Wafer polishing machine for processing light-emitting panel component

Abstract

The invention discloses a wafer polishing machine for light-emitting panel component processing, and relates to the technical field of light-emitting panel processing, and the wafer polishing machine specifically comprises a polishing chamber, a polishing structure is arranged at the top of an inner cavity of the polishing chamber, a cooling liquid spray pipe is arranged on one side of the inner cavity of the polishing chamber, and a sealing shell is fixedly connected to the bottom of the inner cavity of the polishing chamber; a through hole is formed in the middle of the top of the sealing shell, a workbench is connected into an inner cavity of the sealing shell through a lifting rotating structure, and the top end of the workbench extends out of the sealing shell through the through hole. According to the wafer polishing machine for machining the light-emitting panel components, through the arrangement of the workbench, the height of the vacuum suction cup can be changed, cooling liquid left on the workbench is prevented from entering the vacuum suction cup in the wafer taking and placing process, the distance between the wafer and the vacuum suction cup can be changed, and therefore the wafer polishing efficiency is improved. And the tight fit state between the wafer and the vacuum chuck is relieved, so that the wafer can be taken down conveniently.

Description

Technical Field

[0001] The invention relates to the technical field of light-emitting panel processing, and in particular to a wafer polishing machine for processing light-emitting panel components. Background Art

[0002] A light-emitting panel is a panel that can emit light. Its production method depends on the materials and technologies used. Each light-emitting panel has its own specific production process and material requirements to meet different application requirements and performance standards. The light-emitting principle of the light-emitting panel in the prior art can be: based on the organic semiconductor material and the light-emitting material under the drive of the electric field, the light is emitted through carrier injection and recombination. One of the basic materials for making organic semiconductors is the wafer. At present, the Czochralski method (Cz) is an important method for preparing silicon single crystals. The high-purity silicon material placed in the crucible is heated and melted by a thermal field composed of carbon materials. After that, the seed crystal is immersed in the melt and undergoes a series of processes (seedling, shouldering, equal diameter, finishing, cooling) to finally obtain a single crystal rod. The single crystal rod is then ground, polished, and sliced ​​to form a silicon wafer. In order to ensure the stability and availability of the wafer in the later preparation of chips, the wafer is usually polished to achieve a specified smoothness.

[0003] In the related art, when a wafer polishing machine is used, it is usually necessary to place the wafer to be polished on the workbench of the polishing machine. After the wafer is connected to the negative pressure of the workbench, the polishing wheel is used to polish the wafer. During this process, the wafer and the vacuum suction cup are in a tightly fitted state, and it is not easy to remove the polished wafer; the wafer needs to be cooled during the polishing process. The commonly used cooling methods are cooling with coolant and cooling with air. When the coolant is used to cool the wafer, after the wafer is removed, the coolant remaining on the workbench is easy to enter the vacuum negative pressure equipment such as the vacuum suction cup, affecting the use of the polishing machine; at the same time, the wafer particles in the waste liquid will adhere to the workbench, affecting the flow of the coolant, so the workbench needs to be cleaned regularly, and the existing polishing machine usually does not have the function of cleaning the workbench, and needs to prepare additional tools for cleaning, which is more troublesome, and the vacuum negative pressure equipment such as the vacuum suction cup arranged on the workbench will affect the cleaning of the workbench. Based on this, the present application proposes a wafer polishing machine for processing light-emitting panel components. Summary of the invention

[0004] The present invention provides a wafer polishing machine for processing light-emitting panel components, which solves the problem that it is difficult to remove the wafer proposed in the above-mentioned background technology. After the wafer is removed, the coolant remaining on the workbench is easy to enter into vacuum negative pressure equipment such as vacuum suction cups; the polishing machine does not have the function of cleaning the workbench, and the vacuum negative pressure equipment such as vacuum suction cups arranged on the workbench will affect the cleaning of the workbench.

[0005] The present invention provides the following technical solutions: a wafer polishing machine for processing light-emitting panel components, comprising a polishing chamber, a polishing structure is provided at the top of the inner cavity of the polishing chamber, a cooling liquid nozzle is provided at one side of the inner cavity of the polishing chamber, a sealing shell is fixedly connected to the bottom of the inner cavity of the polishing chamber, a through hole is provided in the middle of the top of the sealing shell, a workbench is connected to the inner cavity of the sealing shell through a lifting and rotating structure, the top of the workbench extends to the outside of the sealing shell through the through hole, a vacuum suction cup group 1 is connected to the top of the inner cavity of the workbench through an electric telescopic rod 1, a vacuum suction cup group 2 is connected to the bottom of the inner cavity of the workbench through an electric telescopic rod 2, a lifting plate is connected to the middle of the inner cavity of the workbench through an electric telescopic rod 3, sealing columns are fixed to the top and bottom of the lifting plate, and both the vacuum suction cup group 1 and the vacuum suction cup group 2 include vacuum suction cups, and vacuum suction cups are provided with vacuum suction holes adapted to the sealing columns; The lifting and rotating structure comprises a moving frame connected to the top of the inner cavity of the sealed shell through an electric telescopic rod 5, a rotating tube movably connected to the moving frame, and a vacuum pump fixedly connected to the moving frame, the air inlet end of the vacuum pump is connected to the inner cavity of a rotating tube through a pipeline, an air inlet ring is fixedly connected to the middle of the inner cavity of the workbench, a rotating ring is movably sleeved on the outer ring of the air inlet ring, the rotating tube is fixedly connected to the rotating ring, and the inner cavity of the rotating tube is connected to the inner cavity of the workbench through the air inlet ring; The inner cavity of the sealed shell is connected to a cleaning structure through an electric telescopic rod four, and the cleaning structure includes a waste receiving box connected to the electric telescopic rod four, a sealing ring fixedly connected to the top of the waste receiving box, an injection tube movably connected to the inner cavity of the waste receiving box, and a cleaning brush fixedly connected to the top of the injection tube, the brush handle of the cleaning brush is a hollow structure, the top of the inner cavity of the brush handle is evenly provided with drainage holes, the bottom of the injection tube is connected to a telescopic tube one, and the other end of the telescopic tube one extends to the outside of the polishing chamber, the bottom of the waste receiving box is a hollow structure, the top of the inner cavity of the bottom of the waste receiving box is evenly provided with liquid inlet holes, one side of the bottom of the waste receiving box is fixedly connected to a waste discharge pipe, and the other end of the waste discharge pipe extends to the outside of the polishing chamber.

[0006] Preferably, the polishing chamber comprises a support platform, a sealing frame fixedly connected to the top of the support platform, and an opening and closing door arranged on one side of the sealing frame, and the support platform, the sealing frame and the opening and closing door form the polishing chamber.

[0007] Preferably, the lifting and rotating structure also includes a servo motor 1, and the other rotating tube is driven by the servo motor 1.

[0008] Preferably, a groove adapted to the cleaning structure is provided in the middle of the top of the support platform, an exhaust pipe is fixedly connected to one side of the support platform, and the top of the exhaust pipe is located at the top end of the inner cavity of the sealed shell.

[0009] Preferably, the outer rings at the top and bottom of the workbench are fixedly connected with gear rings, the top of the inner cavity of the sealed shell is fixedly connected with servo motor 2, the end of the output shaft of servo motor 2 is fixedly connected with a gear, and the gear is compatible with the gear ring.

[0010] Preferably, the inner cavity at the bottom of the waste receiving box is fixedly connected to a servo motor three, and the injection tube is driven by the servo motor three.

[0011] Preferably, the outer diameter of the gear ring is smaller than the inner diameter of the sealing ring.

[0012] Preferably, the outer surface of the sealing column is wrapped with a sealing pad, and when the sealing column on one side of the lifting plate blocks the vacuum suction hole, the sealing column on the other side of the lifting plate is separated from the vacuum suction hole away from the lifting plate.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The wafer polishing machine for processing light-emitting panel components can change the height of the vacuum suction cup through the setting of the workbench to prevent the coolant remaining on the workbench from entering the vacuum suction cup during the wafer placement process, and the distance between the wafer and the vacuum suction cup can be changed to release the close fit between the wafer and the vacuum suction cup, making it easier to remove the wafer.

[0014] 2. The wafer polishing machine for processing light-emitting panel components can clean the workbench during use by setting a cleaning structure, which facilitates the flow of coolant along the workbench, and the workbench can continue to be used during the cleaning process, thereby improving the working efficiency of the polishing machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a bottom view schematic diagram of the structure of the present invention; Figure 2 It is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the interior of the structural sealing housing of the present invention; Figure 4 The structure of the present invention Figure 3 Schematic diagram looking up; Figure 5 The structure of the present invention Figure 3 Schematic diagram from top view; Figure 6 It is a schematic cross-sectional view of the cleaning structure of the present invention; Figure 7 This is a schematic diagram of the bottom of the workbench structure of the present invention; Figure 8 It is a cross-sectional schematic diagram of the structural workbench of the present invention; Fig. 9 It is a schematic diagram of the explosion of the structural workbench of the present invention.

[0016] In the figure: 1. support table; 2. sealing frame; 3. opening and closing door; 4. exhaust pipe; 5. telescopic pipe one; 6. waste pipe; 7. electric telescopic rod four; 8. sealing shell; 9. polishing structure; 10. coolant spray pipe; 11. workbench; 12. moving frame; 13. electric telescopic rod five; 14. rotating tube; 15. gear; 16. sealing ring; 17. waste box; 18. vacuum pump; 19. vacuum suction cup group one; 20. servo motor one; 21. servo motor two; 22. servo motor three; 23. cleaning brush; 24. gear ring; 25. vacuum suction cup group two; 26. electric telescopic rod two; 27. sealing column; 28. electric telescopic rod three; 29. ​​air inlet ring; 30. swivel; 31. electric telescopic rod one. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The present invention provides a wafer polishing machine for processing light-emitting panel components, including a polishing chamber, the polishing chamber including a support table 1, a sealing frame 2 fixedly connected to the top of the support table 1, and an opening and closing door 3 arranged on one side of the sealing frame 2. The support table 1, the sealing frame 2 and the opening and closing door 3 form a polishing chamber. When the polishing machine is in use, the polishing chamber can intercept coolant to prevent the coolant from splashing everywhere, and the user can observe the polishing condition of the wafer through the observation window embedded in the opening and closing door 3.

[0019] A polishing structure 9 is provided at the top of the inner cavity of the polishing chamber. The polishing structure 9 is a prior art and will not be described in detail here. A cooling liquid nozzle 10 is provided at one side of the inner cavity of the polishing chamber.

[0020] A sealed shell 8 is fixedly connected to the bottom of the inner cavity of the polishing chamber, a through hole is provided in the middle of the top of the sealed shell 8, a workbench 11 is connected to the inner cavity of the sealed shell 8 through a lifting and rotating structure, and the top of the workbench 11 extends to the outside of the sealed shell 8 through the through hole, the lifting and rotating structure includes an electric telescopic rod 5 13 fixedly connected to the top of the inner cavity of the sealed shell 8, and the electric telescopic rod 5 13 is fixedly connected to both sides of the top of the inner cavity of the sealed shell 8, the output shaft end of the electric telescopic rod 5 13 is fixedly connected to a moving frame 12, a rotating tube 14 is movably connected to the top of a moving frame 12, a servo motor 20 is fixedly connected to a moving frame 12, the rotating tube 14 is driven by the servo motor 20, and the rotating tube 14 can be driven to rotate when the servo motor 20 rotates. Another rotating tube 14 is movably connected to the top of the other movable frame 12, and a vacuum pump 18 is fixedly connected to the other movable frame 12. The air inlet end of the vacuum pump 18 is connected to the inner cavity of the other rotating tube 14 through a pipeline. An exhaust pipe 4 is fixedly connected to one side of the support platform 1, and the top of the exhaust pipe 4 is located at the top of the inner cavity of the sealed shell 8.

[0021] The two rotating tubes 14 are connected by a rotating ring 30, and the rotating tube 14 is fixedly connected to the rotating ring 30. The middle of the inner cavity of the rotating ring 30 is movably connected to an air inlet ring 29, which is a hollow structure. Air holes are evenly arranged on the side wall of the air inlet ring 29, and the inner cavity of the rotating tube 14 is connected to the inner cavity of the air inlet ring 29 through the air holes. The middle of the inner cavity of the workbench 11 is fixedly connected to the air inlet ring 29, and the inner cavity of the air inlet ring 29 is connected to the inner cavity of the workbench 11 through the air holes.

[0022] The top of the inner cavity of the workbench 11 is connected to the vacuum suction cup group 19 through the electric telescopic rod 1 31, the bottom end of the inner cavity of the workbench 11 is connected to the vacuum suction cup group 2 25 through the electric telescopic rod 2 26, and the middle part of the inner cavity of the workbench 11 is connected to the lifting plate through the electric telescopic rod 3 28. Sealing columns 27 are fixed to the top and bottom of the lifting plate. Both the vacuum suction cup group 19 and the vacuum suction cup group 25 include vacuum suction cups. The vacuum suction cups are provided with vacuum suction holes that are compatible with the sealing columns 27, and the outer surface of the sealing columns 27 is wrapped with sealing pads, which can be made of rubber. When the sealing columns 27 on one side of the lifting plate block the vacuum suction holes, the sealing columns 27 on the other side of the lifting plate are separated from the vacuum suction holes away from the lifting plate.

[0023] From the above description, it can be known that when the servo motor 20 rotates, the rotating ring 30 can be driven to rotate through the rotating tube 14 connected thereto, and the rotating ring 30 can drive the workbench 11 to rotate through the air inlet ring 29. The positions of the vacuum suction cup group 19 and the vacuum suction cup group 25 can be swapped, and the sealing column 27 can be used to push out the wafer connected to the vacuum suction cup under negative pressure, so as to release the state of close fit between the wafer and the vacuum suction cup, thereby facilitating the removal of the wafer after polishing, and the height of the vacuum suction cup can be changed to prevent the coolant remaining on the workbench 11 from entering the vacuum suction hole during the removal of the wafer, thereby improving the safety of the wafer polishing machine.

[0024] A groove adapted to the cleaning structure is provided in the middle of the top of the support platform 1, and an electric telescopic rod 47 is fixedly connected to the bottom of the groove. The end of the output shaft of the electric telescopic rod 47 is connected to the cleaning structure. The cleaning structure is movably connected to the inner cavity of the sealing shell 8, and the extension and retraction of the electric telescopic rod 47 can change the position of the cleaning structure connected thereto.

[0025] The outer rings at the top and bottom of the workbench 11 are fixedly connected to a gear ring 24, and the top of the inner cavity of the sealed shell 8 is fixedly connected to a servo motor 21. The end of the output shaft of the servo motor 21 is fixedly connected to a gear 15 through a reducer. The gear 15 is adapted to the gear ring 24, and when the polishing machine is in use, the gear 15 is meshed with the gear ring 24 at the top of the workbench 11. When the servo motor 21 rotates, the servo motor 21 can drive the gear 15 connected thereto to rotate, and the gear 15 can drive the workbench 11 to rotate through the gear ring 24 meshing therewith, so as to facilitate the polishing structure 9 to polish the wafer connected to the vacuum suction cup under negative pressure.

[0026] The cleaning structure includes a waste receiving box 17 connected to the end of the output shaft of the electric telescopic rod 24 7, a sealing ring 16 fixedly connected to the top of the waste receiving box 17, an injection tube movably connected to the inner cavity of the waste receiving box 17, and a cleaning brush 23 fixedly connected to the top of the injection tube. The brush handle of the cleaning brush 23 is a hollow structure, and drainage holes are evenly arranged on the top of the inner cavity of the brush handle. The bottom of the injection tube is connected to a telescopic tube 5, and the other end of the telescopic tube 5 extends to the outside of the polishing chamber. The material of the telescopic tube 5 can be a corrugated tube. The cleaning liquid for cleaning the wafer particles adhered to the workbench 11 can enter the inner cavity of the brush handle through the telescopic tube 5 and the injection tube, and the cleaning liquid in the brush handle can be sprayed to the bottom of the workbench 11 through the drainage holes.

[0027] The inner cavity at the bottom of the waste receiving box 17 is fixedly connected to a servo motor 3 22, and the injection tube is driven by the servo motor 3 22. When the servo motor 3 22 rotates, it can drive the injection tube to rotate, and the injection tube drives the cleaning brush 23 to rotate. The cleaning brush 23 can scrub the bottom of the workbench 11, and the waste liquid generated during the scrubbing process falls to the bottom of the inner cavity of the waste receiving box 17 under the action of gravity.

[0028] The bottom of the waste receiving box 17 is a hollow structure, and the top of the inner cavity at the bottom of the waste receiving box 17 is evenly provided with liquid inlet holes. A waste discharge pipe 6 is fixedly connected to one side of the bottom of the waste receiving box 17, and the other end of the waste discharge pipe 6 extends to the outside of the polishing chamber. The bottom of the inner cavity at the bottom of the waste receiving box 17 is inclined. Under the action of gravity, the waste liquid entering the inner cavity at the bottom of the waste receiving box 17 through the liquid inlet hole can enter the inner cavity of the waste discharge pipe 6, which is convenient for the discharge of the waste liquid. The material of the waste discharge pipe 6 can be a corrugated pipe.

[0029] The outer diameter of the gear ring 24 is smaller than the inner diameter of the sealing ring 16. When the workbench 11 rotates, the cleaning structure can receive the waste liquid sliding off the workbench 11. The size of the sealing ring 16 can be set according to demand and is not limited here.

[0030] From the above description of the cleaning structure, it can be seen that during the use of the polishing machine, the cleaning structure can be used to clean the workbench 11, which facilitates the flow of coolant along the workbench 11, and the workbench 11 can continue to be used during the cleaning process, thereby improving the working efficiency of the polishing machine.

[0031] The electrical components involved in this application are all prior art, and technicians in this field are familiar with their connection methods. Through these technicians, all the electrical components in this application are connected to their compatible power supplies through wires, and according to the actual situation, a suitable controller is selected to meet the control requirements. The specific connection and control sequence are described below. The electrical connection is completed in a sequential working order, and the detailed connection means are well known in the art. The following mainly introduces the working principle and process, and no further explanation of the electrical control is given.

[0032] Next, the present application will be further explained by taking the example that the top of the vacuum suction cup group 19 is located above the sealing shell 8.

[0033] When the wafer polishing machine for processing components of light-emitting panels is used, the wafer for processing components of light-emitting panels is placed on the vacuum suction cup in the vacuum suction cup group 19, the electric telescopic rod 3 28 is extended, and the extension and retraction of the electric telescopic rod 3 28 makes the sealing column 27 seal the vacuum suction hole in the vacuum suction cup group 25, and the vacuum pump 18 is operated. The operation of the vacuum pump 18 makes the wafer and the vacuum suction cup negatively connected, and the position of the wafer is fixed. The servo motor 21 is operated, and the servo motor 21 drives the gear 15 connected thereto to rotate, and the gear 15 drives the workbench 11 to rotate through the gear ring 24 meshing therewith, and the workbench 11 drives the wafer to rotate. The polishing structure 9 on the polishing machine can realize the polishing of the wafer, and during the polishing process, the coolant is sprayed onto the wafer through the coolant nozzle 10 to cool the wafer and wash away the waste chips generated by polishing. When the polished wafer needs to be removed, the electric telescopic rod 31 and the electric telescopic rod 28 work at the same time. After the top of the vacuum suction cup group 19 moves to the top of the workbench 11, the vacuum pump 18 stops working, the electric telescopic rod 28 contracts, and the electric telescopic rod 28 drives the sealing column 27 to move upward until the sealing column 27 supports the wafer and separates the wafer from the vacuum suction cup group 19, which facilitates the removal of the wafer and prevents the coolant remaining on the workbench 11 from entering the vacuum suction hole.

[0034] If the bottom of the workbench 11 needs to be cleaned during the wafer polishing process, the electric telescopic rod 4 7 drives the cleaning structure to move upward until the cleaning brush 23 contacts the bottom of the workbench 11, and the servo motor 3 22 drives the injection tube to rotate, and the injection tube drives the cleaning brush 23 to rotate, and the cleaning brush 23 brushes the bottom of the workbench 11. During the brushing process, the cleaning liquid for cleaning the wafer particles adhered to the workbench 11 enters the inner cavity of the brush handle through the telescopic tube 1 5 and the injection tube, and the cleaning liquid in the brush handle is sprayed to the bottom of the workbench 11 through the drainage hole, thereby improving the brushing efficiency. The waste liquid generated during the brushing process enters the inner cavity at the bottom of the waste receiving box 17 through the liquid inlet hole, and is finally discharged through the waste discharge pipe 6.

[0035] When the positions of the vacuum suction cup group 19 and the vacuum suction cup group 25 need to be replaced, the electric telescopic rod 47 drives the cleaning structure to move downward until the cleaning structure is located in the inner cavity of the groove, and the electric telescopic rod 513 drives the moving frame 12 to move downward, releasing the meshing of the gear 15 and the gear ring 24, and until the workbench 11 can rotate in the inner cavity of the sealed housing 8. The servo motor 120 drives the rotating tube 14 to rotate, and the rotating tube 14 drives the air inlet ring 29 to drive the workbench 11 to rotate through the rotating ring 30 connected thereto. The workbench 11 rotates 180 degrees, and the vacuum suction cup group 19 and the vacuum suction cup group 25 are exchanged. In this process, the coolant sliding off the workbench 11 falls into the inner cavity of the waste receiving box 17 under the action of gravity, and the electric telescopic rod 513 drives the workbench 11 to reset, and the polishing machine can continue to polish the wafer.

[0036] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art and will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field. Although the embodiments of the present invention have been shown and described, it can be understood by ordinary technicians in this field that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer polishing machine for processing light-emitting panel components, comprising a polishing chamber, characterized in that: A polishing structure (9) is provided at the top of the inner cavity of the polishing chamber, a cooling liquid nozzle (10) is provided on one side of the inner cavity of the polishing chamber, a sealing shell (8) is fixedly connected to the bottom of the inner cavity of the polishing chamber, a through hole is provided in the middle of the top of the sealing shell (8), a workbench (11) is connected to the inner cavity of the sealing shell (8) via a lifting and rotating structure, the top of the workbench (11) extends to the outside of the sealing shell (8) via the through hole, and the top of the inner cavity of the workbench (11) is connected via an electric telescopic rod. (31) is connected to a vacuum suction cup group 1 (19), the bottom end of the inner cavity of the workbench (11) is connected to a vacuum suction cup group 2 (25) via an electric telescopic rod 2 (26), the middle of the inner cavity of the workbench (11) is connected to a lifting plate via an electric telescopic rod 3 (28), the top and bottom of the lifting plate are both fixed with sealing columns (27), the vacuum suction cup group 1 (19) and the vacuum suction cup group 2 (25) both include vacuum suction cups, and the vacuum suction cups are provided with vacuum suction holes adapted to the sealing columns (27); The lifting and rotating structure comprises a movable frame (12) connected to the top of the inner cavity of the sealed shell (8) via an electric telescopic rod (13), a rotating tube (14) movably connected to the movable frame (12), and a vacuum pump (18) fixedly connected to the movable frame (12); an air inlet end of the vacuum pump (18) is connected to the inner cavity of a rotating tube (14) via a pipeline; an air inlet ring (29) is fixedly connected to the middle of the inner cavity of the workbench (11); a rotating ring (30) is movably sleeved on the outer ring of the air inlet ring (29); the rotating tube (14) is fixedly connected to the rotating ring (30); and the inner cavity of the rotating tube (14) is connected to the inner cavity of the workbench (11) via the air inlet ring (29); The inner cavity of the sealed housing (8) is connected to a cleaning structure via an electric telescopic rod four (7), the cleaning structure comprising a waste receiving box (17) connected to the electric telescopic rod four (7), a sealing ring (16) fixedly connected to the top of the waste receiving box (17), an injection pipe movably connected to the inner cavity of the waste receiving box (17), and a cleaning brush (23) fixedly connected to the top of the injection pipe, the handle of the cleaning brush (23) is a hollow structure, the top of the inner cavity of the brush handle is evenly provided with drainage holes, the bottom of the injection pipe is connected to a telescopic tube one (5), the other end of the telescopic tube one (5) extends to the outside of the polishing chamber, the bottom of the waste receiving box (17) is a hollow structure, the top of the inner cavity of the bottom of the waste receiving box (17) is evenly provided with liquid inlet holes, one side of the bottom of the waste receiving box (17) is fixedly connected to a waste discharge pipe (6), the other end of the waste discharge pipe (6) extends to the outside of the polishing chamber.

2. The wafer polishing machine for processing light-emitting panel components according to claim 1, characterized in that: The polishing chamber comprises a support platform (1), a sealing frame (2) fixedly connected to the top of the support platform (1), and an opening and closing door (3) arranged on one side of the sealing frame (2); the support platform (1), the sealing frame (2) and the opening and closing door (3) together form the polishing chamber.

3. The wafer polishing machine for processing light-emitting panel components according to claim 1, characterized in that: The lifting and rotating structure further comprises a servo motor 1 (20), and the other rotating tube (14) is driven by the servo motor 1 (20).

4. The wafer polishing machine for processing light-emitting panel components according to claim 2, characterized in that: A groove adapted to the cleaning structure is provided in the middle of the top of the support platform (1), an exhaust pipe (4) is fixedly connected to one side of the support platform (1), and the top of the exhaust pipe (4) is located at the top end of the inner cavity of the sealing shell (8).

5. The wafer polishing machine for processing light-emitting panel components according to claim 1, characterized in that: The outer rings at the top and bottom of the workbench (11) are both fixedly connected to a gear ring (24); the top of the inner cavity of the sealed housing (8) is fixedly connected to a servo motor 2 (21); the end of the output shaft of the servo motor 2 (21) is fixedly connected to a gear (15); the gear (15) is compatible with the gear ring (24).

6. The wafer polishing machine for processing light-emitting panel components according to claim 1, characterized in that: The inner cavity at the bottom of the waste receiving box (17) is fixedly connected to a servo motor three (22), and the liquid injection tube is driven by the servo motor three (22).

7. The wafer polishing machine for processing light-emitting panel components according to claim 5, characterized in that: The outer diameter of the gear ring (24) is smaller than the inner diameter of the sealing ring (16).

8. The wafer polishing machine for processing light-emitting panel components according to claim 1, characterized in that: The outer surface of the sealing column (27) is wrapped with a sealing pad, and when the sealing column (27) on one side of the lifting plate blocks the vacuum suction hole, the sealing column (27) on the other side of the lifting plate is separated from the vacuum suction hole away from the lifting plate.

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