodiment, the bonding lifting drive member 6221 can adopt a servo motor; a limit plate 626 is provided on the lifting platform 625, which is conducive to the placement and positioning of the film-bonded quartz glass on the one hand, and on the other hand, the bonding force is controlled to avoid damage to the quartz glass and the wafer; the film-bonded quartz glass is manually transported from the carrying component 3 to the lifting platform 625, and the side of the quartz glass without film bonding is facing the bonding upper cavity component 7. When bonding is performed, the bonding lifting component 622 will drive the lifting platform 625 to perform an upward movement, which is conducive to tighter bonding between the quartz glass and the wafer and better bonding effect.

[0056] Please refer to Figure 2 , Fig. 9 and Fig.10The bonding upper cavity assembly 7 is located above the bonding lower cavity assembly 6. The bonding upper cavity assembly 7 includes a bonding upper cavity base frame 71, a bonding downward pressure cylinder 72 and an upper cavity assembly 73. The bonding upper cavity base frame 71 is fixedly connected to the frame 1. The bonding downward pressure cylinder 72 is arranged on the bonding upper cavity base frame 71. The output end of the bonding downward pressure cylinder 72 is connected to the upper cavity assembly 73 and is used to drive the upper cavity assembly 73 to press downward so that the upper cavity and the lower cavity form a closed space; the upper cavity assembly 73 includes an upper cavity connecting plate 731, The upper cavity shell 734, the bonding suction plate 735 and the bonding vacuum assembly, the upper cavity assembly 73 is connected to the output end of the bonding downward pressure cylinder 72 through the upper cavity connecting plate 731, the upper cavity shell 734 is connected to the cavity connecting plate, the bonding suction plate 735 is located in the upper cavity shell 734 and is used to adsorb the wafer, and the bonding vacuum assembly is used to vacuum the interior of the upper cavity shell 734; the diameter of the lower cavity shell 621 is smaller than the diameter of the upper cavity shell 734, and the lifting platform 625 and the bonding suction plate 735 are correspondingly arranged.

[0057] In the specific implementation: the bonding upper cavity assembly 7 includes a bonding upper cavity base frame 71, a bonding downward pressure cylinder 72 and an upper cavity assembly 73, the upper cavity assembly 73 includes an upper cavity connecting plate 731, an upper cavity lifting guide rail 732, an upper cavity connecting block 733, an upper cavity shell 734, a bonding suction plate 735, a bonding vacuum assembly and a vacuum control switch 736; the bonding upper cavity base frame 71 is fixedly connected to the frame 1, and a control box 11 is provided on the frame 1, and the control box 11 is used to control the bonding switch, the bonding downward pressure cylinder 72 and the upper cavity assembly 73; The cylinder 72 is arranged on the bonded upper cavity base 71 and is fixedly connected to the bonded upper cavity base 71. The output end of the bonded downward pressure cylinder 72 is connected to the upper cavity assembly 73 and is used to drive the upper cavity assembly 73 to press downward; the upper cavity connecting plate 731 is fixedly connected to the output end of the bonded downward pressure cylinder 72, and an upper cavity lifting guide rail 732 is provided on the inner side of the upper cavity base 71. The upper cavity connecting plate 731 is connected to the upper cavity lifting guide rail 732 through the upper cavity connecting block 733, and forms a slidable connection with the upper cavity base 71. The cavity shell 734 is connected to the cavity connecting plate, and the bonding suction plate 735 is located in the upper cavity shell 734 and is used to absorb the wafer; the diameter of the lower cavity shell 621 is smaller than the diameter of the upper cavity shell 734, and the lifting platform 625 is correspondingly arranged with the bonding suction plate 735, which is conducive to the alignment of the quartz glass and the wafer, making the bonding more accurate; the bonding pressing cylinder 72 drives the upper cavity assembly 73 to press down, and the bonding lifting assembly 622 drives the lifting platform 625 to rise, and the upper cavity assembly 73 and the lower cavity form a cavity closed space, and the bonding The vacuum pumping component performs vacuum treatment on the closed space of the cavity, effectively avoiding the generation of bubbles during bonding; the vacuum control switch 736 is arranged on one side of the bonding upper cavity base 71, and is used to control whether the closed space of the cavity is vacuumed; in a specific embodiment, the bonding suction plate 735 is provided with a limiting ring, and the wafer can be manually adsorbed on the bonding suction plate 735, and the limiting ring is used to achieve accurate placement; turn on the vacuum control switch 736 and the control box 11 to achieve vacuum bonding, effectively improving the bonding effect.

[0058] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0059] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer bonding device, comprising a frame, It is characterized in that It comprises a clean room, a bearing assembly, a film cutting assembly, a film pasting assembly, a bonding lower cavity assembly and a bonding upper cavity assembly, wherein the bearing assembly, the film cutting assembly, the film pasting assembly, the bonding lower cavity assembly and the bonding upper cavity assembly are all arranged in the clean room, and the clean room is arranged on the frame; The bearing assembly is movably disposed below the film cutting assembly and the film attaching assembly, and is used to bear the quartz glass; The film cutting assembly is arranged at the side of the film sticking assembly and is used to cut the adhesive film so that the size and shape of the adhesive film are the same as those of the quartz glass; The film sticking assembly is located at one side of the frame and is used to stick a film on the quartz glass; The bonding lower cavity assembly is arranged on the other side of the frame and is used to place the film-attached quartz glass; The bonding upper cavity assembly is arranged above the bonding lower cavity assembly and is used to absorb the wafer so as to complete the bonding between the wafer and the film-attached quartz glass.

2. The wafer bonding device according to claim 1, It is characterized in that The bonding lower cavity assembly includes a protective cover and a lower cavity assembly, both of which are connected to the frame, and the protective cover is used to protect the lower cavity assembly; the lower cavity assembly includes a lower cavity shell, a bonding lifting assembly, a lifting assembly mounting plate, a lifting platform guide rail and a lifting platform, the lifting assembly mounting plate is arranged in the lower cavity shell and fixedly connected to the lower cavity shell, the lifting platform guide rail is arranged on the inner wall of the lower cavity shell, the lifting platform is slidably connected to the lower cavity shell through the lifting platform guide rail, the bonding lifting assembly is arranged on the lifting assembly mounting plate, the bonding lifting assembly output end is fixedly connected to the lifting platform, and is used to drive the lifting platform to perform lifting movement, and the lifting platform is used to place the film-attached quartz glass.

3. The wafer bonding device according to claim 2, It is characterized in that The bonded upper cavity assembly is located above the bonded lower cavity assembly, and the bonded upper cavity assembly includes a bonded upper cavity base, a bonded downward pressure cylinder and an upper cavity assembly. The bonded upper cavity base is fixedly connected to the frame, and the bonded downward pressure cylinder is arranged on the bonded upper cavity base. The output end of the bonded downward pressure cylinder is connected to the upper cavity assembly and is used to drive the upper cavity assembly to be pressed downward so that the upper cavity and the lower cavity form an enclosed space.

4. The wafer bonding device according to claim 3, It is characterized in that The upper cavity assembly includes an upper cavity connecting plate, an upper cavity shell, a bonding suction plate and a bonding vacuum assembly. The upper cavity assembly is connected to the output end of the bonding downward pressure cylinder through the upper cavity connecting plate. The upper cavity shell is connected to the cavity connecting plate. The bonding suction plate is located in the upper cavity shell and is used to adsorb wafers. The bonding vacuum assembly is used to vacuum the interior of the upper cavity shell.

5. The wafer bonding device according to claim 4, It is characterized in that The outer shell diameter of the lower cavity is smaller than the outer shell diameter of the upper cavity, and the lifting platform is arranged correspondingly to the bonding suction plate.

6. The wafer bonding device according to claim 1, It is characterized in that The bearing assembly includes a horizontal module and a bearing platform. The bearing platform is provided with a heating element and an adsorption element for adsorbing and heating the quartz glass. The bearing platform is arranged above the horizontal module. The horizontal module is used to drive the quartz glass to move under the film cutting assembly and the film pasting assembly.

7. The wafer bonding device according to claim 6, It is characterized in that The horizontal module includes a first linear module and a second linear module, the second linear module is arranged above the first linear module, the supporting platform is arranged above the second linear module, and the first linear module and the second linear module cooperate to move the supporting platform along the direction of the first linear module and the direction of the second linear module.

8. The wafer bonding device according to claim 1, It is characterized in that The film cutting assembly includes a film cutting base frame, a film cutting mounting plate, a rotating module and a cutter assembly. The film cutting base frame is fixedly connected to the film sticking assembly, the film cutting mounting plate is fixedly connected to the film cutting base frame, and the film cutting mounting plate is provided with a through hole; the rotating module is located above the film cutting mounting plate, and the cutter assembly is arranged below the film cutting mounting plate. The rotating module is connected to the cutter assembly through the through hole, and is used to drive the cutter assembly to rotate relative to the quartz glass.

9. The wafer bonding device according to claim 8, It is characterized in that The cutting knife assembly includes a film cutting cylinder and a film cutting knife. The output end of the film cutting cylinder is connected to the film cutting knife and is used to drive the film cutting knife to move up and down relative to the quartz glass. The rotating module and the film cutting cylinder cooperate to drive the film cutting knife to rotate and move up and down. The film cutting knife is used to cut the adhesive film so that the adhesive film and the quartz glass have the same size and shape.

10. The wafer bonding apparatus according to claim 1, It is characterized in that The film sticking assembly includes a film sticking base frame, a film sticking lifting assembly, a pressing assembly and an attaching assembly. The film sticking base frame is fixedly connected to the frame, one end of the film sticking lifting assembly is connected to the film sticking base frame, and the other end is connected to the pressing assembly, the output end of the pressing assembly is connected to the attaching assembly, the film sticking lifting assembly is used to drive the pressing assembly and the attaching assembly to perform lifting and lowering movements, and the pressing assembly is used to drive the attaching assembly to press downward.

11. The wafer bonding device according to claim 10, It is characterized in that The attaching assembly includes an attaching box, an attaching roller and an attaching vacuum assembly, the attaching box is connected to the pressing assembly, the attaching roller is arranged in the attaching box and connected to the attaching box, the attaching roller is used to attach a film to the quartz glass, and the attaching vacuum assembly is used to perform vacuum treatment on the attaching box.

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