Pad electrogilding method and structure, electronic equipment and storage medium

Abstract

The invention discloses a bonding pad electrogilding method and structure, electronic equipment and a storage medium, and relates to the technical field of gilding. The method comprises the following steps: acquiring a substrate to be plated with gold; printing ink is subjected to silk-screen printing in the gold plating area, and the printing ink is exposed and developed to expose the bonding pad to be plated with gold; performing vacuum film pressing on the whole substrate to be plated with gold, and forming a first anti-corrosion photosensitive dry film on the surface of the substrate to be plated with gold; exposing and developing the first anti-corrosion photosensitive dry film to form a first window; according to the first window, nickel plating and soft gold plating are carried out on the to-be-gold-plated bonding pad, and the first anti-corrosion photosensitive dry film is removed; performing secondary vacuum film pressing on the whole substrate to be plated with gold, and forming a second anti-corrosion photosensitive dry film on the surface of the substrate to be plated with gold; exposing and developing the second anti-corrosion photosensitive dry film to form a second window; according to the second window, hard gold plating is carried out on the to-be-gold-plated bonding pad; and removing the second anti-corrosion photosensitive dry film and the ink layer. According to the method provided by the embodiment of the invention, the problem of diffusion coating can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of gold plating, and in particular to a pad electro-gold plating method, structure, electronic equipment and storage medium. Background Art

[0002] With the advancement of science and technology and the miniaturization and precision of electronic products, the application of welding technology in electronic manufacturing is becoming more and more extensive. As a key component in the welding process, the quality and performance of the pad directly affect the reliability of welding. In the traditional welding process, there are some problems with the pad gold plating technology, such as the occurrence of infiltration plating, inaccurate control of the thickness of the gold layer, etc., which will lead to unstable welding quality and affect the performance and life of the product. Therefore, improving the performance and quality of the pad gold plating technology has become an urgent problem to be solved in the current electronic manufacturing industry. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a pad electroplating gold method, structure, electronic device and storage medium, which can avoid the occurrence of seepage plating during the gold plating process.

[0004] On the one hand, the pad electroplating gold method according to an embodiment of the present invention comprises the following steps:

[0005] Obtain a substrate to be gold-plated; the surface of the substrate to be gold-plated includes a gold-plated area and a non-gold-plated area, and the gold-plated area is provided with a pad to be gold-plated;

[0006] Screen printing ink on the gold-plated area, exposing and developing the ink to reveal the pad to be gold-plated, and forming a cured ink layer in a preset area around the pad to be gold-plated;

[0007] According to preset lamination parameters, vacuum lamination is performed on the entire substrate to be gold-plated to form a first anti-corrosion photosensitive dry film on the surface of the substrate to be gold-plated;

[0008] Exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold-plated;

[0009] According to the first window, the pad to be gold-plated is nickel-plated and soft-gold-plated, and the first anti-corrosion photosensitive dry film is removed;

[0010] According to the lamination parameters, performing secondary vacuum lamination on the entire substrate to be gold-plated to form a second anti-corrosion photosensitive dry film on the surface of the substrate to be gold-plated;

[0011] exposing and developing the second anti-etching photosensitive dry film to form a second window corresponding to the pad to be gold plated;

[0012] According to the second window, hard gold is plated on the pad to be gold plated;

[0013] The second anti-etching photosensitive dry film and the ink layer are removed.

[0014] According to some embodiments of the present invention, the step of vacuum laminating the entire substrate to be gold-plated according to preset lamination parameters to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated includes:

[0015] Set the lamination pressure to 0.4-0.5Mpa, the lamination temperature to 105℃-125℃, and the lamination line speed to 2.1-2.5m / min;

[0016] The substrate to be gold-plated is subjected to vacuum lamination at the lamination pressure and the lamination temperature at the lamination line speed to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated.

[0017] According to some embodiments of the present invention, the step of exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold plated includes:

[0018] Set the exposure time to 14-25S / side, exposure energy to 130-150MJ, exposure scale to 4-6 grids, and light intensity to 4-5KW;

[0019] exposing the first anti-etching photosensitive dry film according to the exposure time, the exposure energy, the exposure ruler and the light source intensity;

[0020] The first anti-etching photosensitive dry film after exposure is developed to form a first window corresponding to the pad to be gold-plated.

[0021] According to some embodiments of the present invention, the preset area is within a range of 0.05-0.25 mm from the pad to be gold-plated.

[0022] According to some embodiments of the present invention, the step of performing nickel plating and soft gold plating on the pad to be gold-plated according to the first window includes:

[0023] According to the first window, the pad to be gold-plated is nickel-plated to form a nickel layer with a thickness of 2.5 μm-7 μm;

[0024] Soft gold is electroplated on the surface of the nickel layer to form a soft gold layer with a thickness of 0.03 μm-0.04 μm.

[0025] According to some embodiments of the present invention, after the step of performing nickel plating and soft gold plating on the pad to be gold-plated according to the first window and removing the first anti-corrosion photosensitive dry film, the method further includes:

[0026] The substrate to be gold-plated is pickled with acid.

[0027] According to some embodiments of the present invention, the thickness of the hard gold layer formed by hard gold plating on the pad to be gold-plated is 0.6 μm.

[0028] On the other hand, according to the pad electroplating gold structure of the embodiment of the present invention, the pad electroplating gold structure is manufactured by the pad electroplating gold method described in the above embodiment.

[0029] On the other hand, an electronic device according to an embodiment of the present invention includes:

[0030] A memory for storing program instructions;

[0031] The processor is used to call the program instructions stored in the memory and execute the pad electroplating gold method described in the above embodiment according to the obtained program instructions.

[0032] On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the pad electroplating gold method described in the above embodiment.

[0033] The pad electroplating gold method, structure, electronic device and storage medium according to the embodiments of the present invention have at least the following beneficial effects: by optimizing the lamination parameters and laminating by vacuum lamination, the lamination effect is improved, bubbles are prevented from being generated between the dry film and the substrate to be gold-plated after lamination, and the problem of plating infiltration caused by the bursting of bubbles during the gold plating process is avoided. The problem of plating infiltration is further improved by using ink to protect the preset area around the pad to be gold-plated.

[0034] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0036] Figure 1 A flow chart of the steps of the pad electroplating method according to an embodiment of the present invention;

[0037] Figure 2 A flowchart of the steps of vacuum lamination according to an embodiment of the present invention;

[0038] Figure 3 A flowchart of the exposure and development steps of an embodiment of the present invention;

[0039] Figure 4 The figure is a flow chart of nickel plating and soft gold plating steps according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. For the step numbers in the following embodiments, they are only provided for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0041] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0042] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0043] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0044] With the advancement of science and technology and the miniaturization and precision of electronic products, the application of welding technology in electronic manufacturing is becoming more and more extensive. As a key component in the welding process, the quality and performance of the pad directly affect the reliability of welding. In the traditional welding process, there are some problems with the pad gold plating technology, such as the occurrence of infiltration plating, inaccurate control of the thickness of the gold layer, etc., which will lead to unstable welding quality and affect the performance and life of the product. Therefore, improving the performance and quality of the pad gold plating technology has become an urgent problem to be solved in the current electronic manufacturing industry.

[0045] At present, when gold-plating pads in the industry, dry film is often applied to the finger edges. Due to inaccurate cover line position and cover line size, gold electroplating penetration problems may occur. At the same time, when applying dry film, bubbles may exist in the dry film. When gold is electroplated on the pads, the entire board is covered with dry film. The dry film at the bubble location is not completely cured due to low energy exposure. The bubbles burst at the high temperature of gold plating, resulting in nickel-gold penetration on the gold-plated pads. Penetration plating can cause short circuit problems in the circuit, making the product a defective product.

[0046] To this end, the embodiments of the present invention provide a pad electroplating gold method, structure, electronic device and storage medium, which optimizes the lamination parameters and uses vacuum lamination to improve the lamination effect, prevent bubbles from being generated between the dry film and the substrate to be gold-plated after lamination, and avoid the problem of plating due to bubble rupture during the gold plating process. The problem of plating is further improved by using ink to protect the preset area around the pad to be gold-plated.

[0047] The following is combined with Figure 1-4 , describes in detail the pad electroplating gold method, structure, electronic device and storage medium of the embodiments of the present invention.

[0048] On the one hand, the present invention provides a method for electroplating gold on a pad, such as Figure 1 As shown, the method comprises the following steps:

[0049] Step S100: obtaining a substrate to be gold-plated; the surface of the substrate to be gold-plated includes a gold-plated area and a non-gold-plated area, and the gold-plated area is provided with a pad to be gold-plated;

[0050] Specifically, the substrate to be gold-plated refers to a packaging substrate / circuit board that has completed the production of inner and outer layer circuits and only needs to be nickel-plated, soft gold-plated, and hard gold-plated on the surface pads. On the surface of the substrate to be gold-plated, there are gold-plated areas and non-gold-plated areas, among which the gold-plated pads to be gold-plated are located in the gold-plated areas, and the remaining various circuits are located in the non-gold-plated areas. In the process of gold-plating the gold-plated pads, the non-gold-plated areas need to be protected to prevent the gold-plating solution from entering the non-gold-plated areas, causing short circuits and resulting in product scrapping.

[0051] Step S200: screen printing ink on the gold-plated area, exposing and developing the ink to reveal the pad to be gold-plated, and forming a cured ink layer in a preset area around the pad to be gold-plated;

[0052] It should be noted that in the gold-plated area, not all areas need to be gold-plated, but only the surface of the pad to be gold-plated in the gold-plated area needs to be gold-plated, so the gold-plated area includes not only the pad to be gold-plated that needs to be gold-plated, but also the area around the pad to be gold-plated that does not need to be gold-plated. In order to avoid the phenomenon that the gold-plating solution penetrates into the surrounding of the pad to be gold-plated during the gold-plating process, and enters the non-gold-plated area, and contacts the circuit on the surface of the substrate to be gold-plated to cause a short circuit, the ink is screen-printed in the gold-plated area, and the ink is baked to solidify it, so as to protect the area around the pad to be gold-plated. Then, the ink is exposed and developed, so as to open a window for the ink, reveal the pad to be gold-plated, and the preset area around the pad to be gold-plated is covered by the ink layer. Since the ink layer has an anti-electroplating effect, the ink layer can protect the surrounding area of ​​the pad to be gold-plated, and can effectively prevent the gold-plating solution from penetrating into the surrounding area of ​​the pad to be gold-plated during the gold-plating process.

[0053] In this example, the preset area where the ink layer is located is within the range of 0.05-0.25mm from the pad to be gold-plated, which plays an anti-plating role on the surrounding area of ​​the pad to be gold-plated, preventing plating from occurring during the gold plating process, and the plating solution enters the non-gold-plated area, causing a short circuit.

[0054] Step S300: vacuum lamination is performed on the entire substrate to be gold-plated according to preset lamination parameters to form a first anti-corrosion photosensitive dry film on the surface of the substrate to be gold-plated;

[0055] Specifically, by optimizing the lamination parameters and adopting the lamination method of vacuum lamination, the lamination effect can be effectively improved, so that the first anti-etching photosensitive dry film and the substrate to be gold-plated are closely attached to each other, and the problem of bubbles after lamination is prevented. Since there are no bubbles between the first anti-etching photosensitive dry film and the substrate to be gold-plated, and the two are closely attached, in the subsequent gold plating process, the dry film is not prone to loosening, the dry film bubbles are not prone to rupture, and the phenomenon of infiltration is not prone to occur.

[0056] Specifically, Figure 2 As shown, in this example, the above step S300 includes the following two steps:

[0057] Step S310: setting the lamination pressure to 0.4-0.5Mpa, the lamination temperature to 105°C-125°C, and the lamination line speed to 2.1-2.5m / min;

[0058] Step S320: vacuum lamination is performed on the substrate to be gold-plated at the lamination pressure and lamination temperature at the lamination line speed to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated.

[0059] Through actual verification, it is found that under the environment of lamination pressure of 0.4-0.5Mpa and lamination temperature of 105℃-125℃, a better lamination effect can be achieved; at the same time, by setting the lamination line speed to 2.1-2.5m / min, reducing the lamination line speed and increasing the lamination time, the problem of height difference can be effectively avoided, thereby achieving the effect of improving lamination bubbles. By optimizing the lamination parameters and realizing precise control of the lamination process, the problem of pad permeation can be improved and the product quality can be improved.

[0060] Step S400: exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold plated;

[0061] A first anti-etching photosensitive dry film is attached to the surface of the substrate to be gold plated. The first anti-etching photosensitive dry film has good selective sensitivity, phase resolution, and fine line adhesion, and the dry film thickness is thin, which can play a high protective role. After the first anti-etching photosensitive dry film is exposed and developed, a first window corresponding to the pad to be gold plated is formed, which is convenient for subsequent electroplating of the pad to be gold plated. At the same time, the first anti-etching photosensitive dry film prevents electroplating of other areas of the substrate to be gold plated.

[0062] In this example, if Figure 3 As shown, the above step S400 includes the following three steps:

[0063] Step S410: setting the exposure time to 14-25S / side, the exposure energy to 130-150MJ, the exposure scale to 4-6 grids, and the light source intensity to 4-5KW;

[0064] Step S420: exposing the first resist photosensitive dry film according to the exposure time, exposure energy, exposure scale and light source intensity;

[0065] Step S430: developing the exposed first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold plated.

[0066] Specifically, by optimizing the exposure parameters and increasing the exposure energy, the polymerization and hardening degree of the first anti-etching photosensitive dry film can be increased, the risk of the dry film falling off can be reduced, and the dry film damage can be avoided. At the same time, the corrosion resistance of the first anti-etching photosensitive dry film and the bonding strength between the first anti-etching photosensitive dry film and the copper surface can be improved, and the height difference depression can be better filled, thereby improving product quality.

[0067] Step S500: According to the first window, the pad to be gold-plated is nickel-plated and soft-gold-plated, and the first anti-etching photosensitive dry film is removed;

[0068] Specifically, after the first anti-etching photosensitive dry film is exposed and developed to form a first window corresponding to the pad to be gold-plated, the substrate to be gold-plated is placed in a nickel-plating and gold-plating solution to plate nickel and gold on the surface of the pad to be gold-plated. After the electroplating is completed, the first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated is removed.

[0069] In this example, if Figure 4 As shown, the above step S500 includes the following two steps:

[0070] Step S510: nickel-plating the pad to be gold-plated according to the first window to form a nickel layer with a thickness of 2.5 μm-7 μm;

[0071] Step S520: electroplating soft gold on the surface of the nickel layer to form a soft gold layer with a thickness of 0.03 μm-0.04 μm.

[0072] First, a 2.5μm-7μm nickel layer is plated on the surface of the pad to be gold-plated, and then a soft gold layer with a thickness of 0.03μm-0.04μm is formed on the surface of the nickel layer, thereby protecting the pad to be gold-plated.

[0073] Step S600: performing secondary vacuum lamination on the entire substrate to be gold-plated according to lamination parameters, so as to form a second anti-etching photosensitive dry film on the surface of the substrate to be gold-plated;

[0074] After completing the electroplating of nickel layer and soft gold on the surface of the gold-plated pad, it is also necessary to plate hard gold on the surface of some of the gold-plated pads. To this end, it is necessary to perform a second vacuum lamination on the surface of the entire gold-plated substrate to form a second anti-corrosion photosensitive dry film on the surface of the gold-plated substrate, so as to protect the rest of the gold-plated substrate during the hard gold plating process. It should be noted that in the second vacuum lamination process, the lamination pressure is also set to 0.4-0.5Mpa, the lamination temperature is 105℃-125℃, and the lamination line speed is 2.1-2.5m / min. At this lamination pressure and lamination temperature, the gold-plated substrate is vacuum lamination at this lamination line speed to form a second anti-corrosion photosensitive dry film on the surface of the gold-plated substrate. Under the conditions of lamination pressure of 0.4-0.5Mpa and lamination temperature of 105℃-125℃, a good lamination effect can be achieved; at the same time, by setting the lamination line speed to 2.1-2.5m / min, reducing the lamination line speed and increasing the lamination time, the problem of height difference can be effectively avoided, thereby achieving the effect of improving lamination bubbles. By optimizing the lamination parameters and realizing precise control of the lamination process, the problem of pad permeation can be improved and product quality can be improved.

[0075] Step S700: exposing and developing the second anti-etching photosensitive dry film to form a second window corresponding to the pad to be gold plated;

[0076] It should be noted that when the second anti-etching photosensitive dry film is exposed and developed, the exposure parameters are also optimized, and the exposure time is set to 14-25S / side, the exposure energy is 130-150MJ, the exposure scale is 4-6 grids, and the light source intensity is 4-5KW. According to the exposure time, exposure energy, exposure scale and light source intensity, the second anti-etching photosensitive dry film is exposed; then the exposed second anti-etching photosensitive dry film is developed to form a second window at the gold-plated pad that needs to be electroplated with hard gold. By optimizing the exposure parameters and increasing the exposure energy, the polymerization and hardening degree of the second anti-etching photosensitive dry film can be increased, the risk of the dry film falling off can be reduced, and the dry film can be avoided from being damaged. At the same time, the corrosion resistance of the second anti-etching photosensitive dry film and the bonding strength between the second anti-etching photosensitive dry film and the copper surface can be improved, and the second anti-etching photosensitive dry film has a better filling ability for the drop depression, thereby improving the product quality. The second photosensitive dry film has good sensitivity, phase resolution, and fine line adhesion, and the dry film is thin, so it can play a good protective role. The unopened area of ​​the second photosensitive dry film protects the area of ​​the gold-plated substrate that does not need to be electroplated.

[0077] Step S800: performing hard gold plating on the pad to be gold-plated according to the second window;

[0078] Specifically, after the second anti-etching photosensitive dry film is exposed and developed to form a second window corresponding to the pad to be gold-plated, the substrate to be gold-plated is placed in a gold plating solution, and hard gold is plated on the surface of the pad to be gold-plated to form a hard gold layer. In this example, the thickness of the hard gold layer formed by the hard gold plating of the pad to be gold-plated is 0.6 μm.

[0079] Step S900: removing the second anti-etching photosensitive dry film and the ink layer.

[0080] After the electroplating of the nickel layer, the soft gold layer and the hard gold layer, the second anti-etching photosensitive dry film on the surface of the gold-plated substrate needs to be removed, and at the same time, the ink layer around the gold-plated pad needs to be removed. The removal method can be alkaline etching.

[0081] Furthermore, in some embodiments of the present invention, in order to further enhance the protective effect of the first anti-etching photosensitive dry film and the second anti-etching photosensitive dry film, an optimized window design is made for the first anti-etching photosensitive dry film and the second anti-etching photosensitive dry film, and the problem of plating is further improved. Specifically, when the first anti-etching photosensitive dry film and the second anti-etching photosensitive dry film are opened, the distance from the edge of the window to the lead is less than 0.5mm, the distance from the lead to the bonding edge is less than 0.26mm, the spacing of the cover line layout has a small gap design, and there is an independent small piece / segment of dry film design, which improves the product cover film window design.

[0082] Furthermore, in some embodiments of the present invention, before vacuum lamination of the gold-plated substrate twice, the gold-plated substrate is pickled to remove impurities on the surface of the gold-plated substrate and improve the effect of vacuum lamination. Before nickel plating, soft gold plating and hard gold plating of the gold-plated pad, the gold-plated substrate is pre-treated to improve the electroplating effect. After the entire gold plating process is completed, the gold-plated substrate needs to be cleaned and the entire gold-plated substrate needs to be AOI inspected to check whether all circuits are normal, to ensure the product quality and avoid the outflow of defective products.

[0083] According to the pad electroplating gold method of the embodiment of the present invention, by optimizing the lamination parameters, vacuum lamination is used to laminat e the film, thereby improving the lamination effect, preventing bubbles from being generated between the dry film and the substrate to be gold-plated after lamination, and avoiding the problem of plating penetration caused by bubble rupture during the gold plating process. The problem of plating penetration is further improved by using ink to protect the preset area around the pad to be gold-plated.

[0084] On the other hand, the present invention further proposes a pad electroplating gold structure, which is manufactured by the pad electroplating gold method described in the above-mentioned embodiment.

[0085] According to the pad electroplating gold structure of the embodiment of the present invention, the lamination effect is improved by optimizing the lamination parameters and adopting the vacuum lamination method to lamination, thereby preventing bubbles from being generated between the dry film and the substrate to be gold-plated after lamination, and avoiding the problem of plating penetration caused by the bursting of bubbles during the gold plating process. The problem of plating penetration is further improved by using ink to protect the preset area around the pad to be gold-plated.

[0086] On the other hand, an embodiment of the present invention further provides an electronic device, including:

[0087] A memory for storing program instructions;

[0088] The processor is used to call the program instructions stored in the memory and execute the above-mentioned pad electroplating gold method according to the obtained program instructions.

[0089] The processor may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0090] The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device or a random access memory (RAM). The memory can store an operating system and other applications. When the technical solution provided in the embodiments of this specification is implemented by software or firmware, the relevant program code is stored in the memory, and the processor is called to execute the pad electroplating gold method of the embodiment of the present application; the memory and the processor can be connected through a bus or the like.

[0091] On the other hand, an embodiment of the present invention further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned pad electroplating gold method is implemented.

[0092] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0093] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described according to embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.

[0094] Some aspects of the present disclosure are described above with reference to the block diagram and flow chart of the system, method, system and / or computer program product according to exemplary embodiments.It should be understood that the combination of one or more blocks in the block diagram and flow chart and the blocks in the block diagram and flow chart can be realized by executing computer executable program instructions respectively.Equally, according to some embodiments, some blocks in the block diagram and flow chart may not need to be executed in the order shown, or may not need to be executed in full.In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and flow chart may be present in certain embodiments.

[0095] Therefore, the blocks in the block diagrams and flow charts support the combination of devices for performing the specified functions, the combination of elements or steps for performing the specified functions, and the program instruction devices for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts and the combination of blocks in the block diagrams and flow charts can be implemented by a special-purpose hardware computer system or a combination of special-purpose hardware and computer instructions that performs a specific function, element or step.

[0096] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0097] Software components can be encoded with any of various programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a specific hardware architecture and / or an operating system platform. The software component comprising assembly language instructions may need to be converted to executable machine code by an assembler before being executed by hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language, which can be transplanted across multiple architectures. The software component comprising a higher-level programming language may need to be converted to an intermediate representation by an interpreter or a compiler before execution. Other examples of programming languages ​​include but are not limited to macro languages, shells or command languages, job control languages, scripting languages, database queries or search languages ​​or report writing languages. In one or more exemplary embodiments, the software component comprising the instruction of one of the above-mentioned programming language examples can be directly executed by an operating system or other software components, without first being converted into another form.

[0098] Software components may be stored as files or other data storage structures. Software components of similar type or related functions may be stored together, such as in a specific directory, folder, or library. Software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0099] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for electroplating gold on a pad, characterized in that: The following steps are involved: Obtain a substrate to be gold-plated; the surface of the substrate to be gold-plated includes a gold-plated area and a non-gold-plated area, and the gold-plated area is provided with a pad to be gold-plated; Screen printing ink on the gold-plated area, exposing and developing the ink to reveal the pad to be gold-plated, and forming a cured ink layer in a preset area around the pad to be gold-plated; According to preset lamination parameters, vacuum lamination is performed on the entire substrate to be gold-plated to form a first anti-corrosion photosensitive dry film on the surface of the substrate to be gold-plated; Exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold-plated; According to the first window, the pad to be gold-plated is nickel-plated and soft-gold-plated, and the first anti-corrosion photosensitive dry film is removed; According to the lamination parameters, performing secondary vacuum lamination on the entire substrate to be gold-plated to form a second anti-corrosion photosensitive dry film on the surface of the substrate to be gold-plated; exposing and developing the second anti-etching photosensitive dry film to form a second window corresponding to the pad to be gold plated; According to the second window, hard gold is plated on the pad to be gold plated; The second anti-etching photosensitive dry film and the ink layer are removed.

2. The pad electroplating gold method according to claim 1, characterized in that: The step of vacuum laminating the entire substrate to be gold-plated according to preset laminating parameters to form a first anti-corrosion photosensitive dry film on the surface of the substrate to be gold-plated comprises: Set the lamination pressure to 0.4-0.5Mpa, the lamination temperature to 105℃-125℃, and the lamination line speed to 2.1-2.5m / min; The substrate to be gold-plated is subjected to vacuum lamination at the lamination pressure and the lamination temperature at the lamination line speed to form a first anti-etching photosensitive dry film on the surface of the substrate to be gold-plated.

3. The pad electroplating gold method according to claim 1, characterized in that: The step of exposing and developing the first anti-etching photosensitive dry film to form a first window corresponding to the pad to be gold plated comprises: Set the exposure time to 14-25S / side, exposure energy to 130-150MJ, exposure scale to 4-6 grids, and light intensity to 4-5KW; exposing the first anti-etching photosensitive dry film according to the exposure time, the exposure energy, the exposure ruler and the light source intensity; The first anti-etching photosensitive dry film after exposure is developed to form a first window corresponding to the pad to be gold-plated.

4. The pad electroplating gold method according to claim 1, characterized in that: The preset area is within a range of 0.05-0.25 mm from the pad to be gold-plated.

5. The pad electroplating gold method according to claim 1, characterized in that: The step of performing nickel plating and soft gold plating on the pad to be gold-plated according to the first window comprises: According to the first window, the pad to be gold-plated is nickel-plated to form a nickel layer with a thickness of 2.5 μm-7 μm; Soft gold is electroplated on the surface of the nickel layer to form a soft gold layer with a thickness of 0.03 μm-0.04 μm.

6. The pad electroplating gold method according to claim 1, characterized in that: After the step of plating the gold-plated pad with nickel and soft gold according to the first window and removing the first anti-corrosion photosensitive dry film, the method further includes: The substrate to be gold-plated is pickled with acid.

7. The pad electroplating gold method according to claim 1, characterized in that: The thickness of the hard gold layer formed by hard gold plating on the gold-plated pad is 0.6 μm.

8. A pad electroplating gold structure, characterized in that: The method is prepared by the pad electroplating gold method as described in any one of claims 1 to 7.

9. An electronic device, characterized in that: include: A memory for storing program instructions; A processor is used to call the program instructions stored in the memory, and execute the pad electroplating gold method according to any one of claims 1-7 according to the obtained program instructions.

10. A storage medium, characterized in that: The storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the pad electroplating gold method according to any one of claims 1 to 7.

Images