Polishing apparatus and polishing method

CN119136947APending Publication Date: 2024-12-13FUJIKOSHI MACHINERY
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Patent Information

Application Number
CN202380037787.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-05-26
Filing Date
2023-04-03
Publication Date
2024-12-13

AI Technical Summary

Technical Problem

The prior art cannot effectively grind the workability in the concave and convex parts of the surface of high-hard material workpieces, and cannot effectively consider the concave and convex distribution of the surface of the workpiece.

Method used

The air pocket generation and injection device is used to cause the liquid flow containing the air pocket to collide with the surface of the workpiece, and the hardness is reduced through surface modification (oxidation), thereby improving the processability in the specified parts of the workpiece for grinding. The device includes an inner cylinder and an outer cylinder. The liquid flow that generates air pockets in the inner cylinder is covered by the outer cylinder to ensure that the air pockets and the surface of the workpiece are effectively collided.

Benefits of technology

Through surface modification, the surface of the workpiece is partially reduced in hardness at the specified part, improving the machining ability in a short time, achieving efficient grinding of the workpiece surface, and taking into account the concave and convex distribution of the workpiece.

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Abstract

The present invention addresses the problem of providing a polishing device and a polishing method that improve workability in a short time by modifying the surface of a workpiece in consideration of the irregularity distribution of the surface of the workpiece. As a solution, a polishing device (10) for polishing a workpiece (W) is characterized in that the polishing device (10) has a cavitation generation injection device (50) having an inner cylinder (54) through which a first liquid flow (A) flows, the inner cylinder (54) having a cavitation generation unit (54a), the cavitation generation injection device (50) is configured so as to generate cavitation in the first liquid flow (A), and the cavitation generation unit (54a) is configured so as to generate cavitation in the second liquid flow (A), and the cavitation generation unit (54a) is configured so as to generate cavitation in the second liquid flow (A). The first liquid flow (A) is caused to collide with the workpiece (W).
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