Photoresist curing device using microwave-excited mercury lamp to generate UV light

Abstract

The invention discloses a photoresist curing device using a microwave-excited mercury lamp to generate UV light, and belongs to the technical field of semiconductor chip manufacturing. The photoresist curing device using a microwave-excited mercury lamp to generate UV light comprises: a first shell, which is in a hollow cylindrical shape and has a microwave cavity in the first shell; a magnetron, which is connected to the microwave cavity through a waveguide and is connected to a microwave power supply; a reflective cover, which is in a hollow truncated cone shape and has a reflective cavity in the reflective cover, which is connected to the microwave cavity and has an opening at the lower end of the reflective cover; a mercury lamp, which is suspended in a reflective wall and is filled with mercury gas; and a temperature control disk, which is arranged below the reflective cavity opposite to the opening and is used to place a wafer and provide a suitable curing temperature for a photoresist layer of the wafer, and a first temperature measuring element is arranged on the temperature control disk, and the temperature control disk regulates the temperature of the wafer according to the temperature detected by the first temperature measuring element.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a photoresist curing device that generates UV light using a microwave-excited mercury lamp. Background Art

[0002] Semiconductor devices are the basis of power electronic application products and are also the core components of power electronic conversion devices. They are mainly used for rectification, voltage regulation, switching, mixing, etc. of power electronic equipment. They have the characteristics of wide application range and large usage.

[0003] In the wafer processing process, photoresist curing is a key step, which ensures that the photoresist can stably act as a protective layer during the subsequent etching or ion implantation process. The entire photoresist curing process needs to be precisely controlled to ensure the quality of the photoresist and the performance of the final integrated circuit. High-temperature cross-linking photoresist curing technology is a method of protecting the photoresist pattern, which is cured by baking after development.

[0004] In the reaction chamber, the photoresist layer is irradiated with ultraviolet (UV) light to cause a polymerization reaction. The intensity of UV light is the main factor affecting the curing effect of photoresist. The conventional UV curing method is to use an oven for baking, but the intensity of UV light is difficult to control in the oven, which can easily lead to incomplete curing of the photoresist. In addition, due to the uneven temperature control of the oven baking, it may also lead to uneven curing. Summary of the invention

[0005] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a photoresist curing device that generates UV light using a microwave-excited mercury lamp, which can adjust the intensity of the UV light by adjusting the power of the microwave power supply, thereby ensuring the quality of photoresist curing.

[0006] The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to an embodiment of the present invention comprises: a first shell, which is in a hollow cylindrical shape and has a microwave cavity therein; a magnetron, which is connected to the microwave cavity through a waveguide and is connected to a microwave power supply; a reflector, which is in a hollow truncated cone shape and has a reflector cavity therein, which is connected to the microwave cavity and has an opening at the lower end of the reflector; a mercury lamp, which is suspended in a reflective wall and is filled with mercury gas; a temperature control disk, which is arranged directly below the reflective cavity and faces the opening, is used to place a wafer and provide a suitable curing temperature for a photoresist layer of the wafer, is provided with a first temperature measuring element on the temperature control disk, is electrically connected to the temperature control disk, and regulates the temperature of the wafer according to the temperature detected by the first temperature measuring element; and a heat dissipation mechanism, which is in a ring shape and is sleeved on the opening, is detachably mounted at the lower end of the heat dissipation mechanism, and is provided with a sealing ring between the heat dissipation mechanism and the temperature control disk.

[0007] The device for curing photoresist using a microwave-excited mercury lamp to generate UV light according to the embodiment of the present invention has at least the following beneficial effects: the device for curing photoresist using a microwave-excited mercury lamp to generate UV light has a light bulb filled with mercury gas installed inside a microwave excitation cavity; the light bulb is filled with mercury gas; after microwave excitation, the mercury gas is excited to generate UV light; the intensity of the UV light can be adjusted by adjusting the power of the microwave power supply, thereby achieving precise control of the intensity of the UV light and improving the quality of photoresist curing.

[0008] According to some embodiments of the present invention, a rotating motor is further included. The rotating motor is arranged at the upper end of the first shell and is transmission-connected to the mercury lamp. The rotating motor drives the mercury lamp to rotate, so that the mercury lamp irradiates the wafer more evenly.

[0009] According to some embodiments of the present invention, a trigger switch is provided on the heat dissipation mechanism, and a trigger member is correspondingly provided on the temperature control disk. The trigger switch is electrically connected to the microwave power supply. When the temperature control disk is removed from the heat dissipation mechanism, the trigger member is separated from the trigger switch, and the magnetron stops operating.

[0010] According to some embodiments of the present invention, the heat dissipation mechanism includes a second shell, which is in a circular column shape. An air outlet is provided on the outer side of the second shell. The start and stop of the microwave power supply drives the air outlet to close and open. The inner side of the second shell is connected to the reflection cavity, and a fan is arranged inside the second shell.

[0011] According to some embodiments of the present invention, a baffle is provided in the second shell body, and the baffle is in the shape of a hollow cylinder. The baffle is rotatably provided in the second shell body, and an opening corresponding to the air outlet is provided on the baffle body. The baffle is electrically connected to the microwave power supply, and the start and stop of the microwave power supply drives the baffle to rotate so that the opening overlaps and is misaligned with the air outlet; when the opening overlaps with the air outlet, the air outlet is opened; when the opening is misaligned with the air outlet, the air outlet is closed.

[0012] According to some embodiments of the present invention, a plurality of air outlets and openings are provided, the plurality of air outlets are evenly distributed along the circumference of the second shell, and the plurality of openings are evenly distributed along the circumference of the baffle.

[0013] According to some embodiments of the present invention, a second temperature measuring element is provided in the reflection cavity, the second temperature measuring element is electrically connected to the heat dissipation mechanism, and the start and stop of the heat dissipation mechanism is controlled according to the temperature detected by the second temperature measuring element.

[0014] According to some embodiments of the present invention, a shock-absorbing gasket is provided between the heat dissipation mechanism and the opening.

[0015] According to some embodiments of the present invention, a scattering member is provided on the mercury lamp, and the scattering member is a transparent member.

[0016] According to some embodiments of the present invention, a heat exchange mechanism is further included, which includes a heat absorption component and a heat release component. The heat absorption component is arranged on the inner wall of the microwave cavity, and the heat absorption cavity is used to help the microwave cavity to dissipate heat. The heat release component is arranged in the temperature control disk, and the heat release component is used to provide a heat source for the temperature control disk. A heat transfer pipeline is connected between the heat absorption component and the heat release component, a heat transfer medium flows in the heat transfer pipeline, and a pump body is arranged on the heat transfer pipeline.

[0017] According to some embodiments of the present invention, the heat absorption component includes a third shell, which is arranged on the inner wall of the microwave cavity, the third shell is in an arc shape, the shape of the third shell is consistent with the inside of the microwave cavity, the third shell is a hollow structure, a heat absorption cavity is arranged in the third shell, the heat absorption cavity is connected with the heat transfer pipeline, and a plurality of first heat pipes are passed through a surface of the third shell facing the inner side of the microwave cavity.

[0018] According to some embodiments of the present invention, the first heat pipe is in a hollow cylindrical shape, and the two ends of the first heat pipe are respectively a first heat absorbing part and a first heat releasing part, the first heat absorbing part is located in the microwave cavity, and the first heat releasing part is located in the heat absorbing cavity. A heat exchange medium is sealed in the first heat pipe, and the heat exchange medium absorbs heat in the microwave cavity in the first heat absorbing part. The heat exchange medium that has absorbed the heat moves to the first heat releasing part to release the heat to the heat absorbing cavity.

[0019] According to some embodiments of the present invention, the temperature control plate includes a heating panel, the heating panel is used to place wafers, a heat source cavity is opened under the heating panel, the heat source cavity is used to heat the wafers on the panel, and a heat release component is arranged in the heat source cavity.

[0020] According to some embodiments of the present invention, the heat release component includes a fourth shell, which is arranged in the heat source cavity. The fourth shell is a hollow structure, and a heat release cavity is arranged in the fourth shell. The heat release cavity is connected to the heat transfer pipeline, and a plurality of second heat pipes are passed through the fourth shell.

[0021] According to some embodiments of the present invention, the second heat pipe is in a hollow cylindrical shape, and the two ends of the second heat pipe are respectively a second heat absorption part and a second heat release part, the second heat absorption part is located in the heat release cavity, and the second heat release part is located in the heat source cavity. A heat exchange medium is sealed in the second heat pipe, and the heat exchange medium absorbs heat in the heat release cavity in the second heat absorption part. The heat exchange medium that has absorbed the heat moves to the second heat release part and releases heat to the heat source cavity.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0024] Figure 12 is a schematic structural diagram of a photoresist curing device using a microwave-excited mercury lamp to generate UV light according to an embodiment of the present invention;

[0025] Figure 2 yes Figure 1 A cross-sectional view of

[0026] Figure 3 yes Figure 2 A partial enlarged view of the middle A;

[0027] Figure 4 yes Figure 2 Schematic diagram of the structure of the central temperature control plate;

[0028] Figure 5 It is a schematic diagram of the heat exchange mechanism in a photoresist curing device in which a microwave-excited mercury lamp generates UV light in an embodiment of the present invention.

[0029] Reference numerals:

[0030] First housing 100; microwave cavity 110; rotating motor 120;

[0031] Magnetron 200; waveguide 210;

[0032] Reflection cover 300; reflection cavity 310; opening 320; second temperature measuring element 330;

[0033] Mercury lamp 400; scattering element 410;

[0034] Temperature control plate 500; first temperature measuring element 510; trigger element 520;

[0035] Heat dissipation mechanism 600; sealing ring 610; trigger switch 620; second housing 630; air outlet 631; fan 640; baffle 650; opening 651; shock-absorbing gasket 660;

[0036] Heat absorption component 700; third shell 710; heat absorption chamber 720; first heat pipe 730; first heat absorption part 740; first heat release part 750;

[0037] Heat release assembly 800; heating panel 810; heat source chamber 820; fourth housing 830; heat release chamber 840; second heat pipe 850; second heat absorption part 860; second heat release part 870;

[0038] Heat transfer pipeline 900 and pump body 910 . DETAILED DESCRIPTION

[0039] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0040] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0042] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0043] refer to Figures 1 to 5 A photoresist curing apparatus in which a microwave-excited mercury lamp 400 generates UV light according to an embodiment of the present invention is described.

[0044] like Figures 1 to 5As shown, the photoresist curing device using a microwave-excited mercury lamp 400 to generate UV light according to an embodiment of the present invention comprises: a first shell 100, the first shell 100 is in a hollow cylindrical shape, and a microwave cavity 110 is provided in the first shell 100; a magnetron 200, the magnetron 200 is connected to the microwave cavity 110 through a waveguide 210, and the magnetron 200 is connected to a microwave power supply; a reflector 300, the reflector 300 is in a hollow truncated cone shape, and a reflector cavity 310 is provided in the reflector 300, and the reflector cavity 310 is connected to the microwave cavity 110, and the reflector 300 is connected to the microwave cavity 110. 00 is provided with an opening 320 at the lower end; a mercury lamp 400, which is suspended in the reflecting wall and is filled with mercury gas; a temperature control disk 500, which is arranged below the reflecting cavity 310 opposite to the opening 320, and is used to place wafers and provide a suitable curing temperature for the photoresist layer of the wafer. A first temperature measuring element 510 is provided on the temperature control disk 500, and the first temperature measuring element 510 is electrically connected to the temperature control disk 500, and the temperature control disk 500 adjusts the temperature of the wafer according to the temperature detected by the first temperature measuring element 510.

[0045] like Figure 1 and Figure 2 As shown, magnetrons 200 are respectively arranged on the left and right sides of the first housing 100, and the magnetrons 200 are connected to the microwave cavity 110 in the first housing 100 through the waveguide 210. The lower end of the first housing 100 is connected to a reflector 300, which is in a truncated cone shape, and a reflective cavity 310 is opened in the reflector 300, which is connected to the microwave cavity 110, and a mercury lamp 400 is arranged in the reflective cavity 310. The lower end of the reflective cavity 310 has an opening 320, and a temperature control disk 500 is arranged opposite to the opening 320, and a wafer is placed on the temperature control disk 500.

[0046] The magnetron 200 is connected to a microwave power supply, and the microwave power supply provides power to the magnetron 200. The magnetron 200 is an electric vacuum device for generating microwave energy. It is essentially a diode placed in a constant magnetic field. Under the control of mutually perpendicular constant magnetic fields and constant electric fields, the electrons in the tube interact with the high-frequency electromagnetic field, converting the energy obtained from the constant electric field into microwave energy, thereby achieving the purpose of generating microwave energy. The microwave energy is emitted into the microwave cavity 110 through the waveguide 210, thereby stimulating the mercury gas in the mercury lamp 400 to produce high-speed collisions, thereby generating UV light. The reflector 300 reflects the UV light and irradiates it onto the temperature control disk 500. The wafer coated with UV glue is placed on the temperature control disk 500, and the photoresist layer is irradiated by UV light, causing a polymerization reaction, and curing the photoresist pattern. The temperature control disk 500 regulates the temperature of the wafer according to the temperature detected by the first temperature measuring element 510, so that the wafer is kept in a suitable curing temperature environment.

[0047] Therefore, the photoresist curing device that generates UV light using the microwave-excited mercury lamp 400 installs a bulb filled with mercury gas inside the microwave excitation cavity. The bulb is filled with mercury gas. After microwave excitation, the mercury gas will be excited and generate UV light. The intensity of the UV light can be adjusted by adjusting the power of the microwave power supply, thereby achieving precise control of the intensity of the UV light and improving the quality of photoresist curing.

[0048] like Figure 2 As shown, the photoresist curing device that generates UV light using a microwave-excited mercury lamp 400 also includes a rotating motor 120. The rotating motor 120 is arranged at the upper end of the first shell 100. The rotating motor 120 is transmission-connected to the mercury lamp 400. The rotating motor 120 drives the mercury lamp 400 to rotate, so that the mercury lamp 400 irradiates the wafer more evenly.

[0049] like Figure 2 and Figure 3 As shown, the photoresist curing device for generating UV light by the microwave-excited mercury lamp 400 further includes a heat dissipation mechanism 600, which is in a circular ring shape and is sleeved on the opening 320. The temperature control disk 500 is detachably assembled at the lower end of the heat dissipation mechanism 600, and a sealing ring 610 is arranged between the heat dissipation mechanism 600 and the temperature control disk 500. Microwave-excited plasma will generate a large amount of heat, so an effective heat dissipation mechanism 600 is required to prevent the device from overheating. The sealing ring 610 arranged between the heat dissipation mechanism 600 and the temperature control disk 500 prevents microwaves from leaking from the gap between the heat dissipation mechanism 600 and the temperature control disk 500.

[0050] A trigger switch 620 is provided on the heat dissipation mechanism 600, and a trigger member 520 is correspondingly provided on the temperature control disk. The trigger switch 620 is electrically connected to the microwave power supply. When the temperature control disk 500 is removed from the heat dissipation mechanism 600, the trigger member 520 is separated from the trigger switch 620, and the magnetron 200 stops operating. The trigger member 520 and the trigger switch 620 can be triggered by contact or by magnetic attraction. When the operator removes the temperature control disk 500 to access the wafer, the magnetron 200 automatically stops operating to prevent the microwave generated by the magnetron 200 from leaking at the opening 320 and endangering the health of the operator.

[0051] like Figure 2 and Figure 3As shown, the heat dissipation mechanism 600 includes a second housing 630, which is in the shape of a circular cylinder. An air outlet 631 is provided on the outer side of the second housing 630. The start and stop of the microwave power source drives the air outlet 631 to close and open. The inner side of the second housing 630 is connected to the reflection cavity 310. A fan 640 is arranged in the second housing 630. A baffle 650 is arranged in the second housing 630. The baffle 650 is in the shape of a hollow cylinder. The baffle 650 is rotatably arranged in the second housing 630. An opening 651 corresponding to the air outlet 631 is provided on the baffle 650. The baffle 650 is electrically connected to the microwave power source. The start and stop of the microwave power source drives the baffle 650 to rotate, so that the opening 651 overlaps and is misaligned with the air outlet 631; when the opening 651 overlaps with the air outlet 631, the air outlet 631 is opened; when the opening 651 is misaligned with the air outlet 631, the air outlet 631 is closed.

[0052] When the microwave power is turned on, the baffle 650 rotates to make the opening 651 and the air outlet 631 misaligned, and the air outlet 631 is closed to prevent leakage of microwaves generated by the magnetron 200; when the microwave power is turned off, the baffle 650 rotates to make the opening 651 and the air outlet 631 overlap, and the air outlet 631 is opened, and the fan 640 operates to discharge the heat in the device from the air outlet 631, thereby avoiding excessive heat accumulation in the device.

[0053] In some specific embodiments of the present invention, a plurality of air outlets 631 and openings 651 are provided, the plurality of air outlets 631 are evenly distributed along the circumference of the second shell 630 , and the plurality of openings 651 are evenly distributed along the circumference of the baffle 650 .

[0054] like Figure 2 and Figure 3 As shown, a second temperature measuring element 330 is disposed in the reflective cavity 310, and the second temperature measuring element 330 is electrically connected to the heat dissipation mechanism 600, and the heat dissipation mechanism 600 is started and stopped according to the temperature detected by the second temperature measuring element 330. A shock absorbing washer 660 is disposed between the heat dissipation mechanism 600 and the opening 320.

[0055] like Figure 2 As shown, a scattering member 410 is mounted on the mercury lamp 400, and the scattering member 410 is a transparent member. The UV light generated by the mercury lamp 400 is irradiated toward the wafer through the scattering member 410, thereby further improving the uniformity of the UV light.

[0056] In some specific embodiments of the present invention, the photoresist curing device using a microwave-excited mercury lamp to generate UV light also includes a heat exchange mechanism, which includes a heat absorption component 700 and a heat release component 800. The heat absorption component 700 is arranged on the inner wall of the microwave cavity 110, and the heat absorption cavity 720 is used to help the microwave cavity 110 to dissipate heat. The heat release component 800 is arranged in the temperature control disk 500, and the heat release component 800 is used to provide a heat source for the temperature control disk 500. A heat transfer pipeline 900 is connected between the heat absorption component 700 and the heat release component 800, and a heat transfer medium flows in the heat transfer pipeline 900. A pump body 910 is arranged on the heat transfer pipeline 900.

[0057] like Figure 2 , 4 As shown in , 5, the heat absorption component 700 includes a third shell 710, which is arranged on the inner wall of the microwave cavity 110, and the third shell 710 is in an arc shape. The shape of the third shell 710 is consistent with the inside of the microwave cavity 110, and the third shell 710 is a hollow structure. A heat absorption cavity 720 is arranged in the third shell 710, and the heat absorption cavity 720 is connected to the heat transfer pipeline 900. A plurality of first heat pipes 730 are penetrated on a surface of the third shell 710 facing the inner side of the microwave cavity 110. The first heat pipe 730 is in a hollow cylindrical shape, and the two ends of the first heat pipe 730 are respectively a first heat absorbing part 740 and a first heat releasing part 750. The first heat absorbing part 740 is located in the microwave cavity 110, and the first heat releasing part 750 is located in the heat absorbing cavity 720. A heat exchange medium is sealed in the first heat pipe 730. The heat exchange medium absorbs heat in the microwave cavity 110 in the first heat absorbing part 740. The heat exchange medium that has absorbed the heat moves to the first heat releasing part 750 and releases the heat to the heat absorbing cavity 720.

[0058] like Figure 4 As shown, the temperature control plate 500 includes a heating panel 810, which is used to place wafers. A heat source cavity 820 is opened below the heating panel 810, and the heat source cavity 820 is used to heat the wafers on the panel 810. The heat release component 800 is arranged in the heat source cavity 820.

[0059] like Figure 2 , 45, the heat release assembly 800 includes a fourth shell 830, which is disposed in the heat source cavity 820. The fourth shell 830 is a hollow structure, and a heat release cavity 840 is disposed in the fourth shell 830. The heat release cavity 840 is connected to the heat transfer pipeline 900, and a plurality of second heat pipes 850 are penetrated on the fourth shell 830. The second heat pipe 850 is a hollow cylindrical shape, and the two ends of the second heat pipe 850 are respectively a second heat absorbing part 860 and a second heat releasing part 870. The second heat absorbing part 860 is located in the heat release cavity 840, and the second heat releasing part 870 is located in the heat source cavity 820. A heat exchange medium is sealed in the second heat pipe 850, and the heat exchange medium absorbs the heat in the heat release cavity 840 in the second heat absorbing part 860. The heat exchange medium that has absorbed the heat moves to the second heat releasing part 870 to release the heat to the heat source cavity 820.

[0060] Since the microwave excitation process generates a large amount of heat, in order to avoid overheating to damage the equipment or affect the operating environment, and at the same time to ensure that there is no microwave radiation leakage during the heat dissipation process to avoid harm to the operator, a heat absorption component 700 that mainly absorbs heat through a heat pipe is used to reduce the temperature in the microwave chamber.

[0061] When the photoresist curing device using microwave-excited mercury lamp to generate UV light is in operation, the first heat absorption part 740 of the first heat pipe 730 absorbs heat in the microwave cavity 110, and the heat exchange medium in the first heat absorption part 740 absorbs heat and evaporates. The evaporated heat exchange medium moves toward the first heat release part 750. The first heat release part 750 is located in the heat absorption cavity 720. The heat transfer medium in the heat absorption cavity 720 contacts the first heat release part 750. The heat exchange medium in the first heat release part 750 condenses and releases heat to heat the heat transfer medium. The heated heat transfer medium flows into the heat release cavity 840 of the heat release component 800 driven by the pump body 910, and the second heat absorption part 860 of the second heat pipe 850 absorbs the heat of the heat transfer medium in the heat release cavity 840. The heat exchange medium in the second heat absorption part 860 absorbs heat and evaporates. The evaporated heat exchange medium moves toward the second heat release part 870. The second heat release part 870 is located in the heat source cavity 820. The heat exchange medium in the second heat release part 870 condenses and releases heat, heating the heating panel 810, thereby heating the wafer, and providing a suitable curing temperature for the photoresist layer of the wafer.

[0062] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A photoresist curing device using a microwave-excited mercury lamp to generate UV light, characterized in that: include: A first shell (100), the first shell (100) being in a hollow cylindrical shape, and a microwave cavity (110) being provided in the first shell (100); A magnetron (200), the magnetron (200) being in communication with the microwave cavity (110) via a waveguide (210), and the magnetron (200) being connected to a microwave power source; A reflective cover (300), the reflective cover (300) being in the shape of a hollow truncated cone, a reflective cavity (310) being provided in the reflective cover (300), the reflective cavity (310) being in communication with the microwave cavity (110), and an opening (320) being provided at the lower end of the reflective cover (300); A mercury lamp (400), the mercury lamp (400) being suspended in the reflective wall, the mercury lamp (400) being filled with mercury gas; a temperature control disk (500), the temperature control disk (500) being arranged below the reflective cavity (310) and facing the opening (320); the temperature control disk (500) being used to place a wafer and provide a suitable curing temperature for a photoresist layer of the wafer; a first temperature measuring element (510) being arranged on the temperature control disk (500); the first temperature measuring element (510) being electrically connected to the temperature control disk (500); and the temperature control disk (500) regulating the temperature of the wafer according to the temperature detected by the first temperature measuring element (510); The heat dissipation mechanism (600) is annular in shape and is sleeved on the opening (320). The temperature control disk (500) is detachably mounted on the lower end of the heat dissipation mechanism (600). A sealing ring (610) is provided between the heat dissipation mechanism (600) and the temperature control disk (500).

2. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 1, characterized in that: The invention also comprises a rotating motor (120), wherein the rotating motor (120) is arranged at the upper end of the first shell (100), the rotating motor (120) is in driving connection with the mercury lamp (400), and the rotating motor (120) drives the mercury lamp (400) to rotate, so that the mercury lamp (400) irradiates the wafer more evenly.

3. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 1, characterized in that: The heat dissipation mechanism (600) is provided with a trigger switch (620), and the temperature control disk is correspondingly provided with a trigger member (520); the trigger switch (620) is electrically connected to a microwave power supply; when the temperature control disk (500) is removed from the heat dissipation mechanism (600), the trigger member (520) is separated from the trigger switch (620), and the magnetron (200) stops operating.

4. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 3, characterized in that: The heat dissipation mechanism (600) comprises a second shell (630), the second shell (630) is in the shape of a circular column, an air outlet (631) is provided on the outside of the second shell (630), the start and stop of the microwave power source drives the air outlet (631) to close and open, the inside of the second shell (630) is connected to the reflection cavity (310), and a fan (640) is arranged inside the second shell (630).

5. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 4, characterized in that: A baffle (650) is arranged in the second shell (630), and the baffle (650) is in the shape of a hollow cylinder. The baffle (650) is rotatably arranged in the second shell (630). An opening (651) corresponding to the air outlet (631) is provided on the baffle (650). The baffle (650) is electrically connected to a microwave power supply. The start and stop of the microwave power supply drives the baffle (650) to rotate, so that the opening (651) overlaps and is misaligned with the air outlet (631); when the opening (651) overlaps with the air outlet (631), the air outlet (631) is opened; when the opening (651) is misaligned with the air outlet (631), the air outlet (631) is closed.

6. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 5, characterized in that: A plurality of the air outlets (631) and the openings (651) are provided, the plurality of air outlets (631) are evenly distributed along the circumference of the second shell (630), and the plurality of openings (651) are evenly distributed along the circumference of the baffle (650).

7. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 1, characterized in that: A second temperature measuring element (330) is arranged in the reflection cavity (310); the second temperature measuring element (330) is electrically connected to the heat dissipation mechanism (600); and the start and stop of the heat dissipation mechanism (600) are controlled according to the temperature detected by the second temperature measuring element (330).

8. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 1, characterized in that: A shock-absorbing gasket (660) is provided between the heat dissipation mechanism (600) and the opening (320).

9. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 1, characterized in that: A scattering member (410) is sleeved on the mercury lamp (400), and the scattering member (410) is a transparent member.

10. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 1, characterized in that: The invention also comprises a heat exchange mechanism, which comprises a heat absorption component (700) and a heat release component (800). The heat absorption component (700) is arranged on the inner wall of the microwave cavity (110). The heat absorption cavity (720) is used to help the microwave cavity (110) to dissipate heat. The heat release component (800) is arranged in the temperature control disk (500). The heat release component (800) is used to provide a heat source for the temperature control disk (500). A heat transfer pipeline (900) is connected between the heat absorption component (700) and the heat release component (800). A heat transfer medium flows in the heat transfer pipeline (900). A pump body (910) is arranged on the heat transfer pipeline (900).

11. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 10, characterized in that: The heat absorption component (700) comprises a third shell (710), wherein the third shell (710) is arranged on the inner wall of the microwave cavity (110), the third shell (710) is in an arc shape, the shape of the third shell (710) is consistent with the inside of the microwave cavity (110), the third shell (710) is in a hollow structure, the heat absorption cavity (720) is arranged in the third shell (710), the heat absorption cavity (720) is communicated with the heat transfer pipeline (900), and a plurality of first heat pipes (730) are penetrated on a surface of the third shell (710) facing the inner side of the microwave cavity (110).

12. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 11, characterized in that: The first heat pipe (730) is in the shape of a hollow cylinder. Two ends of the first heat pipe (730) are respectively a first heat absorbing part (740) and a first heat releasing part (750). The first heat absorbing part (740) is located in the microwave cavity (110), and the first heat releasing part (750) is located in the heat absorbing cavity (720). A heat exchange medium is sealed in the first heat pipe (730). The heat exchange medium absorbs heat in the microwave cavity (110) in the first heat absorbing part (740). The heat exchange medium that has absorbed the heat moves to the first heat releasing part (750) to release the heat to the heat absorbing cavity (720).

13. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 10, characterized in that: The temperature control plate (500) comprises a heating panel (810), the heating panel (810) is used to place wafers, a heat source cavity (820) is provided below the heating panel (810), the heat source cavity (820) is used for the wafers on the heating panel (810), and the heat release component (800) is arranged in the heat source cavity (820).

14. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 13, characterized in that: The heat release component (800) comprises a fourth shell (830), the fourth shell (830) being arranged in the heat source cavity (820), the fourth shell (830) being a hollow structure, a heat release cavity (840) being arranged in the fourth shell (830), the heat release cavity (840) being in communication with the heat transfer pipeline (900), and a plurality of second heat pipes (850) being passed through the fourth shell (830).

15. The photoresist curing device using a microwave-excited mercury lamp to generate UV light according to claim 14, characterized in that: The second heat pipe (850) is in the shape of a hollow cylinder. The two ends of the second heat pipe (850) are respectively a second heat absorbing part (860) and a second heat releasing part (870). The second heat absorbing part (860) is located in the heat releasing cavity (840), and the second heat releasing part (870) is located in the heat source cavity (820). A heat exchange medium is sealed in the second heat pipe (850). The heat exchange medium absorbs heat in the heat releasing cavity (840) in the second heat absorbing part (860). The heat exchange medium that has absorbed the heat moves to the second heat releasing part (870) to release the heat to the heat source cavity (820).

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