A pulse electroplating method and related equipment

Abstract

The present invention relates to the technical field of pulse electroplating, and provides a pulse electroplating method and related equipment, including: obtaining current data and voltage data of a direct current power supply; performing data processing on the current data, performing spectrum analysis on the voltage data, obtaining comprehensive electroplating parameters, inputting the comprehensive electroplating parameters into a preset control module, obtaining a plurality of PWM signals and performing spectrum analysis, obtaining PWM modulation parameters, synchronizing all PWM signals according to the PWM modulation parameters, obtaining synchronized PWM signals and inputting them into a power module, and performing pulse electroplating on a PCB through a drive unit preset in the power module. By adopting an MCU that supports outputting multiple synchronously triggered PWM signals for control, the synchronization of the start pulse is improved, the complex hardware requirements are reduced, and the traditional MCU is often difficult to meet the requirements when controlling the synchronization of the start pulse, and there are problems such as low stability, poor reliability and high cost.

Description

Technical Field

[0001] The present application relates to the technical field of pulse electroplating, and in particular to a pulse electroplating method and related equipment. Background Art

[0002] In the PCB electroplating process, the electrolytic method is used to deposit metal or alloy on the surface of the workpiece to form a uniform, dense and well-bonded metal layer. The electroplated copper layer has become one of the indispensable key electroplating technologies in the manufacture of printed circuit boards (PCBs) due to its excellent electrical conductivity, thermal conductivity and mechanical ductility. The double-pulse power supply is more delicate and has better finish than the single-pulse power supply. The anodic dissolution of the reverse pulse of the double-pulse power supply causes the metal ion concentration on the cathode surface to recover rapidly, which is conducive to the use of high pulse current density in the subsequent cathode cycle, so that the coating is dense, bright and has low porosity; the anodic stripping of the reverse pulse of the double-pulse power supply greatly reduces the attachment of organic impurities (including brighteners) in the coating, so the coating has high purity and strong anti-discoloration ability.

[0003] Among the related technical means, dual-pulse PCB electroplating pulse power supply technology is widely used, which converts AC power into DC power first and then controls its output to achieve pulse voltage on the load. This process usually uses a combination of FPGA and MCU dual controllers to ensure the high quality of the pulse waveform, and achieves precise control of the pulse through high-speed ADC feedback to achieve excellent electroplating effects.

[0004] Regarding the above technical solution, although the dual-pulse control method can effectively realize the application of precise pulse voltage, when controlling the synchronization of the starting pulse, the traditional MCU often cannot meet the requirements, resulting in increased system complexity and cost. Summary of the invention

[0005] In order to improve the control of the start pulse synchronization, the traditional MCU is often difficult to meet the requirements and has problems such as low stability, poor reliability and high cost. The present application provides a pulse electroplating method and related equipment.

[0006] The present invention provides a pulse electroplating method, comprising: obtaining current data and voltage data of a direct current power supply based on a preset power module; performing data processing on the current data to obtain a current instantaneous value, a current average value and a current change rate; performing a spectrum analysis on the voltage data using the current instantaneous value to obtain a voltage fluctuation range and a voltage stability, calculating power fluctuation according to the voltage fluctuation range and the current average value, mapping the voltage stability and the current change rate to obtain electroplating stability; performing a comprehensive analysis on the power fluctuation and the electroplating stability to obtain a comprehensive electroplating parameter, inputting the comprehensive electroplating parameter into a preset control module to obtain a plurality of PWM signals; performing a spectrum analysis on all the PWM signals to obtain spectrum data and a spectrum sequence, analyzing the spectrum data to obtain key frequency and amplitude characteristics, optimizing the spectrum sequence using the key frequency and amplitude characteristics to obtain PWM modulation parameters, synchronizing all the PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals; inputting the synchronized PWM signal into the power module, and performing pulse electroplating on the PCB through a drive unit preset in the power module.

[0007] As a preferred embodiment, the step of obtaining current data and voltage data of a DC power supply based on a preset power module includes: obtaining current data of the DC power supply through a current sensor preset in the power module; and obtaining voltage data of the DC power supply through a voltage sensor preset in the power module.

[0008] As a preferred solution, the step of processing the current data to obtain the instantaneous current value, the average current value and the current change rate, and performing spectrum analysis on the voltage data using the instantaneous current value to obtain the voltage fluctuation range and voltage stability includes: performing frequency domain analysis on the current data using a fast Fourier transform algorithm to obtain frequency components and phase information, and calculating the instantaneous current value using the frequency components, and the calculation formula is as follows:

[0009]

[0010] in, is the instantaneous value of current, is the amplitude of the frequency component, is the frequency of the frequency component, is phase information; the instantaneous current value and the phase information are filtered to obtain the current average value, and the current change rate is calculated according to the instantaneous current value and the current average value. The calculation formula is as follows:

[0011]

[0012] in, is the current change rate, is the average current value, is the time interval.

[0013] As a preferred solution, the step of using the instantaneous value of the current to perform a spectrum analysis on the voltage data to obtain a voltage fluctuation range and a voltage stability, calculating the voltage fluctuation range and the current average value to obtain a power fluctuation, and mapping the voltage stability and the current change rate to obtain electroplating stability includes: performing a time-frequency analysis on the instantaneous value of the current according to a wavelet transform to obtain a wavelet coefficient, a spectrum intensity, and an energy distribution, denoising the wavelet coefficient by wavelet threshold denoising to obtain a denoising coefficient and a reconstructed signal; performing a peak detection on the spectrum intensity using the denoising coefficient to obtain a peak point, and performing a fitting analysis on the peak point using the reconstructed signal to obtain a fitting curve; performing a spectrum analysis on the voltage data using the energy distribution and the fitting curve to obtain a voltage fluctuation range and a voltage stability, and adjusting the amplitude of the fitting curve according to the fluctuation range to obtain voltage stability; and calculating the power fluctuation using the voltage fluctuation range and the current average value, and the calculation formula is as follows:

[0014]

[0015] in, For power fluctuation, is the voltage fluctuation range, is the current average value; the voltage stability and the current change rate are mapped by a mapping function to obtain the electroplating stability, and the mapping formula is as follows:

[0016]

[0017] in, For electroplating stability, is the voltage stability, is the rate of change of current.

[0018] As a preferred scheme, the steps of comprehensively analyzing the power fluctuation and the electroplating stability to obtain comprehensive electroplating parameters, inputting the comprehensive electroplating parameters into a preset control module, and obtaining a plurality of PWM signals include: performing factor analysis on the power fluctuation and the electroplating stability by a multivariate analysis method to obtain principal factors, a load matrix, and factor variances, performing rotation transformation on the principal factors to obtain rotated factor loads and rotated factors, and performing principal component extraction on the load matrix using the rotated factor loads to obtain principal components; performing decomposition processing on the factor variance using the principal factors to obtain a factor decomposition matrix, performing combination processing on the factor decomposition matrix using the rotation factors to obtain comprehensive electroplating parameters, inputting the comprehensive electroplating parameters into a preset control module, and performing fuzzy logic processing on the comprehensive electroplating parameters using a fuzzy control algorithm in the control module to obtain a plurality of PWM signals.

[0019] As a preferred solution, the steps of performing spectrum analysis on all the PWM signals to obtain spectrum data and spectrum sequence, analyzing the spectrum data to obtain key frequency and amplitude features, optimizing the spectrum sequence using the key frequency and amplitude features to obtain PWM modulation parameters, and synchronizing all the PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals include: performing time domain analysis on all the PWM signals according to frequency analysis technology to obtain time domain signals, spectrum diagrams and harmonic components; performing window function processing on the time domain signals using short-time Fourier transform to obtain a time-frequency matrix, performing spectral line analysis on the time-frequency matrix through the spectrum diagram to obtain spectral line frequencies, performing harmonic adjustment on the spectral line frequencies and the time domain signals according to the harmonic components to obtain spectrum data; and performing time domain analysis on the PWM signals according to the autocorrelation function to obtain the spectrum data. The spectral line frequency and the time-frequency matrix are subjected to correlation analysis to obtain a spectrum sequence; peak values ​​of the spectrum data are extracted by a spectrum peak detection algorithm to obtain frequency peak values ​​and amplitude peak values, the frequency peak values ​​are band-pass filtered to obtain a key frequency, and the amplitude peak values ​​and the frequency peak values ​​are amplitude filtered by envelope detection to obtain amplitude characteristics; bandwidth optimization is performed on the key frequency and the amplitude characteristics according to a bandwidth selection method to obtain bandwidth parameters, phase parameters and modulation coefficients, the spectrum sequence is reconstructed according to the bandwidth parameters and the phase parameters to obtain a reconstructed sequence, the reconstructed sequence is modulated by the modulation coefficient to obtain PWM modulation parameters; the PWM modulation parameters are input into a synchronization control module, and all the PWM signals are synchronized in the synchronization control module by using a phase synchronization technology to obtain synchronized PWM signals.

[0020] As a preferred solution, the step of inputting the synchronized PWM signal into the power module and performing pulse electroplating on the PCB through a driving unit preset in the power module includes: amplifying the synchronized PWM signal by a power amplifier to obtain an amplified signal, and inputting the amplified signal into the power module; performing power control on the synchronized PWM signal through a driving unit preset in the power module to obtain a plating power signal, and performing pulse electroplating on the PCB according to the plating power signal.

[0021] The present application also provides a pulse electroplating device, including: a data acquisition module, which is used to acquire current data and voltage data of a DC power supply based on a preset power module; a data processing module, which is used to perform data processing on the current data to obtain a current instantaneous value, a current average value, and a current change rate; an analysis and calculation module, which is used to perform a spectrum analysis on the voltage data using the current instantaneous value to obtain a voltage fluctuation range and a voltage stability, calculate the power fluctuation according to the voltage fluctuation range and the current average value, map the voltage stability and the current change rate, and obtain electroplating stability; a signal generation module, which is used to perform a comprehensive analysis of the power fluctuation and the electroplating stability to obtain to comprehensive electroplating parameters, input the comprehensive electroplating parameters into a preset control module to obtain a plurality of PWM signals; a signal optimization module, used to perform spectrum analysis on all the PWM signals to obtain spectrum data and spectrum sequence, analyze the spectrum data to obtain key frequency and amplitude characteristics, optimize the spectrum sequence using the key frequency and amplitude characteristics to obtain PWM modulation parameters, synchronize all the PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals; a signal output module, used to input the synchronized PWM signal into the power module, and perform pulse electroplating on the PCB through a drive unit preset in the power module.

[0022] The present application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the processor executes the computer program, the pulse plating method described above is implemented.

[0023] The present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the processor is enabled to perform the pulse electroplating method as described in any one of the above.

[0024] Compared with the prior art, the present application has the following beneficial effects: strong stability and high reliability. By adopting an MCU that supports outputting multiple synchronous trigger PWM signals for control, the synchronization of the start pulse is improved, and the complex hardware requirements are reduced. This not only improves the stability and uniformity of electroplating, but also helps to improve the purity of the electroplating layer, and ultimately ensures the reliability and consistency of product quality. When controlling the synchronization of the start pulse, traditional MCUs are often difficult to meet the requirements, and there are problems such as low stability, poor reliability and high cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0027] Figure 1 is a schematic flow chart of a pulse plating method provided by an embodiment of the present invention;

[0028] Figure 2 is a schematic block diagram of the structure of a pulse electroplating device provided by an embodiment of the present invention;

[0029] Figure 3 is a schematic block diagram of the structure of an electronic device provided by an embodiment of the present invention;

[0030] Figure 4 It is a schematic block diagram of the connection between the control module and the power module provided in an embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 10. Pulse plating device; 11. Data acquisition module; 12. Data processing module; 13. Analysis and calculation module; 14. Signal generation module; 15. Signal optimization module; 16. Signal output module; 20. Electronic equipment; 21. Memory; 22. Processor. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0035] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0036] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0037] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0038] Example 1

[0039] like Figure 1 As shown, a pulse plating method provided in an embodiment of the present application includes steps S100 to S600.

[0040] Step S100: acquiring current data and voltage data of a DC power supply based on a preset power module.

[0041] In this step, the current and voltage data output by the sensor connected to the DC power supply are monitored in real time; specifically, high-precision current sensors and voltage sensors are used to ensure that the acquired data has high accuracy and timeliness. These data will provide basic information for subsequent analysis and control.

[0042] For example, the output current of the DC power supply is 5A and the voltage is 12V. These data will be stored and used in subsequent processing steps.

[0043] Step S200: Process the current data to obtain the instantaneous current value, the average current value and the current change rate.

[0044] In this step, the acquired current data is processed in real time using a digital signal processing algorithm; specifically, a sliding window algorithm is applied to calculate the instantaneous value and average value of the current, and the current change rate is obtained by the derivative calculation method. These processing results will reflect the stability and change trend of the current.

[0045] For example, after processing, the instantaneous value of the current is 4.8A, the average current is 5.2A, and the current change rate is 0.1A / s, providing a clear view of the current fluctuation.

[0046] Step S300, use the instantaneous value of current to perform a spectrum analysis on the voltage data to obtain the voltage fluctuation range and voltage stability, calculate the power fluctuation according to the voltage fluctuation range and the current average value, map the voltage stability and the current change rate, and obtain the electroplating stability.

[0047] In this step, spectrum analysis software is used to perform spectrum analysis on the voltage data and extract key features. Specifically, the voltage fluctuation range is obtained through Fourier transform, and the power fluctuation is calculated in combination with the current average value to evaluate the stability of the electroplating process.

[0048] For example, after the spectrum analysis, the voltage fluctuation range is 0.5V and the voltage stability is 95%, which shows that the system is in good working condition.

[0049] Step S400, comprehensively analyzing the power fluctuation and electroplating stability to obtain comprehensive electroplating parameters, and inputting the comprehensive electroplating parameters into a preset control module to obtain a plurality of PWM signals.

[0050] In this step, the data fusion algorithm is used to comprehensively evaluate the power fluctuation and electroplating stability; specifically, the electroplating parameters are comprehensively calculated through the set weight coefficients and input into the control module to generate multiple PWM signals to achieve precise control. Figure 4 As shown, one control module can realize the control of 1 to 6 power modules, as well as the communication between the touch screen and the computer.

[0051] For example, the PWM signal frequency is calculated to be 20kHz based on the comprehensive electroplating parameters, which will serve as the basis for generating the PWM signal.

[0052] Step S500, perform spectrum analysis on all PWM signals to obtain spectrum data and spectrum sequence, analyze the spectrum data to obtain key frequency and amplitude characteristics, optimize the spectrum sequence using the key frequency and amplitude characteristics to obtain PWM modulation parameters, synchronize all PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals.

[0053] In this step, the PWM signal is studied in depth through efficient spectrum analysis tools; specifically, its spectrum is analyzed to identify key frequency and amplitude characteristics, and the PWM modulation parameters are adjusted using an optimization algorithm to ensure synchronous output of the signal.

[0054] For example, after analysis, it was determined that the critical frequency was 10kHz and the optimized PWM modulation parameters were a 50% duty cycle to ensure the best effect of the electroplating process.

[0055] Step S600: input the synchronized PWM signal into the power module, and perform pulse electroplating on the PCB through a driving unit preset in the power module.

[0056] In this step, the synchronized PWM signal is input into the power module to drive its output; specifically, the H-bridge circuit of the power module will adjust the current according to the received PWM signal, thereby achieving precise pulse plating of the PCB. Figure 4 As shown, 1 to 6 power modules can be freely selected according to the actual pulse output route requirements, and connected to the control module through cables to form a customizable pulse power supply system.

[0057] For example, through the control of the H-bridge, the current is precisely adjusted in each pulse cycle, making the electroplating layer uniform and dense.

[0058] In this embodiment, the current data and voltage data of the DC power supply are first obtained using a preset power module, and then the current data is processed to obtain the instantaneous value of the current, the average current value, and the current change rate. Next, the voltage data is analyzed using the instantaneous value of the current to obtain the voltage fluctuation range and voltage stability, and the power fluctuation is calculated to map the voltage stability and the current change rate, and finally evaluate the electroplating stability. After comprehensive analysis of the power fluctuation and electroplating stability, comprehensive electroplating parameters are generated and input into a preset control module to obtain multiple PWM signals. Finally, these PWM signals are analyzed and optimized to be synchronously output to the power module to complete the pulse electroplating process.

[0059] Through the solution of this embodiment, the AC-to-DC link in the traditional solution is omitted, making the system design simpler and the procurement cost significantly reduced. At the same time, the MCU that supports the output of multiple synchronous trigger PWM signals is used for control, which improves the synchronization of the start pulse and reduces the complex hardware requirements, which not only improves the stability and uniformity of electroplating, but also helps to improve the purity of the electroplating layer, and ultimately ensures the reliability and consistency of product quality, and improves the traditional MCU when controlling the synchronization of the start pulse. It is often difficult to meet the requirements and has the problems of low stability, poor reliability and high cost.

[0060] Embodiment 2:

[0061] In step S100, current data of a DC power supply is acquired by a current sensor preset in a power module.

[0062] By integrating a highly sensitive current sensor inside the power module, the current value of the DC power supply is collected in real time to ensure the accuracy and reliability of the data, thereby providing basic data for subsequent analysis.

[0063] For example, the DC power supply current detected by the current sensor is 4.5A, and this data will be fed back to the control system in real time for further processing and analysis.

[0064] The voltage data of the DC power supply is obtained through a voltage sensor preset in the power module.

[0065] By installing a high-precision voltage sensor in the power module, the voltage output of the DC power supply is monitored in real time to obtain stable voltage data, thereby ensuring the controllability and consistency of the electroplating process.

[0066] For example, the voltage value read by the voltage sensor is 12V. This data will be used for subsequent current and power calculations to achieve precise control.

[0067] In step S200, the current data is analyzed in the frequency domain using the fast Fourier transform algorithm to obtain the frequency component and phase information, and the instantaneous value of the current is calculated using the frequency component. The calculation formula is as follows:

[0068]

[0069] in, is the instantaneous value of current, is the amplitude of the frequency component, is the frequency of the frequency component, is the phase information.

[0070] The current data is analyzed by fast Fourier transform to extract the current amplitude and phase information at different frequencies, thereby achieving accurate calculation of the instantaneous value of the current.

[0071] For example, through fast Fourier transform, current data with frequency components of 50 Hz, 100 Hz and 200 Hz are obtained, and the corresponding amplitudes are 1.2 A, 0.8 A and 0.5 A respectively, so as to calculate the instantaneous value of the current.

[0072] The instantaneous current value and phase information are filtered to obtain the average current value. The current change rate is calculated based on the instantaneous current value and the average current value. The calculation formula is as follows:

[0073]

[0074] in, is the current change rate, is the average current value, is the time interval.

[0075] The instantaneous current value is smoothed by a filtering algorithm to remove high-frequency noise, thereby obtaining a more accurate current average value and further calculating the current change rate.

[0076] For example, after filtering, the average current value is 4.6A, and the difference between the instantaneous current value and the average current value is 0.2A, resulting in a calculated current change rate of 0.04A / s.

[0077] In step S300, the instantaneous value of the current is subjected to time-frequency analysis according to wavelet transform to obtain wavelet coefficients, spectrum intensity and energy distribution, and the wavelet coefficients are denoised by wavelet threshold denoising to obtain denoised coefficients and reconstructed signals.

[0078] By applying wavelet transform, multi-scale analysis is performed on the instantaneous value of current, so as to extract wavelet coefficients and spectrum characteristics, so as to facilitate the subsequent signal denoising and reconstruction.

[0079] For example, through wavelet transform, the main wavelet coefficients extracted are 0.6, 0.3 and 0.1. After denoising, the denoising coefficient 0.6 and the reconstructed signal are obtained.

[0080] The denoising coefficient is used to perform peak detection on the spectrum intensity to obtain the peak point, and the reconstructed signal is used to perform fitting analysis on the peak point to obtain the fitting curve.

[0081] By analyzing the intensity of the denoised spectrum, the peak points in the spectrum are identified and fitted using the reconstructed signal to obtain a fitting curve of the current signal.

[0082] For example, the peak point of the spectrum intensity is at a frequency of 200 Hz, and the fitted curve accurately reflects the changing trend of the signal.

[0083] The voltage data is analyzed by using energy distribution and fitting curve to obtain the voltage fluctuation range and voltage stability. The fitting curve is adjusted in amplitude according to the fluctuation range to obtain the voltage stability.

[0084] By performing a spectral analysis on the voltage data and combining the energy distribution with the fitting curve, the voltage fluctuation and stability can be determined.

[0085] For example, the voltage fluctuation range obtained from the analysis is 0.3V. Through amplitude adjustment, the voltage stability is improved to 96%, which shows the stability of the system.

[0086] The power fluctuation is calculated using the voltage fluctuation range and the current average value. The calculation formula is as follows:

[0087]

[0088] in, For power fluctuation, is the voltage fluctuation range, is the average current value.

[0089] By multiplying the voltage fluctuation range with the current average value, real-time power fluctuation information is obtained to facilitate the adjustment of the control system.

[0090] For example, if the voltage fluctuation range is 0.3V and the current average value is 4.6A, the calculated power fluctuation is 1.38W.

[0091] The voltage stability and current change rate are mapped through the mapping function to obtain the electroplating stability. The mapping formula is as follows:

[0092]

[0093] in, For electroplating stability, is the voltage stability, is the rate of change of current.

[0094] The voltage stability is combined with the current change rate through a set mapping function to calculate the overall stability of the electroplating process.

[0095] For example, the voltage stability is 96%, the current change rate is 0.04A / s, and the calculated electroplating stability is higher than 85%, indicating a good electroplating process.

[0096] In step S400, factor analysis is performed on power fluctuation and electroplating stability by multivariate analysis method to obtain principal factors, loading matrix and factor variance, the principal factors are rotated to obtain rotated factor loadings and rotated factors, and the principal components of the loading matrix are extracted using the rotated factor loadings to obtain the principal components.

[0097] By applying factor analysis techniques, multivariate analysis of power fluctuation and plating stability was performed to identify the main factors affecting the plating quality.

[0098] For example, factor analysis showed that voltage fluctuation and current variation had a significant effect on electroplating stability, and three main factors were obtained, which were further rotated to simplify the interpretation.

[0099] The factor variance is decomposed by principal factors to obtain a factor decomposition matrix, and the factor decomposition matrix is ​​combined by rotation factors to obtain comprehensive electroplating parameters. The comprehensive electroplating parameters are input into a preset control module, and fuzzy control algorithm is used in the control module to perform fuzzy logic processing on the comprehensive electroplating parameters to obtain several PWM signals.

[0100] By analyzing the main factors, the electroplating parameters are further optimized, and the fuzzy control algorithm is used to adjust the PWM signal to achieve more precise electroplating control.

[0101] For example, according to the analysis results, the comprehensive electroplating parameters are set to 4.5A current and 12V voltage. After fuzzy logic processing, multiple PWM signals are generated to adapt to different electroplating conditions.

[0102] In step S500, all PWM signals are subjected to time domain analysis according to frequency analysis technology to obtain time domain signals, frequency spectra and harmonic components.

[0103] Through frequency analysis technology, the generated PWM signal is deeply analyzed to obtain its time domain characteristics and spectrum information, so as to evaluate the signal quality.

[0104] For example, the analyzed time domain signal shows that the PWM signal has good periodicity at a frequency of 50 Hz, and the spectrum shows fewer harmonic components, indicating that the signal quality is good.

[0105] The time domain signal is processed by window function using short-time Fourier transform to obtain a time-frequency matrix. The time-frequency matrix is ​​analyzed by spectrum line analysis through the spectrum diagram to obtain the spectrum line frequency. The spectrum line frequency and time domain signal are harmonically adjusted according to the harmonic components to obtain the spectrum data.

[0106] The PWM signal is analyzed by short-time Fourier transform to extract the time-frequency characteristics and thus evaluate the harmonic distribution of the signal.

[0107] For example, the time-frequency matrix obtained by short-time Fourier transform shows that the frequency is concentrated at 50 Hz, and after harmonic adjustment, the harmonic component of the spectrum data is reduced to 2%.

[0108] The correlation analysis of the spectrum line frequency and the time-frequency matrix is ​​carried out according to the autocorrelation function to obtain the spectrum sequence.

[0109] The periodicity of the PWM signal and its temporal consistency are evaluated through autocorrelation function analysis to generate a spectrum sequence.

[0110] For example, after correlation analysis, the spectrum sequence shows that the main period of the signal is 20ms, indicating that the PWM signal is stable.

[0111] The peak value of the spectrum data is extracted through the spectrum peak detection algorithm to obtain the frequency peak and amplitude peak. The frequency peak is band-pass filtered to obtain the key frequency. The amplitude peak and frequency peak are amplitude filtered using envelope detection to obtain the amplitude feature.

[0112] By using spectrum peak detection, the key frequencies and amplitudes in the signal can be extracted to further optimize the electroplating process.

[0113] For example, the detected frequency peak is 50Hz, which is confirmed as the key frequency after bandpass filtering, and the amplitude characteristic is 3V, indicating that the signal strength is good.

[0114] The bandwidth of key frequency and amplitude characteristics is optimized according to the bandwidth selection method to obtain bandwidth parameters, phase parameters and modulation coefficients. The spectrum sequence is reconstructed according to the bandwidth parameters and phase parameters to obtain a reconstructed sequence. The reconstructed sequence is modulated using the modulation coefficient to obtain PWM modulation parameters.

[0115] The signal characteristics are optimized through the bandwidth selection method to ensure that the PWM signal is within the appropriate bandwidth range, thereby achieving accurate signal modulation.

[0116] For example, the optimized bandwidth parameter is 2 Hz, the phase parameter is 45°, and the final generated PWM modulation parameters ensure the stability and controllability of the signal.

[0117] The PWM modulation parameters are input into the synchronization control module, and all PWM signals are synchronized in the synchronization control module using the phase synchronization technology to obtain synchronized PWM signals.

[0118] Through phase synchronization technology, all PWM signals are ensured to work within the same time frame to achieve more precise electroplating control.

[0119] For example, after phase synchronization processing, the synchronized PWM signal obtained can remain consistent within each pulse cycle, thereby improving the stability of the electroplating process.

[0120] In step S600, the synchronized PWM signal is amplified by a power amplifier to obtain an amplified signal, and the amplified signal is input into a power module.

[0121] The amplitude of the PWM signal is boosted by the power amplifier to ensure that it can drive the power module for effective electroplating operation.

[0122] For example, the amplitude of the amplified PWM signal reaches 5V, which can effectively control the output of the power module and ensure the effectiveness of the electroplating process.

[0123] The power of the synchronized PWM signal is controlled by a driving unit preset in the power module to obtain an electroplating power signal, and pulse electroplating is performed on the PCB according to the electroplating power signal.

[0124] Through the driving unit of the power module, the power output is accurately controlled according to the amplified PWM signal to achieve electroplating of the PCB.

[0125] For example, the electroplating power signal is 4.5A and the voltage is 12V, and the pulse electroplating process performed ensures the uniformity and consistency of the electroplating layer.

[0126] In this embodiment, by comprehensively applying current and voltage sensors, frequency domain and time-frequency analysis, wavelet transform denoising, factor analysis and fuzzy control, etc., real-time monitoring and optimization of the electroplating process are systematically realized. The entire scheme ensures the stability and efficiency of the electroplating process through precise signal processing and feedback control, and finally achieves high-quality electroplating effects to meet the needs of modern PCB manufacturing. This embodiment not only improves the quality of electroplating, but also reduces human intervention and improves production efficiency through data analysis and intelligent control, and has good application prospects.

[0127] Embodiment 3:

[0128] like Figure 2 As shown, the present application also provides a pulse electroplating device 10, including a data acquisition module 11, a data processing module 12, an analysis and calculation module 13, a signal generation module 14, a signal optimization module 15 and a signal output module 16.

[0129] The data acquisition module 11 is mainly used to acquire current data and voltage data of a DC power supply based on a preset power module.

[0130] The data processing module 12 is mainly used to process the current data to obtain the instantaneous value of the current, the average value of the current and the rate of change of the current.

[0131] The analysis and calculation module 13 is mainly used to perform spectrum analysis on voltage data using the instantaneous value of current to obtain the voltage fluctuation range and voltage stability, calculate the power fluctuation based on the voltage fluctuation range and the current average value, map the voltage stability and current change rate, and obtain the electroplating stability.

[0132] The signal generation module 14 is mainly used to perform a comprehensive analysis on power fluctuation and electroplating stability to obtain comprehensive electroplating parameters, and input the comprehensive electroplating parameters into a preset control module to obtain a number of PWM signals.

[0133] The signal optimization module 15 is mainly used to perform spectrum analysis on all PWM signals to obtain spectrum data and spectrum sequences, analyze the spectrum data to obtain key frequency and amplitude characteristics, optimize the spectrum sequence using the key frequency and amplitude characteristics to obtain PWM modulation parameters, synchronize all PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals.

[0134] The signal output module 16 is mainly used to input the synchronized PWM signal into the power module, and perform pulse electroplating on the PCB through the driving unit preset in the power module.

[0135] In this embodiment, by integrating the data acquisition module 11, the data processing module 12, the analysis and calculation module 13, the signal generation module 14, the signal optimization module 15 and the signal output module 16, an efficient pulse electroplating device 10 is formed, which realizes the comprehensive monitoring and control of the electroplating process. The data acquisition module 11 ensures the real-time acquisition of current and voltage data, the data processing module 12 provides accurate instantaneous current value and current change rate through complex calculations, and the analysis and calculation module 13 further analyzes the voltage fluctuation and electroplating stability. The signal generation module 14 outputs several PWM signals through comprehensive analysis, and the signal optimization module 15 optimizes these signals to improve the quality of electroplating. Finally, the signal output module 16 sends the optimized PWM signal to the power module to complete the efficient pulse electroplating of the PCB. The whole system improves the electroplating accuracy and stability, and meets the needs of modern manufacturing industry for high-quality electroplating.

[0136] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described device and each module can refer to the corresponding process in the aforementioned embodiment 1, and will not be repeated here.

[0137] Embodiment 4:

[0138] like Figure 3 As shown, the present application also provides an electronic device 20, including a memory 21 and a processor 22, wherein the memory 21 stores a computer program that can be run on the processor 22, and the pulse plating method of Example 1 is implemented when the processor 22 executes the computer program.

[0139] In this embodiment, by designing the cooperation between the memory 21 and the processor 22, an electronic device 20 capable of executing the pulse electroplating method is constructed. The computer program stored in the device contains all the algorithms and data processing logic required in Example 1. When the processor 22 runs these programs, it can realize the functions of real-time monitoring of current and voltage, data analysis, signal generation and optimization. In this way, the electronic device 20 can not only automatically perform the pulse electroplating process, but also adjust the electroplating parameters according to real-time feedback, ensure the high quality and consistency of the final product, and improve the overall production efficiency.

[0140] Embodiment 5:

[0141] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the processor executes the pulse plating method as in Example 1.

[0142] In this embodiment, by storing the relevant computer program in a computer-readable storage medium, it is ensured that the processor can smoothly execute the pulse electroplating method in Example 1 during operation. The computer program implements the logic of each link such as data acquisition, processing and signal generation in detail, ensuring that the current and voltage data can be obtained in time during operation, and accurate calculation and analysis can be performed. In addition, the optimization algorithm in the program can dynamically adjust the PWM signal to adapt to different electroplating requirements. Through such a design, the computer-readable storage medium provides convenience for realizing intelligent electroplating, making the electroplating process more efficient and accurate, thereby meeting the strict requirements of modern industry for electroplating technology.

[0143] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A pulse plating method, characterized in that: include: Acquire current data and voltage data of a DC power supply based on a preset power module; Processing the current data to obtain the instantaneous value of the current, the average value of the current and the rate of change of the current; The voltage data is analyzed by using the instantaneous value of the current to obtain the voltage fluctuation range and the voltage stability, the power fluctuation is calculated according to the voltage fluctuation range and the current average value, the voltage stability and the current change rate are mapped to obtain the electroplating stability; wherein, the mapping formula for mapping the voltage stability and the current change rate to obtain the electroplating stability is as follows: in, For electroplating stability, is the voltage stability, is the current change rate; Comprehensively analyze the power fluctuation and the electroplating stability to obtain comprehensive electroplating parameters, input the comprehensive electroplating parameters into a preset control module to obtain a number of PWM signals; wherein, the specific process of comprehensively analyzing the power fluctuation and the electroplating stability to obtain comprehensive electroplating parameters is as follows: factor analysis is performed on the power fluctuation and the electroplating stability by a multivariate analysis method to obtain principal factors, a load matrix, and factor variances; the principal factors are rotated to obtain rotated factor loads and rotated factors; the load matrix is ​​extracted from the principal components using the rotated factor loads to obtain principal components; the factor variance is decomposed using the principal factors to obtain a factor decomposition matrix; the factor decomposition matrix is ​​combined using the rotation factors to obtain comprehensive electroplating parameters; Performing spectrum analysis on all the PWM signals to obtain spectrum data and a spectrum sequence, analyzing the spectrum data to obtain key frequency and amplitude characteristics, optimizing the spectrum sequence using the key frequency and amplitude characteristics to obtain PWM modulation parameters, and synchronizing all the PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals; The synchronized PWM signal is input into the power module, and pulse electroplating is performed on the PCB through a driving unit preset in the power module.

2. The pulse plating method according to claim 1, characterized in that: The step of obtaining current data and voltage data of a DC power supply based on a preset power module includes: Acquiring current data of a DC power supply through a current sensor preset in the power module; The voltage data of the DC power supply is obtained through a voltage sensor preset in the power module.

3. The pulse plating method according to claim 1, characterized in that: The step of processing the current data to obtain the instantaneous current value, the average current value and the current change rate, and performing a spectrum analysis on the voltage data using the instantaneous current value to obtain the voltage fluctuation range and the voltage stability comprises: The current data is analyzed in the frequency domain using the fast Fourier transform algorithm to obtain frequency components and phase information, and the instantaneous value of the current is calculated using the frequency components. The calculation formula is as follows: in, is the instantaneous value of current, is the amplitude of the frequency component, is the frequency of the frequency component, is the phase information; The instantaneous current value and the phase information are filtered to obtain the current average value, and the current change rate is calculated according to the instantaneous current value and the current average value. The calculation formula is as follows: in, is the current change rate, is the average current value, is the time interval.

4. The pulse plating method according to claim 1, characterized in that: The step of using the instantaneous current value to perform a spectrum analysis on the voltage data to obtain a voltage fluctuation range and a voltage stability, calculating the voltage fluctuation range and the current average value to obtain a power fluctuation, and mapping the voltage stability and the current change rate to obtain electroplating stability comprises: Performing time-frequency analysis on the instantaneous value of the current according to wavelet transform to obtain wavelet coefficients, spectrum intensity and energy distribution, and performing denoising processing on the wavelet coefficients by wavelet threshold denoising to obtain denoising coefficients and reconstructed signals; Using the denoising coefficient to perform peak detection on the spectrum intensity to obtain a peak point, and using the reconstructed signal to perform fitting analysis on the peak point to obtain a fitting curve; Performing a spectrum analysis on the voltage data using the energy distribution and the fitting curve to obtain a voltage fluctuation range and a voltage stability, and adjusting the amplitude of the fitting curve according to the fluctuation range to obtain voltage stability; The power fluctuation is calculated using the voltage fluctuation range and the current average value, and the calculation formula is as follows: in, For power fluctuation, is the voltage fluctuation range, is the average current value; The voltage stability and the current change rate are mapped by a mapping function to obtain electroplating stability. The mapping formula is as follows: in, For electroplating stability, is the voltage stability, is the rate of change of current.

5. The pulse plating method according to claim 1, characterized in that: The step of comprehensively analyzing the power fluctuation and the electroplating stability to obtain comprehensive electroplating parameters, and inputting the comprehensive electroplating parameters into a preset control module to obtain a plurality of PWM signals includes: Perform factor analysis on the power fluctuation and the electroplating stability by multivariate analysis to obtain principal factors, load matrix and factor variance, perform rotation transformation on the principal factors to obtain rotated factor loads and rotated factors, and use the rotated factor loads to extract principal components from the load matrix to obtain principal components; The factor variance is decomposed using the principal factors to obtain a factor decomposition matrix, the factor decomposition matrix is ​​combined using the rotation factors to obtain comprehensive electroplating parameters, the comprehensive electroplating parameters are input into a preset control module, and fuzzy logic processing is performed on the comprehensive electroplating parameters in the control module using a fuzzy control algorithm to obtain a number of PWM signals.

6. The pulse plating method according to claim 1, characterized in that: The steps of performing spectrum analysis on all the PWM signals to obtain spectrum data and a spectrum sequence, analyzing the spectrum data to obtain key frequency and amplitude features, optimizing the spectrum sequence using the key frequency and amplitude features to obtain PWM modulation parameters, synchronizing all the PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals include: Performing time domain analysis on all the PWM signals according to frequency analysis technology to obtain time domain signals, spectrum diagrams and harmonic components; Performing window function processing on the time domain signal by using short-time Fourier transform to obtain a time-frequency matrix, performing spectral line analysis on the time-frequency matrix by using the spectrum diagram to obtain spectral line frequencies, and performing harmonic adjustment on the spectral line frequencies and the time domain signal according to the harmonic components to obtain spectrum data; Performing correlation analysis on the spectrum line frequency and the time-frequency matrix according to the autocorrelation function to obtain a spectrum sequence; Peak extraction is performed on the spectrum data by using a spectrum peak detection algorithm to obtain a frequency peak and an amplitude peak, bandpass filtering is performed on the frequency peak to obtain a key frequency, and amplitude filtering is performed on the amplitude peak and the frequency peak by using envelope detection to obtain an amplitude feature; According to the bandwidth selection method, the bandwidth of the key frequency and the amplitude characteristics are optimized to obtain bandwidth parameters, phase parameters and modulation coefficients, the spectrum sequence is reconstructed according to the bandwidth parameters and the phase parameters to obtain a reconstructed sequence, and the reconstructed sequence is modulated using the modulation coefficient to obtain PWM modulation parameters; The PWM modulation parameters are input into a synchronization control module, and all the PWM signals are synchronized in the synchronization control module using a phase synchronization technology to obtain synchronized PWM signals.

7. The pulse plating method according to claim 1, characterized in that: The step of inputting the synchronized PWM signal into the power module and performing pulse electroplating on the PCB through a driving unit preset in the power module includes: Amplifying the synchronized PWM signal using a power amplifier to obtain an amplified signal, and inputting the amplified signal into the power module; The synchronized PWM signal is power-controlled by a driving unit preset in the power module to obtain an electroplating power signal, and pulse electroplating is performed on the PCB according to the electroplating power signal.

8. A pulse plating device, characterized in that: include: A data acquisition module, used to acquire current data and voltage data of a DC power supply based on a preset power module; A data processing module is used to process the current data to obtain the instantaneous value of the current, the average value of the current and the rate of change of the current; The analysis and calculation module is used to perform a spectrum analysis on the voltage data using the instantaneous value of the current to obtain a voltage fluctuation range and a voltage stability, calculate the power fluctuation according to the voltage fluctuation range and the current average value, map the voltage stability and the current change rate to obtain electroplating stability; wherein the mapping formula for mapping the voltage stability and the current change rate to obtain electroplating stability is as follows: in, For electroplating stability, is the voltage stability, is the current change rate; A signal generation module is used to perform a comprehensive analysis on the power fluctuation and the electroplating stability to obtain comprehensive electroplating parameters, and input the comprehensive electroplating parameters into a preset control module to obtain a plurality of PWM signals; wherein, the specific process of performing a comprehensive analysis on the power fluctuation and the electroplating stability to obtain comprehensive electroplating parameters is as follows: factor analysis is performed on the power fluctuation and the electroplating stability by a multivariate analysis method to obtain principal factors, a load matrix, and factor variances; the principal factors are rotated to obtain rotated factor loads and rotated factors; the load matrix is ​​extracted from the principal components using the rotated factor loads to obtain principal components; the factor variance is decomposed using the principal factors to obtain a factor decomposition matrix; the factor decomposition matrix is ​​combined using the rotation factors to obtain comprehensive electroplating parameters; A signal optimization module, used for performing spectrum analysis on all the PWM signals to obtain spectrum data and spectrum sequences, analyzing the spectrum data to obtain key frequency and amplitude features, optimizing the spectrum sequence using the key frequency and amplitude features to obtain PWM modulation parameters, and synchronizing all the PWM signals according to the PWM modulation parameters to obtain synchronized PWM signals; The signal output module is used to input the synchronized PWM signal into the power module, and perform pulse electroplating on the PCB through a driving unit preset in the power module.

9. An electronic device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and the processor implements the pulse plating method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, the processor is caused to perform the pulse plating method according to any one of claims 1 to 7.

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