Sound production assembly and electronic equipment

Abstract

The invention relates to the field of electronic equipment, aims to solve the problem that some electronic equipment sound production devices are large in thickness and are not beneficial to thinning of the electronic equipment, and provides a sound production assembly and the electronic equipment. The sounding assembly includes a base and an open enclosure wall. The base portion is provided with a sounding element. The open enclosure wall edge is connected to the base part; the open enclosure bulkhead is an unclosed enclosure bulkhead with a circumferential notch, and the surface, away from the base part, of the open enclosure bulkhead is a first surface; the surfaces on the two sides of the circumferential notch of the open enclosure bulkhead are second surfaces respectively. The side face, close to the circumferential notch, of the base part is a third surface, the two ends of the third surface are connected to the openings in the two ends of the first surface through the two second surfaces to define a sealing face, and the sealing face is used for being attached to an equipment body of the electronic equipment in a sealed mode; the sounding element corresponds to the sound cavity, so that the sound cavity serves as a front cavity or a rear cavity of the sounding element; and the circumferential gap is used for communicating with a sound outlet hole formed in the equipment main body. The invention has the beneficial effects of low thickness and reliable sealing.

Description

[0001] This application is based on a divisional application with application number 202310699912.1, application date June 13, 2023, and invention name “Sound-generating component, electronic device, and assembly method”. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the field of electronic equipment, and in particular, to a sound-generating component, an electronic device, and an assembly method. Background Art

[0003] Electronic devices such as mobile phones and tablet computers need to be equipped with sound-generating devices (such as speakers) to produce sound.

[0004] The known sound-generating device is provided with sound cavities of different shapes or volumes to obtain better audio effects. However, the sound cavity setting in the known technology has a great influence on the thickness of the sound-generating device, which is not conducive to the increasingly stringent thinning requirements of electronic devices. Summary of the invention

[0005] The present application provides a sound-generating component and an electronic device to solve the problem that the sound-generating components of some electronic devices are relatively thick, which is not conducive to thinning the electronic device.

[0006] In the first aspect, an embodiment of the present application provides a sound-emitting component, including a base and an open surrounding wall. The base is provided with a sound-emitting element, and the sound-emitting element is used for electroacoustic conversion. The open surrounding wall is connected to the base along the thickness direction of the base; the open surrounding wall is an unclosed surrounding wall with a circumferential notch, and the surface of the open surrounding wall away from one end of the base is a U-shaped first surface; the surfaces on both sides of the circumferential notch of the open surrounding wall are second surfaces. The side of the base close to the circumferential notch is a third surface, and the two ends of the third surface are respectively connected to the two end openings of the first surface through two second surfaces to form a circumferentially closed sealing surface, and the sealing surface is used to seal and fit to the device body of an electronic device, so that the device body closes the circumferential notch and the side of the open surrounding wall away from the base to form a sound cavity; the sound-emitting element corresponds to the sound cavity, so that the sound cavity serves as the front cavity or the rear cavity of the sound-emitting element; the circumferential notch is used to connect the sound outlet hole set on the device body.

[0007] After the sound-emitting component in the embodiment of the present application is installed on the device body, the sound-emitting element is energized to vibrate and produce sound, and the sound is transmitted to one side of the circumferential notch through the enclosed sound cavity and is emitted outward through the sound outlet hole.

[0008] The sound-emitting component in the embodiment of the present application is formed into a sound cavity by arranging an open surrounding wall with a circumferential notch on the base, and then closing the sound-emitting component with a device body that is fitted with a sealing surface.

[0009] Compared with the U-shaped sound outlet opening on the existing sealed chamber, the circumferential notch of the sound-emitting component of this embodiment is an unobstructed open structure and is significantly enlarged, which has a good effect on improving audio performance. At the same time, by adopting the non-U-shaped circumferential notch, the size of the sound-emitting component in the thickness direction can be effectively reduced.

[0010] The closed sealing surface formed by the first surface and the third surface is connected by the second surface on both sides of the circumferential notch to realize the sound cavity formed by the fitting seal. While ensuring a low structural thickness, the sealing operation is convenient and the sealing effect is good.

[0011] In a possible implementation, the first surface is located in a plane; the second surface and the third surface are both located in another plane obliquely intersecting with the first surface.

[0012] In this embodiment, the first surface is located in a plane, and the second surface and the third surface are both located in another plane obliquely intersecting with the first surface, so that sealing of surfaces with different inclination angles can be achieved.

[0013] In a possible implementation manner, the angle between the second surface and the first surface is an obtuse angle.

[0014] In this embodiment, the angle between the second surface and the first surface is an obtuse angle, which is conducive to the continuous application of glue on the first surface and the second surface, and is conducive to forming a continuous sealing layer, thereby ensuring reliable circumferential sealing.

[0015] In a possible implementation manner, the angle between the second surface and the first surface is 105-150°.

[0016] In this embodiment, the angle is suitable for a snug seal with the fourth surface.

[0017] In a possible implementation manner, the first surface and the second surface are connected at a junction thereof by a transitional connection via a first arc surface.

[0018] In this embodiment, the first surface and the second surface are connected at a junction thereof by a transitional connection of a first arc surface, which helps to ensure the continuity and smoothness of the gluing on the first surface and the second surface.

[0019] In a possible implementation, the base defines an internal cavity, one of the internal cavity and the sound cavity serves as a front cavity of the sound-emitting element, and the other of the internal cavity and the sound cavity serves as a rear cavity of the sound-emitting element.

[0020] In this embodiment, the internal chamber can be used as a front chamber or a rear chamber, which can be easily configured according to needs.

[0021] In a possible implementation, the open surrounding wall includes a rear wall and two side walls, the two side walls are respectively connected to two sides of the base and are spaced apart from each other; one end of the two side walls is connected and closed by the rear wall, and the other end defines a circumferential gap.

[0022] In this implementation, the structure can provide a rectangular sound-generating component, which is easy to process.

[0023] In a possible implementation, the end surface of the side wall and the rear wall away from the base are coplanar and constitute a first surface. The end surface of the side wall away from the rear wall constitutes a second surface.

[0024] In this embodiment, the structure can conveniently form the aforementioned first surface and second surface.

[0025] In the second aspect, an embodiment of the present application provides an electronic device, which includes a middle frame and the aforementioned sound-emitting component. The middle frame has a first plate surface and a second plate surface opposite to each other along its thickness direction; the middle frame is provided with a receiving groove recessed from the first plate surface, and the groove bottom surface of the receiving groove is provided with a through opening that passes through to the second plate surface, and the circumferential contour of the through opening is located on the inner side of the contour of the groove bottom surface of the receiving groove, so that a U-shaped groove bottom wall is formed between the groove bottom surface of the receiving groove and the second plate surface; the groove side surface of the receiving groove includes a fourth surface, and the fourth surface is provided with a sound outlet hole that passes through the outer circumferential surface of the middle frame. The sound-emitting component is matched with the receiving groove, and the first surface is sealed and fitted to the groove bottom wall, the second surface and the third surface are sealed and fitted to the fourth surface, and the circumferential notch corresponds to the sound outlet hole, and the sound-emitting element corresponds to the through opening.

[0026] The electronic device in this embodiment adopts the aforementioned sound-generating component, can be set to be thinner, and the sound-generating component and the middle frame are well sealed and are not prone to leakage.

[0027] In a possible implementation, the electronic device further includes a screen, which is attached to the second panel and closes the opening.

[0028] In this embodiment, the screen also serves as a structure for covering the opening, and no additional cover is required, which is conducive to reducing the thickness.

[0029] In a possible implementation manner, the screen and the bottom wall of the groove are sealed by a first adhesive.

[0030] In this implementation, the first adhesive can improve the sealing performance of the screen and the middle frame at the opening.

[0031] In a possible implementation, the electronic device further includes a sealing layer, which is annular in shape, and the through opening and the sound outlet are both located on the inner side of the sealing layer; one side of the sealing layer is in contact with the sealing surface, and the other side is in contact with the bottom surface of the accommodating groove and the fourth surface.

[0032] In this implementation, the through opening and the sound outlet hole are both located on the inner side of the sealing layer, and the enclosed sound cavity is isolated from the outside to ensure sealing.

[0033] In a possible implementation, the sealing layer includes a first rubber strip and a second rubber strip, both of which are U-shaped and connected end to end to form a closed ring extending along the sealing surface. The first surface is sealed to the bottom surface of the receiving groove by the first rubber strip. The second surface and the third surface are sealed to the fourth surface by the second rubber strip.

[0034] In this embodiment, the closed annular sealing layer can achieve sealing conveniently and reliably.

[0035] In a possible implementation manner, the fourth surface is parallel to the second surface and the third surface.

[0036] In this embodiment, the fourth surface is parallel to the second surface and the third surface, so that the second surface and the third surface can be sealed in the same plane, and can be sealed facing the fourth surface.

[0037] In a possible embodiment, the electronic device further includes a bearing plate assembly. The bearing plate assembly includes a first plate portion and a second plate portion, the first plate portion and the second plate portion are connected to form an L-shape bent at a set angle, the first plate portion is overlapped and connected to the fourth surface; the second plate portion is overlapped and connected to the portion of the bottom wall of the groove between the through opening and the fourth surface. The portion of the sealing surface corresponding to the bearing plate assembly is connected to the middle frame through the bearing plate assembly. The bearing plate assembly is provided with a through hole connecting the sound outlet and the sound cavity.

[0038] In this embodiment, by providing a bearing plate assembly, the circumferential gap is conveniently closed, and the sound hole and the sound cavity are connected through the via hole. The provided bearing plate assembly can be used to support a dustproof structure or other structures.

[0039] In a possible implementation, a portion of the groove bottom wall between the through opening and the fourth surface is concave to form a groove, and the second plate portion is accommodated in the groove so that the surface of the second plate portion away from the second plate surface is flush with the groove bottom surface of the accommodating groove.

[0040] In this embodiment, the second plate portion is accommodated by a groove formed by an inward concave groove, and the surface of the second plate portion away from the second plate surface is flush with the bottom surface of the accommodating groove. On the one hand, this side of the sealing layer is a planar seal, and on the other hand, there is additional space occupied in the thickness direction. The structure is compact and reasonable, which is conducive to the thinning of electronic equipment.

[0041] In a possible implementation manner, the second plate portion and a space between the groove and away from the fourth surface are connected by glue dispensing and sealing.

[0042] In this embodiment, a spacing space is set between the second plate portion and the groove away from the fourth surface, which reduces the precision requirement on the matching size of the second plate portion and the groove. At the same time, the connection strength between the load-bearing plate assembly and the middle frame is further improved by glue sealing, and leakage between the two can also be avoided.

[0043] In a possible implementation, the carrier plate assembly includes a carrier plate, a second adhesive backing, a dust screen and a third adhesive backing that are sequentially overlapped and connected; the dust screen is a porous structure, and the vias are formed by openings respectively provided in the carrier plate, the second adhesive backing and the third adhesive backing, and portions of the dust screen corresponding to the openings. A portion of the third adhesive backing is attached to the bottom surface of the groove, and another portion is attached to the fourth surface; and a portion of the sealing surface corresponding to the carrier plate is attached to the carrier plate.

[0044] In this embodiment, the supporting plate assembly of this structure can achieve dust protection at the sound outlet by carrying a dustproof net on the supporting plate, and is bonded to the middle frame by the third adhesive, ensuring that the supporting plate assembly is reliably connected to the middle frame.

[0045] In a possible implementation manner, the supporting board is a glass fiber board.

[0046] In this embodiment, the bearing plate is a glass fiber plate, which can achieve higher structural strength with smaller thickness.

[0047] In a possible implementation manner, a chamfer is provided at the edge line of the groove of the receiving groove.

[0048] In this embodiment, a chamfer is provided to facilitate the assembly of the sound generating component into the receiving groove.

[0049] On the third aspect, an embodiment of the present application provides an electronic device, including a device body, a sound-emitting component and a sealing layer. The device body includes a substrate portion and a side wall portion, the substrate portion is provided with a through opening; the side wall portion is connected to the substrate portion; and the side wall portion is provided with a sound outlet. The first surface corresponds to the substrate portion, the second surface and the third surface correspond to the side wall portion, and the circumferential notch corresponds to the sound outlet. The sealing layer is annular, and the opening and the sound outlet are both located on the inner side of the sealing layer; one side of the sealing layer fits the sealing surface, and the other side fits the substrate portion and the side wall portion. The sound-emitting component and the device body form a sound cavity, and one side of the circumferential notch of the sound cavity is connected to the sound outlet; the sound-emitting element corresponds to the sound cavity.

[0050] The electronic device in this embodiment uses the aforementioned sound-emitting component and can be set to be thinner. The sound-emitting component and the device body are sealed by the above-mentioned sealing layer, and the sealing performance is good and leakage is not likely to occur.

[0051] In a possible implementation, the device body further includes a cover plate, which is overlapped and connected to a side of the base plate away from the sound-emitting component and closes the opening.

[0052] In this embodiment, the sound cavity is sealed by covering the opening with a cover plate.

[0053] In a possible implementation manner, a first adhesive backing is provided between the cover plate and the base plate portion, and the first adhesive backing is annular and surrounds the outer side of the through opening.

[0054] In this embodiment, the first adhesive can be used to achieve sealing between the cover plate and the base plate, thereby reducing leakage.

[0055] In one possible implementation, the device body has a middle frame and a back shell, the middle frame includes a substrate portion and a side wall portion, and the back shell serves as a cover; or, the device body has a middle frame and a screen, the middle frame includes a substrate portion and a side wall portion, and the screen serves as a cover.

[0056] This embodiment provides different arrangements of electronic devices, suitable for different design requirements.

[0057] In a possible implementation, the side wall portion is vertically connected to the base plate portion, and a surface of the side wall portion close to the sound-emitting component is a fourth surface, and the fourth surface obliquely intersects with the base plate portion.

[0058] In this embodiment, the fourth surface intersects the substrate portion at an angle, so as to facilitate sealing the second surface, the third surface and the first surface.

[0059] In a fourth aspect, an embodiment of the present application provides an electronic device assembly method for assembling the aforementioned electronic device, the electronic device assembly method comprising:

[0060] Apply a circle of sealant extending along the circumference of the sealing surface on the sealing surface or the middle frame;

[0061] The sound generating assembly is installed into the receiving groove, and the sealing surface and the middle frame are sealed and fitted with a sealing layer formed by the sealant, and the sealing layer surrounds the through opening and the sound outlet hole on the inner side.

[0062] The electronic device assembly method in this embodiment can assemble the aforementioned electronic device, and the assembled electronic device has a small thickness and good sealing performance.

[0063] In a possible implementation manner, in the provided middle frame, a portion of the groove bottom wall between the through opening and the fourth surface is concave to form a groove;

[0064] The electronic device assembly method further includes:

[0065] A load-bearing plate assembly is provided, the load-bearing plate assembly comprises a first plate portion and a second plate portion, the first plate portion and the second plate portion are connected to form an L-shape bent at a set angle;

[0066] The first plate portion is overlapped and connected to the fourth surface, and the second plate portion is overlapped with the groove, and the surface of the second plate portion away from the second plate surface is flush with the bottom surface of the accommodating groove;

[0067] Sealing the space between the second plate portion and the groove away from the fourth surface by dispensing glue;

[0068] Make the sealing surface of the sound generating component corresponding to the portion of the bearing plate fit the bearing plate.

[0069] In this embodiment, the second plate of the carrier plate assembly is accommodated in the groove, and no additional thickness space is required, which is conducive to miniaturization; in addition, sealing is achieved by glue dispensing, which reduces leakage between the middle frame and the carrier plate assembly.

[0070] In a possible implementation, the sealant is made of soft silicone. The soft silicone forms an elastic sealing layer after moisture curing or UV curing. The sealing layer is sealed between the sound-emitting component and the middle frame.

[0071] In this embodiment, the elastic sealing layer formed by curing the soft silicone is used for sealing, and the sealing reliability is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0073] Figure 1 A schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0074] Figure 2 for Figure 1 A three-dimensional view of a portion of a structure in an electronic device;

[0075] Figure 3 for Figure 2 's expanded view;

[0076] Figure 4 A schematic diagram of the structure of a sound-generating component according to an embodiment of the present application;

[0077] Figure 5 for Figure 2 Section view along line AA;

[0078] Figure 6 for Figure 2 Sectional view along line BB;

[0079] Figure 7 for Figure 4 A schematic diagram of a sound-generating component after a sealing layer is applied thereto;

[0080] Figure 8A partial structural view of an electronic device in another embodiment of the present application;

[0081] Fig. 9 for Figure 8 's expanded view;

[0082] Fig.10 To adopt Figure 8 A cross-sectional view of an electronic device having a structure;

[0083] Fig.11 for Fig. 9 A schematic diagram of the structure of the carrier board assembly in FIG.

[0084] Fig.12 is a schematic diagram of an embodiment of an alternative structure for replacing the aforementioned middle frame;

[0085] Fig.13 A schematic diagram of another embodiment of the electronic device of the present application;

[0086] Fig.14 A schematic diagram of another embodiment of the electronic device of the present application;

[0087] Fig.15 for Fig.14 A schematic diagram of the structure of a sound-generating component of an electronic device;

[0088] Fig.16 for Fig.15 A schematic diagram of a sound-generating component after a sealing layer is applied thereto;

[0089] Fig.17 It is a schematic diagram of another embodiment of the electronic device of the present application.

[0090] Description of main component symbols:

[0091] Electronic equipment 100, 200, 300

[0092] Equipment body 101,201

[0093] Screen 102

[0094] Battery 103

[0095] Back cover 104

[0096] Circuit board 105

[0097] Board part 202

[0098] Side wall portion 203

[0099] Cover 204

[0100] Mounting base 210

[0101] Middle frame 10

[0102] Groove bottom wall 11

[0103] Sound component 12

[0104] First adhesive 13

[0105] Base 14

[0106] Open wall 15

[0107] Sound element 16

[0108] Back wall 17

[0109] Sidewall 18

[0110] Sealing layer 19

[0111] First rubber strip 20

[0112] Second rubber strip 21

[0113] Loading plate assembly 30

[0114] The first plate portion 31

[0115] The second plate portion 32

[0116] Glue Dispensing 33

[0117] Loading plate 34

[0118] Second adhesive 35

[0119] Dust screen 36

[0120] The third adhesive 37

[0121] Alternative structure 50

[0122] Thickness direction Y1

[0123] Accommodation slot C1

[0124] Groove C2

[0125] Port K1

[0126] Sound hole K2

[0127] Circumferential notch K3

[0128] Chamfer K4

[0129] Via K5

[0130] Opening K6

[0131] First board surface P1

[0132] Second board P2

[0133] First surface P3

[0134] Second surface P4

[0135] The third surface P5

[0136] Fourth surface P6

[0137] Sealing surface P7

[0138] The first arc surface P8

[0139] Groove bottom surface P9

[0140] Slot side P10

[0141] Outer surface P11

[0142] Installation space Q1

[0143] Sound cavity Q2

[0144] Internal chamber Q3

[0145] Interval space f1 DETAILED DESCRIPTION

[0146] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0147] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a centered element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a centered element. When an element is considered to be "set on" another element, it may be directly set on the other element or there may also be a centered element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0148] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "or / and" used herein includes any and all combinations of one or more related listed items.

[0149] Some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.

[0150] Example

[0151] For example, the SPK-BOX (Speaker Box) in electronic devices such as mobile phones is an electroacoustic device that converts electrical energy into acoustic energy. It can be powered on to vibrate and cause the air medium to fluctuate, thereby realizing the "electricity-force-sound" conversion. The known SPK-BOX usually includes a shell and a sound-generating element. The sound-generating element is arranged in the shell and can form a closed front cavity and rear cavity with the shell. When working, the diaphragm of the sound-generating element vibrates to emit sound, and the sound can be transmitted through the sound outlet channel opened on the shell and connected to the front cavity, finally realizing the sound of the SPK-BOX.

[0152] In order to obtain better sound quality, the front cavity / rear cavity needs to have certain size requirements, which limits the reduction of the size of the SPK-BOX, especially the reduction of the thickness of the SPK-BOX.

[0153] With the updating and iteration of electronic devices such as mobile phones, their thickness requirements are becoming thinner and thinner, and the problem arises that the currently commonly used sealed cavity-type sound cavity speakers are difficult to meet the cavity size requirements (especially the thickness size requirements).

[0154] The embodiments of the present application provide a sound-emitting component and an electronic device using the sound-emitting component, which can meet the requirements of cavity size while meeting the requirements of lower thickness size, which is conducive to the thinning design of the electronic device, and through a special sealing design, it can also ensure the sealing of the sound-emitting component on the entire electronic device, ensuring the waterproof and dustproof effect of the electronic device. An exemplary description will be given below.

[0155] See also Figure 1 This embodiment provides an electronic device 100, including a device body 101 and a sound-generating component 12. The sound-generating component 12 is installed on the device body 101. The sound-generating component 12 in this embodiment is an SPK-BOX, which is used to realize electroacoustic conversion and convert electrical energy into sound.

[0156] The electronic device 100 may be a mobile phone, a laptop computer, a tablet computer, a smart watch, smart glasses or other devices that require a sound-generating function.

[0157] In this embodiment, taking the electronic device 100 as a mobile phone as an example, the device body 101 includes a screen 102, a middle frame 10, a battery 103 and a back cover 104 stacked in sequence. The back cover 104 and the middle frame 10 form an installation space Q1, and the battery 103 is accommodated in the installation space Q1. The device body 101 may also include components such as a circuit board 105, which may be installed in the installation space Q1 and arranged side by side with the battery 103.

[0158] Of course, the structure of the above-mentioned device body 101 is only an example. In other embodiments, the device body 101 can also adopt other overlapping structures, which is not limited here.

[0159] See also Figure 2 and Figure 3 , the middle frame 10 has a first plate surface P1 and a second plate surface P2 facing each other along its thickness direction Y1. The middle frame 10 is provided with a receiving groove C1 recessed from the first plate surface P1, and a through hole K1 penetrating to the second plate surface P2 is provided on the groove bottom surface P9 of the receiving groove C1, and the circumferential contour of the through hole K1 is located inside the contour of the groove bottom surface P9 of the receiving groove C1, so that a U-shaped groove bottom wall 11 is formed between the groove bottom surface P9 of the receiving groove C1 and the second plate surface P2. The groove side surface P10 of the receiving groove C1 includes a fourth surface P6, and the fourth surface P6 is provided with a sound outlet hole K2 penetrating the outer circumferential surface P11 of the middle frame 10.

[0160] The screen 102 is attached to the second panel P2 and closes the opening K1. Figure 3 As shown in the figure, the screen 102 and the bottom wall 11 of the groove are sealed by the first adhesive 13. The first adhesive 13 can be set in a ring shape, which surrounds the outer periphery of the through-port K1, so that the screen 102 can reliably seal the through-port K1, avoid the connection between the bonding surface between the screen 102 and the second plate surface P2 and the through-port K1 to form a leakage channel, and ensure the sealing performance.

[0161] In other embodiments, the screen 102 and the second panel P2 may be sealed by fully spreading adhesive material, and it is sufficient to only seal the opening K1.

[0162] See also Figure 4 In this embodiment, the sound generating assembly 12 includes a base 14 and an open surrounding wall 15. The base 14 is provided with a sound generating element 16, which is used for electroacoustic conversion, for example, a known element that generates sound by driving a diaphragm to vibrate with an electromagnetic voice coil.

[0163] The open surrounding wall 15 is connected to the base 14 along the thickness direction Y1 of the base 14. The open surrounding wall 15 is an open surrounding wall with a circumferential notch K3, and the surface of the open surrounding wall 15 away from one end of the base 14 is a U-shaped first surface P3. The surfaces on both sides of the circumferential notch K3 of the open surrounding wall 15 are second surfaces P4. The side of the base 14 close to the circumferential notch K3 is a third surface P5, and the two ends of the third surface P5 are connected to the two end openings of the first surface P3 through two second surfaces P4, so as to form a circumferentially closed sealing surface P7.

[0164] The circumferential profile of the base 14 in this embodiment is roughly rectangular, and the open surrounding wall 15 includes a rear wall 17 and two side walls 18, which are respectively connected to the two sides of the base 14 and spaced opposite to each other; one end of the two side walls 18 is connected and closed by the rear wall 17, and the other end defines a circumferential gap K3. The end surfaces of the side walls 18 and the rear wall 17 away from the base 14 are coplanar and form a first surface P3; the end surface of the side wall 18 away from the rear wall 17 forms a second surface P4. That is, the rear wall 17 and the two side walls 18 are respectively located on three sides of a rectangle, and the open surrounding wall 15 has no solid material at the fourth side of the rectangle and is not closed in the circumference, forming a circumferential gap K3.

[0165] In other embodiments, the base 14 may also be in other shapes, such as a trapezoid, a circle, an ellipse, etc.; the corresponding open surrounding wall 15 may be in a circumferentially open trapezoid, a circumferentially open circle, a circumferentially open ellipse, etc., which is not limited here.

[0166] In this embodiment, the first surface P3 is located in a plane, for example, a plane parallel to the first plate surface P1 of the middle frame 10. The second surface P4 and the third surface P5 are both located in another plane obliquely intersecting the first surface P3.

[0167] Optionally, the angle between the second surface P4 and the first surface P3 is an obtuse angle, for example, the angle between the second surface P4 and the first surface P3 is 105-150°.

[0168] The first surface P3 and the second surface P4 are transitionally connected by a first arc surface P8, which helps to ensure the continuity and smoothness of the gluing on the first surface P3 and the second surface P4.

[0169] In this embodiment, optionally, a chamfer K4 is provided at the edge of the groove C1 to facilitate the sound generating component 12 to fit in.

[0170] See also Figure 5 and Figure 6 In the assembled state, the sound component 12 fits in the receiving groove C1 of the middle frame 10, the circumferential notch K3 corresponds to the sound hole K2, and the sound element 16 corresponds to the through-port K1. The first surface P3 is sealed to the bottom wall 11 of the groove, and the second surface P4 and the third surface P5 are sealed to the fourth surface P6, so that the middle frame 10 and the screen 102 close the circumferential notch K3 and the side of the open surrounding wall 15 away from the base 14 to form a sound cavity Q2; the sound element 16 corresponds to the sound cavity Q2, so that the sound cavity Q2 serves as the front cavity of the sound element 16; the circumferential notch K3 is connected to the sound hole K2. The thickness of the sound cavity Q2 includes the sum of the thickness defined in the open surrounding wall 15 and the thickness of the through-port K1. In this way, the sound component 12 with a smaller thickness can obtain a sound cavity Q2 with a larger thickness, which can meet the requirements of thinness of the electronic device 100 while maintaining the audio quality requirements.

[0171] In addition, an internal chamber Q3 can be set on the base 14 as the rear chamber of the sound element 16. The sound element 16 is located between the front chamber and the rear chamber. When the sound element 16 vibrates and makes sound, the sound produced can interact with the front chamber and the rear chamber to improve the sound quality.

[0172] When the sound-emitting component 12 in the embodiment of the present application is installed in the receiving groove C1 of the middle frame 10 of the electronic device 100, the sound-emitting element 16 is energized to vibrate and produce sound, and the sound is transmitted to one side of the circumferential notch K3 through the enclosed sound cavity Q2 (the front cavity in this embodiment) and is emitted outward through the sound outlet hole K2.

[0173] The sound-emitting component 12 in the embodiment of the present application is formed into a sound cavity Q2 by setting an open surrounding wall 15 with a circumferential notch K3 on the base 14, and then closing the sound-emitting component 12 by the device body 101 that fits the sealing surface P7. Compared with the existing "U-shaped" sound outlet channel using a closed sound cavity, the circumferential notch K3 of the sound-emitting component 12 in this embodiment is an unobstructed open structure and is significantly enlarged, which has a good effect on improving audio performance. At the same time, by using the circumferential notch K3 of the non-U-shaped structure, the size of the sound-emitting component 12 in the thickness direction Y1 can be effectively reduced, and the thickness is reduced by at least the thickness of the wall on one side, which is conducive to the thinning of the electronic device 100. In some embodiments, the thickness can be reduced by about 0.8mm, including about 0.7mm of the wall thickness on one side and 0.1mm of the thickness of the inner screen to avoid the screen.

[0174] In addition, the closed annular sealing surface P7 formed by the first surface P3 and the third surface P5 is connected by the second surface P4 on both sides of the circumferential notch K3, so as to realize the sound cavity Q2 formed by the non-coplanar first surface P3, the second surface P4 and the third surface P5 being sealed together, so that the sealing operation is convenient and the sealing effect is good while ensuring a low structural thickness.

[0175] In addition, for the implementation method in which the angle between the second surface P4 and the first surface P3 is an obtuse angle, the sound-emitting component 12 is directly pressed downward to achieve positive pressure between the first surface P3 and the bottom wall 11 of the groove, and to achieve inclined pressure between the second surface P4 and the third surface P5 and the fourth surface P6, thereby achieving multi-angle compression sealing with reliable sealing.

[0176] The electronic device 100 in this embodiment further includes a sealing layer 19. Figure 7, the sealing layer 19 is annular. The sealing layer 19 is formed by using CIPG (Cured in-place-gasket) process, applying glue along the circumference of the sealing surface P7, so that the glue surrounds the sealing surface P7 to form an annular glue material that continuously covers the first surface P3, the second surface P4 and the third surface P5; then, the glue on the sealing surface P7 is cured by moisture curing or UV (Ultraviolet) curing to form a closed annular sealing layer 19.

[0177] During assembly, the sound component 12 with the sealing layer 19 attached is pressed down into the receiving groove C1 of the middle frame 10, and the sound component 12 and the middle frame 10 are relatively fixed (such as by screw connection, clamping and fixing each other, or by other structures pressing down and abutting to make the sound component 12 and the middle frame 10 relatively fixed). The sealing layer 19 is squeezed between the sealing surface P7 and the middle frame 10 and elastically deforms, and fills the gap between the sealing surface P7 and the middle frame 10 to achieve reliable sealing. For details, please refer to Figure 5 and Figure 6 The middle sound generating component 12 and the middle frame 10 are sealed by a sealing layer 19 .

[0178] In this embodiment, the sealing layer 19 applied to the sealing surface P7 can have a relatively large height, that is, the height of the adhesive material is greater than the height of the design gap between the middle frame 10 and the sealing surface P7, so that after assembly, the sealing layer 19 can undergo a relatively large elastic deformation, thereby improving the sealing performance between the middle frame 10 and the sealing surface P7. The design gap mentioned here refers to the gap between the middle frame 10 and the sealing surface P7 of the sound component 12 when the sound component 12 and the middle frame 10 are assembled in place.

[0179] Based on this sealing design, it is possible to simultaneously achieve the sealing between the first surface P3 and the bottom surface P9 of the receiving groove C1, the sealing between the fourth surface P6 and the second surface P4 and the third surface P5, and the sealing of the gap between the opening K1 and the screen 102 and the middle frame 10. That is, this sealing method can simultaneously achieve the sealing of the above three leakage paths, solving the leakage problem of the sound-emitting component 12 using the aforementioned non-U-shaped sound outlet.

[0180] Optionally, the volume of the sealing layer 19 is slightly larger than the volume of the designed gap between the middle frame 10 and the sealing surface P7 to ensure that the sealing layer 19 fills the designed gap as densely as possible after deformation to ensure the sealing performance.

[0181] Optionally, the cross-section of the sealing layer 19 before being compressed and deformed is a rectangle with a width of 1 / 2 of the width of the designed gap and a height of 2.1-2.3 times the height of the designed gap. In this way, the total volume of the sealing layer 19 is approximately 1.05-1.15 times the volume of the designed gap, which can fill the designed gap more densely and will not invade the sound cavity Q2 too much from the designed gap.

[0182] In other embodiments, the cross-section of the sealing layer 19 before being compressed and deformed may also be semicircular, semi-elliptical or other shapes, which can be set as needed.

[0183] In this embodiment, the adhesive material may also be applied to the position of the middle frame 10 corresponding to the sealing surface P7 , that is, the portion of the groove bottom surface P9 of the accommodating groove C1 and the portion of the fourth surface P6 .

[0184] The sealing method of forming the sealing layer 19 by the CIPG process can achieve the IPX8 waterproof requirement, and the sound component 12 and the middle frame 10 are not directly bonded, so the sound component 12 can be easily replaced. In addition, the sealing layer 19 is attached to the sealing surface P7 or the middle frame 10 rather than an independent sealing ring structure, and is not easy to lose.

[0185] In other embodiments, the sealing layer 19 may be formed by other processes, for example, by applying adhesive between the sealing surface P7 and the middle frame 10, so that the sealing surface P7 is sealed and bonded to the middle frame 10 through the sealing layer 19. In this sealing manner, the sealing layer 19 can realize the connection between the middle frame 10 and the sound component 12, and no other connection structure (such as screw connection) may be provided between the middle frame 10 and the sound component 12.

[0186] See again Figure 5 , when the sound-emitting component 12 is assembled in the middle frame 10, the through-port K1 and the sound-emitting hole K2 are both located on the inner side of the sealing layer 19. One side of the sealing layer 19 is in contact with the sealing surface P7, and the other side is in contact with the groove bottom surface P9 of the receiving groove C1 and the fourth surface P6. The inner side mentioned here refers to the inner side of the ring formed by the sealing layer 19. By making the sealing layer 19 surround the outer side of the through-port K1 and the sound-emitting hole K2, it can be ensured that the through-port K1 and the sound-emitting hole K2 are both sealed inside the sealing layer 19, and are connected to the space of the sound cavity Q2, and isolated from the outside.

[0187] See again Figure 7The sealing layer 19 is formed on the sealing surface P7 of the sound-generating component 12. The sealing layer 19 includes a first rubber strip 20 and a second rubber strip 21. The first rubber strip 20 is in a U-shape attached to the first surface P3, and the second rubber strip 21 is in a U-shape attached to the third surface P5 and the two second surfaces P4. The first rubber strip 20 and the second rubber strip 21 are connected end to end to form a closed ring extending along the sealing surface P7. The first surface P3 and the bottom surface P9 of the receiving groove C1 are sealed by the first rubber strip 20. The second surface P4 and the third surface P5 are sealed to the fourth surface P6 by the second rubber strip 21.

[0188] In this embodiment, when the sound component 12 is assembled to the middle frame 10, the fourth surface P6 is parallel to the second surface and the third surface P5, so that the sealing layer 19 is subjected to the positive pressure of the middle frame 10 and the sound component 12. Of course, the fourth surface P6 can also be set to have a smaller angle with the second surface P4 and the third surface P5, such as an angle between -5-5°.

[0189] Figure 8-Figure 10 Another embodiment improved on the basis of the aforementioned electronic device 100 is shown. On the basis of the aforementioned electronic device 100, the middle frame 10 is recessed at the portion of the groove bottom wall 11 between the through opening K1 and the fourth surface P6 to form a groove C2, and a carrier board assembly 30 is fitted in the groove C2. Figure 8 and Fig. 9 .

[0190] The supporting plate assembly 30 includes a first plate portion 31 and a second plate portion 32. The first plate portion 31 and the second plate portion 32 are connected to form an L-shape bent at a set angle. The first plate portion 31 is overlapped and connected to the fourth surface P6 of the middle frame 10, and the second plate portion 32 is accommodated in the groove C2 so that the surface of the second plate portion 32 away from the second plate surface P2 is flush with the bottom surface P9 of the accommodating groove C1.

[0191] In some embodiments, there is a spacing space f1 between the second plate portion 32 and the side of the groove C2 away from the fourth surface P6, and the spacing space f1 is sealed and connected by the glue point 33. The sealing connection by the glue point 33 can avoid leakage caused by the gap. In addition, for the solution in which the sealing layer 19 is formed on the middle frame 10, the intersection of the sealing layer 19 and the glue point 33 is connected to each other, which also improves the integrity of the glue structure and the reliability of the whole circle seal, ensuring the sealing performance.

[0192] See also Fig.10 and Fig.11 The supporting plate assembly 30 is provided with a through hole K5 connecting the sound hole K2 and the sound cavity Q2 . In this embodiment, the through hole K5 is provided on the second plate portion 32 .

[0193] For this embodiment, the first surface P3 of the sealing surface P7 of the sound generating component 12 spans over the portion of the groove bottom surface P9 of the groove C2 where the groove C2 is not provided and the second plate portion 32 fitted in the groove C2. The portion of the sealing surface P7 corresponding to the bearing plate assembly 30 is connected to the middle frame 10 through the bearing plate assembly 30.

[0194] See also Fig.11 In this embodiment, optionally, the bearing plate assembly 30 includes a bearing plate 34, a second adhesive backing 35, a dustproof net 36 and a third adhesive backing 37 which are sequentially overlapped and connected. The bearing plate 34 can be made of a fiberglass board to provide a certain structural strength. The dustproof net 36 is a porous structure, and the via K5 is composed of an opening K6 respectively provided in the bearing plate 34, the second adhesive backing 35 and the third adhesive backing 37, and a portion of the dustproof net 36 corresponding to the opening K6. A portion of the third adhesive backing 37 fits the bottom surface of the groove C2, and another portion fits the fourth surface P6; the sealing surface P7 fits the portion of the bearing plate 34 corresponding to the bearing plate 34. In this way, the sound can be transmitted through the via K5, and at the same time, the dustproof net 36 corresponding to the via K5 can play a dustproof effect.

[0195] The embodiment of the present application also provides an electronic device assembly method for assembling an electronic device 100 .

[0196] The electronic device assembly method comprises:

[0197] Applying sealant on the sealing surface P7 or the middle frame 10 to form a sealing layer 19;

[0198] The sound generating assembly 12 is installed into the receiving groove C1 , and the sealing surface P7 and the middle frame 10 are sealed and attached via the sealing layer 19 , and the sealing layer 19 surrounds the through opening K1 and the sound outlet K2 on the inner side.

[0199] In this embodiment, the sealant may be soft silicone. The soft silicone forms an elastic sealing layer 19 after moisture curing or UV curing. The sealing layer 19 is sealed between the sound-emitting component 12 and the middle frame 10 .

[0200] In some embodiments, in the provided middle frame 10, a portion of the groove bottom wall 11 between the through opening K1 and the fourth surface P6 is concave to form a groove C2; ​​the corresponding electronic device assembly method further includes:

[0201] Provide a load-bearing plate assembly 30, the load-bearing plate assembly 30 includes a first plate portion 31 and a second plate portion 32, the first plate portion 31 and the second plate portion 32 are connected to form an L-shape bent at a set angle;

[0202] The first plate portion 31 is overlapped and connected to the fourth surface P6, and the second plate portion 32 is overlapped to the groove C2, and the surface of the second plate portion 32 away from the second plate surface P2 is flush with the groove bottom surface P9 of the accommodating groove C1;

[0203] The space f1 between the second plate portion 32 and the groove C2 away from the fourth surface P6 is sealed by dispensing glue 33;

[0204] The sealing surface P7 of the sound generating component 12 that corresponds to the portion of the supporting plate 34 is in contact with the supporting plate 34 .

[0205] The electronic device assembly method can conveniently and reliably realize the assembly of the electronic device 100 , and the assembled electronic device 100 has a good seal between the sound component 12 and the middle frame 10 , and the sound cavity Q2 with a larger thickness dimension can adapt to thinner electronic devices 100 .

[0206] In this embodiment, the middle frame 10 can also be replaced by other alternative structures, such as the outer shell of the electronic device 100, other brackets inside the electronic device 100, etc., and it is only necessary to open a receiving groove C1 of the aforementioned shape thereon to accommodate the sound component 12, and realize the sealing between the sealing surface P7 of the sound component 12 and the groove bottom surface P9 of the receiving groove C1 and a groove side surface serving as the fourth surface P6 through the sealing layer 19 to enclose the sound cavity Q2 connected to the sound hole K2.

[0207] For example Fig.12 An alternative structure 50 is shown, which is a roughly rectangular structure, and is provided with a receiving groove C1, a through hole K1 and a sound outlet K2 similar to those provided on the aforementioned middle frame 10. In this way, the receiving groove C1 of the alternative structure 50 can accommodate the sound-emitting component 12 and be sealed by a sealing layer 19, and then cooperate with a cover member (such as a screen 102) covering the through hole K1 to enclose a sound cavity Q2 as a front cavity of the sound-emitting component 12.

[0208] A groove C2 similar to the middle frame 10 may be further formed on the bottom wall 11 of the receiving groove C1 , and after being matched with the supporting plate assembly 30 , the sound generating assembly 12 may be sealed with the sealing layer 19 .

[0209] See also Fig.13 In another embodiment, the aforementioned sound cavity Q2 can also be used as the back cavity of the sound-emitting element 16, and the internal cavity Q3 defined on the base 14 is used as the front cavity to communicate with the sound hole K2.

[0210] See also Figure 14-16 In this embodiment, another electronic device 200 is also provided, which is different from the aforementioned electronic device 100 in that the device body is different.

[0211] The electronic device 200 includes a device body 201 , a sealing layer 19 and the aforementioned sound-emitting component 12 .

[0212] The device body 201 includes a mounting base 210, and the mounting base 210 includes a substrate portion 202 and a side wall portion 203, and the side wall portion 203 is vertically connected to the substrate portion 202 to form an L shape. The side wall portion 203 is provided with a sound outlet K2. The surface of the side wall portion 203 close to the sound-emitting component 12 is a fourth surface P6, and the fourth surface P6 intersects with the substrate portion 202 at an angle.

[0213] The first surface P3 of the sound-emitting component 12 corresponds to the base plate portion 202 , the second surface P4 and the third surface P5 correspond to the side wall portion 203 , and the circumferential notch K3 corresponds to the sound hole K2 .

[0214] The sealing layer 19 is annular, with one side of the sealing layer 19 in contact with the sealing surface P7 , and the other side of the sealing layer 19 in contact with the base plate portion 202 and the side wall portion 203 , so as to enclose a sound cavity Q2 connected to the sound hole K2 as a front cavity of the sound generating component 12 .

[0215] See also Fig.17 This embodiment also provides an electronic device 300, which in the above Fig.14 On the basis of the electronic device 200 shown, a through opening K1 is opened on the substrate portion 202 , and the through opening K1 and the sound outlet K2 are both located on the inner side of the sealing layer 19 .

[0216] The electronic device 300 further includes a cover plate 204, which is overlapped and connected to the side of the substrate portion 202 away from the sound-emitting component 12, and closes the opening K1. A first adhesive 13 is provided between the cover plate 204 and the substrate portion 202, and the first adhesive 13 is annular and surrounds the outer side of the opening K1, thereby enclosing a sound cavity Q2. One side of the circumferential notch K3 of the sound cavity Q2 is connected to the sound hole K2, and the sound-emitting element 16 corresponds to the sound cavity Q2.

[0217] See again Figure 14-17 The aforementioned mounting base 210 can be a middle frame, a housing or other support structure of an electronic device, and only needs to have the aforementioned L-shaped structure and the sound outlet K2. Through the L-shaped mounting base 210, the sound component 12 can be conveniently matched, and under the sealing effect of the sealing layer 19, a sound cavity Q2 connected to the sound outlet K2 is obtained. The sound cavity Q2 can be used as the front cavity of the sound component 12, and the base 14 can be provided with an internal cavity Q3 as the back cavity of the sound component 12.

[0218] The cover plate 204 may be a screen or a back cover of an electronic device.

[0219] In summary, in the sound-emitting component 12 and the electronic device in the embodiment of the present application, the circumferential notch K3 of the sound-emitting component 12 is an unobstructed open structure and is significantly enlarged, which expands the width of the sound output channel and has a good effect on improving the audio performance. At the same time, by adopting the circumferential notch K3 of the non-U-shaped structure, the size of the sound-emitting component 12 in the thickness direction Y1 can be effectively reduced, and the thickness is reduced by at least the thickness of the wall thickness on one side, which is conducive to the thinning of the electronic device 100.

[0220] Furthermore, the closed sealing surface P7 formed by the first surface P3 and the third surface P5 is connected to the second surface P4 on both sides of the circumferential notch K3, so that the non-coplanar first surface P3 is sealed with the second surface P4 and the third surface P5 to form a sound cavity Q2, which solves the problem of poor sealing of the SPK-BOX of the non-U-shaped sound outlet and causes water leakage while ensuring a low structural thickness. The sealing operation is convenient and the sealing effect is good. Moreover, by configuring the bearing plate assembly 30 with a dustproof net 36 and combining it with the sealing layer 19, the waterproof and dustproof function of the whole machine can be achieved.

[0221] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A sound-generating component, characterized in that: include: a base, wherein the base is provided with a sound-generating element; an open surrounding wall connected to the base along a thickness direction of the base; The open surrounding wall is an unclosed surrounding wall with a circumferential notch, and the surface of the open surrounding wall away from one end of the base is a U-shaped first surface; the surfaces on both sides of the circumferential notch of the open surrounding wall are respectively second surfaces; The side surface of the base close to the circumferential notch is a third surface, and the two ends of the third surface are respectively connected to the two end openings of the first surface through two second surfaces to form a circumferentially closed sealing surface, and the sealing surface is used to seal and fit to the device body of an electronic device, so that the device body closes the circumferential notch and the side of the open surrounding wall away from the base to form a sound cavity; the sound-emitting element corresponds to the sound cavity, so that the sound cavity serves as the front cavity or the rear cavity of the sound-emitting element; the circumferential notch is used to connect to the sound outlet hole set on the device body.

2. The sound generating assembly according to claim 1, characterized in that: The first surface is located in a plane; the second surface and the third surface are both located in another plane obliquely intersecting with the first surface.

3. The sound generating assembly according to claim 2, characterized in that: An included angle between the second surface and the first surface is an obtuse angle.

4. The sound generating assembly according to claim 1, characterized in that: The angle between the second surface and the first surface is 105-150°.

5. The sound generating assembly according to claim 1, characterized in that: The first surface and the second surface are connected at a junction thereof by a transition of a first arc surface.

6. An electronic device, characterized in that: include: The device body comprises a base plate and a side wall, wherein the base plate is provided with a through opening; the side wall is connected to the base plate; and the side wall is provided with a sound outlet; The sound-emitting component according to any one of claims 1 to 5, wherein the first surface corresponds to the substrate portion, the second surface and the third surface correspond to the side wall portion, and the circumferential notch corresponds to the sound outlet hole; A sealing layer, wherein the sealing layer is annular, and the through opening and the sound outlet are both located on the inner side of the sealing layer; one side of the sealing layer is in contact with the sealing surface, and the other side of the sealing layer is in contact with the base plate portion and the side wall portion; The sound-generating component and the device body form a sound cavity, one side of the circumferential notch of the sound cavity is connected to the sound outlet hole; and the sound-generating element corresponds to the sound cavity.

7. The electronic device according to claim 6, characterized in that: The device body also includes a cover plate, which is overlapped and connected to a side of the base plate away from the sound-emitting component and closes the through opening.

8. The electronic device according to claim 7, characterized in that: A first adhesive backing is provided between the cover plate and the base plate, and the first adhesive backing is annular and surrounds the outer side of the through opening.

9. The electronic device according to claim 7, characterized in that: The device body comprises a middle frame and a back shell, the middle frame comprises the substrate portion and the side wall portion, and the back shell serves as the cover plate; or, The device body has a middle frame and a screen, the middle frame includes the base plate portion and a side wall portion, and the screen serves as the cover plate.

10. The electronic device according to claim 6, characterized in that: The side wall portion is vertically connected to the base plate portion, and a surface of the side wall portion close to the sound generating component is a fourth surface, and the fourth surface is obliquely intersected with the base plate portion.

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