Memory module insertion device and normal position insertion judgment method thereof

Abstract

The present invention provides a memory module insertion device and a normal position insertion determination method thereof, comprising a pair of cylinders linked with a pair of finger clamps to pick up and insert a memory module in a slot, the cylinders having a constant pressure of high pressure air, and further utilizing compressibility of the high pressure air in the constant pressure environment to determine normal position insertion of the memory module. The counter-acting force feedback device is used for absorbing the counter-acting force fed back in the inserting process of the memory module and detecting the crumple distance generated by the counter-acting force so as to judge whether the memory module is positively inserted into the slot or not and protect the memory module from being damaged in the inserting process.

Description

Technical Field

[0001] The present invention relates to a technology for automatically inserting a memory module into a slot of a circuit motherboard, and in particular to an inserting device for a memory module and a method for determining whether the memory module is inserted in the correct position. Background Art

[0002] The memory modules discussed in the present invention generally include DIMM, SIMM, DRAM, SRAM, SDRAM, DDR and other memory modules that are automatically inserted into corresponding slots on a circuit motherboard.

[0003] In the existing patent technology, such as US20210138653A1, CN114043197A and CN213306099U, the related technology of automatically inserting the memory module on the slot of the circuit motherboard has been disclosed, including a finger-shaped fixture that can be opened and closed, a spring for absorbing the load and a force sensor installed on the fixture driven by the automatic arm (robot). The finger-shaped fixture is driven by the automatic arm to pick up a memory module, and the automatic arm is moved to the top of the corresponding slot on the circuit motherboard where the memory module is to be inserted, and then the memory module is driven to be inserted into the slot to complete the automatic insertion operation of the memory module. Among them, the spring plays the role of offsetting or absorbing the reaction force (i.e., load) generated by the insertion axis (represented by the Z axis), and the force sensor plays the role of detecting the size of the reaction force of the insertion axis (i.e., the Z axis) so as to determine whether the insertion action of the memory module is a normal insertion or a skewed insertion.

[0004] The above-mentioned US20210138653A1 case even further discloses that the entire insertion process of the memory module is divided into the first stage and the second stage of insertion control. In both stages of insertion control, springs with different pressure coefficients are used to provide insertion forces. Among them, the first stage of insertion is used to determine when the memory module is not aligned with the slot, and the spring used in the first stage is used to sense the reaction force fed back when the memory module touches the periphery of the slot (that is, the insertion is not correct, or it is called skewed insertion) to determine the insertion failure; when the spring used in the first stage senses that the memory module is correctly inserted into the slot, the spring used in the second stage will be used to strengthen the thrust of the finger clamp, so that the memory module can be firmly inserted into the slot.

[0005] However, it is well known that springs have the problem of elastic fatigue after long-term use, which can easily affect the force sensing accuracy that can be detected by the force sensor during the insertion process of the memory module, resulting in a negative impact on the assembly yield during the automated assembly process of automatically inserting the memory module into the slot of the circuit motherboard. Summary of the invention

[0006] In view of the above problems existing in the aforementioned prior art, the purpose of the present invention is to provide a memory module insertion device and a method for determining whether the memory module is properly inserted, so as to abandon the use of springs or elastic elements as sensing elements to offset or absorb reaction forces during the process of inserting the memory module.

[0007] The present invention particularly relies on the compressibility of high-pressure air and the characteristics of high-pressure air being able to maintain constant pressure supply and being easy to control to replace the elastic force sensing technology used in the prior art.

[0008] To achieve the above-mentioned purpose, the present invention provides a memory module insertion device, which is composed of a jig capable of multi-dimensional movement, and the jig includes: a double-headed cylinder for driving a pair of slides to move synchronously in opposite directions along an X-axis; a pair of single-headed cylinders, respectively arranged on each of the slides along a Z-axis; and a pair of finger-shaped clamps, respectively connected to each of the single-headed cylinders along the Z-axis, and the pair of single-headed cylinders can drive the pair of finger-shaped clamps to move synchronously along the Z-axis; wherein the pair of finger-shaped clamps are respectively formed with an inverted L-shaped retaining surface that can contact two adjacent corners of the memory module, and an end face of each of the inverted L-shaped retaining surfaces is composed of a slot distributed on the Z-axis, and each of the slots can limit the movement of the memory module along the X-axis through the power restraint of the double-headed cylinder.

[0009] In a further implementation, each of the slots has a stopper capable of blocking the memory module from moving along the Z axis. Both ends of each of the slots are respectively formed with the stopper and a pick-up port open to the outside along the Z axis. Each of the slots is formed by three adjacent end walls and an opening, and the three end walls respectively have an arc surface feature capable of limiting the cross-sectional area of ​​the slot along the X axis and the Y axis.

[0010] In a further implementation, the pair of single-head cylinders respectively maintain a constant pressure provided by high-pressure air, and the pair of finger-shaped clamps can pick up and insert the memory module into a slot. The pair of finger-shaped clamps can encounter a reaction force in the Z-axis direction when inserting the memory module; when the reaction force is less than the constant pressure, it is determined that the memory module is correctly inserted into the slot; when the reaction force is greater than the constant pressure, by virtue of the compressibility of the high-pressure air in the constant pressure, each of the finger-shaped clamps generates a detectable collapse distance in the Z-axis direction, which is used to determine that the memory module is not correctly inserted into the slot.

[0011] In a further implementation, an upper sensor and a lower sensor are spaced apart along the Z-axis on each of the single-head cylinders, and the collapse distance is detected by the upper sensor and the lower sensor.

[0012] The present invention further provides a method for determining whether a memory module is correctly inserted, comprising: driving a pair of finger-shaped clamps to separate and then mate along an X-axis to pick up a memory module and move it to a standby insertion position on a Z-axis, and then driving the pair of finger-shaped clamps to insert the memory module into a slot along the Z-axis; wherein: the memory module is subjected to a reaction force fed back by the slot during the insertion process, and each of the finger-shaped clamps maintains a constant pressure provided by high-pressure air to offset the reaction force; when the reaction force is less than the constant pressure, it is determined that the memory module is correctly inserted into the slot; and when the reaction force is greater than the constant pressure, the finger-shaped clamps are caused to form a collapse distance that can offset the reaction force by virtue of the compressibility of the high-pressure air in the constant pressure, and the collapse distance is detected to determine that the memory module is not correctly inserted into the slot.

[0013] In a further implementation, each of the finger-shaped grippers maintains the same constant pressure, and the collapse distance is generated by at least one finger-shaped gripper of the pair of finger-shaped grippers. Each of the finger-shaped grippers detects the collapse distance via an upper sensor and a lower sensor spaced apart along the Z axis.

[0014] In a further implementation, when a movable stroke of each of the finger-shaped clamps is maintained between the detection of the upper sensor and the lower sensor, and the collapse distance of the pair of finger-shaped clamps is simultaneously 0, it is determined that the memory module is correctly inserted into the slot; or, when the collapse distance of the pair of finger-shaped clamps is simultaneously greater than 0 and less than the movable stroke, it is determined that the memory module is correctly inserted into the slot.

[0015] In a further implementation, the upper sensor and the lower sensor detect that there is a movable stroke of each of the finger-shaped clamps, and when the collapse distances of the pair of finger-shaped clamps are different, it is determined that the memory module is not properly inserted into the slot.

[0016] In a further implementation, when it is determined that the memory module is properly inserted into the slot, the pair of finger grippers are made to pick up another memory module again to repeat the determination of the proper insertion.

[0017] In a further implementation, when it is determined that the memory module is not properly inserted into the slot, the pair of finger clamps are reset to the standby insertion position, and the insertion action and the determination of proper insertion are re-executed.

[0018] Based on the above content, the present invention utilizes the constant pressure generated by high-pressure air and its compressible characteristics under the constant pressure environment to offset or absorb the reaction force generated during the memory module insertion process, and accurately detects and determines whether the memory module has been properly inserted into the slot, so as to protect the memory module from damage during the automatic insertion process. Therefore, in the assembly process of automatically inserting the memory module into the slot of the circuit motherboard, the present invention can improve the automated insertion yield compared to the prior art.

[0019] To this end, please further refer to the drawings and detailed description of the preferred embodiments of the present invention as described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 1 is a top view of the insertion device of the present invention, illustrating the state in which the insertion device is installed on an assembly line of a memory module.

[0021] Figure 2 It is a three-dimensional schematic diagram of the insertion device of the present invention.

[0022] Figure 3 yes Figure 2 Front view of.

[0023] Figure 4 yes Figure 2 A schematic bottom-view perspective diagram illustrating the paired finger grippers that can pick up and hold a memory module.

[0024] Figure 5 yes Figure 4 A partial bottom view of the middle finger-shaped clamp is enlarged to illustrate the slot features of the finger-shaped clamp.

[0025] Figure 6 FIG. 4 is another three-dimensional schematic diagram of the insertion device of the present invention, illustrating the insertion device inserting the memory module into the slot.

[0026] Figure 7 It is a program block diagram of the method for determining whether the memory module is properly inserted according to the present invention.

[0027] Figure 8 It is a schematic diagram of the insertion device of the present invention driving the memory module to a standby insertion position.

[0028] Figure 8a It is a continuation Figure 8 Schematic diagram of the first state in which the memory module is inserted correctly into the slot in the state.

[0029] Figure 8b It is a continuation Figure 8 A schematic diagram of a second state in which the memory module is inserted correctly into the slot in the state.

[0030] Figure 8c It is a continuation Figure 8 Schematic diagram of the state where the memory module is not properly inserted into the slot.

[0031] Explanation of the reference numerals: 10- conveyor line; 20- collection platform; 30- automatic arm; 40- double-headed cylinder; 41- slide seat; 42- locking surface; 43- fixture connecting seat; 50- single-headed cylinder; 50a, 501a- upper sensor; 50b, 501b- lower sensor; 51, 51a, 51b- cylinder rod; 52- slide rail; 53- slide table; 60- finger clamp; 61- seat block; 62- clamping rod; 63- slot; 631- opening; 632- bottom edge; 633- side edge; 64- inverted L-shaped retaining surface; 31- working end; 80- memory module; 90- circuit motherboard; 91- slot; F- normal force; h- movable stroke; L- collapse distance; P- constant pressure; R- reaction force; S- arc surface feature; S1 to S4- step description. DETAILED DESCRIPTION

[0032] First, please refer to Figures 1 to 3 , together illustrate the preferred configuration details of a memory module insertion device of the present invention; the memory module 80 described below in the present invention can be any one of DIMM, SIMM, DRAM, SRAM, SDRAM, DDR. Among them:

[0033] Figure 1 A conveyor line 10 for assembling a circuit motherboard 90 is provided. The circuit motherboard 90 has a plurality of slots 91 embedded with memory modules 80. A collecting table 20 for collecting the plurality of memory modules 80 is provided on the side of the conveyor line 10, and an automatic arm 30 capable of multi-axis movement is arranged between the conveyor line 10 and the collecting table 20. The insertion device of the present invention is installed on a working end 31 of the automatic arm 30 and is used as a fixture of the automatic arm 30.

[0034] Continue as Figure 2 and Figure 3 As shown, the fixture (i.e., the insertion device of the present invention) includes a double-head cylinder 40, a pair of single-head cylinders 50, and a pair of finger-shaped clamps 60; wherein:

[0035] The double-headed cylinder 40 is arranged along an X-axis (shown as horizontal in the figure), and has two output ends that can move synchronously in opposite directions along the X-axis, and are used to drive and connect an L-shaped slide 41 respectively, so that the double-headed cylinder 40 can drive the paired L-shaped slides 41 to move synchronously in opposite directions along the X-axis by means of high-pressure air, and each of the L-shaped slides 41 has a locking surface 42 extending from the X-axis to a Z-axis (shown as vertical in the figure); in addition, the top of the double-headed cylinder 40 is arranged along the Z-axis with a fixture connection seat 43 for assembling the above-mentioned automatic arm 30.

[0036] The pair of single-headed cylinders 50 is configured in pairs by two single-headed cylinders 50, and each of the single-headed cylinders 50 is configured on the locking surface 42 of each of the slide seats 41 along the Z-axis. In addition, each of the single-headed cylinders 50 has a cylinder rod 51 that can move along the Z-axis, and the outer wall of each of the single-headed cylinders 50 is also formed with a slide rail 52 distributed along the Z-axis. Each of the cylinder rods 51 is used to drive and connect an L-shaped slide 53, and each of the slides 53 is configured on each of the slide rails 52; accordingly, each of the single-headed cylinders 50 can drive each slide 53 to move along the Z-axis by high-pressure air. Furthermore, each of the single-headed cylinders 50 is spaced apart along the Z-axis with an upper sensor 50a and a lower sensor 50b to detect a collapse distance L (i.e., an upward movement distance, such as Figure 8b and Figure 8c Moreover, the pair of finger-shaped fixtures 60 is configured in pairs, and each of the finger-shaped fixtures 60 is respectively connected to each single-head cylinder 50 along the Z axis through the assembly of each slide 53, so that each single-head cylinder 50 can drive the pair of finger-shaped fixtures 60 to move synchronously along the Z axis.

[0037] Further, please match Figure 3 and Figure 4 As shown, each of the finger-shaped clamps 60 has a T-shaped seat block 61 and a clamping rod 62 fixed to a side wall of the seat block 61; each of the finger-shaped clamps 60 is fixed to the bottom of each slide 53 via the seat block 61; each of the clamping rods 62 is mounted along the Z-axis and is formed with a slot 63 distributed along the Z-axis, and the two slots 63 are respectively formed with an opening portion 631 that is relatively open along the X-axis, thereby constructing an embedding surface area for clamping the memory module 80.

[0038] Furthermore, if Figure 5As shown, each of the slots 63 is formed by three adjacent end walls and the opening 631, and the three end walls include two side edges 633 and a bottom edge 632 adjacent thereto. In addition, the two ends of each of the slots 63 respectively form a stopper and a pick-up opening open to the outside along the Z axis; wherein the stopper may be a bottom wall of the seat block 61, which is used to close an inner end of the two ends of each of the slots 63, and make the pick-up opening an outer end of the two ends of each of the slots 63 and open to the outside along the Z axis.

[0039] The memory module 80 is implanted in the two slots 63 by two pick-up ports and two openings 631, so that the pair of finger-shaped clamps 60 are respectively formed with an inverted L-shaped retaining surface 64 (such as Figure 3 ); wherein, the two side edges 633 and the bottom edge 632 located at each of the picking ports respectively have an arc surface feature S that can limit the cross-sectional area of ​​the slot 63 in the X-axis and Y-axis, and one end face of each of the inverted L-shaped retaining surfaces 64 is composed of the bottom edge 632 of the slot 63 distributed in the Z-axis, so that after the pair of slots 63 pick up and clamp the memory module 80, the power constraint of the double-headed cylinder 40 can be used to limit the movement or shaking of the memory module 80 along the X-axis, and the movement or shaking of the memory module 80 in the surface area constructed by the X-axis and the Y-axis can be further limited by the constraint of the above three arc surface features S.

[0040] like Figure 6 As shown, the automatic arm 30 drives the jig to pick up the memory module 80 and then insert the memory module 80 into the slot 91 on the circuit motherboard 90. Among them, through the configuration technology of the above-mentioned jig, the position accuracy of the memory module 80 during the movement and insertion process can be fully controlled to improve the yield rate of the automated insertion operation.

[0041] In addition to the above, the present invention also includes a method for determining whether a memory module is properly inserted according to the configuration details of the insertion device. Figure 7 , providing the determination method comprises executing the following steps S1 to S5:

[0042] Step S1: Driving the finger gripper to pick up the memory module

[0043] This step relies on the above-mentioned automatic arm 30 with multi-axis displacement accuracy to drive the fixture (i.e., the insertion device) to Figure 1 The collecting table 20 shown is used to collect the memory module 80, and uses high-pressure air to drive the slide 41 of the double-head cylinder 40 to open relatively along the X-axis and then close relatively, so as to drive the pair of finger-shaped clamps 60 to open relatively along the X-axis and then close relatively via the pair of single-head cylinders 50 to pick up the memory module 80.

[0044] Step S2: Drive the memory module to the standby insertion position

[0045] This step relies on the automatic arm 30 to drive the memory module 80 to the top of a predetermined slot 91 on the conveyor line 10 where a circuit motherboard 90 has been placed. The top of the predetermined slot 91 is used as the standby insertion position of the memory module of the present invention. The standby insertion position refers to a predetermined coordinate position (such as the coordinate position of the predetermined slot 91) directly above the predetermined slot 91 along the Z axis and not in contact with the slot 91 where the insertion action is to be performed. Figure 4 As shown in FIG. 1 , when the pair of finger-shaped fixtures 60 separate and then mate along the X-axis to pick up the memory module 80, the three curved surface features S of the pair of slots 63 can prevent the memory module 80 from moving or shaking in the X-axis and Y-axis domains.

[0046] Step S3: driving the finger clip to insert the memory module

[0047] This step relies on the automatic arm 30 to provide a positive force F to drive the fixture to move along the Z axis toward the slot 91 (i.e., move downward), so as to drive the pair of finger-shaped fixtures 60 to insert the memory module 80 into the predetermined slot 91 along the Z axis (e.g., Figure 6 , Figure 8a and Figure 8b During the insertion process, the high-pressure air is accumulated in the pair of single-head cylinders 50, so that the cylinder rod 51 maintains a constant pressure P, and when the memory module 80 touches the slot 91, each finger-shaped clamp 60 transmits a reaction force R in the opposite direction to the positive force F along the Z axis; in the present invention, the constant pressure P is used to offset the reaction force R, so as to ensure that the multiple conductive terminals at the bottom of the memory module 80 are not damaged when the reaction force R is too large.

[0048] The present invention can construct a control unit by a programmable logic controller (hereinafter referred to as PLC), which is responsible for controlling the timing of the electric drive of the automatic arm 30, the timing of the electromagnetic switch valve starting the high-pressure air to drive the double-head cylinder 40 and the paired single-head cylinder 50, and the ON and OFF potential signals of the paired upper sensors 50a and the paired lower sensors 50a, wherein the upper sensors 50a and the lower sensors 50a can be made of reed switches.

[0049] For example, when the high pressure air source provided in the factory implementing the present invention is 5kg / cm 2 When the control end of the insertion device (eg, constructed) can be defined as less than 5 kg / cm according to the collision resistance hardness of the conductive terminal of the memory module 80, the constant pressure P is defined as less than 5 kg / cm 2 2kg / cm 2(P>0), and it is assumed that the cylinder rod 51 can withstand the high pressure air contact area of ​​1cm 2 According to the natural law and formula of F (or R) = PA, the conductive terminal of the memory module 80 can withstand the maximum reaction force R of the push contact. max =2kg. In other words, during the insertion process, whether the memory module 80 is properly inserted into the slot 91 or not, the conductive terminals of the memory module 80 are protected by the constant pressure P and are not damaged.

[0050] Step S4: Determine whether the memory module is properly inserted

[0051] See also Figure 8 The status shown, and check them one by one Figures 8a to 8c , used to illustrate the determination process from step S2 to step S4; wherein:

[0052] Figure 8 It is revealed that in step S2, the memory module 80 is located at the standby insertion position of the Z axis. At this time, the cylinder rod 51 of the pair of single-head cylinders 50 is at the bottom position of a movable stroke h, and is detected by the lower sensors 50b of the left and right cylinder rods 51 as being in the same ON state (indicated by a solid circle in the figure), and the two upper sensors 50a are detected as being in the same OFF state (indicated by a hollow circle in the figure), and it is determined that the memory module 80 located at the standby insertion position can be inserted at any time.

[0053] Since each of the finger-shaped clamps 60 and the cylinder rod 51 are mutually transmission-connected, the movable stroke h and the collapse distance L can be respectively interpreted as the movable stroke h or the collapse distance L of each of the cylinder rod 51 or each of the finger-shaped clamps 60 in the Z axis.

[0054] Figure 8a The first state of the memory module 80 being inserted in the positive position is disclosed. That is, in step S3, the memory module 80 is driven by the positive force F of the automatic arm 30 and moves from the original standby insertion position (such as Figure 8 ) moves toward the slot 91, thereby completing the step S4 of inserting the positive position into the slot 91 (such as Figure 8a During this process, the slot 91 provides a reaction force R in the opposite direction to the positive force F to act on the memory module 80. Since the reaction force R is smaller than the maximum reaction force R converted from the above constant pressure P, max(2 kg), so the pair of cylinder rods 51 do not move, that is, they still remain in the bottom position and no collapse distance L is generated (i.e., L = 0), and the two lower sensors 50b still remain in the same ON state (represented by solid circles in the figure), and the two upper sensors 50a still remain in the same OFF state (represented by hollow circles in the figure). Accordingly, the PLC can determine that the memory module 80 has been properly inserted into the slot 91.

[0055] Figure 8b Reveals the second aspect of the proper insertion of the memory module 80, which is different from Figure 8a The difference lies in that the reaction force R exerted by the slot 91 on the memory module 80 is greater than the maximum reaction force R converted from the above-mentioned constant pressure P max (2 kg), such that the collapse distances L of the pair of cylinder rods 51 simultaneously rising along the z-axis are all less than the movable stroke h (i.e., 0 < L < h); wherein, the compressibility of the high-pressure air in each constant pressure P can be relied upon to offset the said larger reaction force R; in this state, the two lower sensors 50b change to the same OFF state (represented by hollow circles in the figure), and the two upper sensors 50a still remain in the same OFF state (represented by hollow circles in the figure), and the PLC can determine that the memory module 80 has been properly inserted into the slot 91.

[0056] Figure 8c Reveals a state of improper (i.e., skewed) insertion of the memory module 80, that is, the memory module 80 moves from the Figure 8 shown standby insertion position towards the slot 91, but the terminals at the right bottom edge of the memory module 80 touch the fastener 91a at the right end of the slot 91 (as shown in Figure 8c ), and as a result, the reaction force R is greater than the maximum reaction force R converted from the above-mentioned constant pressure P max (2 kg), and consequently causing the finger clamps 60 on at least one side of the left and right sides to generate a detectable collapse distance L in the Z-axis, and the collapse distance L is equal to the movable stroke h of each cylinder rod 51 (i.e., L = h). In this regard, the present invention relies on the compressibility of the high-pressure air in each constant pressure P to allow the reaction force R of the slot 91 to be greater than the maximum reaction force R converted from the above-mentioned constant pressure P max (2 kg) to protect the memory module 80 or the terminals at its bottom from being damaged by excessive reaction forces.

[0057] In the above-mentioned non-proper (i.e. skewed) insertion state, the contact point for the memory module 80 to generate the reaction force R may be, in addition to the fasteners 91a at either end of the slot 91, the slot frame around the slot 91. The fasteners 91a at both ends of the slot 91 will be opened in advance manually or by other automatic machines before the memory module 80 is inserted, which can reduce the collision caused by the memory module 80 when it is inserted, and is explained.

[0058] And know that Figure 8c Taking the skewed insertion state as an example, it is explained that the cylinder rod 51a on the left side is maintained at the bottom position and does not move (no detectable shrinkage distance L is generated, L=0), so that the upper sensor 501a on the left side is maintained in the OFF state (indicated by a hollow circle in the figure) and the lower sensor 501b on the left side is maintained in the ON state (indicated by a solid circle in the figure), while the cylinder rod 51b on the right side moves up and shrinks to the top position (a detectable shrinkage distance L is generated, L=h), so that the upper sensor 501a on the right side is maintained in the ON state (indicated by a solid circle in the figure) and the lower sensor 501b on the left side is maintained in the OFF state (indicated by a hollow circle in the figure). Accordingly, the PLC can determine that the memory module 80 is not properly inserted (i.e., skewed) in the slot 91.

[0059] According to the above description, when the cylinder rod 51a on either side of the pair of single-head cylinders 50 generates a collapse distance L, or when the cylinder rods 51a on both sides simultaneously generate a collapse distance L, it is possible to specifically determine whether the memory module 80 is properly inserted into the slot 91 by means of the known mature technology of electrically connecting the upper sensor 50a and the lower sensor 50b installed on each of the single-head cylinders 50 to the PLC. In particular, the collapse distance L can be interpreted as being equal to (e.g. Figure 8c ) or less than (such as Figure 8b ) The movable stroke h of each cylinder rod 51.

[0060] Step S5: Complete the slot

[0061] When the PLC determines that the memory module 80 has been properly inserted into the slot 91, Figure 7 As shown, the process returns to step S1, that is, the automatic arm 30 is instructed to drive the pair of finger-shaped clamps 60 to move to the stacking platform 20 to pick up another memory module, and then the correct insertion determination method shown in steps S1 to S5 is repeatedly executed.

[0062] In addition, if Figure 7As shown, during the execution of step S4, when the PLC determines that the memory module 80 has not been properly inserted (i.e., inserted crookedly) in the slot 91, it will return to step S2, allowing the automatic arm 30 to drive the memory module 80 to reset and move to the standby insertion position of the Z axis, so as to re-execute the action of inserting the memory module 80 in step S3 and the action of determining whether the memory module 80 is properly inserted in step S4.

[0063] The above embodiments are only preferred embodiments of the present invention, but they cannot be construed as limiting the scope of protection of the present invention. Therefore, the present invention should be based on the contents defined in the claims.

Claims

1. A memory module insertion device, comprising a jig capable of multi-dimensional movement, characterized in that: The fixture includes: A double-headed cylinder is used to drive a pair of slides to move synchronously in opposite directions along an X-axis; A pair of single-head cylinders, respectively disposed on each slide along a Z axis; and A pair of finger-shaped clamps are respectively connected to each of the single-head cylinders along the Z axis, and the pair of single-head cylinders can drive the pair of finger-shaped clamps to move synchronously along the Z axis; Among them, the pair of finger-shaped clamps are respectively formed with an inverted L-shaped retaining surface that can contact two adjacent corners of the memory module, and an end face of each of the inverted L-shaped retaining surfaces is composed of a slot distributed on the Z axis, and each of the slots can limit the movement of the memory module along the X axis through the power restraint of a double-head cylinder.

2. The memory module insertion device according to claim 1, characterized in that: Each of the slots has a stopper capable of stopping the memory module from moving along the Z axis.

3. The memory module insertion device according to claim 1 or 2, characterized in that: The two ends of each slot are respectively formed with the blocking portion and a pick-up port open to the outside along the Z axis.

4. The memory module insertion device according to claim 3, characterized in that: Each of the slots is formed by three adjacent end walls and an opening, and the three end walls respectively have an arc surface feature capable of limiting the cross-sectional area of ​​the slot in the X-axis and the Y-axis.

5. The memory module insertion device according to claim 1, characterized in that: The pair of single-head cylinders respectively maintain a constant pressure provided by high-pressure air, and the pair of finger-shaped clamps can pick up and insert the memory module into a slot. The pair of finger-shaped clamps can encounter a reaction force in the Z-axis direction when inserting the memory module; when the reaction force is less than the constant pressure, it is determined that the memory module is correctly inserted into the slot; when the reaction force is greater than the constant pressure, by virtue of the compressibility of the high-pressure air in the constant pressure, each of the finger-shaped clamps generates a detectable collapse distance in the Z-axis direction, which is used to determine that the memory module is not correctly inserted into the slot.

6. The memory module insertion device according to claim 5, characterized in that: An upper sensor and a lower sensor are disposed at intervals along the Z axis on each single-head cylinder, and the collapse distance is detected by the upper sensor and the lower sensor.

7. The memory module insertion device according to claim 6, characterized in that: The upper sensor and the lower sensor are respectively made of a magnetic reed switch.

8. A method for determining whether a memory module is properly inserted, characterized in that: include: A pair of finger-shaped fixtures are driven to separate and then mate along an X-axis to pick up a memory module and move it to a standby insertion position along a Z-axis, and then the pair of finger-shaped fixtures are driven to insert the memory module into a slot along the Z-axis; wherein: The memory module is subjected to a reaction force fed back by the slot during the insertion process, and each of the finger-shaped clamps maintains a constant pressure provided by high-pressure air to offset the reaction force; When the reaction force is smaller than the constant pressure, it is determined that the memory module is correctly inserted into the slot; when the reaction force is larger than the constant pressure, the compressibility of the high-pressure air in the constant pressure allows the finger clamp to have a collapse distance that can offset the reaction force, and the collapse distance is detected to determine that the memory module is not correctly inserted into the slot.

9. The method for determining whether a memory module is properly inserted as claimed in claim 8, wherein: The constant pressure maintained by each of the finger-shaped clamps is the same, and the collapse distance is generated by the finger-shaped clamp on at least one side of the pair of finger-shaped clamps.

10. The method for determining whether a memory module is properly inserted as claimed in claim 8 or 9, characterized in that: Each of the finger-shaped clamps detects the collapse distance via an upper sensor and a lower sensor spaced apart along the Z axis.

Images