Laser cutting device and laser cutting method

Abstract

The invention provides a laser cutting device and a laser cutting method, and relates to the technical field of laser cutting. The laser cutting device comprises a machining platform, a laser generator, a light beam shaping module and a cutting head module; the laser generator is used for emitting laser, the light beam shaping module can receive the laser, the light beam shaping module comprises a beam expanding lens group, a light spot selection module and a light homogenizer, the processing platform is used for bearing a to-be-processed tooth socket, and the cutting head module is movably arranged on the processing platform and can focus the laser to a cutting point of the to-be-processed tooth socket; in the light beam shaping module, the light spot energy density, the light spot diameter and the light spot energy distribution of the laser beams are sequentially adjusted through a beam expanding lens set, a light spot selection module and a light uniformizing assembly, and therefore the laser machining parameters are adjusted in real time along with movement of the cutting head module on the machining platform. The technical problems that in the prior art, the laser energy intensity of a laser cutting device cannot be adjusted, and the cutting quality is poor are solved, automatic machining is achieved, and meanwhile the cutting efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and in particular to a laser cutting device and a laser cutting method. Background Art

[0002] Invisible braces have the advantages of beautiful appearance, comfortable wearing, and easy removal. With the development of this technology, invisible braces have gradually replaced metal braces in the field of dental correction. Invisible braces are generally made by laser cutting.

[0003] At present, the existing invisible braces laser cutting equipment generally relies on CNC machine tools. The CNC machine tools drive the laser cutting head to cut the processed materials along a preset trajectory.

[0004] However, the laser energy intensity of existing laser cutting devices cannot be adjusted, resulting in poor cutting quality, which causes the laser cut edges of invisible braces to be rough and require manual polishing and rework. Summary of the invention

[0005] The purpose of the present invention is to provide a laser cutting device and a laser cutting method to solve the technical problem in the prior art that the laser energy intensity of the laser cutting device cannot be adjusted, the cutting quality is poor, and the laser cutting mouth of invisible braces is rough, requiring manual polishing and rework.

[0006] In a first aspect, the present invention provides a laser cutting device, comprising: a processing platform, a laser generator, a beam shaping module and a cutting head module;

[0007] The laser generator is connected to the beam shaping module, the laser generator is used to emit laser light, the beam shaping module can receive the laser light, the beam shaping module includes a beam expander, a spot selection module and a light homogenizer, and the laser light passes through the beam expander, the spot selection module and the light homogenizer in sequence and enters the cutting head module;

[0008] The processing platform is used to carry the braces to be processed, and the cutting head module is movably arranged on the processing platform. The cutting head module has a focusing lens to focus the laser to the cutting point of the braces to be processed.

[0009] Furthermore, the beam expander group includes a mechanical housing and lenses disposed in the mechanical housing, a plurality of groups of the lenses are arranged linearly, and the lenses are movably disposed in the mechanical housing so that the spacing between adjacent lenses can be adjusted.

[0010] Furthermore, the light spot selection module is configured as a variable aperture, and the laser passes through a light hole of the variable aperture.

[0011] Furthermore, the laser cutting device also includes a reflector group, which is arranged between the beam shaping module and the cutting head module, and the laser is reflected into the cutting head module through the reflector group.

[0012] Furthermore, the reflector group has a plurality of fixed reflectors and one movable reflector, the movable reflector is movably arranged on the processing platform, the fixed reflector is fixed to the processing platform, and the movable reflector can reflect the laser into the cutting head module.

[0013] Furthermore, the laser cutting device also includes an image recognition component, which is disposed on the processing platform and is disposed toward the braces to be processed.

[0014] Furthermore, the processing platform is provided with a dust suction device, and the dust suction device is arranged toward the braces to be processed.

[0015] A second aspect of the present invention further provides a laser cutting method, which is applied to the above-mentioned laser cutting device, comprising:

[0016] Step 1: Import the cutting program according to the preset braces cutting trajectory;

[0017] Step 2: Identify the material and shape information of the braces to be processed through an image recognition component;

[0018] Step 3: Selecting a cutting program of the cutting head module according to the material and shape information of the braces to be processed;

[0019] Step 4: drive the cutting head module and the laser generator to cut the braces to be processed, and adjust the processing parameters of the laser in real time through the beam shaping module.

[0020] Furthermore, before driving the cutting head module and the laser generator to cut the braces to be processed, the energy density of the laser is set according to the material information of the braces to be processed.

[0021] Furthermore, when driving the cutting head module and the laser generator to cut the braces to be processed, the energy density of the laser is adjusted according to the speed of the cutting head module.

[0022] Compared with the prior art, the laser cutting device provided by the present invention comprises: a processing platform, a laser generator, a beam shaping module and a cutting head module; the laser generator is connected to the beam shaping module, the laser generator is used to emit laser, the beam shaping module can receive laser, the beam shaping module comprises a beam expander lens group, a light spot selection module and a light homogenizer, and the laser passes through the beam expander lens group, the light spot selection module and the light homogenizer in sequence to enter the cutting head module; the processing platform is used to carry the braces to be processed, the cutting head module is movably arranged on the processing platform, and the cutting head module has a focusing lens, The laser is focused to the cutting point of the braces to be processed; in the beam shaping module, the spot energy density, spot diameter and spot energy distribution of the laser beam are adjusted in turn through the beam expander group, the spot selection module and the uniform light component, so that the laser processing parameters can be adjusted in real time with the movement of the cutting head module on the processing platform, so as to solve the technical problems in the prior art that the laser energy intensity of the laser cutting device cannot be adjusted, the cutting quality is poor, and the invisible braces laser cutting mouth is rough, which requires manual polishing and rework, thereby realizing automated processing and improving cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the overall structure of a laser cutting device provided in an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the optical path of a laser cutting device provided in an embodiment of the present invention.

[0026] Reference numerals:

[0027] 100. Processing platform;

[0028] 200. Laser generator;

[0029] 300, beam shaping module;

[0030] 310, beam expander group; 320, light spot selection module; 330, light homogenizer;

[0031] 400, cutting head module;

[0032] 500, reflector assembly; 510, fixed reflector; 520, movable reflector. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0037] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0038] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0040] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a laser cutting device, including: a processing platform 100, a laser generator 200, a beam shaping module 300 and a cutting head module 400; the laser generator 200 is connected to the beam shaping module 300, the laser generator 200 is used to emit laser, the beam shaping module 300 can receive laser, the beam shaping module 300 includes a beam expanding lens group 310, a spot selection module 320 and a homogenizer 330, and the laser passes through the beam expanding lens group 310, the spot selection module 320 and the homogenizer 330 in sequence to enter the cutting head module 400; the processing platform 100 is used to carry the braces to be processed, and the cutting head module 400 is movably arranged on the processing platform 100, and the cutting head module 400 has a focusing lens to focus the laser to the cutting point of the braces to be processed.

[0041] That is, a laser cutting device provided by an embodiment of the present invention adjusts the spot energy density, spot diameter and spot energy distribution of the laser beam in turn through the beam shaping module 300, the beam expander group 310 and the light homogenizing component, thereby instantly adjusting the laser processing parameters as the cutting head module 400 moves on the processing platform 100, so as to solve the technical problems in the prior art that the laser energy intensity of the laser cutting device cannot be adjusted, the cutting quality is poor, and the invisible braces laser cutting mouth is rough, which requires manual polishing and rework, thereby realizing automated processing and improving cutting efficiency.

[0042] Specifically, in this embodiment, the laser generator is set to a CO2 laser, whose average laser power is 0-200W, the laser wavelength is 9.2μm-10.8μm, and the laser repetition frequency is ≤200kHz. The laser generator is set toward the beam shaping module 300 to emit laser to the beam shaping module 300. The beam shaping module 300 is sequentially provided with a beam expander group 310, a spot selection module 320 and a homogenizer 330 along the laser light transmission path, so that the laser can pass through the beam expander group 310, the spot selection module 320 and the homogenizer 330 in sequence. The beam expansion component can adjust the spot energy density of the laser, and the spot selection module 320 can eliminate the influence of stray light and improve the beam quality. The homogenizer 330 is used to diffract the laser into a flat-top beam, so that the spot energy distribution is uniform. In this way, the laser entering the focusing lens in the cutting head module 400 can have a suitable spot energy density. The processing platform 100 is configured as a three-dimensional five-axis linkage machine tool, and the cutting head module 400 is fixed to the swing of the machine tool to adjust its position and direction along with the machine tool, thereby cutting the braces to be processed fixed on the processing platform 100 in any direction.

[0043] Furthermore, the beam expander lens group 310 includes a mechanical housing and lenses disposed in the mechanical housing. The multiple groups of lenses are arranged linearly, and the lenses are movably disposed in the mechanical housing so that the spacing between adjacent lenses can be adjusted.

[0044] Specifically, in the present embodiment, the lenses are arranged in three groups. The three groups of lenses are arranged in a straight line to form a Galileo structure. The three groups of lenses are arranged in sequence as a first group of lenses, a second group of lenses and a third group of lenses. The laser passes through the first group of lenses, the second group of lenses and the third group of lenses in sequence. The mechanical housing is arranged in a cylindrical shape, and the three groups of lenses are slidably arranged in the mechanical housing along its extension direction. Changing the relative distance between the first group of lenses and the second group of lenses can adjust the magnification of the laser spot, and changing the relative distance between the second group of lenses and the third group of lenses can improve the divergence angle of the light beam. When the magnification increases, the laser spot also increases, and the energy density of the laser spot decreases. In the present embodiment, the adjustment range of the beam expander group 310 is 1 times to 8 times. Therefore, by setting the beam expander group 310, the energy intensity of the laser can be adjusted and the divergence angle of the light beam can be improved.

[0045] Preferably, the light spot selection module 320 is configured as a variable aperture, and the laser passes through a light hole of the variable aperture.

[0046] Specifically, the adjustable electric diaphragm uses a stepper motor to drive the diaphragm to change, including diaphragm pieces, diaphragm rivets, diaphragm rotating rings, diaphragm pins, and diaphragm handwheels. By turning the diaphragm handwheel, the diameter of the diaphragm pieces can be changed, thereby adjusting the size of the light flux. The smaller the diaphragm diameter, the more light beams are intercepted, and the smaller the spot diameter of the transmitted laser beam is. In this embodiment, a stepper motor is used to drive the diaphragm to change, thereby achieving precise and continuous adjustment of the diaphragm aperture. The diaphragm aperture adjustment range is 1mm-20mm, thereby eliminating the influence of stray light through the diaphragm and improving the beam quality.

[0047] Furthermore, the laser cutting device also includes a reflector group 500, which is arranged between the beam shaping module 300 and the cutting head module 400, and the laser is reflected into the cutting head module 400 through the reflector group.

[0048] Specifically, the reflector group 500 is fixed on the processing platform 100 and is arranged at the exit end of the laser shaping module, so as to receive the laser after the parameters are adjusted by the laser shaping module. The reflector is specifically a plane reflector, and the laser is reflected into the cutting head module 400 through the reflector group. Therefore, the transmission direction of the laser beam can be adjusted through the reflector so that it is vertically irradiated into the cutting head module 400, thereby ensuring the laser cutting effect.

[0049] Preferably, the reflector assembly 500 has a plurality of fixed reflectors 510 and a movable reflector 520 . The movable reflector 520 is movably disposed on the processing platform 100 . The fixed reflector 510 is fixed to the processing platform 100 . The movable reflector 520 can reflect the laser into the cutting head module 400 .

[0050] Specifically, in this embodiment, the reflector group 500 is provided with four fixed reflectors 510 and one movable reflector in the direction of laser beam transmission, and the movable reflector is connected to the X-axis lifting component of the processing platform 100, thereby driving the reciprocating lifting movement of the movable reflector. In this way, the movable reflector 520 can move with the movement of the cutting head module 400, and the laser can always be vertically irradiated to the cutting head module 400. In other embodiments of the present application, the number and position of the fixed reflectors 510 can also be set according to the actual optical path requirements.

[0051] Furthermore, the laser cutting device also includes an image recognition component, which is disposed on the processing platform 100 and is disposed toward the braces to be processed.

[0052] Specifically, the image recognition component specifically sets an optical camera and an image recognition module. The optical camera is fixed on the processing platform 100 and faces the braces to be processed, so as to capture the image of the braces to be processed. The image recognition module has an image analysis program, which can analyze and recognize the image captured by the optical camera, and transmit the recognized braces material, shape and other information to the overall control center of the laser cutting device. In this way, the information of the braces to be processed can be identified by the image recognition component, and then the corresponding cutting program can be matched, so as to avoid the workers manually inputting the cutting program, so as to improve the efficiency of laser cutting.

[0053] Furthermore, the processing platform 100 is provided with a dust suction device, and the dust suction device is arranged toward the braces to be processed.

[0054] Specifically, the dust suction device is fixed to the processing platform 100 by bolts. The dust suction device is provided with an air pump and an air suction gun. The muzzle of the air suction gun is directed toward the braces to be processed, so that when the braces to be processed are laser cut, the smoke and exhaust gas generated during the processing can be absorbed by the air suction gun to avoid pollution.

[0055] The present invention also provides a laser cutting method, which is applied to the above-mentioned laser cutting device, comprising the following steps: step 1: importing a cutting program according to a preset braces cutting trajectory line; step 2: identifying the material and shape information of the braces to be processed through an image recognition component; step 3: selecting the cutting program of the cutting head module 400 according to the material and shape information of the braces to be processed; step 4: driving the cutting head module 400 and the laser generator to cut the braces to be processed, and adjusting the laser processing parameters in real time through the beam shaping module 300.

[0056] Specifically, a laser cutting method provided in this embodiment is mainly used for mass processing of multiple types of braces in the same batch. Therefore, in order to avoid manually inputting the cutting program separately, the corresponding braces cutting trajectory lines are generally preset according to the corresponding multiple braces types and imported into the machine tool. Barcodes are set on the braces to be processed, and the image recognition component can recognize the barcode of the braces to be processed, so as to match the corresponding cutting program. Then the cutting head module 400 and the laser generator can be driven to cut the braces to be processed, and the laser processing parameters are adjusted in real time through the beam shaping module 300 to ensure the cutting effect of the laser. For example, in order to eliminate the influence of the uneven energy of the first pulse and ensure the cutting quality, the lead-in line and the lead-out line are set for the cutting trajectory of the invisible braces, and the lead-out line angle is 5°-90°. For another example, in order to avoid the interference of the laser beam with the invisible braces emission cutting during processing, a cutting constraint angle of 2°-88° is added.

[0057] Furthermore, before driving the cutting head module 400 and the laser generator to cut the braces to be processed, the energy density of the laser is set according to the information of the braces material to be processed. For example, to reduce the generation of smoke during the invisible braces cutting process, a lower frequency is used for processing; to reduce the generation of oxidation and yellowing in the invisible braces cutting area, a higher laser single pulse energy needs to be set to reduce the laser thermal impact.

[0058] Specifically, before driving the cutting head module 400 and the laser generator to cut the braces to be processed, the energy density of the laser is adjusted accordingly according to the thickness of the invisible braces, thereby obtaining a suitable cutting edge quality and cutting depth.

[0059] Preferably, when driving the cutting head module 400 and the laser generator to cut the dental braces to be processed, the energy density of the laser is adjusted according to the speed of the cutting head module 400 .

[0060] Specifically, since the cutting line of invisible braces is a complex curved trajectory, the machine tool will have many acceleration and deceleration processes when it moves. In order to ensure the cutting quality, it is necessary to adjust the laser energy intensity and the machine tool movement speed in real time during laser processing to always keep the laser energy intensity irradiated to the surface of invisible braces consistent. The laser power is changed by the control signal to achieve the regulation of the single pulse energy of the laser. When the machine tool speed decreases, the number of laser pulses per unit time will increase. In order to ensure the consistent laser energy irradiation intensity, the single pulse energy of the laser needs to be reduced; when the machine tool speed increases, the number of laser pulses per unit time will decrease. At this time, the single pulse energy of the laser needs to be increased to keep the irradiation intensity consistent.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cutting device, It is characterized in that include: A processing platform (100), a laser generator (200), a beam shaping module (300) and a cutting head module (400); The laser generator (200) is connected to the beam shaping module (300); the laser generator (200) is used to emit laser light; the beam shaping module (300) is capable of receiving the laser light; the beam shaping module (300) comprises a beam expanding lens group (310), a light spot selection module (320) and a light homogenizer (330); the laser light sequentially passes through the beam expanding lens group (310), the light spot selection module (320) and the light homogenizer (330) to enter the cutting head module (400); The processing platform (100) is used to carry the dental braces to be processed, and the cutting head module (400) is movably arranged on the processing platform (100). The cutting head module (400) has a focusing lens to focus the laser to the cutting point of the dental braces to be processed.

2. The laser cutting device according to claim 1, It is characterized in that The beam expander lens group (310) comprises a mechanical housing and lenses arranged in the mechanical housing, a plurality of groups of the lenses are arranged linearly, and the lenses are movably arranged in the mechanical housing so that the spacing between adjacent lenses can be adjusted.

3. The laser cutting device according to claim 1, It is characterized in that The light spot selection module (320) is configured as a variable iris, and the laser passes through a light hole of the variable iris.

4. The laser cutting device according to any one of claims 1 to 3, It is characterized in that The laser cutting device further comprises a reflector group (500), wherein the reflector group (500) is arranged between the beam shaping module (300) and the cutting head module (400), and the laser is reflected into the cutting head module (400) through the reflector group (500).

5. The laser cutting device according to claim 4, It is characterized in that The reflector group (500) comprises a plurality of fixed reflectors (510) and a movable reflector (520); the movable reflector (520) is movably arranged on the processing platform (100); the fixed reflector (510) is fixed to the processing platform (100); and the movable reflector (520) is capable of reflecting the laser into the cutting head module (400).

6. The laser cutting device according to any one of claims 1 to 3, It is characterized in that The laser cutting device further comprises an image recognition component, which is arranged on the processing platform (100) and is arranged towards the braces to be processed.

7. The laser cutting device according to any one of claims 1 to 3, It is characterized in that The processing platform (100) is provided with a dust suction device, and the dust suction device is arranged toward the dental brace to be processed.

8. A laser cutting method, It is characterized in that A laser cutting device as claimed in any one of claims 1 to 7, comprising: Step 1: Import the cutting program according to the preset braces cutting trajectory; Step 2: Identify the material and shape information of the braces to be processed through an image recognition component; Step 3: Selecting a cutting program of the cutting head module (400) according to the material and shape information of the braces to be processed; Step 4: driving the cutting head module (400) and the laser generator (200) to cut the dental brace to be processed, and adjusting the processing parameters of the laser in real time through the beam shaping module (300).

9. The laser cutting method according to claim 8, It is characterized in that Before driving the cutting head module (400) and the laser generator (200) to cut the braces to be processed, the energy density of the laser is set according to the material information of the braces to be processed.

10. The laser cutting method according to claim 8, It is characterized in that When driving the cutting head module (400) and the laser generator (200) to cut the dental brace to be processed, the energy density of the laser is adjusted according to the speed of the cutting head module (400).

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