Positioning mechanism of chip inductor welding device

Abstract

The invention discloses a positioning mechanism of a chip inductor welding device, and relates to the technical field of circuit board processing equipment. The positioning mechanism of the chip inductor welding device comprises two sets of supporting plates which are arranged in a bilateral symmetry mode, two sets of conveying rollers are rotationally installed on the two sets of supporting plates, the outer walls of the two sets of conveying rollers are sleeved with a conveying belt, and a flexible discharging frame is fixedly installed on the outer wall of the conveying belt. According to the positioning mechanism of the chip inductor welding device, the hollow sleeve, the movable rod, the electromagnetic attraction block and the guide rod can be driven to reciprocate left and right, and the guide rod is slidably mounted in the guide groove of the fixing plate, so that the movable rod, the electromagnetic attraction block and the guide rod can reciprocate in the direction of the guide groove; and the electromagnetic suction block is driven to convey the chip inductor on the inner side of the material box, the chip inductor is accurately placed on the welding position of the circuit board, and the situation that due to the fact that the inductor is small in size, tweezers are likely to deviate from the welding position during clamping is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing equipment, and in particular to a positioning mechanism of a patch inductive welding device. Background Art

[0002] At present, it is often necessary to install chip inductors on circuit boards. The common installation method of chip inductors is generally to first apply solder paste on the welding base, then heat it with a hot air gun, and then use tweezers to clamp the chip inductor and place it in the welding position. After the solder cools down, the welding is completed. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to the predetermined position. At the welding temperature, as the solvent and some additives evaporate, the components to be welded are welded to the printed circuit pads to form a permanent connection. However, due to the small size of the inductor, it is easy to deviate from the welding position when clamped by tweezers, resulting in installation failure. Summary of the invention

[0003] The object of the present invention is to provide a positioning mechanism for a patch inductive welding device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a positioning mechanism of a chip inductor welding device, comprising a support plate, wherein the support plates are provided in two groups and are symmetrically arranged on the left and right, two groups of transport rollers are rotatably installed on the two groups of support plates, the outer walls of the two groups of transport rollers are sleeved with a conveyor belt, the outer wall of the conveyor belt is fixedly installed with a flexible material discharge frame, a material box is fixedly installed on the top of the two groups of support plates, a material box is arranged on the top of the conveyor belt, a circuit board is placed on the inner side of the material box, and a chip inductor is placed on the inner side of the material box, and also comprises a driving structure and a guide assembly installed on the two groups of support plates, an electromagnetic suction block is arranged below the guide assembly, and the driving structure and the guide assembly are used to accurately place the chip inductor inside the material box on the circuit board through the coordinated use of the driving structure and the guide assembly, and a transmission assembly is installed on the guide structure and the transport roller, and the driving structure is used to drive the transport roller and the conveyor belt to rotate through the transmission assembly.

[0005] Preferably, the driving structure includes a servo motor, a reciprocating screw and a hollow sleeve, the servo motor is fixedly mounted on the outer wall of one side of a group of support plates, the reciprocating screw is rotatably mounted on two groups of support plates, the hollow sleeve is threadedly mounted on the outer wall of the reciprocating screw, and the output shaft of the servo motor is fixedly mounted on one end of the reciprocating screw, so as to drive the hollow sleeve, the movable rod, the electromagnetic suction block and the chip inductor to move back and forth left and right.

[0006] Preferably, the guide assembly includes a fixed plate, a movable rod and a guide rod, the fixed plate is fixedly installed on adjacent side walls of the two groups of support plates, the movable rod is slidably installed on the inner side of the hollow sleeve, and one end of the movable rod extends to the bottom of the hollow sleeve and is fixedly installed with the electromagnetic suction block, the guide rod is fixedly installed on the outer wall of the movable rod, the fixed plate is provided with a guide groove, the guide rod is slidably installed in the guide groove, since the guide rod is slidably installed in the guide groove of the fixed plate, the movable rod, the electromagnetic suction block and the chip inductor can reciprocate along the direction of the guide groove, driving the electromagnetic suction block to transport the chip inductor inside the material box, and accurately placing the chip inductor on the welding position of the circuit board, avoiding the welding position being easily offset when clamped by tweezers due to the small size of the inductor.

[0007] Preferably, the transmission assembly includes a first gear, a second gear and a gear belt, the first gear is fixedly mounted on the outer wall of the reciprocating screw, the second gear is fixedly mounted on the outer wall of a group of transport rollers, the gear belt is sleeved on the outside of the first gear and the second gear, and the gear belts are meshed with the first gear and the second gear. When the reciprocating screw of the driving structure drives the hollow sleeve to move back and forth left and right, it can also drive the transport rollers, the transport belt, the flexible material discharge frame, and the pushing block to rotate, so that the unsoldered circuit boards inside the material box can be pushed to the bottom of the electromagnetic suction block, and the welded circuit boards can be pushed out from the bottom of the electromagnetic suction block, so that the circuit boards can be automatically loaded and unloaded, realizing dual-purpose of one machine, reducing the number of motors, and reducing the manufacturing cost of the equipment.

[0008] Preferably, a discharge port is provided on the front side of the material box, a pushing groove is provided at the bottom of the material box, a pushing block is fixedly installed on the top of the flexible discharge frame, and the pushing block is located in the return groove. When the conveyor belt and the flexible discharge frame rotate, the pushing block is used to push the circuit board in the material box into the flexible discharge frame to automatically load the circuit board.

[0009] Preferably, positioning plates are fixedly installed on the front and rear inner walls of the material box. There are four groups of positioning plates that are symmetrically arranged in a rectangular shape, and the circuit board is located between the four groups of positioning plates for positioning the circuit board to ensure that the circuit board is pushed out from the discharge port.

[0010] Preferably, the material box is fixedly installed on the rear side of the fixed plate, and the bottom of the material box and the bottom of the chip inductor are in contact with the outer wall of the conveyor belt, which is used to position the chip inductor. When the conveyor belt and the flexible material discharge frame rotate, the chip inductor can be moved to the bottom of the electromagnetic suction block in sequence.

[0011] Preferably, an electromagnetic suction block starter and an electromagnetic suction block closer are fixedly installed on the front outer wall of the fixed plate, the electromagnetic suction block starter is located on the left side of the hollow sleeve, and the electromagnetic suction block closer is located on the right side of the material box.

[0012] Preferably, the top of the flexible material discharging frame and the material discharge port of the material box are both chamfered.

[0013] Preferably, a solder paste feeding device and a hot air gun are fixedly installed on an outer wall of one side of another group of support plates, and the solder paste feeding device and the hot air gun are located between the material box and the fixed plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] (1) The positioning mechanism of the chip inductor welding device can drive the hollow sleeve, the movable rod, the electromagnetic suction block and the guide rod to move back and forth left and right through the servo motor and reciprocating screw of the driving structure. Since the guide rod is slidably installed in the guide groove of the fixed plate, the movable rod, the electromagnetic suction block and the guide rod can reciprocate along the direction of the guide groove, driving the electromagnetic suction block to transport the chip inductor inside the material box, and accurately placing the chip inductor on the welding position of the circuit board, thereby avoiding the welding position being easily offset when clamped by tweezers due to the small size of the inductor.

[0016] (2) The positioning mechanism of the SMD inductive welding device can also drive the conveyor roller, conveyor belt, flexible material discharge frame and material pusher block to rotate when the reciprocating screw rod of the driving structure drives the hollow sleeve to move back and forth left and right through the coordinated use of the transmission assembly, so as to push the unsoldered circuit board inside the material box to the bottom of the electromagnetic suction block, and push the welded circuit board out from the bottom of the electromagnetic suction block, so as to automatically load and unload the circuit board, realize dual-purpose of one machine, reduce the number of motors, and reduce the manufacturing cost of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a structural schematic diagram of another side of the present invention;

[0020] Figure 3 It is a placement diagram of the circuit board and the chip inductor of the present invention;

[0021] Figure 4 It is a structural schematic diagram of the guide rod of the present invention;

[0022] Figure 5 It is a structural schematic diagram of the material box of the present invention;

[0023] Figure 6 This is a soldering diagram of the chip inductor of the present invention.

[0024] 1. Support plate; 2. Transport roller; 3. Transport belt; 4. Flexible material discharge frame; 5. Pushing block; 6. Material box; 7. Positioning plate; 8. Servo motor; 9. Reciprocating screw; 10. Hollow sleeve; 11. Fixed plate; 12. Movable rod; 13. Electromagnetic suction block; 14. Electromagnetic suction block starter; 15. Electromagnetic suction block closer; 16. Material box; 17. First gear; 18. Second gear; 19. Gear belt; 20. Circuit board; 21. Chip inductor; 22. Guide rod. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In the description of the present invention, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0029] See also Figure 1-6The present invention provides a technical solution: a positioning mechanism of a chip inductor welding device, comprising a support plate 1, wherein the support plate 1 has two groups and is symmetrically arranged on the left and right, two groups of transport rollers 2 are rotatably installed on the two groups of support plates 1, the outer walls of the two groups of transport rollers 2 are sleeved with a transport belt 3, and the outer wall of the transport belt 3 is fixedly installed with a flexible material discharge frame 4, a material box 6 is fixedly installed on the top of the two groups of support plates 1, a material box 16 is arranged on the top of the transport belt 3, a circuit board 20 is placed on the inner side of the material box 6, and a chip inductor 21 is placed on the inner side of the material box 16, and also includes a driving structure and a guide component installed on the two groups of support plates 1, an electromagnetic suction block 13 is arranged below the guide component, and the driving structure and the guide component are used to accurately place the chip inductor 21 inside the material box 16 on the circuit board 20 through the coordinated use of the driving structure and the guide component, and a transmission component installed on the guide structure and the transport roller 2, and the driving structure is used to drive the transport roller 2 and the transport belt 3 to rotate through the transmission component.

[0030] The driving structure includes a servo motor 8, a reciprocating screw 9 and a hollow sleeve 10. The servo motor 8 is fixedly installed on the outer wall of one side of a group of support plates 1. The reciprocating screw 9 is rotatably installed on two groups of support plates 1. The hollow sleeve 10 is threadedly installed on the outer wall of the reciprocating screw 9, and the output shaft of the servo motor 8 is fixedly installed on one end of the reciprocating screw 9. When the servo motor 8 is started, the output shaft of the servo motor 8 drives the reciprocating screw 9 and the first gear 17 to rotate. The rotation of the reciprocating screw 9 drives the hollow sleeve 10, the movable rod 12, the electromagnetic suction block 13 and the chip inductor 21 to move back and forth left and right.

[0031] The guide assembly includes a fixed plate 11, a movable rod 12 and a guide rod 22. The fixed plate 11 is fixedly installed on the adjacent side walls of the two groups of support plates 1. The movable rod 12 is slidably installed on the inner side of the hollow sleeve 10, and one end of the movable rod 12 extends to the bottom of the hollow sleeve 10 and is fixedly installed with the electromagnetic suction block 13. The guide rod 22 is fixedly installed on the outer wall of the movable rod 12. The fixed plate 11 is provided with a guide groove, and the guide rod 22 is slidably installed in the guide groove. Since the guide rod 22 is slidably installed in the guide groove of the fixed plate 11, the movable rod 12, the electromagnetic suction block 13 and the guide rod 22 can reciprocate along the direction of the guide groove, driving the electromagnetic suction block 13 to transport the chip inductor 21 inside the material box 16, and accurately placing the chip inductor 21 on the welding position of the circuit board 20, avoiding the welding position being easily offset when clamped by tweezers due to the small size of the inductor.

[0032] The transmission assembly includes a first gear 17, a second gear 18 and a gear belt 19. The first gear 17 is fixedly mounted on the outer wall of the reciprocating screw rod 9, and the second gear 18 is fixedly mounted on the outer wall of a group of transport rollers 2. The gear belt 19 is sleeved on the outer sides of the first gear 17 and the second gear 18, and the gear belt 19 is meshed with the first gear 17 and the second gear 18. When the first gear 17 rotates, the first gear 17 drives the second gear 18, the transport roller 2, the transport belt 3, the flexible discharge frame 4, and the pusher block 5 to rotate through the gear belt 19. The rotation of the pusher block 5 drives the pusher block 5 to enter the material return chute, so that the pusher block 5 can push the circuit board 20 inside the material box 6, push the circuit board 20 to the inner side of the flexible discharge frame 4, and enable the flexible discharge frame 4 to transport the circuit board 20, and automatically load and unload the circuit board 20, thereby realizing dual-purpose of one machine, reducing the number of motors, and reducing the manufacturing cost of the equipment.

[0033] A discharge port is provided on the front side of the material box 6, a pushing groove is provided at the bottom of the material box 6, a pushing block 5 is fixedly installed on the top of the flexible discharge frame 4, and the pushing block 5 is located in the return groove. When the conveyor belt 3 and the flexible discharge frame 4 rotate, the pushing block 5 is used to push the circuit board 20 in the material box 6 into the flexible discharge frame 4, and automatically load the circuit board 20.

[0034] Positioning plates 7 are fixedly installed on the front and rear inner walls of the material box 6. There are four groups of positioning plates 7 that are symmetrically arranged in a rectangular shape, and the circuit board 20 is located between the four groups of positioning plates 7 for positioning the circuit board 20 to ensure that the circuit board 20 is pushed out from the discharge port.

[0035] The material box 16 is fixedly installed on the rear side of the fixed plate 11, and the bottom of the material box 16 and the bottom of the chip inductor 21 are in contact with the outer wall of the conveyor belt 3, which is used to position the chip inductor 21. When the conveyor belt 3 and the flexible material discharge frame 4 rotate, the chip inductor 21 can be moved to the bottom of the electromagnetic suction block 13 in sequence.

[0036] The front outer wall of the fixed plate 11 is fixedly installed with an electromagnetic suction block starter 14 and an electromagnetic suction block closer 15. The electromagnetic suction block starter 14 is located on the left side of the hollow sleeve 10, and the electromagnetic suction block closer 15 is located on the right side of the material box 16. Since the chip inductor 21 is slidably installed in the guide groove of the fixed plate 11, the chip inductor 21, the movable rod 12 and the electromagnetic suction block 13 move back and forth along the direction of the guide groove, and the left and right reciprocating motion of the hollow sleeve 10 enables the hollow sleeve 10 to be connected with the electromagnetic suction block starter 14 and the electromagnetic suction block closer 15. When the hollow sleeve 10 contacts the electromagnetic suction block starter 14, the electromagnetic suction block starter 14 will start the electromagnetic suction block 13, causing the electromagnetic suction block 13 to generate magnetism, driving the electromagnetic suction block 13 to adsorb the chip inductor 21, and being able to transport the chip inductor 21 to the circuit board 20 inside the flexible material discharge frame 4. When the flexible material discharge frame 4 is transported to the top of the flexible material discharge frame 4, the hollow sleeve 10 will contact the electromagnetic suction block closer 15, and the electromagnetic suction block closer 15 will close the electromagnetic suction block 13, so that the chip inductor 21 is placed on the top of the circuit board 20.

[0037] The top of the flexible material discharging frame 4 and the material discharging port of the material box 16 are both chamfered.

[0038] A solder paste feeding device and a hot air gun are fixedly installed on the outer wall of one side of another group of support plates 1, and the solder paste feeding device and the hot air gun are located between the material box 6 and the fixed plate 11. When the circuit board 20 is transported between the material box 6 and the fixed plate 11, the solder paste is applied to the circuit board 20 by the solder paste feeding device, and then the solder paste is hot-melted by the hot air gun.

[0039] Working principle: By starting the servo motor 8, the output shaft of the servo motor 8 drives the reciprocating screw 9 and the first gear 17 to rotate, and the rotation of the reciprocating screw 9 drives the hollow sleeve 10, the movable rod 12, the electromagnetic suction block 13, and the guide rod 22 to reciprocate left and right. Since the guide rod 22 is slidably installed in the guide groove of the fixed plate 11, the guide rod 22, the movable rod 12 and the electromagnetic suction block 13 reciprocate along the direction of the guide groove, and the left and right reciprocating motion of the hollow sleeve 10, The hollow sleeve 10 is able to contact the electromagnetic suction block starter 14 and the electromagnetic suction block closer 15. When the hollow sleeve 10 contacts the electromagnetic suction block starter 14, the electromagnetic suction block starter 14 will start the electromagnetic suction block 13, so that the electromagnetic suction block 13 generates magnetism, and drives the electromagnetic suction block 13 to adsorb the chip inductor 21, so that the chip inductor 21 can be transported to the circuit board 20 inside the flexible material discharging frame 4. When the flexible material discharging frame 4 is transported to the top of the flexible material discharging frame 4, the hollow sleeve 10 will contact the electromagnetic suction block closer 15, and the electromagnetic suction block closer 15 will close the electromagnetic suction block 13, so that the chip inductor 21 is placed on the top of the circuit board 20, and when the first gear 17 rotates, the first gear 17 drives the second gear 18, the conveying roller 2, the conveying belt 3, the flexible material discharge frame 4, and the pusher block 5 to rotate through the gear belt 19, and the rotation of the pusher block 5 drives the pusher block 5 to enter the material return slot, so that the pusher block 5 can push the circuit board 20 inside the material box 6 , push the circuit board 20 to the inner side of the flexible material discharge frame 4, and make the flexible material discharge frame 4 transport the circuit board 20. When the circuit board 20 is transported between the material box 6 and the fixed plate 11, the solder paste is applied to the circuit board 20 by the solder paste feeding equipment, and then the solder paste is melted by the hot air gun. When the circuit board 20 is transported to the bottom of the electromagnetic suction block 13, the chip inductor 21 at the bottom of the electromagnetic suction block 13 can fall accurately onto the circuit board 20, and the welding is completed after the solder cools down.

[0040] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A positioning mechanism for a patch inductor welding device, comprising a support plate (1), wherein the support plates (1) have two groups and are arranged symmetrically on both sides, two groups of transport rollers (2) are rotatably mounted on the two groups of support plates (1), the outer walls of the two groups of transport rollers (2) are sleeved with a transport belt (3), the outer wall of the transport belt (3) is fixedly mounted with a flexible material discharge frame (4), a material box (6) is fixedly mounted on the top of the two groups of support plates (1), a material box (16) is arranged on the top of the transport belt (3), a circuit board (20) is placed inside the material box (6), and a patch inductor (21) is placed inside the material box (16), wherein the characteristic is that: Also includes: A driving structure and a guide assembly are mounted on the two sets of support plates (1), and an electromagnetic suction block (13) is arranged below the guide assembly. The driving structure and the guide assembly are used to accurately place the chip inductor (21) inside the material box (16) on the circuit board (20); A transmission component is installed on the guide structure and the transport roller (2), and the drive structure is used to drive the transport roller (2) and the transport belt (3) to rotate through the transmission component.

2. The positioning mechanism of a patch inductive welding device according to claim 1, characterized in that: The driving structure comprises a servo motor (8), a reciprocating screw (9) and a hollow sleeve (10); the servo motor (8) is fixedly mounted on an outer wall of one side of a group of support plates (1); the reciprocating screw (9) is rotatably mounted on two groups of support plates (1); the hollow sleeve (10) is threadedly mounted on the outer wall of the reciprocating screw (9); and the output shaft of the servo motor (8) is fixedly mounted on one end of the reciprocating screw (9).

3. The positioning mechanism of a patch inductive welding device according to claim 2, characterized in that: The guide assembly comprises a fixed plate (11), a movable rod (12) and a guide rod (22); the fixed plate (11) is fixedly mounted on adjacent side walls of the two groups of support plates (1); the movable rod (12) is slidably mounted on the inner side of the hollow sleeve (10); one end of the movable rod (12) extends to the bottom of the hollow sleeve (10) and is fixedly mounted on the electromagnetic suction block (13); the guide rod (22) is fixedly mounted on the outer wall of the movable rod (12); the fixed plate (11) is provided with a guide groove, and the guide rod (22) is slidably mounted in the guide groove.

4. The positioning mechanism of a patch inductive welding device according to claim 3, characterized in that: The transmission assembly comprises a first gear (17), a second gear (18) and a gear belt (19); the first gear (17) is fixedly mounted on the outer wall of the reciprocating screw rod (9); the second gear (18) is fixedly mounted on the outer wall of a group of transport rollers (2); the gear belt (19) is sleeved on the outer sides of the first gear (17) and the second gear (18); and the gear belt (19) is meshed with the first gear (17) and the second gear (18).

5. The positioning mechanism of a patch inductive welding device according to claim 4, characterized in that: The front side of the material box (6) is provided with a discharge port, the bottom of the material box (6) is provided with a material pushing groove, and a material pushing block (5) is fixedly installed on the top of the flexible material discharge frame (4), and the material pushing block (5) is located in the material withdrawal groove.

6. The positioning mechanism of a patch inductive welding device according to claim 5, characterized in that: Positioning plates (7) are fixedly mounted on the front and rear inner walls of the material box (6). There are four groups of positioning plates (7) which are symmetrically arranged in a rectangular shape, and the circuit board (20) is located between the four groups of positioning plates (7).

7. The positioning mechanism of a patch inductive welding device according to claim 6, characterized in that: The material box (16) is fixedly mounted on the rear side of the fixed plate (11), and the bottom of the material box (16) and the bottom of the chip inductor (21) are both in contact with the outer wall of the conveyor belt (3).

8. The positioning mechanism of the patch inductive welding device according to claim 7, characterized in that: An electromagnetic suction block starter (14) and an electromagnetic suction block closer (15) are fixedly mounted on the front outer wall of the fixed plate (11); the electromagnetic suction block starter (14) is located on the left side of the hollow sleeve (10), and the electromagnetic suction block closer (15) is located on the right side of the material box (16).

9. The positioning mechanism of a patch inductive welding device according to claim 8, characterized in that: The top of the flexible material discharging frame (4) and the material discharging port of the material box (16) are both chamfered.

10. The positioning mechanism of a patch inductive welding device according to claim 9, characterized in that: A solder paste feeding device and a hot air gun are fixedly mounted on one side outer wall of another group of support plates (1), and the solder paste feeding device and the hot air gun are located between the material box (6) and the fixed plate (11).

Images