Workpiece positioning mechanism and workpiece inspection device

Abstract

Provided are a workpiece positioning mechanism and a workpiece inspection device that stably maintain a precise positional relationship between a tray on which a workpiece is disposed and an inspection device for the workpiece with a simple structure. A workpiece positioning mechanism (10) is provided with: a tray (26) on which a workpiece (30) is disposed; a frame (45) in which a cutout (49) for specifying the height position of the tray (26) taken in the inspection area (17) is formed; a plurality of pins (43) provided on the frame (45) and positioning the tray (26); and an urging mechanism that urges the bottom surface and places the tray (26) in the inspection region (17).

Description

Technical Field

[0001] The present invention relates to an in-tray type workpiece positioning mechanism and a workpiece inspection device for inspecting a workpiece while the workpiece is arranged on a pallet. Background Art

[0002] Inspection of chips cut from a semiconductor package or wafer is generally classified into the following two types. The first is an in-tray method in which inspection is performed with workpieces arranged on a tray on which the workpieces to be inspected are arranged (e.g., Patent Document 1). The second is a pick-and-place method in which workpieces are taken out of a tray, placed on an inspection table for inspection, and then put back on the tray after inspection (e.g., Patent Document 2).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-295814

[0006] Patent Document 2: Japanese Patent Application Publication No. 2003-114251 Summary of the invention

[0007] Problems to be solved by the invention

[0008] By the way, in the pick-and-place method, it is necessary to carry out / carry in the workpiece to be inspected from the pallet. Therefore, it takes a lot of time to carry out the replacement operation, which leads to a problem of reduced production. In contrast, the in-tray method can overcome the disadvantages of the pick-and-place method mentioned above.

[0009] In the in-tray method, a workpiece inspection area is set in the middle of the pallet conveying path. In addition, in the inspection area, it is difficult to always stably maintain the precise positional relationship between the pallet being intermittently conveyed and the inspector of the workpiece.

[0010] The present invention has been made in consideration of such a situation, and an object of the present invention is to provide a workpiece positioning mechanism and a workpiece inspection device that can stably maintain a precise positional relationship between a pallet on which workpieces are arranged and an inspector for the workpieces with a simple structure.

[0011] Means used to solve problems

[0012] The workpiece positioning mechanism of the present invention comprises: a pallet on which a workpiece is arranged; a frame on which a notch is formed for specifying the height position of the pallet in the inspection area; a plurality of pins provided on the frame for positioning the pallet; and a force applying mechanism for applying force to the bottom surface to position the pallet in the inspection area.

[0013] Effects of the Invention

[0014] According to the present invention, it is possible to provide a workpiece positioning mechanism and a workpiece inspection device that can stably maintain a precise positional relationship between a pallet on which workpieces are arranged and an inspector for the workpieces with a simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is an XY bottom view of a frame defining an inspection area in the work positioning mechanism according to the first embodiment of the present invention.

[0016] Figure 2 (A) is a front view showing a state where the force applied to the bottom surface is released and the tray is separated from the inspection area. Figure 2 (B) is an enlarged view of the periphery of the positioning pin of the pallet.

[0017] Figure 3 (A) is a front view showing a state where a force is applied to the bottom surface of the tray to place it in the inspection area. Figure 3 (B) is an enlarged view of the periphery of the positioning pin of the pallet.

[0018] Figure 4 (A) is a YX plan view for explaining the operation of the workpiece positioning mechanism according to the first embodiment. Figure 4 (B) is its Z-X front view. Figure 4 (C) is its Y-Z side view.

[0019] Figure 5 (A) is a YX plan view for explaining the operation of the workpiece positioning mechanism according to the first embodiment. Figure 5 (B) is its Z-X front view. Figure 5 (C) is its Y-Z side view.

[0020] Figure 6 (A) is a YX plan view for explaining the operation of the workpiece positioning mechanism according to the first embodiment. Figure 6 (B) is its Z-X front view. Figure 6 (C) is its Y-Z side view.

[0021] Figure 7 (A) is a YX plan view for explaining the operation of the workpiece positioning mechanism according to the first embodiment. Figure 7 (B) is its Z-X front view. Figure 7 (C) is its Y-Z side view.

[0022] Figure 8 It is a YX plan view showing a workpiece inspection device according to a second embodiment of the present invention.

[0023] Fig. 9It is a YZ side view which shows the workpiece inspection device according to the second embodiment of the present invention.

[0024] Fig.10 (A) is a top perspective view of a multilayer wiring substrate having bumps arranged on the upper surface used as a workpiece of the present embodiment, Fig.10 (B) is a side perspective view of an LSI package in which an LSI chip is mounted on a multilayer wiring substrate. DETAILED DESCRIPTION

[0025] (First embodiment)

[0026] Hereinafter, embodiments of the present invention will be described based on the drawings. Figure 1 This is an XY bottom view of the frame 45 defining the inspection area 17 in the work positioning mechanism 10 according to the first embodiment of the present invention. In the embodiment, two inspection areas 17, namely the first inspection area 17a and the second inspection area 17b, are shown as the inspection area 17, but only one may be provided.

[0027] Thus, the workpiece positioning mechanism 10 comprises: a tray 26 on which the workpiece 30 is arranged; a frame 45 having a notch 49 defining the height position of the tray 26 to be positioned in the inspection area 17 (17a, 17b); a plurality of pins 43 provided on the frame 45 to position the tray 26; a force applying mechanism 31 (see Figure 2 , Figure 3 ), apply force to the bottom surface and position the tray 26 in the inspection area 17.

[0028] In this way, the positioning pins 43 of the tray 26 are arranged so as to surround the outer periphery of the first inspection area 17a and the second inspection area 17b. In addition, the notches 49 that define the height position of the tray 26 do not need to be evenly arranged on the outer periphery of the inspection area 17 (17a, 17b), and can also be arranged near the positioning pins 43 or integrated with the positioning pins 43.

[0029] Figure 2 (A) is a front view showing a state where the force applied to the bottom surface is released and the tray 26 is separated from the inspection area 17 . Figure 2 (B) is an enlarged view of the periphery of the positioning pin 43 of the tray 26. Figure 3 (A) is a front view showing a state where a force is applied to the bottom surface of the tray 26 so as to be positioned in the inspection area 17 . Figure 3 (B) is an enlarged view of the periphery of the positioning pin 43 of the tray 26.

[0030] The pin 43 includes a body 46 connected to the frame 45 and having a constant outer diameter, and having a side surface in contact with the periphery of the tray 26 to define its planar position; and a tapered portion 47, which is formed by reducing the outer diameter from the body 46 toward the front end, and having a tapered surface in sliding contact with the periphery of the tray 26 to guide it to the inspection area 17. By providing such a pin 43, the tray 26 on which the workpiece 30 is placed and the inspectors 51, 52 (see FIG. 1 ) can be stably maintained with a simple structure. Figure 8 , Fig. 9 )’s precise positional relationship.

[0031] In addition, the workpiece positioning mechanism 10 is as follows Figure 4 As shown in (A), the peripheral equipment includes: a carrying-in mechanism 15 for carrying in a pallet 26 on which the workpiece 30 before inspection is arranged; a first transfer unit 11 for transferring the carried-in pallet 26 in a first direction 21 so that the pallet 26 on which the workpiece 30 is arranged faces a first inspection area 17a; a second transfer unit 12 for transferring the pallet 26 in a second direction 22 orthogonal to the first direction 21 so that the workpiece 30 faces a second inspection area 17b; a third transfer unit 13 for transferring the pallet 26 on which the workpiece 30 after inspection is arranged faces a third direction 23 orthogonal to the second direction 22; and a carrying-out mechanism 16 for carrying out the pallet 26.

[0032] Figure 4 (A)~ Figure 7 (A) is a YX plan view for explaining the operation of the work positioning mechanism 10 according to the first embodiment. Figure 4 (B)~ Figure 7 (B) is its Z-X front view. Figure 4 (C)~ Figure 7 (C) is its Y-Z side view.

[0033] The first transfer unit 11 and the third transfer unit 13 have a common structure, and include a conveyor 41 that transfers the tray 26 from one end to the other end, and a carriage 42 that moves the conveyor 41 toward the first inspection area 17a or the second inspection area 17b. The first transfer unit 11 thus configured transfers the tray 26 on which the workpiece 30 before inspection is placed, which is carried in from the carrying mechanism 15, toward the first direction 21, and directs it toward the first inspection area 17a. On the other hand, the third transfer unit 13 transfers the tray 26 on which the workpiece 30 after inspection is placed, which is separated from the second inspection area 17b, toward the third direction 23 and carries it out.

[0034] The conveyor 41 is formed by arranging carriers made of belts, plastic chains, etc. in two rows. The pallet 26 on which the workpieces 30 are arranged two-dimensionally is supported at both ends by the conveyor 41 and moves.

[0035] The carrying-in mechanism 15 and the carrying-out mechanism 16 have a common structure. The carrying-in mechanism 15 carries the pallet 26 on which the workpieces 30 before inspection are arranged to one end of the first conveying unit 11. The carrying-out mechanism 16 receives the pallet 26 on which the workpieces 30 after inspection are arranged from the third conveying unit 13 and carries it out. In addition, a belt conveyor type is exemplified as the carrying-in mechanism 15 and the carrying-out mechanism 16, but it is not particularly limited and can also be carried out manually.

[0036] The second transfer unit 12 is as follows Figure 7 As shown, it has: a first force-applying mechanism 31, which applies force to the bottom surface to move the tray 26 from the first transfer unit 11 to the first inspection area 17a; a moving mechanism 44, which carries the tray 26, from which the force is released, so that it moves from the first inspection area 17a to the second inspection area 17b; and a second force-applying mechanism 32, which applies force to the bottom surface to move the tray 26 from the moving mechanism 44 to the second inspection area 17b. Figure 4 (C)~ Figure 7 As shown in (C), the first urging mechanism 31 and the second urging mechanism 32 synchronize the timing of urging and releasing the corresponding tray 26 .

[0037] The second transfer unit 12 carries the tray 26 and transfers it from the first inspection area 17a to the second inspection area 17b in the second direction 22, and also returns the tray 26 from the second inspection area 17b in an empty state in the direction opposite to the second direction 22 of the first inspection area 17a. A frame 45 is provided on the upper side of the second transfer unit 12 to partition the first inspection area 17a and the second inspection area 17b.

[0038] Figure 8 It is a YX plan view showing a workpiece inspection device 50 according to a second embodiment of the present invention. Fig. 9 1 is a YZ side view thereof. Thus, the workpiece inspection device 50 comprises: a first inspector 51 for inspecting the workpiece 30 in the first inspection area 17a and a second inspector 52 for inspecting the workpiece 30 in the second inspection area 17b; a box 55 for accommodating the first inspector 51 and the second inspector 52 at the same arrangement interval as the first inspection area 17a and the second inspection area 17b; a table 56 for displacing the box 55 at the same interval as the arrangement interval of the workpiece 30 in the tray 26; and a support body 57 for supporting the table 56 and being fixed relative to the ground 58.

[0039] In addition, the workpiece inspection device 50 of the embodiment adopts a ground fixing method in which the support body 57 of the table 56 is fixed on the ground 58, but a hanging method in which the table 56 is fixed on the ceiling surface may also be adopted. In addition, the example of having a plurality of first inspection areas 17a and second inspection areas 17b is shown, but there is also a case where there is only one inspection area 17.

[0040] Here, back Figures 4 to 7 , the function of the workpiece positioning mechanism 10 and the operation of the workpiece inspection device 50 according to the embodiment are described. Figure 4 As shown, in the first inspection area 17a and the second inspection area 17b, the first inspection device 51 and the second inspection device 52 ( Figure 8 , Fig. 9 ) is displaced at the same pitch as the arrangement interval of the workpiece 30 to inspect the workpiece 30. At this time, the second conveying unit 12 causes the force applying mechanisms 31 and 32 to rise, and applies force to the tray 26 to position it relative to the first inspection area 17a and the second inspection area 17b. At this time, the plurality of pins 43 ( Figure 1 ) to stably maintain the precise positional relationship between the tray 26 and the inspectors 51, 52.

[0041] Then, the pallet 26 on which the workpieces 30 before inspection are arranged is transported to one end of the first transfer unit 11 by the transport mechanism 15. Then, the first transfer unit 11 transfers the pallet 26 from one end to the other end by the conveyor 41. At the other end of the first transfer unit 11, the pallet 26 is in a standby state until the inspection of the pallet 26 in the inspection area 17 is completed.

[0042] Then, if Figure 5 As shown, when the inspection of the pallet 26 in the inspection area 17 is completed (or before it is completed), the third transfer unit 13 is moved in the direction opposite to the third direction 23, so that the empty conveyor 41 is located below the second inspection area 17b. Next, the force-applying mechanisms 31 and 32 are lowered to release the force, so that the pallet 26 is separated from the inspection area 17 (17a, 17b). As a result, the pallet 26 in the first inspection area 17a is placed on the moving mechanism 44, and the pallet 26 in the second inspection area 17b is placed on the conveyor 41 of the third transfer unit 13. At this time, the plurality of pins 43 ( Figure 1 ) so that the tray 26 can be stably separated from the inspection area 17.

[0043] Then, if Figure 6 As shown, the third transfer unit 13 is moved in the third direction 23 so as to be close to the carrying-out mechanism 16. Then, at the same time, the moving mechanism 44 moves the pallet 26 carried thereon from directly below the first inspection area 17a toward the second direction 22 to directly below the second inspection area 17b. Furthermore, at the same time, the first transfer unit 11 is moved in the first direction 21 so that the conveyor 41 carrying the pallet 26 on which the workpiece 30 to be inspected is arranged is located below the first inspection area 17a. These three actions are performed simultaneously, from Figure 5 Instantly switch to Figure 6 status.

[0044] Then, if Figure 7 As shown, in the second conveying section 12, the force applying mechanisms 31 and 32 are raised to apply force to the tray 26 and position it relative to the first inspection area 17a and the second inspection area 17b. Figure 2 , Figure 3 ) to accurately and stably position the height position and plane position of the tray 26 relative to the first inspection area 17a and the second inspection area 17b respectively.

[0045] Next, the first transfer unit 11 is moved in the direction opposite to the first direction 21, so that the empty conveyor 41 is brought close to the carrying mechanism 15. Furthermore, at the same time, in the second transfer unit 12, the moving mechanism 44 is moved from the second inspection area 17b to the second direction 22 (see FIG. Figure 6 ) and returns to the position of the first inspection area 17a. The third transfer unit 13 operates the conveyor 41 to transfer and transport the pallet 26 with the inspected workpiece 30 separated from the second inspection area 17b in the third direction 23. These three actions are performed simultaneously. Figure 7 Instantly switch to Figure 4 In this way, the Figures 4 to 7 In the operation described above, the pallet 26 on which the workpieces 30 before inspection are placed is sequentially carried in, inspected, and carried out.

[0046] Fig.10 (A) is a perspective view of a multilayer wiring board 38 having bumps 37 arranged on the upper surface thereof, which is used as the workpiece 30 of the present embodiment. Fig.10 (B) is a side perspective view of an LSI package in which an LSI chip 36 is mounted on the multilayer wiring substrate 38. In the LSI package, electrodes of the multilayer wiring substrate 38 and electrodes of the LSI chip 36 are electrically connected via bumps 37. Furthermore, the LSI package is encapsulated with resin for deterioration and heat countermeasures. Such a method of electrical connection using spherical bumps 37 is called flip chip mounting.

[0047] In order to make the electrodes of the multilayer wiring substrate 38 and the electrodes of the LSI chip 36 directly overlap each other, the flip chip mounting needs to align the height of the bump 37. This is because if there is a deviation in the height of the bump 37, a poor connection will occur. In addition, it is also required to detect the position of the bump, the diameter of the bump, the abnormal shape of other bumps, and foreign matter on the substrate. In addition, the workpiece 30 is exemplified as an LSI package in the embodiment, but it is not limited to this, and it is suitable as long as it can be placed on the tray 26.

[0048] In this case, the first inspection device 51 measures the relative height of the multilayer wiring board 38. The second inspection device 52 is a measuring / inspecting device that measures various sizes of the bumps 37 arranged on the upper surface of the multilayer wiring board 38 or detects foreign matter. Specifically, it is a surface shape measuring machine and an image measuring machine using light, or a measuring / inspecting machine having the functions of both and capable of measuring the convex and concave information of the surface.

[0049] In addition, the dispersion of the top surface height of the multilayer wiring substrate 38 is generally much greater than the dispersion of the size of the bump 37. Therefore, the first inspector 51 is set to have a larger measuring range than the second inspector 52. Therefore, an adjustment mechanism (not shown) is provided to adjust the height direction of the frame 45 so that the second inspection area 17b does not deviate from the measuring range of the second inspector 52. In addition, the inspectors 51 and 52 are not particularly limited, and any type, whether contact or non-contact, can be appropriately adopted as long as they inspect the workpiece 30.

[0050] Description of symbols

[0051] 10…workpiece positioning mechanism; 11…first transfer section; 12…second transfer section; 13…third transfer section; 15…carry-in mechanism; 16…carry-out mechanism; 17…inspection area; 17a…first inspection area; 17b…second inspection area; 21…first direction; 22…second direction; 23…third direction; 26…tray; 30…workpiece; 31…first force-applying mechanism; 32…second force-applying mechanism; 36…LSI chip; 37…bump; 38…multilayer wiring board; 41…conveyor; 42…trolley; 43…positioning pin (pin); 44…moving mechanism; 45…frame; 46…body; 47…taper; 49…notch; 50…workpiece inspection device; 51…first inspector; 52…second inspector; 55…housing; 56…table; 57…support body; 58…ground; 59…pillar.

Claims

1. A workpiece positioning mechanism, It is characterized in that have: A pallet configured with a workpiece; A frame having a notch formed therein to define a height position of the tray positioned in the inspection area; a plurality of pins disposed on the frame to position the tray; and The force applying mechanism applies force to the bottom surface to position the tray in the inspection area.

2. The workpiece positioning mechanism according to claim 1, It is characterized in that The above pins have: A body part connected to the frame and having a constant outer diameter, wherein a side peripheral surface abuts against a peripheral edge of the tray to define a planar position thereof; and The tapered portion is formed such that the outer diameter decreases from the body portion toward the front end, and the tapered surface is in sliding contact with the peripheral edge of the tray to guide the tray to the inspection area.

3. The workpiece positioning mechanism according to claim 1 or 2, It is characterized in that The inspection areas are the first inspection area and the second inspection area which are adjacent to each other; The device includes a moving mechanism for placing the tray after the urging force is released and moving the tray from the first inspection area to the second inspection area.

4. A workpiece inspection device, It is characterized in that have: The workpiece positioning mechanism according to claim 1 or 2; an inspector for inspecting the workpiece in the inspection area; A box housing the inspector; and The platform displaces the box body at the same pitch as the arrangement interval of the workpieces on the pallet.

5. A workpiece inspection device, It is characterized in that have: The workpiece positioning mechanism according to claim 3; a first inspector for inspecting the workpiece in the first inspection area and a second inspector for inspecting the workpiece in the second inspection area; a box body that accommodates the first inspection device and the second inspection device at the same arrangement interval as the first inspection area and the second inspection area; and The platform displaces the box body at the same pitch as the arrangement interval of the workpieces on the pallet.

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